KR102383776B9 - 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판 - Google Patents
고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판Info
- Publication number
- KR102383776B9 KR102383776B9 KR1020210039735A KR20210039735A KR102383776B9 KR 102383776 B9 KR102383776 B9 KR 102383776B9 KR 1020210039735 A KR1020210039735 A KR 1020210039735A KR 20210039735 A KR20210039735 A KR 20210039735A KR 102383776 B9 KR102383776 B9 KR 102383776B9
- Authority
- KR
- South Korea
- Prior art keywords
- same
- metal foil
- polyimide film
- clad laminate
- high modulus
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020210039735A KR102383776B1 (ko) | 2019-05-24 | 2021-03-26 | 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판 |
KR1020220041316A KR102482355B1 (ko) | 2021-03-26 | 2022-04-01 | 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190061396A KR20200135028A (ko) | 2019-05-24 | 2019-05-24 | 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판 |
KR1020210039735A KR102383776B1 (ko) | 2019-05-24 | 2021-03-26 | 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020190061396A Division KR20200135028A (ko) | 2019-05-24 | 2019-05-24 | 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020220041316A Division KR102482355B1 (ko) | 2021-03-26 | 2022-04-01 | 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판 |
Publications (3)
Publication Number | Publication Date |
---|---|
KR20210038508A KR20210038508A (ko) | 2021-04-07 |
KR102383776B1 KR102383776B1 (ko) | 2022-04-08 |
KR102383776B9 true KR102383776B9 (ko) | 2022-12-27 |
Family
ID=81183058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020210039735A KR102383776B1 (ko) | 2019-05-24 | 2021-03-26 | 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR102383776B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115505262B (zh) * | 2021-06-07 | 2024-04-09 | 达迈科技股份有限公司 | 高分子薄膜及其制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110010009A (ko) * | 2009-07-23 | 2011-01-31 | 코오롱인더스트리 주식회사 | 폴리이미드 제조 방법, 이에 의해 제조된 폴리이미드 및 상기 폴리이미드로 제조된 필름 |
KR20150080221A (ko) * | 2013-12-31 | 2015-07-09 | 에스케이이노베이션 주식회사 | 폴리아믹산 수지 조성물, 이로부터 제조된 폴리이미드 수지 및 폴리이미드 기판 |
KR101838333B1 (ko) * | 2014-02-13 | 2018-03-13 | 주식회사 엘지화학 | 폴리이미드계 필름 및 이의 제조방법 |
JP2016188298A (ja) | 2015-03-30 | 2016-11-04 | 新日鉄住金化学株式会社 | ポリイミド、樹脂フィルム、金属張積層体及び回路基板 |
-
2021
- 2021-03-26 KR KR1020210039735A patent/KR102383776B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20210038508A (ko) | 2021-04-07 |
KR102383776B1 (ko) | 2022-04-08 |
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Legal Events
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A107 | Divisional application of patent | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application | ||
X091 | Application refused [patent] | ||
AMND | Amendment | ||
X701 | Decision to grant (after re-examination) | ||
G170 | Re-publication after modification of scope of protection [patent] |