KR101867496B1 - Polishing apparatus inner spherical surface of retainer ring - Google Patents

Polishing apparatus inner spherical surface of retainer ring Download PDF

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Publication number
KR101867496B1
KR101867496B1 KR1020160184330A KR20160184330A KR101867496B1 KR 101867496 B1 KR101867496 B1 KR 101867496B1 KR 1020160184330 A KR1020160184330 A KR 1020160184330A KR 20160184330 A KR20160184330 A KR 20160184330A KR 101867496 B1 KR101867496 B1 KR 101867496B1
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KR
South Korea
Prior art keywords
retainer ring
polishing
fixed
holder
frame
Prior art date
Application number
KR1020160184330A
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Korean (ko)
Inventor
이정기
Original Assignee
이정기
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Priority to KR1020160184330A priority Critical patent/KR101867496B1/en
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Publication of KR101867496B1 publication Critical patent/KR101867496B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/18—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centreless means for supporting, guiding, floating or rotating work
    • B24B5/185—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centreless means for supporting, guiding, floating or rotating work for internal surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/18—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centreless means for supporting, guiding, floating or rotating work
    • B24B5/307—Means for supporting work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/36—Single-purpose machines or devices
    • B24B5/363—Single-purpose machines or devices for grinding surfaces of revolution in situ

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The present invention relates to an inner spherical surface polishing apparatus for a retainer ring based on a combination of a fixed frame provided on one side of a rotating facility provided with a rotating plate rotating at a predetermined speed with the outer peripheral surface of the upper end portion of the retainer ring curved downwards fixed; an elevation driving unit provided with a horizontal elevation frame elevated by first driving means with one end connected to the vertical frame of the fixed frame; a horizontal moving unit including a moving block horizontally moving over a predetermined length along a screw shaft rotated by second driving means below the elevation frame; a swing driving unit in which a step motor is fixed to the vertical fixing bracket connected to the lower end portion of the moving block and a holder is vertically connected to the end portion of the motor shaft penetrating the fixing bracket corresponding to the step motor; and a polishing knife axially fixed to the holder to be length-adjustable, in which the plate surface lower end portion having a predetermined height inclined downwards at a predetermined angle is curved downwards such that the curved surface is in contact with the inner spherical surface of the retainer ring.

Description

[0001] The present invention relates to an inner spherical surface of a retainer ring,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an inner surface polishing apparatus for a retainer ring, and more particularly to an inner surface polishing apparatus for a retainer ring that processes a surface of an inner peripheral surface of a retainer ring having a cut- .

Generally, a semiconductor wafer is subjected to surface planarization by chemical mechanical polishing (CMP).

The chemical mechanical polishing apparatus is an apparatus for polishing or removing an oxide film or a metal thin film applied on a semiconductor wafer by using chemical action and physical action to planarize or remove the oxide film or the metal thin film.

The chemical mechanical polishing apparatus is connected to the motor and polishes the wafer surface of the semiconductor accommodated in the rotating polishing head while supplying a chemical abrasive to the polishing pad.

The retainer ring is mounted on a lower surface of the polishing head to form a receiving portion in which the semiconductor wafer is received, and serves to prevent the semiconductor wafer from being detached from the receiving portion during polishing.

The retainer ring is used by periodically replacing the wearer with a consumable item while the lower surface of the retainer ring contacts the polishing pad.

The retainer ring of the chemical mechanical polishing apparatus is abraded while abrading the abrasive pad which abrades the wafer during use, so that if foreign matter is contained in the abraded portion, the foreign matter damages the polishing pad.

Particularly, when a metallic foreign substance is contained in the interior of the retainer ring, the polishing pad is largely damaged, thereby causing damage to the wafer, as well as greatly reducing safety and causing an accident.

On the other hand, the retainer ring may be formed in a ring-like shape so that the inside thereof penetrates vertically, but the retainer ring may be configured to be closed in a spherical shape.

The ring-shaped retainer ring has only a circular side surface, while the spherical retainer ring has a shape in which a spherical surface having a certain thickness is partially cut.

