KR20000036382A - Non Volatile Memory Card With Diestacked Pakage - Google Patents

Non Volatile Memory Card With Diestacked Pakage Download PDF

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Publication number
KR20000036382A
KR20000036382A KR1020000010270A KR20000010270A KR20000036382A KR 20000036382 A KR20000036382 A KR 20000036382A KR 1020000010270 A KR1020000010270 A KR 1020000010270A KR 20000010270 A KR20000010270 A KR 20000010270A KR 20000036382 A KR20000036382 A KR 20000036382A
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KR
South Korea
Prior art keywords
volatile memory
card
memory semiconductor
semiconductor
massive
Prior art date
Application number
KR1020000010270A
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Korean (ko)
Inventor
황문도
김윤신
Original Assignee
민훈
솔칩테크놀로지 주식회사
황문도
주식회사 플래시비전
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Application filed by 민훈, 솔칩테크놀로지 주식회사, 황문도, 주식회사 플래시비전 filed Critical 민훈
Priority to KR1020000010270A priority Critical patent/KR20000036382A/en
Publication of KR20000036382A publication Critical patent/KR20000036382A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/74General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/84Biological processes
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L9/00Disinfection, sterilisation or deodorisation of air
    • A61L9/14Disinfection, sterilisation or deodorisation of air using sprayed or atomised substances including air-liquid contact processes
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2209/00Aspects relating to disinfection, sterilisation or deodorisation of air
    • A61L2209/10Apparatus features
    • A61L2209/13Dispensing or storing means for active compounds
    • A61L2209/134Distributing means, e.g. baffles, valves, manifolds, nozzles

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biomedical Technology (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Molecular Biology (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Epidemiology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

PURPOSE: A layered massive non-volatile memory semiconductor card is proposed to greatly enhance storage quantity of semiconductor card of non-volatile memory by laying control CPU(Central Processing Unit) part in the non-volatile memory semiconductor. CONSTITUTION: A layered massive non-volatile memory semiconductor card is consisted of control part and non-volatile memory semiconductor part. Massive storage is accomplished by arranging multiple non-volatile memory semiconductors in one card of non-volatile memory semiconductor. A card of massive non-volatile memory semiconductor with many elements is built by laying control CPU part in the non-volatile memory semiconductor. This method makes it possible to reduce production cost of non-volatile memory semiconductor card with massive storage instead of using the method of heightening the condensation degree of semiconductor.

Description

적층식 대용량 불휘발성 메모리 반도체 카드{Non Volatile Memory Card With Diestacked Pakage}Stackable Large Capacity Nonvolatile Memory Semiconductor Cards {Non Volatile Memory Card With Diestacked Pakage}

본 발명은 불휘발성 메모리 반도체 카드의 용량을 확대하는 방법에 관한것이다.The present invention relates to a method for expanding the capacity of a nonvolatile memory semiconductor card.

지금까지는 용량을 증가시키기 위해 보다집적도가 높은 소자를 개발하여왔다. 이는 막대한 비용이 투자되는 커다란 사업이었다.To date, more integrated devices have been developed to increase capacity. This was a big business with huge investments.

본 발명은 상기의 문제점을 해결하기 위하여 고안된 것 으로서 불휘발성 메모리 반도체위에 제어 cpu부(불휘발성 메모리 반도체 제어부와 불휘발성 메모리 반도체 접속부로 구성)를 적층하여 대용량화를 실현함에 그 복적이 있다.SUMMARY OF THE INVENTION The present invention has been devised to solve the above-mentioned problems, and the present invention is to achieve a large capacity by stacking a control cpu unit (composed of a nonvolatile memory semiconductor control unit and a nonvolatile memory semiconductor connection unit) on a nonvolatile memory semiconductor.

도1은 발명품의 구성을 나타내는 도면으로1 is a view showing the configuration of the invention

① 하나의 불휘발성 메모리 반도체 카드 내부에① inside one nonvolatile memory semiconductor card

② 다수의 불휘발성 메모리 반도체가 존재하여 스페이스가 없을 때② When there is no space because many nonvolatile memory semiconductors exist

③ 제어cpu부를 불휘발성 메모리 반도체 위에 적층하여 작은 공간내에 많은 소자를 넣어 대용량의 불휘발성 메모리 반도체 카드를 만든다.(3) The control cpu portion is stacked on the nonvolatile memory semiconductor to make a large capacity nonvolatile memory semiconductor card by putting many elements in a small space.

