KR102207890B1 - Manufacturing Method of Powder Coating Materials - Google Patents

Manufacturing Method of Powder Coating Materials Download PDF

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KR102207890B1
KR102207890B1 KR1020190034063A KR20190034063A KR102207890B1 KR 102207890 B1 KR102207890 B1 KR 102207890B1 KR 1020190034063 A KR1020190034063 A KR 1020190034063A KR 20190034063 A KR20190034063 A KR 20190034063A KR 102207890 B1 KR102207890 B1 KR 102207890B1
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powder coating
heat
heat dissipating
weight
dissipating powder
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KR20200113607A (en
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오원태
박성엽
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동의대학교 산학협력단
비엔비머티리얼 주식회사
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D167/00Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03Powdery paints
    • C09D5/033Powdery paints characterised by the additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • C08K2003/2241Titanium dioxide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • C08K2003/265Calcium, strontium or barium carbonate

Abstract

본 발명은 소성 처리된 알루미늄실리케이트를 이용한 방열성 분체도료에 관한 것으로, 본 발명에 따른 소성 처리된 알루미늄실리케이트 및 이산화티타늄, 알루미나, 이산화규소 및 탄산칼슘으로 이루어진 군으로부터 선택되는 1종을 열전도성 필러로 이용하여 제조된 방열성 분체도료는 탄소 소재를 배제하여 제조되었으며, 열전도 효과 및 방열 효과가 우수하여 조명등기구, 전자기기용 하우징 또는 부품, 자동차 전장품, 변압기 외판 또는 부품, 방열판, 열교환기 등의 제조에 이용할 수 있고, 기존의 분체도료의 방열 특성을 개선하여, 발열체의 열 축적을 방지할 수 있는 효과가 있다.The present invention relates to a heat dissipating powder coating using a fired aluminum silicate, and one selected from the group consisting of fired aluminum silicate and titanium dioxide, alumina, silicon dioxide and calcium carbonate according to the present invention as a thermally conductive filler. The heat-dissipating powder coating manufactured by using is manufactured by excluding carbon materials, and has excellent heat conduction and heat dissipation effects, so it can be used for manufacturing lighting fixtures, housings or parts for electronic devices, automobile electronics, transformer outer plates or parts, heat sinks, heat exchangers, etc. And, by improving the heat dissipation characteristics of the existing powder coating, there is an effect of preventing heat accumulation in the heating element.

Description

방열분체도료 제조기술{Manufacturing Method of Powder Coating Materials}Heat dissipation powder coating manufacturing technology {Manufacturing Method of Powder Coating Materials}

본 발명은 소성 처리된 알루미늄실리케이트를 이용한 방열성 분체도료에 관한 것으로, 구체적으로 소성 처리된 알루미늄실리케이트 및 이산화티타늄, 알루미나, 이산화규소 및 탄산칼슘으로 이루어진 군으로부터 선택되는 1종을 열전도성 필러로 이용하여 제조된 방열성 분체도료에 관한 것이다.The present invention relates to a heat dissipating powder coating using sintered aluminum silicate, and specifically, using sintered aluminum silicate and one selected from the group consisting of titanium dioxide, alumina, silicon dioxide and calcium carbonate as a thermally conductive filler. It relates to the prepared heat dissipating powder coating.

전자기기 제품이나 조명 제품 등을 비롯하여 방열이 요구되는 제품은, 발열효율에 따라 제품의 수명이 많은 영향을 받기 때문에 방열성능을 높이기 위한 많은 노력이 이루어지고 있다. 이들 제품들의 방열성능을 높이기 위한 방안으로 제품의 외장을 방열성 도료로 코팅하는 기술에 대한 수요가 증가하고 있다. 다시 말해 발열체의 열 축적을 방지하고, 열이 많이 발생하는 전자기기의 과열에 의한 고장, 화재, 폭발 등의 사고를 방지하기 위한 방법으로 방열 기능성 도료를 도포하는 제품에 대한 수요가 증가하고 있다.For products requiring heat dissipation, including electronic products and lighting products, a lot of efforts have been made to increase heat dissipation performance because the life of the product is greatly affected by the heating efficiency. As a way to increase the heat dissipation performance of these products, there is an increasing demand for a technology that coats the exterior of the product with a heat dissipation paint. In other words, as a method to prevent heat accumulation of a heating element and prevent accidents such as failure, fire, and explosion due to overheating of electronic devices that generate a lot of heat, there is an increasing demand for products that apply heat-dissipating functional paints.

한편, 액상도료는 용제에서 발생되는 다양한 휘발성 유기화합물들이 인체에 유해하여 아토피와 같은 피부질환이나 호흡기질환을 유발시키기도 하며, 대기도 오염시키는 단점이 있다. 이에 반해, 분체도료는 용제를 사용하지 않기 때문에 액상도료처럼 휘발성 유기화합물이 발생되지 않아 액상도료에 비해 친환경적이며, 인체에도 유해하지 않으며. 원하는 두께의 도막을 손쉽게 얻을 수 있는 장점이 있다. 또한, 분체도료는 금속기재 표면 보호, 광택 등의 개선 목적으로도 많은 제품에 광범위한 코팅기술로 적용되고 있다.On the other hand, liquid paints have disadvantages that various volatile organic compounds generated from solvents are harmful to the human body, causing skin diseases such as atopy or respiratory diseases, and polluting the atmosphere. On the other hand, powder paints do not use solvents, so volatile organic compounds are not generated like liquid paints, so they are more environmentally friendly than liquid paints, and are not harmful to the human body. There is an advantage of being able to easily obtain a coating film of a desired thickness. In addition, powder coatings are widely applied to many products for the purpose of improving the surface protection and gloss of metal substrates.

상술한 바와 같은 도료의 특성으로 인해 최근에는 액상도료의 사용이 자제되고, 분체도료의 사용이 장려되고 있는 실정이나, 방열성 도료들은 거의 대부분 액상도료이다. 방열성을 가지는 분체도료가 몇몇 제안되기는 하였으나, 방열성이 미미하며, 일반적인 분체도료 조성에 흑연, 탄소나노튜브, 또는 그래핀 등과 같은 탄소소재를 첨가하는 방법으로 방열특성을 구현하고 있다.Due to the characteristics of the above-described paints, the use of liquid paints has been restricted in recent years, and the use of powder paints is being encouraged, but most of the heat dissipating paints are liquid paints. Although some powder paints having heat dissipation have been proposed, heat dissipation properties are insignificant, and heat dissipation properties are implemented by adding a carbon material such as graphite, carbon nanotubes, or graphene to the general powder coating composition.

