KR102496596B1 - Aluminized sealing adhesive film with excellent barrier properties and organic light emitting diode including thereof - Google Patents

Aluminized sealing adhesive film with excellent barrier properties and organic light emitting diode including thereof Download PDF

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KR102496596B1
KR102496596B1 KR1020200160320A KR20200160320A KR102496596B1 KR 102496596 B1 KR102496596 B1 KR 102496596B1 KR 1020200160320 A KR1020200160320 A KR 1020200160320A KR 20200160320 A KR20200160320 A KR 20200160320A KR 102496596 B1 KR102496596 B1 KR 102496596B1
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adhesive film
oxide
encapsulation
film
release film
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KR20220072566A (en
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김도형
김태경
노승훈
이규완
도상길
박영돈
오민호
김헌정
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엘지디스플레이 주식회사
율촌화학 주식회사
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)

Abstract

본 명세서에는 배리어성이 우수한 알루미늄을 이용한 봉지 접착 필름 및 이를 포함하는 유기발광다이오드가 개시된다.Disclosed herein is an encapsulation adhesive film using aluminum having excellent barrier properties and an organic light emitting diode including the same.

Description

배리어성이 우수한 알루미늄을 이용한 봉지 접착 필름 및 이를 포함하는 유기발광다이오드 {ALUMINIZED SEALING ADHESIVE FILM WITH EXCELLENT BARRIER PROPERTIES AND ORGANIC LIGHT EMITTING DIODE INCLUDING THEREOF}Encapsulation adhesive film using aluminum with excellent barrier properties and organic light emitting diode including the same

본 명세서는 배리어성이 우수한 알루미늄을 이용한 봉지 접착 필름 및 이를 포함하는 유기발광다이오드에 관한 것이다.The present specification relates to an encapsulating adhesive film using aluminum having excellent barrier properties and an organic light emitting diode including the same.

현재 상용화된 OLED 디스플레이는 LCD 등 기존의 디스플레이와 비교해, 자체발광으로 인한 단순한 구조로 패널수가 절반가량 적다는 장점과 함께 자연색에 가까운 색상과 높은 명암비, 소비전력 감소 등 다양한 장점이 있어, LCD에서 OLED로 시장의 니즈가 옮겨가고 있다.Compared to existing displays such as LCD, the currently commercialized OLED display has the advantage of having a simple structure due to self-luminescence and reducing the number of panels by about half, as well as various advantages such as colors close to natural colors, high contrast ratio, and reduced power consumption. market needs are shifting.

그러나 OLED는 수분, 가스에 취약한 치명적인 문제점이 있어, 이를 극복하기 위한 다양한 봉지 기술이 개발되어 왔다. TV 등 대형 디스플레이에는 박막봉지를 위한 금속 박형 Barrier Layer와 패널을 부착하고 있으며, 패널 내에 발생하는 수분과 가스의 제거를 위한 OLED用 Encapsulation접착 필름이 필수적이다. However, OLED has a fatal problem of being vulnerable to moisture and gas, and various encapsulation technologies have been developed to overcome this problem. A thin metal barrier layer for thin film encapsulation and panels are attached to large displays such as TVs, and an encapsulation adhesive film for OLED is essential to remove moisture and gas generated in the panel.

봉지 접착 필름은 한 면에 금속 기재, 다른 면에 OLED패널과 합착되기 전까지, 양면에 PET와 같은 이형필름으로 보호되어 있다. 이때, OLED패널과 합착될 때 제거되는 이형필름의 경우, 일반적인 실리콘이 처리된 PET 이형 필름은 수분차단성능이 미미하다. The encapsulation adhesive film is protected with a release film such as PET on both sides until it is bonded to the metal substrate on one side and the OLED panel on the other side. At this time, in the case of a release film that is removed when bonded to an OLED panel, a PET release film treated with general silicone has insignificant water barrier performance.

따라서, 밀착력이 우수하면서도 수분을 충분히 제거할 수 있는 필름의 개발이 요구되고 있다. Therefore, there is a demand for the development of a film capable of sufficiently removing moisture while having excellent adhesion.

WO2013125874A1WO2013125874A1

본 명세서는 OLED패널을 봉지하기 전까지 보관, 이송 과정에서 발생할 수 있는 수분침투 문제를 해결하고자 한다. This specification aims to solve the moisture penetration problem that may occur during the storage and transportation process until the OLED panel is sealed.

