KR102588826B1 - electroless nickel plating device - Google Patents

electroless nickel plating device Download PDF

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KR102588826B1
KR102588826B1 KR1020210116289A KR20210116289A KR102588826B1 KR 102588826 B1 KR102588826 B1 KR 102588826B1 KR 1020210116289 A KR1020210116289 A KR 1020210116289A KR 20210116289 A KR20210116289 A KR 20210116289A KR 102588826 B1 KR102588826 B1 KR 102588826B1
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plating
plating solution
heater
discharge pipe
plating tank
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KR1020210116289A
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Korean (ko)
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KR20230033385A (en
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김성재
김영준
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동아대학교 산학협력단
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1666—Ultrasonics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1673—Magnetic field
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1676—Heating of the solution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

본 발명 무전해 니켈 도금장치는, 육면체의 박스 형상이고, 내부에는 니켈 등의 금속이온이 포함된 도금용액(S)이 수용되며, 상단 일측에는 도금용액 유입관(221)이 형성되고, 하단 타측에는 도금용액 배출관(222)이 형성된 도금탱크(220), 도금용액 유입관(221)에 설치되며, 도금용액(S)을 도금탱크(220)의 내부로 공급하면서, 도금탱크(220) 내부의 도금용액(S)을 가압하는 가압펌프(P), 도금용액 배출관(222)에 설치되며, 도금용액(S)에 포함되어 있는 이물질을 제거하는 필터(F), 도금탱크(220)의 중앙부에 설치되며, 하면에 연결된 회전축(231) 및 도금탱크(220)를 관통하는 회전축(231)의 단부에 설치된 BLDC모터(M)와 연결된 턴테이블(230)을 포함하는 것을 요지로 한다.The electroless nickel plating device of the present invention has a hexahedral box shape, inside which a plating solution (S) containing metal ions such as nickel is accommodated, a plating solution inlet pipe 221 is formed on one side of the upper end, and a plating solution inlet pipe 221 is formed on one side of the upper end. It is installed on the plating tank 220 and the plating solution inlet pipe 221, where the plating solution discharge pipe 222 is formed on the side, and while supplying the plating solution (S) into the inside of the plating tank 220, the inside of the plating tank 220 A pressurizing pump (P) that pressurizes the plating solution (S), installed in the plating solution discharge pipe 222, a filter (F) that removes foreign substances contained in the plating solution (S), and a filter (F) located in the center of the plating tank (220). It is installed and includes a turntable 230 connected to a rotation axis 231 connected to the lower surface and a BLDC motor (M) installed at the end of the rotation axis 231 that penetrates the plating tank 220.

Description

무전해 니켈 도금장치 {electroless nickel plating device}Electroless nickel plating device {electroless nickel plating device}

본 발명은 도금장치에 관한 것으로서, 구체적으로는, 도금 두께의 균일화가 가능하고, 내식성 및 경도가 향상되어, 항공기의 부품 도금에 최적화된 무전해 니켈 도금장치에 관한 것이다.The present invention relates to a plating device, and specifically, to an electroless nickel plating device that enables uniform plating thickness, improves corrosion resistance and hardness, and is optimized for plating aircraft parts.

도금이란 소재의 표면에 금속을 코팅하는 과정을 말하며 일반적으로 부식을 방지하기 위해서나, 내마모성(스크래치에 대한 저항성)을 부여하거나, 고온에서 사용하는 금속을 보호하기 위하여서나, 밀착성(혹은 접착성)을 제공하기 위하여 또는Plating refers to the process of coating metal on the surface of a material. It is generally used to prevent corrosion, provide wear resistance (resistance to scratches), protect metal used at high temperatures, or improve adhesion (or adhesiveness). to provide or

적절한 전기적 성질을 얻기 위해서, 혹은 소재에 반사성을 부여하고 외형을 좋게 하기 위하여 등등의 여러 가지 목적을 위해 사용된다.It is used for various purposes, such as obtaining appropriate electrical properties, providing reflectivity to materials, and improving appearance.

특히, 항공기에 사용되는 부품 등과 같이 저온 및 고온 또는 고압 환경에 노출되는 부품에 있어서는 도금의 중요성이 커지게 된다.In particular, the importance of plating increases for parts exposed to low-temperature, high-temperature, or high-pressure environments, such as those used in aircraft.

금속 박막 도금방법으로는 전해 박막 도금법이 있는데, 전해 박막 도금법은 외부로부터 연속적으로 전기 에너지를 공급함으로서, 양극과 음극에서의 전기 분해법을 이용하여 피처리물의 표면 위에 금속 박막을 형성하도록 하는 도금방법으로서, 이를 위하여 금속의 이온을 함유한 용액에 전극을 넣고 전류를 통하게 하면 음극에서 금속이온이 환원하며 고순도의 금속층을 형성하게 된다. 이것을 이용하여 음극에 놓은 피처리물 표면에 직접적인 금속결합을 갖는 얇은 막을 만들게 된다. 일반적으로는 표면 마무리 공정을 위해서 사용되며 내식성, 내마모성을 향상시키기 위해 사용된다. There is an electrolytic thin film plating method as a metal thin film plating method. The electrolytic thin film plating method is a plating method that forms a metal thin film on the surface of the object to be treated using electrolysis at the anode and cathode by continuously supplying electrical energy from the outside. For this purpose, when an electrode is placed in a solution containing metal ions and an electric current is passed through it, the metal ions are reduced at the cathode and a high-purity metal layer is formed. This is used to create a thin film with direct metallic bonding on the surface of the object placed on the cathode. It is generally used for surface finishing processes and to improve corrosion resistance and wear resistance.

도 1은 종래 전해도금장치의 개략도, 도 2는 도 1의 부분확대도이다.Figure 1 is a schematic diagram of a conventional electroplating device, and Figure 2 is a partially enlarged view of Figure 1.

도시된 바와 같이, 전해도금장치(100)는 도금조(110), 양극 봉(120), 음극 봉(130), 금속 망(140), 보조 음극 봉(150) 및 보조 금속망(160)을 포함한다.As shown, the electroplating device 100 includes a plating bath 110, an anode rod 120, a cathode rod 130, a metal mesh 140, an auxiliary cathode rod 150, and an auxiliary metal mesh 160. Includes.

도금조(110)는 도금액(S)을 수용하는 역할을 하며, 양극 봉(120)은 도금조(110)의 양측 가장자리에 장착되고. 이러한 양극 봉(120)에서는 산화 반응(oxidation reaction)이 일어난다. 음극 봉(130)은 도금조(110)의 중앙 부분에 장착되고 인쇄회로기판(P)과 접속된다. 금속 망(140)은 음극 봉(130)의 단부에 고정되도록 장착된다. 이때, 음극 봉(130)은 금속 망(140)의 양측 가장자리에 각각 설치되는 전해도금장치가 공지되어 있다.The plating tank 110 serves to accommodate the plating solution (S), and the anode rod 120 is mounted on both edges of the plating tank 110. An oxidation reaction occurs in this anode rod 120. The cathode rod 130 is mounted in the center of the plating bath 110 and connected to the printed circuit board (P). The metal mesh 140 is mounted to be fixed to the end of the cathode rod 130. At this time, an electroplating device in which the cathode rod 130 is installed on both edges of the metal mesh 140 is known.

