KR102338812B1 - Silicone heat dissipation adhesive - Google Patents
Silicone heat dissipation adhesive Download PDFInfo
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- KR102338812B1 KR102338812B1 KR1020210115627A KR20210115627A KR102338812B1 KR 102338812 B1 KR102338812 B1 KR 102338812B1 KR 1020210115627 A KR1020210115627 A KR 1020210115627A KR 20210115627 A KR20210115627 A KR 20210115627A KR 102338812 B1 KR102338812 B1 KR 102338812B1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Abstract
Description
본 발명은 실리콘 방열 점착제에 관한 것으로서, 보다 상세하게는 전자제품에 적용하여 전자제품의 기동시 방열 특성을 높임으로써 전자제품의 기능장애가 발생하지 않도록 하되, 장기간 사용하여도 열전도성 저하, 내구성 저하, 층간 내열성 저하, 박리성 증가 등의 문제가 발생하지 않고 장수명화를 달성할 수 있도록 개선된 실리콘 방열 점착제에 관한 것이다. The present invention relates to a silicone heat dissipation adhesive, and more particularly, it is applied to electronic products to increase heat dissipation properties when the electronic products are started, thereby preventing malfunctions of electronic products, and reducing thermal conductivity, lowering durability, It relates to an improved silicone heat-dissipating pressure-sensitive adhesive so as to achieve a longer life without problems such as a decrease in interlayer heat resistance and an increase in peelability.
디스플레이 패널 제조시, 접착 매개체로서 투명한 점착제 또는 시트 형태로 점착제가 사용된다. 예컨대, 도 1에 도시한 바와 같이 글라스 등의 상부 패널(11)과, 글라스, LCD 패널 등의 하부 패널(13)을 접착하기 위해 이들(11,13) 사이에 점착제(12)가 개재된다. In manufacturing a display panel, a transparent adhesive or an adhesive in the form of a sheet is used as an adhesive medium. For example, as shown in FIG. 1 , an adhesive 12 is interposed between the
그런데, 상기 점착제는 그 역할상 점착성이 양호해야 할 뿐만 아니라 광 특성(특히 광투과율) 또한 양호해야만 한다. However, the pressure-sensitive adhesive should not only have good adhesion in view of its role, but also have good optical properties (especially light transmittance).
따라서, 다양한 종류의 디스플레이 패널에 폭넓게 사용할 수 있는 점착제가 요구되고 있다. Accordingly, there is a demand for an adhesive that can be widely used in various types of display panels.
한편, 전자제품의 경우 사용시 발열에 따른 기능 장애를 극복하기 위해 많은 시도들이 제안되어 있다.On the other hand, in the case of electronic products, many attempts have been proposed to overcome functional problems caused by heat generation during use.
일 예로, 전자제품(혹은 전자부품)의 발열량을 줄이기 위해 히트싱크와 방열 금속판 등의 방열체를 사용하여 열을 확산시키는 방법이 있다.As an example, in order to reduce the amount of heat generated by an electronic product (or electronic component), there is a method of diffusing heat using a heat sink and a heat sink such as a heat dissipation metal plate.
하지만, 효과가 뛰어난 방열체라고 하더라도 이를 부착 고정하기 위한 점착제이 방열 특성이 떨어지면 그 효과가 반감되는 단점이 있다.However, even with an excellent heat dissipator, if the heat dissipation property of the adhesive for attaching and fixing it is inferior, the effect is reduced by half.
이에, 방열특성이 우수한 점착제를 개발하려는 노력들이 경주되었으며, 그 일환으로 일본특허공개공보 평06-88061호, 일본특허공개공보 제2000-281997호 등 다수가 있으나, 여전한 열전도성 저하, 내구성 저하, 층간 내열성 저하, 박리성 증가 등의 한계에 부딪혀 있는 실정이다.Accordingly, efforts have been made to develop an adhesive having excellent heat dissipation properties, and as a part of it, there are many such as Japanese Patent Application Laid-Open No. 06-88061 and Japanese Unexamined Patent Publication No. 2000-281997, but still thermal conductivity deterioration, durability deterioration, It is facing limitations such as a decrease in interlayer heat resistance and an increase in peelability.