본 발명의 예시적인 구현예들에서는, 금속 기재; 상기 금속 기재 상에 위치한 접착 필름; 상기 봉지 접착 필름 상에 위치한 이형 필름; 및 상기 이형 필름 상에 라미네이트된 알루미늄 포일(Aluminum foil)층;을 포함하는, 봉지 접착 필름을 제공한다. In exemplary embodiments of the present invention, a metal substrate; an adhesive film positioned on the metal substrate; a release film positioned on the encapsulation adhesive film; and an aluminum foil layer laminated on the release film.

본 발명의 예시적인 구현예들에서는, 기판; 기판 상에 형성된 OLED 패널; 및 상기 OLED 패널 전면을 봉지하는 전술한 봉지 접착 필름을 포함하는 유기발광다이오드(Organic Light Emitting Diode)를 제공한다. In exemplary embodiments of the present invention, a substrate; an OLED panel formed on a substrate; And it provides an organic light emitting diode (Organic Light Emitting Diode) including the above-described encapsulation adhesive film for encapsulating the front surface of the OLED panel.

본 발명의 일 측면에서, OLED패널과 합착될 때 제거되는 PET 이형필름에 Aluminized 복합 이형필름을 적용하여, 취급시와 패널 부착시의 수분 침투를 방지하여 높은 제품 신뢰성 확보가 가능하다.In one aspect of the present invention, by applying an aluminized composite release film to a PET release film that is removed when bonded to an OLED panel, it is possible to prevent moisture penetration during handling and panel attachment, thereby ensuring high product reliability.

본 발명의 다른 일 측면에서, Aluminized 복합 이형필름을 증착이 아닌 부착 또는 라미네이트로 형성하여, 수분방지와 신뢰성 면에서 우수한 봉지 접착 필름을 제공하고자 한다. In another aspect of the present invention, it is intended to provide an encapsulant adhesive film excellent in moisture resistance and reliability by forming an aluminized composite release film by adhesion or lamination rather than deposition.

도 1은 본 발명의 일 구현예에 따른 봉지 접착 필름의 구조도이다.
도 2은 종래(비교예 1)의 봉지 접착 필름의 구조도이다.
도 3은 비교예 2의 봉지 접착 필름의 구조도이다. 1 is a structural diagram of an adhesive film for encapsulation according to an embodiment of the present invention.
2 is a structural diagram of a conventional (comparative example 1) sealing adhesive film.
Figure 3 is a structural diagram of the sealing adhesive film of Comparative Example 2.

본 명세서에서, 어떤 부분이 어떤 구성 요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성 요소를 제외하는 것이 아니라 다른 구성 요소를 더 포함할 수 있는 것을 의미한다.In this specification, when a certain component is said to "include", it means that it may further include other components, not excluding other components unless otherwise stated.

이하, 본 발명의 예시적인 구현예들을 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention are described in detail.

도 1은 본 발명의 일 구현예에 따른 봉지 접착 필름의 구조도이다. 1 is a structural diagram of an adhesive film for encapsulation according to an embodiment of the present invention.

본 발명의 예시적인 구현예들에서는, 금속 기재(10); 상기 금속 기재 상에 위치한 접착 필름(20); 상기 접착 필름 상에 위치한 이형 필름(30); 및 상기 이형 필름 상에 라미네이트된 알루미늄 포일(Aluminum foil)층(40);을 포함하는, 봉지 접착 필름을 제공한다.In exemplary embodiments of the present invention, the metal substrate 10; an adhesive film 20 positioned on the metal substrate; a release film (30) positioned on the adhesive film; and an aluminum foil layer 40 laminated on the release film.

OLED 봉지 접착필름은 제조 후 양면 이형필름으로 보호되어 있으며, 금속 Barrier 기재와 합착된 후에도, 수분방지를 위해 알루미늄 파우치 형태의 포장재 안에 진공 포장되는 등 엄격한 관리가 필요하다. The OLED encapsulation adhesive film is protected with a double-sided release film after manufacturing, and even after bonding with the metal barrier substrate, strict management is required, such as being vacuum-packed in an aluminum pouch-type packaging material to prevent moisture.

본 발명의 일 구현예에 따르면, OLED 패널과 만나는 면인 이형필름을 Aluminized 이형필름(이형 필름 상에 라미네이트된 알루미늄 포일층)으로 대체함으로써 수분 침투 방지 효과를 더 극대화할 수 있다.According to one embodiment of the present invention, the effect of preventing moisture penetration can be further maximized by replacing the release film, which is the surface that meets the OLED panel, with an aluminized release film (an aluminum foil layer laminated on the release film).

예시적인 구현예에서, 상기 금속 기재는 금속, 산화금속, 질화금속, 탄화금속, 옥시질화금속, 및 옥시붕화금속으로 이루어진 군에서 선택되는 하나 이상을 포함할 수 있다. In an exemplary embodiment, the metal substrate may include one or more selected from the group consisting of metal, metal oxide, metal nitride, metal carbide, metal oxynitride, and metal oxyboride.

