KR102290765B9 - 적층형 구조의 led 기판 - Google Patents

적층형 구조의 led 기판

Info

Publication number
KR102290765B9
KR102290765B9 KR1020190140951A KR20190140951A KR102290765B9 KR 102290765 B9 KR102290765 B9 KR 102290765B9 KR 1020190140951 A KR1020190140951 A KR 1020190140951A KR 20190140951 A KR20190140951 A KR 20190140951A KR 102290765 B9 KR102290765 B9 KR 102290765B9
Authority
KR
South Korea
Prior art keywords
led
stacked structure
stacked
led led
Prior art date
Application number
KR1020190140951A
Other languages
English (en)
Other versions
KR102290765B1 (ko
KR20210054821A (ko
Inventor
안종욱
박정환
심재곤
배정빈
정현우
Original Assignee
(주)올릭스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)올릭스 filed Critical (주)올릭스
Priority to KR1020190140951A priority Critical patent/KR102290765B1/ko
Priority to JP2019568287A priority patent/JP2022518302A/ja
Priority to PCT/KR2019/016303 priority patent/WO2021091000A1/ko
Priority to US16/620,968 priority patent/US20210336092A1/en
Publication of KR20210054821A publication Critical patent/KR20210054821A/ko
Application granted granted Critical
Publication of KR102290765B1 publication Critical patent/KR102290765B1/ko
Publication of KR102290765B9 publication Critical patent/KR102290765B9/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
KR1020190140951A 2019-11-06 2019-11-06 적층형 구조의 led 기판 KR102290765B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020190140951A KR102290765B1 (ko) 2019-11-06 2019-11-06 적층형 구조의 led 기판
JP2019568287A JP2022518302A (ja) 2019-11-06 2019-11-26 積層型構造のｌｅｄ基板
PCT/KR2019/016303 WO2021091000A1 (ko) 2019-11-06 2019-11-26 적층형 구조의 led 기판
US16/620,968 US20210336092A1 (en) 2019-11-06 2019-11-26 Led with stacked structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190140951A KR102290765B1 (ko) 2019-11-06 2019-11-06 적층형 구조의 led 기판

Publications (3)

Publication Number Publication Date
KR20210054821A KR20210054821A (ko) 2021-05-14
KR102290765B1 KR102290765B1 (ko) 2021-08-20
KR102290765B9 true KR102290765B9 (ko) 2022-04-15

Family

ID=75848518

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190140951A KR102290765B1 (ko) 2019-11-06 2019-11-06 적층형 구조의 led 기판

Country Status (4)

Country Link
US (1) US20210336092A1 (ko)
JP (1) JP2022518302A (ko)
KR (1) KR102290765B1 (ko)
WO (1) WO2021091000A1 (ko)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1448031A1 (en) * 2003-02-13 2004-08-18 Yang, Pi-Fu Concave cup printed circuit board for light emitting diode and method for producing the same
WO2008105527A1 (ja) * 2007-03-01 2008-09-04 Nec Lighting, Ltd. Ｌｅｄ装置及び照明装置
TW200843135A (en) * 2007-04-23 2008-11-01 Augux Co Ltd Method of packaging light emitting diode with high heat-dissipating efficiency and the structure thereof
KR100976607B1 (ko) * 2008-09-10 2010-08-17 주식회사 코스모인 씨오엠(ｃｏｍ) 형 발광다이오드 패키지, 이를 이용한 발광다이오드 모듈 및 그 제조방법
JP5277085B2 (ja) * 2009-06-18 2013-08-28 スタンレー電気株式会社 発光装置及び発光装置の製造方法
KR101105454B1 (ko) * 2009-08-10 2012-01-17 심현섭 엘이디 조명장치용 인쇄회로기판 및 그의 제조방법
KR101162541B1 (ko) * 2009-10-26 2012-07-09 주식회사 두산 패키지용 인쇄회로기판 및 그 제조방법
KR20130014755A (ko) * 2011-08-01 2013-02-12 엘지이노텍 주식회사 발광 소자 패키지 및 조명 시스템
JP5936885B2 (ja) 2012-03-05 2016-06-22 シチズンホールディングス株式会社 半導体発光装置
KR20140013612A (ko) * 2012-07-25 2014-02-05 서호이노베이션(주) 칩 온 메탈 타입 인쇄회로기판 제조방법
KR101448165B1 (ko) 2013-11-27 2014-10-08 지엘비텍 주식회사 금속 본딩 회로 패턴을 독립적으로 구성하고，어레이가 형성되어 직병렬 연결 구조가 가능하게 한 ｃｏｂ 또는 ｃｏｍ 형태의 ｌｅｄ 모듈
JP6293914B2 (ja) 2014-09-30 2018-03-14 株式会社東芝 Ｌｅｄモジュール及び照明装置

Also Published As

Publication number Publication date
KR102290765B1 (ko) 2021-08-20
JP2022518302A (ja) 2022-03-15
US20210336092A1 (en) 2021-10-28
KR20210054821A (ko) 2021-05-14
WO2021091000A1 (ko) 2021-05-14

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Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
G170 Re-publication after modification of scope of protection [patent]
G170 Re-publication after modification of scope of protection [patent]