KR102423795B1 - Chip-scale package structure and manufacturing method for moisture-sensitive high-gamut backlight applications - Google Patents

Chip-scale package structure and manufacturing method for moisture-sensitive high-gamut backlight applications Download PDF

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KR102423795B1
KR102423795B1 KR1020207018928A KR20207018928A KR102423795B1 KR 102423795 B1 KR102423795 B1 KR 102423795B1 KR 1020207018928 A KR1020207018928 A KR 1020207018928A KR 20207018928 A KR20207018928 A KR 20207018928A KR 102423795 B1 KR102423795 B1 KR 102423795B1
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adhesive film
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package
inorganic filler
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KR20210038838A (en
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잉 한
쇼화 탄
둥순 류
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테코어 신케이엠 인크
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
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    • C09J183/04—Polysiloxanes
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
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    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
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Abstract

본 발명은 습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 구조를 공개하였고, 이는 이중층 패키지 구조를 가지고 있고, 내층은 KSF 형광체 분말을 포함하는 형광 접착필름이고; 외층은 무기 필러를 포함하는 투명 접착필름이며, 먼저, LED 플립칩을 기판 위에 어레이시키고; KSF 형광체 분말을 포함하는 형광 접착필름을, 칩의 5면에 진공으로 등각 접착하고; 패키지의 외부 수직면을 따라 저부 필름을 절단하고; 절단된 패키지를 기판 위에 2차 어레이시키고; 미크론 크기의 무기 필러를 포함하는 유기 실리콘 투명 접착필름을, 절단된 패키지의 외면에 진공 라미네이트로 패키징하고, 마지막으로, 고체화시킨 후, 칩 스케일 패키지를 절단하는 단계를 포함한다. 본 발명은, 내습성, 경도, 열 전도성 및 광 감쇠 방지 성능이 훌륭하고, 고출력LED 기기에 사용될 수 있으며, CSP패키지 완제품의 전반적이 성능을 향상시킬 수 있다. The present invention discloses a chip-scale package structure for high-color gamut backlight applications sensitive to moisture, which has a double-layer package structure, and the inner layer is a fluorescent adhesive film containing KSF phosphor powder; The outer layer is a transparent adhesive film containing an inorganic filler, and first, an LED flip chip is arrayed on a substrate; A fluorescent adhesive film containing KSF phosphor powder was conformally adhered to 5 sides of the chip by vacuum; cut the bottom film along the outer vertical side of the package; secondly arraying the cut packages on the substrate; and packaging the organic silicon transparent adhesive film including micron-sized inorganic fillers as a vacuum laminate on the outer surface of the cut package, and finally, solidifying, and then cutting the chip scale package. The present invention has excellent moisture resistance, hardness, thermal conductivity and light attenuation prevention performance, can be used in high-power LED devices, and can improve the overall performance of CSP package finished products.

Description

습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 구조 및 제조방법Chip-scale package structure and manufacturing method for moisture-sensitive high-gamut backlight applications

본 발명은 백라이트 기술 영역에 관한 것으로, 특히 습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 구조 및 제조방법에 관한 것이다. BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to the field of backlight technology, and more particularly to a chip-scale package structure and manufacturing method for high color gamut backlight applications that are sensitive to moisture.

LED 플립칩 CSP(칩 스케일 패키지)의 제조기술이 성숙됨에 따라, CSP(칩 스케일 패키지)의 백색광 LED를 백라이트 발광 소자로 하는 TFT-LCD(박막 트랜지스터 액정 디스플레이)가 점차 주류가 되었고, 높은 색영역 디스플레이 효과를 위하여, 피크의 반값폭이 좁은 KSF 불화물 형광체 분말 및 β-사이알론(ß-SiAlON) 형광체 분말의 조성물을 LED 형광체 분말로 사용하였다. KSF계 형광체 분말은, 물과 만나면 화학반응으로 변질이 생기는데, 형광체 분말의 제조업체는 형광체 분말에 대하여 표면 패시베이션 처리를 수행하지만, 장기적인 안정성 요구에 있어서, 단순한 KSF 형광체 분말의 표면처리는 수분의 침입을 막지 못하는데, 즉, 일반적인 5면의 단층 패키지 구조는 KSF 형광체 분말을 보호하는 목적을 실현하지 못한다. 따라서, KSF를 포함하는 패키지 재료를 패키지 내층에 위치시키고, 물을 냉각 매체로 하는 절단공정을 패키지 제조 공정에서 배제시키는 구조적인 설계를 해야 한다. As the manufacturing technology of LED flip chip CSP (Chip Scale Package) matures, TFT-LCD (Thin Film Transistor Liquid Crystal Display) which uses white light LED of CSP (Chip Scale Package) as a backlight light emitting device has gradually become mainstream, and has a high color gamut. For the display effect, a composition of KSF fluoride phosphor powder and β-SiAlON phosphor powder having a narrow half-width of the peak was used as the LED phosphor powder. KSF-based phosphor powder undergoes a chemical reaction when it comes into contact with water. Manufacturers of phosphor powder perform a surface passivation treatment on the phosphor powder, but for long-term stability requirements, simple surface treatment of KSF phosphor powder prevents the penetration of moisture. In other words, the general 5-sided single-layer package structure does not realize the purpose of protecting the KSF phosphor powder. Therefore, it is necessary to place the package material including KSF in the inner layer of the package, and to design a structural design that excludes a cutting process using water as a cooling medium from the package manufacturing process.

통상적으로, 백라이트 애플리케이션은 중간 또는 고출력의 LED CSP를 사용하는데, 칩에서 방출되는 청색광이 형광체 분말을 여기시킬 때 많은 열을 발생하지만, 실리카겔의 낮은 열 전도율로, 일반적인 단층 접착필름으로 패캐징한 5면의 CSP를 고출력으로 점등할 때, 접착제에 균열이 발생하여 효과를 잃거나 색도 좌표가 변화하는 문제가 발생하므로, 패키지의 산열문제를 해결하여야 한다. 경도가 상대적으로 낮은 실리콘은, 패키지 표면이 쉽게 긁히고, 분류기의 동작 성능이 낮으므로, 패키지의 경도를 향상시켜야 한다. 따라서, 내습성, 고경도, 내열성을 가진 칩 스케일 패키지 LED를 개발하는 것이 매우 중요하다. Typically, backlight applications use medium or high power LED CSPs, which generate a lot of heat when the blue light emitted from the chip excites the phosphor powder, but with the low thermal conductivity of silica gel, packaged with a typical single-layer adhesive film. When the CSP of cotton is turned on with high power, the adhesive cracks and loses the effect or the chromaticity coordinate changes. Therefore, the problem of heat dissipation of the package must be solved. Silicon, which has a relatively low hardness, is easily scratched on the surface of the package, and the operation performance of the classifier is low, so it is necessary to improve the hardness of the package. Therefore, it is very important to develop a chip-scale package LED with moisture resistance, high hardness, and heat resistance.

본 발명의 목적은, 칩 스케일 패키지 구조 및 제조방법을 제공하는 것이고, 특히, 습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 구조 및 제조방법을 제공하는 것이다. It is an object of the present invention to provide a chip scale package structure and manufacturing method, and in particular, a chip scale package structure and manufacturing method for high color gamut backlight applications sensitive to moisture.

본 발명의 기술적 문제를 해결하기 위한 기술적 방법은 아래와 같다. A technical method for solving the technical problem of the present invention is as follows.

습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 구조(즉 칩 스케일 패키지 구조)에 있어서, 이중층 패키지 구조를 가지고 있고, 내층은 KSF 형광체 분말을 포함하는 형광 접착필름이며; 외층은 무기 필러를 포함하는 투명 접착필름이다. A chip-scale package structure (ie, a chip-scale package structure) for high-color gamut backlight applications that is sensitive to moisture, has a double-layer package structure, and the inner layer is a fluorescent adhesive film containing KSF phosphor powder; The outer layer is a transparent adhesive film containing an inorganic filler.

