KR101980497B1 - Imprint apparatus, imprint method and manufacturing method of article - Google Patents

Imprint apparatus, imprint method and manufacturing method of article Download PDF

Info

Publication number
KR101980497B1
KR101980497B1 KR1020187008576A KR20187008576A KR101980497B1 KR 101980497 B1 KR101980497 B1 KR 101980497B1 KR 1020187008576 A KR1020187008576 A KR 1020187008576A KR 20187008576 A KR20187008576 A KR 20187008576A KR 101980497 B1 KR101980497 B1 KR 101980497B1
Authority
KR
South Korea
Prior art keywords
mold
imprint material
unit
substrate
imprint
Prior art date
Application number
KR1020187008576A
Other languages
Korean (ko)
Other versions
KR20180044391A (en
Inventor
요오스케 곤도
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20180044391A publication Critical patent/KR20180044391A/en
Application granted granted Critical
Publication of KR101980497B1 publication Critical patent/KR101980497B1/en

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)

Abstract

Thereby suppressing deterioration of throughput associated with foreign matter detection. The present invention relates to an imprint apparatus 100 configured to form a pattern of an imprint material 114 on a substrate 103 using a mold 102. [ The imprint apparatus 100 is provided with an image pickup unit 119 configured to pick up an image of an imprint material 114 and a foreign substance 503a existing between the mounting unit 106 on which the substrate 103 is mounted and the substrate 103 (120). The detection unit 120 detects the first imaging result captured by the imaging unit 119 before the mold 102 is separated from the imprint material 114 with which the mold 102 is contacted, The foreign matter 503a is detected on the basis of the second image pickup result picked up by the image pickup unit 119 after the mold 102 is separated from the imprint material 114. [

Description

Imprint apparatus, imprint method and manufacturing method of article

The present invention relates to an imprint apparatus, an imprint method, and a method of manufacturing an article.

BACKGROUND ART [0002] Imprint technology is known as a method for forming fine patterns on a substrate for manufacturing semiconductor devices and the like. In the imprint technique, a mold having a concave portion and a convex pattern formed portion (hereinafter, referred to as a pattern portion) is brought into contact with an imprint material to form a transfer pattern of the mold on the substrate.

When foreign matter is placed between the mounting unit on which the substrate is mounted and the substrate, the substrate is locally protruded. If a pattern is formed in this state, a pattern defect may occur or a pattern portion may be damaged.

Patent Document 1 discloses a lithographic apparatus including a detection device capable of detecting foreign matter on a mounting unit before the substrate is mounted on the mounting unit. The detection device has an optical flat in contact with the mounting unit, a laser light source for irradiating the optical flat and the mounting unit with laser light, and a monitor and an image processing device. The detection apparatus detects foreign matter on the mount unit by analyzing the image pickup result of the interference fringes captured on the optical flat using the image processing apparatus.

Japanese Patent Laid-Open No. 10-70069

The foreign substance detecting device disclosed in Patent Document 1 performs foreign substance detection before the substrate is mounted on the mounting unit. As a result, the step of bringing the optical flat and the substrate into contact with each other is carried out separately, and the throughput of the process involving the foreign matter detection including the inspection step and the processing step executed on the inspected substrate may be reduced. Accordingly, one aspect of the present invention provides an imprint apparatus and an imprint method capable of suppressing deterioration of throughput associated with foreign matter detection. An exemplary embodiment according to one aspect of the present invention provides an imprint apparatus configured to form a pattern of an imprint material on a substrate using a mold. The imprint apparatus includes an imaging unit configured to image an imprint material, and a detection unit configured to detect foreign matter existing between the substrate and a mounting unit on which the substrate is mounted. The detection unit detects the first imaging result captured by the imaging unit before the mold is detached from the imprint material with which the mold is in contact and the second imaging result detected by the imaging unit after the mold is detached from the imprint material with which the mold is in contact. And is configured to detect foreign matter based on the imaging result.

Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings.

1A shows driving of an imprint apparatus according to an exemplary embodiment.
Fig. 1B shows a configuration of a rectangular mold and a mold stage.
2A is a front view showing a structure of a mold.
Fig. 2B shows the mold seen in the + Z direction.
3 is a flow chart illustrating an imprint method according to an exemplary embodiment.
4A is a schematic view showing a state in which the mold and the imprint material are in contact with each other.
4B shows an image showing the result obtained by picking up the imprint material before the mold is separated.
4C shows an image showing the result obtained by picking up the imprint material after the mold is separated.
5 is a schematic view showing a state after the mold is separated from the imprint material.
6 is a flowchart showing a method of detecting a foreign object according to an exemplary embodiment.
Figure 7 shows the difference between the images taken before and after the mold was detached.
8 is a view for explaining a layout imprint.

[First Exemplary Embodiment]

[Device Configuration]

1A shows a configuration of an imprint apparatus 100 according to the present exemplary embodiment. 1A, the Z axis (vertical direction in the present exemplary embodiment) is parallel to the optical axis of the ultraviolet radiation 104 emitted by the light source 101, transmitted through the mold 102, and incident on the substrate 103 Corresponds to one axis. The X and Y axes are two axes perpendicular to each other within a plane perpendicular to the Z axis.