However, since the surface treatment of the spherical retainer ring is performed by a manual operation of fixing the end of the retainer ring so that the inside of the retainer ring faces upward and then allowing the end of the abrasive tool to contact the inner spherical surface while rotating the retainer ring, There is a problem that the specific gravity is very large and the efficiency is low even in polishing uniformity.

Registration No. 1088494 (November 24, 2011)

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a retainer ring which is capable of automatically polishing an inner circumferential surface of a spherical surface, The main purpose is to provide a device.

It is another object of the present invention to provide an inner surface grinding apparatus for a retainer ring that allows uniform and accurate inner surface grinding by setting the time for rotating the retainer ring.

According to an aspect of the present invention, there is provided an inner surface polishing apparatus for a retainer ring, comprising: a stationary frame provided at one side of a rotating facility having a rotating plate for rotating a constant velocity at an upper end outer peripheral surface of a retainer ring; A lifting and lowering driving part having a horizontal lifting frame whose one end is connected to the vertical frame of the fixed frame and which is lifted and lowered by the first driving device; A horizontal moving part comprising a moving block horizontally moving along a screw axis rotated by a second driving unit in a lower part of the lifting frame; A stepping motor is fixed to a vertical fixing bracket connected to a lower end of the moving block and a swing driving part is vertically connected to an end of a motor shaft passing through a fixing bracket corresponding to the stepping motor; And a polishing knife which is axially fixed to the holder so as to be adjustable in length and which has a curved surface which is curved downward so that the lower surface of the plate is inclined downward at a predetermined angle and is brought into contact with the inner surface of the retainer ring to be.

The inner peripheral surface of the spherical surface is curved downward by a retainer ring fixed to rotate downward at a constant speed so as to be curved downward by the inner surface polishing apparatus of the retainer ring according to the present invention having the above- .

Further, according to the present invention, the inner spherical surface is always polished with a uniform pressing force, thereby realizing accurate and uniform working efficiency.

1 is a front view illustrating an inner surface polishing apparatus of a retainer ring according to the present invention;
2 is a perspective view illustrating an abrasive knife in the inner surface polishing apparatus of the retainer ring according to the present invention.
3 is a side view illustrating a state in which the retainer ring of the spherical surface is polished by the inner surface polishing apparatus of the retainer ring according to the present invention

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an inner surface polishing apparatus for a retainer ring according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a front view illustrating an inner surface polishing apparatus of a retainer ring according to the present invention. The inner surface polishing apparatus of the present invention includes a fixed frame 10, a vertical movement driving unit 20, a horizontal movement driving unit 30, 40 and a polishing knife 50 as shown in Fig.

The stationary frame 10 of the present invention is configured to be provided at one side of a rotating facility having a rotating plate for rotating the retainer ring at a constant speed while being fixedly seated.

The stationary frame 10 may be provided separately from the outside of the rotating facility, but is preferably fixed outside the rotating facility.

The fixed frame 10 is provided with a lifting and lowering drive unit 20 capable of lifting and lowering.

That is, the elevating and lowering driving unit 20 includes a first driving unit 21 and an elevating frame 22. The first driving unit 21 includes a deceleration motor fixed to the fixed frame 10, As a cylinder.

In this embodiment, the first driving means 21 includes a decelerating motor and a vertical screw shaft rotated by the decelerating motor. The screw shaft is provided with a lifting block 220 for lifting the lifting block 220 in an axial direction, And one end of a horizontal lifting frame 22 having a predetermined length is fixed to the lifting block 220. [

Accordingly, the lifting frame 22 is axially coupled to the screw shaft by a single lifting block 220 and is capable of lifting and lowering by rotation of the screw shaft.

The horizontal moving part 30 is connected to the lifting frame 22.

The horizontal moving unit 30 includes a second driving unit 31 fixed to the lift frame 22 and a moving block 32 horizontally moved by the second driving unit 31. [

The second driving means 31 includes a deceleration motor 310 and a screw shaft 311 rotated by the decelerating motor 310. The screw shaft 311 at this time is connected to the lifting frame 22, And is axially supported by the bearing block 312 so as to be rotatable.

It is more preferable that the decelerating motor provided by the first driving means 21 and the second driving means 31 is capable of forward and reverse rotation.