예시적인 구현예에서, 상기 금속 기재는 알루미늄, 구리, 니켈, 및 인바-니켈합금(Invar : Nikel-Alloy), 산화실리콘, 산화알루미늄, 산화티타늄, 산화인듐, 산화주석, 산화주석인듐, 산화탄탈룸, 산화지르코늄, 및 산화니오븀으로 이루어진 군에서 선택되는 하나 이상을 포함할 수 있고, 금속 기재로 비정질 금속(Amrphous metal)을 적용할 수도 있다. (Fe-Si-B, Fe-Si-B-Cr, Co-Fe-Ni-Si-B-Mo, Co-Fe-Ni-Si-B, Ni-Fe-Mo-B, Ni-Cr-Fe-Si-B 등)In an exemplary embodiment, the metal substrate is aluminum, copper, nickel, and invar-nickel alloy (Invar: Nikel-Alloy), silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, and tantalum oxide. , zirconium oxide, and at least one selected from the group consisting of niobium oxide, and an amorphous metal may be applied as the metal substrate. (Fe-Si-B, Fe-Si-B-Cr, Co-Fe-Ni-Si-B-Mo, Co-Fe-Ni-Si-B, Ni-Fe-Mo-B, Ni-Cr-Fe -Si-B, etc.)

예컨대 금속 기재로 인바-니켈합금(Invar : Nikel-Alloy)을 60~100um 의 두께로 사용할 수 있다. For example, an invar-nickel alloy (Invar: Nikel-Alloy) may be used as a metal substrate in a thickness of 60 to 100 um.

예시적인 구현예에서, 상기 접착 필름은 단일층 또는 2 이상의 층으로 이루어질 수 있다. In an exemplary embodiment, the adhesive film may be formed of a single layer or two or more layers.

예시적인 구현예에서, 상기 접착 필름은 점착부여제; 폴리올레핀계 바인더, 아크릴 모노머, 광개시제 및 흡습제로 이루어지는 군에서 선택되는 하나 이상을 포함할 수 있다. In an exemplary embodiment, the adhesive film may include a tackifier; It may include at least one selected from the group consisting of a polyolefin-based binder, an acrylic monomer, a photoinitiator, and a moisture absorbent.

일 구현예에서, 상기 폴리올레핀계 바인더는 당업계에 공지된 일반적인 폴리올레핀계 바인더는 모두 해당될 수 있다. 또한 상기 폴리올레핀계 수지는 폴리에틸렌계 수지 또는 폴리프로필렌계 수지일 수 있으며, 변성 폴리에틸렌 수지, 변성 폴리프로필렌계 수지, 에틸렌 공중합체 또는 프로필렌 공중합체일 수 있으며, 예컨대, 내수분성이 좋고, 가격이 저렴한 가소성 폴리올레핀(TPO), 폴리올레핀 엘라스토머(POE)를 사용할 수 있고, 바람직하게는 EPDM 또는 Butyl Rubber일 수 있다.In one embodiment, the polyolefin-based binder may correspond to all general polyolefin-based binders known in the art. In addition, the polyolefin-based resin may be a polyethylene-based resin or a polypropylene-based resin, and may be a modified polyethylene resin, a modified polypropylene-based resin, an ethylene copolymer, or a propylene copolymer. Polyolefin (TPO) or polyolefin elastomer (POE) may be used, and preferably EPDM or Butyl Rubber.

일 구현예에서, 상기 아크릴 모노머는 아크릴레이트계 모노머 또는 메타크릴레이트계 모노머일 수 있고, 예컨대, 디메틸아미노에틸메타크릴레이트, 디에틸아미노에틸메타크릴레이트, 디메틸아미노에틸아크릴레이트, t-부틸아미노에틸메타크릴레이트일 수 있다. 예컨대, 3관능기 이상의 아크릴 모너머로서 Tricyclodecane dimethanol diacrylate (관용명 TCDDA)를 사용할 수 있다. In one embodiment, the acrylic monomer may be an acrylate-based monomer or a methacrylate-based monomer, for example, dimethylaminoethyl methacrylate, diethylaminoethyl methacrylate, dimethylaminoethyl acrylate, t-butylamino It may be ethyl methacrylate. For example, tricyclodecane dimethanol diacrylate (common name TCDDA) may be used as an acrylic monomer having a trifunctional group or higher.