그러나 탄소소재(흑연, 탄소나노튜브, 그래핀 등)를 사용하면 열전도와 방열특성은 쉽게 향상시킬 수 있으나, 전체적으로 도료의 색상이 검은색을 띄게 되어 다양한 제품의 외관에 도포시 선택이 제한적이고, 다른 색상으로 변환이 불가하다. 그리고 사용되는 탄소소재의 가격이 매우 높아 개발되는 분체도료의 생산비용이 높아지는 문제점이 있다.However, if carbon materials (graphite, carbon nanotubes, graphene, etc.) are used, the heat conduction and heat dissipation characteristics can be easily improved, but the overall color of the paint is black, so when applying to the exterior of various products, the selection is limited. It cannot be converted to other colors. In addition, the cost of the carbon material used is very high, and the production cost of the powder coating to be developed is increased.

이에, 본 발명자들은 탄소소재를 배제한 방열분체도료 제조 기술을 연구하던 중, 소성 처리된 알루미늄실리케이트(aluminum silicate)를 이용한 방열분체도료를 개발하였고, 상기 방열분체도료의 열전도 효과 및 방열 효과가 우수함을 확인하여 본 발명을 완성하였다.Accordingly, the inventors of the present invention developed a heat-dissipating powder paint using sintered aluminum silicate while researching a technology for manufacturing a heat-dissipating powder paint excluding carbon materials. Confirmed and completed the present invention.

한국등록특허 제10-1296285호Korean Patent Registration No. 10-1296285

본 발명의 목적은 방열성 분체도료를 제공하는 것이다.It is an object of the present invention to provide a heat dissipating powder coating.

본 발명의 다른 목적은 상기 방열성 분체도료를 이용하여 제조된 조명등기구, 전자기기용 하우징 또는 부품, 자동차 전장품, 변압기 외판 또는 부품, 방열판 및 열교환기를 제공하는 것이다.Another object of the present invention is to provide a lighting fixture manufactured using the heat dissipating powder coating, a housing or part for an electronic device, an automobile electronic product, a transformer outer plate or part, a heat sink and a heat exchanger.

상기 목적을 달성하기 위하여,To achieve the above object,

본 발명은 수지; 제1열전도성 필러로서, 소성 처리된 알루미늄실리케이트(aluminum silicate); 및 제2열전도성 필러로서, 이산화티타늄(titanium dioxide, TiO2), 알루미나(Alumina, Al2O3), 이산화규소(Silica, SiO2) 및 탄산칼슘(calcium carbonate, CaCO3)으로 이루어진 군으로부터 선택되는 1종;을 포함하는, 방열성 분체도료를 제공한다.The present invention is a resin; As the first thermally conductive filler, the sintered aluminum silicate (aluminum silicate); And as a second thermally conductive filler, from the group consisting of titanium dioxide (titanium dioxide, TiO 2 ), alumina (Alumina, Al 2 O 3 ), silicon dioxide (Silica, SiO 2 ) and calcium carbonate (calcium carbonate, CaCO 3 ) It provides a heat dissipating powder coating containing;

또한, 본 발명은 상기 방열성 분체도료를 이용하여 제조된 조명등기구, 전자기기용 하우징 또는 부품, 자동차 전장품, 변압기 외판 또는 부품, 방열판 및 열교환기를 제공한다.In addition, the present invention provides a lighting fixture manufactured using the heat dissipating powder coating, a housing or part for an electronic device, an automobile electronic product, a transformer outer plate or part, a heat sink and a heat exchanger.

본 발명에 따른 소성 처리된 알루미늄실리케이트 및 이산화티타늄, 알루미나, 이산화규소 및 탄산칼슘으로 이루어진 군으로부터 선택되는 1종을 열전도성 필러로 이용하여 제조된 방열성 분체도료는 탄소 소재를 배제하여 제조되었으며, 열전도 효과 및 방열 효과가 우수하여 조명등기구, 전자기기용 하우징 또는 부품, 자동차 전장품, 변압기 외판 또는 부품, 방열판, 열교환기 등의 제조에 이용할 수 있고, 기존의 분체도료의 방열 특성을 개선하여, 발열체의 열 축적을 방지할 수 있는 효과가 있다. 또한, 본 발명에 따른 방열성 분체도료는 탄소소재를 사용하지 않기 때문에 기본적으로 흰색을 나타내며, 다른 색상으로 변환이 자유롭고, 원료의 가격이 상대적으로 저렴하여 생산비용이 낮은 장점이 있으므로, 기존 탄소소재를 첨가한 방열성 분체도료보다 유용할 수 있다.The heat-dissipating powder coating prepared by using the calcined aluminum silicate according to the present invention and one selected from the group consisting of titanium dioxide, alumina, silicon dioxide and calcium carbonate as a thermal conductive filler was manufactured by excluding carbon materials, and Due to its excellent effect and heat dissipation effect, it can be used to manufacture lighting fixtures, housings or parts for electronic devices, automobile electronic equipment, transformer outer plates or parts, heat sinks, heat exchangers, etc., and by improving the heat dissipation properties of existing powder coatings, the heat of the heating element It has the effect of preventing accumulation. In addition, since the heat dissipating powder coating according to the present invention does not use a carbon material, it basically exhibits white color, is free to convert to other colors, and has the advantage of low production cost due to the relatively low cost of raw materials. It may be more useful than an added heat dissipating powder coating.

도 1은 본 발명에 따른 푸리에 열전도법칙을 나타낸 도이다.
도 2는 본 발명의 제조예 1에 따른 수지의 (a) 경화 전 및 (b)경화 후 형태를 나타낸 도이다.
도 3은 본 발명에 따른 실시예 및 비교예의 표면 온도(T1)와 방열 온도(방사온도, T2) 측정 방법을 나타낸 도이다.
도 4는 본 발명에 따른 실시예 4의 방열분체도료(오른쪽) 및 비교예 9의 일반분체도료(왼쪽)의 표면 온도를 열화상카메라로 촬영한 사진이다.
1 is a diagram showing the Fourier law of heat conduction according to the present invention.
FIG. 2 is a diagram showing (a) before and (b) forms of a resin according to Preparation Example 1 of the present invention.
3 is a diagram showing a method of measuring surface temperature (T1) and heat dissipation temperature (radiation temperature, T2) in Examples and Comparative Examples according to the present invention.
4 is a photograph taken with a thermal imaging camera of the surface temperatures of the heat dissipating powder coating (right) of Example 4 and the general powder coating (left) of Comparative Example 9 according to the present invention.

이하, 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail.

방열성Heat dissipation 분체도료 Powder coating

본 발명은 수지;The present invention is a resin;

제1열전도성 필러로서, 소성 처리된 알루미늄실리케이트(aluminum silicate); 및As the first thermally conductive filler, the sintered aluminum silicate (aluminum silicate); And

제2열전도성 필러로서, 이산화티타늄(titanium dioxide, TiO2), 알루미나(Alumina, Al2O3), 이산화규소(Silica, SiO2) 및 탄산칼슘(calcium carbonate, CaCO3)으로 이루어진 군으로부터 선택되는 1종;을 포함하는, 방열성 분체도료를 제공한다.As a second thermally conductive filler, selected from the group consisting of titanium dioxide (TiO 2 ), alumina (Alumina, Al 2 O 3 ), silicon dioxide (Silica, SiO 2 ) and calcium carbonate (CaCO 3 ) Provides a heat-dissipating powder coating containing;

본 발명에 따른 상기 방열성 분체도료에 있어서, 상기 수지는 폴리에스터(polyester) 및 에폭시 수지(epoxy resin) 중 1종 이상인 것일 수 있고, 바람직하게는 상기 폴리에스터 60 내지 80 중량부 및 에폭시 수지 20 내지 40 중량부 혼합하여 경화시켜 제조한 것일 수 있다.In the heat dissipating powder coating according to the present invention, the resin may be one or more of polyester and epoxy resin, preferably 60 to 80 parts by weight of polyester and 20 to epoxy resin It may be prepared by mixing 40 parts by weight and curing.

