KR102016514B1

KR102016514B1 - lighting device

Info

Publication number: KR102016514B1
Application number: KR1020120142935A
Authority: KR
Inventors: 김기웅; 홍상준; 천정오; 김진욱
Original assignee: 엘지이노텍 주식회사
Priority date: 2012-12-10
Filing date: 2012-12-10
Publication date: 2019-09-04
Also published as: KR20140074691A

Abstract

A lighting device, comprising: a housing comprising an upper opening and a lower opening, an optical member disposed in the upper opening of the housing, a radiation member disposed in the lower opening of the housing, A light source disposed in the central region of the heat dissipation member, and a driver disposed in the peripheral region of the heat dissipation member and electrically connected to the light source, wherein the central region of the heat dissipation member has a first thickness and has a first thickness. The peripheral region of may have a second thickness, and the first thickness and the second thickness may be equal to each other.

Description

Lighting device

Embodiments relate to a lighting device.

In general, a down light is a lighting method that drills a hole in a ceiling and embeds a light source therein, and is widely used as an architectural lighting technique for integrating lighting and buildings.

Such a buried light is a structure that is embedded in the ceiling, there is almost no exposure of the lighting fixture has the advantage that the ceiling surface looks neat, and furthermore, because the ceiling surface is dark, it is a suitable way to create an atmosphere indoor space. .

1 is a view showing a general lighting device.

As shown in FIG. 1, the lighting apparatus includes a light source module 1 and a reflector 2 for setting an emission directing angle of light emitted from the light source module 1.

Here, the light source module 1 may include at least one LED light source 1a provided on a printed circuit board (PCB) 1b.

The reflector 2 focuses the light emitted from the LED light source 1a so that the reflector 2 can be emitted through the opening with a predetermined directivity angle, and may have a reflective surface on the inner surface.

As described above, the lighting device may be used as an illumination lamp that focuses a plurality of LED light sources 1a to obtain light, and is mounted in the ceiling or wall of the building to expose the opening side of the reflector 2. It can be used as a downlight.

However, such an illumination device is not only limited in the arrangement space of the LED light source 1a, but also may be difficult to dissipate heat.

Therefore, in the future, it is necessary to develop a lighting device that can improve heat dissipation performance and sufficiently secure a space for arranging an LED light source.

Embodiments provide an illumination device that can reduce heat resistance and improve heat dissipation performance by disposing a light source adjacent to a heat dissipation member.

In addition, the embodiment is to provide a lighting device that can increase the arrangement area of the light source and improve the light efficiency by arranging the light source on the heat radiating member having no boss.

In addition, the embodiment is to provide a lighting device that can be easily assembled and the weight can be reduced by removing the boss from the heat dissipation member and integrating the reflector and the housing.

Embodiments include a housing comprising an upper opening and a lower opening, an optical member disposed in the upper opening of the housing, a radiation member disposed in the lower opening of the housing, and a heat radiating member. A light source disposed in the central region of the heat dissipation member, and a driver disposed in the peripheral region of the heat dissipation member and electrically connected to the light source, wherein the central region of the heat dissipation member has a first thickness and has a periphery of the heat dissipation member. The region has a second thickness, and the first thickness and the second thickness may be equal to each other.

Here, the heat dissipation member may include a central region in which the light source is disposed, and a peripheral region in which the driving unit is disposed and surrounds the central region, and the central region and the peripheral region of the heat dissipation member may be disposed on the same level. .

In addition, a boundary groove is disposed between the central region and the peripheral region of the heat dissipation member, and a ratio of the depth of the boundary groove to the first thickness may be 0.001: 1-0.5: 1.

In addition, the heat dissipation member may include a central region in which the light source is disposed, and a peripheral region in which the driving unit is disposed and surrounds the central region, and the central region and the peripheral region of the heat dissipation member may be disposed on different planes. .

Here, the distance between the central region of the heat dissipation member and the optical member may be closer than the distance between the peripheral region of the heat dissipation member and the optical member.

In this case, an interface is disposed between the central region and the peripheral region of the heat dissipation member, and the interface of the heat dissipation member may be perpendicular to the surface of the central region and the peripheral region of the heat dissipation member.

And, the distance between the central region of the heat dissipation member and the optical member may be longer than the distance between the peripheral region of the heat dissipation member and the optical member.

Here, an interface is disposed between the central region and the peripheral region of the heat dissipation member, and the interface of the heat dissipation member may be inclined with respect to the surface of the central region and the peripheral region of the heat dissipation member.

At this time, the angle between the boundary surface of the heat dissipation member and the surface of the central region of the heat dissipation member may be an obtuse angle. The boundary surface of the heat dissipation member may be any one of a flat plane, a concave curved surface, and a convex curved surface.

Subsequently, at least one fastening hole may be disposed in the central region of the heat dissipation member.

In addition, at least one projection may be disposed in a peripheral area of the heat dissipation member, and the protrusion may protrude outward from an edge of the heat dissipation member.

In addition, the central region of the heat dissipation member may be any one of a flat plane, a concave curved surface, and a convex curved surface.

Next, the light source can be directly contacted with the heat radiation member.

In some cases, the light source is disposed on the substrate, and the substrate may be in direct contact with the heat dissipation member.

In another case, the light source may be disposed on the substrate, the substrate may be disposed at a predetermined distance from the heat radiating member, and a heat radiating pad may be disposed between the substrate and the heat radiating member.

Here, the area of the heat radiation pad may be larger than the area of the substrate.

In addition, the area of the heat radiation pad may be equal to the area of the central area of the heat radiation member.

Subsequently, a connector for electrically connecting the driving unit and the light source is disposed in the peripheral area of the heat dissipation member, and the connector may include a ground pin that grounds the driving unit.

The driving unit may include a base member including a through hole in a central region, and a circuit element disposed on the base member to drive a light source.

Here, the base member may be in direct contact with the heat dissipation member.

In some cases, the base member may be disposed at a predetermined distance from the heat radiating member, and an insulation member and a heat radiating pad may be disposed between the base member and the heat radiating member.

The through hole of the base member may be disposed corresponding to the central region of the heat dissipation member, and the base member may be disposed corresponding to the peripheral region of the heat dissipation member.

Here, the area of the through hole of the base member may be equal to the area of the central region of the heat dissipation member, and the area of the base member may be equal to the area of the peripheral region of the heat dissipation member.

The housing may then be larger in diameter than the lower opening and the inner surface of the housing may be a reflective surface that reflects light.

Here, the inner surface of the housing may be any one of a flat plane, a concave curved surface and a convex curved surface.

The apparatus further includes a reflector disposed inside the housing, the reflector including a first opening facing the optical member and a second opening facing the light source, the diameter of the first opening being equal to that of the second opening. It may be larger than the diameter.

Here, the inner surface of the reflector may be any one of a flat plane, a concave curved surface, and a convex curved surface.

On the other hand, another embodiment is a housing comprising an upper opening and a lower opening, an optical member disposed in the upper opening of the housing, and a radiation member disposed in the lower opening of the housing; A light source disposed in the central region of the heat dissipation member, and a driver disposed in the peripheral region of the heat dissipation member and electrically connected to the light source, wherein the central region of the heat dissipation member has a first thickness, The peripheral region of the heat dissipation member has a second thickness, and the first thickness may be thinner than the second thickness.

Here, the ratio of the first thickness and the second thickness may be 0.99: 1-0.1: 1.

The boundary surface is disposed between the central region and the peripheral region of the heat dissipation member, and the angle between the boundary surface of the heat dissipation member and the surface of the central region of the heat dissipation member may be an obtuse angle.

Another embodiment includes a housing comprising an upper opening and a lower opening, an optical member disposed in the upper opening of the housing, a radiation member disposed in the lower opening of the housing, A recess disposed in the central region of the heat dissipation member, a light source disposed in the recess, and a driver disposed in the peripheral region of the recess and electrically connected to the light source. The ratio of the maximum depth of the set and the thickness of the heat dissipation member may be 0.99: 1-0.1: 1.

Here, the recess may include a bottom surface and a side surface surrounding the bottom surface, and an angle between the side surface of the recess and the bottom surface of the recess may be an obtuse angle.

Another embodiment includes a housing comprising an upper opening and a lower opening, an optical member disposed in the upper opening of the housing, a radiation member disposed in the lower opening of the housing, A light source disposed in the center region of the heat dissipation member, and a driver disposed in the peripheral region of the heat dissipation member and electrically connected to the light source, wherein the drive unit includes a light source disposed in the center region of the heat dissipation member. And a through hole to be exposed, and a ratio of the area of the through hole of the driving unit to the total area of the heat dissipation member may be 0.4: 1 to 0.8: 1.

Another embodiment includes a housing comprising an upper opening and a lower opening, an optical member disposed in the upper opening of the housing, a radiation member disposed in the lower opening of the housing, A light source disposed in the central region of the heat dissipation member, and a driver disposed in the peripheral region of the heat dissipation member and electrically connected to the light source, wherein the drive includes a base member and a base member. And a circuit element disposed above to drive the light source, wherein the distance between the optical member and the base member may be closer than the distance between the optical member and the light source.

In the embodiment, by disposing the light source adjacent to the heat dissipation member, the heat resistance can be reduced to improve the heat dissipation performance.

Further, in the embodiment, by arranging the light source on the heat dissipation member having no boss, the area of the light source can be increased and the light efficiency can be improved.

In addition, in the embodiment, by removing the boss from the heat dissipation member and integrating the reflector and the housing, the assembly is easy and the weight can be reduced.