형광 접착필름의 두께는 30-70㎛이고, 투명 접착필름의 두께는 50-80㎛이다. The thickness of the fluorescent adhesive film is 30-70 μm, and the thickness of the transparent adhesive film is 50-80 μm.

칩 스케일 패키지 구조의 제조방법은 아래 단계를 포함한다: 단계 (1), LED 플립칩을 기판 위에 어레이시킨다; 단계 (2), KSF 형광체 분말을 포함하는 형광 접착필름을, 칩의 5면에 진공으로 등각 접착한다; 단계 (3), 패키지의 외부 수직면을 따라 저부 필름을 절단한다; 단계 (4), 절단된 패키지를 기판 위에 2차 어레이시킨다; 단계 (5) 미크론 크기의 무기 필러를 포함하는 유기 실리콘 투명 접착필름을, 절단된 패키지의 외면에 진공 라미네이트로 패키징한다; 단계 (6), 고체화시킨 후, 칩 스케일 패키지를 절단한다. The manufacturing method of the chip scale package structure includes the following steps: Step (1), an LED flip chip is arrayed on a substrate; Step (2), the fluorescent adhesive film containing KSF phosphor powder is conformally adhered to the 5 sides of the chip by vacuum; Step (3), cut the bottom film along the outer vertical plane of the package; Step (4), a secondary array of the cut packages on the substrate; Step (5) packaging the organic silicone transparent adhesive film containing micron-sized inorganic fillers in a vacuum laminate on the outer surface of the cut package; Step (6), after solidification, the chip scale package is cut.

KSF 형광체 분말을 포함하는 형광 접착필름은, 아래 단계에 따라 제조된다:A fluorescent adhesive film comprising KSF phosphor powder is prepared according to the following steps:

단계 1, 총 20-99 질량부의 다우 코닝 고굴절률 유기 실리콘 패키지 수지A, B, 1-80 질량부의 KSF 형광체 분말, 1-80 질량부의 ß-SiAlON 형광체 분말을 블렌더로 균일하게 혼합하여 혼합물 4를 수득하는 단계인데, 여기서, 각 질량부는 1g이고; 바람직하게 총 40-80 질량부의 다우 코닝 고굴절률 유기 실리콘 패키지 수지A, B, 10-40 질량부의 KSF 형광체 분말, 10-50 질량부의 ß-SiAlON 형광체 분말을 사용한다;Step 1, a total of 20-99 parts by mass of Dow Corning high refractive index organosilicon package resins A and B, 1-80 parts by mass of KSF phosphor powder, and 1-80 parts by mass of ß-SiAlON phosphor powder are uniformly mixed with a blender to mix mixture 4 obtaining step, wherein each mass part is 1 g; Preferably, a total of 40-80 parts by mass of Dow Corning high refractive index organosilicon package resins A and B, 10-40 parts by mass of KSF phosphor powder, and 10-50 parts by mass of β-SiAlON phosphor powder are used;

단계 2, 혼합물 4를 이형 필름에 압출, 코팅 또는 압연하여, 두께가 30-70㎛인 균일한 필름을 형성한다. Step 2, mixture 4 is extruded, coated or rolled onto a release film to form a uniform film with a thickness of 30-70 μm.

무기 필러를 포함하는 투명 접착필름에서, 무기 필러가 1-60 질량% (즉, 무기 필러의 질량/투명 접착필름의 질량)이고, 10-60질량%이 바람직하다. In the transparent adhesive film containing an inorganic filler, the inorganic filler is 1-60 mass % (that is, the mass of an inorganic filler/mass of a transparent adhesive film), 10-60 mass % is preferable.

무기 필러는 미크론 크기의 무기 필러이고, 일반식은 M(1-x-y-z-u) + vAxByCzDuEvO0.5(1 + x + 2y + 3z + 3u) 로 표시될 수 있으며, 여기서, M=Na, K; A=Mg, Ca, Sr, Zn; B=B, Al, Ga; C=Si, Ge, Sn; D=Zr, Ti; E=F, Cl이고; 각 요소의 함량은, x < 0.3; 0.1 < y < 0.3; 0.4 < z < 0.7; u < 0.3; v < 0.1, 그리고 x + y + z + u-v > 0.1이며, 구체적인 내용은 출원인의 선출원 특허인 2019104635590에 기재되었다. The inorganic filler is a micron-sized inorganic filler, and the general formula can be expressed as M (1-xyzu) + v A x B y C z D u E v O 0.5(1 + x + 2y + 3z + 3u) , where , M=Na, K; A=Mg, Ca, Sr, Zn; B=B, Al, Ga; C=Si, Ge, Sn; D=Zr, Ti; E=F, Cl; The content of each element is: x <0.3; 0.1 < y <0.3; 0.4 < z <0.7; u <0.3; v < 0.1, and x + y + z + uv > 0.1, and specific details are described in the applicant's earlier patent application, 2019104635590.

무기 필러를 포함하는 투명 접착필름, 즉 미크론 크기의 무기 필러를 포함하는 투명 접착필름은 아래 단계에 따라 제조된다:A transparent adhesive film containing inorganic fillers, that is, a transparent adhesive film containing micron-sized inorganic fillers, is prepared according to the following steps:

단계 1, 총 40-99 질량부의 상업적으로 판매되는 고굴절률 유기 실리콘 패키지 수지A, B제품(예를 들어, 다우 코닝 OE-6650 수지), 1-60 질량부의 미크론 크기의 무기 필러(이 둘의 합은 100 질량부)를, 블렌더, 혼련기 또는 반죽기로 균일하게 혼합한 후 혼합물 1을 수득한다; Step 1, a total of 40-99 parts by mass of commercially available high refractive index organosilicon packaging resins A and B (eg, Dow Corning OE-6650 resin), 1-60 parts by mass of micron-sized inorganic fillers (of the two 100 parts by mass) was uniformly mixed with a blender, kneader or kneader to obtain a mixture 1;

단계 2, 혼합물 1을 이형 필름에 압출, 코팅 또는 압연하여, 두께가 50-80㎛인 균일한 유기 실리콘 투명 접착필름을 형성한다. Step 2, mixture 1 is extruded, coated or rolled onto a release film to form a uniform organic silicone transparent adhesive film having a thickness of 50-80 μm.

무기 필러를 포함하는 투명 접착필름, 즉 미크론 크기의 무기 필러를 포함하는 투명 접착필름은 아래 단계로도 제조된다:A transparent adhesive film containing inorganic fillers, that is, a transparent adhesive film containing micron-sized inorganic fillers, is also prepared in the following steps:

단계 1, 10-50 질량부의 페닐 비닐 실리콘 수지, 1-60 질량부의 미크론 크기의 무기 필러를 블렌더, 혼련기 또는 반죽기로 균일하게 혼합한 후 혼합물 2를 수득한다;Step 1, 10-50 parts by mass of phenyl vinyl silicone resin, 1-60 parts by mass of micron-sized inorganic fillers are uniformly mixed with a blender, kneader or kneader to obtain a mixture 2;

여기서, 상기 페닐 비닐 실리콘 수지에서 비닐기의 함량은 0.001 중량%-15 중량%이고, 점도는 1,000-200,000 mPa.s이다; Here, the content of the vinyl group in the phenyl vinyl silicone resin is 0.001% by weight-15% by weight, and the viscosity is 1,000-200,000 mPa·s;