일 구현예에서, 상기 광개시제는 일반적인 300~400nm 파장대역에서 사용 가능한 광개시제는 사용 가능하며, 예컨대, 벤조인메틸에테르, 2,4,6-트리메틸벤조일 디페닐포스핀옥사이드, 비스(2,4,6-트리메틸벤조일) 페닐포스핀옥사이드, α,α-메톡시-α-하이드록시아세토페논, 2-벤조일-2-(디메틸아미노)-1-[4-(4-몰포닐) 페닐]-1-부타논, 2,2-디메톡시-2-페닐아세토페논, 옥심에스터계 등으로 이루어진 군으로부터 선택된 하나 이상을 포함할 수 있다. 예시적인 구현예에서, 상기 흡습제는 금속 산화물을 포함할 수 있다. In one embodiment, the photoinitiator can be used in the general 300 ~ 400nm wavelength band, for example, benzoin methyl ether, 2,4,6-trimethylbenzoyl diphenylphosphine oxide, bis (2,4, 6-trimethylbenzoyl) phenylphosphine oxide, α,α-methoxy-α-hydroxyacetophenone, 2-benzoyl-2-(dimethylamino)-1-[4-(4-morphonyl)phenyl]-1 -It may include at least one selected from the group consisting of butanone, 2,2-dimethoxy-2-phenylacetophenone, oxime esters, and the like. In an exemplary embodiment, the moisture absorbent may include a metal oxide.

또한, 예컨대 1-Hydroxy-cyclohexyl-phenyl-ketone나 Bis(2,4,6-trimethylbenzoyl)-phenylphosphineoxide를 사용할 수 있으며, 바람직하게는 Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide(관용명 TPO)를 사용할 수 있다. In addition, for example, 1-Hydroxy-cyclohexyl-phenyl-ketone or Bis (2,4,6-trimethylbenzoyl) -phenylphosphineoxide can be used, preferably diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide (common name TPO). can be used

예시적인 구현예에서, 상기 흡습제는 산화리튬(Li2O), 산화나트륨(Na2O), 산화칼륨(K2O) 산화바륨(BaO), 산화칼슘(CaO), 및 산화마그네슘(MgO)로 이루어진 군에서 선택되는 하나 이상을 포함할 수 있다.In an exemplary embodiment, the desiccant may be lithium oxide (Li 2 O), sodium oxide (Na 2 O), potassium oxide (K 2 O), barium oxide (BaO), calcium oxide (CaO), and magnesium oxide (MgO). It may include one or more selected from the group consisting of.

예시적인 구현예에서, 상기 이형 필름은 폴리에틸렌테레프탈레이트(PET; polyethyleneterephthalate), 폴리에틸렌(PE; Polyethylene), 폴리프로필렌(PP; Polypropylene), 폴리카보네이트(PC; polycarbonate), 폴리메틸메타크릴레이트(PMMA; Poly(methyl methacrylate)), 폴리이미드(PI; polyimide), 연신폴리프로필렌(OPP; Oriented Polypropylene), 이축연신폴리프로필렌(BOPP; Biaxially oriented Polypropylene), 폴리에틸렌 2,6-디카르복실 나프탈레이트(PEN; Polyethylene 2,6-dicarboxyl naphthalate), 폴리에테르설폰(PES; polyethersulfone), 폴리에스테르(Polyester) 및 폴리스티렌(PS; Polystyrene)로 이루어진 군에서 선택되는 하나 이상을 포함할 수 있다. In an exemplary embodiment, the release film is polyethyleneterephthalate (PET), polyethylene (PE), polypropylene (PP), polycarbonate (PC), polymethyl methacrylate (PMMA; Poly(methyl methacrylate)), polyimide (PI; polyimide), oriented polypropylene (OPP), biaxially oriented polypropylene (BOPP), polyethylene 2,6-dicarboxyl naphthalate (PEN; It may include at least one selected from the group consisting of polyethylene 2,6-dicarboxyl naphthalate), polyethersulfone (PES), polyester, and polystyrene (PS).

일반적인 실리콘이 처리된 PET와 같은 이형 필름은 수분차단성능이 미미하여, Aluminum foil 등 Barrier Layer를 적용한 경우 WVTR 성능이 크게 향상될 수 있다. Release films such as PET treated with general silicone have minimal water barrier performance, so when a barrier layer such as aluminum foil is applied, WVTR performance can be greatly improved.