그러나 상기와 같은 전해도금장치는, 도금두께를 일정하게 하기가 어려운 문제점이 있고 전극의 설치가 어려운 복잡한 구조에 대해서는 사용하기 어려운 문제점이 있으며 도체에 대해서만 적용이 가능하다는 단점이 있다However, the above-described electroplating device has the disadvantage of making it difficult to keep the plating thickness constant, making it difficult to use for complex structures where electrode installation is difficult, and being applicable only to conductors.

등록특허공보 제10-1362083호 (2014.02.14. 공고)Registered Patent Publication No. 10-1362083 (announced on February 14, 2014)

본 발명은 상기와 같은 문제점을 해결하기 위한 것으로서, 내식성, 내마모성을 가지면서도 전해도금법의 적용이 어려운 복잡한 구조에 대해서도 도금 두께의 균일화가 가능하고, 내식성 및 경도가 향상되어, 항공기 부품의 도금에 최적화된 무전해 니켈 도금장치를 제공하고자 함이다.The present invention is intended to solve the above problems. It is possible to uniform the plating thickness even for complex structures that have corrosion resistance and wear resistance but are difficult to apply electroplating method, and the corrosion resistance and hardness are improved, so it is optimized for plating of aircraft parts. The purpose is to provide an electroless nickel plating device.

본 발명 무전해 니켈 도금장치는, 육면체의 박스 형상이고, 내부에는 니켈 등의 금속이온이 포함된 도금용액(S)이 수용되며, 상단 일측에는 도금용액 유입관이 형성되고, 하단 타측에는 도금용액 배출관이 형성된 도금탱크, 도금용액 유입관에 설치되며, 도금용액을 도금탱크의 내부로 공급하면서, 도금탱크 내부의 도금용액을 가압하는 가압펌프, 도금용액 배출관에 설치되며, 도금용액에 포함되어 있는 이물질을 제거하는 필터, 도금탱크의 중앙부에 설치되며, 하면에 연결된 회전축 및 도금탱크를 관통하는 회전축의 단부에 설치된 BLDC모터와 연결된 턴테이블을 포함하는 것을 특징으로 한다.The electroless nickel plating device of the present invention has a hexahedral box shape, inside which a plating solution (S) containing metal ions such as nickel is accommodated, a plating solution inlet pipe is formed on one side of the upper side, and a plating solution is formed on the other side of the lower side. It is installed in the plating tank with an discharge pipe, the plating solution inlet pipe, and supplies the plating solution to the inside of the plating tank while pressurizing the plating solution inside the plating tank. It is installed in the plating solution discharge pipe and contains the plating solution. It is characterized by including a filter to remove foreign substances, a turntable installed in the center of the plating tank, a rotating shaft connected to the bottom, and a BLDC motor installed at the end of the rotating shaft that penetrates the plating tank.

또한, 도금탱크의 내부 저면에 초음파진동자가 더 구비된 것을 특징으로 한다.In addition, an ultrasonic vibrator is further provided on the inner bottom of the plating tank.

또한, 도금탱크의 내측면에 마주보는 방향으로 구비되며, 상측히터는 하측히터 보다 높은 위치에 설치된 것을 특징으로 한다.In addition, it is provided in a direction facing the inner surface of the plating tank, and the upper heater is installed at a higher position than the lower heater.

또한, 도금탱크의 상측 외부에 구비된 자기장발생부 및 도금탱크 내의 압력을 계측하여 외부에서 사용자가 인식할 수 있도록 표출하는 압력계가 더 구비된 것을 특징으로 한다.In addition, it is further characterized by a magnetic field generator provided outside the upper side of the plating tank and a pressure gauge that measures the pressure inside the plating tank and displays it so that the user can recognize it from the outside.

또한, 턴테이블의 상면에는 비금속재질의 망체가 구비된 것을 특징으로 한다.In addition, the upper surface of the turntable is characterized by a mesh body made of non-metallic material.

또한, 상,하측히터는, 일측은 폐쇄되고 일측은 개구된 원통형 구조의 히터수용부와, 히터수용부에 삽입된 형상으로 구비된 히터본체를 포함하되; 히터본체는, 히터본체의 내부 중앙에 구비된 열선과, 열선을 감싸는 형상으로 구비되며, 열선의 열을 전달하면서, 전기적으로 절연되어 감전이나 누전되는 것을 방지하는 마그네슘분말과, 마그네슘분말을 감싸는 원통의 형상으로 구비된 금속재발열관과, 금속재발열관의 표면에 피복된 법랑유약층으로 이루어진 것을 특징으로 한다.In addition, the upper and lower heaters include a heater accommodating portion of a cylindrical structure with one side closed and one side open, and a heater body provided in a shape inserted into the heater accommodating portion; The heater main body is comprised of a heating wire provided in the inner center of the heater main body, magnesium powder in a shape that surrounds the heating wire, transmits the heat of the heating wire and is electrically insulated to prevent electric shock or short circuit, and a cylinder surrounding the magnesium powder. It is characterized by consisting of a metal reheating tube provided in the shape of and an enamel glaze layer coated on the surface of the metal reheating tube.

본 발명 무전해 니켈 도금장치는, 피도금체의 외부로 노출된 표면 뿐만 아니라, 미세가공된 부분까지도 도금용액과의 접촉이 원활하게 이루어져 도금의 효율을 극대화할 수 있는 효과를 갖는다.The electroless nickel plating device of the present invention has the effect of maximizing plating efficiency by smoothly contacting the plating solution not only with the externally exposed surface of the object to be plated but also with the microprocessed portion.

또한, 도금의 효율을 높이면서, 피도금체가 턴테이블에서 이탈되는 것을 방지하는 효과, 망체의 사이로 분산되어 유입된 도금용액에 의하여 피도금체의 미세한 부분까지 도금이 원활하게 이루어져 도금의 효율을 극대화할 수 있는 효과를 갖는다.In addition, it increases the efficiency of plating and prevents the object to be plated from leaving the turntable. The plating solution dispersed and introduced between the nets ensures smooth plating even to the finest details of the object to be plated, thereby maximizing plating efficiency. It has a possible effect.

또한, 피도금체의 표면 및 미세가공된 홈이나 통공 등까지도 도금이 원활하게 이루어질 수 있는 효과를 갖는다.In addition, it has the effect of allowing smooth plating even on the surface of the object to be plated and the micromachined grooves or holes.

또한, 도금용액을 80∼100℃를 유지하면서, 온도편차가 극소화되도록 가열함으로서, 도금의 효율을 높이는 효과를 갖는다.In addition, by heating the plating solution to minimize temperature deviation while maintaining 80 to 100°C, it has the effect of increasing plating efficiency.

또한, 양이온인 니켈 등의 금속이온이 피도금체 표면에 집중되도록 하여, 도금의 효율을 높이는 효과를 갖는다.In addition, it has the effect of increasing the efficiency of plating by allowing metal ions such as nickel, which are positive ions, to concentrate on the surface of the object to be plated.

