KR19990070141A - Adhesive tape for electronic parts - Google Patents

Adhesive tape for electronic parts Download PDF

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Publication number
KR19990070141A
KR19990070141A KR1019980004810A KR19980004810A KR19990070141A KR 19990070141 A KR19990070141 A KR 19990070141A KR 1019980004810 A KR1019980004810 A KR 1019980004810A KR 19980004810 A KR19980004810 A KR 19980004810A KR 19990070141 A KR19990070141 A KR 19990070141A
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South Korea
Prior art keywords
weight
adhesive tape
parts
adhesive
acrylonitrile
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KR1019980004810A
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Korean (ko)
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KR100530517B1 (en
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박민효
임대우
김정락
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한형수
주식회사 새한
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Priority to KR1019980004810A priority Critical patent/KR100530517B1/en
Publication of KR19990070141A publication Critical patent/KR19990070141A/en
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Publication of KR100530517B1 publication Critical patent/KR100530517B1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

본 발명은 반도체 장치에서 리드, 다이패드, 방열판, 반도체 칩 등과 같은 리드프레임 주변의 부품들의 접착에 사용할 수 있는 전자부품용 접착테이프에 관한 것으로서, 기존에 비해 특히 저온에서 접착, 경화할 수 있고 충분한 내열성 및 신뢰성을 지닌 접착테이프를 제공하는데 그 목적이 있는 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive tape for electronic components that can be used to bond parts around a lead frame such as leads, die pads, heat sinks, semiconductor chips, etc. in a semiconductor device. It is an object of the present invention to provide an adhesive tape having heat resistance and reliability.

본 발명은 내열성 필름의 한면 또는 양면에 아크릴로 니트릴과 부타디엔의 공중합체 혹은 아크릴로니트릴, 부타디엔 및 아크릴산의 삼원공중합체에 양 말단에 에폭시기를 가진 폴리에스터-에폭시 공중합체를 각각의 경화제와 함께 첨가하여 얻어지는 접착제를 도포, 건조하여 접착층을 형성시킨 전자부품용 접착테이프에 관한 것으로서, 이와 같이 제조된 접착테이프는 저온에서 접착, 경화가 가능할 뿐만 아니라 내열성등 제반물성이 우수하여 반도체 장치등의 전자부품용으로 사용시 매우 유용하다.The present invention adds a polyester-epoxy copolymer having epoxy groups at both ends with a copolymer of acrylonitrile and butadiene or a terpolymer of acrylonitrile, butadiene and acrylic acid on one or both sides of the heat resistant film together with the respective curing agents. The present invention relates to an adhesive tape for electronic components obtained by applying and drying an adhesive obtained by forming an adhesive layer. The adhesive tape thus prepared is not only able to be adhered and cured at low temperatures, but also has excellent physical properties such as heat resistance and is excellent in electronic components such as semiconductor devices. Very useful when used for

Description

전자부품용 접착테이프Adhesive tape for electronic parts

본 발명은 반도체 장치에서 리드, 다이패드, 방열판, 반도체 칩 등과 같은 리드프레임 주변의 부품들의 접착에 사용할 수 있는 전자부품용 내열성 접착테이프에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat resistant adhesive tape for electronic components that can be used for bonding parts around a lead frame such as leads, die pads, heat sinks, semiconductor chips, and the like in semiconductor devices.

기존에 수지패키지형 반도체 장치에 있어서 사용되는 접착 테이프에는, 리드 프레임 고정용 접착테이프, TAB 테이프 등이 있는데, 예를들어, 리드프레임 고정용 접착테이프의 경우에 있어서는, 도 1 및 도 2에 나타낸 바와 같이 리드프레임의 리드를 고정하여, 리드프레임 자체 및 반도체 조립공정 전체의 수율 및 생산성 향상을 목적으로 사용되며, 일반적으로 리드프레임 메이커에서 리드프레임 상에 접착되고, 반도체 메이커는 이것을 이용하여 반도체 칩을 탑재한 후에 수지로 패키징 한다.Conventional adhesive tapes used in resin packaged semiconductor devices include lead tape fixing adhesive tapes and TAB tapes. For example, in the case of lead frame fixing adhesive tapes, the adhesive tapes shown in Figs. As described above, the lead of the lead frame is fixed and used for the purpose of improving the yield and productivity of the lead frame itself and the whole semiconductor assembly process. After mounting, package with resin.