Barrier Layer로는 자체 투습방지 성능이 높은 필름(PCTFE등)을 적용하는 경우, 증착(금속, 세라믹, 유기물 등), 코팅(PVDC, nano clay등), 금속 foil 라미네이션, 다층 필름압출 등 다양한 방법이 있으나, 본 명세서에서는 적용성, 신뢰성, 경제성을 고려하여 알루미늄 포일(Aluminum foil)을 라미네이션(부착)한 구조를 적용한 것이다. As a barrier layer, there are various methods such as applying a film (PCTFE, etc.) with high moisture permeability prevention performance, deposition (metal, ceramic, organic material, etc.), coating (PVDC, nano clay, etc.), metal foil lamination, and multi-layer film extrusion. , In this specification, a structure in which aluminum foil is laminated (attached) is applied in consideration of applicability, reliability, and economy.

예시적인 구현예에서, 상기 알루미늄 포일(Aluminum foil)층의 두께는 5 내지 40 μm일 수 있고, 바람직하게는 6~20 μm일 수 있다. 상기 두께가 6μm 미만일 경우 수분 Barrier 신뢰성이 저하되며, 두께 20μm 초과인 경우 이형필름 전체 두께가 증가되는 문제가 있다.In an exemplary embodiment, the thickness of the aluminum foil layer may be 5 to 40 μm, preferably 6 to 20 μm. When the thickness is less than 6 μm, the moisture barrier reliability is lowered, and when the thickness exceeds 20 μm, there is a problem in that the total thickness of the release film increases.

예시적인 구현예에서, 상기 봉지 접착 필름의 수분 투과도는 0.1 mg/m2·day 이하일 수 있고, 예컨대, 0.1 mg/m2·day 이하, 0.09 mg/m2·day 이하, 0.08 mg/m2·day 이하, 0.07 mg/m2·day 이하, 0.06 mg/m2·day 이하, 0.05 mg/m2·day 이하, 0.04 mg/m2·day 이하, 0.03 mg/m2·day 이하, 0.02 mg/m2·day 이하, 0.01 mg/m2·day 이하일 수 있다. 상기 수분 투과도는 낮을수록 좋으므로 특별히 제한되지 않으나, 0.0001 mg/m2·day 일 수 있다. In an exemplary embodiment, the water permeability of the encapsulant adhesive film may be 0.1 mg/m 2 · day or less, for example, 0.1 mg/m 2 · day or less, 0.09 mg/m 2 · day or less, 0.08 mg/m 2 day or less , 0.07 mg/m 2 day or less, 0.06 mg/m 2 day or less, 0.05 mg/m 2 day or less, 0.04 mg/m 2 day or less, 0.03 mg/m 2 day or less, 0.02 It may be mg/m 2· day or less, or 0.01 mg/m 2· day or less. The lower the water permeability, the better, so it is not particularly limited, but may be 0.0001 mg/m 2· day.

예시적인 구현예에서, 상기 봉지 접착 필름은 OLED용 봉지 접착 필름일 수 있다. In an exemplary embodiment, the adhesive encapsulation film may be an adhesive encapsulation film for OLED.

예시적인 구현예에서, 상기 라미네이트된 알루미늄 포일의 외면과 OLED 패널이 접촉할 수 있다. 전술한 바와 같이, OLED 패널과 만나는 면인 이형필름을 Aluminized 이형필름(이형 필름 상에 라미네이트된 알루미늄 포일층)으로 대체함으로써 수분 침투 방지 효과를 더 극대화할 수 있다.In an exemplary embodiment, the outer surface of the laminated aluminum foil may be in contact with the OLED panel. As described above, the effect of preventing moisture permeation can be further maximized by replacing the release film, which is the surface that meets the OLED panel, with an aluminized release film (an aluminum foil layer laminated on the release film).

본 발명의 또다른 예시적인 구현예들에서는, 기판; 기판 상에 형성된 OLED 패널; 및 상기 OLED 패널 전면을 봉지하는 전술한 봉지 접착 필름을 포함하는 유기발광다이오드(Organic Light Emitting Diode)를 제공한다.In still other exemplary embodiments of the present invention, a substrate; an OLED panel formed on a substrate; And it provides an organic light emitting diode (Organic Light Emitting Diode) including the above-described encapsulation adhesive film for encapsulating the front surface of the OLED panel.

상기 기판은 글래스(Glass)일 수 있다. The substrate may be glass.

이하, 본 발명의 예시적인 구현예들에 따른 구체적인 실시예를 더욱 상세하게 설명한다. 그러나 본 발명이 하기 실시예에 한정되는 것은 아니며 첨부된 특허청구범위 내에서 다양한 형태의 실시예들이 구현될 수 있고, 단지 하기 실시예는 본 발명의 개시가 완전하도록 함과 동시에 당 업계에서 통상의 지식을 가진 자에게 발명의 실시를 용이하게 하고자 하는 것임이 이해될 것이다.Hereinafter, specific embodiments according to exemplary embodiments of the present invention will be described in more detail. However, the present invention is not limited to the following examples, and various types of embodiments can be implemented within the scope of the appended claims, and only the following examples will make the disclosure of the present invention complete and at the same time common in the art. It will be understood that the intention is to facilitate practice of the invention to those skilled in the art.