본 발명에 따른 방열성 분체도료에 있어서, 상기 방열성 분체도료는 왁스, 벤조인, 산화방지제 및 레벨링제로 이루어진 군으로부터 선택되는 1종 이상의 첨가제를 더 포함하는 것일 수 있다. 바람직하게는, 상기 첨가제는 왁스, 벤조인, 산화방지제 및 레벨링제의 혼합물을 이용하는 것일 수 있다.In the heat dissipating powder coating according to the present invention, the heat dissipating powder coating may further include one or more additives selected from the group consisting of wax, benzoin, antioxidants and leveling agents. Preferably, the additive may be to use a mixture of wax, benzoin, antioxidant and leveling agent.

본 발명에 따른 방열성 분체도료에 있어서, 상기 방열성 분체도료는, 수지 50 내지 70 중량%, 제1열전도성 필러 1 내지 40 중량%, 제2열전도성 필러 1 내지 40 중량% 및 첨가제 1 내지 10 중량% 포함하는 것일 수 있다. 바람직하게는, 수지 50 내지 70 중량%, 제1열전도성 필러 5 내지 35 중량%, 제2열전도성 필러 5 내지 35 중량% 및 첨가제 1 내지 10 중량 % 포함하는 것일 수 있고, 더 바람직하게는 수지 52 내지 68 중량%, 제1열전도성 필러 7 내지 33 중량%, 제2열전도성 필러 7 내지 33 중량% 및 첨가제 2 내지 8 중량 % 포함하는 것일 수 있고, 보다 더 바람직하게는 수지 53 내지 67 중량%, 제1열전도성 필러 8 내지 32 중량%, 제2열전도성 필러 8 내지 32 중량% 및 첨가제 3 내지 7 중량 % 포함하는 것일 수 있다.In the heat dissipating powder coating according to the present invention, the heat dissipating powder coating comprises 50 to 70% by weight of resin, 1 to 40% by weight of the first thermally conductive filler, 1 to 40% by weight of the second thermally conductive filler, and 1 to 10% by weight of additives. It may contain %. Preferably, 50 to 70% by weight of a resin, 5 to 35% by weight of a first thermally conductive filler, 5 to 35% by weight of a second thermally conductive filler, and 1 to 10% by weight of an additive may be included, and more preferably, a resin 52 to 68% by weight, 7 to 33% by weight of the first thermally conductive filler, 7 to 33% by weight of the second thermally conductive filler, and 2 to 8% by weight of additives, and even more preferably 53 to 67% by weight of the resin %, 8 to 32% by weight of the first thermally conductive filler, 8 to 32% by weight of the second thermally conductive filler, and 3 to 7% by weight of additives.

본 발명의 일실시예에 있어서, 본 발명에 따른 상기 방열성 분체도료는, 바람직하게는, 수지 50 내지 70 중량%, 제1열전도성 필러로서 소성 처리된 알루미늄실리케이트 5 내지 35 중량%, 제2열전도성 필러로서 이산화티타늄 5 내지 35 중량% 및 첨가제 1 내지 10 중량 % 포함하는 것일 수 있고, 더 바람직하게는 수지 60 내지 70 중량%, 제1열전도성 필러로서 소성 처리된 알루미늄실리케이트 15 내지 25 중량%, 제2열전도성 필러로서 이산화티타늄 5 내지 15 중량% 및 첨가제 1 내지 10 중량 % 포함하는 것일 수 있고, 보다 더 바람직하게는 수지 62 내지 68 중량%, 제1열전도성 필러로서 소성 처리된 알루미늄실리케이트 17 내지 23 중량%, 제2열전도성 필러로서 이산화티타늄 7 내지 13 중량% 및 첨가제 2 내지 8 중량 % 포함하는 것일 수 있고, 보다 더 바람직하게는 수지 63 내지 67 중량%, 제1열전도성 필러로서 소성 처리된 알루미늄실리케이트 18 내지 22 중량%, 제2열전도성 필러로서 이산화티타늄 8 내지 12 중량% 및 첨가제 3 내지 7 중량 % 포함하는 것일 수 있다.In an embodiment of the present invention, the heat dissipating powder coating according to the present invention is preferably 50 to 70% by weight of resin, 5 to 35% by weight of aluminum silicate sintered as the first thermally conductive filler, and the second thermoelectric May contain 5 to 35% by weight of titanium dioxide and 1 to 10% by weight of additives as the conductive filler, more preferably 60 to 70% by weight of resin, 15 to 25% by weight of calcined aluminum silicate as the first thermally conductive filler , As the second thermally conductive filler, it may contain 5 to 15% by weight of titanium dioxide and 1 to 10% by weight of the additive, and more preferably, 62 to 68% by weight of the resin, and the aluminum silicate subjected to sintering as the first thermally conductive filler 17 to 23% by weight, 7 to 13% by weight of titanium dioxide and 2 to 8% by weight of additives may be included as the second thermally conductive filler, more preferably 63 to 67% by weight of the resin, as the first thermally conductive filler It may include 18 to 22% by weight of sintered aluminum silicate, 8 to 12% by weight of titanium dioxide and 3 to 7% by weight of additives as the second thermally conductive filler.

