KR102193813B1 - 이방성 도전 필름, 접속 방법 및 접합체 - Google Patents
이방성 도전 필름, 접속 방법 및 접합체 Download PDFInfo
- Publication number
- KR102193813B1 KR102193813B1 KR1020140017046A KR20140017046A KR102193813B1 KR 102193813 B1 KR102193813 B1 KR 102193813B1 KR 1020140017046 A KR1020140017046 A KR 1020140017046A KR 20140017046 A KR20140017046 A KR 20140017046A KR 102193813 B1 KR102193813 B1 KR 102193813B1
- Authority
- KR
- South Korea
- Prior art keywords
- anisotropic conductive
- conductive film
- terminal
- electronic component
- substrate
- Prior art date
Links
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Non-Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013029645A JP5956362B2 (ja) | 2013-02-19 | 2013-02-19 | 異方性導電フィルム、接続方法、及び接合体 |
JPJP-P-2013-029645 | 2013-02-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20140103855A KR20140103855A (ko) | 2014-08-27 |
KR102193813B1 true KR102193813B1 (ko) | 2020-12-22 |
Family
ID=51310569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140017046A KR102193813B1 (ko) | 2013-02-19 | 2014-02-14 | 이방성 도전 필름, 접속 방법 및 접합체 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5956362B2 (ja) |
KR (1) | KR102193813B1 (ja) |
CN (1) | CN103996431B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6330346B2 (ja) * | 2014-01-29 | 2018-05-30 | 日立化成株式会社 | 接着剤組成物、接着剤組成物を用いた電子部材、及び半導体装置の製造方法 |
JP6280017B2 (ja) * | 2014-10-03 | 2018-02-14 | デクセリアルズ株式会社 | 異方性導電フィルム、並びに、接続方法及び接合体 |
KR101845129B1 (ko) * | 2015-05-13 | 2018-04-03 | 삼성에스디아이 주식회사 | 이방 도전성 필름 및 이를 이용한 반도체 장치 |
JP7446095B2 (ja) * | 2019-12-03 | 2024-03-08 | デクセリアルズ株式会社 | フィルム巻装体及び接続体の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010248455A (ja) * | 2009-04-20 | 2010-11-04 | Bridgestone Corp | チオール基含有接着性樹脂組成物 |
JP2011032491A (ja) | 2010-11-09 | 2011-02-17 | Sony Chemical & Information Device Corp | 異方性導電フィルム |
JP2011076808A (ja) | 2009-09-30 | 2011-04-14 | Sony Chemical & Information Device Corp | 異方性導電フィルム及びその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10168412A (ja) * | 1996-12-10 | 1998-06-23 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
JP5111711B2 (ja) * | 2002-01-31 | 2013-01-09 | 日立化成工業株式会社 | 接着剤組成物、回路接続用接着剤組成物及び回路接続方法 |
CN101483080A (zh) * | 2003-12-04 | 2009-07-15 | 旭化成电子材料元件株式会社 | 各向异性的导电粘合片材及连接结构体 |
KR100929593B1 (ko) * | 2007-09-20 | 2009-12-03 | 제일모직주식회사 | 이방 도전성 접착 조성물 및 그를 포함하는 이방 도전성 필름 |
TWI389999B (zh) * | 2007-12-18 | 2013-03-21 | Cheil Ind Inc | 黏著性組成物及使用該黏著性組成物的各向異性導電膜 |
JP5833809B2 (ja) * | 2010-02-01 | 2015-12-16 | デクセリアルズ株式会社 | 異方性導電フィルム、接合体及び接続方法 |
JP5695881B2 (ja) * | 2010-10-28 | 2015-04-08 | デクセリアルズ株式会社 | 電子部品の接続方法及び接続構造体 |
JP5823117B2 (ja) * | 2010-11-16 | 2015-11-25 | デクセリアルズ株式会社 | 異方性導電フィルム、接合体、及び接合体の製造方法 |
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2013
- 2013-02-19 JP JP2013029645A patent/JP5956362B2/ja active Active
-
2014
- 2014-02-14 KR KR1020140017046A patent/KR102193813B1/ko active IP Right Grant
- 2014-02-18 CN CN201410054738.6A patent/CN103996431B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010248455A (ja) * | 2009-04-20 | 2010-11-04 | Bridgestone Corp | チオール基含有接着性樹脂組成物 |
JP2011076808A (ja) | 2009-09-30 | 2011-04-14 | Sony Chemical & Information Device Corp | 異方性導電フィルム及びその製造方法 |
JP2011032491A (ja) | 2010-11-09 | 2011-02-17 | Sony Chemical & Information Device Corp | 異方性導電フィルム |
Also Published As
Publication number | Publication date |
---|---|
JP2014160546A (ja) | 2014-09-04 |
KR20140103855A (ko) | 2014-08-27 |
CN103996431B (zh) | 2017-04-12 |
CN103996431A (zh) | 2014-08-20 |
JP5956362B2 (ja) | 2016-07-27 |
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