본 발명은 상술한 바와 같은 종래 기술상의 한계점을 감안하여 이를 해결하고자 창출된 것으로, 전자제품에 적용하여 전자제품의 기동시 방열 특성을 높임으로써 전자제품의 기능장애가 발생하지 않도록 하되, 장기간 사용하여도 열전도성 저하, 내구성 저하, 층간 내열성 저하, 박리성 증가 등의 문제가 발생하지 않고 장수명화를 달성할 수 있도록 개선된 실리콘 방열 점착제를 제공함에 그 주된 목적이 있다.The present invention was created to solve this problem in consideration of the limitations of the prior art as described above. It is applied to electronic products to increase heat dissipation characteristics when the electronic products are started to prevent malfunction of the electronic products from occurring, but even after long-term use. Its main purpose is to provide an improved silicone heat-dissipating pressure-sensitive adhesive to achieve a longer life without problems such as lowering of thermal conductivity, lowering durability, lowering interlayer heat resistance, and increasing peelability.
본 발명은 상기한 과제를 달성하기 위한 수단으로, 실리콘 검(Gum) 5-10중량%, 구리 분말 5-10중량%, 산화알루미늄 분말 10-15중량%, 흑연 분말 5-10중량%, 탄화규소 분말 2-5중량%, 이소헥산 10-20중량%, 은 분말 1-3중량%, 자일렌 1-3중량%, 백금 분말 1-2중량% 및 나머지 실리콘수지로 조성된 것을 특징으로 하는 실리콘 방열 점착제를 제공한다.The present invention is a means for achieving the above object, silicon gum (Gum) 5-10% by weight, copper powder 5-10% by weight, aluminum oxide powder 10-15% by weight, graphite powder 5-10% by weight, carbonization 2-5% by weight of silicon powder, 10-20% by weight of isohexane, 1-3% by weight of silver powder, 1-3% by weight of xylene, 1-2% by weight of platinum powder and the remaining silicone resin A silicone heat dissipation adhesive is provided.
또한, 본 발명은 상기한 과제를 달성하기 위한 수단으로, 실리콘 검(Gum) 5-10중량%, 구리 분말 5-10중량%, 산화알루미늄 분말 10-15중량%, 흑연 분말 5-10중량%, 탄화규소 분말 2-5중량%, 이소헥산 10-20중량%, 은 분말 1-3중량%, 자일렌 1-3중량%, 백금 분말 1-2중량% 및 나머지는 혼합수지로 조성되되, 상기 혼합수지는 실리콘수지 80-90중량%와, 바이페닐형 에폭시수지 10-20중량%를 혼합한 것을 특징으로 하는 실리콘 방열 점착제도 제공한다.In addition, the present invention is a means for achieving the above object, silicon gum (Gum) 5-10% by weight, copper powder 5-10% by weight, aluminum oxide powder 10-15% by weight, graphite powder 5-10% by weight , silicon carbide powder 2-5% by weight, isohexane 10-20% by weight, silver powder 1-3% by weight, xylene 1-3% by weight, platinum powder 1-2% by weight, and the remainder is composed of a mixed resin, The mixed resin also provides a silicone heat-dissipating adhesive, characterized in that 80-90% by weight of a silicone resin and 10-20% by weight of a biphenyl type epoxy resin are mixed.
이때, 상기 실리콘 방열 점착제에는 상기 실리콘수지 100중량부에 대해 아크릴로니트릴 10-12중량부를 더 첨가혼합할 수 있다.At this time, 10-12 parts by weight of acrylonitrile may be further added and mixed with the silicone heat-dissipating pressure-sensitive adhesive based on 100 parts by weight of the silicone resin.