본 발명의 다른 일실시예에 있어서, 본 발명에 따른 상기 방열성 분체도료는, 바람직하게는, 상기 수지 50 내지 70 중량%, 제1열전도성 필러로서 소성 처리된 알루미늄실리케이트 5 내지 35 중량%, 제2열전도성 필러로서 탄산칼슘 또는 이산화규소 5 내지 35 중량% 및 첨가제 1 내지 10 중량 % 포함하는 것일 수 있고, 더 바람직하게는 수지 50 내지 60 중량%, 제1열전도성 필러로서 소성 처리된 알루미늄실리케이트 25 내지 35 중량%, 제2열전도성 필러로서 탄산칼슘 또는 이산화규소 5 내지 15 중량% 및 첨가제 1 내지 10 중량 % 포함하는 것일 수 있고, 보다 더 바람직하게는 수지 52 내지 58 중량%, 제1열전도성 필러로서 소성 처리된 알루미늄실리케이트 27 내지 33 중량%, 제2열전도성 필러로서 탄산칼슘 또는 이산화규소 7 내지 13 중량% 및 첨가제 2 내지 8 중량 % 포함하는 것일 수 있고, 보다 더 바람직하게는 수지 53 내지 57 중량%, 제1열전도성 필러로서 소성 처리된 알루미늄실리케이트 28 내지 32 중량%, 제2열전도성 필러로서 탄산칼슘 또는 이산화규소 8 내지 12 중량% 및 첨가제 3 내지 7 중량 % 포함하는 것일 수 있다.In another embodiment of the present invention, the heat dissipating powder coating according to the present invention is preferably 50 to 70% by weight of the resin, 5 to 35% by weight of aluminum silicate calcined as the first thermally conductive filler, 2 As a thermally conductive filler, it may contain 5 to 35% by weight of calcium carbonate or silicon dioxide and 1 to 10% by weight of an additive, more preferably 50 to 60% by weight of a resin, aluminum silicate subjected to sintering as the first thermally conductive filler 25 to 35% by weight, 5 to 15% by weight of calcium carbonate or silicon dioxide and 1 to 10% by weight of additives as the second thermally conductive filler, more preferably 52 to 58% by weight of resin, first thermoelectric filler It may contain 27 to 33% by weight of calcined aluminum silicate as a conductive filler, 7 to 13% by weight of calcium carbonate or silicon dioxide and 2 to 8% by weight of additives as the second thermally conductive filler, and more preferably resin 53 To 57% by weight, 28 to 32% by weight of sintered aluminum silicate as the first thermally conductive filler, 8 to 12% by weight of calcium carbonate or silicon dioxide, and 3 to 7% by weight of additives as the second thermally conductive filler. .

본 발명의 또 다른 일실시예에 있어서, 본 발명에 따른 상기 방열성 분체도료는, 바람직하게는, 상기 수지 50 내지 70 중량%, 제1열전도성 필러로서 소성 처리된 알루미늄실리케이트 5 내지 35 중량%, 제2열전도성 필러로서 알루미나 5 내지 35 중량% 및 첨가제 1 내지 10 중량 % 포함하는 것일 수 있고, 더 바람직하게는 수지 50 내지 60 중량%, 제1열전도성 필러로서 소성 처리된 알루미늄실리케이트 5 내지 15 중량%, 제2열전도성 필러로서 알루미나 25 내지 35 중량% 및 첨가제 1 내지 10 중량 % 포함하는 것일 수 있고, 보다 더 바람직하게는 수지 52 내지 58 중량%, 제1열전도성 필러로서 소성 처리된 알루미늄실리케이트 7 내지 13 중량%, 제2열전도성 필러로서 알루미나 27 내지 33 중량% 및 첨가제 2 내지 8 중량 % 포함하는 것일 수 있고, 보다 더 바람직하게는 수지 53 내지 57 중량%, 제1열전도성 필러로서 소성 처리된 알루미늄실리케이트 8 내지 12 중량%, 제2열전도성 필러로서 알루미나 28 내지 32 중량% 및 첨가제 3 내지 7 중량 % 포함하는 것일 수 있다.In another embodiment of the present invention, the heat dissipating powder coating according to the present invention is preferably 50 to 70% by weight of the resin, 5 to 35% by weight of aluminum silicate calcined as the first thermally conductive filler, As the second thermally conductive filler, it may include 5 to 35% by weight of alumina and 1 to 10% by weight of additives, more preferably 50 to 60% by weight of resin, and 5 to 15 of aluminum silicate calcined as the first thermally conductive filler. % By weight, may contain 25 to 35% by weight of alumina and 1 to 10% by weight of additives as the second thermally conductive filler, more preferably 52 to 58% by weight of resin, and calcined aluminum as the first thermally conductive filler 7 to 13% by weight of silicate, 27 to 33% by weight of alumina and 2 to 8% by weight of additives may be included as the second thermally conductive filler, and more preferably, 53 to 57% by weight of resin, as the first thermally conductive filler It may include 8 to 12% by weight of sintered aluminum silicate, 28 to 32% by weight of alumina and 3 to 7% by weight of additives as the second thermally conductive filler.

본 발명의 일실시예에 따르면, 본 발명에 따른 방열성 분체도료는 기존 분체도료에 소성 처리된 알루미늄실리케이트를 포함시켜 제조함으로써, 소성 처리된 알루미늄실리케이트를 포함하지 않는 분체도료 또는 소성 처리되지 않은 알루미늄실리케이트를 포함시켜 제조한 분체도료 대비 분체도료를 도포한 시료의 표면 온도(T1)가 낮아지고, 방열 온도(T2)가 증가되는 효과를 나타낼 수 있다(실험예 1 참조).According to an embodiment of the present invention, the heat dissipating powder coating according to the present invention is manufactured by including a sintered aluminum silicate in an existing powder coating, so that a powder coating that does not contain the sintered aluminum silicate or an aluminum silicate that is not sintered The surface temperature (T1) of the sample coated with the powder coating is lowered and the heat dissipation temperature (T2) is increased compared to the powder coating prepared by including (see Experimental Example 1).

일반적으로, 방열 온도는 시료 표면 위 15mm 지점의 공기온도를 측정함으로써 평가하게되며, 시료의 표면 온도와 방열 온도의 온도 차이가 크다는 것은 그 시료를 통과하여 전달되는 열에너지량이 많다는 것을 의미한다(수학식 1 참조). 동일한 환경에서 열에너지가 공급되는 상황에서는 표면의 온도가 낮을수록 위 아래면의 온도차이가 크게 되므로, 시료의 열전달이 효과적임을 의미한다. 즉, 시료표면으로 동일한 열에너지가 공급되었을 때 표면의 온도가 상대적으로 낮다는 것은 시료를 통과하는 열에너지가 더 많다는 것을 의미하고 시료표면에 열에너지가 축적되지 않으며 외부(대기)로 열에너지가 잘 방출되고 있음을 의미한다. 동일한 조건에서 시료표면으로 전달되는 열에너지가 외부(대기)로 잘 방출되면 그 주변의 대기온도를 상승시키게 되어 상대적으로 높은 온도를 측정할 수 있다. 즉, 방열온도가 상대적으로 높다는 것은 시료표면으로부터 열에너지가 잘 방출되고 있음을 의미한다. In general, the heat dissipation temperature is evaluated by measuring the air temperature at a point 15 mm above the surface of the sample, and the large difference in temperature between the surface temperature of the sample and the heat dissipation temperature means that the amount of heat energy transmitted through the sample is large (Equation 1). In a situation where thermal energy is supplied in the same environment, the lower the surface temperature, the greater the difference in temperature between the top and bottom surfaces, which means that heat transfer of the sample is effective. That is, when the same heat energy is supplied to the sample surface, the relatively low temperature of the surface means that there is more heat energy passing through the sample, and thermal energy is not accumulated on the sample surface, and heat energy is well released to the outside (atmosphere). Means. If the heat energy transferred to the sample surface under the same conditions is well discharged to the outside (atmosphere), the ambient air temperature is raised, and a relatively high temperature can be measured. That is, the relatively high heat dissipation temperature means that heat energy is well released from the sample surface.

