KR102410592B1 - 온도 제어 장치, 온도 제어 방법, 및 검사 장치 - Google Patents

온도 제어 장치, 온도 제어 방법, 및 검사 장치 Download PDF

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Publication number
KR102410592B1
KR102410592B1 KR1020190152831A KR20190152831A KR102410592B1 KR 102410592 B1 KR102410592 B1 KR 102410592B1 KR 1020190152831 A KR1020190152831 A KR 1020190152831A KR 20190152831 A KR20190152831 A KR 20190152831A KR 102410592 B1 KR102410592 B1 KR 102410592B1
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KR
South Korea
Prior art keywords
cooling
temperature
temperature control
output
sliding mode
Prior art date
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KR1020190152831A
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English (en)
Korean (ko)
Other versions
KR20200064923A (ko
Inventor
마사히토 고바야시
시게루 가사이
Original Assignee
도쿄엘렉트론가부시키가이샤
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20200064923A publication Critical patent/KR20200064923A/ko
Application granted granted Critical
Publication of KR102410592B1 publication Critical patent/KR102410592B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Feedback Control In General (AREA)
  • Control Of Temperature (AREA)
KR1020190152831A 2018-11-29 2019-11-26 온도 제어 장치, 온도 제어 방법, 및 검사 장치 KR102410592B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018224108 2018-11-29
JPJP-P-2018-224108 2018-11-29
JPJP-P-2019-057315 2019-03-25
JP2019057315A JP7304722B2 (ja) 2018-11-29 2019-03-25 温度制御装置、温度制御方法、および検査装置

Publications (2)

Publication Number Publication Date
KR20200064923A KR20200064923A (ko) 2020-06-08
KR102410592B1 true KR102410592B1 (ko) 2022-06-17

Family

ID=71086440

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190152831A KR102410592B1 (ko) 2018-11-29 2019-11-26 온도 제어 장치, 온도 제어 방법, 및 검사 장치

Country Status (2)

Country Link
JP (1) JP7304722B2 (ja)
KR (1) KR102410592B1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102508040B1 (ko) * 2020-05-20 2023-03-08 시바우라 메카트로닉스 가부시끼가이샤 냉각 장치, 기판 처리 장치, 냉각 방법, 및 기판 처리 방법
JP7433147B2 (ja) * 2020-06-26 2024-02-19 東京エレクトロン株式会社 載置台及び検査装置
JP2022130964A (ja) 2021-02-26 2022-09-07 東京エレクトロン株式会社 検査装置及び温度制御方法
WO2023170737A1 (ja) * 2022-03-07 2023-09-14 株式会社アドバンテスト 温度制御装置、試験装置、温度制御方法、および温度制御プログラム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020008534A1 (en) * 2000-03-30 2002-01-24 Nagase Sangyo Kabushiki Kaisha Prober and low-temperature test equipment having same incorporated therein
KR101227153B1 (ko) * 2012-09-05 2013-01-31 (주)테키스트 열전소자를 이용한 반도체 제조 설비의 광역 온도제어시스템
US20150137442A1 (en) * 2012-05-30 2015-05-21 Kyocera Corporation Flow path member, and heat exchanger and semiconductor manufacturing apparatus using same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10135315A (ja) 1996-10-29 1998-05-22 Tokyo Electron Ltd 試料載置台の温度制御装置及び検査装置
US6415858B1 (en) * 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
JP4480921B2 (ja) * 2001-02-19 2010-06-16 株式会社小松製作所 むだ時間を有するプロセス系に対する離散時間スライディングモード制御装置及び方法
JP4462165B2 (ja) * 2005-10-21 2010-05-12 日産自動車株式会社 制御装置
JP2008267640A (ja) * 2007-04-17 2008-11-06 Sumitomo Heavy Ind Ltd 冷却装置および半導体検査装置
JP2011052913A (ja) * 2009-09-02 2011-03-17 Nishiyama Corp ポンプ循環量制御温度調節装置
JP5983765B2 (ja) * 2012-12-07 2016-09-06 オムロン株式会社 調節器、制御方法および制御プログラム
JP6994313B2 (ja) * 2016-11-29 2022-01-14 東京エレクトロン株式会社 載置台及び電子デバイス検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020008534A1 (en) * 2000-03-30 2002-01-24 Nagase Sangyo Kabushiki Kaisha Prober and low-temperature test equipment having same incorporated therein
US20150137442A1 (en) * 2012-05-30 2015-05-21 Kyocera Corporation Flow path member, and heat exchanger and semiconductor manufacturing apparatus using same
KR101227153B1 (ko) * 2012-09-05 2013-01-31 (주)테키스트 열전소자를 이용한 반도체 제조 설비의 광역 온도제어시스템

Also Published As

Publication number Publication date
JP2020096152A (ja) 2020-06-18
KR20200064923A (ko) 2020-06-08
JP7304722B2 (ja) 2023-07-07
TW202036198A (zh) 2020-10-01

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