또한, 상기 실리콘 방열 점착제에는 베이스수지를 혼합수지로 할 때, 상기 혼합수지 100중량부에 대해 아크릴로니트릴 10-12중량부를 더 첨가혼합할 수 있다.In addition, when the base resin is a mixed resin in the silicone heat dissipation adhesive, 10-12 parts by weight of acrylonitrile may be further added and mixed with respect to 100 parts by weight of the mixed resin.
본 발명에 따르면, 전자제품에 적용하여 전자제품의 기동시 방열 특성을 높임으로써 전자제품의 기능장애가 발생하지 않도록 하되, 장기간 사용하여도 열전도성 저하, 내구성 저하, 층간 내열성 저하, 박리성 증가 등의 문제가 발생하지 않고 장수명화를 달성할 수 있도록 개선된 효과를 얻을 수 있다.According to the present invention, it is applied to electronic products to prevent malfunction of electronic products by increasing heat dissipation characteristics when starting up electronic products, but to reduce thermal conductivity, decrease durability, decrease interlayer heat resistance, increase peelability, etc. An improved effect can be obtained so that a long life can be achieved without problems occurring.
도 1은 일반적인 디스플레이 패널의 층 구조를 보여주는 개념도이다.1 is a conceptual diagram showing a layer structure of a general display panel.
이하, 본 발명의 바람직한 실시예를 첨부된 도면들을 참조하여 상세히 설명한다. 본 발명을 설명함에 있어, 관련된 공지 구성 또는 기능에 대한 구체적인 설명이 본 발명의 요지를 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명은 생략한다. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.
본 발명에 따른 실리콘 방열 점착제는 실리콘 검(Gum) 5-10중량%, 구리 분말 5-10중량%, 산화알루미늄 분말 10-15중량%, 흑연 분말 5-10중량%, 탄화규소 분말 2-5중량%, 이소헥산 10-20중량%, 은 분말 1-3중량%, 자일렌 1-3중량%, 백금 분말 1-2중량% 및 나머지 실리콘수지로 조성된다.Silicone heat-dissipating pressure-sensitive adhesive according to the present invention is silicone gum (Gum) 5-10% by weight, copper powder 5-10% by weight, aluminum oxide powder 10-15% by weight, graphite powder 5-10% by weight, silicon carbide powder 2-5 % by weight, isohexane 10-20% by weight, silver powder 1-3% by weight, xylene 1-3% by weight, platinum powder 1-2% by weight, and the rest of the silicone resin.
이때, 실리콘 검은 광투과율이 우수하여 고투명성을 확보하기 위해 첨가되는 것으로, 용매인 이소헥산에 의해 용해된다.At this time, the silicone gum is added to secure high transparency due to excellent light transmittance, and is dissolved by isohexane as a solvent.
특히, 실리콘 검을 사용하는 이유는 점착성은 저하시키지 않으면서 투명성은 높여야 하기 때문이다.In particular, the reason for using the silicone gum is that the transparency must be increased without reducing the adhesion.
그리고, 본 발명에서는 실리콘 검과 이소헥산을 반드시 함께 투입해야 하며, 이들의 혼합비는 실리콘 검과 이소헥산이 1:2의 중량비로 혼합되어야 한다.And, in the present invention, silicone gum and isohexane must be added together, and their mixing ratio must be mixed with silicone gum and isohexane in a weight ratio of 1:2.
또한, 구리 분말은 전성과 연성이 뛰어나고 전기 전도도 뿐만 아니라, 열전도성도 뛰어나기 때문에 계면간 접지력과 부착력 및 방열특성을 강화시키기 위해 첨가된다.In addition, copper powder has excellent malleability and ductility, and has excellent electrical conductivity as well as thermal conductivity.
뿐만 아니라, 산화알루미늄 분말은 점착제의 점착 후 형태성을 유지하면서 열전도성 필러 특성을 구현하여 방열특성을 증대시키기 위해 첨가된다.In addition, aluminum oxide powder is added to improve heat dissipation properties by implementing thermally conductive filler properties while maintaining the formability after adhesion of the pressure-sensitive adhesive.