The substrate stage (moving body) 105 includes a substrate holding unit (mounting unit) 106 for holding a substrate 103. The substrate holding unit 106 is connected to a vacuum pump (not shown), and by controlling the vacuum pump, the force by which the substrate holding unit 106 holds the substrate 103 is controlled. On the substrate stage 105, a mark mount 107 on which a reference mark is formed is provided at a position apart from the substrate 103.

Fig. 1B shows the configuration of the mold 102 and the mold stage 108, which are rectangular. The mold stage 108 has a mold 102 and a driving mechanism 125 for moving the mold holding unit 110 holding the mold 102 in the Z axis direction.

The pressing operation (contact operation) of the mold 102 with respect to the uncured imprint material (imprint material) 114 (shown in Fig. 1A) and the pressing operation The operation of separating the mold 102 is performed. At the center of the mold stage 108, a cylindrical space 109 is formed. The mold holding unit 110 sucks and holds the mold 102 by a vacuum attraction force.

In the imprint material 114, a curable composition (also referred to as uncured resin) which is cured as energy for curing is provided is used. The energy for curing may be provided in the form of electromagnetic waves, radiation, heat, or the like. The electromagnetic wave may be, for example, infrared radiation, visible light, ultraviolet radiation, etc., selected from radiation having a wavelength of 10 nm or more and 1 mm or less, or may be electromagnetic radiation such as X-ray or gamma ray. The radiation may be particle radiation, such as an electron beam.

The curable composition is a composition that is cured by irradiation with light or radiation or is cured by heating. Among these compositions, the photo-curable composition that is cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may optionally contain a non-polymerizable compound or a solvent. The non-polymer compound is at least one member selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component and the like.

The polymerizable compound is a compound which reacts with a polymerization factor (for example, a radical) generated from a photopolymerization initiator and forms a solid comprising a macromolecular compound by a chain reaction (polymerization reaction). For example, the polymerizable compound is a compound having at least one acryloyl group or methacryloyl group, that is, a (meth) acrylic compound. The photopolymerization initiator is a compound which generates polymerization factors by light reception, and is, for example, a radical generator such as an acylphosphine oxide compound.

The imprint material 114 is applied in a film form on the substrate 103 by a spin coater or a slit coater. Alternatively, the imprint material 114 may be applied to the substrate 103 in the form of droplets, or islands or films in which a plurality of droplets are connected, by the liquid ejection head. The viscosity (viscosity at 25 캜) of the imprint material 114 is, for example, 1 mPa * S or more and 100 mPa * S or less.

The contact operation and the separation operation of the imprint material 114 and the mold 102 can be performed by moving only the substrate stage 105 or by moving the mold stage 108 and the substrate stage 105 in combination.

The pressure control unit 112 controls the pressure in the space 113 by feeding and discharging the gas through the pipe 111. The space 113 is a space enclosed by the glass plate 126 and the recessed portion 102b of the mold 102. [ The pressure in the space 113 is raised by the pressure control unit 112 to be higher than the air pressure in the imprint apparatus 100 so that the pattern unit (pattern forming unit) 102a described later is projected toward the substrate 103 . The substrate holding unit 106 and the mold holding unit 110 can hold each holding object by using the electrostatic force instead of using the vacuum attraction force.

The mold 102 includes a rectangular pattern portion 102a provided at its center portion, and concave and convex patterns are formed in the pattern portion 102a. The recess 102b is formed on the surface of the mold 102 opposite to the surface on which the pattern portion 102a is formed and the recess 102b has a cross sectional area larger than that of the pattern portion 102a . The recessed portion 102b has a depth of approximately 1 mm.

2A is a front view of the mold 102, and Fig. 2B shows the mold 102 seen in the + Z direction. The pattern portion 102a is a portion where a pattern to be transferred is formed. The pattern portion 102a has a base portion 201, a concave portion 202, and a convex portion 203. The base 201 has a thickness (length in the Z-axis direction) of about 30 mu m. With respect to the size of the concave and convex patterns, for example, the depth from the concave portion 202 to the top of the convex portion 203 is in the range of several tens nanometers to several hundred nanometers, and the concave portion 202 and the convex portion 203 ) Is in the range of about several nanometers to several tens of nanometers.

At the four corners of the pattern portion 102a, marks 204 used for measuring the position and size of the pattern portion 102a are provided. The mark 204 is detected by the detection unit 115 described later.

When the imprint material 114 used in the imprint is photocurable, a material capable of transmitting the ultraviolet radiation 104 for curing is used as the material of the mold 102. Examples of such a material include glass such as silica glass, silicate glass, calcium fluoride, magnesium fluoride, or acrylic glass; Sapphire; Gallium nitride; Polycarbonate; polystyrene; acryl; And polypropylene. Alternatively, a multilayer member made of any of the above materials may be used. Also, the material for the mold 102 is selected so that the refractive index of the mold 102 is substantially equal to the refractive index of the imprint material 114.

1A and 1B, the detection unit 116 detects an alignment mark (not shown) provided on the substrate 103 and a reference mark whose position with respect to the substrate stage 105 is known. Based on the detection result, the control unit 120 obtains the position of the substrate 103 with respect to the substrate stage 105. The control unit 120 also obtains the shape, positional deviation, and the like of the pattern area 117 of the base pattern provided on the substrate 103.

