KR102668917B1 - LED Module with Integrated Heat Dissipation Structure PCB and Manufacturing Method Thereof - Google Patents
LED Module with Integrated Heat Dissipation Structure PCB and Manufacturing Method Thereof Download PDFInfo
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- KR102668917B1 KR102668917B1 KR1020230167569A KR20230167569A KR102668917B1 KR 102668917 B1 KR102668917 B1 KR 102668917B1 KR 1020230167569 A KR1020230167569 A KR 1020230167569A KR 20230167569 A KR20230167569 A KR 20230167569A KR 102668917 B1 KR102668917 B1 KR 102668917B1
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- heat dissipation
- dissipation structure
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 98
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 70
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 46
- 239000006229 carbon black Substances 0.000 claims abstract description 33
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 238000002347 injection Methods 0.000 claims abstract description 13
- 239000007924 injection Substances 0.000 claims abstract description 13
- 238000009413 insulation Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 10
- 239000010703 silicon Substances 0.000 claims abstract description 10
- 238000001746 injection moulding Methods 0.000 claims abstract description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 16
- 239000010439 graphite Substances 0.000 claims description 16
- 239000003575 carbonaceous material Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 5
- 239000007770 graphite material Substances 0.000 claims description 5
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 4
- 239000002041 carbon nanotube Substances 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 4
- 239000002952 polymeric resin Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 230000002265 prevention Effects 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 239000002826 coolant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
본 발명은 열전도 및 방열 효율을 향상시킴과 동시에 자체 중량을 감소시킬 수 있는 탄소계 방열구조체와 절연성능 및 열전도도가 우수한 인슐레이션 카본 블랙(Insulation Carbon Black) 블록(Block)을 이중사출 방식으로 성형하고 인쇄회로를 일체형으로 구비함으로써 LED의 정션 온도(Junction Temperature) 및 열 저항(Thermal Resistance)을 최대한 낯추고 제품의 수명(Life Time)을 최대한 보장할 수 있도록 한 방열구조체 일체형 PCB가 구비된 LED 모듈 및 그 제조방법에 관한 것으로,
방열구조체 일체형 PCB에 LED 패키지가 접합되고, 그 위에 실리콘 패드(200) 및 PC 렌즈(300)가 설치되어 형성된 방열구조체 일체형 PCB가 구비된 LED 모듈에 있어서, 상기 방열구조체 일체형 PCB는, 인슐레이션 카본 블랙을 1차로 사출 성형하여 카본 블랙 블록을 형성한 후, 이 카본 블랙 블록에 탄소계 혼합소재를 2차로 사출 성형하여 방열부를 형성한 이중 사출방식의 탄소계 방열구조체; 및 절연본딩시트에 코퍼패턴이 형성된 전기전도시트와 접착제시트 및 반사시트가 적층되어 형성되며, 히트프레스 방식으로 탄소계 방열구조체에 적층 본딩되는 PCB 회로층;을 포함하는 것을 특징으로 한다.The present invention is a carbon-based heat dissipation structure that can improve heat conduction and heat dissipation efficiency while reducing its own weight, and an insulation carbon black block with excellent insulation performance and heat conductivity is molded by double injection. An LED module with an integrated heat dissipation structure PCB that minimizes the junction temperature and thermal resistance of the LED by providing an integrated printed circuit and ensures the maximum product life time. Regarding the manufacturing method,
In the LED module provided with a heat dissipation structure integrated PCB formed by bonding an LED package to a heat dissipation structure integrated PCB and a silicon pad 200 and a PC lens 300 installed thereon, the heat dissipation structure integrated PCB is made of insulation carbon black. A double injection type carbon-based heat dissipation structure in which a carbon black block is formed by first injection molding, and then a carbon-based mixed material is secondarily injection molded on the carbon black block to form a heat dissipation part; And a PCB circuit layer formed by stacking an electrically conductive sheet with a copper pattern formed on an insulating bonding sheet, an adhesive sheet, and a reflective sheet, and laminated and bonded to the carbon-based heat dissipation structure by a heat press method.
Description
본 발명은 방열구조체 일체형 PCB가 구비된 LED 모듈 및 그 제조방법에 관한 갓으로, 터욱 상세하게는 열전도 및 방열 효율을 향상시킴과 동시에 자체 중량을 감소시킬 수 있는 탄소계 방열구조체와 절연성능 및 열전도도가 우수한 인슐레이션 카본 블랙(Insulation Carbon Black) 블록(Block)을 이중사출 방식으로 성형하고 인쇄회로를 일체형으로 구비함으로써 LED의 정션 온도(Junction Temperature) 및 열 저항(Thermal Resistance)을 최대한 낯추고 제품의 수명(Life Time)을 최대한 보장할 수 있도록 한 방열구조체 일체형 PCB가 구비된 LED 모듈 및 그 제조방법에 관한 것이다.The present invention relates to an LED module equipped with a heat dissipation structure-integrated PCB and a method of manufacturing the same. Specifically, the present invention relates to a carbon-based heat dissipation structure that can reduce its own weight while improving heat conduction and heat dissipation efficiency, as well as insulation performance and heat conduction. By molding a block of high-quality insulation carbon black using a double injection method and providing an integrated printed circuit, the junction temperature and thermal resistance of the LED are minimized and the product is manufactured. This relates to an LED module equipped with a heat dissipation structure-integrated PCB that ensures maximum life time and a method of manufacturing the same.
일반적으로 가로등, 투광등에는 수은램프 또는 나트륨램프, 메탈할라이드램프 등 을 이용한 조명등이 이용되어 왔으나, 전력 사용량이 많은 이유와 제품의 수명이 짧은 관계로 최근에는 고휘도의 발광 다이오드를 이용하는 조명등이 개발되었다.In general, lighting using mercury lamps, sodium lamps, metal halide lamps, etc. has been used for street lights and floodlights, but due to the high power consumption and short product lifespan, lighting using high-brightness light-emitting diodes has been developed recently. .
그러나 상기 고휘도의 발광 다이오드들은 사용 도중에 발생되는 고열이 문제점으로 지적되고 있다. 발광 다이오드들을 이용하는 조명 장치의 경우 방열이 적절하게 이루어지지 않으면, 발광 다이오드들의 휘도 및 수명이 크게 저하될 수 있으며, 이에 따라 상기 조명 장치의 유지보수 비용이 크게 증가할 수 있다. However, the high-brightness light emitting diodes are pointed out as a problem due to the high heat generated during use. In the case of a lighting device using light-emitting diodes, if heat dissipation is not properly performed, the brightness and lifespan of the light-emitting diodes may be greatly reduced, and thus the maintenance cost of the lighting device may significantly increase.