1 is a cross-sectional view showing a general lighting device
2A to 2C are diagrams for describing a lighting apparatus according to an embodiment.
3A and 3B are views illustrating a layout relationship of the heat dissipation member, the light source module, and the driving unit of FIG. 2B.
4 is a cross-sectional view showing a heat dissipation member according to a first embodiment;
5A and 5B are cross-sectional views showing boundary grooves disposed in the heat dissipation member of FIG. 4.
6 is a cross-sectional view illustrating a heat dissipation member according to the embodiment of FIG. 2.
7A to 7D are cross-sectional views showing a heat dissipation member according to a third embodiment.
8a and 8b are views showing the fastening hole of the heat dissipation member
9A and 9B show protrusions of the heat dissipation member;
10A to 10C are cross-sectional views showing a central region of the heat dissipation member.
11 is a cross-sectional view showing a method of arranging a light source according to the first embodiment;
12A and 12B are cross-sectional views illustrating a method of arranging a light source according to a second embodiment.
13 is a sectional view showing a method of arranging a light source according to a third embodiment;
14A to 14C are cross-sectional views illustrating a method of arranging a light source according to a fourth embodiment.
15A to 15C show a connector disposed on a heat dissipation pad.
16 is a view showing an arrangement of connectors disposed on the heat dissipation member and the driving unit;
17A and 17B show the driving part of FIG. 2B
18A and 18B are cross-sectional views illustrating a method of arranging a driving unit according to the first embodiment.
19 is a sectional view showing a method of arranging a driving unit according to the second embodiment;
20A and 20B illustrate a method of arranging a driving unit according to a third embodiment.
21A and 21B show a method of arranging a driving unit according to a fourth embodiment.
22A and 22B show a housing according to the first embodiment
23A-C are cross-sectional views showing the inner side of the housing of FIG. 22B.
24A and 24B show a housing according to a second embodiment
25A-25C are cross-sectional views showing the inner side of the reflector of FIG. 24B.
26 is a cross-sectional view illustrating a lighting device to which a heat dissipation member according to a fourth embodiment is applied.
27A to 27D are cross-sectional views illustrating a heat dissipation member according to a fourth exemplary embodiment of FIG. 26.
28 is a sectional view showing a heat dissipation member according to a fifth embodiment;
29 is a cross-sectional view illustrating a lighting device to which a heat dissipation member according to a sixth embodiment is applied;
30A to 30C are cross-sectional views illustrating a heat dissipation member according to a sixth embodiment of FIG. 29.
31 is a cross-sectional view showing the area of the through hole of the drive unit.
32A to 32D are cross-sectional views showing a distance between the driving unit and the optical member and between the light source and the optical member.

Hereinafter, exemplary embodiments will be described with reference to the accompanying drawings.

In the description of the embodiments, each layer, region, pattern, or structure is formed “on” or “under” of a substrate, each layer (film), region, pad, or pattern. In the case where it is described as, “on” and “under” include both “directly” or “indirectly” formed through another layer. In addition, the criteria for the top or bottom of each layer will be described with reference to the drawings.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

2A to 2C are diagrams for describing the lighting apparatus according to the embodiment, FIG. 2A is a perspective view of the lighting apparatus, FIG. 2B is an exploded view of FIG. 2A, and FIG. 2C is a cross-sectional view taken along the line II of FIG. 2A. to be.

As shown in FIGS. 2A-2C, an embodiment includes a housing 100, an optical member 500, a radiation member 400, a light source module. 200 and a driver 300 may be included.

Here, the housing 100 includes an upper opening and a lower opening, the optical member 500 may be disposed in the upper opening of the housing 100, the heat dissipation member 400 is disposed in the lower opening of the housing 100. Can be.

In addition, the light source module 200 may be disposed in the central area of the heat dissipation member 400, and the driving unit 300 may be disposed in the peripheral area of the heat dissipation member 400, and may be electrically connected to the light source module 200. .

That is, the housing 100 may configure the external appearance of the lighting apparatus by accommodating the optical member 500, the light source module 200, the driver 300, and the heat dissipation member 400.

The housing 100 may have a cylindrical shape or a polygonal column shape, but is not limited thereto.

Subsequently, the upper opening of the housing 100 may be covered by the optical member 500, and the diameter of the upper opening of the housing 100 may be made smaller than the diameter of the optical member 500, and in some cases The diameter of the upper opening of the housing 100 may be larger than that of the optical member 500.

Next, the lower opening of the housing 100 may be covered by the heat dissipation member 400, and a projection 403 of the heat dissipation member 400 may be coupled to the groove of the housing 100.

In addition, the housing 100 may be mounted with a reflector 110 therein, the housing 100 is a detachable type that the reflector 110 can be separated from the housing 100, the reflector 110 is a housing It can be manufactured in one piece that cannot be separated from the 100.

For example, in a unitary housing 100 in which the reflector 110 cannot be separated from the housing 100, the diameter of the upper opening is larger than the diameter of the lower opening, and the inner surface of the housing 100 reflects light. It may include a reflective surface.

Here, the inner surface of the housing 100 may be any one of a flat plane, a concave curved surface and a convex curved surface.

In addition, in the detachable housing 100 in which the reflector 110 may be separated from the housing 100, the reflector 110 may be coupled to and separated from the inside of the housing 100.

Here, the reflector 110 may include a first opening facing the optical member 500 and a second opening facing the light source module 200, the diameter of the first opening being greater than the diameter of the second opening. Can be large.

In this case, the inner surface of the reflector 110 may be any one of a flat plane, a concave curved surface, and a convex curved surface.

Next, the optical member 500 may cover the upper opening of the housing 100, and the diameter of the optical member 500 may be determined according to the type of the housing 100.

For example, the diameter of the optical member 500 applied to the detachable housing 100 capable of detaching the reflector 110 may be smaller than the diameter of the upper opening of the housing 100.

In addition, the diameter of the optical member 500 applied to the unitary housing 100 including the reflector 110 may be larger than the diameter of the upper opening of the housing 100.

In addition, a milky white paint may be coated on an inner surface of the optical member 500 facing the light source module 200, and the milky white paint may include a diffuser capable of diffusing light passing through the optical member 500. .

Subsequently, the material of the optical member 500 may be glass, plastic, polypropylene, polyethylene, polycarbonite, or the like, but is not limited thereto.

In addition, the optical member 500 may include an inner surface facing the light source module 200 and an outer surface exposed to the outside. The roughness of the inner surface of the optical member 500 is greater than the roughness of the outer surface of the optical member 500. Can be large.

This is because when the roughness of the inner surface of the optical member 500 is greater than the roughness of the outer surface of the optical member 500, scattering and diffusion of light emitted from the light source module 200 can be increased.

The optical member 500 may include a phosphor so as to excite the light emitted from the light source module 200.

Here, the phosphor may include at least one of a Garnet-based (YAG, TAG), a silicate (Silicate), a nitride (Nitride), an oxynitride (oxyxyride) system.

On the other hand, the heat dissipation member 400 may emit heat generated from the light source module 200 and the driver 300 to the outside.

Here, the light source module 200 may be disposed in the central region of the heat dissipation member 400, and the driving unit 300 may be disposed in the peripheral region of the heat dissipation member 400.

In this case, the central region of the heat dissipation member 400 may have a first thickness, and the peripheral region of the heat dissipation member 400 may have a second thickness, and the first thickness and the second thickness may be the same.

This is because the heat radiation performance can be improved by reducing the resistance to heat generated from the light source module 200 and the driver.

For example, when the first thickness of the central region of the heat dissipation member 400 is thicker than the second thickness of the peripheral region of the heat dissipation member 400, the heat dissipation performance due to the thermal resistance may decrease, and the overall weight is increased. Because you can.

Therefore, by making the same thickness of the center region and the peripheral region of the heat radiation member 400, and by placing the light source module 200 in the center region of the heat radiation member 400, it is possible to improve the heat radiation performance by reducing the thermal resistance The overall weight can be reduced.

In addition, the heat dissipation member 400 may include a central region in which the light source module 200 is disposed, and a peripheral region in which the driving unit 300 is disposed and surrounds the central region. The regions may be disposed on the same level.

Here, when the central region and the peripheral region of the heat dissipation member 400 are disposed on the same level, since the arrangement area of the light source module 200 may be increased, the number of the light sources 220 may be increased to increase light. The efficiency can be improved.

Subsequently, a boundary groove 401 may be disposed between the central region and the peripheral region of the heat dissipation member 400.

The reason why the boundary grooves 401 are disposed between the central area and the peripheral area of the heat dissipation member 400 is to accurately align the light source module 200 and the driving part 300 on the heat dissipation member 400. .

In addition, at least one fastening hole 402 may be disposed in the central region of the heat dissipation member 400, and the fastening hole 402 of the heat dissipation member 400 may be disposed to correspond to the fastening groove of the reflector 110. have.

Therefore, the fastening screw 750 penetrates the fastening hole 402 of the heat dissipation member 400 and is inserted into the fastening groove of the reflector 110, whereby the heat dissipation member 400 may be coupled to the reflector 110.

In addition, at least one projection 403 may be disposed in a peripheral area of the heat dissipation member 400, and the protrusion 403 may protrude outward from an edge of the heat dissipation member 400. .

Here, the protrusion 403 of the heat dissipation member 400 is inserted into the groove of the housing 100, whereby the heat dissipation member 400 may be coupled to the housing 100 to cover the lower opening of the housing 100.

Subsequently, the heat dissipation member 400 may be formed of a metal material or a resin material, but is not limited thereto.

For example, the heat dissipation member 400 may be any material selected from aluminum, nickel, copper, silver, tin, and the like.

Next, the light source module 200 may include a substrate 210 having an electrode pattern and at least one light source 220 disposed on the substrate 210.

Here, the substrate 210 is a single-layer PCB (Printed Circuit Board), multilayer PCB, metal PCB (MPCB: Metal PCB), metal core PCB (MCPCB: Metal Core PCB), flexible PCB (FPCB: Flexible PCB) and ceramic PCB It may be any one of.