실시예Example

동일한 조성물의 코팅용액을 코팅하고 보호필름의 종류를 달리하여, 기존의 실리콘 처리된 PET 이형필름(비교예 1), 실리콘 처리 반대면에 Aluminum 증착 처리를 한 PET 이형필름(비교예 2), 실리콘 처리 반대면에 Aluminum foil을 라미네이션(부착)한 PET 이형필름(실시예 1)으로 각각 보호필름을 적용하여 비교하였다.The coating solution of the same composition is coated and the type of protective film is different, the existing silicon-treated PET release film (Comparative Example 1), the PET release film with aluminum deposition treatment on the opposite side of the silicon treatment (Comparative Example 2), and the silicone-treated PET release film (Comparative Example 2). A PET release film (Example 1) in which aluminum foil was laminated (attached) on the opposite side of the treatment was applied to each protective film and compared.

실시예Example 1 One

A. 1번 코팅액 제조A. Preparation of coating solution No. 1

EPDM, Butyl Rubber, 점착부여제를 1:2:4로 섞은 용액에 0.5wt%의 아크릴 모너머와 아크릴 모너머 100wt% 대비 10wt%의 광개시제를 첨가하여 1번 코팅액을 제조하였다. 사용한 제품은 구체적으로 다음과 같다:Coating solution No. 1 was prepared by adding 0.5wt% of acrylic monomer and 10wt% of photoinitiator relative to 100wt% of acrylic monomer to a solution of EPDM, Butyl Rubber, and tackifier mixed in a ratio of 1:2:4. The products used were specifically:

-EPDM : ethylene norbornene 약 10wt% 함량의 High Diene 타입 제품-EPDM : High diene type product containing about 10wt% of ethylene norbornene

-Butyl Rubber : Isobutlyene과 Isoprene의 공중합체(30~55MU(무늬점도))-Butyl Rubber : Copolymer of Isobutlyene and Isoprene (30~55MU (pattern viscosity))

-점착부여제(Tackifier): 전기적인 극성이 낮은 Softening Point가 90℃ 및 100℃인 두 종류를 혼합-Tackifier: Mixing two types with low electrical polarity and softening points of 90℃ and 100℃

-아크릴 모너머: Tricyclodecane dimethanol diacrylate (관용명 TCDDA)-Acrylic monomer: Tricyclodecane dimethanol diacrylate (common name TCDDA)

-광개시제: Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide(관용명 TPO)-Photoinitiator: Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (common name TPO)

B. 2번 코팅액 제조B. Preparation of coating solution No. 2

CaO를 1번 코팅액과 1:1 섞어 2번 코팅액을 제조하였다.Coating solution No. 2 was prepared by mixing CaO with the coating solution No. 1 in a ratio of 1:1.

C. 필름 제조C. Film Manufacture

1번 코팅액을 Aluminum foil(40)/PET 이형필름(30) 위에 코팅하고, 2번 코팅액을 공정용 필름(금속 기재 부착시 제거)에 각각 코팅하여 코팅층 2종을 제조하고 두 코팅층을 라미네이션하여 봉지 접착필름을 제조하였다. Coating solution No. 1 is coated on the aluminum foil (40)/PET release film (30), and coating solution No. 2 is coated on the process film (removed when attaching the metal substrate) to prepare two types of coating layers, and the two coating layers are laminated to form an encapsulation An adhesive film was prepared.

이어서 2번 코팅층의 이형필름을 제거하면서, 금속 기재(10)를 봉지 접착필름(20)과 부착하였다. (도 1 참조) 금속 기재는 금속+니켈 합금(Fe-Ni 합금; Invar)을 60~100um의 두께로 사용하였다. Subsequently, the metal substrate 10 was attached to the encapsulation adhesive film 20 while removing the release film of the second coating layer. (See FIG. 1 ) As the metal substrate, a metal + nickel alloy (Fe-Ni alloy; Invar) was used with a thickness of 60 to 100 um.

