KR102027793B1 - 처리액, 기판의 세정 방법 및 반도체 디바이스의 제조 방법 - Google Patents

처리액, 기판의 세정 방법 및 반도체 디바이스의 제조 방법 Download PDF

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Publication number
KR102027793B1
KR102027793B1 KR1020187018802A KR20187018802A KR102027793B1 KR 102027793 B1 KR102027793 B1 KR 102027793B1 KR 1020187018802 A KR1020187018802 A KR 1020187018802A KR 20187018802 A KR20187018802 A KR 20187018802A KR 102027793 B1 KR102027793 B1 KR 102027793B1
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South Korea
Prior art keywords
liquid
compound
substrate
treatment liquid
hydroxylamine
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KR1020187018802A
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English (en)
Korean (ko)
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KR20180088452A (ko
Inventor
아키코 요시이
나오츠구 무로
사토미 타카하시
테츠야 시미즈
토모노리 타카하시
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후지필름 가부시키가이샤
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Publication of KR20180088452A publication Critical patent/KR20180088452A/ko
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Publication of KR102027793B1 publication Critical patent/KR102027793B1/ko

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    • C11D11/0047—
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/10—Salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02079—Cleaning for reclaiming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Inorganic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
KR1020187018802A 2016-01-05 2016-12-26 처리액, 기판의 세정 방법 및 반도체 디바이스의 제조 방법 KR102027793B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016000727 2016-01-05
JPJP-P-2016-000727 2016-01-05
PCT/JP2016/088670 WO2017119334A1 (ja) 2016-01-05 2016-12-26 処理液、基板の洗浄方法および半導体デバイスの製造方法

Publications (2)

Publication Number Publication Date
KR20180088452A KR20180088452A (ko) 2018-08-03
KR102027793B1 true KR102027793B1 (ko) 2019-10-02

Family

ID=59273712

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187018802A KR102027793B1 (ko) 2016-01-05 2016-12-26 처리액, 기판의 세정 방법 및 반도체 디바이스의 제조 방법

Country Status (4)

Country Link
JP (1) JP6542393B2 (ja)
KR (1) KR102027793B1 (ja)
TW (1) TWI702285B (ja)
WO (1) WO2017119334A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6542392B2 (ja) * 2016-01-05 2019-07-10 富士フイルム株式会社 処理液、基板の洗浄方法、および、半導体デバイスの製造方法
JP6876570B2 (ja) * 2017-07-28 2021-05-26 株式会社Ｓｃｒｅｅｎホールディングス 処理液除電方法、基板処理方法および基板処理システム
JP7274982B2 (ja) * 2019-08-23 2023-05-17 東京応化工業株式会社 充填剤、基板の処理方法、及び充填剤の製造方法
WO2021039137A1 (ja) 2019-08-23 2021-03-04 富士フイルム株式会社 洗浄剤組成物
JPWO2022176663A1 (ja) * 2021-02-22 2022-08-25

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001261312A (ja) * 2000-03-24 2001-09-26 Nisshin Kako Kk ヒドロキシルアミン水溶液およびその製造方法
JP2006269677A (ja) * 2005-03-23 2006-10-05 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100849913B1 (ko) * 2005-10-13 2008-08-04 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 수성 세정 조성물 및 이를 이용하는 방법
JP2009212383A (ja) * 2008-03-05 2009-09-17 Sanyo Chem Ind Ltd 洗浄剤組成物及び半導体基板の製造方法
KR101254845B1 (ko) * 2008-11-05 2013-04-15 도쿄엘렉트론가부시키가이샤 액처리 방법, 액처리 장치 및 기억매체
KR101381494B1 (ko) * 2007-02-23 2014-04-04 쓰리엠 이노베이티브 프로퍼티즈 컴파니 불소계 용매-함유 용액의 정제 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518777B2 (ja) 1972-02-02 1980-05-21
JP3738992B2 (ja) * 2001-12-27 2006-01-25 東京応化工業株式会社 ホトレジスト用剥離液
JP4350364B2 (ja) * 2002-12-12 2009-10-21 昭和電工株式会社 洗浄剤組成物、半導体ウェーハの洗浄方法および製造方法
US20060003910A1 (en) * 2004-06-15 2006-01-05 Hsu Jiun Y Composition and method comprising same for removing residue from a substrate
JP5159066B2 (ja) * 2006-08-24 2013-03-06 ダイキン工業株式会社 半導体ドライプロセス後の残渣除去液及びそれを用いた残渣除去方法
JP5736567B2 (ja) * 2010-10-20 2015-06-17 国立研究開発法人産業技術総合研究所 半導体ウエハの洗浄方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001261312A (ja) * 2000-03-24 2001-09-26 Nisshin Kako Kk ヒドロキシルアミン水溶液およびその製造方法
JP2006269677A (ja) * 2005-03-23 2006-10-05 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100849913B1 (ko) * 2005-10-13 2008-08-04 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 수성 세정 조성물 및 이를 이용하는 방법
KR101381494B1 (ko) * 2007-02-23 2014-04-04 쓰리엠 이노베이티브 프로퍼티즈 컴파니 불소계 용매-함유 용액의 정제 방법
JP2009212383A (ja) * 2008-03-05 2009-09-17 Sanyo Chem Ind Ltd 洗浄剤組成物及び半導体基板の製造方法
KR101254845B1 (ko) * 2008-11-05 2013-04-15 도쿄엘렉트론가부시키가이샤 액처리 방법, 액처리 장치 및 기억매체

Also Published As

Publication number Publication date
WO2017119334A1 (ja) 2017-07-13
TWI702285B (zh) 2020-08-21
KR20180088452A (ko) 2018-08-03
TW201736591A (zh) 2017-10-16
JPWO2017119334A1 (ja) 2018-10-25
JP6542393B2 (ja) 2019-07-10

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