이 때문에 리드프레임 고정용 접착테이프는 반도체 수준에서의 일반적인 신뢰성 및 테이핑시의 작업성 등은 물론, 테이핑 후의 접착력 및 반도체 장치의 조립공정에서의 가열에 견딜 수 있는 충분한 내열성을 갖추어야 한다.For this reason, the adhesive tape for fixing the lead frame must have sufficient heat resistance to withstand the general reliability at the semiconductor level and the workability during taping, as well as the adhesive strength after taping and heating in the assembling process of the semiconductor device.

이와 같은 용도에 사용되는 기존의 접착테이프로는, 예를 들어, 폴리이미드 필름등의 내열성 지지 필름상에, 폴리아크릴로니트릴, 폴리아크릴레이트 혹은 아크릴로니트릴-부타디엔 공중합체 등의 합성 고무계 수지 등을 단독 혹은 또 다른 수지로 변경한 것 또는 다른 수지와 혼합한 접착제를 도포한 것이 사용되고 있다.Conventional adhesive tapes used for such applications include, for example, synthetic rubber-based resins such as polyacrylonitrile, polyacrylate, or acrylonitrile-butadiene copolymers on heat resistant support films such as polyimide films. Is used alone or another resin, or coated with an adhesive mixed with another resin.

또한, 근래들어 반도체 장치 내부에 있어서도 다핀화나 방열성의 확보로 인하여 패키지 구조가 복잡화하고, 그중에 사용되는 접착 테이프등의 유기재료에 대해서도 그 전기적, 물리적 특성이나 취급특성에 대한 요구가 엄격해 지고 있는 실정이다.In addition, in recent years, even in the semiconductor device, the package structure has become complicated due to polyfinization or heat dissipation, and the demand for electrical, physical characteristics and handling characteristics of organic materials such as adhesive tapes used therein is strict. to be.

예를들어, 수지밀봉형 반도체 장치에서 리드핀의 고정에 종래의 접착테이프를 사용한 경우에는 내열성이나 전기적 신뢰성이 충분치 않은 문제가 있고 반도체 칩과 리드핀을 절연테이프로 접합시키는 경우에 기존의 폴리이미드나 폴리아미드 수지 테이프를 적용시 그 테이핑 온도나 압력, 경화조건 등이 엄격하고, 리드프레임 등의 금속재료를 손상시킬 우려가 있으며, 저코스트화가 어려운 등의 문제가 있다.For example, when a conventional adhesive tape is used to fix lead pins in a resin-sealed semiconductor device, there is a problem of insufficient heat resistance and electrical reliability. When the tape or polyamide resin tape is applied, its taping temperature, pressure, curing conditions, etc. are severe, there is a risk of damaging metal materials such as lead frames, and low cost is difficult.

본 발명은 상기와 같은 문제점을 해결하기 위해 안출된 것으로서, 비교적 저온에서 접착, 경화할 수 있고, 충분한 내열성 및 신뢰성 등을 갖는 접착테이프의 제공을 그 목적으로 한 것이다.The present invention has been made to solve the above problems, and an object thereof is to provide an adhesive tape that can be bonded and cured at a relatively low temperature, and has sufficient heat resistance and reliability.

도 1은 리드프레임의 개략 구성도.1 is a schematic configuration diagram of a lead frame.

도 2는 리드프레임의 주요부의 확대도.2 is an enlarged view of a main part of a lead frame.