열전도 현상을 설명하는 법칙을 '열전도의 법칙' 또는 '푸리에 열전도법칙'이라고 하며, 하기 수학식 1과 같이 나타낼 수 있다(도 1 참조).The law describing the heat conduction phenomenon is referred to as the'law of heat conduction' or'the Fourier law of heat conduction', and can be expressed as Equation 1 below (see FIG. 1).

[수학식 1][Equation 1]

Figure 112019030707876-pat00001
Figure 112019030707876-pat00001

(λ = 물질의 열전도계수;(λ = thermal conductivity coefficient of the material;

q = 열전달에너지;q = heat transfer energy;

A = 열이 전달되는 수직방향의 면적;A = vertical area through which heat is transferred;

(∂T/∂x) = 열이 전달되는 방향으로 온도구배.)(∂T/∂x) = temperature gradient in the direction of heat transfer.)

한편, 탄소소재(흑연, 탄소나노튜브, 그래핀 등)를 이용한 기존의 방열성 분체도료의 경우, 열전도와 방열특성은 쉽게 향상시킬 수 있으나, 전체적으로 도료의 색상이 검은색을 띄게 되어 다양한 제품의 외관에 도포시 선택이 제한적이고, 다른 색상으로 변환이 불가하다. 그리고 사용되는 탄소소재의 가격이 매우 높아 개발되는 분체도료의 생산비용이 높아지는 문제점이 있다. On the other hand, in the case of existing heat dissipating powder coatings using carbon materials (graphite, carbon nanotubes, graphene, etc.), heat conduction and heat dissipation characteristics can be easily improved, but the overall color of the paint is black, so the appearance of various products When applied to, the selection is limited, and conversion to other colors is not possible. In addition, the cost of the carbon material used is very high, and the production cost of the powder coating to be developed is increased.

본 발명에 따른 상기 방열성 분체도료는 탄소소재를 사용하지 않기 때문에 기본적으로 흰색을 나타내며, 다른 색상으로 변환이 자유롭고, 원료의 가격이 상대적으로 저렴하여 생산비용이 낮은 장점이 있으므로, 기존 탄소소재를 첨가한 방열성 분체도료의 문제점을 해결하여 유용하게 사용될 수 있다.Since the heat dissipating powder coating according to the present invention does not use a carbon material, it basically exhibits white color, is free to convert to other colors, and has the advantage of low production cost due to relatively low cost of raw materials, so existing carbon materials are added. It can be usefully used by solving the problem of a heat dissipating powder coating.

또한, 본 발명은 상기 방열성 분체도료를 이용하여 제조된 조명등기구, 전자기기용 하우징 또는 부품, 자동차 전장품, 변압기 외판 또는 부품, 방열판 및 열교환기를 제공한다.In addition, the present invention provides a lighting fixture manufactured using the heat dissipating powder coating, a housing or part for an electronic device, an automobile electronic product, a transformer outer plate or part, a heat sink and a heat exchanger.

예를 들어, 상기 조명등기구는 방열성 분체도료를 몸체, 반사패널 또는 히트싱크에 코팅한 후 경화시켜 제조된 것일 수 있고, LED 등일 수 있으나 이에 제한되지는 않는다. 또한, 상기 열교환기는 발전소, 선박, 정유설비, 화학플랜트, 철강산업시설, 하수정화설비 및 폐수정화설비로 이루어진 군으로부터 선택되는 1종 이상에서 사용되는 열교환기일 수 있으나, 이에 제한되지는 않는다.For example, the lighting fixture may be manufactured by coating a heat-dissipating powder paint on a body, a reflective panel, or a heat sink and then curing it, and may be an LED, but is not limited thereto. In addition, the heat exchanger may be a heat exchanger used in one or more selected from the group consisting of power plants, ships, oil refining facilities, chemical plants, steel industry facilities, sewage purification facilities, and wastewater purification facilities, but is not limited thereto.

이 외에도 본 발명에 따른 상기 방열성 분체도료는 전자기기 부품 등 발열체의 열 축적 방지가 필요한 제품이라면 종류에 제한되지 않고 사용될 수 있다.In addition, the heat dissipating powder coating according to the present invention may be used without limitation if it is a product requiring heat accumulation of a heating element such as an electronic device component.

이하, 본 발명을 하기의 실시예에 의하여 더욱 상세하게 설명한다. 단, 하기의 실시예는 본 발명을 예시하는 것일 뿐, 본 발명의 내용이 하기의 실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail by the following examples. However, the following examples are merely illustrative of the present invention, and the contents of the present invention are not limited by the following examples.

<< 제조예Manufacturing example 1> 수지의 제조 1> Preparation of resin

수지는 폴리에스터(polyester) 70 중량% 및 에폭시 레진(epoxy resin) 30 중량% 혼합하여 경화시켜 제조하였다. 이때, 폴리에스터는 카르복실기(Carboxylic group: -COOH)를 갖는 Carboxyl polyester(alymers HC7803, INOPOL., CO. Ltd), 에폭시는 비스페놀-A형의 Glycidyl ether 형태의 Epoxy resin(YD-013K, 국도화학(주))을 구입하여 사용하였고, 이들의 경화 형태는 도 1과 같다.The resin was prepared by mixing 70% by weight of polyester and 30% by weight of an epoxy resin and curing. At this time, the polyester is Carboxyl polyester (alymers HC7803, INOPOL., CO. Ltd) having a carboxylic group (-COOH), and the epoxy is bisphenol-A type of Glycidyl ether type Epoxy resin (YD-013K, Kukdo Chemical). Note)) was purchased and used, and their cured form is shown in FIG. 1.

<< 실시예Example > 소성 처리된 알루미늄실리케이트를 이용한 > Using fired aluminum silicate 방열분체도료의Heat dissipation powder coating 제조 Produce

수지, 열전도성 필러 및 가공조제를 혼합하여 방열분체도료를 제조하였다.A heat dissipating powder coating was prepared by mixing a resin, a thermally conductive filler, and a processing aid.