단계 2, 0.00005～0.001 질량부의 억제제, 0.1～5 질량부의 점착 부여제, 3.0Х10-4～1.5Х10-3 질량부의 카르스테트 촉매, 수소 함량이 0.1 중량%-1.6 중량%이고, 점도가 5-20,000mPa.s인 페닐 수소 함유 실리콘 오일을 칭량하는 단계인데, 여기서, 상기 페닐 수소 함유 실리콘 오일 중의 Si-H 몰 수는 혼합물 2 중의 비닐기 몰 수의 1.01-5배이다; Step 2, 0.00005 to 0.001 parts by mass of inhibitor, 0.1 to 5 parts by mass of tackifier, 3.0Х10-4 to 1.5Х10-3 parts by mass of Karstedt's catalyst, with a hydrogen content of 0.1%-1.6% by weight, and a viscosity of 5 weighing a phenyl hydrogen-containing silicone oil of -20,000 mPa.s, wherein the number of moles of Si-H in the silicone oil containing phenyl hydrogen is 1.01-5 times the number of moles of vinyl groups in mixture 2;

단계 3, 단계 2의 각 구성 성분을 혼합물 2(각 구성 성분의 합은 100 질량부)에 추가하고, 블렌더, 혼련기 또는 반죽기로 균일하게 혼합하여 혼합물 3을 수득한 다음, 혼합물 3을 압출, 압연 또는 코팅하여 두께가 50-80㎛인 유기 실리콘 투명 접착필름을 형성한다.Step 3, each component of step 2 is added to mixture 2 (the sum of each component is 100 parts by mass), uniformly mixed with a blender, kneader or kneader to obtain mixture 3, and then mixture 3 is extruded; Roll or coat to form an organic silicone transparent adhesive film with a thickness of 50-80㎛.

본 발명의 칩 스케일 패키지 구조의 제조방법은, 아래 단계에 따라 수행된다:The manufacturing method of the chip scale package structure of the present invention is performed according to the following steps:

단계 (1), LED 플립칩을 기판 위에 어레이시키고, 200℃ 이상의 내열성을 가진 고온 테이프로 웨이퍼를 고정시키며, LED칩(또는 LED웨이퍼)의 수량은 1-10,000개 이다; Step (1), the LED flip chip is arrayed on the substrate, and the wafer is fixed with a high-temperature tape having heat resistance of 200°C or higher, and the number of LED chips (or LED wafers) is 1-10,000 pieces;

단계 (1)에서 사용한 LED 플립칩의 크기는, 3535, 4040, 4545이거나, 정격 출력이 1w 이상인 다른 크기의 플립칩이다; The size of the LED flip chip used in step (1) is 3535, 4040, 4545, or another size flip chip whose rated output is 1w or more;

단계 (2), KSF 형광체 분말을 포함하는 형광 접착필름(12)을, 칩의 5면에 진공으로 등각 접착한다; Step (2), the fluorescent adhesive film 12 containing KSF phosphor powder is conformally adhered to the 5 sides of the chip by vacuum;

단계 (2)의 형광체 분말을 포함하는 형광 접착필름은, 도우 코닝의 A/B 이성분계 실리카겔로 제조되었고, 형광체 분말의 첨가량은 5-80중량%(즉, 형광체 분말의 질량/형광 접착필름의 질량)이며, 압출, 압연 또는 코팅을 통하여, 두께가 30-70㎛인 박막으로 제조된 것이다;The fluorescent adhesive film containing the phosphor powder of step (2) was prepared with A/B two-component silica gel of Dow Corning, and the amount of the phosphor powder added was 5-80 wt% (that is, the mass of the phosphor powder/the amount of the fluorescent adhesive film) mass) and produced as a thin film with a thickness of 30-70 μm through extrusion, rolling or coating;

단계 (3), 단계 (2)에서 수득한 패키지의 외부 수직면을 따라 저부 필름을 절단한다; Cut the bottom film along the outer vertical plane of the package obtained in step (3), step (2);

단계 (4), 절단된 패키지를 기판 위에 2차 어레이시켜 패키징하고, 200℃ 이상의 내열성을 가진 고온 테이프로 고정시킨다; Step (4), packaging the cut package in a secondary array on a substrate, and fixing it with a high-temperature tape having heat resistance of 200° C. or higher;

단계 (5), 어레이된 패키지는, 미크론 크기의 무기 필러를 포함하는 (유기 실리콘)투명 접착필름을, 진공 라미네이트로 패키징한다;Step (5), the arrayed package, the (organosilicon) transparent adhesive film containing the micron-sized inorganic filler is packaged into a vacuum laminate;

단계 (5)에서 사용한 미크론 크기의 무기 필러를 포함하는 유기 실리콘 투명 접착필름은, 상업적으로 판매되는 A/B 이성분계 실리카겔, 예를 들어, 40-99부의 도우 코닝OE-6650A/B, 1-60부의 미크론 크기의 무기 필러를, 블렌더, 혼련기 또는 반죽기로 균일하게 혼합한 후, 압출, 압연 또는 코팅을 통하여, 두께가 50-80㎛인 유기 실리콘 투명 접착필름으로 제조된 것이다; The organic silicone transparent adhesive film containing micron-sized inorganic fillers used in step (5) is a commercially available A/B two-component silica gel, for example, 40-99 parts of Dough Corning OE-6650A/B, 1- 60 parts of micron-sized inorganic fillers are uniformly mixed with a blender, kneader or kneader, and then extruded, rolled or coated to form an organic silicone transparent adhesive film having a thickness of 50-80 μm;

단계 (6), 150℃ 오븐에서 고체화시킨 후, CSP(chip scale package) 패키지를 절단하여, 하나의 습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 광원을 형성한다. Step (6), after solidifying in an oven at 150° C., the CSP (chip scale package) package is cut to form a single moisture-sensitive, high-color gamut, chip-scale package light source for backlight applications.

단계 (5)의 투명 접착필름은 핫멜트 재료, 즉 실리콘 수지 반경화 프리폴리머이고, 이의 유변학적 특성은 아래와 같다: TA DHR 레오미터를 사용한 직경D=25mm의 밀판 테스트에서, 진동빈도 1Hz, 스트레인0.1%, 테스트 온도 범위 25°C-150°C, 가열 속도 5°C/분, 저장 계수G' 20-2,000 KPa, 손실 계수 30-900 KPa, 젤 포인트는 7.2min에서 나타나고; 유변학적 특성은 점도 6,000-8,000 mPa.s을 만족해야 하고, 측정 온도는 60°C, 회전자 회전속도는 20 RPM이다.The transparent adhesive film of step (5) is a hot melt material, that is, a silicone resin semi-cured prepolymer, and its rheological properties are as follows: In a plate test with a diameter of D = 25 mm using a TA DHR rheometer, a vibration frequency of 1 Hz and a strain of 0.1% , test temperature range 25 °C-150 °C, heating rate 5 °C/min, storage coefficient G' 20-2,000 KPa, loss coefficient 30-900 KPa, gel point appears at 7.2 min; The rheological properties must satisfy the viscosity of 6,000-8,000 mPa.s, the measurement temperature is 60°C, and the rotor rotation speed is 20 RPM.

종래의 기술과 비교하면, 본 발명은 이중층 패키지를 통하여, KSF 형광체 분말과 실리콘 접착제를 초박형 형광 접착필름(30-70㎛)으로 미리 제조하고, 이를 칩 표면에 위치시켜 패키지 표면으로 부터 이격되게 한 후, 외층에서 미리 제조된 미크론 크기의 무기 필러를 포함하는 투명 형광 접착필름으로 다시 패키징하는 것으로, 무기 필러는 훌륭한 내습성을 가지고 있기에, KSF 형광체 분말이 수분의 영향을 받지 않도록 충분히 보호하고, 또한, 패키징 과정에서 처음 2번의 절단 공정은 모두 편 모향의 커터를 사용한 건식절단으로 수행하였다. Compared with the prior art, the present invention prepares KSF phosphor powder and a silicone adhesive into an ultra-thin fluorescent adhesive film (30-70 μm) in advance through a double-layer package, and places it on the chip surface to be spaced apart from the package surface. After that, the outer layer is packaged again with a transparent fluorescent adhesive film containing micron-sized inorganic fillers prepared in advance. Since the inorganic filler has excellent moisture resistance, it sufficiently protects the KSF phosphor powder from being affected by moisture, and also , The first two cutting processes in the packaging process were all performed by dry cutting using a single-sided cutter.