도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings

1 : 리드고정테이프 2 : 댐바(DAMBAR)1: Lead fixing tape 2: Dambar (DAMBAR)

3 : 리드핀 4 : 다이패드3: lead pin 4: die pad

본 발명은 내열성 필름의 한면 또는 양면에 중량평균분자량이 5,000∼150,000인 아크릴로니트릴과 부타디엔 공중합체 혹은 아크릴로니트릴, 부타디엔과 아크릴산의 삼원공중합체(중합체A)에 분자량 1,000∼30,000이며 양 말단에 에폭시기를 가진 폴리에스터-에폭시 공중합체(중합체 B)를 중합체 A 100중량부에 대하여 50∼600중량부 첨가하고, 중합체 B의 경화제로서 전기적 특성과 내열특성이 뛰어난 페놀계 화합물 혹은 산무수물계 경화제를 중합체 B 100중량부에 대하여 5∼30중량부 첨가하며, 중합체 A의 경화제로서 튜램(thiuram)계 가황제 또는 과산화물을 중합체 A 100중량부에 대하여 1∼10중량부를 첨가하여 얻어지는 접착제를 도포건조하여 접착층을 형성시킨 것 임을 특징으로 하는 전자부품용 접착테이프에 관한 것이다.The present invention has an acrylonitrile and butadiene copolymer having a weight average molecular weight of 5,000 to 150,000 on one side or both sides of a heat resistant film or a terpolymer (polymer A) of acrylonitrile, butadiene and acrylic acid, and has a molecular weight of 1,000 to 30,000 at both ends. 50 to 600 parts by weight of a polyester-epoxy copolymer (polymer B) having an epoxy group is added to 100 parts by weight of polymer A, and a phenolic compound or an acid anhydride-based curing agent having excellent electrical and heat resistance properties is used as a curing agent for polymer B. 5-30 parts by weight is added to 100 parts by weight of the polymer B, and an adhesive obtained by adding 1-10 parts by weight of a turam vulcanizing agent or peroxide to 100 parts by weight of the polymer A as a curing agent of the polymer A is applied and dried. It relates to an adhesive tape for an electronic component, characterized in that the adhesive layer is formed.

이하, 본 발명에 대하여 상세히 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail.

본 발명에서 중합체 A로 사용되는 아크릴로니트릴, 부타디엔과 아크릴산의 삼원공중합체(아크릴로니트릴-부타디엔 고무)는 중량평균분자량이 5,000∼150,000(보다 바람직하게는 10,000∼50,000)의 분자량을 가지는 것으로, 아크릴로니트릴 함유율이 10∼60중량%(보다 바람직하게는 20∼50중량%)인 것이 적합하다. 이때 중량평균분자량이 5,000 보다 낮으면 열안정성이 불량해지고 내열성이 저하한다. 또, 150,000 보다 높아지면 용매에 대한 용해성이 나빠지고 용액 제조시에 점도가 증가하여 접착제로 사용하였을 경우에 작업성이 불량해지고 접착성이 저하된다. 또, 아크릴로니트릴 함유율이 10중량% 보다 낮아지면 용매 용해성이 저하되고, 60중량% 보다 높아지면 전기절연성이 불량해진다. 또한 아크릴산의 함유율이 1중량% 미만인 경우에는 접착력이 저하되며, 20중량% 초과한 경우에는 접착테이프의 테이핑 작업성이 저하된다.The terpolymer (acrylonitrile-butadiene rubber) of acrylonitrile, butadiene and acrylic acid used as the polymer A in the present invention has a weight average molecular weight of 5,000 to 150,000 (more preferably 10,000 to 50,000), It is suitable that acrylonitrile content rate is 10 to 60 weight% (more preferably 20 to 50 weight%). At this time, if the weight average molecular weight is lower than 5,000, the thermal stability is poor and the heat resistance is lowered. In addition, when it is higher than 150,000, the solubility in solvents is deteriorated, the viscosity increases during solution preparation, and when used as an adhesive, the workability is poor and the adhesiveness is lowered. Moreover, when the acrylonitrile content rate is lower than 10 weight%, solvent solubility will fall, and when higher than 60 weight%, electrical insulation will be bad. Moreover, when the content rate of acrylic acid is less than 1 weight%, adhesive force falls, and when it exceeds 20 weight%, the taping workability of an adhesive tape falls.

