KR20010073752A - Electroplating boosbar manufacturing process - Google Patents
Electroplating boosbar manufacturing process Download PDFInfo
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- KR20010073752A KR20010073752A KR1020000002585A KR20000002585A KR20010073752A KR 20010073752 A KR20010073752 A KR 20010073752A KR 1020000002585 A KR1020000002585 A KR 1020000002585A KR 20000002585 A KR20000002585 A KR 20000002585A KR 20010073752 A KR20010073752 A KR 20010073752A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D7/00—Bending rods, profiles, or tubes
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Abstract
Description
본 발명은 전기이온도금용 부스바의 제조방법에 관한 것으로, 더욱 상세하게는 전기이온도금장치의 도금조로 설치되는 부스바를 제조함에 있어, 동의 열연과 인발,압연공정을 통해 동과 티타늄의 밀착력을 향상시키므로서 제품의 수명연장과 함께 투입 애노드량을 일정하게 조절하여 균일한 두께로 도금작업을 행 할 수 있어, 불량율의 감소효과와 생산성 향상효과를 기대할 수 있는 전기이온도금용 부스바에 관한 것이다.The present invention relates to a method for manufacturing a busbar for an electrothermal charge, and more particularly, in manufacturing a busbar installed as a plating bath of an electrothermal charge device, to improve adhesion between copper and titanium through copper hot rolling, drawing and rolling processes. The present invention relates to a bus bar for electric temperature heating, which can be plated with a uniform thickness by uniformly adjusting the input anode amount along with the life of the product, thereby reducing the defect rate and improving the productivity.
일반적으로, 전기이온장치는 반도체 결정에 불순물 원자를 도입하여 전도형의 비저항을 갖는 반도체를 만들기 위해 불순물 원자를 이온화하여 고전압에 의한 고속 가속기에 의해 고속으로 반도체결정 표면에 주입하는 이온주입법에 사용되는 장치인바, 이와같은 전기이온장치는 실제 니켈,아연과 같은 도금작업과 함께 인쇄회로기판도금과 반도체부품의 도금작업에 사용되고 있다.In general, an electric ion device is used in an ion implantation method in which an impurity atom is introduced into a semiconductor crystal to ionize an impurity atom and implant it into a semiconductor crystal surface at high speed by a high speed accelerator due to a high voltage. As a device, such an electric ion device is actually used for plating of printed circuit boards and plating of semiconductor parts together with plating operations such as nickel and zinc.
이때, 상기와 같이 인쇄회로기판의 도금작업에 사용되는 전기이온장치(100)는 동(Cu)조각이 담겨지며 복수조로 설치되는 바스켓(110)을 '+ ,- '전극이 연결되는 부스바(120)에 걸림고정한 상태로서 산성 수용액(130)이 충진되는 도금조(140)에 담그고, 도금할 대상물을 도금조(140)에 담근후, 부스바(120)로 전원을 공급하여, 대상물(기판)의 표면으로 용액중에 이온화 된 금속을 석출하도록 작동되는 것이다.At this time, the electrical ion device 100 used in the plating operation of the printed circuit board as described above, the copper (Cu) is contained in the basket 110, which is installed in a plurality of sets of bus bar '+,-' electrode is connected ( 120 is dipped into the plating bath 140 filled with the acidic aqueous solution 130 in a state of being locked to the state, and the object to be plated is dipped in the plating bath 140, and then the power is supplied to the busbar 120 to provide the object (substrate). To the ionized metal in solution.
여기서, 상기한 부스바(120)는 도금조의 담겨지도록 한 구조로 "" 형태를 갖는 것으로서, 높은 전도율의 동을 그 구성재질로 사용하였는데, 이와같은 부스바(120)는 바스켓(110) 또는 도금대상물와 함께 대부분의 부위가 산성수용액(130)에 담가지게 되므로 쉽게 산화됨에 따라 그 사용수명이 짧은 단점을 갖는 것이었다.Here, the bus bar 120 has a structure so as to be contained in the plating bath " "As having a form, copper of high conductivity was used as its constituent material, such a bus bar 120 is easily oxidized because most parts are immersed in the acidic aqueous solution 130 with the basket 110 or the plating object. Therefore, the service life was short.
따라서, 근래에는 상기와 같은 문제점을 해결하고자 동(Cu)의 외둘레를 티타늄으로 감싸므로서 내부식성을 향상되도록 한 부스바를 개발,사용하고 있는데,Therefore, in recent years, in order to solve the above problems, the bus bar was developed and used to improve corrosion resistance by wrapping the outer circumference of copper with titanium.