이러한 구조의 장점은, 첫째, 내층 초박형 구조에서 발생한 열량이 낮고 또한 쉽게 기판에 전달되어 산열되고; 둘째, 외층 필름 중 미크로 크기의 필러는 훌륭한 내열성을 기여하기 때문에, 전반적인 패키지 구조는 보다 좋은 내열성을 가지고 있어, 고출력 기기에도 사용될 수 있다. 또한, 외층 필름 중 미크로 크기의 필러는 외층 필름의 경도를 향상시켜, 패키징된 CSP는 보다 높은 경도를 갖게 되어, 스크래치의 발생을 방지하고 분류기의 작업도 보다 쉬어질 수 있다. Advantages of this structure are: first, the amount of heat generated in the inner layer ultra-thin structure is low, and is easily transferred to the substrate and dissipated; Second, since micro-sized fillers in the outer film contribute excellent heat resistance, the overall package structure has better heat resistance, so it can be used in high-power devices. In addition, the micro-sized filler in the outer layer film improves the hardness of the outer layer film, and the packaged CSP has a higher hardness, thereby preventing the occurrence of scratches and making the work of the classifier easier.

도 1은 일반적인 5면에서 광을 방출하는 CSP의 구조예시도이고, 1-플립칩; 2-형광체 분말을 첨가한 유기 실리콘 접착필름; 3-형광체 분말 입자이다.
도 2는 본 발명의 습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 구조의 예시도이고, 11-플립칩; 12-KSF 형광체 분말을 포함하는 형광 접착필름; 13-KSF 및 ß-SiAlON 의 형광체 분말 조성물; 14-미크론 크기의 무기 필러를 포함하는 유기 실리콘 투명 접착필름; 15-미크론 크기의 무기 필러이다.
도 3은 본 발명에 따른 습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 구조의 제조방법의 흐름도이다. 1 is a schematic structural diagram of a CSP that emits light from five general planes, one-flip-chip; 2-organosilicon adhesive film with phosphor powder added; 3-phosphor powder particles.
2 is an exemplary diagram of a chip scale package structure for a moisture-sensitive high color gamut backlight application of the present invention, 11-flip-chip; Fluorescent adhesive film containing 12-KSF phosphor powder; 13-KSF and β-SiAlON phosphor powder compositions; Organic silicone transparent adhesive film containing 14-micron size inorganic filler; 15-micron sized inorganic filler.
3 is a flowchart of a method of manufacturing a chip scale package structure for a moisture-sensitive high color gamut backlight application according to the present invention.

이하에서, 구제척인 실시예를 참조하여 본 발명을 상세하게 설명한다. 본 기술 분야의 통상의 지식을 가진 자는 아래 설명된 내용에 따라 본 발명의 장점을 쉽게 이해할 수 있다. 본 발명의 구체적인 내용을 설명함에 있어서, 본 발명의 보호범위는 아래에 설명된 특정 실시예에 의해 한정되지 않고, 아래 실시예에서 구체적인 실험 조건을 제시하지 않은 실험방법은, 통상적으로 공지의 조건, 또는 제조업체의 권장 조건인 것으로 이해되어야 한다. 실시예에 제시된 수치 범위는, 본 발명에서 따로 설명하지 않는 한, 각각의 수치 범위의 양단 및 그 사이의 임의의 값임을 이해 하여야 한다. Hereinafter, the present invention will be described in detail with reference to exemplary embodiments. Those of ordinary skill in the art can easily understand the advantages of the present invention according to the description below. In describing the specific contents of the present invention, the protection scope of the present invention is not limited by the specific examples described below, and the experimental methods that do not suggest specific experimental conditions in the examples below are generally known conditions, or the manufacturer's recommended conditions. It should be understood that the numerical ranges given in the examples are any values at both ends of each numerical range and therebetween, unless otherwise specified in the present invention.

도 1은 종래 기술의 일반적인 5면에서 광을 방출하는 CSP의 구조예시도이고, 형광체 분말을 첨가한 유기 실리콘 접착필름을 플립칩의 외부에 설치한다. 본 발명의 습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 구조는, 도 2와 같이, KSF 형광체 분말을 포함하는 형광 접착필름(12)은, 플립칩(11)의 주변에 등각 접촉되고, 형광 접착필름의 두께는 30㎛, 50㎛, 70㎛이며, KSF 및 ß-SiAlON 의 형광체 분말 조성물(13)을 포함하고; 가장 외층은 미크론 크기의 무기 필러를 포함하는 유기 실리콘 투명 접착제층(14)이고, 그중 포함된 미크론 크기의 무기 필러(15)는 내습성을 가지고 있기에, 내층의 KSF 형광체 분말이 파손되지 않도록 효과적으로 보호할 수 있으며, 두께는 80㎛이다. 1 is a schematic structural diagram of a CSP emitting light from five general surfaces of the prior art, and an organic silicon adhesive film to which phosphor powder is added is installed on the outside of a flip chip. In the chip scale package structure for high color gamut backlight applications sensitive to moisture of the present invention, as shown in FIG. 2 , the fluorescent adhesive film 12 containing KSF phosphor powder is in conformal contact with the periphery of the flip chip 11 , The thickness of the fluorescent adhesive film is 30 μm, 50 μm, and 70 μm, and contains the phosphor powder composition 13 of KSF and β-SiAlON; The outermost layer is an organic silicon transparent adhesive layer 14 containing micron-sized inorganic fillers, and the included micron-sized inorganic fillers 15 have moisture resistance, so that the KSF phosphor powder in the inner layer is effectively protected from being damaged. and the thickness is 80 μm.

본 발명에서 사용되는 각 성분은 다음과 같다：Each component used in the present invention is as follows:

(1) 형광 접착필름용 접착제, LF-1112A, LF-1112B, THE DOW CHEMICAL COMPANY. (1) Adhesive for fluorescent adhesive film, LF-1112A, LF-1112B, THE DOW CHEMICAL COMPANY.

(2) KSF와 β-SiAlON 형광체 분말, KR-3K01, GR-MW540K8SD, Denka Company Limited. (2) KSF and β-SiAlON phosphor powder, KR-3K01, GR-MW540K8SD, Denka Company Limited.

(3) 미크론 크기의 무기 필러, TLF-158, Tianjin Tecore Synchem Inc. (3) Micron-Sized Inorganic Filler, TLF-158, Tianjin Tecore Synchem Inc.

(4) 유기 실리콘층용 접착제, OE-6650A, OE-6650B, THE DOW CHEMICAL COMPANY. (4) Adhesive for organic silicon layer, OE-6650A, OE-6650B, THE DOW CHEMICAL COMPANY.

(5) 플립칩, F36A-CB, HC Semitek Corporation. (5) Flip Chip, F36A-CB, HC Semitek Corporation.

(6) 침강 방지 분말, DM-30, Tokuyama Chemicals (Zhejiang) Co., Ltd.(6) Anti-settling powder, DM-30, Tokuyama Chemicals (Zhejiang) Co., Ltd.

(7) 진공 라미네이팅 장치, VHP-200, Shenzhen Nitto Optical Co., Ltd. (7) Vacuum laminating device, VHP-200, Shenzhen Nitto Optical Co., Ltd.