그리고, 폴리에스터-에폭시 수지(중합체 B)는 양 말단에 에폭시기를 가진 것이여야 하며 중합체 A 100중량부에 대하여 50∼600중량부(보다 바람직하게는 100∼200중량부) 사용하는데, 폴리에스터-에폭시수지를 50중량부 미만 사용한 경우는 접착력이 저하되며, 과다하게 사용한 경우는 내열성이 저하된다. 또한, 폴리에스터-에폭시 수지의 분자량은 1,000∼30,000정도의 분자량을 가진 것으로 분자량이 1,000미만일 경우에는 내열성이 불량해지며 30,000을 초과할 경우에는 용매에 대한 용해성이 저하되어 용액 제조시에 점도가 증가하여 접착제로 사용하였을 경우에 작업성이 불량해진다.In addition, the polyester-epoxy resin (polymer B) should have epoxy groups at both ends and 50 to 600 parts by weight (more preferably 100 to 200 parts by weight) based on 100 parts by weight of polymer A. When less than 50 parts by weight of epoxy resin is used, the adhesive strength is lowered, and when excessively used, heat resistance is lowered. In addition, the molecular weight of the polyester-epoxy resin has a molecular weight of about 1,000 to 30,000. If the molecular weight is less than 1,000, the heat resistance is poor. If the molecular weight exceeds 30,000, the solubility in the solvent decreases and the viscosity increases during solution preparation. Workability becomes poor when used as an adhesive.

상기의 폴리에스터-에폭시 수지는 하기 화학식 1과 같이 양 말단이 카르복실기인 테레프탈산-에틸렌 글리콜 올리고머와 하기 화학식 2와 같이 양 말단이 에폭시기인 비스페놀 A 타입의 수지를 반응시켜 얻을 수 있다.The polyester-epoxy resin may be obtained by reacting a terephthalic acid-ethylene glycol oligomer having a carboxyl group at both ends thereof with a bisphenol A type resin having an epoxy group at both ends thereof as shown in the following Formula (2).

[화학식 1][Formula 1]

[화학식 2][Formula 2]

즉, 상기 화합물을 염기성 촉매하에서 반응시키면 하기 화학식 3과 같이 양 말단에 에폭시기를 가진 폴리에스터-에폭시 공중합체를 얻을 수 있는 것이다.That is, when the compound is reacted under a basic catalyst, it is possible to obtain a polyester-epoxy copolymer having epoxy groups at both ends as shown in the following general formula (3).

[화학식 3][Formula 3]

본 발명에서 사용되는 폴리에스터-에폭시수지의 경화제는 수지 100중량부에 대하여 5∼30중량부 사용되며 부족하거나 과다한 경우는 내용제성, 내열성, 전기저항 등이 저하된다. 경화제는 전기적 특성과 내열성, 내약품성이 우수한 산무수물계나 페놀계 화합물을 경화제로 사용하고, 경화반응을 촉진하기 위하여 경화촉진제를 사용할 수 있다. 사용가능한 산무수물계 경화제로는 무수프탈산, 무수말레산, 무수도데실숙신산, 무수헥사히드로프탈산, 무수메틸나딕산, 무수피로멜리트산, 무수벤조페논테트라카르본산 등이 있으며, 사용가능한 페놀계 경화제로는 페놀, p-크레졸, p-클로로페놀, p-니트로페놀, 2, 4-디니트로페놀, 2-나프톨 등이 있다.The curing agent of the polyester-epoxy resin used in the present invention is used 5 to 30 parts by weight with respect to 100 parts by weight of the resin, when insufficient or excessively low solvent resistance, heat resistance, electrical resistance and the like. The curing agent may be an acid anhydride or phenolic compound having excellent electrical properties, heat resistance, and chemical resistance as a curing agent, and a curing accelerator may be used to promote the curing reaction. Acid anhydride curing agents that can be used include phthalic anhydride, maleic anhydride, dodecyl succinic anhydride, hexahydrophthalic anhydride, methylnadic acid anhydride, pyromellitic anhydride, benzophenonetetracarboxylic acid anhydride, and the like. Examples are phenol, p-cresol, p-chlorophenol, p-nitrophenol, 2, 4-dinitrophenol, 2-naphthol and the like.