The detection unit 115 detects a mark 204 (details will be described later) provided in the mold 102 and an alignment mark. The detection unit 115 detects the position of the pattern area 117 between the pattern area 117a and the pattern area 102a to be pattern formation on the substrate 103 based on the moire signal (interference fringe) generated by the mark 204 and the alignment mark The positional deviation and the shape difference of the positional deviation.

The detection unit 115 has a plurality of scopes. A plurality of alignment marks are provided for each pattern region 117, and a plurality of marks 204 are provided in the pattern portion 102a. Each scope detects a pair of alignment marks and marks 204. For example, the detection unit 115 measures marks of four corners of the pattern area 117 simultaneously. The moiré signal can be detected without a high-precision optical system. As a result, the detection unit 115 is constituted by a plurality of scopes having a low resolution (NA).

The application unit 118 supplies the uncured photocurable imprint material 114 to the pattern area 117. [

The image pickup unit 119 is configured so that after the transfer pattern of the pattern portion 102a is formed in the pattern portion 117 from the time when the mold stage 108 starts to descend the mold 102, The image of the imprint material 114 is picked up during the period up to the rising edge.

The image pickup unit 119 has a light source 119a and an image pickup element 119b formed by light emitting diodes (LEDs), and picks up the imprint material 114 from the side where the recess portion 102b of the mold 102 is formed do. Specifically, the image pickup unit 119 picks up the imprint material 114 using the light transmitted through the mold 102 and reflected by the substrate 103. The light source 119a emits light having a wavelength range different from that of the ultraviolet radiation 104 and having a wavelength (for example, approximately 400 nm to 500 nm) at which the imprint material 114 is not sensitized. The image pickup element 119b is constituted by a charge coupled device (CCD) sensor. The imaging visual field of the imaging element 119b is slightly larger than the area of the pattern portion 102a.

When the pattern portion 102a is brought into contact with the imprint material 114, interference fringes are observed around the portion where the imprint material 114 and the pattern portion 102a make contact with each other. By observing changes in the interference fringe, it is possible to determine the completion of the charging step (contact step). In the filling step, an area where the imprint material 114 and the pattern unit 102a are in contact with each other extends in parallel to the substrate 103, and the imprint material 114 is applied to the concave part 202 of the pattern unit 102a And is charged.

The refractive indices of the imprint material 114 and the mold 102 are substantially equal to each other so that the concave portions 202 are filled with the imprint material 114 and substantially the same number of gradations (pixel information) Is observed. The number of gradations is a value representing the density of the color in the gray scale image. The term " substantially the same number of gradations " means that, for example, when the number of gradations of each pixel of a gray scale image is binarized, the resultant number of gradations is the same. When foreign substances are present on the surface of the substrate 103 facing the workpiece surface (the surface facing the mold 102) and the surface opposite to the surface to be treated (surface facing the substrate holding unit 106), interference fringes An image is observed.

The image pickup result picked up by the image pickup unit 119 is stored in the storage unit 121 by the control unit 120. The imaging results stored in the storage unit 121 include still images at respective individual moments.

The control unit (detection unit, calculation means) 120 includes a light source 101, a mold stage 108, a detection unit 116, a coating unit 118, an image pickup unit 119, a storage unit 121, And is connected to the cleaning unit 122. The control unit 120 controls these units to form a transfer pattern of the mold 102 over the substrate 103 and detects foreign matter existing on the front surface or the back surface of the substrate 103. [

The storage unit 121 stores the program shown in the flowcharts shown in Figs. 3 and 6. The control unit 120 reads a program stored in the storage unit 121 and controls a unit connected to the control unit 120 to execute the program.

The cleaning unit 122 is controlled by the control unit 120 and cleans the substrate holding unit 106 based on the detection result of the foreign substance 503a described later. The cleaning unit 122 has a plate 124 having a polishing surface and a plate holding unit 123 for holding the plate 124. The cleaning unit 122 can be moved in the Z axis direction by being controlled by the control unit 120 have. The plate 124 is brought into contact with the surface of the substrate holding unit 106 while the substrate 103 is removed and the plate 124 and the substrate holding unit 106 are moved with respect to each other in the XY plane. Through this operation, the surface of the substrate holding unit 106 is cleaned, and the foreign substance 503a rubs off.

[Method of detecting foreign matter]

The imprint apparatus 100 is an apparatus for obtaining an image of the imprint material 114 (first imaging result) obtained in a state where the pattern unit 102a and the imprint material 114 are in contact with each other, The foreign substance is detected by comparing the image (second image pickup result) of the imprint material 114 obtained while the pattern unit 102a is separated.

A foreign matter detection method performed in the pattern formation step on one pattern area 117 will be described with reference to the flowchart shown in Fig.

By moving the substrate stage 105, the pattern region 117 is positioned below the application unit 118. [ The coating unit 118 applies an uncured imprint material 114 to the pattern area 117 (S101).