The substrate 210 may be formed of a material that efficiently reflects light, or may be formed of a color that reflects light efficiently, for example, white, silver, or the like.

In addition, any one of a reflective coating film and a reflective coating material layer may be formed on the substrate 210, and may reflect light generated by the light source 220 toward the optical member 500.

Subsequently, the light source 220 of the light source module 200 may be disposed on the substrate 210.

The light source 220 may be a top view type light emitting diode.

In some cases, the light source 220 may be a side view type light emitting diode.

The light source 220 may be a light emitting diode chip, and the light emitting diode chip may include a blue LED chip or an ultraviolet LED chip, or a red LED chip, a green LED chip, a blue LED chip, and yellow green. ) It may be configured in a package form combining at least one or more of the LED chip, the white LED chip.

In addition, the light emitting diode chip may have a phosphor.

The phosphor may be at least one of a garnet-based (YAG, TAG), a silicate, a nitride, and an oxynitride.

Subsequently, the phosphor may be one or more of a yellow phosphor, a green phosphor, and a red phosphor.

In addition, the white LED may be implemented by combining yellow phosphor on the blue LED, or simultaneously using red phosphor and green phosphor on the blue LED, and yellow phosphor on the blue LED. Yellow phosphor, red phosphor, and green phosphor may be simultaneously used.

In addition, the light source 220 of the light source module 200 may be bonded to the LED package on the substrate 210, the LED chip not packaged on the substrate 210 may be directly bonded.

In addition, the substrate 210 of the light source module 200 may directly contact the heat dissipation member 400.

In some cases, a second heat radiation pad 420 may be disposed between the substrate 210 of the light source module 200 and the heat radiation member 400.

In addition, a connector 230 for electrically connecting the driver 300 and the light source 220 may be disposed in an edge region of the substrate 210 of the light source module 200.

Here, the connector 230 may include a ground pin for grounding the driver 300.

As another example, the light source 220 of the light source module 200 may be directly contacted with the heat dissipation member 400 without the substrate 210.

As such, when the light source 220 is in direct contact with the heat dissipation member 400, since an arrangement area in which the light source 220 may be disposed increases, the number of the light sources 220 may be increased to improve light efficiency. In addition, the degree of freedom of the arrangement of the light source 220 may be increased.

In addition, when the light source 220 directly contacts the heat dissipation member 400, a connector (not shown) for electrically connecting the driving unit 300 and the light source 220 may be disposed in the peripheral region of the heat dissipation member 400. Can be.

In this case, the connector may include a ground pin that grounds the driver 300.

Meanwhile, the driver 300 includes a base member 310 including a through hole in a central region and a circuit element 320 disposed on the base member 310 to drive the light source 220. ) May be included.

Here, the base member 310 of the driving unit 300 may be in direct contact with the heat dissipation member 400.

In some cases, the base member 310 may be disposed at a predetermined distance from the heat dissipation member 400, and the insulating member 700 and the first heat dissipation pad 410 may be disposed between the base member 310 and the heat dissipation member 400. ) May be arranged.

The through hole of the base member 310 may be disposed to correspond to the central region of the heat dissipation member 400, and the base member 310 may be disposed to correspond to the peripheral area of the heat dissipation member 400.

Subsequently, a portion of the base member 310 may be exposed to the outside of the housing 100.

Here, a plurality of electrode pads (not shown) are disposed on the exposed surface of the base member 310, and the driving unit 300 may receive external power through the electrode pads.

In addition, the circuit element 320 disposed on the base member 310 of the driving unit 300 includes a DC converter for converting AC power supplied from an external power source into DC power and a driving chip for controlling driving of the light source 220. And an electrostatic discharge (ESD) protection element for protecting the light source 220.

Next, the embodiment may include a top cover 600 that fixes the periphery of the optical member 500.

Also, the embodiment may include a plurality of heat dissipation pads, for example, the first, second, and third heat dissipation pads 410, 420, and 430.

Here, the first heat dissipation pad 410 may be disposed between the base member 310 of the driving unit 300 and the heat dissipation member 400, and the second heat dissipation pad 420 may be a substrate 210 of the light source module 200. ) And the heat dissipation member 400, and the third heat dissipation pad 430 may be disposed between the bottom surface of the heat dissipation member 400 and an external heat sink (not shown).

The first heat dissipation pad 410 may be disposed only on a portion of the base member 310 of the driving unit 300. The heat dissipation pad 410 may be disposed.

Subsequently, the second heat dissipation pad 420 may be partially disposed only in a central region of the upper surface of the upper surface of the heat dissipation member 400, and the third heat dissipation pad 430 may be disposed on the entire lower surface of the heat dissipation member 400. Can be arranged.

Therefore, the embodiment, by rapidly transferring the heat generated from the light source module 200 and the drive unit 300 through the first, second, third heat radiation pads (410, 420, 430), The heat dissipation performance can be improved.

As described so far, in the embodiment, by arranging the light source 220 adjacent to the heat dissipation member 400, the heat resistance can be reduced to improve the heat dissipation performance.

In addition, in the embodiment, by arranging the light source 220 on the heat radiating member 400 having no boss, it is possible to increase the arrangement area of the light source 220 and to improve the light efficiency.

In addition, in the embodiment, by removing the boss from the heat dissipation member 400 and integrating the reflector 110 and the housing 100, assembly is easy and weight can be reduced.

3A and 3B are diagrams illustrating a disposition relationship between the heat dissipation member, the light source module, and the driving unit of FIG. 2B. FIG. 3A is a sectional view, and FIG.

As shown in FIGS. 3A and 3B, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

Here, the central region of the heat dissipation member 400 may have a first thickness t1, and the peripheral region of the heat dissipation member 400 may have a second thickness t2, where the first thickness t1 and the second thickness t2 may be the same. have.

The light source module 200 may be disposed in the central region of the heat radiating member 400, and the driving unit 300 electrically connected to the light source module 200 may be disposed in the peripheral region of the heat radiating member 400. Can be.

In this case, the light source module 200 may include a substrate 210 and a plurality of light sources 220 disposed on the substrate 210. The substrate 210 directly contacts the central region of the heat dissipation member 400. can be contacted.

In some cases, the substrate 210 may be disposed at a predetermined distance from the heat dissipation member 400, and a heat dissipation pad (not shown) may be disposed between the substrate 210 and the heat dissipation member 400.

Subsequently, the driving unit may include a base member 310 and a plurality of circuit elements 320 disposed on the base member 310.

Here, the through member 330 may be formed in the central region of the base member 310, and the through hole 330 of the base member 310 is disposed corresponding to the central region of the heat dissipation member 400. Can be.

The base member 310 may be disposed corresponding to the peripheral area of the heat dissipation member 400.

In some cases, the area of the through hole 330 of the base member 310 may be equal to the area of the central area of the heat dissipation member 400, and the area of the base member 310 is a peripheral area of the heat dissipation member 400. It may be equal to the area of.

In addition, the base member 310 may directly contact the heat dissipation member 400.

In some cases, the base member 310 may be disposed at a predetermined distance from the heat dissipation member 400. An insulating member (not shown) and a heat dissipation pad (not shown) may be disposed between the base member 310 and the heat dissipation member 400. May be arranged.

As described above, in the embodiment, by disposing the light source module 200 on the heat dissipation member 400 having no boss, the heat resistance may be reduced to improve heat dissipation performance, and the arrangement area of the light source module 200 may be increased. The light efficiency may be improved, and the boss may be removed from the heat dissipation member 400 to reduce the weight.

4 is a cross-sectional view showing a heat dissipation member according to a first embodiment.

As illustrated in FIG. 4, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

In addition, the central area and the peripheral area of the heat dissipation member 400 may be disposed on the same level.

That is, the surface 400a of the central region of the heat dissipation member 400 and the surface 400b of the peripheral region of the heat dissipation member 400 are flat planes and may have the same height.

Therefore, a light source module (not shown) may be correspondingly disposed in the central region of the heat dissipation member 400, and a driving unit (not shown) electrically connected to the light source module corresponds to the peripheral region of the heat dissipation member 400. Can be arranged.

As such, the reason why the central region and the peripheral region of the heat dissipation member 400 are disposed on the same level with the same thickness is as follows. First, a light source module (not shown) and a driving unit (not shown) are generated. Since heat resistance can be improved by reducing the resistance to heat, and second, the light efficiency can be improved by increasing the arrangement area of the light source module 200. Third, since the overall weight of the heat dissipation member 400 can be reduced. to be.

5A and 5B are cross-sectional views illustrating boundary grooves disposed in the heat dissipation member of FIG. 4.

As shown in FIGS. 5A and 5B, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

In addition, a boundary groove 404 may be disposed between the central region and the peripheral region of the heat dissipation member 400.

Here, the reason for disposing the boundary groove 404 between the central region and the peripheral region of the heat dissipation member 400 is that the light source module (not shown) and the driving unit (not shown) are correctly aligned on the heat dissipation member 400. To do so.

In this case, the ratio between the depth of the boundary groove 404 and the thickness of the heat dissipation member 400 may be about 0.001: 1-0.5: 1.

The reason is that if the depth of the boundary groove 404 is too shallow, since the division of the center region and the peripheral region of the heat dissipation member 400 is not clear, the alignment of the light source module and the driving unit may not be accurate, and the boundary groove 404 This is because if the depth of) is too deep, a crack may occur in the heat dissipation member 400 even with a weak external shock.

In addition, as shown in FIG. 5A, the boundary groove 404 of the heat dissipation member 400 has a depth d1 of the boundary groove 404 located at one side of the central region of the heat dissipation member 400 and the heat dissipation member 400. Depth d2 of the boundary groove 404 located on the other side of the central region may be equal to each other.

That is, the boundary groove 404 of the heat dissipation member 400 may have a uniform depth as a whole.