(8) 분류기, LEDA.PNP M6500 MAPPING SORTER, Shenzhen Nitto Optical Co., Ltd. (8) Sorter, LEDA.PNP M6500 MAPPING SORTER, Shenzhen Nitto Optical Co., Ltd.

(9) 송풍 건조기, DHG-9070A, Shanghai Yiheng Kexueyiqi, Co., Ltd. (9) Blow Dryer, DHG-9070A, Shanghai Yiheng Kexueyiqi, Co., Ltd.

(10) 정밀 다이싱 절단기, DS613, Shenyang Heyantech Co., Ltd. (10) Precision dicing cutter, DS613, Shenyang Heyantech Co., Ltd.

아래 실시예에서 테스트에 사용되는 형광 접착필름의 구성 성분은 아래와 같다: 20 중량부의 LF-1112A 접착제, 20 중량부의 LF-1112B접착제, 40 중량부의 KR-3K01 형광체 분말, 20 중량부의 GR-MW540K8SD 형광체 분말, 상기 구성 성분을 균일하게 혼합한 후, 두께가 30㎛인 형광 접착필름으로 코팅한다. The components of the fluorescent adhesive film used for testing in the examples below are as follows: 20 parts by weight of LF-1112A adhesive, 20 parts by weight of LF-1112B adhesive, 40 parts by weight of KR-3K01 phosphor powder, and 20 parts by weight of GR-MW540K8SD phosphor After uniformly mixing the powder and the above components, it is coated with a fluorescent adhesive film having a thickness of 30 μm.

아래 실시예에서 테스트에 사용되는 미크로 크기의 투명 필러를 포함하는 유기 실리콘 투명 접착필름의 구성 성분은 아래와 같다: 총 39-98 중량부의 OE-6650A/B, 1 중량부의 DM-30, 1-60 중량부의 미크론 크기의 무기 필러, 상기 구성 성분을 균일하게 혼합한 후, 두께가 80㎛인 투명 접착필름으로 코팅한다.The components of the organic silicone transparent adhesive film including the micro-sized transparent filler used for the test in the examples below are as follows: a total of 39-98 parts by weight of OE-6650A/B, 1 part by weight of DM-30, and 1-60 After uniformly mixing the micron-sized inorganic filler and the above components by weight, it is coated with a transparent adhesive film having a thickness of 80 μm.

아래 실시예에서 테스트에 사용되는 CSP의 제조방법은 아래와 같다: MPI 분류기로F36A-CB플립칩을 배열한 후, 접착필름을 진공 라미네이팅 장치로 칩 위에 접착시키고, 송풍 건조기로 150℃에서 2시간 건조한 후, 정밀 다이싱 절단기로 절단시켜, 하나의 CSP를 형성한다. The manufacturing method of the CSP used for the test in the example below is as follows: After arranging the F36A-CB flip chip with an MPI sorter, the adhesive film is adhered on the chip with a vacuum laminating device, and dried at 150° C. for 2 hours with a blow dryer. Then, it is cut with a precision dicing cutter to form one CSP.

본 발명의 습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 구조는, 도 2와 같이, 가장 외층은 미크론 크기의 무기 필러를 포함하는 유기 실리콘 투명 접착제층(14)이고, 그중에 포함된 미크론 크기의 무기 필러(15)는 내습성이 훌륭하여, 내층의 KSF 형광체 분말이 파손되지 않도록 충분한 보호를 제공할 수 있다. 표 1은 투명 접착필름 중 미크론 크기의 무기 필러의 첨가량과 수분 흡수율 사이의 관계를 나타내는 표이다. 수분 흡수율을 테스트하는 방법은 아래와 같다: 미리 제조된 미크론 크기의 무기 필러의 첨가량이 서로 다른 두께가 80㎛인 투명 접착필름을 50mm*20mm의 스틱으로 절단하고, 무게M0을 측정한 후, 끓는 물에 침지시켜 1시간 동안 끓인 다음, 무진 종이로 접착필름 표면의 수분은 제거하고, 다시 무게 M1을 측정하고, 아래 공식1에 따라 끓는 물 흡수율을 계산한다. 측정결과에 따르면, 미크론 크기의 무기 필러를 첨가하지 않은 접착필름의 끓는 물 흡수율이 가장 높고, 미크론 크기의 무기 필러를 포함하는 접착필름은, 필러의 함량이 높을 수록 끓는 물 흡수율이 낮아진다. As shown in FIG. 2, the chip-scale package structure for high-color gamut backlight applications sensitive to moisture of the present invention is an organic silicon transparent adhesive layer 14 containing micron-sized inorganic fillers as the outermost layer, and micron-sized components included therein. The inorganic filler 15 has excellent moisture resistance, and can provide sufficient protection so that the KSF phosphor powder of the inner layer is not damaged. Table 1 is a table showing the relationship between the amount of micron-sized inorganic filler in the transparent adhesive film and the water absorption rate. The method for testing the water absorption rate is as follows: A transparent adhesive film having a thickness of 80 μm with different amounts of micron-sized inorganic fillers prepared in advance is cut with a stick of 50 mm * 20 mm, the weight M 0 is measured, and boiling After immersing in water and boiling for 1 hour, remove moisture from the surface of the adhesive film with dust-free paper, measure the weight M 1 again, and calculate the absorption rate of boiling water according to Formula 1 below. According to the measurement results, the boiling water absorption rate of the adhesive film without the addition of micron-sized inorganic fillers is the highest, and the boiling water absorption rate of the adhesive film containing the micron-sized inorganic fillers is lower as the content of the filler increases.

[공식][Formula]

끓는 물 흡수율=(M1-M0)/M0*100% Boiling water absorption=(M 1 -M 0 )/M 0 *100%

표1. 미크론 크기의 무기 필러의 첨가량과 수분 흡수율의 관계Table 1. The relationship between the amount of micron-sized inorganic filler and the water absorption rate

Figure 112020067767807-pct00001
Figure 112020067767807-pct00001

본 발명의 습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 구조는, 도 2와 같이, 가장 외층은 미크론 크기의 무기 필러를 포함하는 유기 실리콘 투명 접착제층(14)이고, 여기서, 미크론 크기의 무기 필러(15)의 첨가량이 1-60 중량%일 때, 유기 필름의 경도를 ShoreD70~ShoreD80까지 증가할 수 있고, CSP에 스크래치가 생기는 것을 방지하고, CSP 완제품의 분류작업에 유리하다. 미리 제조된 미크론 크기의 무기 필러의 첨가량이 서로 다른 두께가 80㎛인 투명 접착필름에 대하여, ShoreD 디지털 디스플레이 경도계(Shanghai Shuangxu Electronics Co., Ltd.)로 경도 테스트를 수행하였다. 표 2는 미크론 크기의 무기 필러의 첨가량과 경도 사이의 관계를 나타낸 표이다. 경도는, 미크론 크기의 무기 필러의 첨가량의 증가에 따라 증가된다. The chip scale package structure for a moisture-sensitive high color gamut backlight application of the present invention, as shown in FIG. 2 , the outermost layer is an organic silicon transparent adhesive layer 14 containing micron-sized inorganic fillers, where micron-sized When the amount of the inorganic filler 15 added is 1-60% by weight, the hardness of the organic film can be increased from ShoreD70 to ShoreD80, it is possible to prevent scratches on the CSP, and it is advantageous for the classification operation of the CSP finished product. A hardness test was performed with a ShoreD digital display hardness tester (Shanghai Shuangxu Electronics Co., Ltd.) for the pre-prepared transparent adhesive films having different thicknesses of 80 μm with different amounts of micron-sized inorganic fillers. Table 2 is a table showing the relationship between the addition amount of the micron-sized inorganic filler and the hardness. The hardness increases with an increase in the amount of the inorganic filler of micron size added.