최근, 상기와 같은 문제점을 극복하기 위하여 다양한 구조의 방열 기구들이 개발되고 있다. 예를 들면, 방열핀들을 이용하여 열을 방출하는 구조, 방열핀들과 냉각팬을 장착하는 구조, 냉각수를 이용한 강제 냉각 구조, 히트파이프를 이용 전도 방열하는 구조 등이 개발되고 있다.Recently, heat dissipation mechanisms of various structures have been developed to overcome the above problems. For example, structures that dissipate heat using heat dissipation fins, structures that mount heat dissipation fins and a cooling fan, structures that force cooling using coolant, and structures that dissipate heat by conduction using heat pipes are being developed.
그러나 종래의 조명 장치에서 냉각핀이 케이스 내부에 배치되는 경우 방열 효과가 크지 않으며, 냉각팬 또는 냉각수를 이용하는 경우 가로등의 구조에 따라 실제로 적용하기가 어려운 문제점이 있다. However, in a conventional lighting device, when cooling fins are placed inside the case, the heat dissipation effect is not significant, and when a cooling fan or coolant is used, it is difficult to actually apply it depending on the structure of the street light.
또한, 냉각팬 또는 냉각수의 강제 순환을 이용하는 경우와 히트파이프를 이용하는 조명등의 제작비용 및 유지보수 비용이 크게 증가할 수 있다.In addition, when forced circulation of cooling fans or coolant is used, the manufacturing and maintenance costs of lighting using heat pipes may increase significantly.
참고로, 통상적인 알루미늄 히트싱크 및 메탈 PCB를 적용한 가로등용 LED 모듈은 도 1에 도시된 바와 같이, 방열핀이 구비된 알루미늄 히트싱크(10)와. 알루미늄 PCB에 LED 패키지가 접합되어 이루어지는 LED 모듈(20)과, 알루미늄 히트싱크(10)에 LED 모듈(20)을 고정하는 체결나사(25)와, 방수를 위해 LED 모듈(20)을 감싸도록 설치되는 실리콘 패드(30)와, LED를 보호하도록 실리콘 패드(30)의 상측에 설치되는 PC 렌즈(40)와, 실리콘 패드(30)와 PC 렌즈(40)를 관통하여 알루미늄 히트싱크(10)에 설치되는 렌즈 체결나사(45)를 포함하고 있다.For reference, an LED module for street lights using a typical aluminum heat sink and metal PCB includes an aluminum heat sink 10 equipped with a heat dissipation fin, as shown in FIG. 1. An LED module (20) made by bonding an LED package to an aluminum PCB, a fastening screw (25) to secure the LED module (20) to the aluminum heat sink (10), and installed to surround the LED module (20) for waterproofing. The silicon pad 30, the PC lens 40 installed on the upper side of the silicon pad 30 to protect the LED, and the aluminum heat sink 10 penetrate through the silicon pad 30 and the PC lens 40. It includes an installed lens fastening screw (45).
한편, 본 발명과 관련한 선행기술을 조사한 결과 다수의 특허문헌이 검색되었으며, 그 중 일부를 소개하면 다음과 같다.Meanwhile, as a result of researching prior art related to the present invention, a number of patent documents were searched, some of which are introduced as follows.
특허문헌 1은, 방열구조체 일체형 PCB가 구비된 LED 모듈은, 사각 형상의 탄소계 방열구조체에 회로가 형성된 전기전도층이 절연본딩층에 의해 본딩되어 형성되는 방열구조체 일체형 PCB와; 상기 전기전도층에 본딩되며 다수의 LED 설치용 구멍이 형성된 절연 및 반사층과; 솔더에 의해 상기 절연 및 반사층을 관통하여 상기 전기전도층에 연결되는 다수의 LED 패키지와; PC로 형성되며 상기 LED 패키지가 수용되는 렌즈부가 다수 형성된 렌즈 하우징과; 상기 절연 및 반사층과 렌즈 하우징 사이에 개재되는 실리콘 패드;를 포함하고, 상기 절연본딩층과 전기전도층을 보호필름에 각각 패터닝한 후 상기 절연본딩층에 전기전도층을 본딩 형태로 가접하고, 이를 상기 방열구조체에 적층하여 히트 프레스를 통해 적층 본딩하는 방식으로 방열구조체 일체형 PCB를 형성함으로써, 전체적인 부피가 감소되고 기존 가로등용 LED 모듈과 동일한 배광특성 및 높은 휘도를 제공하면서도 LED의 정션온도와 열저항을 최대한 낮추고 제품의 수명을 최대한 보장할 수 있도록 한 방열구조체 일체형 PCB가 구비된 LED 모듈 및 그 제조방법을 개시허고 있다.Patent Document 1 states that an LED module equipped with a PCB with an integrated heat dissipation structure includes a PCB with an integrated heat dissipation structure formed by bonding an electrically conductive layer on which a circuit is formed to a square-shaped carbon-based heat dissipation structure by an insulating bonding layer; an insulating and reflective layer bonded to the electrically conductive layer and having a plurality of holes for installing LEDs; a plurality of LED packages connected to the electrically conductive layer through the insulating and reflective layer by solder; a lens housing made of PC and having a plurality of lens units for accommodating the LED package; It includes a silicon pad interposed between the insulating and reflective layer and the lens housing, and after patterning the insulating bonding layer and the electrically conductive layer on a protective film, tack-joining the electrically conductive layer to the insulating bonding layer in a bonding form, and By forming a PCB integrated with the heat dissipation structure by laminating the heat dissipation structure and bonding it through a heat press, the overall volume is reduced and while providing the same light distribution characteristics and high luminance as existing streetlight LED modules, the junction temperature and thermal resistance of the LED are reduced. An LED module equipped with a heat dissipation structure-integrated PCB and a method of manufacturing the same are disclosed to lower the temperature as much as possible and ensure the lifespan of the product as much as possible.