In some cases, the boundary groove 404 of the heat dissipation member 400 has a depth d1 of the boundary groove 404 located at one side of the center region of the heat dissipation member 400 and the center of the heat dissipation member 400, as shown in FIG. 5B. The depth d2 of the boundary groove 404 located on the other side of the region may be different.

That is, the boundary groove 404 of the heat dissipation member 400 may have an uneven depth as a whole.

This is because the heat dissipation performance can be improved by increasing the heat dissipation area of the heat dissipation member 400.

As such, by arranging the boundary grooves 404 between the central area and the peripheral area of the heat dissipation member 400, the light source module (not shown) and the driving unit (not shown) are accurately aligned on the heat dissipation member 400. The heat dissipation area of the heat dissipation member 400 can be increased.

6 is a cross-sectional view illustrating a heat dissipation member according to the embodiment of FIG. 2.

As illustrated in FIG. 6, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

In addition, the central area and the peripheral area of the heat dissipation member 400 may be disposed on different planes.

In addition, when the optical member 500 is disposed in the upper opening of the housing 100, and the heat dissipation member 400 is disposed in the lower opening of the housing 100, the surface 400a of the central region of the heat dissipation member 400 is disposed. The distance d11 between the optical member 500 and the optical member 500 may be closer than the distance d12 between the surface 400b of the peripheral region of the heat radiating member 400 and the optical member 500.

Subsequently, an interface 400c may be disposed between the surface 400a of the central region of the heat dissipation member 400 and the surface 400b of the peripheral region, and the interface 400c of the heat dissipation member 400 may include a heat dissipation member ( It may be perpendicular to the surface 400a of the central region of 400 and the surface 400b of the peripheral region.

As described above, the heat dissipation member 400 according to the second exemplary embodiment may arrange a light source module (not shown) disposed in the central region of the heat dissipation member 400 so as to be adjacent to the optical member 500, thereby increasing luminance. Not only that, but also the heat dissipation performance can be improved.

7A to 7D are sectional views showing the heat dissipation member according to the third embodiment.

As shown in FIGS. 7A to 7D, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

In addition, when the optical member 500 is disposed in the upper opening of the housing 100, and the heat dissipation member 400 is disposed in the lower opening of the housing 100, the surface 400a of the central region of the heat dissipation member 400 is disposed. The distance d11 between the optical member 500 and the optical member 500 may be further than the distance d12 between the surface 400b of the peripheral region of the heat radiating member 400 and the optical member 500.

Subsequently, an interface 400c may be disposed between the surface 400a of the central region of the heat dissipation member 400 and the surface 400b of the peripheral region. The interface 400c of the heat dissipation member 400 is illustrated in FIG. 7A. Likewise, it may be perpendicular to the surface 400a of the central region of the heat dissipation member 400 and the surface 400b of the peripheral region.

In some cases, the interface 400c of the heat dissipation member 400 has a surface 400a of the central region of the heat dissipation member 400 and the surface 400b of the peripheral region, as shown in FIGS. 7B, 7C, and 7D. It may be inclined.

Here, the angle θ1 between the boundary surface 400c of the heat dissipation member 400 and the surface of the central region of the heat dissipation member 400 may be an obtuse angle.

The boundary surface 400c of the heat dissipation member 400 may be a flat plane, as shown in FIG. 7B, may be a concave curved surface, as shown in FIG. 7C, or may be a convex curved surface, as illustrated in FIG. 7D.

As such, the boundary surface 400c of the heat dissipation member 400 is inclined because the light generated from the light source module can be reflected in the direction of the optical member 500 without loss, thereby providing uniform luminance.

As described above, the heat dissipation member 400 according to the third exemplary embodiment may arrange the light source module (not shown) disposed in the central region of the heat dissipation member 400 so as to be adjacent to an external heat sink (not shown). The heat dissipation performance can be improved.

8A and 8B are views showing the fastening holes of the heat dissipation member, FIG. 8A is a sectional view, and FIG. 8B is a perspective view.

As shown in FIGS. 8A and 8B, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

Here, a light source module (not shown) may be correspondingly disposed in the central region of the heat dissipation member 400, and a driving unit (not shown) electrically connected to the light source module corresponds to the peripheral region of the heat dissipation member 400. Can be arranged.

In addition, at least one fastening hole 402 may be disposed in the central region of the heat dissipation member 400.

Here, the fastening hole 402 of the heat dissipation member 400 may be disposed corresponding to the fastening groove of the reflector (110 of FIG. 2B).

As such, the reason for arranging the fastening hole 402 in the central region of the heat dissipation member 400 is that the center region of the heat dissipation member 400 in which the light source module may be disposed is relative to the peripheral region of the heat dissipation member 400. Because it is wide.

In addition, the fastening hole 402 of the heat dissipation member 400 is disposed around the substrate (210 of FIG. 2B) of the light source module 200 (FIG. 2B), and the substrate (210 of FIG. 2B) of the light source module (200 of FIG. 2B). It may be arranged so that it is not covered by).

In some cases, the fastening hole 402 of the heat dissipation member 400 is disposed under the substrate (210 of FIG. 2B) of the light source module 200 (FIG. 2B), and the substrate (FIG. 2B) of the light source module 200 (FIG. 2B). It may be covered by (210).

Here, through holes (not shown) may be disposed on the substrate (210 of FIG. 2B) of the light source module 200 (FIG. 2B) corresponding to the fastening hole 402 of the heat radiating member 400.

9A and 9B are views showing protrusions of the heat dissipation member. FIG. 9A is a cross-sectional view and FIG. 9B is a perspective view.

As shown in FIGS. 9A and 9B, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

In addition, at least one projection 403 may be disposed in a peripheral area of the heat dissipation member 400.

Here, the protrusion 403 may protrude outward from an edge of the heat dissipation member 400.

In this case, the outward direction means a direction parallel to the surface 400b of the peripheral region of the heat dissipation member 400.

The protrusion 403 of the heat dissipation member 400 may be formed of a metal material or a resin material, but is not limited thereto.

In addition, the protrusion 403 of the heat dissipation member 400 may be made of the same material as the heat dissipation member 400, but may be made of different materials in some cases.

For example, when the protrusion 403 of the heat dissipation member 400 is a resin material, the heat dissipation member 400 may be a metal material.

Alternatively, when the protrusion 403 of the heat dissipation member 400 is a metal material, the heat dissipation member 400 may be a resin material.

As such, the protrusion 403 of the heat dissipation member 400 is inserted into the groove of the housing (100 in FIG. 2B), whereby the heat dissipation member 400 covers the lower opening of the housing (100 in FIG. 2B). 2b of 100).

10A to 10C are cross-sectional views showing a central region of the heat dissipation member.

As shown in FIGS. 10A to 10C, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

In this case, a light source module (not shown) may be disposed correspondingly to the central region of the heat dissipation member 400, and a driving unit (not shown) electrically connected to the light source module corresponds to the peripheral region of the heat dissipation member 400. Can be arranged.

And, as shown in Figure 10a, the central region and the peripheral region of the heat radiation member 400 may be a flat plane.

Here, when the central region of the heat dissipation member 400 is a flat plane, there is an effect that can improve the light efficiency by increasing the arrangement area of the light source module.

In addition, as shown in FIG. 10B, the central region of the heat dissipation member 400 may be a convex curved surface, and the peripheral region of the heat dissipation member 400 may be a flat plane.

Here, when the central region of the heat dissipation member 400 is a convex curved surface, the light directing angle of the light source module is widened, and the light can be diffused.

Subsequently, as shown in FIG. 10C, the central region of the heat dissipation member 400 may be a concave curved surface, and the peripheral region of the heat dissipation member 400 may be a flat plane.

Here, when the central region of the heat dissipation member 400 is a concave curved surface, it is possible to concentrate the light of the light source module to the central region to increase the luminous flux.

11 is a cross-sectional view showing a method of arranging a light source according to the first embodiment.

As illustrated in FIG. 11, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

Here, at least one light source 220 may be correspondingly disposed in the central region of the heat radiating member 400, and a driving unit (not shown) electrically connected to the light source 220 in the peripheral region of the heat radiating member 400. ) May be arranged correspondingly.

In this case, the light source 220 may directly contact the heat dissipation member 400.

In addition, when the plurality of light sources 220 are disposed in the central region of the heat dissipation member 400, the light sources 220 adjacent to each other may be spaced apart at a predetermined interval.

Here, the spacing between the light sources 220 may be uniform throughout, or in some cases may be nonuniform.

For example, the distance between the light sources 220 may gradually increase from the central area of the heat dissipation member 400 to the peripheral area.

In some cases, the distance between the light sources 220 may be gradually reduced from the central area of the heat dissipation member 400 to the peripheral area.

In addition, the ratio of the total area S1 of the central area of the heat dissipation member 400 and the total area S2 of the light source 220 may be about 1: 0.3-1: 10.8.

The reason is that when the total area S2 of the light source 220 is about 30% or less with respect to the total area S1 of the central region of the heat dissipation member 400, the overall luminance is lowered and thus it cannot perform the function as the lighting device. If the total area S2 of 220 is about 80% or more with respect to the total area S1 of the central region of the heat dissipation member 400, since the distance between the light sources 220 may be too narrow, electrical circuit design may be difficult. to be.

12A and 12B are cross-sectional views illustrating a method of arranging a light source according to a second embodiment.

As shown in FIGS. 12A and 12B, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

Here, the light source 220 may be correspondingly disposed in the central region of the heat dissipation member 400, and the driving unit (not shown) electrically connected to the light source 220 may correspond to the peripheral region of the heat dissipation member 400. Can be arranged.

In this case, the light source 220 may be disposed on the substrate 210, and the substrate 210 may directly contact the heat dissipation member 400.

In addition, when the plurality of light sources 220 are disposed on the substrate 210, the light sources 220 adjacent to each other may be spaced apart at a predetermined interval.