도 1은 종래 전해도금장치의 개략도.
도 2는 도 1의 부분확대도.
도 3은 본 발명 무전해 니켈 도금장치의 설치 상태도.
도 4는 상,하측히터의 단면도.
도 5는 도 4 A-A'선 단면도.
도6은 히터수용부의 다른 실시 예의 사시도.
도 7은 필터 자동교환수단의 설치상태도.
도 8은 필터 자동교환수단의 단면도 및 회전카트리지의 확대평면도.1 is a schematic diagram of a conventional electroplating device.
Figure 2 is a partially enlarged view of Figure 1.
Figure 3 is a diagram showing the installation state of the electroless nickel plating device of the present invention.
Figure 4 is a cross-sectional view of the upper and lower heaters.
Figure 5 is a cross-sectional view taken along line A-A' in Figure 4.
Figure 6 is a perspective view of another embodiment of the heater receiving portion.
Figure 7 is a diagram showing the installation state of the automatic filter exchange means.
Figure 8 is a cross-sectional view of the automatic filter exchange means and an enlarged plan view of the rotating cartridge.

본 발명의 바람직한 실시 예를 첨부된 도면을 참조하여 상세히 설명한다. 참고로, 본 발명을 설명하는데 참조하는 도면에 도시된 구성요소의 크기, 선의 두께 등은 이해의 편의상 다소 과장되게 표현되어 있을 수 있다. Preferred embodiments of the present invention will be described in detail with reference to the attached drawings. For reference, the sizes of components, thickness of lines, etc. shown in the drawings used to describe the present invention may be somewhat exaggerated for ease of understanding.

또, 본 발명의 설명에 사용되는 용어들은 본 발명에서의 기능을 고려하여 정의한 것이므로 사용자, 운용자 의도, 관례 등에 따라 달라질 수 있다. 따라서, 이 용어에 대한 정의는 본 명세서의 전반에 걸친 내용을 토대로 내리는 것이 마땅하다.In addition, the terms used in the description of the present invention are defined in consideration of the functions of the present invention and may vary depending on the user, operator intention, custom, etc. Therefore, the definition of this term should be based on the overall content of this specification.

그리고 본 출원에서, '포함하다', '가지다' 등의 용어는 명세서 상에 기재된 특정의 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지칭하는 것이지, 하나 또는 그 이상의 다른 특징이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.In the present application, terms such as 'comprise', 'have', etc. refer to the existence of specific numbers, steps, operations, components, parts, or combinations thereof described in the specification, and do not refer to the presence of one or more other numbers, steps, operations, components, parts, or combinations thereof. It should be understood that this does not exclude in advance the possibility of the presence or addition of features, numbers, steps, operations, components, parts, or combinations thereof.

또한, 본 발명은 이하에서 개시되는 실시 예에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 것이며, 단지 본 실시 예는 본 발명의 개시가 완전하도록 하며, 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이다.In addition, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms, but the present embodiments only serve to ensure that the disclosure of the present invention is complete and to convey the scope of the invention to those skilled in the art. It is provided for complete information.

그러므로, 본 발명은 다양한 변경을 가할 수 있고 여러 가지 형태를 가질 수 있는바, 구현 예(態樣, aspect)(또는 실시 예)들을 명세서에 상세하게 설명하고자 한다. 그러나 이는 본 발명을 특정한 개시 형태에 대해 한정하려는 것이 아니며, 본 발명의 기술적 사상에 포함되는 모든 변경, 균등물 내지 대체물을 포함하는 것으로 이해되어야 하고, 본 명세서에서 사용한 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. Therefore, since the present invention can make various changes and take various forms, implementation examples (or embodiments) will be described in detail in the specification. However, this is not intended to limit the present invention to a specific disclosed form, and should be understood to include all changes, equivalents, and substitutes included in the technical idea of the present invention, and the singular expressions used in this specification are clearly different from the context. Unless otherwise intended, plural expressions are included.

다만, 본 발명을 설명함에 있어서, 주지 또는 공지된 기능 혹은 구성에 대한 구체적인 설명은 본 발명의 요지를 명료하게 하기 위하여 생략하기로 한다.However, in describing the present invention, detailed descriptions of well-known or known functions or configurations will be omitted to make the gist of the present invention clear.

이하에서 본 발명의 구체적인 실시 예를 도면을 참고하여 설명한다.Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

도 3은 본 발명 무전해 니켈 도금장치의 설치 상태도이다.Figure 3 is a diagram showing the installation state of the electroless nickel plating apparatus of the present invention.

도시된 바와 같이 무전해 니켈 도금장치(200)는, 자기장발생부(210), 도금탱크(220), 턴테이블(230), 하측히터(240a), 상측히터(240b), 초음파진동자(250), 가압펌프(P), 필터(F)를 포함하고 있다.As shown, the electroless nickel plating device 200 includes a magnetic field generator 210, a plating tank 220, a turntable 230, a lower heater 240a, an upper heater 240b, an ultrasonic oscillator 250, Includes a pressurization pump (P) and a filter (F).

도금탱크(220)는, 육면체의 박스 형상을 하고 있고, 내부에는 니켈 등의 금속이온이 포함된 도금용액(S)이 수용되어 있으며, 도금탱크(220)의 상단 일측에는 도금용액 유입관(221)이 형성되어 있고, 도금탱크(220)의 하단 타측에는 도금용액 배출관(222)이 형성되어 있다.The plating tank 220 has a hexahedral box shape, and contains a plating solution (S) containing metal ions such as nickel inside. There is a plating solution inflow pipe 221 on one upper side of the plating tank 220. ) is formed, and a plating solution discharge pipe 222 is formed on the other lower side of the plating tank 220.

상기, 도금용액 유입관(221) 및 도금용액 배출관(222)은 서로 연결되어 도금용액(S)이 순환될 수 있는 것은 물론이다.Of course, the plating solution inlet pipe 221 and the plating solution discharge pipe 222 are connected to each other so that the plating solution S can be circulated.

가압펌프(P)는, 도금용액 유입관(221)에 설치되어 있어, 도금용액(S)을 도금탱크(220)의 내부로 공급하면서, 도금탱크(220) 내부의 도금용액(S)을 가압하는 기능을 가진다.The pressure pump (P) is installed in the plating solution inlet pipe 221, and supplies the plating solution (S) into the plating tank 220 while pressurizing the plating solution (S) inside the plating tank 220. It has the function of

이와 같의 가압된 도금용액(S)은, 미세기공 또는 미세홈 등이 가공되어 있는 항공기 부품인 피도금체(W)에 압력을 가하게 되고, 그 압력에 의하여 도금용액(S)이 미세홈 등을 통과하면서, 도금이 이루어지는 것이므로, 피도금체(W)의 외부로 노출된 표면 뿐만 아니라, 미세가공된 부분까지도 도금용액(S)과의 접촉이 원활하게 이루어져 도금의 효율을 극대화할 수 있는 작용, 효과를 갖게 되는 것이다.This pressurized plating solution (S) applies pressure to the plated body (W), which is an aircraft part on which micropores or microgrooves, etc. are processed, and the plating solution (S) forms microgrooves, etc. by the pressure. Since plating is carried out while passing through, not only the externally exposed surface of the plated body (W) but also the micro-processed part is smoothly contacted with the plating solution (S), thereby maximizing the efficiency of plating. , it will have an effect.

필터(F)는, 도금용액 배출관(222)에 설치되어 있어, 도금용액(S)에 포함되어 있는 이물질을 제거한다.The filter (F) is installed in the plating solution discharge pipe 222 and removes foreign substances contained in the plating solution (S).