이와같이 강자성체인 티타늄을 동의 외둘레로 감싸기 위한 종래 부스바 제조방법으로는 도 2에 도시된 바와같이 판상체를 취하는 동판(300)의 상,하면으로 티타늄판(200)을 폭발접착한 후, 동판(300)의 양측면에 티타늄판(200)을 덧대는 형태로서 용접하는 방법 또는 동관이 티타늄관에 의해 감싸여지도록 인발압출성형하는 방법이 사용되었는데,Thus, as a conventional busbar manufacturing method for wrapping the ferromagnetic titanium in the outer circumference of the copper as shown in Figure 2, the upper and lower surfaces of the copper plate 300 taking the plate body explosion-bonded to the upper and lower surfaces, the copper plate Titanium plate 200 is padded on both sides of the 300 to weld or pull-extrusion molding to be wrapped by the titanium tube was used,
전자인 폭발접착방법은 표면접착력은 우수하기는 하지만 폭발접착공정이 매우 번거롭고 부스바를 수용액에 담글경우 용접부위가 쉽게 부식되는 문제점을 갖는 것이며,Explosion adhesion method, which is the former, has excellent surface adhesion, but has a problem that the explosion adhesion process is very cumbersome and the welding part is easily corroded when the busbar is immersed in an aqueous solution.
후자인 인발압출방식은 동관과 티타늄과의 접합부위가 불규칙적으로 형성되므로 그만큼 전기 전도성이 저하됨에 따라 도금두께의 조절에 상당한 어려움과 함께, 그만큼 불량율이 증가하게 되는 문제점을 갖는 것이었다.The latter draw-out extrusion method had a problem that the defect rate was increased with considerable difficulty in controlling the plating thickness as the electrical conductivity was reduced because the joint portion between the copper tube and titanium was irregularly formed.
따라서, 본 발명은 전술한 종래 부스바 제작방법의 제반적인 문제점을 해결하고자 창안된 것으로,Therefore, the present invention was devised to solve the general problems of the above-described conventional busbar manufacturing method,
본 발명의 목적은 동의 열연과 인발공정 후, 압연공정을 동시에 행함에 따라 동과 티타늄의 밀착력을 향상시키므로서 제품의 수명연장은 물론 투입 애노드량을 일정하게 조절하여 균일한 두께로 도금작업을 행하도록하여, 불량율의 감소효과와 생산성 향상효과를 기대할 수 있는 전기이온도금용 부스바에 관한 것이다.It is an object of the present invention to improve the adhesion between copper and titanium as the rolling process is carried out simultaneously after the copper hot rolling and drawing process, thereby to extend the life of the product as well as to adjust the amount of anode input in a uniform thickness. To this end, the present invention relates to a bus bar for electric interest price that can be expected to reduce the defective rate and improve the productivity.
상기한 목적을 달성하기 위한 본 발명의 구체적인 수단으로는;As a specific means of the present invention for achieving the above object;
원형 티타늄관을 인발성형하는 과정과; 동을 열연하여 티타늄의 내경으로 압출하는 과정과; 내경으로 동이 압출삽입된 티타늄관을 프레스에 압연성형하는 과정과; 압연성형이 이루어진 관을 절곡성형하는 과정으로 이루어지는 부스바의 제조방법을 구비하므로서 달성된다.Drawing a round titanium tube; Hot-rolling copper and extruding it into the inner diameter of titanium; Rolling the titanium tube extruded with copper into an inner diameter into a press; It is achieved by providing a method for producing a busbar comprising a process of bending the tube formed by rolling.