구체적으로, 수지는 제조예 1의 수지를 이용하였다. 입도 10μm 수준의 소성처리된 알리미늄실리케이트(제조사: Hoffmann mineral; 제조국: 독일) 분말을 제1열전도성 필러(filler)로 이용하였고, 제2열전도성 필러(filler)로서, 입도 2 내지 5μm 수준의 이산화티타늄(titanium dioxide, TiO2; 쌍용화학), 입도 10μm 수준의 알루미나(Alumina, Al2O3; Denka), 입도 12μm 수준의 이산화규소(Silica, SiO2; ABC Nanotech) 및 입도 10μm 수준의 탄산칼슘(calcium carbonate, CaCO3; 성신미네필드) 중 1종의 분말을 이용하였다. 기타 성분으로서 가공조제(첨가제)는 산화방지제(Songnox 1010, 송원), 왁스(PE Wax, Sinotech), 벤조인(미원상사) 및 레벨링제(BYK)의 혼합물을 사용하였다.Specifically, the resin of Preparation Example 1 was used. The fired aluminum silicate (manufacturer: Hoffmann mineral; country of manufacture: Germany) powder with a particle size of 10 μm was used as a first thermally conductive filler, and as a second thermally conductive filler, a particle size of 2 to 5 μm Titanium dioxide (TiO 2 ; Ssangyong Chemical), alumina with a particle size of 10 μm (Alumina, Al 2 O 3 ; Denka), silicon dioxide (Silica, SiO 2 ; ABC Nanotech) with a particle size of 10 μm, and carbonic acid with a particle size of 10 μm One type of powder was used in calcium (calcium carbonate, CaCO 3 ; Sungshin Minefield). As other ingredients, a mixture of antioxidants (Songnox 1010, Songwon), wax (PE Wax, Sinotech), benzoin (Miwon Corporation), and leveling agent (BYK) was used as other ingredients.

상기 수지, 방열첨가제(제1열전도성 필러 및 제2열전도성 필러) 및 가공조제를 하기 표 1과 같이 혼합하여 방열분체도료를 제조하였다. 구체적으로, 상기 수지, 방열첨가제 및 가공조제를 모두 슈퍼믹서를 사용하여 사전 혼합한 후에 150℃ 온도로 설정된 twin extruder 장치에 투입하고 압출하여 혼합조성물 칩(compound chip)을 제조하고, 이것을 냉동분쇄기를 사용하여 50um 입도 수준으로 분쇄함으로써 최종적으로 실시예 1 내지 4의 방열분체도료를 준비하였다.The resin, the heat dissipation additive (first thermally conductive filler and the second thermally conductive filler) and processing aid were mixed as shown in Table 1 below to prepare a heat dissipating powder coating. Specifically, after premixing all of the resin, heat dissipation additives and processing aids using a supermixer, they are put into a twin extruder device set at 150°C and extruded to produce a compound chip, which is then used in a frozen grinder. The heat dissipation powder coatings of Examples 1 to 4 were finally prepared by pulverizing to a level of 50 μm particle size.

단위:중량%Unit:% by weight 실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 실시예 4Example 4 수지Suzy 5555 5555 5555 6565 소성처리된 알루미늄 실리케이트Fired aluminum silicate 1010 3030 3030 2020 Al2O3 Al 2 O 3 3030 -- -- -- CaCO3 CaCO 3 -- 1010 -- -- SiO2 SiO 2 -- -- 1010 -- TiO2 TiO 2 -- -- -- 1010 가공조제Processing aid 55 55 55 55 합계Sum 100100 100100 100100 100100

<< 비교예Comparative example > 소성 처리된 알루미늄실리케이트 불포함 > Without fired aluminum silicate 방열분체도료의Heat dissipation powder coating 제조 Produce

상기 실시예 1 내지 4와 동일한 방법으로 방열분체도료를 제조하되, 소성 처리된 알루미늄실리케이트를 제외하거나 소성 처리하지 않은 일반 알루미늄실리케이트를 이용하여, 하기 표 1과 같이 혼합하여 비교예 1 내지 8을 제조하였다.To prepare a heat-dissipating powder coating in the same manner as in Examples 1 to 4, except for the fired aluminum silicate or using a general aluminum silicate not fired, as shown in Table 1 below to prepare Comparative Examples 1 to 8 I did.

또한, 폴리에스테르(Polyester) 수지를 주제로 한 열경화성 분체도료인 POWLAC PE100(조광페인트(주))를 비교예 9의 일반분체도료로 이용하였다.In addition, POWLAC PE100 (Jokwang Paint Co., Ltd.), a thermosetting powder coating based on a polyester resin, was used as a general powder coating of Comparative Example 9.

단위:중량%Unit:% by weight 비교예 1Comparative Example 1 비교예 2Comparative Example 2 비교예 3Comparative Example 3 비교예 4Comparative Example 4 비교예 5Comparative Example 5 비교예 6Comparative Example 6 비교예 7Comparative Example 7 비교예 8Comparative Example 8 수지Suzy 5555 5555 5555 6565 5555 5555 5555 6565 알루미늄 실리케이트Aluminum silicate -- -- -- -- 1010 3030 3030 2020 Al2O3 Al 2 O 3 4040 -- -- -- 3030 -- -- -- CaCO3 CaCO 3 -- 4040 -- -- -- 1010 -- -- SiO2 SiO 2 -- -- 4040 -- -- -- 1010 -- TiO2 TiO 2 -- -- -- 3030 -- -- -- 1010 가공조제Processing aid 55 55 55 55 55 55 55 55 합계Sum 100100 100100 100100 100100 100100 100100 100100 100100

<< 실험예Experimental example 1> 1> 방열분체도료의Heat dissipation powder coating 방열특성 분석 Heat dissipation characteristic analysis

실시예 1 내지 4 및 비교예 1 내지 8의 방열분체도료의 방열특성을 알아보기 위하여, 표면온도, 방사율, 열전도도 및 방열온도를 평가하였다.In order to examine the heat dissipation characteristics of the heat dissipating powder coatings of Examples 1 to 4 and Comparative Examples 1 to 8, surface temperature, emissivity, thermal conductivity and heat dissipation temperature were evaluated.

먼저, 도 2와 같이 상기 각 방열분체도료를 알루미늄 기판에 도포하여 시료를 준비하고, 시료를 핫플레이트 상에 올려놓고 동일한 온도(91±0.2℃)의 열을 안정화될 때까지 3~4시간 정도 가한 이후, 시료표면 온도(T1)와 시료표면 위 15mm 지점의 공기온도(방열온도, T2)를 측정하였다. 이 때, 공기흐름의 비정상적 변수를 제거하기 위해 윗 부분이 열려있는 원기둥 형태의 테프론 구조물을 시료표면상에 설치하고 내부의 공기온도를 분석하였다.First, as shown in Fig. 2, each of the heat dissipation powder coatings is applied to an aluminum substrate to prepare a sample, and the sample is placed on a hot plate and the heat at the same temperature (91±0.2°C) is stabilized for about 3 to 4 hours. After the addition, the sample surface temperature (T1) and the air temperature at a point 15 mm above the sample surface (heating temperature, T2) were measured. At this time, in order to remove abnormal variables of air flow, a cylindrical Teflon structure with an open upper part was installed on the sample surface and the internal air temperature was analyzed.

또한, Laser Flash method(LFA 447, Netzch)를 이용하여 시료의 열전도도(W/mK)를 평가하였고, ISO 9050 standard (FT-IR spectrometer, M4000, Midac)를 이용하여 시료의 열방사율을 평가하였다.In addition, the thermal conductivity (W/mK) of the sample was evaluated using the Laser Flash method (LFA 447, Netzch), and the thermal emissivity of the sample was evaluated using the ISO 9050 standard (FT-IR spectrometer, M4000, Midac). .