아울러, 흑연 분말은 분산안정성과 열전달특성이 우수하여 방열성을 강화시키기 위해 첨가된다.In addition, graphite powder is added to enhance heat dissipation due to excellent dispersion stability and heat transfer properties.
나아가, 탄화규소 분말은 고경도, 고내열성 및 금속 알루미늄보다 큰 열전도율(熱傳導率)을 갖고 있어 전자부품의 방열성 강화용 점착제 조성물로 매우 적합하다.Furthermore, silicon carbide powder has high hardness, high heat resistance, and thermal conductivity greater than that of metallic aluminum, so it is very suitable as a pressure-sensitive adhesive composition for enhancing heat dissipation of electronic parts.
그리고, 은 분말은 전기전도도 뿐만 아니라, 열전도율을 높이기 위해 첨가되며; 자일렌은 점착 특성, 특히 접착에 가깝게 유지하여 부착력을 강화시킴으로써 박리 억제력을 높이기 위해 첨가된다.In addition, silver powder is added to increase thermal conductivity as well as electrical conductivity; Xylene is added to enhance peeling inhibition by strengthening adhesion properties, especially by keeping close to adhesion.
또한, 백금 분말은 실리콘수지 내에서 하이드로실릴화 반응을 통해 경화반응을 촉진하기 위해 첨가된다.In addition, platinum powder is added to promote the curing reaction through the hydrosilylation reaction in the silicone resin.
아울러, 실리콘수지는 점착 성능을 발휘하기 위한 베이스수지이다.In addition, the silicone resin is a base resin for exhibiting adhesive performance.
이와 같이 구성하게 되면, 본 발명에 따른 실리콘 방열 점착제는 장기간 사용하여도 열전도성 저하, 내구성 저하, 층간 내열성 저하, 박리성 증가 등의 문제가 발생하지 않고 장수명화를 달성할 수 있게 된다.With this configuration, the silicone heat-dissipating pressure-sensitive adhesive according to the present invention can achieve long life without problems such as thermal conductivity degradation, durability degradation, interlayer heat resistance degradation, and peelability increase even after long-term use.
이에 더하여, 본 발명에서는 베이스수지를 실리콘수지 단독으로 하지 않고, 실리콘수지 80-90중량%와, 바이페닐형 에폭시수지 10-20중량%를 혼합한 혼합수지를 사용할 수 있다.In addition, in the present invention, the base resin is not a silicone resin alone, but a mixed resin in which 80-90% by weight of a silicone resin and 10-20% by weight of a biphenyl type epoxy resin are mixed can be used.
이 경우, 바이페닐형 에폭시수지를 혼합함으로써 베이스수지가 고온 다습 조건에서도 점착기능을 유지할 수 있도록 하는 특성을 강화시키게 된다.In this case, by mixing the biphenyl-type epoxy resin, the characteristics of the base resin to maintain the adhesive function even under high temperature and high humidity conditions are strengthened.
뿐만 아니라, 본 발명에서는 점착제가 도포되고 경화된 후에 쉽게 박리되는 것을 막고 고정안정성, 즉 고부착력을 유지할 수 있도록 상기 베이스수지 100중량부에 대해 아크릴로니트릴 10-12중량부를 더 첨가할 수 있다.In addition, in the present invention, 10-12 parts by weight of acrylonitrile can be further added to 100 parts by weight of the base resin to prevent easy peeling after the adhesive is applied and cured and to maintain fixing stability, that is, high adhesion.
때문에, 상기 아크릴로니트릴은 실리콘수지를 단독으로 하는 단독형의 경우는 물론, 바이페닐형 에폭시수지를 혼합한 혼합수지 형태인 혼합형의 경우에도 모두 적용될 수 있다.Therefore, the acrylonitrile can be applied to both the case of a single type using a silicone resin alone, as well as a mixed type of a mixed resin type in which a biphenyl type epoxy resin is mixed.