표 2. 미크론 크기의 무기 필러의 첨가량과 경도의 관계Table 2. Relationship between the addition amount of micron-sized inorganic fillers and hardness

Figure 112020067767807-pct00002
Figure 112020067767807-pct00002

본 발명의 습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 구조는, 도 2와 같이, 가장 외층은 미크론 크기의 무기 필러를 포함하는 유기 실리콘 투명 접착제층(14)이고, 그중에 포함된 미크론 크기의 무기 필러(15)는 훌륭한 열전도성 및 광 감쇠 방지 성능을 가지고 있고, 1W 이상의 고출력 LED기기에 사용될 수 있다. 아래 열 저항 테스트 장치는 T3Ster열 저항 테스트기(Shenzhen Manyoung Technology Co.,Ltd.)이다. 표 3은 미크론 크기의 무기 필러의 첨가량과 열저항 사이의 관계이고, 그 결과에 따르면, 가장 외층의 투명층에 미크론 크기의 무기 필러의 첨가량이 많을 수록 열 저항이 낮아 지는데, 즉 제품의 열 전도성능이 더 좋은 것이다.As shown in FIG. 2, the chip-scale package structure for high-color gamut backlight applications sensitive to moisture of the present invention is an organic silicon transparent adhesive layer 14 containing micron-sized inorganic fillers as the outermost layer, and micron-sized components included therein. The inorganic filler 15 has excellent thermal conductivity and light attenuation prevention performance, and can be used in high-power LED devices of 1W or more. The thermal resistance test device below is a T3Ster thermal resistance tester (Shenzhen Manyoung Technology Co., Ltd.). Table 3 shows the relationship between the amount of micron-sized inorganic filler added and the thermal resistance. According to the results, the higher the amount of micron-sized inorganic filler added to the outermost transparent layer, the lower the thermal resistance, that is, the thermal conductivity of the product. this would be better

표 3. 미크론 크기의 무기 필러의 첨가량 및 열 저항 사이의 관계Table 3. Relationship between the addition amount of micron-sized inorganic fillers and thermal resistance

Figure 112020067767807-pct00003
Figure 112020067767807-pct00003

본 발명의 습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 구조는, 도 2와 같이, 가장 외층은 미크론 크기의 무기 필러를 포함하는 유기 실리콘 투명 접착제층(14)이고, 그중에 포함된 미크론 크기의 무기 필러(15)는 CSP 완제품의 광 방출 효율을 향상시킬 수 있다. 표 4는 본 발명의 이중층 구조 CSP(외층 투명 접착제층에 20% 중량부의 미크론 크기의 무기 필러를 추가함)와 일반적인 이중층 구조 CSP(즉, KSF 형광층과 일반 투명층으로 패키징한 CSP)에 대하여 원거리장 광학 테스트를 한 결과를 비교한 것이고, 여기서 내층의 KSF형광층은 완전 동일하다. LED626 고니오 포토미터(Hangzhou Yuanfang Photoelectric Information Co., Ltd)를 테스트 기기로 사용하였다. 테스트 범위는 C0-180도, 즉 -90° 내지 90°의 광도 분포 데이터를 측정하였고, 테스트 간격은 1.0도이다. 결과에 따르면, 본 발명의 이중층 구조 CSP는, 광 효율이 더 높고, 평균 광도 확산각이 더 크며, 다시 말하면, 광 방출 형태가 더욱 훌륭하다. As shown in FIG. 2, the chip-scale package structure for high-color gamut backlight applications sensitive to moisture of the present invention is an organic silicon transparent adhesive layer 14 containing micron-sized inorganic fillers as the outermost layer, and micron-sized components included therein. The inorganic filler 15 of CSP can improve the light emission efficiency of the finished product. Table 4 shows the distance of the double-layer structure CSP of the present invention (with 20% parts by weight of micron-sized inorganic filler added to the outer transparent adhesive layer) and the general double-layer structure CSP (that is, the CSP packaged with the KSF fluorescent layer and the general transparent layer) The result of field optical test is compared, where the KSF fluorescent layer of the inner layer is exactly the same. An LED626 gonio photometer (Hangzhou Yuanfang Photoelectric Information Co., Ltd) was used as a test instrument. The test range was C0-180 degrees, that is, the luminous intensity distribution data of -90 degrees to 90 degrees were measured, and the test interval was 1.0 degrees. According to the results, the double-layer structure CSP of the present invention has a higher light efficiency, a larger average light intensity diffusion angle, in other words, a better light emission form.

표 4. 본 발명에 의해 제조된 이중층 구조 CSP와 일반적인 이중층 구조 CSP의 원거리장 광학 테스트 비교결과Table 4. Comparison of far-field optical test results of the double-layer structure CSP prepared by the present invention and the general double-layer structure CSP

Figure 112020067767807-pct00004
Figure 112020067767807-pct00004

도 2와 같이, 본 발명의 미크론 크기의 무기 필러(15)의 입경은: D10은 1-3㎛, D50은 10-15㎛, D90은 40-50㎛, D97은 60-70㎛이다. 입경이 너무 크면, 큰 입자의 형광체 분말로 인하여 미리 제조된 필름 표면에 돌기가 형성되고, csp로 패키지한 후 표면이 거칠며, 심한 경우 csp패키지의 색온도 일치성에 영향을 주고; 입경이 너무 작으면, 경도, 내습성, 내열성을 향상시키는 효과가 현저하지 않는다.As shown in FIG. 2 , the particle diameter of the micron-sized inorganic filler 15 of the present invention is: D10 is 1-3 μm, D50 is 10-15 μm, D90 is 40-50 μm, and D97 is 60-70 μm. If the particle size is too large, protrusions are formed on the surface of the pre-fabricated film due to the large particles of the phosphor powder, and the surface is rough after packaging with csp, and in severe cases, it affects the color temperature consistency of the csp package; When the particle size is too small, the effect of improving hardness, moisture resistance, and heat resistance is not remarkable.

도 2와 같이, 본 발명의 미크론 크기의 무기 필러(15)의 첨가량은, 1-60중량%이고, 바람직하게는 10-50중량%이다. 첨가량이 10% 보다 낮은 경우, 내습성, 경도, 내열성 및 광 감쇠 방지를 향상시키는 효과가 현저하지 않고; 첨가량이 50% 보다 높은 경우, 전체 유기 실리콘 시스템의 점도가 지나치게 높아(＞50000mPa.s), 미리 성막하기 어렵다. As shown in Fig. 2, the amount of the inorganic filler 15 of micron size of the present invention added is 1-60 wt%, preferably 10-50 wt%. When the addition amount is lower than 10%, the effect of improving moisture resistance, hardness, heat resistance and light attenuation prevention is not remarkable; When the addition amount is higher than 50%, the viscosity of the whole organosilicon system is too high (> 50000 mPa.s), and it is difficult to form a film in advance.

도 2와 같이, 플립칩(11) 주변에 KSF 형광체 분말을 포함하는 형광 접착필름(12)을 등각으로 접착하고, DENKA사(DENKA, Shanghai)의KSF 및 β-SiAlON 형광체 분말 조성물을 추가한다. As shown in FIG. 2, a fluorescent adhesive film 12 including KSF phosphor powder is conformally adhered to the periphery of the flip chip 11, and KSF and β-SiAlON phosphor powder compositions from DENKA (DENKA, Shanghai) are added.