In addition, the total area S1 of the central region of the heat dissipation member 400 and the total area S3 of the substrate 210 may be the same as in FIG. 12A.

In some cases, the total area S1 of the central region of the heat dissipation member 400 and the total area S3 of the substrate 210 may be different from each other as shown in FIG. 12B.

Here, the total area S3 of the substrate 210 may be smaller than the total area S1 of the central area of the heat dissipation member 400.

Therefore, the ratio of the total area S1 of the central region of the heat dissipation member 400 to the total area S3 of the substrate 210 may be about 1: 0.5-1: 1.

The reason is that if the total area S3 of the substrate 210 is about 50% or less with respect to the total area S1 of the central region of the heat dissipation member 400, the number of light sources 220 to be arranged is limited, so that the overall luminance is low. If the total area S3 of the substrate 210 is about 100% or more with respect to the total area S1 of the central region of the heat dissipation member 400, the drive unit (not shown) arrangement space is too narrow so that the arrangement of the drive unit (not shown) Because it can be difficult.

In addition, a connector (not shown) for electrically connecting the driving unit (not shown) and the light source 220 may be disposed in the edge region of the substrate 210.

In some cases, as shown in FIG. 12B, when the area of the substrate 210 is small, a connector (not shown) for electrically connecting the driving unit (not shown) and the light source 220 may be provided in a peripheral area of the heat dissipation member 400. It may be arranged.

13 is a cross-sectional view illustrating a method of arranging a light source according to a third embodiment.

As illustrated in FIG. 13, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

In this case, the light source 220 may be disposed on the substrate 210, and the substrate 210 may be disposed at a predetermined distance from the heat dissipation member 400.

That is, the lower surface 210a of the substrate 210 may be spaced apart from the surface 400a of the central region of the heat dissipation member 400 by a predetermined distance d10.

In this case, a heat transfer medium (not shown) may be disposed between the heat dissipation member 400 and the substrate 210.

Here, the heat transfer medium (not shown) may be in contact with the heat dissipation member 400 and the substrate 210 in part or all to transfer heat of the substrate 210 to the heat dissipation member 400.

In this case, the heat transfer medium (not shown) may be made of a material that electrically insulates the substrate 210 from the heat dissipation member 400 and transmits heat.

As such, when the substrate 220 is disposed away from the heat dissipation member 400 by a predetermined distance, since the distance between the optical member (not shown) and the light source 210 approaches, the overall luminance may increase.

14A to 14C are cross-sectional views illustrating a method of arranging a light source according to a fourth embodiment.

As shown in FIGS. 14A to 14C, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

The second heat dissipation pad 420 may be disposed between the substrate 210 and the heat dissipation member 400.

Here, the second heat dissipation pad 420 may quickly transfer heat generated from the light source 220 in the direction of the heat dissipation member 400. The area of the second heat dissipation pad 420 is larger than the area of the substrate 210. It may be larger or equal to the area of the substrate 210.

As shown in FIG. 14A, an area S4 of the second heat dissipation pad 420 may be the same as an area S3 of the substrate 210.

The area S4 of the second heat dissipation pad 420 may be equal to the total area S1 of the central region of the heat dissipation member 400.

In some cases, as shown in FIG. 14B, the area S4 of the second heat radiation pad 420 may be larger than the area S3 of the substrate 210.

As another example, as shown in FIG. 14C, an area S4 of the second heat dissipation pad 420 may be larger than an area S3 of the substrate 210.

The area S4 of the second heat dissipation pad 420 may be larger than the total area S1 of the center area of the heat dissipation member 400.

As described above, the area of the second heat dissipation pad 420 is larger than the area of the substrate 210 or the same as the area of the substrate 210. The heat generated from the light source 220 is transferred to the heat dissipation pad 400. This is because the heat dissipation performance can be improved by delivering quickly.

15A to 15C show a connector disposed on the heat dissipation pad, wherein FIG. 15A is a sectional view, FIG. 15B is a plan view, and FIG. 15C is a detail view of the connector.

As shown in FIGS. 15A to 15C, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

In addition, a connector 230 for electrically connecting the driving unit (not shown) and the light source 220 may be disposed in the peripheral region of the heat dissipation member 400.

Here, the connector 230 may include a plurality of pins 232 and a support 231 for supporting the plurality of pins 232, as shown in FIG. 15C.

For example, the plurality of pins 232 may include a first pin 232a, a second pin 232b, and a third pin 232c, where the first pin 232a is a positive terminal. The second pin 232b may be a negative terminal, and the third pin 232c may be a ground terminal.

Accordingly, the connector 230 may electrically connect the driving unit (not shown) and the light source 220.

As described above, in the embodiment, by arranging the connector 230 on the heat dissipation member 400, assembly and fixing of the driving unit (not shown) and the heat dissipation member 400 are facilitated, and the driving unit (not shown) and the light source 220 and The electrical connection of the is simple, and an additional area for electrical connection between the driving unit and the light source 220 is not required, so that the number of the light sources 220 may be increased.

Here, most importantly, since the connector 230 includes a ground pin for grounding a driving unit (not shown), it is necessary to design an additional ground line and a ground circuit installation space for grounding of the driving unit (not shown). Therefore, the light efficiency may be improved by maximizing the arrangement area of the light source 220.

16 is a view showing an arrangement of connectors disposed on the heat dissipation member and the driving unit.

As illustrated in FIG. 16, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

Here, the light source 220 may be correspondingly disposed in the central region of the heat dissipation member 400, and the driving unit 300 electrically connected to the light source 220 may correspond to the peripheral region of the heat dissipation member 400. Can be arranged.

In addition, a connector 230 for electrically connecting the driving unit 300 and the light source 220 may be disposed in the peripheral region of the heat dissipation member 400.

Here, the connector 230 may include a plurality of pins 232 and a support 231 for supporting the plurality of pins 232.

For example, the plurality of pins 232 may include a plus (+) terminal, a minus (-) terminal, and a ground terminal.

Subsequently, the driver 300 includes a base member 310 including a through hole 330 in a central region, and a circuit disposed on the base member 310 to drive the light source 220. Device 320 may be included.

Here, the through hole 330 of the base member 310 may be disposed to correspond to the central region of the heat dissipation member 400, and the base member 310 may be disposed to correspond to the peripheral region of the heat dissipation member 400. have.

In addition, the lower surface of the base member 310 may face the heat dissipation member 400, and a driver connector 350 may be disposed.

Here, the driver connector 350 may be electrically connected to correspond to the connector 230 of the heat dissipation member 400, and may include a positive terminal, a negative terminal, and a ground terminal. have.

Therefore, the base member 310 of the driving unit 300 may be coupled to correspond to the peripheral area of the heat dissipation member 400, in which case the connector for the driving unit 350 and the connector 230 of the heat dissipation member 400 are mutually Can be electrically connected.

17A and 17B are views illustrating the driving unit of FIG. 2B, and FIG. 17A is a plan view, and FIG. 17B is a cross-sectional view taken along line II-II of FIG. 17A.

As shown in FIGS. 17A and 17B, the driving unit 300 includes a base member 310 including a via hole 330 in a central region, and a base member 310 disposed on the base member 310. May include a circuit device 320.

Here, the base member 310 may have a circular plate shape, but is not limited thereto and may have various shapes.

For example, the base member 310 may be an oval or polygonal plate shape or the like.

In addition, the base member 310 may be an insulator printed with a circuit pattern.

In addition, the circuit element 320 of the driving unit 300 includes a DC converter for converting AC power provided from an external power source into DC power, a driving chip for controlling the driving of the light source 220, and protecting the light source 220. And an electrostatic discharge (ESD) protection element.

Subsequently, the through hole 330 of the base member 310 is disposed corresponding to the central region of the heat dissipation member (not shown), and the base member 310 is disposed corresponding to the peripheral region of the heat dissipation member (not shown). Can be.

Here, the area S5 of the through hole 330 of the base member 310 may be the same as the area of the center area of the heat dissipation member (not shown), and in some cases, the area of the center area of the heat dissipation member (not shown). It may be larger than

In addition, the area S6 of the base member 310 may be the same as the area of the peripheral area of the heat dissipation member (not shown), and in some cases, may be smaller than the area of the peripheral area of the heat dissipation member (not shown).

That is, the area S5 of the through hole 330 of the base member 310 is equal to the area of the light source module (not shown) disposed in the center region of the heat dissipation member (not shown) or the area of the light source module (not shown). Can be greater than

In this way, the driving unit 300, by arranging the through-hole 330 in the central region of the base member 310, it is easy to assemble with the heat dissipation member (not shown) where the light source module (not shown) is arranged, and the light source module The light efficiency can be improved by increasing the arrangement area of (not shown).

18A and 18B are cross-sectional views illustrating a method of arranging a driving unit according to the first embodiment.

As shown in FIGS. 18A and 18B, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

In addition, the driving unit 300 may include a base member 310 including a through hole 330 in a central region, and a circuit element 320 disposed on the base member 310.

In this case, the base member 310 may directly contact the heat dissipation member 400.

18A, the area S5 of the through hole 330 of the base member 310 may be the same as the area S1 of the central region of the heat dissipation member 400, and the area S6 of the base member 310 may be It may be equal to the area S7 of the peripheral region of the heat dissipation member 400.

In some cases, as shown in FIG. 18B, the area S5 of the through hole 330 of the base member 310 may be larger than the area S1 of the central region of the heat dissipation member 400, and the area S6 of the base member 310. May be smaller than the area S7 of the peripheral region of the heat dissipation member 400.

That is, the area S5 of the through hole 330 of the base member 310 is equal to the area of the light source module (not shown) disposed in the central region of the heat dissipation member 400 or is larger than the area of the light source module (not shown). Can be larger.

As described above, in the embodiment, since the base member 310 of the driving unit 300 directly contacts the heat dissipating member 400, the heat dissipation efficiency of the driving unit 300 may be improved.