특허문헌 2는, 탄소계 방열구조체에 회로가 형성된 전기전도층이 절연본딩시트에 의해 부착되어 형성된 방열구조체 일체형 PCB와; 전기전도층에 부착되는 절연 및 반사층과; 솔더층에 의해 전기전도층에 연결되는 LED 패키지;로 이루어지고, 탄소계 방열구조체는 총 중량을 기준으로 40~60중량%의 탄소계 혼합재료와 40~60중량%의 고분자 수지를 포함하는 탄소계 소재로 형성되며, 상기 탄소계 혼합재료는 탄소재료 분산물과 흑연재료를 포함하고, 상기 탄소재료 분산물을 탄소나노튜브, 그래핀 및 카본블랙으로 이루어진 군으로부터 선택되는 1종 이상의 탄소재료와 용매를 포함하며, 상기 흑연재료는 인상흑연과 팽창흑연, 판상흑연, 구상흑연으로 이루어진 군으로부터 선택되는 2종 이상으로 이루어짐으로써, 체적인 부피가 감소되어 천장 등에 설치하기가 쉽고 경량화로 인해 낙하 위험이 방지되는 방열구조체 일체형 PCB가 구비된 조명용 LED 모듈 및 이를 구비한 LED 등기구를 개시하고 있다.Patent Document 2 includes a heat dissipation structure integrated PCB formed by attaching an electrically conductive layer on which a circuit is formed to a carbon-based heat dissipation structure with an insulating bonding sheet; an insulating and reflective layer attached to the electrically conductive layer; It consists of an LED package connected to an electrically conductive layer by a solder layer; the carbon-based heat dissipation structure contains 40 to 60% by weight of carbon-based mixed material and 40 to 60% by weight of polymer resin based on the total weight. It is formed of a carbon-based mixed material, and the carbon-based mixed material includes a carbon material dispersion and a graphite material, and the carbon material dispersion is mixed with one or more carbon materials selected from the group consisting of carbon nanotubes, graphene, and carbon black. Contains a solvent, and the graphite material is composed of two or more types selected from the group consisting of stretched graphite, expanded graphite, plate-shaped graphite, and nodular graphite, so that the volume is reduced, making it easy to install on the ceiling, etc., and risk of falling due to light weight. A lighting LED module equipped with a PCB integrated with a heat dissipation structure that prevents this and an LED lighting fixture equipped with the same are disclosed.
본 발명은 상기한 종래기술의 문제점을 해결하기 위하여 안출된 것으로서, 열전도 및 방열 효율을 향상시킴과 동시에 자체 중량을 감소시킬 수 있는 탄소계 방열구조체와 절연성능 및 열전도도가 우수한 카본 블랙 블록을 이중사출 방식으로 성형하고 인쇄회로를 일체형으로 구비함으로써 LED의 정션 온도 및 열 저항을 최대한 낯추고 제품의 수명을 최대한 보장할 수 있도록 한 방열구조체 일체형 PCB가 구비된 LED 모듈 및 그 제조방법을 제공하는데 그 목적이 있다,The present invention was developed to solve the problems of the prior art described above, and consists of a carbon-based heat dissipation structure that can improve heat conduction and heat dissipation efficiency and reduce its own weight, and a carbon black block with excellent insulation performance and thermal conductivity. We provide an LED module with an integrated heat dissipation structure PCB and its manufacturing method that minimize the junction temperature and thermal resistance of the LED and ensure the maximum lifespan of the product by molding by injection method and providing an integrated printed circuit. There is a purpose,
상기 목적을 달성하기 위한 본 발명의 방열구조체 일체형 PCB가 구비된 LED 모듈은, LED 패키지가 접합된 방열구조체 일체형 PCB에 실리콘패드 및 PC 렌즈가 설치되어 형성된 방열구조체 일체형 PCB가 구비된 LED 모듈에 있어서, 상기 방열구조체 일체형 PCB는, 인슐레이션 카본 블랙을 1차로 사출 성형하여 카본 블랙 블록을 형성한 후, 이 카본 블랙 블록에 탄소계 혼합소재를 2차로 사출 성형하여 방열부를 형성한 이중 사출방식의 탄소계 방열구조체; 및 절연본딩시트에 코퍼패턴이 형성된 전기전도시트와 접착제시트 및 반사시트가 적층되어 형성되며, 히트프레스 방식으로 탄소계 방열구조체에 적층 본딩되는 PCB 회로층;을 포함하는 것을 특징으로 한다.The LED module equipped with a heat dissipation structure integrated PCB of the present invention to achieve the above object is an LED module equipped with a heat dissipation structure integrated PCB formed by installing a silicon pad and a PC lens on a heat dissipation structure integrated PCB to which an LED package is bonded. , the heat dissipation structure-integrated PCB is a carbon-based double injection type in which insulation carbon black is first injection-molded to form a carbon black block, and then a carbon-based mixed material is secondarily injection-molded on this carbon black block to form a heat dissipation part. Heat dissipation structure; And a PCB circuit layer formed by stacking an electrically conductive sheet with a copper pattern formed on an insulating bonding sheet, an adhesive sheet, and a reflective sheet, and laminated and bonded to the carbon-based heat dissipation structure by a heat press method.
또, 본 발명의 방열구조체 일체형 PCB가 구비된 LED 모듈에 따르면, 상기 PCB 회로층은 카본 블랙 블록과 동일한 형상으로 형성되는 절연본딩시트와, 회로를 구성하는 코퍼패턴이 형성되어 절연본딩시트의 상측에 적층되는 전기전도시트와, 접착제가 도포되어 전기전도시트를 절연본딩시트에 접착하도록 전기전도시트의 상측에 적층되는 접착제시트와, 반사층이 형성되어 접착제 시트의 상측에 적층되는 반사시트를 포함하고, 자동가접기에 의해 가접되어 이루어진 것을 특징으로 한다.In addition, according to the LED module equipped with the heat dissipation structure integrated PCB of the present invention, the PCB circuit layer includes an insulating bonding sheet formed in the same shape as the carbon black block, and a copper pattern constituting the circuit is formed on the upper side of the insulating bonding sheet. It includes an electrically conductive sheet that is laminated, an adhesive sheet that is applied with an adhesive and is laminated on the upper side of the electrically conductive sheet to adhere the electrically conductive sheet to the insulating bonding sheet, and a reflective sheet that is laminated on the upper side of the adhesive sheet with a reflective layer formed thereon. , It is characterized by being tack welded by an automatic tack folding machine.
또, 본 발명의 방열구조체 일체형 PCB가 구비된 LED 모듈에 따르면, 상기 PCB 회로층은 절연본딩시트의 저면과 반사시트의 상면에 각각 적층되는 이형제 시트를 더 포함하는 것을 특징으로 한다.In addition, according to the LED module equipped with the heat dissipation structure integrated PCB of the present invention, the PCB circuit layer further includes a release agent sheet laminated on the bottom surface of the insulating bonding sheet and the upper surface of the reflective sheet, respectively.