비교예comparative example 1 One

실시예 1의 C의 공정 시, 1번 코팅액의 이형필름을 일반적인 PET 이형필름으로 적용하고, 그 외 내용은 실시예와 동일하게 진행하였다. (도 2 참조)In the process of C of Example 1, the release film of coating liquid No. 1 was applied as a general PET release film, and other contents were carried out in the same manner as in Example. (See Fig. 2)

비교예comparative example 2 2

실시예 C의 공정 시, 1번 코팅액의 이형필름을 Aluminum 증착된 PET 이형필름(50)으로 적용하고, 그 외 내용은 실시예와 동일하게 진행하였다. (도 3 참조)In the process of Example C, the release film of coating liquid No. 1 was applied to the aluminum-deposited PET release film 50, and other details were carried out in the same manner as in Example. (See Fig. 3)

시험예test example

1. 이형필름의 1. Release film WVTRWVTR

이형필름 자체의 수분 차단 성능을 확인하기 위해, WVTR 장비중에 가장 공신력이 높고, 5x10-5 g/m2·day까지 정밀 측정이 가능한 Mocon社의 Aquatran-2 장비로 수분투과도 (water vapor transmission rate, WVTR)을 분석하여, 하기 표 1에 나타내었다. In order to check the moisture blocking performance of the release film itself, Mocon's Aquatran-2 equipment, which has the highest public confidence among WVTR equipment and can accurately measure up to 5x10 -5 g/m 2 day, measures the water vapor transmission rate (water vapor transmission rate, WVTR) was analyzed and shown in Table 1 below.

2. 이형필름을 부착한 봉지 접착필름의 가속수명 평가2. Evaluation of accelerated life of encapsulation adhesive film attached with release film

금속 기재가 부착된 봉지 접착필름을 온도 85℃, 습도 85%의 신뢰성 챔버에 방치한 후 96시간까지 방치 한 후, 이형필름 방향 외면의 이상유무를 육안으로 관찰하였다. 특이한 문제가 없는 경우부터 외면의 이상이 심각한 경우의 정도를 양호(◎), 문제점 발생(△), 문제 심각(X)으로 구분하여, 하기 표 1에 나타내었다. The encapsulation adhesive film attached with the metal substrate was left in a reliability chamber at a temperature of 85 ° C and a humidity of 85%, and then left for up to 96 hours, and then the presence or absence of abnormalities on the outer surface of the release film was visually observed. The degree of severe external abnormality from no specific problem was classified into good (◎), problem occurrence (Δ), and serious problem (X), and is shown in Table 1 below.

이형필름 타입 구분Type of release film 이형필름의 WVTR
(g/m2·day)Release film's WVTR
(g / m2 day) 가속수명평가
(온도 85℃/
습도 85%)Accelerated life evaluation
(Temperature 85℃/
Humidity 85%) 실시예 1Example 1 Aluminum foil(라미네이트)/PET 이형 filmAluminum foil (laminate)/PET release film 10-4~10-5 10 -4 to 10 -5 ◎◎ 비교예 1Comparative Example 1 PET 이형 filmPET release film 40~6040-60 XX 비교예 2Comparative Example 2 Aluminum 증착 PET 이형 filmAluminum vapor deposition PET release film 100~10-1 10 0 to 10 -1 △△

상기 표를 참조하면, 본 발명의 실시예 1의 경우 수분투과도가 비교예 1 또는 비교예 2와 비교하여 현저히 낮고, 가속수명평가에 있어서도 외면의 이상이 발생하지 않아 양호한 것을 확인할 수 있다. Referring to the above table, in the case of Example 1 of the present invention, the moisture permeability is significantly lower than that of Comparative Example 1 or Comparative Example 2, and it can be confirmed that the outer surface is not abnormal even in the accelerated life evaluation.

10: 금속 기재
20: 접착 필름
30: 이형 필름
40: 라미네이트된 알루미늄 포일
50: 알루미늄 증착 PET 필름10: metal substrate
20: adhesive film
30: release film
40: laminated aluminum foil
50: aluminum-deposited PET film

Claims (12)