도 1은 전기이온도금장치의 구성도1 is a block diagram of an electric charge device
도 2는 폭발접착방법에 의해 형성되는 종래 부스바의 제작도Figure 2 is a production diagram of a conventional busbar formed by the explosion bonding method
도 3은 본 발명에 따른 전기이온도금용 부스바의 제조방법을 나타낸 공정도Figure 3 is a process chart showing a manufacturing method of the electric charge electrode bus bar according to the present invention
<도면주요부위에 대한 부호의 설명><Explanation of symbols for major parts of drawing>
S1-S4 : 1-4과정 1 : 티타늄관 2 : 동S1-S4: 1-4 Process 1: Titanium Tube 2: Copper
이하, 본 발명의 바람직한 실시예를 첨부도면에 의거 상세히 설명하기로 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
<실시예><Example>
도 3은 본 발명에 따른 부스바의 제조공정도로서, 이에 도시된 바와같이 인발방식을 통해 티타늄관(1)의 성형하는 1과정(S1)과, 동(2)을 열연한 후 티타늄관(1)의 내경에 압출하는 2과정(S2)과, 티타늄관(1)을 압연하는 3과정(S3)과, 절곡성형하는 4과정(S4)으로 구성된다.3 is a manufacturing process diagram of the busbar according to the present invention, as shown in the first step (S1) of forming the titanium tube (1) through the drawing method, and after the hot rolled copper (2) titanium tube (1) It consists of two processes (S2) of extruding to the inner diameter of, three processes (S3) of rolling the titanium tube (1), and four processes (S4) of bending molding.
여기서, 상기 1과정(S1)은 도 3에서와 같이 인발다이를 통해 티타늄관(1)을 성형하는 공정인데,Here, the first step (S1) is a process of molding the titanium tube 1 through the drawing die, as shown in FIG.
통상적으로 티타늄은 주기율표 4족에 속하는 은백색 금속원소. 원소기호 Ti, 원자번호 22, 원자량 47.90. 녹는점 1,.675℃. 비중 4.5.을 갖는 것으로 알려져 있으며, 강도가 크고 밀도가 작으며 내식성이 뛰어나 항공기, 선박의 부품에 널리사용되고 있는바, 이와같은 티타늄을 인발다이를 통해 이음매 없이 원형관형태로 제조하는 공정이다.Titanium is usually a silver white metal element belonging to group 4 of the periodic table. Element symbol Ti, atomic number 22, atomic weight 47.90. Melting point 1, .675 ° C. It is known to have a specific gravity of 4.5. It is widely used in parts of aircraft and ships because of its high strength, low density, and excellent corrosion resistance.
또한, 2과정(S2)은 상기 1과정(S1)을 통해 성형된 티타늄관(1)의 내경으로 열연된 동(2)을 압출하는 공정으로서,In addition, the second process (S2) is a process of extruding the hot rolled copper (2) to the inner diameter of the titanium tube (1) formed through the first process (S1),
상기한 동(2)은 원소기호 Cu. 원자번호 29. 원자량 63.546.으로 알려져 있으며, 열, 전기의 양도체로 전연성(展延性)이 풍부하며 차가운 염산이나 황산에는 반응하지 않지만, 질산이나 뜨거운 진한 황산에는 녹는 특성을 갖고 있는바,Copper (2) described above is an element symbol Cu. Atomic number 29. Known as 63.546. Atomic weight, it is a good conductor of heat and electricity, rich in malleability and does not react to cold hydrochloric acid or sulfuric acid, but it dissolves in nitric acid and hot concentrated sulfuric acid.
2과정(S2)에서는 위와같은 동을 열연하여 다이 오리피스를 통해 고압으로 압출하되, 압출되는 동(2)이 전술한 티타늄관(1)의 내경에 삽입되도록 하는 공정이다.In the second process (S2), the copper is hot rolled to extrude at a high pressure through the die orifice, and the copper 2 to be extruded is inserted into the above-described inner diameter of the titanium tube 1.
이때, 상기와 같이 내부로 삽입되는 동은 티타늄관(1)의 입,출구에 돌출되도록하여 돌출부위를 통해 전원공급이 용이하게 이루어지도록함이 바람직하며, 이와같이 동을 압출하는 2과정(S2)에서는 티타늄관(1)의 균열을 방지하기 위해 티타늄관(1)을 750 - 850℃로 가열함이 바람직하다.At this time, the copper is inserted into the interior as described above is to be protruded to the inlet and outlet of the titanium tube (1) to facilitate the power supply through the protruding portion, it is preferable to extrude the copper in this way (S2) In the present invention, it is preferable to heat the titanium tube (1) to 750-850 ℃ to prevent cracking of the titanium tube (1).