도 3은, 본 발명의 습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 구조의 제조방법의 흐름도이고, 제조방법은 아래 단계를 포함한다:Fig. 3 is a flow chart of the manufacturing method of the chip scale package structure for the moisture-sensitive high color gamut backlight application of the present invention, the manufacturing method comprising the following steps:

단계 (1), LED 플립칩을 기판 위에 어레이시키고, 200℃ 이상의 내열성을 가진 고온 테이프로 웨이퍼를 고정시킨다; Step (1), an LED flip chip is arrayed on a substrate, and the wafer is fixed with a high-temperature tape having heat resistance of 200°C or higher;

단계 (2), KSF 형광체 분말을 포함하는 형광 접착필름(12)을, 칩의 5면에 진공으로 등각 접착한다; Step (2), the fluorescent adhesive film 12 containing KSF phosphor powder is conformally adhered to the 5 sides of the chip by vacuum;

단계 (3), 패키지의 외부 수직면을 따라 저부 필름을 절단한다; Step (3), cut the bottom film along the outer vertical plane of the package;

단계 (4), 절단된 패키지를 기판 위에 2차 어레이시키고, 200℃ 이상의 내열성을 가진 고정 테이프로 패키지를 고정시킨다; Step (4), secondary arraying the cut package on a substrate, and fixing the package with a fixing tape having heat resistance of 200° C. or higher;

단계 (5), 어레이된 패키지는, 진공 라미네이트로 미크론 크기의 무기 필러를 포함하는 유기 실리콘 투명 접착필름을 패키징한다; Step (5), the arrayed package, package the organic silicon transparent adhesive film containing micron-sized inorganic fillers by vacuum laminate;

단계 (6), 150℃ 오븐에서 고체화시킨 후, CSP(chip scale package) 패키지를 절단하여, 하나의 습기에 민감한 높은 색영역의 백라이트 애플리케이션용 칩 스케일 패키지 광원을 형성한다. Step (6), after solidifying in an oven at 150° C., the CSP (chip scale package) package is cut to form a single moisture-sensitive, high-color gamut, chip-scale package light source for backlight applications.

단계 (1)에서 사용된 LED 플립칩의 크기는, 3535, 4040, 4545이거나, 정격 출력이 1w이상인 다른 크기의 플립칩을 사용할 수 있다. The size of the LED flip chip used in step (1) is 3535, 4040, 4545, or another size flip chip having a rated output of 1w or more may be used.

단계 (2)에서 사용한 KSF 형광체 분말을 포함하는 형광 접착필름은, 도우 코닝의 A/B 이성분계 실리카겔로 제조되었고, 형광체 분말의 첨가량은 5-80 중량%이며, 압출, 압연, 또는 코팅을 통하여 두께가 30-70㎛인 박막으로 제조된 것이다. The fluorescent adhesive film containing the KSF phosphor powder used in step (2) was prepared with A/B two-component silica gel of Dow Corning, and the phosphor powder was added in an amount of 5-80 wt%, and was subjected to extrusion, rolling, or coating. It is manufactured as a thin film with a thickness of 30-70 μm.

단계 (5)에서 사용한 미크론 크기의 무기 필러를 포함하는 유기 실리콘 투명 접착필름은, 상업적으로 판매되는 A/B이성분계 실리카겔, 예를 들어, 40-99부의 도우 코닝OE-6650A/B, 1-60부의 미크론 크기의 무기 필러를, 블렌더, 혼련기 또는 반죽기로 균일하게 혼합한 후, 압출, 압연 또는 코팅을 통하여, 두께가 50-80㎛인 유기 실리콘 투명 접착필름으로 제조된 것이다. The organic silicone transparent adhesive film containing micron-sized inorganic fillers used in step (5) is a commercially available A/B binary silica gel, for example, 40-99 parts of Dough Corning OE-6650A/B, 1- 60 parts of micron-sized inorganic fillers are uniformly mixed with a blender, kneader or kneader, and then extruded, rolled or coated to form an organic silicone transparent adhesive film having a thickness of 50-80 μm.

본 발명에 따라 제조된 CSP제품, 일반적인 5면이 단층 접착필름인 CSP패키지, 및 KSF 형광층과 일반적인 투명층을 가진 이중층 패키지CSP제품에 대하여, 1000시간의 점등 노화 테스트를 수행하였고, 그 비교결과는 표 5와 같다. 여기서, 테스트 조건은 아래와 같다: 웨이퍼는 55*55mil, 점등 전압은 3V, 전류는 1500mA이다. 테스트 결과에 있어서, CIE X와 CIE Y의 변화값인 ΔX과 ΔY가 작을 수록 제품 성능이 좋다는 것을 의미한다. 1000시간 점등 후 100℃의 빨간색 잉크에 2시간 침지시킨 다음, 패키지 접착제층에 빨간색 잉크가 스며 들었는지를 확인하는데, 잉크가 존재하면 성능이 나쁜 것이고, 잉크가 존재하지 않으면 성능이 좋은 것을 의미한다. 테스트 결과에 따르면, 일반적인 5면이 단층인 CSP와, 일반적인 이중층 구조 CSP(즉, KSF형광층과 일반적인 투명층으로 패키징한 CSP)의 표면 패키지 접착제층에 모두 빨간색 잉크가 존재하고, 본 발명의 이중층 구조 CSP(외층의 투명 접착제층에 20 중량%의 미크론 크기의 무기 필러가 첨가됨)의 표면 패키지 접착제층에는 빨간색 잉크가 존재하지 않는다.A 1000-hour lighting aging test was performed on the CSP product manufactured according to the present invention, the CSP package with a single-layer adhesive film on five sides, and the double-layer package CSP product having a KSF fluorescent layer and a general transparent layer. Table 5 shows. Here, the test conditions are as follows: the wafer is 55*55mil, the lighting voltage is 3V, and the current is 1500mA. In the test result, the smaller ΔX and ΔY, which are the change values of CIE X and CIE Y, means better product performance. After 1000 hours of lighting, it is immersed in red ink at 100℃ for 2 hours, and then check whether the red ink has permeated into the package adhesive layer. . According to the test results, red ink is present in both the surface package adhesive layer of the CSP having a single layer on five sides and the CSP having a general double-layer structure (that is, CSP packaged with a KSF fluorescent layer and a general transparent layer), and the double-layer structure of the present invention There is no red ink in the surface package adhesive layer of CSP (20 wt% of micron-sized inorganic filler is added to the transparent adhesive layer of the outer layer).

표 5. 1000시간 점등 노화 테스트 비교 데이터Table 5. 1000 hours lighting aging test comparison data

Figure 112020067767807-pct00005
Figure 112020067767807-pct00005

상기 실시예에 따라 제조한 CSP패키지는, 내습성, 내열성 및 광 감쇠 방지 성능이 훌륭하고, 또한 높은 경도 및 광 방출 효율을 가지고 있으며, 습기에 민감한 높은 색영역의 백라이트 애플리케이션에 적합하다. The CSP package manufactured according to the above embodiment has excellent moisture resistance, heat resistance and light attenuation prevention performance, has high hardness and light emission efficiency, and is suitable for high color gamut backlight applications that are sensitive to moisture.

본 발명에서 제시한 각 변수와 재료를 조절하는 것으로, 본 발명과 유사한 성능을 가진 칩 패키지 구조를 실현할 수 있다, 이상과 같이 실시예들을 통하여 본 발명을 설명하였으나, 본 발명의 핵심에서 벗어나지 않는 범위의 간단한 변형, 수정 또는 해당 기술분야에서 통상의 지식을 가진 자가 창조적인 노력없이 수득하을 수 있는 균등한 것들은 모두 후술하는 특허청구범위의 범위에 속한다.By adjusting each variable and material presented in the present invention, a chip package structure having similar performance to that of the present invention can be realized. Simple variations, modifications, or equivalents that can be obtained without creative efforts by a person of ordinary skill in the art fall within the scope of the following claims.