턴테이블(230)은, 도금탱크(220)의 중앙부에 설치되어 있으며, 턴테이블(230)의 하면에 연결된 회전축(231) 및 도금탱크(220)를 관통하는 회전축(231)의 단부에 설치된 BLDC모터(M)와 연결되어 있으며, BLDC모터(M)의 구동에 의하여 회전한다.The turntable 230 is installed in the center of the plating tank 220, and has a rotation shaft 231 connected to the lower surface of the turntable 230 and a BLDC motor ( It is connected to M) and rotates by driving the BLDC motor (M).

상기 턴테이블(230)의 상면에는 피도금체(W)가 놓여지며, 피도금체(W)는 턴테이블(230)의 상면에 형성된 비금속재질의 망체(232)의 내부에 구비된다.A plated body (W) is placed on the upper surface of the turntable 230, and the plated body (W) is provided inside a mesh 232 made of a non-metallic material formed on the upper surface of the turntable 230.

상기 망체(232)는 도금용액(S)을 분산시켜 관통시키는 기능을 가지면서, 비금속재질로 이루어져 있으므로, 도금에는 영향을 미치지 않는 것과 더불어 망체(232) 내부의 피도금체(W)가 턴테이블(230)에서 이탈되는 것을 방지하는 작용, 효과를 갖는다.The mesh 232 has the function of dispersing and penetrating the plating solution (S) and is made of a non-metallic material, so it does not affect plating and the plated body (W) inside the mesh 232 can be used on the turntable ( 230) has the action and effect of preventing deviation from the system.

또한 상기 망체(232)에는 피도금체(W)를 인입할 수 있는 도어(도시를 생략함)가 설치될 수 있음은 물론이다.In addition, of course, a door (not shown) through which the plated body (W) can be introduced may be installed on the net body 232.

상기 BLDC 모터(M)는, 종래의 DC모터에 쓰이던 브러시 대신 전자회로를 쓰는 브러시리스(Brushless)모터로서, 사용할수록 마모되는 브러시를 쓰지 않기 때문에 반영구적이며, 제품의 수명이 종래의 DC모터에 비하여 10배 이상 향상된 모터로서, 소음이 거의 없고, 진동이 최소화되며, 에너지효율이 20% 이상 개선된 작용, 효과를 갖는다.The BLDC motor (M) is a brushless motor that uses an electronic circuit instead of the brush used in a conventional DC motor. It is semi-permanent because it does not use a brush that wears out with use, and the product lifespan is longer than that of a conventional DC motor. It is a motor that has been improved by more than 10 times, making almost no noise, minimizing vibration, and improving energy efficiency by more than 20%.

이와 같은 구조를 가지는 턴테이블(230)에 의하여, 피도금체(W)가 회전되는 것이어서 도금용액(S)과의 접촉면적을 순차적으로 넓혀 도금의 효율을 높이면서, 가압된 도금용액(S)에 의하여 턴텐이블(230)에서 이탈하려는 항공부품 등의 피도금체(W)는 망체(232)에 의하여 이동이 제한되는 것이므로 피도금체(W)가 턴테이블(230)에서 이탈되는 것을 방지함과 동시에 망체(232)의 사이로 분산되어 유입된 도금용액(S)에 의하여 피도금체(W)의 미세한 부분까지 도금이 원활하게 이루어져 도금의 효율을 극대화할 수 있는 것이다.By the turntable 230 having this structure, the object to be plated (W) is rotated, thereby increasing the efficiency of plating by sequentially expanding the contact area with the plating solution (S) and Since the movement of the plated object (W), such as aerospace parts, which is trying to escape from the turntable 230, is restricted by the mesh 232, the plated object (W) is prevented from being separated from the turntable 230 and at the same time, The plating solution (S) dispersed and introduced between the nets 232 allows plating to be smoothly carried out even in the finest parts of the object to be plated (W), thereby maximizing the efficiency of plating.

초음파진동자(250)는, 도금탱크(220)의 내부 저면에 구비되어 있으며, 초음파진동자가 구동되어 초음파를 발생시키면, 초음파에 의하여 생성된 도금용액(S)의 방울은 초음파진동자(250)의 상부방향으로 퍼져나가면서 피도금체(W)에 충돌함으로서, 피도금체(W)의 표면 및 미세가공된 홈이나 통공 등까지도 도금이 원활하게 이루어질 수 있는 것이다.The ultrasonic transducer 250 is provided on the inner bottom of the plating tank 220, and when the ultrasonic transducer is driven to generate ultrasonic waves, droplets of the plating solution (S) generated by the ultrasonic waves move to the upper part of the ultrasonic transducer 250. By spreading in this direction and colliding with the plated body (W), plating can be smoothly performed even on the surface of the plated body (W) and the micro-machined grooves or holes.

하측히터(240a) 및 상측히터(240b)는, 도금탱크(220)외 내측면에 마주보는 방향으로 구비되어 있으며, 상측히터(240b)는 하측히터(240a) 보다 높은 위치에 설치된다.The lower heater 240a and the upper heater 240b are provided in opposite directions on the outer inner surface of the plating tank 220, and the upper heater 240b is installed at a higher position than the lower heater 240a.

이러한 하측히터(240a) 및 상측히터(240b)는 도금용액을 80∼100℃를 유지하도록 가열함으로서, 도금의 효율을 높이는 것이다.These lower heaters 240a and upper heaters 240b increase plating efficiency by heating the plating solution to maintain 80 to 100°C.

또한, 하측히터(240a) 및 상측히터(240b)의 위치를 상, 하로 특정하는 것으로 인하여, 도금용액(S)의 온도가 도금탱크(220) 내부의 지역에 따라 편차가 생기는 것을 최소화함으로써, 도금의 효율을 더욱 더 높일 수 있는 것이다.In addition, by specifying the positions of the lower heater 240a and the upper heater 240b as upper and lower, the temperature of the plating solution (S) minimizes deviation depending on the area inside the plating tank 220, thereby improving plating. The efficiency can be further increased.

자기장발생부(210)는, 도금탱크(220)의 상측 외부에 구비되며, 피도금체(W)가 도금용액(S)에 침지되어 도금탱크(220) 내의 턴테이블(230)에서 수평한 상태로 위치할 경우 자기장발생부(210)는 피도금체(W)를 통과하는 자기장을 발생시켜 피도금체(W)의 표면에 금속이온을 집중시킬 수 있다. The magnetic field generator 210 is provided outside the upper side of the plating tank 220, and allows the object to be plated (W) to be immersed in the plating solution (S) in a horizontal state on the turntable 230 within the plating tank 220. When positioned, the magnetic field generator 210 can generate a magnetic field that passes through the plated body (W) and concentrate metal ions on the surface of the plated body (W).

즉, 자기장발생부(210)는 피도금체(W) 표면에 자기장의 N극을 대전시킴으로서 양이온인 니켈 등의 금속이온이 피도금체(W) 표면에 집중되도록 한다. That is, the magnetic field generator 210 charges the surface of the plated body (W) with the N pole of the magnetic field so that metal ions such as nickel, which are positive ions, are concentrated on the surface of the plated body (W).