또한, 3과정(S3)은 전술한 2과정(S2)을 통해 내경으로 동(2)이 삽입된 원형 티타늄관(1)을 압축로울러에 의해 다각체로 성형하는 압연공정으로서,In addition, the three process (S3) is a rolling process for molding the circular titanium tube (1) in which the copper (2) is inserted into the inner diameter through the two processes (S2) described above into a polygonal body by a compression roller,
이와같이 압연공정은 원형관형태의 티타늄관(1)을 압축성형함에 따라 전술한 2과정(S2)을 통해 티타늄관(1)에 삽입된 동(2)과, 티타늄관(1)의 경계면의 불규칙한 접합면이 일체화되는 것으로,As described above, the rolling process is performed by compressing the titanium tube 1 in the form of a circular tube, and the copper 2 inserted into the titanium tube 1 through the above-described two steps (S2) and irregularities of the interface between the titanium tube 1 are irregular. The joint surface is integrated,
이와같이 경계면을 일체화함에 따라 동을 통해 공급되는 외부전원이 티타늄에 균일하게 전달되므로, 투입되는 전원량을 일정하게 조절할 수 있으며, 균일한 양극면적을 유지할 수 있어, 도금두께를 균일하게 책정할 수 있으며, 고속도금을 행할 수 있게 된다.In this way, since the external power supplied through copper is uniformly transmitted to titanium as the interface is integrated, the amount of power input can be uniformly adjusted, and the uniform anode area can be maintained, so that the plating thickness can be uniformly set. Therefore, high speed plating can be performed.
마지막 공정은 4과정(S4)은 제 3과정(S3)을 통해 도형체로 압연성형된 티타늄관(1)을 ""같은 형태로서 절곡성형하여 완제품으로서의 부스바를 제작하는 공정이다.In the final process, the fourth process (S4) is made of the titanium tube (1) rolled into a figure through the third process (S3). "It is the process of forming a busbar as a finished product by bending molding in the same form.
따라서, 위와같은 제작공정을 통해 완성된 부스바는 결과적으로 볼 때, 본발명에 따른 부스바는 종래 인발압출방법과 폭발접착방법의 장점만을 얻을 수 있는 것이며, 이와같은 제작방법을 갖는 부스바는 전기이온도금장치뿐만아니라, 폐수처리장치 등에 적용할 수도 있는 것이다.Therefore, the busbar completed through the manufacturing process as described above, as a result, the busbar according to the present invention can obtain only the advantages of the conventional drawing extrusion method and explosion bonding method, the busbar having such a manufacturing method In addition to the electric heating device, it can be applied to waste water treatment equipment.
이상과 같이 본 발명에 따른 전기이온도금용 부스바 제조방법은 동의 열연과 인발공정 후, 압연공정을 동시에 행함에 따라 동과 티타늄의 밀착력을 향상시키므로서 제품의 수명연장은 물론 투입 애노드량을 일정하게 조절하여 균일한 두께로 도금작업을 행할 수 있어, 불량율의 감소효과와 함께 생산성 향상효과를 갖는 것으로, 생산자 및 사용자 모두에게 매우 유용한 발명인 것이다.As described above, according to the present invention, the method for manufacturing an electric thermal bus bar according to the present invention improves the adhesion between copper and titanium at the same time by performing a rolling process at the same time as the copper hot rolling and drawing process, thereby extending the life of the product as well as the amount of anode added. It is possible to perform the plating operation with a uniform thickness by adjusting, to have a productivity improvement effect with the effect of reducing the defective rate, it is a very useful invention for both producers and users.
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KR1020000002585A KR20010073752A (en) | 2000-01-20 | 2000-01-20 | Electroplating boosbar manufacturing process |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101148183B1 (en) * | 2011-09-07 | 2012-05-29 | (주)대신제일 | Mold and method of bus bar |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62164899A (en) * | 1986-01-14 | 1987-07-21 | Tanaka Kikinzoku Kogyo Kk | Composite bus bar for electric conduction |
EP0753604A1 (en) * | 1995-07-12 | 1997-01-15 | Metallgesellschaft Ag | Anode for the electrowinning of metals |
KR970004548B1 (en) * | 1994-06-15 | 1997-03-29 | 변제현 | Method for manufacturing bus-bar |
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2000
- 2000-01-20 KR KR1020000002585A patent/KR20010073752A/en active Search and Examination
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62164899A (en) * | 1986-01-14 | 1987-07-21 | Tanaka Kikinzoku Kogyo Kk | Composite bus bar for electric conduction |
KR970004548B1 (en) * | 1994-06-15 | 1997-03-29 | 변제현 | Method for manufacturing bus-bar |
EP0753604A1 (en) * | 1995-07-12 | 1997-01-15 | Metallgesellschaft Ag | Anode for the electrowinning of metals |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101148183B1 (en) * | 2011-09-07 | 2012-05-29 | (주)대신제일 | Mold and method of bus bar |
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