즉, 단독형의 경우에는 베이스수지가 실리콘수지이므로 실리콘수지 100중량부에 대해 아크릴로니트릴 10-12중량부가 더 첨가되는 형태일 것이고; 혼합형의 경우에는 베이스수지가 혼합수지이므로 혼합수지 100중량부에 대해 아크릴로니트릴 10-12중량부가 더 첨가되는 형태일 것이다.That is, in the case of a single type, since the base resin is a silicone resin, 10-12 parts by weight of acrylonitrile is further added to 100 parts by weight of the silicone resin; In the case of the mixed type, since the base resin is a mixed resin, 10-12 parts by weight of acrylonitrile is further added to 100 parts by weight of the mixed resin.
또한, 본 발명에서는 점착제의 경화촉진 및 경화 안정화를 위해 상기 베이스수지 100중량부에 대해 트리페닐포스핀을 15-20중량부 더 첨가하여 실리콘 방열 점착제를 구성할 수 있다.In addition, in the present invention, 15-20 parts by weight of triphenylphosphine can be further added to 100 parts by weight of the base resin to form a silicone heat-dissipating adhesive for promoting curing and stabilizing the curing of the pressure-sensitive adhesive.
특히, 본 발명에서는 점착제의 경화 후 경도 증가를 억제하여 신율을 유지함으로써 크랙이나 탈락을 차단하도록 상기 베이스수지 100중량부에 대해 폴리실록산을 5-10중량부 더 첨가하여 실리콘 방열 점착제를 구성할 수 있다.In particular, in the present invention, 5-10 parts by weight of polysiloxane is further added to 100 parts by weight of the base resin to prevent cracks or drop-offs by maintaining elongation by suppressing the increase in hardness after curing of the adhesive to configure a silicone heat dissipating adhesive. .
뿐만 아니라, 본 발명에서는 내열성을 확보하여 점착특성 강화, 점착제의 열화 방지 및 장수명화, 고방열특성 증대를 위해 상기 베이스수지 100중량부에 대해, 크실렌디아민과 디페닐피레라진이 2:1의 중량비로 혼합된 혼합물 15-20중량부를 더 첨가하여 실리콘 방열 점착제를 구성할 수 있다.In addition, in the present invention, xylenediamine and diphenylpyrerazine are used in a weight ratio of 2:1 with respect to 100 parts by weight of the base resin in order to secure heat resistance to strengthen adhesive properties, prevent deterioration of the adhesive, increase lifespan, and increase high heat dissipation properties. 15-20 parts by weight of the mixed mixture may be further added to constitute a silicone heat dissipation adhesive.
나아가, 본 발명에서는 배합 후 도포시 공기방울이 생기지 않도록 하여 도포불량이나 계면 들뜸에 의한 점착불량, 방열특성 불량을 미연에 방지할 수 있도록 상기 베이스수지 100중량부에 대해, 폴리아미드수지와 N-에틸에탄올을 6:4의 중량비로 혼합한 혼합물 10-20중량부를 더 첨가하여 실리콘 방열 점착제를 구성할 수도 있다.Furthermore, in the present invention, polyamide resin and N-ethyl with respect to 100 parts by weight of the base resin, so that air bubbles are not generated during application after blending, so that poor adhesion due to poor coating or interfacial floating, and poor heat dissipation properties can be prevented in advance. A silicone heat-dissipating adhesive may be formed by further adding 10-20 parts by weight of a mixture in which ethanol is mixed in a weight ratio of 6:4.
이때, 상술한 첨가물은 앞서 설명한 단독형과 혼합형의 설명과 동일하게 적용된다. 다만, 설명의 편의를 위해 단독형인 실리콘수지를 기준으로 설명한 것에 불과할 뿐이다.In this case, the above-described additives are applied in the same manner as described above for the single type and the mixed type. However, for convenience of explanation, it is only described based on a single type of silicone resin.
즉, 혼합형의 경우는 기준이 혼합수지가 됨은 자명하다 하겠다.That is, in the case of a mixed type, it is obvious that the standard is a mixed resin.