측정 결과는 하기 표 3에 나타난 바와 같다.The measurement results are as shown in Table 3 below.

구분division 실시예1Example 1 실시예2Example 2 실시예3Example 3 실시예4Example 4 비교예1Comparative Example 1 비교예2Comparative Example 2 비교예3Comparative Example 3 비교예4Comparative Example 4 비교예5Comparative Example 5 비교예 6Comparative Example 6 비교예7Comparative Example 7 비교예8Comparative Example 8 수지Suzy 5555 5555 5555 6565 5555 5555 5555 6565 5555 5555 5555 6565 소성처리된 알루미늄 실리케이트Fired aluminum silicate 1010 3030 3030 2020 -- -- -- -- -- -- -- -- 알루미늄 실리케이트Aluminum silicate -- -- -- -- -- -- -- -- 1010 3030 3030 2020 Al2O3 Al 2 O 3 3030 -- -- -- 4040 -- -- -- 3030 -- -- -- CaCO3 CaCO 3 -- 1010 -- -- -- 4040 -- -- -- 1010 -- -- SiO2 SiO 2 -- -- 1010 -- -- -- 4040 -- -- -- 1010 -- TiO2 TiO 2 -- -- -- 1010 -- -- -- 3030 -- -- -- 1010 가공조제Processing aid 55 55 55 55 55 55 55 55 55 55 55 55 열전도도
(W/mK)
Thermal conductivity
(W/mK)
1.101.10 0.500.50 0.600.60 0.950.95 0.340.34 0.320.32 0.360.36 0.330.33 0.420.42 0.380.38 0.410.41 0.400.40
열방사율Heat emissivity 0.9150.915 0.8770.877 0.8830.883 0.9160.916 0.7260.726 0.6290.629 0.7350.735 0.8220.822 0.8260.826 0.8320.832 0.8560.856 0.8470.847 표면온도
(T1, ℃)
Surface temperature
(T1, ℃)
83.8 ±0.283.8 ±0.2 83.1 ±0.283.1 ±0.2 83.2 ±0.283.2 ±0.2 82.9 ±0.282.9 ±0.2 84.9 ±0.384.9 ±0.3 85.6 ±0.285.6 ±0.2 85.7 ±0.185.7 ±0.1 84.8 ±0.284.8 ±0.2 85.5±0.285.5±0.2 86.1±0.386.1±0.3 86.4±0.186.4±0.1 86.3±0.286.3±0.2
방열온도
(T2, ℃)
Heat dissipation temperature
(T2, ℃)
44.1 ±0.244.1 ±0.2 45.9 ±0.245.9 ±0.2 46.1 ±0.246.1 ±0.2 46.3 ±0.246.3 ±0.2 38.4±0.238.4±0.2 38.6±0.338.6±0.3 39.5±0.139.5±0.1 38.6 ±0.238.6 ±0.2 39.7±0.239.7±0.2 40.2±0.340.2±0.3 40.5±0.240.5±0.2 40.1±0.340.1±0.3

상기 표 3에 나타난 바와 같이, 알루미나(Al2O3) 및 소성 처리된 알루미늄실리케이트를 방열첨가제로 이용하여 제조된 실시예 1의 방열분체도료는 열전도도가 약 1W/mK으로 비교예 시료들에 비해 매우 높은 열전도도를 나타내어 열전달 효과가 상대적으로 우수함을 확인하였고, 열방사율은 0.9 수준으로 확인되었으며, 비교예보다 표면온도가 낮고, 방열온도가 높아 방열효과가 있음을 확인하였다.As shown in Table 3, the heat dissipation powder coating of Example 1 prepared by using alumina (Al 2 O 3 ) and fired aluminum silicate as a heat dissipation additive has a thermal conductivity of about 1 W/mK and Compared to that, it was confirmed that the heat transfer effect was relatively excellent due to very high thermal conductivity, and the heat emissivity was confirmed to be 0.9 level, and the surface temperature was lower than that of the comparative example, and the heat dissipation temperature was higher than that of the comparative example.

탄산칼슘(CaCO3) 및 소성 처리된 알루미늄실리케이트를 방열첨가제로 이용하여 제조된 실시예 2의 방열분체도료는 비교예 대비 열전도도가 높게 나타났고, 비교예보다 표면온도가 낮고, 방열온도도 약 4~5℃ 정도 높은 수준으로 확인되어, 표면에서 대기로 열을 전달하는 방열효과가 우수함을 확인하였다.The heat dissipation powder paint of Example 2, prepared using calcium carbonate (CaCO 3 ) and calcined aluminum silicate as a heat dissipation additive, showed higher thermal conductivity than the comparative example, and the surface temperature was lower than that of the comparative example, and the heat dissipation temperature was also weak. It was confirmed at a high level of about 4~5℃, and it was confirmed that the heat dissipation effect of transferring heat from the surface to the atmosphere was excellent.

실리카(이산화규소, SiO2) 및 소성 처리된 알루미늄실리케이트를 방열첨가제로 이용하여 제조된 실시예 3의 방열분체도료는 비교예 대비 열전도도가 높게 나타났고, 비교예보다 표면온도가 낮고, 방열온도도 약 4~5℃ 정도 높은 수준으로 확인되어, 표면에서 대기로 열을 전달하는 방열효과가 우수함을 확인하였다.The heat dissipation powder paint of Example 3, prepared using silica (silicon dioxide, SiO 2 ) and fired aluminum silicate as a heat dissipation additive, showed higher thermal conductivity than the comparative example, and the surface temperature was lower than that of the comparative example, and the heat dissipation temperature. It was also confirmed at a high level of about 4-5°C, and it was confirmed that the heat dissipation effect of transferring heat from the surface to the atmosphere was excellent.

이산화티타늄(TiO2) 및 소성 처리된 알루미늄실리케이트를 방열첨가제로 이용하여 제조된 실시예 4의 방열분체도료는 열전도도가 약 1W/mK 수준으로 비교예 시료들에 비해 열전달 효과가 매우 우수한 것으로 나타났고, 열방사율 역시 0.9 수준으로 확인되었으며, 비교예보다 표면온도가 낮고, 방열온도도 약 4~5℃ 정도 높은 수준으로 확인되어, 열전달 효과 뿐만 아니라 표면에서 대기로 열을 전달하는 방열효과가 가장 우수함을 확인하였다.The heat dissipation powder coating of Example 4, prepared using titanium dioxide (TiO 2 ) and calcined aluminum silicate as a heat dissipation additive, has a thermal conductivity of about 1 W/mK, showing very excellent heat transfer effect compared to the comparative samples. The heat emissivity was also confirmed to be at 0.9 level, and the surface temperature was lower than that of the comparative example, and the heat dissipation temperature was also confirmed to be at a level of about 4 to 5°C, so the heat dissipation effect of transferring heat from the surface to the atmosphere was the most. It was confirmed to be excellent.