중합체 A 경화제의 경우에는 중합체 A 100중량부에 대하여 1∼10중량부가 첨가되는 것이 좋으며, 이보다 부족한 경우에는 내열성 내용제성등이 저하되고 과다한 경우에는 접착력이 떨어진다.In the case of the polymer A curing agent, it is preferable to add 1 to 10 parts by weight with respect to 100 parts by weight of the polymer A. If it is insufficient, the heat resistance solvent resistance is lowered, and in the case of an excessive amount, the adhesive strength is poor.

이상과 같은 조성으로 준비된 접착제는 점도가 100∼2000cps(보다 좋기로는 200∼1000cps)로 조절하여 사용하는 것이 좋다.The adhesive prepared in the above composition is preferably used by adjusting the viscosity to 100 to 2000 cps (preferably 200 to 1000 cps).

본 발명에서는 상기 접착제를 내열성 필름위에 건조후의 두께가 10∼50㎛이 되도록 도포하고 80∼120℃에서 1∼20분 동안 건조한 후, 박리성 필름을 붙이고 80∼120℃에서 5∼30분 동안 반경화시키는 과정을 거쳐 내열성 접착테이프를 제조한다.In the present invention, the adhesive is applied to the heat-resistant film after drying to a thickness of 10 to 50㎛ and dried for 1 to 20 minutes at 80 to 120 ℃, then attaching a peelable film and a radius for 5 to 30 minutes at 80 to 120 ℃ The heat-resistant adhesive tape is manufactured through the process of oxidization.

이때 사용될 수 있는 내열성 필름으로는, 예를들면 폴리이미드, 폴리페닐렌술피드, 폴리에테르, 폴리파라벤산 및 경우에 따라서는 폴리에틸렌테레프탈레이트 등의 내열성수지 필름 등이 사용될 수 있으나, 특히 폴리이미드수지 필름이 바람직하다.At this time, as the heat-resistant film that can be used, for example, polyimide, polyphenylene sulfide, polyether, polyparabenic acid and optionally heat-resistant resin film such as polyethylene terephthalate, etc. may be used, in particular polyimide resin film This is preferred.

내열성 필름의 두께는 5∼100㎛(보다 바람직하게는 10∼75㎛)의 범위로 설정하는 것이 바람직하며, 두께가 지나치게 얇은 경우에는 접착테이프가 부드러워 취급하기 곤란하고 지나치게 두꺼운 경우에는 접착테이프의 펀칭성이 곤란해진다.The thickness of the heat resistant film is preferably set in the range of 5 to 100 µm (more preferably, 10 to 75 µm). In the case where the thickness is too thin, the adhesive tape is soft and difficult to handle. Sex becomes difficult.

박리성 필름의 경우 두께가 10∼200㎛ (보다 바람직하게는 25∼150㎛)의 것이 사용되며, 사용 가능한 박리성 필름으로는 폴리프로필렌 필름, 불소수지계 필름, 폴리에틸렌 필름, 폴리에틸렌테레프탈레이트 필름, 종이 및 경우에 따라 이들에 실리콘 수지로 박리성을 부여한 것을 사용할 수 있다.In the case of a peelable film, the thing of thickness 10-200 micrometers (more preferably 25-150 micrometers) is used, As a peelable film which can be used, a polypropylene film, a fluororesin film, a polyethylene film, a polyethylene terephthalate film, paper And in some cases, those having imparted peelability with a silicone resin can be used.

이하에서 실시예 및 비교예를 들어 본 발명을 좀 더 구체적으로 설명한다.Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples.