In addition, the area S5 of the through hole 330 of the base member 310 is equal to the area of the light source module (not shown) disposed in the central region of the heat dissipation member 400 or is larger than the area of the light source module (not shown). Since it is larger, the light efficiency can be improved by increasing the arrangement area of the light source module (not shown).

19 is a cross-sectional view illustrating a method of arranging a driving unit according to a second embodiment.

As illustrated in FIG. 19, the heat dissipation member 400 may include a central area and a peripheral area surrounding the central area.

In this case, the base member 310 may be disposed away from the heat dissipation member 400 by a predetermined interval.

That is, the lower surface 310a of the base member 310 may be spaced apart from the surface 400b of the peripheral area of the heat dissipation member 400 by a predetermined distance d11.

In this case, a heat transfer medium (not shown) may be disposed between the heat dissipation member 400 and the base member 310 of the driving unit 300.

Here, the heat transfer medium (not shown) is part or all in contact with the heat dissipation member 400 and the base member 310 of the driver 300 to transfer the heat of the driver 300 to the heat dissipation member 400. can do.

In this case, the heat transfer medium (not shown) may be made of a material that electrically insulates the drive unit 300 from the heat dissipation member 400 and transmits heat.

As such, when the driving unit 300 is disposed away from the heat dissipation member 400 by a predetermined distance, an area of the light source module (not shown) disposed on the heat dissipation member 400 may increase.

20A and 20B illustrate a method of arranging the driving unit according to the third embodiment, in which FIG. 20A is a sectional view and FIG. 20B is an exploded perspective view.

As shown in FIGS. 20A and 20B, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

In addition, the insulating member 700 and the first heat radiation pad 410 may be disposed between the base member 310 and the heat dissipation member 400.

Here, the first heat dissipation pad 410 may quickly transfer heat generated from the driving unit 300 in the direction of the heat dissipation member 400, and the area of the first heat dissipation pad 410 is the area of the base member 310. Can be smaller than

Subsequently, the insulating member 700 is to electrically insulate the driving unit 300 and the heat dissipation member 400, and an area of the insulating member 700 may be smaller than that of the base member 310.

In addition, an area of the insulating member 700 may be larger than that of the first heat dissipation pad 410.

Here, the first heat dissipation pad 410 may be disposed only on a portion of the base member 310 of the driving unit 300. For example, the first heat dissipation pad 410 may be formed in a region where a circuit element that generates a lot of heat, such as a transformer, is disposed. 1 The heat dissipation pad 410 may be disposed.

The thickness of the insulating member 700 may be the same as the thickness of the first heat dissipation pad 410, but may be different in some cases.

In this way, the insulating member 700 and the first heat dissipation pad 410 are disposed between the base member 310 and the heat dissipation member 400 so that the base member 310 and the heat dissipation member 400 of the driving unit 300 are disposed. Assembly is easy, and heat dissipation performance of the driving unit 300 may be improved.

21A and 21B illustrate a method of arranging the driving unit according to the fourth embodiment, in which FIG. 21A is a sectional view and FIG. 21B is an exploded perspective view.

As shown in FIGS. 21A and 21B, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

The first heat dissipation pad 410 may be disposed between the base member 310 and the heat dissipation member 400.

Here, the first heat dissipation pad 410 may quickly transfer heat generated from the driving unit 300 in the direction of the heat dissipation member 400, and the area of the first heat dissipation pad 410 is the area of the base member 310. And may be identical to each other.

In some cases, the area of the first heat radiation pad 410 may be smaller than the area of the base member 310.

In addition, a through hole may be formed in the central region of the first heat radiating pad 410, and the through hole of the first heat radiating pad 410 may be disposed to correspond to the through hole 330 of the driving unit 300.

Here, the area of the through hole of the first heat radiation pad 410 may be equal to the area of the through hole 330 of the driving part 300, or larger than the area of the through hole 330 of the driving part 300.

As such, by disposing the first heat dissipation pad 410 between the base member 310 and the heat dissipation member 400, the heat dissipation performance of the driving unit 300 may be improved.

22A and 22B show a housing according to the first embodiment, in which FIG. 22A is a perspective view and FIG. 22B is a sectional view taken along line III-III of FIG. 22A.

As shown in FIGS. 22A and 22B, the housing 100 includes an upper opening 102 and a lower opening 104, wherein the upper opening 102 of the housing 100 has an optical member (500 in FIG. 2B). May be disposed, and a heat dissipation member (400 of FIG. 2B) may be disposed in the lower opening 104 of the housing 100.

That is, the housing 100 accommodates an optical member (500 in FIG. 2B), a light source module (200 in FIG. 2B), a driving unit (300 in FIG. 2B), and a heat dissipation member (400 in FIG. 2B) to improve the appearance of the lighting device. Can be configured.

The diameter D21 of the upper opening 102 of the housing 100 may then be larger than the diameter D22 of the lower opening 104.

In addition, the inner surface 106 of the housing 100 may be a reflective surface that reflects light.

Here, the inner surface 106 of the housing 100 may be any one of a flat plane, a concave curved surface, and a convex curved surface.

In addition, a hollow 108 having a predetermined depth may be disposed around the lower opening 104 of the housing 100.

Here, the hollow 108 of the housing 100 is a space in which circuit elements of a driving unit (not shown) may be disposed, and the depth of the hollow 108 may be determined by the height of the circuit elements.

In addition, at least one fastening part 101 may be disposed around the lower opening 104 of the housing 100.

Here, at least one fastening groove 101a may be disposed in the fastening portion 101 of the housing 100.

In this case, an external fastening screw 750 may be inserted into the fastening groove 101a.

That is, the fastening screw 750 penetrates the fastening hole of the heat dissipation member (not shown) and is inserted into the fastening groove 101a of the fastening portion 101 of the housing 100, whereby the heat dissipation member (not shown) is connected to the housing ( 100).

As such, the housing 100 has an additional diameter, such as a reflector, since the diameter D21 of the upper opening 102 is larger than the diameter D22 of the lower opening 104, and the inner surface 106 reflects light. No components are required, the assembly process is easy and the overall weight and cost can be reduced.

That is, the embodiment is an integrated housing in which the reflector and the housing 100 are integrated, and the configuration of the lighting apparatus can be simplified.

23A-23C are cross-sectional views showing the inner side of the housing of FIG. 22B.

As shown in FIGS. 23A-23C, the housing 100 includes an upper opening and a lower opening, in which an optical member (500 of FIG. 2B) may be disposed, and the housing 100. The heat dissipation member (400 of FIG. 2B) may be disposed in the lower opening of the bottom surface.

Here, the diameter of the upper opening of the housing 100 may be larger than the diameter of the lower opening.

Here, the inner surface 106 of the housing 100 may be a flat plane, as shown in Figure 23a.

In some cases, the inner surface 106 of the housing 100 may be a concave curved surface, as shown in FIG. 23B.

As another case, the inner surface 106 of the housing 100 may be a convex curved surface, as shown in FIG. 23C.

As described above, the inner surface 106 of the housing 100 is an element capable of determining the uniformity of luminance, and adjusts the degree of inclination of the inner surface 106 of the housing 100 or the curvature of the inner surface 106 of the housing 100. Thereby, the lighting apparatus which can provide uniform luminance can be manufactured.

24A and 24B show a housing according to a second embodiment, in which FIG. 24A is a perspective view and FIG. 24B is a sectional view taken along line IV-IV of FIG. 24A.

As shown in FIGS. 24A and 24B, the housing 100 includes an upper opening and a lower opening, in which an optical member (500 of FIG. 2B) may be disposed, and the housing 100. The heat dissipation member (400 of FIG. 2B) may be disposed in the lower opening of the bottom surface.

In addition, the housing 100 may have a reflector 110 mounted therein.

Here, the reflector 110 may be a detachable type detachable from the housing 100.

Here, the reflector 110 may include a first opening 112 facing the optical member (500 in FIG. 2B) and a second opening 114 facing the light source module (200 in FIG. 2B). The diameter D31 of the first opening 112 may be larger than the diameter D32 of the second opening 114.

In this case, the inner surface 118 of the reflector 110 may be any one of a flat plane, a concave curved surface, and a convex curved surface.

In addition, a space 108 having a predetermined size may be formed between the outer surface of the reflector 110 and the inner surface of the housing 100, and the space between the outer surface of the reflector 110 and the inner surface of the housing 100. The circuit elements of the driver (not shown) may be disposed at 108.

In addition, at least one fastening part 116 may be disposed around the second opening 114 of the reflector 110.

Here, at least one fastening groove 116a may be disposed in the fastening portion 116 of the reflector 110.

In this case, an external fastening screw 750 may be inserted into the fastening groove 116a.

That is, the fastening screw 750 penetrates the fastening hole of the heat dissipation member (not shown), and is inserted into the fastening groove 116a of the fastening portion 116 of the reflector 110, whereby the heat dissipation member (not shown) is the reflector (not shown). 110).

As such, in the detachable housing 100 in which the reflector 110 may be separated from the housing 100, the reflector 110 may be coupled to and separated from the inside of the housing 100.

Such a detachable housing 100 has an effect that is easy to replace and repair when the reflector 110 is damaged.

25A-25C are cross-sectional views showing the inner side of the reflector of FIG. 24B.

As shown in FIGS. 25A-25C, the reflector 110 may include a first opening facing the optical member (500 of FIG. 2B) and a second opening facing the light source module (200 of FIG. 2B). There is a diameter of the first opening may be larger than a diameter of the second opening.

Here, the inner surface 118 of the reflector 110 may be any one of a flat plane, a concave curved surface, and a convex curved surface.

In this case, the inner surface 118 of the reflector 110 may be a flat plane, as shown in Figure 25a.