또, 본 발명의 방열구조체 일체형 PCB가 구비된 LED 모듈에 따르면, 상기 탄소계 혼합소재는 총 중량을 기준으로 40~60중량%의 탄소계 혼합재료와 40~60중량%의 고분자 수지를 포함하고, 는상기 탄소계 혼합재료는 탄소나노튜브, 그래핀 및 카본블랙으로 이루어진 군으로부터 선택되는 1종 이상의 탄소재료와 용매를 포함하는 탄소재료 분산물과, 인상흑연과 팽창흑연, 판상흑연, 구상흑연으로 이루어진 군으로부터 선택되는 2종 이상으로 이루어진 흑연재료를 포함하여 이루어진 것을 특징으로 한다.In addition, according to the LED module equipped with the heat dissipation structure integrated PCB of the present invention, the carbon-based mixed material includes 40 to 60% by weight of the carbon-based mixed material and 40 to 60% by weight of the polymer resin based on the total weight. , The carbon-based mixed material is a carbon material dispersion containing one or more carbon materials selected from the group consisting of carbon nanotubes, graphene, and carbon black, and a solvent, and expanded graphite, expanded graphite, platelet graphite, and nodular graphite. It is characterized by comprising a graphite material consisting of two or more types selected from the group consisting of.
그리고 본 발명의 방열구조체 일체형 PCB가 구비된 LED 모듈의 제조방법은, 인슐레이션 카본 블랙을 1차로 사출 성형하여 카본 블랙 블록을 형성한 후, 이 카본 블랙 블록에 탄소계 혼합소재를 방열부로 2차로 사출 성형하여 이중 사출방식으로 탄소계 방열구조체를 형성하는 단계; 절연본딩시트에 코퍼패턴이 형성된 전기전도시트와 접착제 시트 및 반사시트를 적층 및 가접하여 PC 회로층을 형성하는 단계; 히트프레스를 이용하여 탄소계방열구조체에 PC 회로층을 적층 본딩하는 단계; 회로의 오픈이나 쇼트를 검사하는 BBT 체크를 수행하는 단계; PC 회로층에 OSP를 실시하여 방청막을 형성하는 단계; 솔더층을 이용하여 LED 패키지를 PC 회로층에 연결하여 LED 모듈 조립체를 완성하는 SMD 단계 및 LED를 보호하기 위하여 LED 모듈 조립체의 상측에 실리콘 패드와 PC 렌즈를 설치하는 단계;를 포함하는 것을 특징으로 한다.In addition, the method of manufacturing an LED module equipped with a heat dissipation structure-integrated PCB of the present invention involves first injection molding insulation carbon black to form a carbon black block, and then secondarily injecting a carbon-based mixed material into this carbon black block as a heat dissipation part. Forming a carbon-based heat dissipation structure by molding and using a double injection method; Forming a PC circuit layer by laminating and tack welding an electrically conductive sheet with a copper pattern formed on an insulating bonding sheet, an adhesive sheet, and a reflective sheet; Stacking and bonding a PC circuit layer to a carbon-based heat dissipation structure using a heat press; Performing a BBT check to check for open or short circuits; Forming a rust-prevention film by applying OSP to the PC circuit layer; An SMD step of completing the LED module assembly by connecting the LED package to the PC circuit layer using a solder layer, and a step of installing a silicon pad and a PC lens on the upper side of the LED module assembly to protect the LED. do.
본 발명의 방열구조체 일체형 PCB가 구비된 LED 모듈 및 그 제조방법은, 종래의 LED 모듈이 알루미늄 방열판 및 케이스(압출, 주물, 다이캐스팅)를 사용한 것과는 달리 방열성능이 우수한 탄소계 재료를 적용하고 방열구조체에 직접 인쇄회로를 구성함으로 방열하우징의 중량을 대폭 줄여 생산단가를 최대한 낮춤과 동시에 방열을 최대한 극대화시킴으로 LED의 정션 온도(Junction Temperature) 및 열 저항(Thermal Resistance)을 최대한 낮추고 제품의 수명(Life Time)을 최대한 보장할 수 있게 되는 효과가 있다.Unlike conventional LED modules that use aluminum heat sinks and cases (extrusion, casting, die casting), the LED module equipped with a heat dissipation structure-integrated PCB of the present invention and its manufacturing method apply a carbon-based material with excellent heat dissipation performance and a heat dissipation structure. By constructing a printed circuit directly in the heat dissipation housing, the weight of the heat dissipation housing is significantly reduced, thereby lowering the production cost as much as possible and maximizing heat dissipation as much as possible, thus lowering the junction temperature and thermal resistance of the LED as much as possible and the life time of the product. ) has the effect of ensuring maximum coverage.
그리고, 고휘도 발광다이오드를 이용한 조명장치를 구성할 수 있으며, 전도 및 방열 성능을 향상시키면서도 슬림화, 경량화될 수 있어, 각종 조명장치 및 전자장치에 더욱 광범위하게 적용될 수 있는 효과가 있다.In addition, a lighting device using high-brightness light-emitting diodes can be constructed, and conduction and heat dissipation performance can be improved while being slimmer and lighter, which has the effect of being applied more widely to various lighting devices and electronic devices.
도 1은 종래의 알루미늄 히트싱크 및 메탈 PCB를 적용한 가로등용 LED 모듈이 도시된 사시도.
도 2는 본 발명에 따른 방열구조체 일체형 PCB가 구비된 LED 모듈의 분해사시도.
도 3은 본 발명에 따른 방열구조체 일체형 PCB가 구비된 LED 모듈의 탄소계 방열구조체가 도시된 분해사시도.
도 4는 본 발명에 따른 방열구조체 일체형 PCB가 구비된 LED 모듈의 PCB층이 도시된 단면도,
도 5는 본 발명에 따른 방열구조체 일체형 PCB가 구비된 LED 모듈의 방열구조체 일체형 PCB가 도시된 분해사시도.
도 6은 본 발명에 따른 방열구조체 일체형 PCB가 구비된 LED 모듈의 LED 모듈 조립체가 도시된 분해사시도.
도 7은 본 발명에 따른 방열구조체 일체형 PCB가 구비된 LED 모듈의 제조방법이 도시된 순서도.
도 8은 본 발명에 따른 방열구조체 일체형 PCB가 구비된 LED 모듈의 중 탄소계 방열구조체와 전기전도시트, PCB 회로층 I LED 모듈 조립체를나타낸 참고도.Figure 1 is a perspective view showing an LED module for street lights using a conventional aluminum heat sink and metal PCB.
Figure 2 is an exploded perspective view of an LED module equipped with a heat dissipation structure integrated PCB according to the present invention.
Figure 3 is an exploded perspective view showing the carbon-based heat dissipation structure of an LED module equipped with a heat dissipation structure integrated PCB according to the present invention.
Figure 4 is a cross-sectional view showing the PCB layer of an LED module equipped with a heat dissipation structure integrated PCB according to the present invention;
Figure 5 is an exploded perspective view showing the heat dissipation structure integrated PCB of an LED module equipped with the heat dissipation structure integrated PCB according to the present invention.