또한, 자기장발생부(210)에서 발생되는 자기장은 도금용액(S)에 포함된 환완제의 활성화 에너지를 감소시켜 도금 반응 속도를 증가시키는 작용, 효과를 가지는 것이다.In addition, the magnetic field generated from the magnetic field generator 210 has the effect of increasing the plating reaction speed by reducing the activation energy of the refining agent contained in the plating solution (S).

압력계는, 도금탱크(220) 내의 압력을 계측하여 외부에서 사용자가 인식할 수 있도록 표출함으로써, 사용자가 도금탱크(220) 등이 과압에 의하여 파손되는 것을 미리 예방할 수 있는 효과를 가진다.The pressure gauge measures the pressure inside the plating tank 220 and displays it externally so that the user can recognize it, thereby allowing the user to prevent the plating tank 220, etc. from being damaged by overpressure.

이상과 같은 무전해 니켈 도금장치(200)는, The electroless nickel plating device 200 as described above,

가압펌프(P)에 의하여, 도금탱크(220) 내부의 도금용액(S)을 가압함으로서, 피도금체(W)의 외부로 노출된 표면 뿐만 아니라, 미세가공된 부분까지도 도금용액(S)과의 접촉이 원활하게 이루어지게 함으로서, 도금의 효율을 극대화 할 수 있는 효과를 갖는다.By pressurizing the plating solution (S) inside the plating tank 220 by the pressurizing pump (P), not only the externally exposed surface of the plated object (W) but also the micro-processed part is treated with the plating solution (S). By ensuring smooth contact, it has the effect of maximizing plating efficiency.

또한, 턴테이블(230) 및 망체(232)에 의하여, 피도금체(W)와 도금용액(S)과의 접촉면적을 순차적으로 넓혀 도금의 효율을 높이면서, 턴텐이블(230)에서 이탈하려는 항공부품 등의 피도금체(W)가 턴테이블(230)에서 이탈되는 것을 방지하는 효과와 더불어, 망체(232)의 사이로 분산되어 유입된 도금용액(S)에 의하여 피도금체(W)의 미세한 부분까지 도금이 원활하게 이루어져 도금의 효율을 극대화할 수 있는 효과를 갖는다.In addition, by the turntable 230 and the mesh 232, the contact area between the plated body (W) and the plating solution (S) is sequentially expanded to increase the efficiency of plating, while preventing the aircraft trying to deviate from the turntable 230. In addition to the effect of preventing the plated body (W), such as a part, from being separated from the turntable 230, fine parts of the plated body (W) are damaged by the plating solution (S) dispersed and introduced between the nets (232). Plating is carried out smoothly up to this point, which has the effect of maximizing plating efficiency.

또한, 초음파진동자(250)에 의하여, 생성된 도금용액(S)의 방울은 초음파진동자(250)의 상부방향으로 퍼져나가면서 피도금체(W)에 충돌함으로서, 피도금체(W)의 표면 및 미세가공된 홈이나 통공 등까지도 도금이 원활하게 이루어질 수 있는 효과를 갖는다.In addition, the droplets of the plating solution (S) generated by the ultrasonic vibrator 250 spread toward the upper part of the ultrasonic vibrator 250 and collide with the object to be plated (W), thereby damaging the surface of the object to be plated (W). It has the effect of allowing smooth plating even on finely processed grooves and holes.

또한, 하측히터(240a) 및 상측히터(240b)에 의하여, 도금용액을 80∼100℃를 유지하면서, 온도편차가 극소화되도록 가열함으로서, 도금의 효율을 높이는 효과를 갖는다.In addition, the lower heater 240a and the upper heater 240b heat the plating solution to minimize temperature deviation while maintaining the temperature at 80 to 100°C, which has the effect of increasing plating efficiency.

또한, 자기장발생부(210)에 의하여, 피도금체(W) 표면에 자기장의 N극을 대전시킴으로서 양이온인 금속이온이 피도금체(W) 표면에 집중되도록 하여, 도금의 효율을 높이는 효과를 갖는다.In addition, by charging the N pole of the magnetic field on the surface of the plated body (W) by the magnetic field generator 210, metal ions, which are positive ions, are concentrated on the surface of the plated body (W), thereby increasing the efficiency of plating. have

이하의 실시 예에서는 자기장발생부의 재질에 관하여 설명한다.In the following embodiments, the material of the magnetic field generator will be described.

자기장발생부(210)는, 자석으로 이루어져 있으며, 상기 자석은, The magnetic field generator 210 is made of a magnet, and the magnet is,

전이금속 원소를 포함하는 110 ~ 150 ㎛ 의 크기를 가진 자성 분말과 수지 바인더로 구성되며, 수지바인더는 라디칼-중합 반응성을 가진 열경화성 수지 100 중량부당 N-옥실 화합물 15 중량부, 불포화 폴리에스테르 수지 5 ~ 20 중량부의 조성물을 포함하는 것을 특징으로 한다.It consists of magnetic powder with a size of 110 ~ 150 ㎛ containing transition metal elements and a resin binder. The resin binder is 15 parts by weight of N-oxyl compound and 5 parts by weight of unsaturated polyester resin per 100 parts by weight of thermosetting resin with radical-polymerization reactivity. It is characterized in that it comprises ~20 parts by weight of the composition.

위와 같은 조성물로 이루어진 자석은, 자석 특성, 형태 자유도 및 기계적 강도, 성형성이 우수하므로, 산업장치인 무전해 니켈 도금장치에서 높은 사용효율을 가질수 있는 것이다.Magnets made of the above composition have excellent magnetic properties, freedom of shape, mechanical strength, and formability, so they can have high use efficiency in electroless nickel plating equipment, which is an industrial device.

이하의 실시 예에서는 망체의 재질에 관하여 설명한다.In the following examples, the material of the net body will be described.

망체(232)는 화학반응이 일어나지 않는 내화학성이 우수한 재질로 형성된다.The mesh 232 is made of a material with excellent chemical resistance that does not cause chemical reactions.

상기 망체(232)는, 실리카 졸 100 중량부에 대하여, 염기성 화합물 7 ~ 10 중량부, 트리메톡시실란 6 ~ 9 중량부, Al2 O3 5~ 15 중량부, Cr2O3 5 ~ 10 중량부, SiO2 1 ~ 7 중량부, 물 10 ~ 30 중량부를 포함하는 세라믹 조성물로 이루어진 것을 특징으로 한다.The mesh 232 contains 7 to 10 parts by weight of a basic compound, 6 to 9 parts by weight of trimethoxysilane, 5 to 15 parts by weight of Al 2 O 3 , and 5 to 10 parts by weight of Cr 2 O 3 based on 100 parts by weight of silica sol. It is characterized in that it is made of a ceramic composition containing 1 to 7 parts by weight of SiO 2 and 10 to 30 parts by weight of water.

이상과 같은 조성물로 이루어진 망체(232)는 내화학성 및 내열성이 우수하면서도 기계적강도 역시 우수하여 설비의 잦은 교체에 따른 비용이 절감되는 효과를 갖는다.The net body 232 made of the above composition has excellent chemical resistance and heat resistance and also excellent mechanical strength, which has the effect of reducing costs due to frequent replacement of equipment.

이하의 실시 예에서는 상,하측히터의 구체적 구성에 관하여 설명한다.In the following embodiments, the specific configuration of the upper and lower heaters will be described.