In some cases, the inner surface 118 of the reflector 110 may be a concave curved surface, as shown in FIG. 25B.

As another case, the inner side surface 118 of the reflector 110 may be a convex curved surface, as shown in FIG. 25C.

As described above, the inner side surface 118 of the reflector 110 is an element capable of determining the uniformity of luminance, and the degree of inclination of the inner side surface 118 of the reflector 110 or the inner side surface 118 of the reflector 110 is determined. By adjusting the curvature, it is possible to manufacture a lighting device that can provide a uniform brightness.

26 is a cross-sectional view illustrating a lighting apparatus to which a heat dissipation member according to a fourth embodiment is applied.

As illustrated in FIG. 26, the heat dissipation member 400 according to the fourth embodiment may include a central region and a peripheral region surrounding the central region.

Here, the central region of the heat dissipation member 400 may have a first thickness t1, and the peripheral region of the heat dissipation member 400 may have a second thickness t2, and the first thickness t1 and the second thickness t2 may be different from each other. .

In addition, when the optical member 500 is disposed in the upper opening of the housing 100, and the heat dissipation member 400 is disposed in the lower opening of the housing 100, the surface of the central region of the heat dissipation member 400 and the optical member are disposed. The distance between the 500 may be longer than the distance between the surface of the peripheral region of the heat radiation member 400 and the optical member 500.

Subsequently, an interface between the surface of the central region of the heat dissipation member 400 and the surface of the peripheral region may be perpendicular to the surface of the central region of the heat dissipation member 400 and the surface of the peripheral region.

In some cases, the interface between the surface of the central region of the heat dissipation member 400 and the surface of the peripheral region may be inclined with respect to the surface of the central region and the surface of the peripheral region of the heat dissipation member 400. The angle between the surfaces of the central region of 400 may be an obtuse angle.

That is, the central region of the heat dissipation member 400 has a first thickness t1, and the peripheral region of the heat dissipation member 400 has a second thickness t2, and the first thickness t1 may be thinner than the second thickness t2.

Here, the ratio of the first thickness t1 and the second thickness t2 may be about 0.99: 1-0.1: 1.

If the first thickness t1 of the center region of the heat dissipation member 400 is too thin, the heat dissipation member 400 may be damaged even by a small external shock, and the first thickness t1 of the center region of the heat dissipation member 400 may be If too thick, heat dissipation efficiency due to heat resistance may be lowered.

The heat dissipation member 400 having such a structure may be disposed in the lower opening of the housing 100, and the optical member 500 may be disposed in the upper opening of the housing 100.

In addition, the light source 220 may be disposed in the central area of the heat dissipation member 400, and the driving unit 300 may be disposed in the peripheral area of the heat dissipation member 400, and may be electrically connected to the light source 220.

Subsequently, a reflector 110 may be mounted inside the housing 100, and the reflector 110 may include a first opening facing the optical member 500 and a second opening facing the light source 220. It may include.

Here, the diameter of the first opening may be larger than the diameter of the second opening.

In addition, the driver 300 includes a base member 310 including a via hole in a central region, and a circuit element 320 disposed on the base member 310 to drive the light source 220. ) May be included.

As described above, the heat dissipation member 400 according to the fourth embodiment may arrange the light source 220 disposed in the central region of the heat dissipation member 400 so as to be adjacent to an external heat sink (not shown). Can improve.

27A to 27D are cross-sectional views illustrating a heat dissipation member according to a fourth exemplary embodiment of FIG. 26.

As illustrated in FIGS. 27A to 27D, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

In addition, the heat dissipation member 400 may include an upper surface facing the optical member (not shown) and a lower surface facing the external heat sink.

Here, among the upper surfaces of the heat dissipation member 400, the central region and the peripheral region of the heat dissipation member 400 may be disposed on different planes, and among the lower surfaces of the heat dissipation member 400, the heat dissipation member The central area and the peripheral area of the 400 may be disposed on the same plane.

Next, as shown in FIG. 27A, the boundary surface 400c is formed between the surface 400a of the center region of the heat dissipation member 400 and the surface 400b of the peripheral region, and the surface 400a of the center region of the heat dissipation member 400 and the surface 400a. It may be perpendicular to the surface 400b of the peripheral region.

In some cases, the boundary surface 400c of the heat dissipation member 400 has a surface 400a of the central region of the heat dissipation member 400 and the surface 400b of the peripheral region as shown in FIGS. 27B, 27C, and 27D. It may be inclined.

Here, the angle θ11 between the boundary surface 400c of the heat dissipation member 400 and the surface of the central region of the heat dissipation member 400 may be an obtuse angle.

The boundary surface 400c of the heat dissipation member 400 may be a flat plane, as shown in FIG. 27B, may be a concave curved surface, as shown in FIG. 27C, or may be a convex curved surface as illustrated in FIG. 27D.

The reason why the boundary surface 400c of the heat dissipation member 400 is inclined as described above is that light generated from the light source module can be reflected in the direction of the optical member (500 of FIG. 1B) without loss to provide uniform luminance. .

As described above, the heat dissipation member 400 according to the fourth exemplary embodiment may arrange the light source (not shown) disposed in the central region of the heat dissipation member 400 to be adjacent to an external heat sink (not shown). It can improve performance.

28 is a cross-sectional view showing a heat dissipation member according to a fifth embodiment.

As illustrated in FIG. 28, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

Here, among the upper surfaces of the heat dissipation member 400, the central region and the peripheral region of the heat dissipation member 400 may be disposed on the same plane, and among the lower surfaces of the heat dissipation member 400, the heat dissipation member 400 may be formed. The central region and the peripheral region may be disposed on different planes.

As described above, the heat dissipation member 400 according to the fifth embodiment may arrange the light source (not shown) disposed in the central region of the heat dissipation member 400 to be adjacent to an external heat sink (not shown). It can improve performance.

29 is a cross-sectional view illustrating a lighting device to which a heat dissipation member according to a sixth embodiment is applied.

As illustrated in FIG. 29, the heat dissipation member 400 according to the sixth embodiment may include a central region and a peripheral region surrounding the central region.

Here, a recess 460 may be disposed in the central region of the heat dissipation member 400, and a light source 220 may be disposed in the recess 460.

In this case, the recess 460 may include a bottom surface 460a and a side surface 460b surrounding the bottom surface 460a, and the side surface 460b of the recess 460 may be inclined.

In this case, the angle θ21 between the side surface 460b of the recess 460 and the bottom surface 460a of the recess 460 may be an obtuse angle.

The reason why the side surface 460b of the recess 460 is inclined is that light generated from the light source 220 can be reflected in the direction of the optical member 500 without loss, thereby providing uniform luminance.

In some cases, the side 460b of the recess 460 may be perpendicular to the bottom surface 460a of the recess 460.

In addition, a driver 300 electrically connected to the light source 220 may be disposed in the peripheral area of the recess 460.

In addition, the ratio of the maximum depth d31 of the recess 460 and the thickness t of the heat dissipation member 400 may be about 0.99: 1-0.1: 1.

If the maximum depth of the recess 460 is too deep, the heat dissipation member 400 may be damaged even with a small external shock, and if the maximum depth of the recess 460 is too shallow, heat dissipation efficiency due to thermal resistance This can be degraded.

Here, the inclination of the inner surface 118 of the reflector 110 may be the same as the inclination of the side surface 460a of the recess 460 of the heat dissipation member 400.

This is because the light generated from the light source 220 can be reflected in the direction of the optical member 500 without loss to provide uniform luminance.

As described above, the heat dissipation member 400 according to the sixth embodiment may arrange the light source 220 disposed in the central region of the heat dissipation member 400 so as to be adjacent to an external heat sink (not shown). Can improve.

30A to 30C are cross-sectional views illustrating a heat dissipation member according to the sixth embodiment of FIG. 29, and FIG. 30A is a perspective view, and FIGS. 30B and 30C are cross-sectional views taken along the line VV of FIG. 30A.

As shown in FIGS. 30A to 30C, the heat dissipation member 400 may include a central region and a peripheral region surrounding the central region.

In this case, the ratio of the maximum depth d31 of the recess 460 and the thickness t of the heat dissipation member 400 may be about 0.99: 1 to 0.1: 1.

The recess 460 may include a bottom surface 460a and a side surface 460b surrounding the bottom surface 460a.

Here, as shown in FIG. 30B, the side 460b of the recess 460 may be perpendicular to the bottom surface 460a of the recess 460, and as shown in FIG. 30C, the side 460b of the recess 460. ) May be inclined with respect to the bottom surface 460a of the recess 460.

As described above, the heat dissipation member 400 according to the sixth embodiment may arrange a light source (not shown) disposed in the recess 460 of the heat dissipation member 400 to be adjacent to an external heat sink (not shown). Therefore, the heat dissipation performance can be improved.

31 is a cross-sectional view showing an area of a through hole of a driving unit.

As shown in FIG. 31, the housing 100 includes an upper opening and a lower opening. An optical member 500 may be disposed in an upper opening of the housing 100, and a heat dissipation may be provided in a lower opening of the housing 100. Member 400 may be disposed.

In addition, the light source 220 may be disposed in the central region of the heat dissipation member 400, and the driving unit 300 electrically connected to the light source 220 may be disposed in the peripheral region of the heat dissipation member 400.

Here, the driving part 300 may include a through hole 330 exposing the light source 220 disposed in the central region of the heat dissipation member 400.

That is, the driving unit 300 may include a base member 310 and a plurality of circuit elements 320 disposed on the base member 310.

In this case, the ratio of the area S23 of the through hole 330 of the driving part 300 to the total area S21 of the heat dissipation member 400 may be about 0.4: 1 to 0.8: 1.

If the area S23 of the through hole 330 is too large, the arrangement space of the driving part 300 is narrow, and thus the arrangement of the driving part 300 is difficult, and if the area S23 of the through hole 330 is too narrow, the light source 220 ), The space for the arrangement may be narrow, resulting in a decrease in light efficiency.