By the movement of the substrate stage 105, the pattern region 117 is positioned below the mold holding unit 110. The mold stage 108 lowers the mold 102 and the mold holding unit 110. When the mold 102 and the mold holding unit 110 are lowered, the pressure control unit 112 feeds gas into the space 113. The pressure in the space 113 becomes higher than the pressure in the space in which the imprint apparatus 100 is disposed so that the pattern portion 102a is deformed so as to project toward the lower side (the side facing the substrate 103). The amount of movement of the mold 102 and the mold holding unit 110 at the time of descent is determined based on the distance between the pattern unit 102a and the substrate 103 previously measured by the measuring unit (not shown).

When the pattern portion 102a is deformed, the central portion of the pattern portion 102a comes into contact with the imprint material 114 (S102). After the pattern unit 102a contacts the imprint material 114, the pressure control unit 112 discharges the gas from the space 113 and supplies the pressure in the space 113 to the imprint apparatus 100 Slowly approach pressure. The imprint material 114 is filled in the concave portion 202 from the central portion of the pattern portion 102a toward the end portion and the region where the pattern portion 102a and the imprint material 114 are in contact with each other gradually increases (S103).

The light source 101 irradiates the imprint material 114 with ultraviolet radiation 104 after the concave portion 202 is filled with the imprint material 114 (after the imprint material 114 and the mold 102 are in contact with each other) And the imprint material 114 is cured (S104). The timing of completion of the charging is determined by the control unit 120 based on the imaging result captured by the imaging unit 119. [ Alternatively, a predetermined time may be preset.

As described above, the image pickup unit 119 forms the transfer pattern of the pattern portion 102a in the pattern region 117 from the time when the mold stage 108 starts to descend the mold 102, 102 are lifted up to their original positions.

After S102, an image associated with foreign matters 501a and 502a on the substrate 103 is picked up. The image pickup unit 119 acquires an image after the imprint material 114 is cured and before the step of separating the mold 102 from the imprint material 114 (separation step) is started, and the control unit 120 Stores the imaging result in the storage unit 121 (S105).

The mold stage 108 raises the mold 102 and the mold holding unit 110 in the + Z direction in the mold separating step S106. While the mold 102 and the mold holding unit 110 are lifted up, the pressure control unit 112 feeds the gas into the space 113, and the region where the pattern portion 102a and the imprint material 114 contact each other The mold separating step is terminated. Even if the imprint material 114 is partially attached to the pattern portion 102a, this attachment portion is ignored.

Even after the mold separation step, the image pickup unit 119 picks up the imprint material 114. The control unit 120 stores the imaging result captured by the imaging element 119b in the storage unit 121 after the mold separation step is completed (after the separation operation is completed) (S107). The image pickup result stored in the storage unit 121 in S105 is referred to as an image 504 (shown in FIG. 4B) and the image pickup result stored in the storage unit 121 in S107 is referred to as an image 505 (shown in FIG. The image 504 and the image 505 are expressed in gray scale.

The control unit 120 determines whether or not the image pickup element 119b has detected the foreign substance 503a between the substrate holding unit 106 and the substrate 103 based on the image 504 and the image 505 (S108). If it is determined that there is no foreign substance 503a (no foreign substance 503a is detected), steps S101 to S108 are repeated for the next pattern area 117. [ If it is determined that the foreign substance 503a is present (the foreign substance 503a is detected), the control unit 120 calculates foreign substance information (S109). The foreign substance information is information on the position and size of the foreign substance 503a.

When the foreign substance 503a is detected, the substrate holding unit 106 is carried to the cleaning unit 122, and the substrate side surface of the substrate holding unit 106 is cleaned (S110). At this time, the cleaning unit 122 performs cleaning based on the foreign substance information acquired in S109 received from the control unit 120. [ The imprint apparatus 100 resumes the process of forming a pattern on the substrate 103 after cleaning.

The control unit 120 notifies the user of an error when a predetermined number of foreign substances 503a is detected or a predetermined area occupied by the foreign matter 503a is detected. The cleaning unit 122 can clean the substrate holding unit 106 when an error is notified to the user or when a cleaning instruction issued by the user who has been notified of the error is received. Alternatively, instead of carrying out the cleaning, the process of forming the pattern on the substrate 103 when the foreign substance 503a is detected can be finished.

An image 504, an image 505, and a method for acquiring foreign substance information will be described.

4A is a schematic view showing a state in which the mold 102 and the imprint material 114 are in contact with each other. 4A shows a state in which foreign substances 501a and 502a are present on the substrate 103 and a foreign substance 503a is present between the substrate holding unit 106 and the substrate 103. Fig. The molds 102 and the imprint material 114 can not be in partial contact with each other due to the foreign matter 501a and 502a and therefore the gaps 301 and 302 are present. Here, the thickness of the imprint material 114 is, for example, about 50 占 퐉, and the sizes of the impurities 501a, 502a, and 503a are several micrometers to several tens of micrometers or less.

Figs. 4B and 4C show images acquired by the image pickup unit 119. Fig.

4B shows an image 504 showing the result obtained by picking up the imprint material 114 before the mold 102 is separated (before separation). The rectangle 401 corresponds to the outer periphery of the pattern portion 102a and represents the boundary between the pattern portion 102a and the space surrounding the pattern portion 102a. Inside the rectangle 401, images of the regions 501b and 502b are shown.