도 4는 상,하측히터의 단면도, 도 5는 도 4 A-A'선 단면도이다.Figure 4 is a cross-sectional view of the upper and lower heaters, and Figure 5 is a cross-sectional view taken along line A-A' in Figure 4.

도시된 바와 같이 상,하측히터(240b,240a)는, 도금탱크(220)의 외측에서 내측으로 삽입된 형상으로 구비되며, 상기 상,하측히터(240b,240a)는, 히터수용부(241), 히터본체(242), 슬리브(243)를 포함하고 있다.As shown, the upper and lower heaters 240b and 240a are provided in a shape inserted from the outside to the inside of the plating tank 220, and the upper and lower heaters 240b and 240a are connected to the heater receiving portion 241. , heater body 242, and sleeve 243.

히터수용부(241)는, 일측은 폐쇄되고 일측은 개구된 원통형 구조를 가지고 있으며, 상기 히터수용부(241)는, 이트륨을 포함하는 화합물을 이트륨 환산으로 10wt％ 이상 50wt％ 이하, 특히 1wt％ 이상 3wt％ 이하를 포함하는 것이 바람직하고, 마그네슘을 포함하는 화합물을 마그네슘 환산으로 0.5wt％ 이상 50wt％ 이하, 특히 1wt％ 이상 3wt％ 이하를 포함하는 것이 바람직하다.The heater accommodating part 241 has a cylindrical structure with one side closed and one side open, and the heater accommodating part 241 contains a yttrium-containing compound of 10 wt% or more and 50 wt% or less, especially 1 wt%, in terms of yttrium. It is preferable that it contains more than 3 wt% or less, and it is preferable that the compound containing magnesium is contained in an amount of 0.5 wt% or more and 50 wt% or less, especially 1 wt% or more and 3 wt% or less, in terms of magnesium.

위와 같은 조성물로 이루어진 히터수용부(241)는, 고강도이고 고열전도의 소결체가 된다.The heater receiving portion 241 made of the above composition becomes a sintered body with high strength and high thermal conductivity.

히터본체(242)는, 히터수용부(241)에 삽입된 형상으로 구비되며, 법랑유약층(242-1), 금속재발열관(242-2), 마그네슘분말(242-3), 열선(242-4)을 포함하고 있다. 도 4에서는 히터수용부(241)의 내면과 히터본체(242)가 이격된 것으로 도시되어 있으나, 그와 같은 점은 구성의 연동관계를 표현하기 위한 예시일 뿐, 히터수용부(241)와 히터본체(242)가 밀착되어 열전달이 일어날 수 있음은 물론이다.The heater body 242 is provided in a shape inserted into the heater receiving portion 241, including an enamel glaze layer 242-1, a metal reheating tube 242-2, magnesium powder 242-3, and a heating wire 242. -4) is included. In Figure 4, the inner surface of the heater accommodating part 241 and the heater main body 242 are shown to be spaced apart, but this is only an example to express the interlocking relationship of the configuration, and the heater accommodating part 241 and the heater Of course, heat transfer can occur due to the body 242 being in close contact.

상기 열선(242-4)은, 히터본체(242)의 내부 중앙에 구비되며, 전기를 도통시킴으로서 발열한다.The heating wire 242-4 is provided at the inner center of the heater body 242 and generates heat by conducting electricity.

상기 마그네슘분말(242-3)은, 열선(242-4)을 감싸는 형상으로 구비되며, 열선의 열을 전달하면서, 전기적으로 절연되어 감전이나 누전되는 것을 방지한다.The magnesium powder (242-3) is provided in a shape that surrounds the heating wire (242-4), transmits the heat of the heating wire, and is electrically insulated to prevent electric shock or short circuit.

상기 금속재발열관(242-2)은, 마그네슘분말(242-3)을 감싸는 원통의 형상으로 구비되며, 마그네슘분말(242-3)에서 전도된 열을 받아 발열하고, 발열된 열을 히터수용부(241)로 전달한다.The metal reheating tube (242-2) is provided in the shape of a cylinder surrounding the magnesium powder (242-3), receives heat conducted from the magnesium powder (242-3), generates heat, and transfers the generated heat to the heater receiving unit. Forward to (241).

상기 법랑유약층(242-1)은, 금속재발열관(242-2)의 표면에 유리질 유약을 피복시키는 것으로서 금속의 강인성과 법랑이 가진 내식성과 청결성 및 내염, 내산성에 의해 산 이온반응에 따른 녹 생성이 일어나지 않게 되는 작용, 효과를 가진다.The enamel glaze layer (242-1) covers the surface of the metal reheating pipe (242-2) with a glassy glaze, and is formed due to the toughness of the metal and the corrosion resistance, cleanliness, salt resistance, and acid resistance of the enamel, thereby preventing rust due to acid ion reaction. It has the action and effect of preventing creation.

슬리브(243)는, 알루미나, 탄화규소 등으로 이루어지는 충전재를 통해 히터수용부(241)의 일측 끝단에 부착할 수 있으며, 상기 슬리브(243)는, 외측방향으로 돌출된 원반 형상의 플랜지부를 구비하고, 도금탱크(220)에 부착하기 위해 사용된다.The sleeve 243 can be attached to one end of the heater receiving portion 241 through a filler made of alumina, silicon carbide, etc., and the sleeve 243 has a disk-shaped flange portion protruding outward. and is used to attach to the plating tank 220.

이상과 같은 상,하측히터(240b,240a)의 작용, 효과를 살펴보면,Looking at the actions and effects of the upper and lower heaters 240b and 240a as described above,

히터본체(242)는 히터수용부(241)에 의하여 보호되는 것이므로, 도금용액(S)에 의하여 부식되는 것을 방지하면서, 여기에 더하여 히터본체(242)에 구비된 법랑유약층(242-1)은 내염, 내산성을 가지는 것이어서, 히터본체(242)의 내부에 구비된 금속재발열관(242-2) 및 열선(242-4) 등을 보호하는 작용, 효과가 있는 것이다.Since the heater body 242 is protected by the heater receiving portion 241, it prevents corrosion by the plating solution (S), and in addition, the enamel glaze layer 242-1 provided on the heater body 242 Since it has salt and acid resistance, it has the effect of protecting the metal reheating tube 242-2 and the heating wire 242-4 provided inside the heater main body 242.

이하에서는 히터수용부의 다른 실시 예에 관하여 살펴본다.Below, we will look at other embodiments of the heater receiver.

도6은 히터수용부의 다른 실시 예의 사시도이다.Figure 6 is a perspective view of another embodiment of the heater receiving portion.

도시된 바와 같이 본 실시 예의 히터수용부(241)는, 외표면에 날개부(241-1)가 형성되고, 날개부(241-1)에는 관통공이 형성된 점에 특징이 있다.As shown, the heater accommodating portion 241 of this embodiment is characterized in that a wing portion 241-1 is formed on the outer surface, and a through hole is formed in the wing portion 241-1.

이러한 구조를 갖는 히터수용부(241)는, 날개부(241-1)에 의하여 열교환면적이 넓어져서 도금용액(S)을 가열하는 효과를 향상시키는 것과 더불어 순환하는 도금용액(S)이 관통공을 통하여 순환됨으로서, 더욱 더 열교환효율을 향상시켜, 도금용액을 가열하는 효율을 극대화할 수 있는 것이다.The heater accommodating portion 241 having this structure has a larger heat exchange area due to the wing portion 241-1, thereby improving the effect of heating the plating solution (S) and allowing the circulating plating solution (S) to pass through the through hole. By circulating through , the heat exchange efficiency can be further improved and the efficiency of heating the plating solution can be maximized.