<실험예 2> 방열분체도료의 표면 발열 상태 방열특성 분석<Experimental Example 2> Analysis of the heat dissipation characteristics of the heat dissipation powder coating surface

실시예 4의 방열분체도료와 비교예 9의 일반분체도료에 대하여, 상기 실험예 1과 같이 준비한 시료 표면을 열화상카메라 촬영하여 온도에 따른 색상차이를 확인하였다.For the heat dissipation powder coating of Example 4 and the general powder coating of Comparative Example 9, the surface of the sample prepared as in Experimental Example 1 was photographed with a thermal imaging camera to confirm the color difference according to the temperature.

도 4는 본 발명에 따른 실시예 4의 방열분체도료(오른쪽) 및 비교예 9의 일반분체도료(왼쪽)의 표면 온도를 열화상카메라로 촬영한 사진이다.4 is a photograph taken with a thermal imaging camera of the surface temperatures of the heat dissipating powder coating (right) of Example 4 and the general powder coating (left) of Comparative Example 9 according to the present invention.

그 결과, 도 4에 나타난 바와 같이, 비교예 9의 분체도료는 백색으로 나타나, 적색으로 나타난 실시예 4의 방열분체도료보다 표면 온도가 높은 것으로 확인하였다. 이는, 비교예 9의 분체도료가 발열체로부터 열을 전달 받았을 때 대기로 열을 방출 하지 못하고 시료 표면에 열을 머금고 있다는 것을 의미하며, 이와 반면에 본 발명의 실시예 4의 방열분체도료의 경우, 발열체로부터 전달받은 열을 보관하지 않고 대기로 방출시켜, 방열 특성이 우수함을 의미한다.As a result, as shown in Figure 4, the powder coating of Comparative Example 9 appeared white, it was confirmed that the surface temperature is higher than the heat dissipating powder coating of Example 4 shown in red. This means that when the powder coating of Comparative Example 9 receives heat from the heating element, it does not emit heat to the atmosphere and retains heat on the surface of the sample. , It does not store the heat received from the heating element and releases it to the atmosphere, which means excellent heat dissipation properties.

이제까지 본 발명에 대하여 그 바람직한 실시예들을 중심으로 살펴보았다. 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자는 본 발명이 본 발명의 본질적인 특성에서 벗어나지 않는 범위에서 변형된 형태로 구현될 수 있음을 이해할 수 있을 것이다. 그러므로 개시된 실시예들은 한정적인 관점이 아니라 설명적인 관점에서 고려되어야 한다. 본 발명의 범위는 전술한 설명이 아니라 특허 청구범위에 나타나 있으며, 그와 동등한 범위 내에 있는 모든 차이점은 본 발명에 포함된 것으로 해석되어야 할 것이다.So far, the present invention has been looked at around its preferred embodiments. Those of ordinary skill in the art to which the present invention pertains will be able to understand that the present invention may be implemented in a modified form without departing from the essential characteristics of the present invention. Therefore, the disclosed embodiments should be considered from an illustrative point of view rather than a limiting point of view. The scope of the present invention is shown in the claims rather than the foregoing description, and all differences within the scope equivalent thereto should be construed as being included in the present invention.

Claims (12)

폴리에스터 수지(polyester resin) 및 에폭시 수지(epoxy resin);
제1열전도성 필러로서, 소성 처리된 알루미늄실리케이트(aluminum silicate); 및
제2열전도성 필러로서, 이산화티타늄(titanium dioxide, TiO2), 알루미나(Alumina, Al2O3), 이산화규소(Silica, SiO2) 및 탄산칼슘(calcium carbonate, CaCO3)으로 이루어진 군으로부터 선택되는 1종;을 포함하는, 방열성 분체도료.
Polyester resin and epoxy resin;
As the first thermally conductive filler, the sintered aluminum silicate (aluminum silicate); And
As a second thermally conductive filler, selected from the group consisting of titanium dioxide (TiO 2 ), alumina (Alumina, Al 2 O 3 ), silicon dioxide (Silica, SiO 2 ) and calcium carbonate (CaCO 3 ) Including, heat dissipating powder coating.
제1항에 있어서,
상기 폴리에스터(polyester) 수지는 카복실 폴리에스터 수지(Carboxyl polyester resin)이고,
상기 에폭시 수지(epoxy resin)는 비스페놀 A형의 글리시딜 에테르 형태의 에폭시수지인 것을 특징으로 하는, 방열성 분체도료.
The method of claim 1,
The polyester resin is a carboxyl polyester resin,
The epoxy resin is a bisphenol A type glycidyl ether type epoxy resin, characterized in that, heat dissipating powder coating.
제1항에 있어서,
상기 방열성 분체도료는 왁스, 벤조인, 산화방지제 및 레벨링제로 이루어진 군으로부터 선택되는 1종 이상의 첨가제를 더 포함하는 것을 특징으로 하는, 방열성 분체도료.
The method of claim 1,
The heat dissipating powder coating further comprises at least one additive selected from the group consisting of wax, benzoin, antioxidants and leveling agents.
제3항에 있어서,
상기 방열성 분체도료는, 폴리에스터 수지(polyester resin) 및 에폭시 수지(epoxy resin) 50 내지 70 중량%, 제1열전도성 필러 1 내지 40 중량%, 제2열전도성 필러 1 내지 40 중량% 및 상기 첨가제 1 내지 10 중량% 포함하는 것을 특징으로 하는, 방열성 분체도료.
The method of claim 3,
The heat dissipating powder coating includes 50 to 70% by weight of a polyester resin and an epoxy resin, 1 to 40% by weight of a first thermally conductive filler, 1 to 40% by weight of a second thermally conductive filler, and the additive Heat dissipating powder coating, characterized in that it contains 1 to 10% by weight.
제1항에 따른 방열성 분체도료를 이용하여 제조된 조명등기구.A lighting fixture manufactured using the heat dissipating powder coating according to claim 1. 제1항에 따른 방열성 분체도료를 이용하여 제조된 전자기기용 하우징.A housing for an electronic device manufactured using the heat dissipating powder coating according to claim 1. 제1항에 따른 방열성 분체도료를 이용하여 제조된 자동차 전장품.Automotive electrical equipment manufactured using the heat dissipating powder coating according to claim 1. 제1항에 따른 방열성 분체도료를 이용하여 제조된 변압기 외판.A transformer outer plate manufactured using the heat dissipating powder coating according to claim 1. 제1항에 따른 방열성 분체도료를 이용하여 제조된 방열판.A heat sink manufactured by using the heat dissipating powder coating according to claim 1. 제1항에 따른 방열성 분체도료를 이용하여 제조된 열교환기.A heat exchanger manufactured using the heat dissipating powder coating according to claim 1. 제1항에 따른 방열성 분체도료를 이용하여 제조된 전자기기용 부품.Components for electronic devices manufactured using the heat dissipating powder coating according to claim 1. 제1항에 따른 방열성 분체도료를 이용하여 제조된 변압기 부품.A transformer component manufactured using the heat dissipating powder coating according to claim 1.
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