[실시예 1]Example 1

아크릴로니트릴-부타디엔 고무(아크릴로니트릴 함량 27중량%, 카르복실기 함량 4중량%) 100중량부를 메틸에틸케톤에 녹여 15중량% 용액을 제조한 후, 폴리에스터-에폭시수지를 150중량부, 과산화벤조일 3중량부, p-클로로페놀 15중량부를 첨가하고, 메틸에틸케톤과 톨루엔 용제를 이용하여 용액의 점도를 1000cps로 맞추어 액상접착제를 제조하였다.100 parts by weight of acrylonitrile-butadiene rubber (27% by weight of acrylonitrile, 4% by weight of carboxyl group) was dissolved in methyl ethyl ketone to prepare a 15% by weight solution, and then 150 parts by weight of polyester-epoxy resin and benzoyl peroxide 3 parts by weight and 15 parts by weight of p-chlorophenol were added, and a liquid adhesive was prepared by adjusting the viscosity of the solution to 1000 cps using methyl ethyl ketone and toluene solvent.

이 접착제를 이용하여 두께가 50㎛인 폴리이미드 필름(상품명 : KAPTON, DUPONT社 제조)위에 건조후의 두께가 20㎛이 되도록 도포하고, 건조(120℃, 5분)한 후, 두께가 38㎛ 폴리에틸렌테레프탈레이트 필름을 라미네이트하여 접착테이프를 제조하였다.The adhesive was applied onto a polyimide film having a thickness of 50 µm (trade name: manufactured by KAPTON, DUPONT, Inc.) so that the thickness after drying was 20 µm, and dried (120 ° C. for 5 minutes), followed by 38 µm polyethylene. The terephthalate film was laminated to prepare an adhesive tape.

[실시예 2]Example 2

아크릴로니트릴-부타디엔 고무 100중량부에 폴리에스터-에폭시수지 200중량부, 과산화벤조일 4중량부, p-클로로페놀 20중량부를 첨가하여 실시예 1과 같이 메틸에틸 케톤과 톨루엔 용제를 이용하여 용액의 점도를 1000cps로 맞춘 다음, 이 접착제를 이용하여 실시예 1과 같은 방법으로 접착테이프를 제조하였다.To 100 parts by weight of acrylonitrile-butadiene rubber, 200 parts by weight of polyester-epoxy resin, 4 parts by weight of benzoyl peroxide, and 20 parts by weight of p-chlorophenol were added, and methyl ethyl ketone and toluene solvent were used to prepare the solution. After adjusting the viscosity to 1000 cps, an adhesive tape was prepared in the same manner as in Example 1 using this adhesive.

[실시예 3]Example 3

아크릴로니트릴-부타디엔 고무 100중량부에 폴리에스터-에폭시수지 100중량부, t-부틸과산화물 5중량부, p-클로로페놀 10중량부를 첨가하여 실시예 1과 같이 메틸에틸 케톤과 톨루엔 용제를 이용하여 용액의 점도를 1000cps로 맞춘 다음, 이 접착제를 이용하여 실시예 1과 같은 방법으로 접착테이프를 제조하였다.100 parts by weight of polyester-epoxy resin, 5 parts by weight of t-butyl peroxide, and 10 parts by weight of p-chlorophenol were added to 100 parts by weight of acrylonitrile-butadiene rubber, using methyl ethyl ketone and toluene solvent as in Example 1. The viscosity of the solution was adjusted to 1000 cps, and then the adhesive tape was prepared in the same manner as in Example 1 using this adhesive.

[비교예 1]Comparative Example 1

실시예 1에서 폴리에스터-에폭시수지의 사용량을 40중량부로 한 것을 제외하고는 실시예 1 과 같은 방법으로 접착테이프를 제조하였다.An adhesive tape was prepared in the same manner as in Example 1 except that the amount of the polyester-epoxy resin used in Example 1 was 40 parts by weight.

[비교예 2]Comparative Example 2

실시예 1에서 폴리에스터-에폭시수지의 사용량을 700중량부로 한 것을 제외하고는 실시예 1과 같은 방법으로 접착테이프를 제조하였다.An adhesive tape was prepared in the same manner as in Example 1 except that the amount of the polyester-epoxy resin in Example 1 was 700 parts by weight.

[비교예 3]Comparative Example 3

실시예 1에서 p-클로로페놀의 사용량을 5중량부로 한 것을 제외하고는 실시예 1과 같은 방법으로 접착테이프를 제조하였다.An adhesive tape was prepared in the same manner as in Example 1 except that the amount of p-chlorophenol used in Example 1 was 5 parts by weight.