이하의 실시 예에서는 필터의 구체적 구성에 관하여 설명한다.In the following embodiments, the specific configuration of the filter will be described.

도 7은 필터 자동교환수단의 설치상태도, 도 8은 필터 자동교환수단의 단면도 및 회전카트리지의 확대평면도이다.Figure 7 is an installation state diagram of the automatic filter exchange means, and Figure 8 is a cross-sectional view of the automatic filter exchange means and an enlarged plan view of the rotating cartridge.

도시된 바와 같이 필터(F)는 자동교환수단을 구비하고 있으며, 케이스(310), 회전카트리지(320), 제1센서(S1), 제2센서(S2), 제어부, 회전모터를 포함하고 있다.As shown, the filter (F) is equipped with an automatic exchange means and includes a case 310, a rotating cartridge 320, a first sensor (S1), a second sensor (S2), a control unit, and a rotating motor. .

케이스(310)는, 중공의 원통모양을 하고 있으며, 상부면과 하부면으로는 도금용액배출관(222)이 관통되어 구비된다.The case 310 has a hollow cylindrical shape, and has a plating solution discharge pipe 222 penetrating its upper and lower surfaces.

제1센서(S1)는, 케이스(310) 상부의 도금용액배출관(222)에 구비되어, 도금용액배출관(222) 내의 압력을 측정하여 제어부로 송신한다.The first sensor S1 is provided in the plating solution discharge pipe 222 at the top of the case 310, measures the pressure in the plating solution discharge pipe 222, and transmits it to the control unit.

제2센서(S2)는, 케이스(310) 하부의 도금용액배출관(222)에 구비되어, 도금용액배출관(222) 내의 압력을 측정하여 제어부로 송신한다.The second sensor S2 is provided in the plating solution discharge pipe 222 at the bottom of the case 310, measures the pressure in the plating solution discharge pipe 222, and transmits it to the control unit.

회전카트리지(320)는, 케이스(310) 내의 도금용액배출관(222)의 일정구간에 설치되며, 회전카트리지(320)의 중심을 기준으로 외곽의 원주방향에 다수의 여과망(321)이 등간격으로 구비되어 있고, 일측면은 회전모터와 연결되어 있어, 회전모터의 구동에 의하여 회전한다.The rotating cartridge 320 is installed in a certain section of the plating solution discharge pipe 222 in the case 310, and a plurality of filter nets 321 are arranged at equal intervals in the circumferential direction of the outer circumference based on the center of the rotating cartridge 320. It is provided, and one side is connected to a rotation motor, so it rotates by being driven by the rotation motor.

상기 회전모터의 축과 연동하여 회전카트리지(320)가 회전하는 구성은 일반적으로 상용되는 벨트전동, 기어전동 등이 채택되는 것이므로, 여기에서는 그 구체적인 구성의 연동관계에 관한 설명은 생략한다.Since the configuration in which the rotary cartridge 320 rotates in conjunction with the axis of the rotary motor adopts commonly used belt transmission, gear transmission, etc., a description of the linkage relationship of the specific configuration is omitted here.

제어부는, 제1센서(S1) 및 제2센서(S2)의 압력 측정치를 수신하여, 압력을 비교하며, 제1센서(S1)에서 측정된 압력치가 제2센서(S2)에서 측정된 압력치보다 높고, 그 차이가 제어부에 기설정되어 내장된 압력치 보다 높으면 필터의 여과망(321)이 이물질에 의하여 막힌 것으로 판단하고, 회전모터를 구동시켜, 회전카트리지(320)를 회전시킴으로서, 회전카트리지(320)의 여과망(321)을 새로운 것으로 교체한다.The control unit receives pressure measurements from the first sensor (S1) and the second sensor (S2), compares the pressure, and the pressure value measured by the first sensor (S1) is the pressure value measured by the second sensor (S2). If it is higher than the pressure value preset in the control unit and the difference is higher than the built-in pressure value, it is determined that the filter net 321 is blocked by foreign matter, and the rotary motor is driven to rotate the rotary cartridge 320, thereby rotating the rotary cartridge ( Replace the filter net (321) of 320) with a new one.

이상과 같은 필터(F)는, 이물질에 의하여 여과망(321)이 막히면, 제어부가 회전카트리지(320)를 회전시켜, 새로운 여과망(321)으로 자동으로 교체할 수 있는 작용, 효과가 있는 것이다.The filter (F) as described above has the function and effect of allowing the control unit to rotate the rotating cartridge 320 to automatically replace the filter net 321 with a new filter net 321 when the filter net 321 is clogged by foreign substances.

200:무전해 니켈 도금장치 210:자기장발생부
220:도금탱크 221:도금액 유입관
222:도금액 배출관 230:턴테이블
231:회전축 240a:하측히터
240b:상측히터 241:히터수용부
241-1:날개부 242:히터본체
242-1:법랑유약층 242-2:금속재발열관
242-3:마그네슘분말 242-4:열선
243:슬리브 250:초음파진동자
310:케이스 320:회전카트리지
321:여과망
M:BLDC모터 F:필터
S:도금용액 P:가압펌프
S1:제1센서 S2:제2센서200: Electroless nickel plating device 210: Magnetic field generator
220: Plating tank 221: Plating solution inlet pipe
222: Plating solution discharge pipe 230: Turntable
231: Rotating shaft 240a: Lower heater
240b: Upper heater 241: Heater receiving part
241-1: Wing 242: Heater main body
242-1: Enamel glaze layer 242-2: Metal reheating tube
242-3: Magnesium powder 242-4: Heating wire
243: Sleeve 250: Ultrasonic vibrator
310: Case 320: Rotating cartridge
321: Filter net
M: BLDC motor F: Filter
S: Plating solution P: Pressurization pump
S1: 1st sensor S2: 2nd sensor

Claims (6)