In addition, the reflector 110 may be mounted inside the housing 100, and the reflector 110 may include a first opening facing the optical member 500 and a second opening facing the light source 220. It may include.

As such, by optimally designing the area of the through hole 330 of the driving unit 300, the light efficiency of the light source 220 may be increased to improve the light efficiency.

32A to 32D are cross-sectional views showing distances between the driving unit and the optical member and between the light source and the optical member.

As shown in FIGS. 32A-32D, the housing (not shown) includes an upper opening and a lower opening. An optical member 500 may be disposed in the upper opening of the housing, and a heat dissipation member may be disposed in the lower opening of the housing. 400 may be disposed.

Here, the driving part 300 may include a through hole exposing the light source 220 disposed in the central region of the heat dissipation member 400.

Here, a through hole may be formed in the central region of the base member 310, and the through hole of the base member 310 may be disposed to correspond to the central region of the heat dissipation member 400.

In this case, the distance d52 between the optical member 500 and the base member 310 of the driving unit 300 may be closer than the distance d51 between the optical member 500 and the light source 220.

The reason is that the light source 220 can be disposed adjacent to an external heat sink (not shown), and the heat dissipation performance can be improved.

For example, FIG. 31A illustrates a structure in which the base member 310 and the light source 220 of the driving unit 300 are disposed on an upper surface of the heat radiating member 400 having a flat surface.

Here, the distance d52 between the optical member 500 and the base member 310 of the driver 300 may be closer than the distance d51 between the optical member 500 and the light source 220.

In addition, FIG. 31B illustrates a structure in which the base member 310 and the light source 220 of the driving unit 300 are disposed on the upper surface of the heat radiating member 400 having the recess in the central region.

Here, the light source 220 may be disposed in the recess of the heat dissipation member 400.

Therefore, the distance d52 between the optical member 500 and the base member 310 of the driving unit 300 may be closer than the distance d51 between the optical member 500 and the light source 220.

Subsequently, FIG. 31B illustrates a structure in which the base member 310 and the light source 220 of the driving unit 300 are disposed on the upper surface of the heat radiating member 400 having the recess in the central region.

Here, the substrate 210 may be disposed in the recess of the heat dissipation member 400, and the light source 220 may be disposed on the substrate 210.

31D illustrates a structure in which the base member 310 and the light source 220 of the driving unit 300 are disposed on an upper surface of the heat dissipation member 400 having a flat surface.

Here, the insulating member 700 and the first heat dissipation pad 410 are disposed between the base member 310 and the heat dissipation member 400 of the driving unit 300, and the light source 220 is disposed between the heat dissipation member 400. 210 may be disposed.

As such, by disposing the light source 220 in various structures so as to be adjacent to an external heat sink (not shown), it is possible to improve heat dissipation performance and light efficiency.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

100 housing 110 reflector
200: light source module 210: substrate
220: light source 300: drive unit
310: base member 320: circuit element
400: heat dissipation member 410: first heat dissipation pad
420: second heat dissipation pad 430: third heat dissipation pad
500: optical member 600: top cover
700: insulating member 750 fastening screw

Claims

A housing comprising an upper opening and a lower opening;
An optical member disposed in an upper opening of the housing;
A radiation member disposed in the lower opening of the housing;
A light source disposed in the central region of the heat dissipation member;
A driver disposed in a peripheral area of the heat radiating member and electrically connected to the light source; And
A connector disposed in the peripheral region of the heat dissipation member and electrically connecting the driving unit and the light source;
The central region of the heat dissipation member has a first thickness, and the peripheral region of the heat dissipation member has a second thickness,
The first thickness and the second thickness are the same as each other,
The connector includes a ground pin for grounding the drive unit,
The driving unit,
A base member including a via hole in the central region; And
And a circuit element disposed on the base member to drive the light source.

The method of claim 1, wherein the peripheral region of the heat dissipation member surrounds the central region of the heat dissipation member,
And the central area and the peripheral area of the heat dissipation member are disposed on the same level.

The method of claim 2, wherein a boundary groove is disposed between the central region and the peripheral region of the heat dissipation member,
The ratio of the depth of the said boundary groove and the said 1st thickness is 0.001: 1-0.5: 1.

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Claim 5 was abandoned upon payment of a set-up fee.

The method of claim 1, wherein the peripheral region of the heat dissipation member surrounds the central region of the heat dissipation member,
And the central area and the peripheral area of the heat dissipation member are disposed on different planes.

Claim 6 has been abandoned upon payment of a setup registration fee.

The illuminating device according to claim 5, wherein a distance between the central region of the heat dissipation member and the optical member is closer than a distance between the peripheral region of the heat dissipation member and the optical member.

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Claim 8 has been abandoned upon payment of a set-up fee.

The illuminating device according to claim 5, wherein a distance between the central region of the heat dissipation member and the optical member is farther than a distance between the peripheral region of the heat dissipation member and the optical member.

Claim 9 was abandoned upon payment of a set-up fee.

The method of claim 6 or 8, wherein the interface between the central region and the peripheral region of the heat dissipation member is disposed,
And the boundary surface of the heat dissipation member is perpendicular to or inclined with respect to surfaces of the central region and the peripheral region of the heat dissipation member.

Claim 10 has been abandoned upon payment of a setup registration fee.

According to any one of claims 1, 2, 5, at least one fastening hole is disposed in the central region of the heat dissipation member,
The central region of the heat dissipation member is any one of a flat plane, a concave curved surface and a convex curved surface,
The light source is disposed on a substrate,
And the substrate is in direct contact with the heat dissipation member.

Claim 11 was abandoned upon payment of a set-up fee.

The method of claim 1, wherein at least one projection is disposed in a peripheral region of the heat dissipation member.
And the protrusion protrudes outward from an edge of the heat dissipation member.

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Claim 15 was abandoned upon payment of a set-up fee.

The method of claim 1, wherein the light source is disposed on a substrate,
The substrate is disposed away from the heat radiating member by a predetermined distance,
And a heat dissipation pad disposed between the substrate and the heat dissipation member.

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Claim 19 was abandoned upon payment of a set-up fee.

The lighting device of claim 1, wherein the base member is in direct contact with the heat dissipation member.

Claim 20 was abandoned when the set registration fee was paid.

The said base member is arrange | positioned at a predetermined space | distance from the said heat radiating member,
And an insulation member and a heat dissipation pad are disposed between the base member and the heat dissipation member.

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Claim 22 was abandoned upon payment of a set-up fee.

The method of claim 1, wherein the housing, the diameter of the upper opening is larger than the diameter of the lower opening,
And an inner surface of the housing is a reflecting surface that reflects light.

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Claim 24 was abandoned when the setup registration fee was paid.

According to claim 1, further comprising a reflector (reflector) disposed inside the housing,
The reflector includes a first opening facing the optical member and a second opening facing the light source,
The diameter of the first opening is greater than the diameter of the second opening.

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A housing comprising an upper opening and a lower opening;
An optical member disposed in an upper opening of the housing;
A radiation member disposed in the lower opening of the housing;
A light source disposed in the central region of the heat dissipation member;
A driver disposed in a peripheral area of the heat radiating member and electrically connected to the light source; And
A connector disposed in the peripheral region of the heat dissipation member and electrically connecting the driving unit and the light source;
The central region of the heat dissipation member has a first thickness, and the peripheral region of the heat dissipation member has a second thickness,
The first thickness is thinner than the second thickness,
The connector includes a ground pin for grounding the drive unit,
The driving unit,
A base member including a via hole in the central region; And
And a circuit element disposed on the base member to drive the light source.

Claim 27 was abandoned upon payment of a set-up fee.

27. The lighting device of claim 26, wherein the ratio of the first thickness to the second thickness is 0.99: 1-0.1: 1.

A housing comprising an upper opening and a lower opening;
An optical member disposed in an upper opening of the housing;
A radiation member disposed in the lower opening of the housing;
A recess disposed in a central region of the heat dissipation member;
A light source disposed in the recess;
A driver disposed in a peripheral area of the recess and electrically connected to the light source; And
A connector disposed in the peripheral region of the heat dissipation member and electrically connecting the driving unit and the light source;
The ratio of the maximum depth of the recess and the thickness of the heat dissipation member is 0.99: 1-0.1: 1,
The connector includes a ground pin for grounding the drive unit,
The driving unit,
A base member including a via hole in the central region; And
And a circuit element disposed on the base member to drive the light source.

A housing comprising an upper opening and a lower opening;
An optical member disposed in an upper opening of the housing;
A radiation member disposed in the lower opening of the housing;
A light source disposed in the central region of the heat dissipation member;
A driver disposed in a peripheral area of the heat radiating member and electrically connected to the light source; And
A connector disposed in the peripheral region of the heat dissipation member and electrically connecting the driving unit and the light source;
The connector includes a ground pin for grounding the drive unit,
The driving unit,
A base member including a through hole exposing a light source disposed in the central region of the heat dissipation member; And
A circuit element disposed on the base member to drive the light source;
The ratio of the area of the said through-hole of the said drive part and the total area of the said heat radiating member is 0.4: 1-0.8: 1.

A housing comprising an upper opening and a lower opening;
An optical member disposed in an upper opening of the housing;
A radiation member disposed in the lower opening of the housing;
A light source disposed in the central region of the heat dissipation member;
A driver disposed in a peripheral area of the heat radiating member and electrically connected to the light source; And
A connector disposed in the peripheral region of the heat dissipation member and electrically connecting the driving unit and the light source;
The connector includes a ground pin for grounding the drive unit,
The driving unit,
A base member including a via hole in the central region,
A circuit element disposed on the base member to drive the light source;
And a distance between the optical member and the base member is closer than a distance between the optical member and the light source.