도1은 발명품의 구성을 나타내는 도면으로1 is a view showing the configuration of the invention

① 하나의 불휘발성 메모리 반도체 카드 내부에① inside one nonvolatile memory semiconductor card

② 다수의 불휘발성 메모리 반도체를 배열하여 대용량화를 실현하고② By arranging a large number of nonvolatile memory semiconductors,

③ 제어cpu부를 불휘발성 메모리 반도체 위에 적층하여 많은 소자를 넣은 대용량의 불휘발성 메모리 반도체 카드를 만든다.(3) A control cpu portion is stacked on a nonvolatile memory semiconductor to make a large capacity nonvolatile memory semiconductor card containing many elements.

적은 비용으로 대용량의 불휘발성 반도체 카드를 마들어 각종 데이타 처리기기(MP3 player,휴대폰,디지탈 카메라류등)등의 성능 및 활용도를 향상시켜 시장확대와 수출증진에 기여한다.By making large-capacity nonvolatile semiconductor cards at low cost, it improves the performance and utilization of various data processing devices (MP3 player, mobile phones, digital cameras, etc.), contributing to market expansion and export increase.

Claims (2)

하나의 불휘발성 반도체 메모리 카드에 다수의 불휘발성 반도체 메모리를 적층하는 방법How to stack multiple nonvolatile semiconductor memories on one nonvolatile semiconductor memory card 불휘발성 반도체 메모리 위, 또는 아래에 제어 cpu부(불휘발성 메모리 반도체 제어부와 불휘발성 메모리 반도체 접속장치로 구성)를 적층하는 방법A method of stacking a control cpu unit (comprising a nonvolatile memory semiconductor control unit and a nonvolatile memory semiconductor connection device) on or below a nonvolatile semiconductor memory.
KR1020000010270A 2000-02-29 2000-02-29 Non Volatile Memory Card With Diestacked Pakage KR20000036382A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020000010270A KR20000036382A (en) 2000-02-29 2000-02-29 Non Volatile Memory Card With Diestacked Pakage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020000010270A KR20000036382A (en) 2000-02-29 2000-02-29 Non Volatile Memory Card With Diestacked Pakage

Publications (1)

Publication Number Publication Date
KR20000036382A true KR20000036382A (en) 2000-07-05

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KR1020000010270A KR20000036382A (en) 2000-02-29 2000-02-29 Non Volatile Memory Card With Diestacked Pakage

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8151052B2 (en) 2007-12-24 2012-04-03 Samsung Electronics Co., Ltd. Memory card with removable cover

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0778228A (en) * 1993-09-07 1995-03-20 Toshiba Corp Memory card and its data managing method
JPH0778231A (en) * 1993-09-07 1995-03-20 Toshiba Corp Memory card
JPH0793499A (en) * 1993-09-20 1995-04-07 Hitachi Ltd Memory card
KR950021508U (en) * 1993-12-09 1995-07-28 현대반도체주식회사 EPROM memory card
JPH07320017A (en) * 1994-05-25 1995-12-08 Fuji Photo Film Co Ltd Ic memory card

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0778228A (en) * 1993-09-07 1995-03-20 Toshiba Corp Memory card and its data managing method
JPH0778231A (en) * 1993-09-07 1995-03-20 Toshiba Corp Memory card
JPH0793499A (en) * 1993-09-20 1995-04-07 Hitachi Ltd Memory card
KR950021508U (en) * 1993-12-09 1995-07-28 현대반도체주식회사 EPROM memory card
JPH07320017A (en) * 1994-05-25 1995-12-08 Fuji Photo Film Co Ltd Ic memory card

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8151052B2 (en) 2007-12-24 2012-04-03 Samsung Electronics Co., Ltd. Memory card with removable cover

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