Figure 6 is an exploded perspective view showing the LED module assembly of an LED module equipped with a heat dissipation structure integrated PCB according to the present invention.
Figure 7 is a flow chart showing a method of manufacturing an LED module equipped with a heat dissipation structure integrated PCB according to the present invention.
Figure 8 is a reference diagram showing the “I LED module assembly” of the medium carbon heat dissipation structure, electrical conductive sheet, and PCB circuit layer of the LED module equipped with the heat dissipation structure integrated PCB according to the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 방열구조체 일체형 PCB가 구비된 LED 모듈 및 그 제조방법에 대하여 설명하면 다음과 같다.Hereinafter, the LED module equipped with the heat dissipation structure integrated PCB of the present invention and its manufacturing method will be described with reference to the attached drawings.
본 발명에서 사용되는 용어들은 본 발명에서의 기능을 고려하여 정의된 용어들로서, 이는 사용자, 운용자의 의도 또는 관례에 따라 달라질 수 있으므로, 이러한 용어들에 대한 정의는 본 발명의 기술적 사항에 부합되는 의미와 개념으로 해석되어야 할 것이다.The terms used in the present invention are terms defined in consideration of the functions in the present invention, and may vary depending on the intention or custom of the user or operator, so the definitions of these terms are defined in accordance with the technical details of the present invention. It should be interpreted as a concept.
아울러, 본 발명의 실시예는 본 발명의 권리범위를 한정하는 것이 아니라 본 발명의 청구범위에 제시된 구성요소의 예시적인 사항에 불과하며, 본 발명의 명세서 전반에 걸친 기술사상에 포함되고 청구범위의 구성요소에서 균등물로서 치환 가능한 구성요소를 포함하는 실시예이다.In addition, the embodiments of the present invention do not limit the scope of the present invention, but are merely illustrative of the components presented in the claims of the present invention, and are included in the technical idea throughout the specification of the present invention and are included in the claims. This is an embodiment that includes components that can be replaced as equivalents in the components.
그리고, 아래 실시예에서의 선택적인 용어는 하나의 구성요소를 다른 구성요소로부터 구별하기 위해 사용되는 것으로서, 구성요소가 상기 용어들에 의해 제한되는 것은 아니다.Additionally, optional terms in the examples below are used to distinguish one component from another component, and the components are not limited by the terms.
이에, 본 발명을 설명함에 있어서, 본 발명의 요지를 불필요하게 흐릴 수 있는 관련된 공지기술에 대한 상세한 설명은 생략한다.Accordingly, in describing the present invention, detailed descriptions of related known technologies that may unnecessarily obscure the gist of the present invention are omitted.
본 발명의 바람직한 실시예를 설명하기 위한, 도 2 내지 도 6은 본 발명에 따른 방열구조체 일체형 PCB가 구비된 LED 모듈을 설명하기 위한 도면들이고, 도 7은 본 발명에 따른 방열구조체 일체형 PCB가 구비된 LED 모듈의 제조방법을 나나냄 도면이며, 도 8은 본 발명에 따른 방열구조체 일체형 PCB가 구비된 LED 모듈의 주요구성을 나타낸 도면이다.In order to explain a preferred embodiment of the present invention, Figures 2 to 6 are diagrams for explaining an LED module equipped with a PCB integrated with a heat dissipation structure according to the present invention, and Figure 7 is a diagram provided with a PCB integrated with a heat dissipation structure according to the present invention. It is a drawing showing the manufacturing method of the LED module, and Figure 8 is a drawing showing the main configuration of the LED module equipped with the heat dissipation structure integrated PCB according to the present invention.
본 발명에 따른 방열구조체 일체형 PCB가 구비된 LED 모듈은 도 1 내지 6에 도시된 바와 같이, LED 패키지(130)가 방열구조체 일체형 PCB에 접합되어 이루어진 LED 모듈 조립체(100)에 실리콘 패드(200) 및 PC 렌즈(300)가 설치되어 이루어진다.As shown in FIGS. 1 to 6, the LED module equipped with a heat dissipation structure integrated PCB according to the present invention includes a silicon pad 200 in an LED module assembly 100 in which an LED package 130 is bonded to a heat dissipation structure integrated PCB. and the PC lens 300 is installed.
상기 방열구조체 일체형 PCB는 도 2 내지 6에 도시된 바와 같이, 카본 블랙 블록(111)과 방열부(112)가 일체로 이루어진 탄소계 방열구조체(110)와, 히트프레스 방식으로 탄소계 방열구조체(110)에 적층 본딩되는 PCB 회로층(120)과, 조명용 LED 패키지(130);를 포함하여 이루어진다.As shown in FIGS. 2 to 6, the heat dissipation structure integrated PCB includes a carbon-based heat dissipation structure 110 in which a carbon black block 111 and a heat dissipation portion 112 are integrated, and a carbon-based heat dissipation structure (110) using a heat press method. It includes a PCB circuit layer 120 laminated and bonded to 110) and an LED package 130 for lighting.
상기 탄소계 방열구조체(110)는 이중 사출방식으로 이루어진 것으로, 도 2에 도시된 바와 같이, 인슐레이션 카본 블랙을 1차로 사출 성형하여 카본 블랙 블록(111)을 형성한 후, 이 카본 블랙 블록(111)에 탄소계 혼합소재를 2차로 사출 성형하여 방열부(112)를 형성히여 이중 사출방식의 탄소계 방열구조체(110)를 형성한다.The carbon-based heat dissipation structure 110 is made of a double injection method. As shown in FIG. 2, insulation carbon black is first injection molded to form a carbon black block 111, and then the carbon black block 111 is formed. ) to form the heat dissipation portion 112 by secondary injection molding the carbon-based mixed material to form the carbon-based heat dissipation structure 110 of the double injection method.
여기서, 상기 탄소계 혼합소재는 총 중량을 기준으로 40~60중량%의 탄소계 혼합재료와 40~60중량%의 고분자 수지를 포함하여 이루어진 것으로, 상기 탄소계 혼합재료는 탄소나노튜브, 그래핀 및 카본블랙으로 이루어진 군으로부터 선택되는 1종 이상의 탄소재료와 용매를 포함하는 탄소재료 분산물과, 인상흑연과 팽창흑연, 판상흑연, 구상흑연으로 이루어진 군으로부터 선택되는 2종 이상으로 이루어진 흑연재료를 포함하여 이루어진다.Here, the carbon-based mixed material consists of 40 to 60% by weight of the carbon-based mixed material and 40 to 60% by weight of the polymer resin based on the total weight, and the carbon-based mixed material includes carbon nanotubes and graphene. and a carbon material dispersion containing at least one carbon material selected from the group consisting of carbon black and a solvent, and a graphite material consisting of two or more types selected from the group consisting of waxy graphite, expanded graphite, plate-shaped graphite, and nodular graphite. It is done including.