[비교예 4][Comparative Example 4]

실시예 1에서 p-클로로페놀의 사용량을 75중량부로 한 것을 제외하고는 실시예 1 과 같은 방법으로 접착테이프를 제조하였다.An adhesive tape was prepared in the same manner as in Example 1 except that the amount of p-chlorophenol used in Example 1 was 75 parts by weight.

[비교예 5][Comparative Example 5]

실시예 1에서 과산화벤조일의 사용량을 0.5중량부로 한 것을 제외하고는 실시예 1 과 같은 방법으로 접착테이프를 제조하였다.An adhesive tape was prepared in the same manner as in Example 1 except that the amount of benzoyl peroxide used in Example 1 was 0.5 parts by weight.

[비교예 6]Comparative Example 6

실시예 1에서 과산화벤조일의 사용량을 20중량부로 한 것을 제외하고는 실시예 1과 같은 방법으로 접착테이프를 제조하였다.An adhesive tape was prepared in the same manner as in Example 1 except that the amount of benzoyl peroxide used in Example 1 was 20 parts by weight.

상기 실시예 및 비교예에서 얻어진 접착테이프의 물성을 측정하여 하기 표 1에 나타내었으며, 이 때 물성의 평가는 다음의 방법을 사용하였다.The physical properties of the adhesive tapes obtained in Examples and Comparative Examples were measured and shown in Table 1 below, in which the physical properties were evaluated using the following method.

접착력Adhesion

150℃로 유지되고 있는 열판 위에 동박을 얹어 놓고, 상기 실시예 및 비교예에서 제조된 TAPE을 5Kg/㎠ 압력으로 0.5초간 압착한 후, 165℃ 열풍오븐에서 1시간동안 경화시킨 후, 인장강도시험기를 이용하여 T-PEEL 강도를 측정The copper foil was placed on a hot plate maintained at 150 ° C., and the TAPE prepared in Examples and Comparative Examples was pressed at 5 Kg / cm 2 for 0.5 seconds, and then cured for 1 hour in a 165 ° C. hot air oven, followed by a tensile strength tester. T-PEEL strength

열분해온도Pyrolysis temperature

DuPONT V4.1C 2200 모델 TGA 이용 측정Measuring with DuPONT V4.1C 2200 Model TGA

탄성율Modulus

UTM(Ultimate Testing Machine)이용 접착제층의 탄성율 측정Measurement of Elastic Modulus of Adhesive Layer Using UTM (Ultimate Testing Machine)

흡습율Moisture absorption

23℃ 물에 24시간동안 담근 후 무게변화 측정Soak for 24 hours in 23 ℃ water and measure weight change

[표 1]TABLE 1

평가항목Evaluation item 접착력(g/cm)Adhesive force (g / cm) 열분해온도(℃)Pyrolysis Temperature (℃) 탄성율(Kg/㎟)Elastic modulus (Kg / mm2) 흡습율(%)Hygroscopicity (%) 실시예 1Example 1 860860 370370 280280 1.81.8 실시예 2Example 2 740740 395395 312312 1.91.9 실시예 3Example 3 620620 365365 254254 1.91.9 비교예 1Comparative Example 1 530530 345345 214214 1.71.7 비교예 2Comparative Example 2 430430 390390 325325 1.81.8 비교예 3Comparative Example 3 560560 315315 226226 2.12.1 비교예 4Comparative Example 4 420420 380380 285285 1.71.7 비교예 5Comparative Example 5 650650 302302 302302 1.81.8 비교예 6Comparative Example 6 430430 368368 310310 1.71.7

상기 실시예 및 비교예에서도 확인되듯이 본 발명에 따른 접착테이프는 저온에서 접착 경화가 가능하고 접착강도, 내열성, 탄성율, 흡습율 등의 특성이 우수하기 때문에 반도체 장치들의 부품과 같은 전자부품용 접착에 사용시 매우 유용하다.As can be seen from the above examples and comparative examples, the adhesive tape according to the present invention is capable of adhesive curing at low temperatures and has excellent properties such as adhesive strength, heat resistance, elastic modulus, moisture absorption rate, and the like. Very useful when used in