The pattern portion 102a is deformed so as to project in the out-of-plane direction (Z-axis direction) about the point where the pattern portion 102a contacts the foreign matter 501a, 502a. The gap 301 is a space formed between the pattern portion 102a and the imprint material 114 due to the foreign substance 501a. The gap 302 is a space formed between the pattern portion 102a and the imprint material 114 due to the foreign substance 502a. Since the refractive indexes of the gas existing in the gaps 301 and 302 differ from the refractive indices of the mold 102 and the imprint material 114, an image of the regions 501b and 502b appears.

The substrate 103 gently protrudes about the point where the substrate 103 contacts the foreign substance 503a. Due to the rigidity of the substrate 103, the deformed region of the substrate 103 is widely diffused in the out-of-plane direction and is inclined gently. Since the substrate 103 is deformed in this manner, a gap is hard to be generated between the pattern portion 102a and the imprint material 114, so that an image associated with the foreign matter 503a is not picked up.

4C shows an image 505 showing the result obtained by picking up the imprint material 114 after the mold 102 has been separated (after separation). In the image 505, an image of the area 501b appears at substantially the same position as the image of the area 501c, and an image of the area 502c appears at substantially the same position as the image of the area 502b. Also, an image of the area 503c appears.

The phases of the regions 501c and 502c have substantially the same number of tones as the phases of the regions 501b and 502b. The film thickness of the imprint material 114 in the region where the foreign substances 501a and 502a are present is less uniform than the film thickness of the imprint material 114 in the region where the foreign substances 501a and 502a are not present The variation of the film thickness is large). This difference in film thickness of the imprint material 114 causes a difference in the interference action of light, and therefore, an image of the regions 501c and 502c appears.

5, the thickness of the imprint material 114 in the region 307 above the foreign substance 503a due to the foreign substance 503a is larger than the thickness of the imprint material 114 in the other region 308 Thickness. The difference in the thickness causes a difference in the interference action of light, so that an image of the region 503c appears.

The shape (thickness distribution) of the imprint material 114 retained after the mold 102 is separated is the same as the shape of the imprint material 114 held before the mold 102 is separated, No image associated with the shape of the imprint material 114 is observed.

The refractive index of the mold 102 is substantially equal to the refractive index of the imprint material 114 and light is hardly reflected at the boundary between the mold 102 and the imprint material 114. [ The total thickness of the mold 102 and the imprint material 114 is substantially equal to the thickness of the mold 102 since the mold 102 is sufficiently thicker than the imprint material 114. [ Therefore, there is almost no interference which occurs in association with the difference in the minute thickness of the imprint material 114, and interference fringes are hardly observed by the image pickup unit 119.

On the other hand, after the mold 102 is separated, a gas 309 having a refractive index different from that of the mold 102 and the imprint material 114 exists between the mold 102 and the imprint material 114. Since the light is reflected at the boundary between the base 309 and the imprint material 114, unlike the case before the mold 102 is separated, in association with the thickness distribution of the imprint material 114, An interference fringe that does not appear in the obtained image is displayed.

6 is a flowchart showing a method of acquiring foreign substance information such as the presence of a foreign substance 503a and the position and size of a foreign substance 503a using the image 504 and the image 505. FIG.

The control unit 120 reads the image 504 and the image 505 stored in the storage unit 121 (S201). The control unit 120 subtracts the pixel information of the image 504 from the pixel information of the image 505 (S202). More specifically, the control unit 120 subtracts the number of gradations of the pixels of the image 504 corresponding to each pixel of the image 505 from the number of gradations of the pixels of the image 505. [ The control unit 120 binarizes the image obtained by the subtraction.

7 shows the image 506 obtained in S202 and the image 506 is obtained after the mold 102 is separated from the pixel information of the image of the imprint material 114 obtained before the mold 102 is separated The difference between the pixel information of the image of the imprint material 114 is shown. The image of the rectangle 401 common to the image 504 and the image 505 disappears and only the image of the area 503c is left through binarization.

Subsequently, the control unit 120 continuously compares the values of the adjacent pixels, and extracts a boundary in which a pixel having a value equal to or smaller than a predetermined threshold value is adjacent to a pixel having a value equal to or larger than the threshold value. The boundary extracted here coincides with the outline of the area 503c indicating the outline of the foreign substance 503a. In the present exemplary embodiment, since the binarization processing has been performed, the boundary where the value is changed from the low value to the high value corresponds to the contour of the foreign substance 503a.

The control unit 120 obtains the position of the apex of the pattern portion 102a (the position of the formed pattern) with respect to the imaging visual field of the imaging element 119b (S203). Here, the control unit 120 extracts the positions of the four vertices of the rectangle 401 in the image 504 and the positions of the four vertices of the rectangle 401 in the image 505, Find the average value of the position.

The control unit 120 groups the pixels included in the closed boundary line together and identifies one group as one foreign substance (S204). Based on the result obtained in S204, the control unit 120 determines whether or not the foreign substance 503a has been detected, that is, whether or not the foreign substance 503a is present.