그리고, 상기 PCB 회로층(120)은 절연본딩시트(121)에 코퍼패턴이 형성된 전기전도시트(122)와 접착제시트(123) 및 반사시트(124)가 적층되어 형성되는 것으로, 히트프레스 방식으로 탄소계 방열구조체(110)에 적층 본딩된다. In addition, the PCB circuit layer 120 is formed by stacking an electrically conductive sheet 122 with a copper pattern formed on an insulating bonding sheet 121, an adhesive sheet 123, and a reflective sheet 124, using a heat press method. It is laminated and bonded to the carbon-based heat dissipation structure 110.
구체적으로, 상기 PCB 회로층(120)은 도 3에 도시된 바와 같이, 카본 블랙 블록(111)과 동일한 형상으로 형성되는 절연본딩시트(121)와, 회로를 구성하는 코퍼패턴이 형성되어 절연본딩시트(121)의 상측에 적층되는 전기전도시트(122)와, 접착제가 도포되어 전기전도시트(122)를 절연본딩시트(121)에 접착하도록 전기전도시트(122)의 상측에 적층되는 접착제시트(123)와, 반사층이 형성되어 접착제 시트(123)의 상측에 적층되는 반사시트(124)를 포함하여 이루어지며, 자동가접기에 의해 가접된다.Specifically, as shown in FIG. 3, the PCB circuit layer 120 is formed with an insulating bonding sheet 121 formed in the same shape as the carbon black block 111 and a copper pattern constituting the circuit for insulating bonding. An electrically conductive sheet 122 laminated on the upper side of the sheet 121, and an adhesive sheet laminated on the upper side of the electrically conductive sheet 122 so that adhesive is applied to adhere the electrically conductive sheet 122 to the insulating bonding sheet 121. It includes (123) and a reflective sheet (124) on which a reflective layer is formed and laminated on the upper side of the adhesive sheet (123), and is tack-welded by an automatic tack-folding machine.
이때, 상기 PCB 회로층(120)을 보호하기 위하여 절연본딩시트(121)의 저면과 반사시트(124)의 상면에 각각 이형제 시트(125)가 더 적층되는 것이 바람직하다.At this time, in order to protect the PCB circuit layer 120, it is preferable that a release agent sheet 125 is further laminated on the bottom surface of the insulating bonding sheet 121 and the top surface of the reflective sheet 124, respectively.
상기 LED 패키지(130)는 조명을 형성하기 위한 것으로, 도 5에 도시되된 바와 같이, 솔더층(135)에 의해 PCB 회로층(120)에 연결된다. 이에 따라 LED 모듈 조립체(100)를 완성된다.The LED package 130 is used to form lighting, and as shown in FIG. 5, it is connected to the PCB circuit layer 120 by a solder layer 135. Accordingly, the LED module assembly 100 is completed.
마지막으로, 도 6에 도시된 바와 같이, 방수를 위해 LED 모듈을 감싸도록 실리콘 패드(200)가 설치되고, LED를 보호하도록 실리콘 패드(200)의 상측에 PC 렌즈(300)가 렌즈 체결나사(135)에 의해 설치된다.Finally, as shown in FIG. 6, a silicone pad 200 is installed to surround the LED module for waterproofing, and a PC lens 300 is attached to the upper side of the silicone pad 200 to protect the LED with a lens fastening screw ( 135).
한편, 본 발명에 따른 방열구조체 일체형 PCB가 구비된 LED 모듈의 제조방법은 도 7에 도시된 바와 같이, 인슐레이션 카본 블랙을 1차로 사출 성형하여 카본 블랙 블록(111)을 형성한 후, 이 카본 블랙 블록(111)에 탄소계 혼합소재를 방열부(112)로 2차로 사출 성형하여 이중 사출방식으로 탄소계 방열구조체(110)를 형성하는 단계; 절연본딩시트(121)에 코퍼패턴이 형성된 전기전도시트(122)와 접착제 시트(123) 및 반사시트(124)를 적층 및 가접하여 PC 회로층(120)을 형성하는 단계; 히트프레스를 이용하여 탄소계 방열구조체(110)에 PC 회로층(120)을 적층 본딩하는 단계; 회로의 오픈이나 쇼트를 검사하는 BBT 체크를 수행하는 단계; PC 회로층(120)에 OSP를 실시하여 방청막을 형성하는 단계; 솔더층(135)을 이용하여 LED 패키지(130)를 PC 회로층(120)에 연결하여 LED 모듈 조립체(100)를 완성하는 SMD 단계 및 LED를 보호하기 위하여 LED 모듈 조립체(100)의 상측에 실리콘 패드(200)와 PC 렌즈(300)를 설치하는 단계;를 포함하여 이루어진다.Meanwhile, in the method of manufacturing an LED module equipped with a heat dissipation structure-integrated PCB according to the present invention, as shown in FIG. 7, the carbon black block 111 is formed by first injection molding insulation carbon black, and then the carbon black is formed. Forming a carbon-based heat dissipation structure 110 by secondary injection molding the block 111 with a carbon-based mixed material as a heat dissipation unit 112; Forming a PC circuit layer 120 by laminating and tack-welding an electrically conductive sheet 122 with a copper pattern, an adhesive sheet 123, and a reflective sheet 124 on an insulating bonding sheet 121; Stacking and bonding the PC circuit layer 120 to the carbon-based heat dissipation structure 110 using a heat press; Performing a BBT check to check for open or short circuits; Forming a rust prevention film by performing OSP on the PC circuit layer 120; SMD step of completing the LED module assembly 100 by connecting the LED package 130 to the PC circuit layer 120 using the solder layer 135, and silicon on the upper side of the LED module assembly 100 to protect the LED. It includes the step of installing the pad 200 and the PC lens 300.
더욱 상세하게 설명하면, PC 회로층(120)을 형성하는 단계는 절연본딩시트(121)에 코퍼패턴이 노출되도록 패턴을 형성하고, 전기전도시트(122)에 코퍼패턴을 형성한 후, 접착제 시트(123)에 접착용 패턴을 형성하고 반사시트(124)에 LED 패키기(130)의 부착을 위한 반사층 패턴을 형성한 후, 자동 가접기를 이용하여 커버레이(Coveray 또는 이형제 시트)을 가접하게 된다. 이때, 절연본딩시트(121)와 전기전도시트(122)와 접착제 시트(123) 및 반사시트(124)는 롤투롤 방식으로 각각의 패턴을 타발하게 된다.In more detail, the step of forming the PC circuit layer 120 involves forming a pattern so that the copper pattern is exposed on the insulating bonding sheet 121, forming the copper pattern on the electrically conductive sheet 122, and then forming an adhesive sheet. After forming an adhesive pattern on (123) and forming a reflective layer pattern for attaching the LED package (130) to the reflective sheet (124), tack welding a coverlay (Coveray or release agent sheet) using an automatic tack folding machine. do. At this time, the insulating bonding sheet 121, the electrically conductive sheet 122, the adhesive sheet 123, and the reflective sheet 124 are punched out into their respective patterns using a roll-to-roll method.