금속 기재;
상기 금속 기재 상에 위치한 접착 필름;
상기 접착 필름 상에 위치한 이형 필름; 및
상기 이형 필름 상에 라미네이트된 알루미늄 포일(Aluminum foil)층;을 포함하며,
상기 알루미늄 포일층은 OLED 패널과 합착되며,
상기 금속 기재는 구리, 니켈, 인바-니켈합금(Invar : Nikel-Alloy), 산화실리콘, 산화알루미늄, 산화티타늄, 산화인듐, 산화주석, 산화주석인듐, 산화탄탈룸, 산화지르코늄 및 산화니오븀으로 이루어진 군에서 선택되는 하나 이상을 포함하는, 봉지 접착 필름. metal base;
an adhesive film positioned on the metal substrate;
a release film positioned on the adhesive film; and
Including; an aluminum foil layer laminated on the release film,
The aluminum foil layer is bonded to the OLED panel,
The metal substrate is a group consisting of copper, nickel, invar-nickel alloy (Invar: Nikel-Alloy), silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide and niobium oxide. Encapsulation adhesive film containing at least one selected from. 제1항에 있어서,
상기 접착 필름은 단일층 또는 2 이상의 층으로 이루어진, 봉지 접착 필름.According to claim 1,
The adhesive film is composed of a single layer or two or more layers, the sealing adhesive film. 제1항에 있어서,
상기 접착 필름은 점착부여제; 및 폴리올레핀계 바인더, 아크릴 모노머, 광개시제 및 흡습제로 이루어진 군에서 선택되는 하나 이상;을 포함하는, 봉지 접착 필름.According to claim 1,
The adhesive film may include a tackifier; And at least one selected from the group consisting of a polyolefin-based binder, an acrylic monomer, a photoinitiator, and a moisture absorbent; containing, the sealant adhesive film. 제3항에 있어서,
상기 흡습제는 산화리튬(Li2O), 산화나트륨(Na2O), 산화칼륨(K2O) 산화바륨(BaO), 산화칼슘(CaO) 및 산화마그네슘(MgO)으로 이루어진 군에서 선택되는 하나 이상을 포함하는, 봉지 접착 필름.According to claim 3,
The moisture absorbent is one selected from the group consisting of lithium oxide (Li 2 O), sodium oxide (Na 2 O), potassium oxide (K 2 O), barium oxide (BaO), calcium oxide (CaO) and magnesium oxide (MgO). The sealing adhesive film containing the above. 제1항에 있어서,
상기 이형 필름은 폴리에틸렌테레프탈레이트(PET; polyethyleneterephthalate), 폴리에틸렌(PE; Polyethylene), 폴리프로필렌(PP; Polypropylene), 폴리카보네이트(PC; polycarbonate), 폴리메틸메타크릴레이트(PMMA; Poly(methyl methacrylate)), 폴리이미드(PI; polyimide), 연신폴리프로필렌(OPP; Oriented Polypropylene), 이축연신폴리프로필렌(BOPP; Biaxially oriented Polypropylene), 폴리에틸렌 2,6-디카르복실 나프탈레이트(PEN; Polyethylene 2,6-dicarboxyl naphthalate), 폴리에테르설폰(PES; polyethersulfone), 폴리에스테르(Polyester) 및 폴리스티렌(PS; Polystyrene)으로 이루어진 군에서 선택되는 하나 이상을 포함하는, 봉지 접착 필름.According to claim 1,
The release film is polyethyleneterephthalate (PET), polyethylene (PE), polypropylene (PP), polycarbonate (PC), poly(methyl methacrylate) (PMMA) , polyimide (PI; polyimide), oriented polypropylene (OPP), biaxially oriented polypropylene (BOPP), polyethylene 2,6-dicarboxyl naphthalate (PEN; Naphthalate), polyethersulfone (PES; polyethersulfone), polyester (Polyester) and polystyrene (PS; Polystyrene) containing at least one selected from the group consisting of, the encapsulation adhesive film. 제1항에 있어서,
상기 알루미늄 포일(Aluminum foil)층의 두께는 5 내지 40 μm인, 봉지 접착 필름.According to claim 1,
The thickness of the aluminum foil layer is 5 to 40 μm, the sealing adhesive film. 제1항에 있어서,
상기 봉지 접착 필름의 수분 투과도는 0.1 mg/m2·day 이하인, 봉지 접착 필름.According to claim 1,
The water permeability of the encapsulation adhesive film is 0.1 mg / m 2 · day or less, the encapsulation adhesive film. 제1항에 있어서,
상기 봉지 접착 필름은 OLED용 봉지 접착 필름인, 봉지 접착 필름.According to claim 1,
The encapsulation adhesive film is an encapsulation adhesive film for OLED. 제8항에 있어서,
상기 라미네이트된 알루미늄 포일의 외면과 OLED 패널이 접촉하는 것인, 봉지 접착 필름. According to claim 8,
To which the outer surface of the laminated aluminum foil and the OLED panel are in contact, the encapsulation adhesive film. 기판; 기판 상에 형성된 OLED 패널; 및 상기 OLED 패널 전면을 봉지하는 제1항 내지 제9항 중 어느 한 항에 따른 봉지 접착 필름;을 포함하는 유기발광다이오드(Organic Light Emitting Diode).Board; an OLED panel formed on a substrate; And an organic light emitting diode (Organic Light Emitting Diode) comprising a; encapsulation adhesive film according to any one of claims 1 to 9 for encapsulating the front surface of the OLED panel. 삭제delete 삭제delete
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