The control unit 120 obtains the center of gravity position of the foreign substance 503a by calculating the center of gravity position of the area 503c (S205). The position of the center of gravity obtained in S205 is the position of the foreign matter 503a relative to the imaging visual field of the imaging element 119b. When a plurality of foreign substances 503a are detected in S204, the position of the center of gravity is obtained in the same manner.

The control unit 120 calculates the position of the center of gravity of the foreign substance 503a with respect to the pattern unit 102a using the results obtained in S204 and S205 (S206). Similarly, the control unit 120 obtains the position of the foreign matter 503a in the XY coordinate system with one of the four vertexes of the pattern unit 102a obtained in S203 as the origin.

Subsequently, the control unit 120 obtains the position of the foreign substance 503a with respect to the substrate stage 105 (S207).

The position of the substrate 103 with respect to the substrate stage 105, the position of the pattern region 117 with respect to the substrate 103, and the position of the pattern portion 117 with respect to the pattern region 117 by using the detection units 115, 102a are known.

The position of the foreign substance 503a with respect to the substrate stage 105 can be obtained by using the known information described above and the position of the center of gravity of the foreign substance 503a with respect to the pattern unit 102a obtained in S206. The method of detecting the foreign substance 503a and the method of obtaining the foreign substance information of the foreign substance 503a have been described above.

In the imprint apparatus 100 according to the present exemplary embodiment, an image pickup result obtained before the mold 102 is detached from the imprint material 114 is used to form a gap between the substrate holding unit 106 and the substrate 103 It is possible to detect an existing foreign substance 503a. It is possible to detect the foreign substance 503a concurrently with the pattern formation process. Therefore, it is possible to suppress a decrease in throughput as compared with the case where the present exemplary embodiment is not applied.

Particularly, the method of detecting the foreign substance 503a according to the present exemplary embodiment is advantageous in that even when the step of detecting the foreign substance 503a is performed each time the substrate mounted on the substrate stage 105 is exchanged, Is excellent. The above method is also effective when the foreign substances 501a and 502a on the surface of the substrate 103 are distinguished from the foreign substance 503a on the back surface of the substrate 103 even after the substrate 103 is mounted on the substrate holding unit 106 It is excellent in that it can do.

When a plurality of foreign substances 503a are detected in S204, the processes in steps S205 to S207 are repeated in the same number as the number of foreign substances 503a. Alternatively, after the processing of S205 to S207 is completed once, the processing of S205 to S207 may be repeated for another foreign substance 503a.

The control unit 120 can determine that a defect has occurred at the time when the region 501b or 502b appeared relative to the foreign matter 501a or 502a before detaching the mold 102 from the substrate 103, Can be terminated. Alternatively, the control unit 120 can determine the size of the foreign substance on the surface of the substrate 103 or the number of foreign substances, and can determine whether to continue the imprint processing based on the obtained result.

[Other exemplary embodiments]

As described so far, the step of picking up an image before the mold 102 is separated is preferably carried out after the imprint material 114 is cured. Even if the intensity of light incident on the imaging element 119b changes due to a change in the optical characteristic of the imprint material 114 before and after the imprint material 114 is cured, It is possible to keep the pixel values of the regions where the foreign substances 501, 502a, and 503a do not exist in the image. Therefore, it becomes easier to compare the image 504 and the image 505. [

The imprint apparatus 100 performs the imprint processing using a mold 802 (shown in Fig. 8) having a pattern portion 801 capable of forming a pattern in a plurality of pattern regions 117 through one imprint processing Or the like. The image of the imprint material 114 is picked up by the image pickup field of view substantially identical to the area of the image pickup unit 119 which is subjected to the imprint processing at one time so that in the above described exemplary embodiment, And the substrate holding unit 106. The substrate holding unit 106 is provided with a substrate holding unit 106,

It is sufficient that the cleaning unit 122 is capable of cleaning at least one of the substrate holding unit 106 and the back surface of the substrate 103. Further, the cleaning unit 122 does not need to perform cleaning based on the foreign substance information. In this case, when the foreign substance 503a is detected, the cleaning unit 122 can clean the whole area to be cleaned. The foreign substance information may be at least one of the position and the size of the foreign substance 503a.

Although the control unit 120 shows an example having both the function of the detection unit for detecting the foreign matter 503a and the function of the calculation unit for obtaining the foreign substance information, these functions can be provided individually on the separate control boards have. The imprint apparatus 100 may be an imprint apparatus 100 employing a thermosetting technique instead of the photo-curing technique. Further, the imprint material according to the exemplary embodiment of the present invention is an imprint material that is cured or thermally cured by various kinds of electromagnetic radiation including light. The imprint material is selected in accordance with the curing technique employed in the imprint apparatus 100. [

In this specification, the term " hardening " means that the intermolecular bonding of at least a part of the molecules constituting the imprint material 114 is changed.

In this specification, the term " foreign substance " refers to a substance which is not intended to contribute to pattern formation. For example, the foreign matter may be removed from the dried solid from the imprint material 114 discharged from the coating unit 118 and floating in the form of mist, fine particles generated from the members constituting the imprint apparatus 100, And may be dust or the like present in the imprint apparatus 100.