이하, 실시예에 대하여 설명한다.Hereinafter, an Example is demonstrated.
[실시예][Example]
본 발명에 따라 베이스수지를 단독형으로 구성한 조성물을 발명예1로 하고, 베이스수지를 혼합형으로 구성한 조성물을 발명예2로 하였으며, 비교예는 당해 분야에서 일반적으로 사용되는 점착제로 하였다.According to the present invention, the composition composed of a single type of the base resin was referred to as Invention Example 1, the composition composed of the base resin as a mixed type was referred to as Invention Example 2, and the comparative example was an adhesive generally used in the art.
먼저, 방열특성은 LED 소자에 방열판을 점착제로 부착 경화시킨 후 동일한 가열원으로 30분간 가열하였다. 이때, 가열원의 최대온도는 70℃를 초과하지 못하도록 제한하였다.First, the heat dissipation characteristics were cured by attaching a heat sink to the LED element with an adhesive, and then heating with the same heating source for 30 minutes. At this time, the maximum temperature of the heating source was limited not to exceed 70 ℃.
실험결과, 발명예1,2는 각각 21.5℃, 22℃에서 46.5℃와 48℃까지 상승한 반면, 비교예는 22℃에서 42.5℃까지 밖에 상승하지 못하였다. 즉, 그 만큼 본 발명에 따른 점착제의 방열특성이 우수한 것으로 확인되었다.As a result of the experiment, Inventive Examples 1 and 2 increased from 21.5°C and 22°C to 46.5°C and 48°C, respectively, whereas Comparative Examples only increased from 22°C to 42.5°C. That is, it was confirmed that the heat dissipation characteristics of the pressure-sensitive adhesive according to the present invention were excellent.
또한, 본 발명에 따른 점착제의 인장강도를 인하기 위해 KSM 6518에 의해 테스트하였다.In addition, in order to check the tensile strength of the adhesive according to the present invention, it was tested according to KSM 6518.
테스트 결과, 발명예1,2는 인장강도가 각각 25.1MPa, 25.6MPa였지만, 비교예는 21MPa였다. 이를 통해, 본 발명의 점착제는 쉽게 파손되지 않고, 쉽게 들뜨지 않으며, 쉽게 박리되지 않아 장수명화를 유지할 수 있음을 확인하였다.As a result of the test, the tensile strengths of Inventive Examples 1 and 2 were 25.1 MPa and 25.6 MPa, respectively, but the Comparative Example was 21 MPa. Through this, it was confirmed that the pressure-sensitive adhesive of the present invention is not easily broken, is not easily lifted, and is not easily peeled off so that it can maintain a long life.
Claims (4)
상기 실리콘 방열 점착제에는 상기 실리콘수지 100중량부에 대해 아크릴로니트릴 10-12중량부를 더 첨가혼합한 것을 특징으로 하는 실리콘 방열 점착제.Silicon gum (Gum) 5-10% by weight, copper powder 5-10% by weight, aluminum oxide powder 10-15% by weight, graphite powder 5-10% by weight, silicon carbide powder 2-5% by weight, isohexane 10-20 % by weight, silver powder 1-3% by weight, xylene 1-3% by weight, platinum powder 1-2% by weight, and the remaining silicone resin to constitute a silicone heat dissipation adhesive,
Silicone heat dissipation adhesive, characterized in that the silicone heat dissipation adhesive is further mixed with 10-12 parts by weight of acrylonitrile with respect to 100 parts by weight of the silicone resin.
상기 실리콘 방열 점착제에는 상기 혼합수지 100중량부에 대해 아크릴로니트릴 10-12중량부를 더 첨가혼합한 것을 특징으로 하는 실리콘 방열 점착제.
3. The method of claim 2,
Silicone heat dissipation adhesive, characterized in that the silicone heat dissipation adhesive is further mixed with 10-12 parts by weight of acrylonitrile with respect to 100 parts by weight of the mixed resin.
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