그리고, 탄소계 방열구조체(110)에 PC 회로층(120)를 적층할 때는 PC 회로층(120)의 이형제 시트(125)를 제거한 후 가접된 절연본팅시트(121)의 패턴과 전기전도시트(122)의 코퍼패턴을 진공 히트프레스를 통해 140~200℃에서 2~3시간 동안 적층하고 롤링하는 방식으로 이루어진다. In addition, when laminating the PC circuit layer 120 on the carbon-based heat dissipation structure 110, the release agent sheet 125 of the PC circuit layer 120 is removed, and then the pattern of the tack-welded insulating bonding sheet 121 and the electrical conductive sheet ( This is done by laminating and rolling the copper patterns in 122) at 140-200°C for 2-3 hours through a vacuum heat press.
또, 방청막을 형성하는 단계는 OSP(Organic Solderability Preservative) 방식으로 이루어진다, OSP는 표면처리의 일종으로, 전기전도시트(122)의 코퍼패턴 표면에 벤조이미다졸(Benzimidazole)과 같은 방청막을 코팅(Coating) 처리하게 된다.In addition, the step of forming the rust prevention film is performed using the OSP (Organic Solderability Preservative) method. OSP is a type of surface treatment, where a rust prevention film such as benzimidazole is coated on the surface of the copper pattern of the electrically conductive sheet 122. ) will be processed.
이상으로 본 발명의 기술적 사상을 예시하기 위한 몇 가지 실시 예들과 관련하여 설명하고 도시하였지만, 본 발명은 이와 같이 설명된 그대로의 구성 및 작용에만 국한되는 것이 아니며, 발명의 설명에 기재된 기술적 사상의 범주를 일탈함이 없이 본 발명에 대해 다수의 변경 및 수정이 가능함을 통상의 기술자들은 잘 이해할 수 있을 것이다. 따라서 그러한 모든 적절한 변경 및 수정과 균등물들도 본 발명의 범위에 속하는 것으로 간주되어야 할 것이다.Although the present invention has been described and illustrated in relation to several embodiments to illustrate the technical idea of the present invention, the present invention is not limited to the configuration and operation as described, and is within the scope of the technical idea described in the description of the invention. Those skilled in the art will be able to understand that many changes and modifications can be made to the present invention without departing from the above. Accordingly, all such appropriate changes, modifications and equivalents shall be considered to fall within the scope of the present invention.
100...LED 모듈 조립체
110....탄소계 방열구조체
111....카본 블랙 블록
1 12...방열부(Heat Sink)
120...PCB 회로층
121...절연본딩시트(Insulation Bonding Sheet)
122....전기전도시트(Copper Sheet)
123...접착제 시트(Adhesive Sheet)
124...반사시트(White Layer Sheet)
125...이형제 시트(Release Layer Sheet)
130...LED 패키지
135...솔더(Solder)층
200...실리콘 패드
300...PC 렌즈
350...렌즈 체결나사100...LED module assembly
110...Carbon-based heat dissipation structure
111....carbon black block
1 12...Heat Sink
120...PCB circuit layer
121...Insulation Bonding Sheet
122....Electrically conductive sheet (Copper Sheet)
123...Adhesive Sheet
124...Reflective Sheet (White Layer Sheet)
125...Release Layer Sheet
130...LED package
135...Solder layer
200...Silicone pad
300...PC Lens
350...lens fastening screw
Claims (5)
상기 방열구조체 일체형 PCB는, 인슐레이션 카본 블랙을 1차로 사출 성형하여 카본 블랙 블록(111)을 형성한 후, 이 카본 블랙 블록(111)에 탄소계 혼합소재를 2차로 사출 성형하여 방열부(112)를 형성한 이중 사출방식의 탄소계 방열구조체(110);
절연본딩시트(121)에 코퍼패턴이 형성된 전기전도시트(122)와 접착제시트(123) 및 반사시트(124)가 적층되어 형성되며, 히트프레스 방식으로 탄소계 방열구조체(110)에 적층 본딩되는 PCB 회로층(120);
솔더층(135)에 의해 PCB 회로층(120)에 연결되어 조명을 형성하는 LED 패키지(130);를 포함하고,
상기 PCB 회로층(120)은 카본 블랙 블록(111)과 동일한 형상으로 형성되는 절연본딩시트(121)와, 회로를 구성하는 코퍼패턴이 형성되어 절연본딩시트(121)의 상측에 적층되는 전기전도시트(122)와, 접착제가 도포되어 전기전도시트(122)를 절연본딩시트(121)에 접착하도록 전기전도시트(122)의 상측에 적층되는 접착제시트(123)와, 반사층이 형성되어 접착제 시트(123)의 상측에 적층되는 반사시트(124)를 포함하고, 자동가접기에 의해 가접되어 이루어진 것을 특징으로 하는 방열구조체 일체형 PCB가 구비된 LED 모듈.In the LED module provided with a heat dissipation structure integrated PCB, which is formed by bonding an LED package to a heat dissipation structure integrated PCB and silicon pads and a PC lens installed thereon,
The heat dissipation structure integrated PCB is made by first injection molding insulation carbon black to form a carbon black block 111, and then secondarily injection molding a carbon-based mixed material on this carbon black block 111 to form a heat dissipation unit 112. A double injection type carbon-based heat dissipation structure (110) formed;
It is formed by stacking an electrically conductive sheet 122 with a copper pattern, an adhesive sheet 123, and a reflective sheet 124 on an insulating bonding sheet 121, and is laminated and bonded to the carbon-based heat dissipation structure 110 using a heat press method. PCB circuit layer 120;
It includes an LED package 130 that is connected to the PCB circuit layer 120 by a solder layer 135 to form lighting,
The PCB circuit layer 120 includes an insulating bonding sheet 121 formed in the same shape as the carbon black block 111, and a copper pattern constituting the circuit, which is an electrical conduction layer laminated on the upper side of the insulating bonding sheet 121. Sheet 122, an adhesive sheet 123 to which adhesive is applied and laminated on the upper side of the electrically conductive sheet 122 to adhere the electrically conductive sheet 122 to the insulating bonding sheet 121, and a reflective layer to form an adhesive sheet An LED module equipped with a heat dissipation structure-integrated PCB, which includes a reflective sheet 124 laminated on the upper side of (123) and is tack-welded by an automatic tack folding machine.