Claims (10)

이중층 패키지 구조를 가지고 있고, 내층은 KSF 형광체 분말을 포함하는 형광 접착필름인, 백라이트 애플리케이션용 칩 스케일 패키지(CPS, chip scale package)에 있어서,
외층은 무기 필러를 포함한 투명 접착필름이고; 무기 필러를 포함하는 투명 접착필름에서, 무기 필러가 1-60 질량%이고, 일반식은 M(1-x-y-z-u) + vAxByCzDuEvO0.5(1 + x + 2y + 3z + 3u)로 표시될 수 있고, 여기서, M=Na, K; A=Mg, Ca, Sr, Zn; B=B, Al, Ga; C=Si, Ge, Sn; D=Zr, Ti; E=F, Cl이고; 각 요소의 함량 규정은, x < 0.3; 0.1 < y < 0.3; 0.4 < z < 0.7; u < 0.3; v < 0.1, 그리고 x + y + z + u - v > 0.1이며, 형광 접착필름의 두께는 30-70㎛이고, 투명 접착필름의 두께는 50-80㎛인 것을 특징으로 하는, 백라이트 애플리케이션용 칩 스케일 패키지.
In a chip scale package (CPS) for backlight application, which has a double-layer package structure, and the inner layer is a fluorescent adhesive film containing KSF phosphor powder,
The outer layer is a transparent adhesive film containing an inorganic filler; In the transparent adhesive film containing an inorganic filler, the inorganic filler is 1-60 mass %, and the general formula is M (1-xyzu) + v A x B y C z D u E v O 0.5 (1 + x + 2y + 3z) + 3u) , where M=Na, K; A=Mg, Ca, Sr, Zn; B=B, Al, Ga; C=Si, Ge, Sn; D=Zr, Ti; E=F, Cl; The content regulation of each element is: x <0.3; 0.1 < y <0.3; 0.4 < z <0.7; u <0.3; Chip for backlight applications, characterized in that v < 0.1, and x + y + z + u - v > 0.1, the thickness of the fluorescent adhesive film is 30-70 μm, and the thickness of the transparent adhesive film is 50-80 μm scale package.
 제1항에 있어서,
무기 필러를 포함하는 투명 접착필름에서, 무기 필러가 10-60 질량%인 것을 특징으로 하는, 백라이트 애플리케이션용 칩 스케일 패키지.
According to claim 1,
A transparent adhesive film containing an inorganic filler, characterized in that the inorganic filler is 10-60 mass %, a chip scale package for backlight applications.
 제1항에 있어서,
KSF 형광체 분말을 포함하는 형광 접착필름은,
단계 1, 총 20-99 질량부의 유기 실리콘 패키지 수지 A, B, 1-80 질량부의 KSF 형광체 분말, 1-80 질량부의 β-SiAlON 형광체 분말을 블렌더로 균일하게 혼합하여 혼합물 4를 수득하는, 단계 1; - 각 질량부는 1g이고; 총 40-80 질량부의 유기 실리콘 패키지 수지 A, B, 10-40 질량부의 KSF 형광체 분말, 10-50 질량부의 β-SiAlON 형광체 분말을 사용함-;
단계 2, 혼합물 4를 이형 필름에 압출, 코팅 또는 압연하여, 두께가 30-70㎛인 균일한 필름을 형성하는 것을 특징으로 하는, 백라이트 애플리케이션용 칩 스케일 패키지.
According to claim 1,
A fluorescent adhesive film containing KSF phosphor powder,
Step 1, a total of 20-99 parts by mass of organic silicon package resin A, B, 1-80 parts by mass of KSF phosphor powder, and 1-80 parts by mass of β-SiAlON phosphor powder are uniformly mixed with a blender to obtain a mixture 4, One; - each part by mass is 1 g; A total of 40-80 parts by mass of organic silicon package resins A and B, 10-40 parts by mass of KSF phosphor powder, and 10-50 parts by mass of β-SiAlON phosphor powder are used-;
A chip scale package for backlight applications, characterized in that step 2, mixture 4 is extruded, coated or rolled onto a release film to form a uniform film with a thickness of 30-70 μm.
 제1항에 있어서,
무기 필러를 포함하는 투명 접착필름은,
총 40-99 질량부의 유기 실리콘 패키지 수지 A, B 제품, 1-60 질량부의 무기 필러(이 둘의 합은 100 질량부)를, 블렌더, 혼련기 또는 반죽기로 균일하게 혼합한 후 혼합물 1을 수득하는, 단계 1;
혼합물 1을 이형 필름에 압출, 코팅 또는 압연하여, 두께가 50-80㎛인 균일한 유기 실리콘 투명 접착필름을 형성하는, 단계 2;로 제조되는 것을 특징으로 하는, 백라이트 애플리케이션용 칩 스케일 패키지.
According to claim 1,
A transparent adhesive film containing an inorganic filler,
A total of 40-99 parts by mass of the organic silicone package resins A and B products and 1-60 parts by mass of an inorganic filler (the sum of the two are 100 parts by mass) were uniformly mixed with a blender, kneader or kneader to obtain a mixture 1 which, step 1;
A chip scale package for backlight applications, characterized in that prepared in step 2; extruding, coating or rolling mixture 1 onto a release film to form a uniform organic silicon transparent adhesive film having a thickness of 50-80 μm.
 제1항에 있어서,
무기 필러를 포함하는 투명 접착필름은,
10-50 질량부의 페닐 비닐 실리콘 수지, 1-60 질량부의 무기 필러를 블렌더, 혼련기 또는 반죽기로 균일하게 혼합한 후 혼합물 2를 수득하는, 단계 1 - 상기 페닐 비닐 실리콘 수지에서 비닐기의 함량은 0.001 중량%-15 중량%이고, 점도는 1,000-200,000 mPa.s임-;
0.00005～0.001 질량부의 억제제, 0.1～5 질량부의 점착 부여제, 3.0Х10-4～1.5Х10-3 질량부의 카르스테트 촉매, 수소 함량이 0.1 중량%-1.6 중량%이고, 점도가 5-20,000mPa.s인 페닐 수소 함유 실리콘 오일을 칭량하는, 단계 2 - 상기 페닐 수소 함유 실리콘 오일 중의 Si-H 몰 수는 혼합물 2 중의 비닐기 몰 수의 1.01-5배임 -;
단계 2의 각 구성 성분을 혼합물 2(각 구성 성분의 합은 100 질량부)에 추가하고, 블렌더, 혼련기 또는 반죽기로 균일하게 혼합하여 혼합물 3을 수득한 다음, 혼합물 3을 압출, 압연 또는 코팅하여 두께가 50-80㎛인 유기 실리콘 투명 접착필름을 형성하는, 단계 3;으로 제조되는 것을 특징으로 하는, 백라이트 애플리케이션용 칩 스케일 패키지.According to claim 1,
A transparent adhesive film containing an inorganic filler,
10-50 parts by mass of phenyl vinyl silicone resin and 1-60 parts by mass of inorganic filler are uniformly mixed with a blender, kneader or kneader to obtain a mixture 2, Step 1 - The content of vinyl groups in the phenyl vinyl silicone resin is 0.001%-15% by weight, and the viscosity is 1,000-200,000 mPa·s;
0.00005 to 0.001 parts by mass of inhibitor, 0.1 to 5 parts by mass of tackifier, 3.0Х10-4 to 1.5Х10-3 parts by mass of Karstedt's catalyst, with a hydrogen content of 0.1%-1.6% by weight, and a viscosity of 5-20,000 mPa Step 2 Weighing the phenyl hydrogen containing silicone oil which is .s, wherein the number of moles of Si-H in the phenyl hydrogen containing silicone oil is 1.01-5 times the number of moles of vinyl groups in mixture 2;
Each component of step 2 is added to mixture 2 (the sum of each component is 100 parts by mass), uniformly mixed with a blender, kneader or kneader to obtain mixture 3, and then mixture 3 is extruded, rolled or coated to form an organic silicon transparent adhesive film having a thickness of 50-80 μm, characterized in that manufactured in step 3; a chip scale package for backlight applications. 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete
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