[Manufacturing method of articles]

The cured patterns formed using the imprint apparatus are used temporarily, at least in part, of various articles or permanently when various articles are manufactured. The article may be an electric circuit element, an optical element, a microelectromechanical sensor (MEMS), a recording element, a sensor, a mold, or the like. The electrical circuitry may be a volatile or nonvolatile semiconductor memory such as dynamic random-access memory (DRAM), static random-access memory (SRAM), flash memory, or magnetoresistive random-access memory (MRAM); A semiconductor device such as a large scale integration (LSI), a CCD, an image sensor, or a field-programmable gate array (FPGA). The optical element may be a microlens, a light guide, a waveguide, an antireflection film, a diffraction grating, a polarizing element, a color filter, a light emitting element, a display, a solar cell, or the like. The MEMS may be a DMD (digital micromirror device), a microchannel, an electromechanical transducer, or the like. The recording element may be an optical disk such as a CD (compact disc) or a DVD (digital versatile disc), a magnetic disk, a magneto-optical disk, a magnetic head, or the like. The sensor may be a magnetic sensor, a light sensor, a gyro sensor, or the like. The mold may be a mold for imprinting or the like.

The cured pattern is used intact as a component of at least a part of the article, or temporarily used as a resist mask. The resist mask is removed after etching or ion implantation is performed in the substrate processing step in manufacturing the article.

Although the exemplary embodiments of the present invention have been described above, the present invention is not limited to these exemplary embodiments, and various modifications and changes may be made within the scope of the present invention.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

This application claims priority from Japanese Patent Application No. 2015-174407, filed September 4, 2015, the disclosure of which is incorporated herein by reference in its entirety.

Claims (11)

An imprint apparatus configured to form a pattern of an imprint material on a substrate using a mold,
An imaging unit configured to image the imprint material; And
And a detection unit configured to detect foreign matter existing between the mounting unit on which the substrate is mounted and the substrate,
Wherein the detection unit is configured to detect a first imaging result captured by the imaging unit before the mold is separated from the imprint material with which the mold is contacted and a second imaging result obtained after the mold is detached from the imprint material with which the mold is contacted, And to detect the foreign matter on the basis of a second imaging result taken by the unit. The method according to claim 1,
Wherein the imaging unit is configured to image the imprint material using light transmitted through the mold. 3. The method according to claim 1 or 2,
Wherein the detection unit is configured to detect the foreign matter based on the difference between the pixel information of the image as the first image pickup result and the pixel information of the image as the second image pickup result. 3. The method according to claim 1 or 2,
Further comprising a calculation unit configured to calculate at least one of a position and a size of a foreign object detected by the detection unit using the second image pickup result. 5. The method of claim 4,
Wherein the calculation unit is configured to obtain the position of the foreign matter with respect to the moving body moving in a state in which the mounting unit is mounted based on the position of the pattern forming portion of the mold with respect to the imaging visual field. 3. The method according to claim 1 or 2,
Further comprising a cleaning unit configured to clean the mount unit,
Wherein the cleaning unit is configured to clean the mount unit when the detection unit detects the foreign matter. 3. The method according to claim 1 or 2,
Wherein the first imaging result is imaged after the imprint material and the mold are in contact with each other and before the operation of separating the mold from the imprint material is started and the second imaging result separates the mold from the imprint material And is imaged after the operation is completed. 3. The method according to claim 1 or 2,
Wherein the first imaging result is imaged after the imprint material is cured and before an operation of separating the mold from the imprint material is started. An imprint method for forming a pattern of an imprint material on a substrate using a mold,
Contacting the imprint material and the mold with each other;
Separating the mold from the imprint material after the contacting step; And
On the basis of the first imaging result of the imprint material after the contacting step and before the separating step and the second imaging result of the imprint material picked up after the separating step, And detecting a foreign substance existing between the impurities. 10. The method of claim 9,
And cleaning at least one of the mounting unit and the substrate when the foreign matter is detected in the detecting step. A method of manufacturing an article,
Forming a pattern of the imprint material on the substrate using the imprint apparatus according to claim 1 or 2; And
And processing the substrate on which the pattern is formed in the forming step.
KR1020187008576A 2015-09-04 2016-08-03 Imprint apparatus, imprint method and manufacturing method of article KR101980497B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2015-174407 2015-09-04
JP2015174407A JP6541518B2 (en) 2015-09-04 2015-09-04 Imprint apparatus, imprint method, and article manufacturing method
PCT/JP2016/003579 WO2017038007A1 (en) 2015-09-04 2016-08-03 Imprint apparatus, imprint method, and method of manufacturing article

Publications (2)

Publication Number Publication Date
KR20180044391A KR20180044391A (en) 2018-05-02
KR101980497B1 true KR101980497B1 (en) 2019-05-20

Family

ID=58186870

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187008576A KR101980497B1 (en) 2015-09-04 2016-08-03 Imprint apparatus, imprint method and manufacturing method of article

Country Status (3)

Country Link
JP (1) JP6541518B2 (en)
KR (1) KR101980497B1 (en)
WO (1) WO2017038007A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6887279B2 (en) * 2017-03-24 2021-06-16 キヤノン株式会社 Imprint equipment and article manufacturing method
JP7043199B2 (en) * 2017-08-03 2022-03-29 キヤノン株式会社 Imprint method, program, imprint device and manufacturing method of goods