The upper end of the moving block 32 horizontally passes through the screw shaft 311 to be axially coupled to move the moving block 32 horizontally in the axial direction in accordance with the rotation of the screw shaft 311.

A plurality of guide shafts 313 are provided in parallel between the bearing blocks 312 of the section in which the moving block 32 moves so that the moving block 32 does not rotate while moving horizontally, .

The moving block 32 of the horizontal moving unit 30 is provided with a swing drive unit 40 at a lower end thereof.

The swing drive unit 40 includes a vertical fixed bracket 41 provided at the bottom of the moving block 32 and a stepping motor 42 and a stepping motor 42 fixed to the fixed bracket 41, As shown in Fig.

The stationary bracket 41 of the swing driver 40 is vertically downwardly formed at the bottom of the moving block 32. The stationary bracket 41 at this time vertically moves one end of the moving block 32 vertically It may be formed in a shape to be bent.

Such a fixing bracket 41 is provided in a moving direction of the moving block 32 and the step motor 42 is fixed to the end face of the fixing frame 10 at the fixing bracket 41.

The step motor 42 may be fixed to the fixing bracket 41 or may be fixed to the bottom surface of the moving block 32.

The drive shaft 420 drawn out of the stepping motor 42 is horizontally inserted through the stationary bracket 41 so as to be protruded from the stationary bracket 41 by a predetermined length.

However, it is more preferable that the step motor 42 is capable of normal / reverse rotation.

A tubular holder 43 vertically penetrating is coupled to the end of the drive shaft 420 of the step motor 42 projecting from the stationary bracket 41.

The holder 43 has an inner circumferential surface formed with a circular or polygonal insertion hole 430 and a tightening bolt 431 connected to the outer circumferential surface of the holder 43 to be inserted into the insertion hole 430 side.

The holder 43 of the swing driver 40 is connected to the polishing knife 50 so as to be adjustable in length.

2, the polishing knife 50 is constituted by an engaging end portion 51, a knife body 52 and a polishing end portion 53. As shown in Fig.

The engaging end portion 51 is vertically provided and the engaging end portion 51 is formed to have the same sectional shape as that of the insertion hole 430 so as to be inserted into the insertion hole 430 of the holder 40.

The knife body 52 is provided at the lower end of the coupling end 51 so as to be formed as a flat plate having the same width as the diameter of the coupling end 51 and inclined downward at a predetermined angle and length, So as to form the end portion 53 of the polishing pad.

Therefore, the knife body 52 and the polishing end portion 53 have the same width and thickness as those of the thin plate integrally.

Particularly, in the polishing knife 50, the length of the knife body 52 and the polishing end portion 53 are formed to be constant, but the length of the engaging end portion 51 is formed differently according to the height of the polishing surface of the retainer ring, The width of the knife body 52 and the polishing end portion 53 may be different depending on the width of the surface.

Hereinafter, the operation and effects of the inner surface polishing apparatus of the retainer ring according to the present invention will be described.

3 is a side view illustrating a state in which a retainer ring of a spherical surface is polished by an inner surface polishing apparatus of a retainer ring according to the present invention.

The polishing apparatus according to the present invention is configured such that the elevating frame 22 is elevated and lowered by a first driving means 21 of the elevating and lowering driving unit 20 while the elevating frame 22 is elevated and lowered by the second driving means 31 The drive shaft 420 to be pulled out of the step motor 42 of the swing drive portion 40 is moved in the longitudinal direction of the lift frame 22 by using the retainer ring 60 of the spherical surface, Centered.

More specifically, the polishing end portion 53, which is the lower end portion of the polishing knife 50 fixed to the holder 43 connected to the driving shaft 420, is positioned at the center of the concave surface of the retainer ring 60.

At this time, the rotation axis of the holder 53 that rotatably supports the retainer ring 60 is positioned at the same radius as the internal spherical surface of the retainer ring 60.

However, when the polishing of the spherical surface is completed, the outer circumferential end of the retainer ring 60 is cut and then removed.

By the rotating plate 70 of the rotating equipment for fixing the retainer ring 60 after the polishing end portion 53 of the polishing knife 50 is positioned at the center of the retainer ring 60 and brought into close contact with the inner spherical surface at a certain pressure Let it rotate at a constant speed.