Claims (3)

내열성 필름의 한면 또는 양면에 중량평균분자량이 5,000∼150,000인 아크릴로니트릴과 부타디엔의 공중합체 혹은 아크릴로니트릴, 부타디엔 및 아크릴산의 삼원공중합체(A)에 분자량 1,000∼30,000 이며 양 말단에 에폭시기를 가진 폴리에스터-에폭시 공중합체(B)를 중합체(A) 100중량부에 대하여 50∼600중량부 첨가하며, 중합체(A)의 경화제로서 튜램계 가황제 또는 과산화물을 중합체(A) 100중량부에 대하여 1∼10중량부 첨가하고, 중합체(B)의 경화제로서 페놀계 화합물 또는 산무수물계 경화제를 중합체(B) 100중량부에 대하여 5∼30중량부 첨가하여 얻어지는 접착제를 도포, 건조하여 접착층을 형성시킨 것임을 특징으로 하는 전자부품용 접착테이프.A copolymer of acrylonitrile and butadiene having a weight average molecular weight of 5,000 to 150,000 or a terpolymer (A) of acrylonitrile, butadiene and acrylic acid on one or both sides of the heat resistant film has a molecular weight of 1,000 to 30,000 and an epoxy group at both ends. 50 to 600 parts by weight of the polyester-epoxy copolymer (B) is added to 100 parts by weight of the polymer (A), and a turram vulcanizing agent or peroxide is added to 100 parts by weight of the polymer (A) as a curing agent of the polymer (A). 1-10 weight part is added, the adhesive obtained by adding 5-30 weight part of phenolic compounds or an acid-anhydride type hardening | curing agent with respect to 100 weight part of polymers (B) as a hardening | curing agent of a polymer (B) is apply | coated, dried, and an adhesive layer is formed. Adhesive tape for electronic components, characterized in that. 제 1 항에 있어서, 아크릴로니트릴, 부타디엔 및 아크릴산의 삼원공중합체는 아크릴로니트릴 함량이 10∼60중량% 인 것 임을 특징으로 하는 전자부품용 접착 테이프.The adhesive tape for electronic parts according to claim 1, wherein the terpolymer of acrylonitrile, butadiene and acrylic acid has an acrylonitrile content of 10 to 60% by weight. 제 1 항에 있어서, 폴리에스터-에폭시 공중합체는 폴리에스터 함량이 30∼90중량% 인 것 임을 특징으로 하는 전자부품용 접착 테이프.The adhesive tape according to claim 1, wherein the polyester-epoxy copolymer has a polyester content of 30 to 90% by weight.
KR1019980004810A 1998-02-17 1998-02-17 Adhesive tapes for the electronic parts KR100530517B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100707732B1 (en) * 2001-10-29 2007-04-16 주식회사 코오롱 Adhesive and adhesive tape for electronic accessories
KR100800214B1 (en) * 2006-12-13 2008-02-01 제일모직주식회사 Bonding film composition for semiconductor assembly and bonding film therefrom

Family Cites Families (4)

* Cited by examiner, † Cited by third party
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JPS6151076A (en) * 1984-08-21 1986-03-13 Tomoegawa Paper Co Ltd Adhesive tape
JP2818254B2 (en) * 1990-04-13 1998-10-30 セメダイン株式会社 Resin composition
KR970065675A (en) * 1996-03-06 1997-10-13 박흥기 Adhesive composition for flexible printed circuit boards
KR19990019012A (en) * 1997-08-28 1999-03-15 한형수 Heat-resistant adhesive tape for electronic parts

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100707732B1 (en) * 2001-10-29 2007-04-16 주식회사 코오롱 Adhesive and adhesive tape for electronic accessories
KR100800214B1 (en) * 2006-12-13 2008-02-01 제일모직주식회사 Bonding film composition for semiconductor assembly and bonding film therefrom

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