상기 PCB 회로층(120)은 절연본딩시트(121)의 저면과 반사시트(124)의 상면에 각각 적층되는 이형제 시트(125)를 더 포함하는 것을 특징으로 하는 방열구조체 일체형 PCB가 구비된 LED 모듈.According to paragraph 1,
The PCB circuit layer 120 further includes a release agent sheet 125 laminated on the bottom surface of the insulating bonding sheet 121 and the top surface of the reflective sheet 124, respectively. An LED module equipped with a heat dissipation structure integrated PCB. .
상기 탄소계 혼합소재는 총 중량을 기준으로 40~60중량%의 탄소계 혼합재료와 40~60중량%의 고분자 수지를 포함하고,
상기 탄소계 혼합재료는 탄소나노튜브, 그래핀 및 카본블랙으로 이루어진 군으로부터 선택되는 1종 이상의 탄소재료와 용매를 포함하는 탄소재료 분산물과, 인상흑연과 팽창흑연, 판상흑연, 구상흑연으로 이루어진 군으로부터 선택되는 2종 이상으로 이루어진 흑연재료를 포함하여 이루어진 것을 특징으로 하는 방열구조체 일체형 PCB가 구비된 LED 모듈.According to paragraph 1,
The carbon-based mixed material includes 40 to 60% by weight of the carbon-based mixed material and 40 to 60% by weight of the polymer resin based on the total weight,
The carbon-based mixed material consists of a carbon material dispersion containing one or more carbon materials selected from the group consisting of carbon nanotubes, graphene, and carbon black, and a solvent, and expanded graphite, expanded graphite, sheet graphite, and nodular graphite. An LED module equipped with a heat dissipation structure-integrated PCB, characterized in that it includes a graphite material made of two or more types selected from the group.
인슐레이션 카본 블랙을 1차로 사출 성형하여 카본 블랙 블록(111)을 형성한 후, 이 카본 블랙 블록(111)에 탄소계 혼합소재를 방열부(112)로 2차로 사출 성형하여 이중 사출방식으로 탄소계 방열구조체(110)를 형성하는 단계;
절연본딩시트(121)에 코퍼패턴이 형성된 전기전도시트(122)와 접착제 시트(123) 및 반사시트(124)를 적층 및 가접하여 PC 회로층(120)을 형성하는 단계;
히트프레스를 이용하여 탄소계 방열구조체(110)에 PC 회로층(120)을 적층 본딩하는 단계;
회로의 오픈이나 쇼트를 검사하는 BBT 체크를 수행하는 단계;
PC 회로층(120)에 OSP를 실시하여 방청막을 형성하는 단계;
솔더층(135)을 이용하여 LED 패키지(130)를 PC 회로층(120)에 연결하여 LED 모듈 조립체(100)를 완성하는 SMD 단계; 및
LED 모듈 조립체(100)의 LED를 보호하기 위하여 실리콘 패드(200)와 PC 렌즈(300)를 설치하는 단계;를 포함하고
상기 PC 회로층(120)을 형성하는 단계에서는 절연본딩시트(121)와 전기전도시트(122)와 접착제 시트(123) 및 반사시트(124)는 롤투롤 방식으로 각각의 패턴을 타발하고,
상기 적층 본딩 단계에서는 진공 히트프레스를 통해 140~200℃에서 2~3시간 동안 적층하고 롤링하는 것을 특징으로 하는 방열구조체 일체형 PCB가 구비된 LED 모듈의 제조방법.In the method of manufacturing an LED module equipped with the heat dissipation structure integrated PCB of claim 1 or 3,
After first injection molding insulation carbon black to form a carbon black block 111, a carbon-based mixed material is secondarily injection molded on this carbon black block 111 as the heat dissipation part 112 to form a carbon-based block 111 using a double injection method. Forming a heat dissipation structure 110;
Forming a PC circuit layer 120 by laminating and tack-welding an electrically conductive sheet 122 with a copper pattern, an adhesive sheet 123, and a reflective sheet 124 on an insulating bonding sheet 121;
Stacking and bonding the PC circuit layer 120 to the carbon-based heat dissipation structure 110 using a heat press;
Performing a BBT check to check for open or short circuits;
Forming a rust prevention film by performing OSP on the PC circuit layer 120;
An SMD step of completing the LED module assembly 100 by connecting the LED package 130 to the PC circuit layer 120 using a solder layer 135; and
Includes; installing a silicone pad 200 and a PC lens 300 to protect the LEDs of the LED module assembly 100;
In the step of forming the PC circuit layer 120, the insulating bonding sheet 121, the electrically conductive sheet 122, the adhesive sheet 123, and the reflective sheet 124 are punched out into respective patterns using a roll-to-roll method,
In the stacking bonding step, a method of manufacturing an LED module with a heat dissipation structure-integrated PCB, characterized in that stacking and rolling for 2 to 3 hours at 140 to 200 ° C. through a vacuum heat press.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130013806A (en) * | 2011-07-29 | 2013-02-06 | 금강전기 (주) | Led lighting unit |
| KR101997669B1 (en) | 2019-01-16 | 2019-07-08 | (주)세광산업조명 | LED Module with Heat Dissipating PCB and Manufacturing Method Thereof |
| KR20200073010A (en) | 2018-12-13 | 2020-06-23 | 문규식 | LED Module for Lighting with Heat Dissipating PCB and LED Lighting Apparatus with It |
| KR102151658B1 (en) * | 2020-01-07 | 2020-09-03 | 석주한 | Heat sink, led module and led light |
| KR102523306B1 (en) * | 2022-09-22 | 2023-04-20 | 사단법인 장애인한빛 | The LED Lighting Apparatus With Improved Heat Radiation |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130013806A (en) * | 2011-07-29 | 2013-02-06 | 금강전기 (주) | Led lighting unit |
| KR20200073010A (en) | 2018-12-13 | 2020-06-23 | 문규식 | LED Module for Lighting with Heat Dissipating PCB and LED Lighting Apparatus with It |
| KR101997669B1 (en) | 2019-01-16 | 2019-07-08 | (주)세광산업조명 | LED Module with Heat Dissipating PCB and Manufacturing Method Thereof |
| KR102151658B1 (en) * | 2020-01-07 | 2020-09-03 | 석주한 | Heat sink, led module and led light |
| KR102523306B1 (en) * | 2022-09-22 | 2023-04-20 | 사단법인 장애인한빛 | The LED Lighting Apparatus With Improved Heat Radiation |
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