The center of the inner spherical surface is polished by the polishing knife 50 by the rotation of the rotary plate 70 and the retainer ring 60 rotating and the step motor 42 of the swing driver 40 is rotated So that the abrasive knife 50 is rotated around the position where the abrasive knife 50 is fixed to the holder 43, so that polishing is performed from the center of the inner spherical surface to the outer peripheral surface.

If the polishing knife 50 is rotated while being moved from the center to the outside along the inner spherical surface of the retainer ring 60 by driving the step motor 42 while rotating the retainer ring 60, Can be uniformly polished.

Such an operation is performed for a predetermined time, and uniform operation efficiency can be obtained by repeating the same operation for the same product.

By automating the inner surface polishing of the retainer ring 60, it is possible to maximally reduce the manpower required for the work, thereby providing a very useful effect of further lowering the manufacturing cost.

10: fixed frame 20:
21: first driving means 22: lift frame
220: Lift block 30: Horizontal moving part
31: second driving means 32: moving block
40: swing drive part 41: fixed bracket
42: step motor 43: holder

Claims (3)

The downward curved surface being provided at one side of the rotary facility having a rotary plate for rotating the upper end of the retainer ring at a constant speed so as to fix the outer peripheral surface thereof;
A lifting and lowering driving part having a horizontal lifting frame whose one end is connected to the vertical frame of the fixed frame and which is lifted and lowered by the first driving device;
A horizontal moving part comprising a moving block horizontally moving along a screw axis rotated by a second driving unit in a lower part of the lifting frame;
A stepping motor fixed to the fixed bracket and capable of rotating in the forward and reverse directions and a holder fixed to the end of the driving shaft of the stepping motor, And a holder having a cylindrical shape penetrating vertically is coupled to the end of the driving shaft. The holder has a circular or polygonal inner circumferential surface to form an insertion hole, and an outer circumferential surface A swing driver for connecting the tightening bolt to the insertion hole side;
And a knife body and a polishing end, wherein the joint end is a vertically disposed rod shape and is inserted into the insertion hole of the holder, and the lower end of the coupling end is formed of a flat plate having the same width as the diameter of the coupling end And the lower end of the knife body is formed in a downwardly curved shape so as to form a polishing end, and a length of the holder can be adjusted to a predetermined height A connecting knife;
/ RTI >
The polishing end of the lower end of the polishing knife is brought into close contact with the inner surface of the retainer ring at a predetermined pressure and then the polishing knife is rotated along the inner spherical surface of the retainer ring by driving the step motor while rotating the retainer ring So that the inner surface of the retainer ring can be polished.
The method according to claim 1,
Wherein the first driving means and the second driving means comprise a reduction motor and a screw shaft.
delete
KR1020160184330A 2016-12-30 2016-12-30 Polishing apparatus inner spherical surface of retainer ring KR101867496B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160184330A KR101867496B1 (en) 2016-12-30 2016-12-30 Polishing apparatus inner spherical surface of retainer ring

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Application Number Priority Date Filing Date Title
KR1020160184330A KR101867496B1 (en) 2016-12-30 2016-12-30 Polishing apparatus inner spherical surface of retainer ring

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KR101867496B1 true KR101867496B1 (en) 2018-06-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118146939A (en) * 2024-05-13 2024-06-07 江南大学附属医院 Biological tissue low-temperature grinder for neurology experiments

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011177872A (en) * 2010-03-03 2011-09-15 Konica Minolta Opto Inc Grinding device and grinding method
KR101088494B1 (en) 2009-04-06 2011-11-30 주식회사 디어포스 Grinder-shaped Eco-abrasive atricle and method for manufacturing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101088494B1 (en) 2009-04-06 2011-11-30 주식회사 디어포스 Grinder-shaped Eco-abrasive atricle and method for manufacturing the same
JP2011177872A (en) * 2010-03-03 2011-09-15 Konica Minolta Opto Inc Grinding device and grinding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118146939A (en) * 2024-05-13 2024-06-07 江南大学附属医院 Biological tissue low-temperature grinder for neurology experiments

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