육면체의 박스 형상이고, 내부에는 니켈 등의 금속이온이 포함된 도금용액(S)이 수용되며, 상단 일측에는 도금용액 유입관(221)이 형성되고, 하단 타측에는 도금용액 배출관(222)이 형성된 도금탱크(220),
도금용액 유입관(221)에 설치되며, 도금용액(S)을 도금탱크(220)의 내부로 공급하면서, 도금탱크(220) 내부의 도금용액(S)을 가압하는 가압펌프(P),
도금용액 배출관(222)에 설치되며, 도금용액(S)에 포함되어 있는 이물질을 제거하는 필터(F),
도금탱크(220)의 중앙부에 설치되며, 하면에 연결된 회전축(231) 및 도금탱크(220)를 관통하는 회전축(231)의 단부에 설치된 BLDC모터(M)와 연결된 턴테이블(230)을 포함하며,
도금탱크(220)의 내부 저면에 초음파진동자(250)가 더 구비되고,
도금탱크(220)의 내측면에 마주보는 방향으로 구비되며, 상측히터(240b)는 하측히터(240a) 보다 높은 위치에 설치되고,
도금탱크(220)의 상측 외부에 구비된 자기장발생부(210) 및 도금탱크(220) 내의 압력을 계측하여 외부에서 사용자가 인식할 수 있도록 표출하는 압력계가 더 구비되며,
턴테이블(230)의 상면에는 비금속재질의 망체(232)가 구비되고,
상,하측히터(240b,240a)는,
일측은 폐쇄되고 일측은 개구된 원통형 구조의 히터수용부(241)와, 히터수용부(241)에 삽입된 형상으로 구비된 히터본체(242)를 포함하되;
히터본체(242)는,
히터본체(242)의 내부 중앙에 구비된 열선(242-4)과,
열선(242-4)을 감싸는 형상으로 구비되며, 열선(242-4)의 열을 전달하면서, 전기적으로 절연되어 감전이나 누전되는 것을 방지하는 마그네슘분말(242-3)과,
마그네슘분말(242-3)을 감싸는 원통의 형상으로 구비된 금속재발열관(242-2)과,
금속재발열관(242-2)의 표면에 피복된 법랑유약층(242-1)으로 이루어지며,
히터수용부(241)는, 외표면에 날개부(241-1)가 형성되고, 날개부(241-1)에는 관통공이 형성되고,
필터 자동교환수단이 구비되되;
필터 자동교환수단은,
중공의 원통모양이며, 상부면과 하부면으로는 도금용액배출관(222)이 관통되어 구비된 케이스(310)와,
케이스(310) 상부의 도금용액배출관(222)에 구비되어, 도금용액배출관(222) 내의 압력을 측정하여 제어부로 송신하는 제1센서(S1)와,
케이스(310) 하부의 도금용액배출관(222)에 구비되어, 도금용액배출관(222) 내의 압력을 측정하여 제어부로 송신하는 제2센서(S2)와,
케이스(310) 내의 도금용액배출관(222)에 설치되며, 중심을 기준으로 외곽의 원주방향에 다수의 여과망(321)이 등간격으로 구비되고, 일측면은 회전모터와 연결된 회전카트리지(320)를 포함하며,
제어부는, 제1센서(S1) 및 제2센서(S2)의 압력 측정치를 수신하여, 압력을 비교하며, 제1센서(S1)에서 측정된 압력치가 제2센서(S2)에서 측정된 압력치보다 높고, 그 차이가 제어부에 기설정되어 내장된 압력치 보다 높으면 필터의 여과망(321)이 이물질에 의하여 막힌 것으로 판단하고, 회전모터를 구동시켜, 회전카트리지(320)를 회전시킴으로서, 회전카트리지(320)의 여과망(321)을 새로운 것으로 교체하도록 제어하는 것을 특징으로 하는 무전해 니켈 도금장치.It has a hexahedral box shape, and inside it contains a plating solution (S) containing metal ions such as nickel. A plating solution inlet pipe 221 is formed on one side of the upper side, and a plating solution discharge pipe 222 is formed on the other side of the lower side. Plating tank (220),
A pressure pump (P) installed in the plating solution inlet pipe 221 and supplying the plating solution (S) into the plating tank (220) while pressurizing the plating solution (S) inside the plating tank (220),
A filter (F) installed in the plating solution discharge pipe 222, which removes foreign substances contained in the plating solution (S),
It is installed in the center of the plating tank 220 and includes a turntable 230 connected to a rotation shaft 231 connected to the lower surface and a BLDC motor (M) installed at the end of the rotation shaft 231 penetrating the plating tank 220,
An ultrasonic vibrator 250 is further provided on the inner bottom of the plating tank 220,
It is provided in a direction facing the inner surface of the plating tank 220, and the upper heater (240b) is installed at a higher position than the lower heater (240a),
A magnetic field generator 210 provided outside the upper side of the plating tank 220 and a pressure gauge that measures the pressure inside the plating tank 220 and displays it so that the user can recognize it from the outside are further provided,
A mesh 232 made of non-metallic material is provided on the upper surface of the turntable 230,
The upper and lower heaters (240b, 240a) are,
It includes a heater accommodating part 241 of a cylindrical structure with one side closed and one side open, and a heater main body 242 provided in a shape inserted into the heater accommodating part 241;
The heater body 242 is,
A heating wire (242-4) provided at the inner center of the heater main body (242),
Magnesium powder 242-3, which is provided in a shape to surround the heating wire 242-4 and transmits the heat of the heating wire 242-4 while being electrically insulated to prevent electric shock or short circuit,
A metal reheating tube (242-2) provided in the shape of a cylinder surrounding the magnesium powder (242-3),
It consists of an enamel glaze layer (242-1) coated on the surface of the metal reheating tube (242-2),
The heater receiving portion 241 has a wing portion 241-1 formed on the outer surface, and a through hole is formed in the wing portion 241-1,
A means for automatically changing filters is provided;
The automatic filter replacement means is,
A case 310 that has a hollow cylindrical shape and has a plating solution discharge pipe 222 penetrating its upper and lower surfaces,
A first sensor (S1) provided in the plating solution discharge pipe 222 at the top of the case 310, which measures the pressure in the plating solution discharge pipe 222 and transmits it to the control unit,
A second sensor (S2) provided in the plating solution discharge pipe 222 at the bottom of the case 310, which measures the pressure in the plating solution discharge pipe 222 and transmits it to the control unit,
It is installed in the plating solution discharge pipe 222 in the case 310, and is provided with a plurality of filter nets 321 at equal intervals in the circumferential direction of the outer side based on the center, and one side has a rotating cartridge 320 connected to a rotating motor. Includes,
The control unit receives pressure measurements from the first sensor (S1) and the second sensor (S2), compares the pressure, and the pressure value measured by the first sensor (S1) is the pressure value measured by the second sensor (S2). If it is higher than the pressure value preset in the control unit and the difference is higher than the built-in pressure value, it is determined that the filter net 321 is blocked by foreign matter, and the rotary motor is driven to rotate the rotary cartridge 320, thereby rotating the rotary cartridge ( An electroless nickel plating device, characterized in that control to replace the filter net 321 of 320) with a new one. 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019039038A (en) * 2017-08-24 2019-03-14 株式会社Ｓｃｒｅｅｎホールディングス Substrate treatment apparatus
JP2019214776A (en) * 2018-06-13 2019-12-19 株式会社Ｓｃｒｅｅｎホールディングス Electroless plating method, electroless plating apparatus and program

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000020779U (en) * 1999-05-13 2000-12-15 이칠상 A heater of withstanding salt and acidity
KR20090053204A (en) * 2007-11-22 2009-05-27 삼성전기주식회사 Apparatus for plating
KR20100009752A (en) * 2008-07-21 2010-01-29 삼성전자주식회사 Apparatus for treating electroless plating method using magnetic field of treating electroless plating using magnetic field and apparatus for treating electroless plating
KR101362083B1 (en) 2012-12-21 2014-02-14 주식회사 심텍 Dual mesh type electro-chemical plating apparatus and electro-chemical plating method of printed circuit board using the same
CN112740367A (en) * 2018-09-27 2021-04-30 东京毅力科创株式会社 Substrate processing apparatus and substrate processing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019039038A (en) * 2017-08-24 2019-03-14 株式会社Ｓｃｒｅｅｎホールディングス Substrate treatment apparatus
JP2019214776A (en) * 2018-06-13 2019-12-19 株式会社Ｓｃｒｅｅｎホールディングス Electroless plating method, electroless plating apparatus and program

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