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009212382A (en) 2008-03-05 2009-09-17 Hitachi High-Technologies Corp Proximity exposure device, substrate moving method of proximity exposure device and method of manufacturing displaying panel substrate
JP2010149469A (en) 2008-12-26 2010-07-08 Showa Denko Kk Imprinting device and method of detecting contamination of mold
US20150076724A1 (en) 2013-09-13 2015-03-19 Canon Kabushiki Kaisha Imprint apparatus, imprint method, detecting method, and method of manufacturing device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1070069A (en) * 1996-08-28 1998-03-10 Canon Inc Dust detecting system for semiconductor aligner
JP5173944B2 (en) * 2009-06-16 2013-04-03 キヤノン株式会社 Imprint apparatus and article manufacturing method
US11133118B2 (en) * 2012-05-22 2021-09-28 University Of Massachusetts Patterned nanoparticle structures
JP2014103385A (en) * 2012-10-26 2014-06-05 Canon Inc Detection device, lithography device, and manufacturing method and detection method of goods
JP6331292B2 (en) * 2013-08-30 2018-05-30 大日本印刷株式会社 Imprint method and imprint apparatus
JP6313585B2 (en) * 2013-12-10 2018-04-18 キヤノン株式会社 Exposure apparatus and article manufacturing method
JP2016025230A (en) * 2014-07-22 2016-02-08 キヤノン株式会社 Imprint method, imprint device and manufacturing method of article
US10747106B2 (en) * 2014-12-09 2020-08-18 Canon Kabushiki Kaisha Imprint apparatus
JP6674218B2 (en) * 2014-12-09 2020-04-01 キヤノン株式会社 Imprint apparatus, imprint method, and article manufacturing method
JP6403627B2 (en) * 2015-04-14 2018-10-10 キヤノン株式会社 Imprint apparatus, imprint method, and article manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009212382A (en) 2008-03-05 2009-09-17 Hitachi High-Technologies Corp Proximity exposure device, substrate moving method of proximity exposure device and method of manufacturing displaying panel substrate
JP2010149469A (en) 2008-12-26 2010-07-08 Showa Denko Kk Imprinting device and method of detecting contamination of mold
US20150076724A1 (en) 2013-09-13 2015-03-19 Canon Kabushiki Kaisha Imprint apparatus, imprint method, detecting method, and method of manufacturing device

Also Published As

Publication number Publication date
JP2017050482A (en) 2017-03-09
KR20180044391A (en) 2018-05-02
JP6541518B2 (en) 2019-07-10
WO2017038007A1 (en) 2017-03-09

Similar Documents

Publication Publication Date Title
US8807978B2 (en) Template manufacturing method, template inspecting method and inspecting apparatus, nanoimprint apparatus, nanoimprint system, and device manufacturing method
CN105700291B (en) Imprint apparatus, imprint method, and method of manufacturing article
TWI392578B (en) Real time imprint process diagnostics for defects
KR101879480B1 (en) Imprint method, imprint apparatus, method of manufacturing article, and program
JP6331292B2 (en) Imprint method and imprint apparatus
KR102350286B1 (en) Method of determining drop recipe, imprint apparatus, and article manufacturing method
TWI662371B (en) Imprint apparatus and article manufacturing method
US20210097675A1 (en) Information processing apparatus, determination method, imprint apparatus, lithography system, article manufacturing method, and non-transitory computer-readable storage medium
JP6255789B2 (en) Imprint method and imprint apparatus
KR101980497B1 (en) Imprint apparatus, imprint method and manufacturing method of article
US11833736B2 (en) Method of controlling imprint apparatus, imprint apparatus, and method of manufacturing article
JP7025132B2 (en) Manufacturing method of imprint device and goods
US11061335B2 (en) Information processing apparatus, storage medium, lithography apparatus, lithography system, and article manufacturing method
KR20190022385A (en) Imprint apparatus, imprint method, article manufacturing method, molding apparatus, and molding method
KR20200002620A (en) Information processing apparatus, storage medium, lithography apparatus, lithography system, and article manufacturing method
KR20190037114A (en) Imprint apparatus, imprint method, method of determining layout pattern of imprint material, and article manufacturing method
JP6413507B2 (en) Imprint method and imprint apparatus
JP7175620B2 (en) Molding apparatus for molding composition on substrate using mold, molding method, and article manufacturing method
TWI486579B (en) Detection apparatus, lithography apparatus, method of manufacturing article, and detection method
US20230347391A1 (en) Foreign particle removing method, formation method, article manufacturing method, foreign particle removing apparatus, system, and template
KR20180060992A (en) Imprint apparatus, imprint method and article manufacturing method
JP2019096697A (en) Imprint apparatus and article manufacturing method
US20230347390A1 (en) Foreign particle removing method, formation method, article manufacturing method, foreign particle removing apparatus, and system
JP7059046B2 (en) A molding device for molding a composition on a substrate using a mold, and a method for manufacturing an article.
JP2023020870A (en) Information processing device, molding device, molding method and method for manufacturing article

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant