KR101853377B1 - Apparatus and Method for treating substrate - Google Patents

Apparatus and Method for treating substrate Download PDF

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Publication number
KR101853377B1
KR101853377B1 KR1020160184120A KR20160184120A KR101853377B1 KR 101853377 B1 KR101853377 B1 KR 101853377B1 KR 1020160184120 A KR1020160184120 A KR 1020160184120A KR 20160184120 A KR20160184120 A KR 20160184120A KR 101853377 B1 KR101853377 B1 KR 101853377B1
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South Korea
Prior art keywords
horizontal
substrate
clamping
lower body
unit
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KR1020160184120A
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Korean (ko)
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정평순
한병진
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세메스 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention provides an apparatus and a method for processing a substrate. The substrate processing apparatus includes a process chamber having an upper body and a lower body combined with each other to provide a processing space therein, a substrate supporting unit for supporting the substrate in the processing space, and a lower substrate A clamping unit for clamping the upper body and the lower body located at the closed position, a sensor unit for measuring the horizontal position of the upper body and the lower body, And a controller for controlling the operation of the clamping unit on the basis of the level received from the sensor unit. This makes it possible to prevent the clamping member from colliding with the body which is out of the normal range of the horizontal degree.

Figure R1020160184120

Description

[0001] APPARATUS AND METHOD FOR TREATING SUBSTRATE [0002]

The present invention relates to an apparatus and a method for processing a substrate.

In order to manufacture a semiconductor device, a desired pattern is formed on a substrate through various processes such as photolithography, etching, ashing, ion implantation, and thin film deposition on the substrate. Various processes are used for each process, and contaminants and particles are generated during the process. A cleaning process for cleaning contaminants and particles is essentially performed before and after each process.

Generally, in the cleaning step, the substrate is treated with a chemical and a rinsing liquid and then dried. The drying treatment step is a step for drying the rinsing liquid remaining on the substrate. The rinsing liquid on the substrate is replaced with an organic solvent whose surface tension is lower than that of the rinsing liquid such as isopropyl alcohol (IPA), and then the organic solvent is removed do. However, as the distance (CD: critical dimension) between the pattern formed on the substrate and the pattern becomes finer, it is not easy to remove the organic solvent remaining in the spaces between the patterns.

Recently, a process of removing residual organic solvent on a substrate using a supercritical fluid is performed. The supercritical process proceeds in an enclosed, high pressure space to satisfy the specific conditions of the supercritical fluid.

1 is a cross-sectional view showing a general supercritical processing apparatus. Referring to FIG. 1, a process chamber for performing a supercritical processing process has an upper body 2 and a lower body 4. The lower body 4 is provided in the form of a cup having an open top, and the upper body 2 is provided in a plate shape. The upper body 2 and the lower body 4 are combined with each other to form a processing space therein. In order to seal the processing space even under high pressure conditions, the cylinder continuously provides a strong force in the direction of bringing the upper body 2 and the lower body 4 into close contact with each other.

However, the cylinder 6 is stressed as the cylinder 6 continues to provide a strong force during the process. As a result, there is a fear that the cylinder 6 may be damaged, and the atmosphere of the processing space is leaked to the outside.

In addition, due to the damage of the cylinder 6, the lower body 4 can be combined with the upper body 2 in such a state that one side and the other side are inclined so as to have different heights. In this case, Can be leaked.

Korean Patent Publication No. 10-2011-0117699

SUMMARY OF THE INVENTION The present invention is directed to an apparatus and method for measuring the horizontality of a process chamber for forming a high-pressure atmosphere in combination with each other.

Embodiments of the present invention provide an apparatus and method for processing a substrate. The substrate processing apparatus includes a process chamber having an upper body and a lower body combined with each other to provide a processing space therein, a substrate supporting unit for supporting the substrate in the processing space, and a lower substrate A clamping unit for clamping the upper body and the lower body located at the closed position, a sensor unit for measuring the horizontal position of the upper body and the lower body, And a controller for controlling the operation of the clamping unit on the basis of the level received from the sensor unit.

The controller may generate an interlock in the operation of the clamping unit if the horizontal angle is out of the normal range. Wherein the clamping unit comprises a clamping member for clamping the process chamber and a clamping member for clamping the upper body and the lower body or moving the clamping member to the releasing position spaced apart from the upper body and the lower body, The clamping member may include a first clamp located at one side of the process chamber and a second clamp positioned between the process chamber and the first clamp.

Wherein the controller is configured to move the clamping member to the locked position when the clamping member measures the horizontal angle at the unlocked position and if the horizontal angle is within the normal range, And the clamping member can be controlled to cause the movable member to generate the interlock at the releasing position.

Wherein the sensor unit includes a horizontal irradiation member for irradiating light to measure any one of the horizontal angles at the closed position, wherein the horizontal irradiation member includes a horizontal light source for irradiating light in a horizontal direction located at one side of the process chamber And a horizontal light receiving unit for receiving the light emitted from the horizontal light emitting unit with the process chamber interposed therebetween.

Wherein the sensor unit further includes a vertical irradiation member for irradiating light to measure any one of the horizontal positions at the closed position, wherein the vertical irradiation member is arranged in a vertical direction at a position facing one of the vertically- And a vertical light receiving unit provided on one surface of the vertical light emitting unit and receiving light emitted from the vertical light emitting unit.

Wherein the sensor unit includes a contact sensor member for measuring a pressure of a contact surface where the upper body and the lower body are in contact with each other to measure any one of the horizontal positions in the closed position, And a second pressure sensor positioned in a second region of the contact surface. The first pressure sensor and the second pressure sensor may be positioned to face each other with a central axis of the process chamber therebetween.

The elevating member may include a plurality of cylinders for supporting any of the cylinders, and the sensor unit may include a plurality of pressure sensors provided in each of the cylinders to measure the pressure of each of the cylinders.

The method of processing a substrate using the substrate processing apparatus may include a contact step in which the lower body and the upper body are in close contact with each other when the substrate flows into the processing space, Wherein in the measuring step, a clamping step of clamping the upper body and the lower body, which are in close contact with each other, is performed when the horizontal level is within a normal range, and in the measuring step, The clamping step is stopped.

In the measurement step, the horizontal angle can be measured by irradiating any one of the above lights. In the measurement step, the pressure of the contact surface where the upper body and the lower body are in contact with each other may be measured to measure the horizontality. The measuring step may measure the pressure on a plurality of different areas of the contact surface. The elevating member may include a plurality of cylinders for supporting any one of the cylinders. In the measuring step, the pressure of each of the cylinders may be measured to measure the level.

According to the embodiment of the present invention, the horizontal motion of the movable body among the upper body and the lower body is measured, and the operation of the clamping member for clamping each body according to the measurement result is interlocked. This makes it possible to prevent the clamping member from colliding with the body which is out of the normal range of the horizontal degree.

1 is a cross-sectional view showing a general supercritical processing apparatus.
2 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.
Fig. 3 is a cross-sectional view showing an apparatus for cleaning the substrate in the first processing unit of Fig. 2;
4 is a cross-sectional view showing a first embodiment of an apparatus for dry-processing a substrate in the second process unit of FIG. 2;
5 is a perspective view showing the housing of Fig.
Figure 6 is a perspective view showing the substrate support unit of Figure 4;
Figure 7 is a perspective view showing the clamping member of Figure 4;
Fig. 8 is a cross-sectional view showing a second embodiment of the sensor unit of Fig. 4;
9 is a cross-sectional view showing a third embodiment of the sensor unit of FIG.
10 is a cross-sectional view showing a fourth embodiment of the sensor unit of FIG.

The embodiments of the present invention can be modified into various forms and the scope of the present invention should not be interpreted as being limited by the embodiments described below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Accordingly, the shapes of the components and the like in the drawings are exaggerated in order to emphasize a clearer description.

The present invention will be described in detail with reference to Figs. 2 to 10 by way of example of the present invention.

2 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.

2, the substrate processing apparatus 1 has an index module 10 and a processing module 20, and the index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 20 are sequentially arranged in a line. The direction in which the load port 120, the transfer frame 140 and the processing module 20 are arranged is referred to as a first direction 12 and a direction perpendicular to the first direction 12 Direction is referred to as a second direction 14 and a direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction 16. [

In the load port 120, a carrier 18 in which a substrate W is housed is seated. A plurality of load ports 120 are provided, and they are arranged in a line along the second direction 14. In FIG. 1, four load ports 120 are shown. However, the number of load ports 120 may increase or decrease depending on conditions such as process efficiency and footprint of the process module 20. The carrier 18 is formed with a slot (not shown) provided to support the edge of the substrate. A plurality of slots are provided along the third direction 16 and the substrates are positioned within the carrier 18 so as to be stacked apart from each other along the third direction 16. As the carrier 18, a front opening unified pod (FOUP) may be used.

The processing module 20 has a buffer unit 220, a transfer chamber 240, a first processing unit 260, and a second processing unit 280. The transfer chamber 240 is disposed such that its longitudinal direction is parallel to the first direction 12. The first processing units 260 are disposed on one side of the transfer chamber 240 along the second direction 14 and the second processing units 260 are disposed on the other side of the transfer chamber 240 along the second direction 14. [ 280 are disposed. The first process units 260 and the second process units 280 may be provided to be symmetrical with respect to the transfer chamber 240. Some of the first processing units 260 are disposed along the longitudinal direction of the transfer chamber 240. In addition, some of the first processing units 260 are arranged to be stacked on each other. That is, the first process units 260 may be arranged on one side of the transfer chamber 240 in the arrangement of A X B (A and B are each a natural number of 1 or more). Where A is the number of the first process units 260 provided in a row along the first direction 12 and B is the number of the second process units 260 provided in a row along the third direction 16. [ When four or six first process units 260 are provided on one side of the transfer chamber 240, the first process units 260 may be arranged in an array of 2 X 2 or 3 X 2. The number of the first processing units 260 may increase or decrease. The second process units 280 may also be arranged in an array of M X N (where M and N are natural numbers of 1 or more, respectively) similar to the first process units 260. Here, M and N may be the same numbers as A and B, respectively. Unlike the above, the first processing unit 260 and the second processing unit 280 may both be provided only on one side of the transfer chamber 240. In addition, unlike the above, the first processing unit 260 and the second processing unit 280 may be provided as a single layer on one side and the other side of the transfer chamber 240, respectively. In addition, the first processing unit 260 and the second processing unit 280 may be provided in various arrangements different from those described above.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before the transfer of the substrate W between the transfer chamber 240 and the transfer frame 140. [ The buffer unit 220 is provided with a slot (not shown) in which the substrate W is placed, and a plurality of slots (not shown) are provided to be spaced apart from each other in the third direction 16. The surface of the buffer unit 220 opposed to the transfer frame 140 and the surface of the transfer chamber 240 facing each other are opened.

The transfer frame 140 transfers the substrate W between the buffer unit 220 and the carrier 18 that is seated on the load port 120. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and is linearly moved along the index rail 142 in the second direction 14. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. Also, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward relative to the body 144b. A plurality of index arms 144c are provided and each is provided to be individually driven. The index arms 144c are stacked in a state of being spaced from each other along the third direction 16. Some of the index arms 144c are used to transfer the substrate W from the processing module 20 to the carrier 18 while the other part is used to transfer the substrate W from the carrier 18 to the processing module 20. [ As shown in Fig. This can prevent the particles generated from the substrate W before the process processing from adhering to the substrate W after the process processing in the process of loading and unloading the substrate W by the index robot 144. [

The transfer chamber 240 transfers the substrate W between the buffer unit 220, the first processing unit 260 and the second processing unit 280. The transfer chamber 240 is provided with a guide rail 242 and a main robot 244. The guide rails 242 are arranged so that their longitudinal directions are parallel to the first direction 12. The main robot 244 is installed on the guide rails 242 and is linearly moved along the first direction 12 on the guide rails 242.

The first processing unit 260 and the second processing unit 280 may be provided to perform a process on one substrate W sequentially. For example, the substrate W may be subjected to a chemical process, a rinsing process, and a primary drying process in the first process unit 260, and a secondary drying process may be performed in the second process unit 260. In this case, the primary drying step may be performed by an organic solvent, and the secondary drying step may be performed by a supercritical fluid. As the organic solvent, isopropyl alcohol (IPA) liquid may be used, and supercritical fluid may be carbon dioxide (CO 2 ). Alternatively, the primary drying process in the first process unit 260 may be omitted.

Hereinafter, the substrate processing apparatus 300 provided in the first processing unit 260 will be described. Fig. 3 is a cross-sectional view showing an apparatus for cleaning the substrate in the first processing unit of Fig. 2; 3, the substrate processing apparatus 300 has a processing vessel 320, a spin head 340, an elevating unit 360, and a jetting member 380. [ The processing vessel 320 provides a space where the substrate processing process is performed, and the upper portion thereof is opened. The processing vessel 320 has an inner recovery cylinder 322 and an outer recovery cylinder 326. [ Each of the recovery cylinders 322 and 326 recovers the different treatment liquids among the treatment liquids used in the process. The inner recovery cylinder 322 is provided in an annular ring shape surrounding the spin head 340 and the outer recovery cylinder 326 is provided in an annular ring shape surrounding the inner recovery cylinder 322. The inner space 322a of the inner recovery cylinder 322 and the space 326a between the outer recovery cylinder 326 and the inner recovery cylinder 322 are connected to each other by the inner recovery cylinder 322 and the outer recovery cylinder 326, And serves as an inflow port. Recovery passages 322b and 326b extending perpendicularly to the bottom of the recovery passages 322 and 326 are connected to the recovery passages 322 and 326, respectively. Each of the recovery lines 322b and 326b discharges the processing liquid introduced through each of the recovery cylinders 322 and 326. [ The discharged treatment liquid can be reused through an external treatment liquid recovery system (not shown).

The spin head 340 is disposed in the processing vessel 320. The spin head 340 supports the substrate W and rotates the substrate W during the process. The spin head 340 has a body 342, a support pin 334, a chuck pin 346, and a support shaft 348. The body 342 has a top surface that is generally circular when viewed from the top. A support shaft 348 rotatable by a motor 349 is fixedly coupled to the bottom surface of the body 342. A plurality of support pins 334 are provided. The support pin 334 is spaced apart from the edge of the upper surface of the body 342 by a predetermined distance and protrudes upward from the body 342. The support pins 334 are arranged so as to have a generally annular ring shape in combination with each other. The support pins 334 support the rear edge of the substrate such that the substrate W is spaced apart from the upper surface of the body 342 by a certain distance. A plurality of the chuck pins 346 are provided. The chuck pin 346 is disposed farther away from the center of the body 342 than the support pin 334. The chuck pin 346 is provided to protrude upward from the body 342. The chuck pin 346 supports the side of the substrate W so that the substrate W is not laterally displaced in place when the spin head 340 is rotated. The chuck pin 346 is provided so as to be linearly movable between a standby position and a supporting position along the radial direction of the body 342. The standby position is a distance from the center of the body 342 relative to the support position. When the substrate W is loaded or unloaded onto the spin head 340, the chuck pin 346 is positioned at the standby position and the chuck pin 346 is positioned at the support position when the substrate W is being processed. At the support position, the chuck pin 346 contacts the side of the substrate W.

The elevating unit 360 moves the processing vessel 320 linearly in the vertical direction. As the processing vessel 320 is moved up and down, the relative height of the processing vessel 320 to the spin head 340 is changed. The lifting unit 360 has a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixed to the outer wall of the processing container 320 and a moving shaft 364 which is moved upward and downward by a driver 366 is fixedly coupled to the bracket 362. The processing vessel 320 is lowered so that the spin head 340 protrudes to the upper portion of the processing vessel 320 when the substrate W is placed on the spin head 340 or lifted from the spin head 340. When the process is performed, the height of the process container 320 is adjusted so that the process liquid may flow into the predetermined collection container 360 according to the type of the process liquid supplied to the substrate W.

The lift unit 360 can move the spin head 340 in the vertical direction instead of the processing vessel 320. [

The jetting member 380 supplies the treatment liquid onto the substrate W. [ The injection member 380 has a nozzle support 382, a nozzle 384, a support shaft 386, and a driver 388. The support shaft 386 is provided along its lengthwise direction along the third direction 16 and a driver 388 is coupled to the lower end of the support shaft 386. The driver 388 rotates and lifts the support shaft 386. The nozzle support 382 is coupled perpendicular to the opposite end of the support shaft 386 coupled to the driver 388. The nozzle 384 is installed at the bottom end of the nozzle support 382. The nozzle 384 is moved by a driver 388 to a process position and a standby position. The process position is a position in which the nozzle 384 is disposed in the vertical upper portion of the processing container 320 and the standby position is defined as a position in which the nozzle 384 is deviated from the vertical upper portion of the processing container 320. One or a plurality of the ejection members 380 may be provided. When a plurality of jetting members 380 are provided, each of the chemical, rinsing liquid, and organic solvent may be provided through jetting members 380 that are different from each other. The chemical may be a liquid with strong acid or strong base properties. The rinse liquid may be pure. The organic solvent may be a mixture of an isopropyl alcohol vapor and an inert gas or may be an isopropyl alcohol solution.

The second processing unit 280 is provided with a substrate processing apparatus 400 to be performed by the secondary drying process of the substrate W. The substrate processing apparatus 400 secondary-dries the substrate W subjected to the first drying process in the first processing unit 260. The substrate processing apparatus 400 drys the substrate W on which the organic solvent remains. The substrate processing apparatus 400 can dry-process the substrate W using a supercritical fluid. FIG. 4 is a cross-sectional view showing a first embodiment of an apparatus for drying a substrate in the second processing unit of FIG. 2, and FIG. 5 is a perspective view showing the housing of FIG. 4 and 5, the substrate processing apparatus 400 includes a housing 402, a processing chamber 410, a substrate supporting unit 440, an elevating member 450, a heating member 460, a blocking member 480 An exhaust unit 470, a fluid supply unit 490, a clamping member 500, a shifting member 550, a buffer member 700, a sensor unit, and a controller 600.

The housing 402 includes a body 404 and an intermediate plate 406. The body 404 is provided in a cylindrical shape having a receiving space therein. For example, the body 404 may be provided in a rectangular parallelepiped shape. On the upper surface of the body 404, slit-shaped through-holes 405 are formed. The through holes 405 are provided so as to have the same longitudinal direction at mutually different positions. According to one example, there are four through holes 405, two of which are located on one side, and the other two can be located on the other side. Alternatively, the through hole 405 may be provided in an even number, and may be two or more than six. The through hole 405 functions as a passage connecting the moving member 550 and the clamping member 500.

The intermediate plate 406 is positioned within the body 404. The intermediate plate 406 separates the accommodating space 408 into an upper space 408a and a lower space 408b. The intermediate plate 406 is provided in the form of a plate having a hollow 404a. The lower body 420 is provided to be insertable into the hollow 404a. The hollow 404a may be provided to have a larger diameter than the lower end of the lower body 420. The process chamber 410 and the clamping member 500 may be located in the upper space 408a and the elevating member 450 may be located in the lower space 408b. The shifting member 550 may be located on the outer wall of the housing 402.

The process chamber 410 has a processing space 412 for processing the substrate W therein. The processing chamber 410 seals the processing space 412 from the outside while processing the substrate W. [ The process chamber 410 includes a lower body 420, an upper body 430, and a sealing member 414. The bottom surface of the lower body 420 is provided stepped. The lower body 420 is provided in such a shape that the bottom center portion is positioned lower than the edge portion. For example, the lower body 420 may be provided in a generally cylindrical shape. The lower body 420 is movable up and down by the lifting member 450 to the upper space 408a and the lower space 408b of the body 404. A lower supply port 422 and an exhaust port 426 are formed on the bottom surface of the lower body 420. The lower supply port 422 may be positioned out of the central axis of the lower body 420 as viewed from above. The lower supply port 422 serves as a flow path for supplying a supercritical fluid to the processing space 412.

The upper body 430 is combined with the lower body 420 to form a processing space 412 therein. The upper body 430 is positioned above the lower body 420. The upper body 430 is located in the upper space 408a of the housing 402. [ The side ends of the upper body 430 are provided to be stepped. The upper body 430 is provided in such a shape that the central portion of the upper surface is positioned higher than the edge portion. for example. The upper body 430 may be provided in a generally cylindrical shape. An upper supply port 432 is formed in the upper body 430. The upper supply port 432 serves as a flow path for supplying supercritical fluid to the processing space 412. The upper supply port 432 may be positioned coincident with the center of the upper body 430. According to an example, each of the upper body 430 and the lower body 420 may be made of a metal material.

The sealing member 414 seals a gap between the upper body 430 and the lower body 420. The sealing member 414 is positioned between the upper body 430 and the lower body 420. The sealing member 414 has an annular ring shape. For example, the sealing member 414 may be provided with an O-ring 414. The sealing member 414 is provided on the lower end face of the upper body 430 or the upper face of the lower body 420. In this embodiment, it is assumed that the sealing member 414 is provided on the upper surface of the lower body 420. The upper surface of the lower body is formed with a sealing groove into which the sealing member 414 is inserted. A part of the sealing member 414 is positioned to be inserted into the sealing groove, and the other part is positioned to protrude from the sealing groove. The sealing member 414 may be provided with a material including elasticity.

The substrate support unit 440 supports the substrate W in the processing space 412. Figure 6 is a perspective view showing the substrate support unit of Figure 4; Referring to FIG. 6, the substrate supporting unit 440 supports the substrate W such that the processing surface of the substrate W faces upward. The substrate support unit 440 includes a support table 442 and a substrate support table 444. The support base 442 is provided in a bar shape extending downward from the bottom surface of the upper body 430. A plurality of supports 442 are provided. For example, the support base 442 may be four. The substrate holder 444 supports the bottom edge region of the substrate W. [ A plurality of substrate holding tables 444 are provided, each supporting a different area of the substrate W. For example, the number of the substrate holding tables 444 may be two. The substrate holder 444 is provided in a rounded plate shape when viewed from above. The substrate holder 444 is positioned inside the support when viewed from above. Each substrate holder 444 is provided to have a ring shape in combination with each other. Each of the substrate holders 444 is positioned apart from each other.

Referring again to FIGS. 4 and 5, the elevating member 450 adjusts the relative position between the upper body 430 and the lower body 420. The elevating member 450 is moved up and down so that any one of the upper body 430 and the lower body 420 is spaced apart from or close to the other. The elevating member 450 moves up or down one of the upper body 430 and the lower body 420 to move the process chamber 410 to the open position or the closed position. Here, the open position is a position where the upper body 430 and the lower body 420 are spaced apart from each other, and the closed position is a position in which the close surfaces of the upper body 430 and the lower body 420 facing each other come into close contact with each other . That is, in the open position, the processing space 412 is opened from the outside, and the processing space 412 is sealed from the outside in the closed position. In this embodiment, the elevating member 450 moves up and down the lower body 420 in the lower space 408b, and the upper body 430 is fixed in position. Alternatively, the lower body 420 may be fixed, and the upper body 430 may be moved up and down with respect to the lower body 420. [ In this case, the lifting member 450 can be located in the upper space 408a.

The elevation member 450 includes a support plate 452, an elevation shaft 454, and a driver 456. The support plate 452 supports the lower body 420 in the lower space 408b. The lower body 420 is fixedly coupled to the support plate 452. The support plate 452 is provided in the shape of a circular plate. The support plate 452 is provided to have a larger diameter than the hollow 404a. The lower end of the lower body 420 is positioned in the lower space 408b even in the closed position. The lifting shaft 454 supports the bottom surface of the support plate 452 in the lower space 408b. The lifting shaft 454 is fixedly coupled to the support plate 452. The elevation shaft 454 is provided in plural. The lifting shafts 454 are arranged to be arranged along the circumferential direction. The driver 456 moves up and down the respective lift axes 454. A plurality of actuators 456 are provided and are associated with the lift shaft 454 in a one-to-one correspondence. The lower body 420 and the lift shaft 454 are moved up and down and the upper body 430 and the lower body 420 are moved to the closed position where the processing space is sealed. When the driving force of the driver 456 is released at the closed position, the upper body 430 and the lower body 420 can maintain the closed position. Each of the drivers 456 is provided with the same driving force, or the driving force is released equally. Accordingly, the plurality of lifting shafts 454 are positioned at the same height during the lifting and lowering, and the lifting and lowering of the supporting plate 452 and the lower body 420 can be performed while maintaining the horizontal. For example, the driver 456 may be a cylinder or a motor.

The lower body 420 and the lifting shaft 454 are moved down while the upper body 430 and the lower body 420 are moved to the open position where the processing space is opened Lt; / RTI >

The heating member 460 heats the processing space 412. The heating member 460 heats the supercritical fluid supplied to the processing space 412 above the critical temperature to maintain it in the supercritical fluid phase. The heating member 460 includes a plurality of heaters 460. The heaters 460 are provided in the form of bars or rods having longitudinal directions parallel to each other. The heaters 460 have a longitudinal direction perpendicular to the direction in which the clamps 510 and 520 are moved. For example, the heaters 460 have a longitudinal direction parallel to the direction in which each body 420, 430 is moved. This makes it impossible to insert the heater 460 from the sides of the respective bodies 420 and 430 since the sides of the bodies 420 and 430 are clamped. And may be embedded in at least one of the upper body 430 and the lower body 420. For example, the heater may receive power from the outside to generate heat. In this embodiment, the heater 460 is provided to the upper body 430, but may be provided to the upper body 430 and the lower body 420, respectively. Further, the heater 460 may not be provided in the upper body 430 and may be provided in the lower body 420.

The blocking member 480 prevents the supercritical fluid supplied from the lower supply port 474 from being directly supplied to the non-processed surface of the substrate W. [ The blocking member 480 includes a blocking plate 482 and a support 484. The blocking plate 482 is positioned between the lower supply port 474 and the substrate support unit 440. The blocking plate 482 is provided to have a circular plate shape. The blocking plate 482 has a smaller diameter than the inner diameter of the lower body 420. The blocking plate 482 has a diameter that obscures both the lower supply port 474 and the exhaust port 426 when viewed from above. For example, the blocking plate 482 may be provided to have a diameter corresponding to, or larger than, the diameter of the substrate W. [ Support base 484 supports blocking plate 482. The supports 484 are provided in a plurality and are arranged along the circumferential direction of the shield plate 482. Each support base 484 is spaced apart from one another at regular intervals.

The exhaust unit 470 exhausts the atmosphere of the processing space 412. The process by-products generated in the process space 412 are exhausted through the exhaust unit 470. The exhaust may be natural exhaust or forced exhaust. The exhaust unit 470 is also capable of controlling the pressure in the processing space 412 while exhausting the process by-products. The exhaust unit 470 includes an exhaust line 472 and a pressure measuring member 474. The exhaust line 472 is connected to the exhaust port 426. The exhaust valve 476 provided in the exhaust line 472 is capable of regulating the amount of exhaust in the processing space 412. The pressure measuring member 474 is installed in the exhaust line 472, and measures the pressure of the exhaust line 472. The pressure measuring member 474 is located upstream of the exhaust valve 476 with respect to the exhaust direction. The exhausting unit 470 can reduce the pressure of the processing space 412 to atmospheric pressure or to a pressure corresponding to the outside of the process chamber 410.

The fluid supply unit 490 supplies the processing fluid to the processing space 412. The treatment fluid is supplied in a supercritical state by the critical temperature and the critical pressure. The fluid supply unit 490 includes an upper supply line 492 and a lower supply line 494. The upper supply line 492 is connected to the upper supply port 432. The processing fluid is supplied to the processing space 412 through the upper supply line 492 and the upper supply port 432 in sequence. The upper supply line 492 is provided with an upper valve 493. The upper valve 493 opens and closes the upper supply line 492. The lower supply line 494 connects the upper supply line 492 and the lower supply port 422 to each other. The lower supply line 494 branches from the upper supply line 492 and is connected to the lower supply port 422. That is, the processing fluid supplied from each of the upper supply line 492 and the lower supply line 494 may be the same kind of fluid. The processing fluid is supplied to the processing space 412 through the lower supply line 494 and the lower supply port 422 in sequence. The lower supply line 494 is provided with a lower valve 495. The lower valve 495 opens and closes the lower supply line 494.

The processing fluid is supplied from the lower supply port 422 opposed to the non-processing surface of the substrate W and is then supplied from the upper supply port 432 opposed to the processing surface of the substrate W, Can be supplied. Thus, the process fluid may be supplied to the process space 412 via the bottom feed line 494 and then to the process space 412 via the top feed line 492. [ This is to prevent the initially supplied processing fluid from being supplied to the substrate W with the critical pressure or the critical temperature not yet reached.

The clamping member 500 clamps the upper body 430 and the lower body 420 located in the closed position. Therefore, even when the pressure in the processing space increases during the process, it is possible to prevent the gap between the upper body 430 and the lower body 420 from being generated. The driving force of the actuator 456 is released while the process chamber 410 is being clamped by the clamping member 500. As a result, a strong force is applied to the driver 456 for a long time, and the driver 456 can be prevented from being damaged.

Figure 7 is a perspective view showing the clamping member of Figure 4; Referring to Fig. 7, the clamping member 500 includes a first clamp 510, a second clamp 520, and a locking pin 530. As shown in Fig. The first clamp 510 and the second clamp 520 are located on the side of the process chamber 410. According to one example, each of the first clamp 510 and the second clamp 520 is positioned opposite to each other with the process chamber 410 interposed therebetween. Each of the first clamp 510 and the second clamp 520 is provided in a shape that encloses the process chamber 410. Each of the first clamp 510 and the second clamp 520 has a clamp groove 512 formed on an inner surface thereof facing the process chamber 410. The edge of the upper body 430 and the edge of the lower body 420 positioned in the closed position can be inserted into the clamp groove 512. That is, the edge portions of the upper body 430 and the edge portions of the lower body 420 are each provided as a clamped region.

The clamping member 500 is movable to the locked position or the released position. Here, the lock position is a position where the first clamp 510 and the second clamp 520 close to each other to clamp the upper body 430 and the lower body 420, and the release position is a position where the first clamp 510 and the second clamp 520 (520) is spaced apart from the upper body (430) and the lower body (420). The first clamp 510 and the second clamp 520 are provided to have an annular ring shape in combination with each other at the locking position. For example, the vertical cross-section of either the first clamp 510 or the second clamp 520 has a "C" or "C" shape, and the other vertical cross-section has a vertical cross- Can be provided symmetrically.

The first clamp 510 is provided so that one side of the first clamp 510 is in contact with the second clamp 520. The second clamp 520 is provided so that the other side in contact with the first clamp 510 is stepped. One side of the first clamp 510 and the other side of the second clamp 520 are provided in a staggered shape. According to an example, one side of the first clamp 510 may be provided such that the upper end of the first clamp 510 is longer than the lower end, and the other side of the second clamp 520 is shorter than the lower end. A first pin groove 514 in which the lock pin 530 is located and a second pin groove 524 in the stepped region of the second clamp 520 are formed in the stepped region of the first clamp 510. Each of the first pin groove 514 and the second pin groove 524 is provided so as to be directed in a direction perpendicular to the moving direction of the clamping member 500. In the locking position, the first pin groove 514 and the second pin groove 524 are positioned opposite to each other. According to an example, the lock pin 530 may protrude from the first pin groove 514 and be inserted into the second pin groove 524 in the lock position. The first pin groove 514 may be further formed in the second clamp 520 and the second pin groove 524 may be further formed in the first clamp 510.

4 and 5, the moving member 550 moves the clamping member 500 to the locked position and the released position. The moving member 550 moves the clamping member 500 in a direction perpendicular to the moving direction of the process chamber 410. The moving member 550 includes a guide rail 560, a bracket 570, and a driving member 580. The guide rail 560 is located outside the housing 402. The guide rail 560 is positioned adjacent to the upper space 408a where the upper body 430 is located. The guide rail 560 is provided on the upper surface of the housing 402. The guide rail 560 has a longitudinal direction perpendicular to the moving direction of the process chamber 410. A plurality of guide rails 560 are provided, each having the same longitudinal direction. According to one example, the guide rails 560 are provided in the same number as the through holes 405. The guide rail 560 has a longitudinal direction parallel to the through hole 405. The guide rail 560 overlaps with the through hole 405 when viewed from above. The bracket 570 fixes the guide rail 560 and the clamping member 500 to each other. The brackets 570 are provided in the same number as the guide rails 560. According to one example, the guide rails 560 located at one side when viewed from above are connected to the first clamps 510, The second clamp 520 may be connected to the guide rail. The driving member 580 drives the guide rail 560 such that the clamping member 500 is moved to the locking position or the releasing position along the longitudinal direction of the guide rail 560.

The buffer member 700 relaxes the impact that the upper body 430 applies to the housing 400. The cushioning member (700) relaxes the impact of the upper body (430) on the ceiling of the body (404). The cushioning member 700 connects the ceiling of the upper body 430 and the body 404 with each other. The buffer member 700 is fixedly coupled to the upper body 430 and the ceiling surface, respectively. The buffer member 700 is provided with an elastic material. The buffer member 700 has elasticity in a direction parallel to the direction in which the upper body 430 and the lower body 420 are moved. For example, the buffer member 700 may be a leaf spring or a coil spring.

The sensor unit 800 measures the horizontality of any one of the upper body 430 and the lower body 420. The sensor unit 800 measures the horizontality of the body that can be raised and lowered by the elevating member. In the present embodiment, the upper body 430 is fixed to the housing 402, and the lower body 420 is moved up and down by the elevating member. The sensor unit 800 can measure the horizontality of the lower body 420.

The sensor unit 800 includes a horizontal irradiation member 810. The horizontal irradiation member 810 measures the degree of tilting of the lower body 420 (hereinafter referred to as horizontality) at the closed position. The horizontal irradiation member 810 measures the horizontality of the lower body 420 by irradiating light in a horizontal direction. The horizontal irradiation member 810 includes a horizontal light emitting portion 812 and a horizontal light receiving portion 814. The horizontal light emitting portion 812 and the horizontal light receiving portion 814 are positioned to face each other in the lower space 408b. The horizontal light emitting portion 812 may be positioned at one side of the process chamber 410 and the horizontal light receiving portion 814 may be positioned to face the horizontal light emitting portion 812 with the process chamber 410 therebetween have. The horizontal light emitting portion 812 and the horizontal light receiving portion 814 may be provided on the bottom surface of the intermediate plate 406. The horizontal light emitting portion 812 emits light in the horizontal direction, and the horizontal light receiving portion 814 can receive the light. For example, when the upper body 430 and the lower body 420 are included in the normal range having the degree of tilting of the lower body 420 at the closed position, the light can be received by the horizontal light receiving portion 814. The lower body 420 and the support plate 406 are provided in a slanted state with one side and the other side being different from each other when the horizontal degree of the lower body 420 is out of the normal range. The light emitted from the horizontal light emitting portion 812 is blocked by the lower body 420 and the support plate 406 and can not be received by the horizontal light receiving portion 814. [

The controller 600 controls the operation of the clamping member 500 based on the horizontal level received from the sensor unit 800. The controller 600 interlocks with the operation of the clamping member 500 when the horizontal degree of the lower body 420 is out of the normal range. That is, the controller 600 controls the moving member according to the horizontal degree of the lower body 420. This can prevent the clamping member 500 from clamping the lower body 420 out of the normal range and prevent the clamping member 500 from colliding with the lower body 420. According to one example, the lower body 420 may be released from its interlock when the horizontal position is included in the normal range and is positioned at the closed position. When the lower body 420 is positioned at the open position, the lower body 420 interrupts the light emitted from the horizontal light emitting portion 812, so that the operation of the clamping member 500 is interlocked. This can prevent the clamping member 500 from clamping the process chamber 410 located in the open position due to computational and operational errors.

Next, a method of processing the substrate W by using the above-described substrate processing apparatus will be described. The method of treating the substrate W includes a contact step and a measurement step. The adhesion step and the measurement step proceed sequentially. In the contact step, the lower body 420 is moved to the closed position in which it is in close contact with the upper body 430. When the upper body 430 and the lower body 420 are placed in the closed position, the processing space 412 is closed and the measurement step proceeds.

In the measuring step, the horizontality of the lower body 420 is measured. When the horizontal degree of the lower body 420 is within the normal range, the light emitted from the horizontal light emitting portion 812 is received by the horizontal light receiving portion 814. On the other hand, when the horizontal degree of the lower body 420 is out of the normal range, the light emitted from the horizontal light emitting portion 812 is not received by the horizontal light receiving portion 814. When the horizontal light receiving portion 814 is irradiated with light, the interlocking of the clamping member 500 is released, and the clamping member 500 is moved from the releasing position to the locking position.

The processing space 412 is then supplied with the processing fluid through the lower supply port 422. When the processing space 412 reaches the critical temperature and the critical pressure, the processing space 412 is supplied with the processing fluid through the upper supply port 432. The processing fluid is supplied to the processing surface of the substrate W in a supercritical state, and the substrate W is dried. When the drying processing of the substrate W is completed, the supply of the processing fluid is stopped, and the atmosphere of the processing space 412 is exhausted through the exhaust unit. The clamping member 500 is moved from the locked position to the released position and the lower body 420 is moved from the closed position to the open position.

Alternatively, if light is not received by the horizontal light receiving unit 814 in the measuring step, the clamping member 500 maintains the release position and generates an alarm. The operator can stop the operation of the substrate processing apparatus through the alarm and perform the maintenance work.

Next, a second embodiment of the sensor unit 800 will be described. Referring to FIG. 8, the sensor unit 800 may further include a vertical irradiation member 820. The vertical irradiation member 820 can irradiate light in the vertical direction. The vertical irradiation member 820 may include a plurality of vertical light emitting portions 822 and a vertical light receiving portion 824. The vertical light emitting portions 822 are positioned below the support plate 406 in the lower space. The vertical light emitting portions 822 may be positioned to face different regions of the support plate 406. [ The vertical light emitting portion 822 can irradiate light in the vertical upward direction. The vertical light receiving portion 824 may be positioned to face the vertical light emitting portion 822 in a one-to-one correspondence. The vertical light receiving portion 824 may be provided on the bottom surface of the support plate 406. The controller 600 may be provided with a plurality of spacing distances between the vertical light emitting portion 822 and the vertical light receiving portion 824. At this time, if the distance distances measured from the vertical irradiation member 820 are the same, the degree of tilt can be determined as zero. Alternatively, if the spacing distances are different from each other, it is determined that the horizontal extent is out of the normal range, and an interlock may be generated in the clamping member 500.

Next, the third embodiment of the sensor unit 800 will be described. Referring to FIG. 9, the sensor unit 800 may include a contact sensor member 830. The contact sensor member 830 can measure the pressure of the contact surface where the upper body 430 and the lower body 420 are in contact with each other. The contact sensor member 830 may include a first pressure sensor 832 and a second pressure sensor 834. A first groove and a second groove may be formed on the contact surface. The first groove and the second groove may be positioned to face each other with the central axis of the process chamber 410 therebetween. The first groove and the second groove are located outside the sealing member 414. A first pressure sensor 832 may be located in the first groove and a second pressure sensor 834 may be located in the second groove. Each of the first pressure sensor 832 and the second pressure sensor 834 may be positioned such that the upper surface thereof has the same height as the upper end of the contact surface. When the lower body 420 is moved to the closed position, the measured pressures measured from the respective pressure sensors 832 and 834 may be transmitted to the controller 600. [ If the measured pressures from the respective pressure sensors 832 and 834 are the same, the degree of tilt can be determined to be zero. On the contrary. If the measured pressures are different from each other, it is determined that the horizontal angle is out of the normal range, and interlocking can be generated in the clamping member 500.

Next, a fourth embodiment of the sensor unit 800 will be described. Referring to FIG. 10, the sensor unit 800 may include a plurality of pressure sensors 840. The pressure sensors 840 may be provided in a number corresponding one-to-one with the cylinder 456. Pressure sensors 840 may be provided in the cylinder 456, respectively. Each of the pressure sensors 840 can measure the pressure of the cylinder 456. When each cylinder 456 is pressed, the lower body 420 can be moved to the closed position. At this time, if the measurement pressures measured from the pressure sensors 840 are the same, the degree of tilt can be determined as zero. On the contrary. If the measured pressures are different from each other, it is determined that the horizontal angle is out of the normal range, and interlocking can be generated in the clamping member 500.

600: controller 800: sensor unit
810: horizontal irradiation member 812:
814: horizontal light receiving portion 820: vertical irradiation member
830: contact sensor member 840: pressure sensor

Claims (14)

A process chamber having an upper body and a lower body which are combined with each other to provide a processing space therein;
A substrate supporting unit for supporting the substrate in the processing space;
An elevating member for raising and lowering one of the upper body and the lower body to an open position or a close close position spaced apart from the other;
A clamping unit for clamping the upper body and the lower body in the closed position;
A sensor unit for measuring any one of the horizontal degrees;
And a controller for controlling the operation of the clamping unit based on a horizontal level received from the sensor unit,
Wherein the controller generates an interlock in the operation of the clamping unit if the horizontal degree is out of the normal range. delete The method according to claim 1,
Wherein the clamping unit comprises:
A clamping member for clamping the process chamber;
And a moving member for moving the clamping member to a locked position where the clamping member clamps the upper body and the lower body or to a release position where the clamping member is separated from the upper body and the lower body,
The clamping member
A first clamp located at one side of the process chamber;
And a second clamp positioned to face the first clamp with the process chamber therebetween. The method of claim 3,
Wherein the controller is configured to move the clamping member to the locked position when the clamping member measures the horizontal angle at the unlocked position and if the horizontal angle is within the normal range, And controls the moving member to cause the clamping member to generate an interlock at the releasing position. The method according to any one of claims 1, 3, and 4,
The sensor unit includes:
And a horizontal irradiation member for irradiating light to measure any one of the horizontal positions at the closed position,
The horizontal irradiation member
A horizontal light emitting unit disposed at one side of the process chamber for emitting light in a horizontal direction;
And a horizontal light receiving portion for receiving light emitted from the horizontal light emitting portion with the process chamber interposed therebetween. 6. The method of claim 5,
The sensor unit includes:
Further comprising a vertical irradiation member for irradiating light to measure any one of the horizontal positions at the closed position,
The vertical irradiation member
A vertical light emitting unit for emitting light in a vertical direction at a position opposite to any one of the upward and downward directions;
And a vertical light receiving unit installed on the one surface and receiving light emitted from the vertical light emitting unit. The method according to any one of claims 1, 3, and 4,
The sensor unit includes:
And a contact sensor member for measuring a pressure of a contact surface where the upper body and the lower body are in contact with each other to measure any one of the horizontal positions in the closed position,
The contact sensor member comprises:
A first pressure sensor located in a first region of the contact surface;
And a second pressure sensor located in a second region of the contact surface. 8. The method of claim 7,
Wherein the first pressure sensor and the second pressure sensor are positioned to face each other with a central axis of the process chamber therebetween. The method according to any one of claims 1, 3, and 4,
The elevating member
A plurality of cylinders for supporting any of the above,
The sensor unit includes:
And a plurality of pressure sensors provided in each of the cylinders to measure the pressure of each of the cylinders. A method of processing a substrate using the substrate processing apparatus of claim 1,
A contact step of bringing the lower body and the upper body into close contact with each other when the substrate flows into the processing space;
And a measurement step of measuring any one of the horizontal degrees after the adhesion step,
The clamping unit clamps the upper body and the lower body that are in close contact with each other when the horizontal angle is within the normal range,
And stopping the clamping step if the horizontal degree deviates from the normal range in the measuring step. 11. The method of claim 10,
Wherein the measurement step irradiates light to any one of the above to measure the horizontality. 11. The method of claim 10,
Wherein the measuring step measures the pressure on a contact surface where the upper body and the lower body are in contact with each other to measure the horizontalness. 13. The method of claim 12,
Wherein the measuring step measures the pressure on a plurality of different areas of the contact surface. 11. The method of claim 10,
Wherein the elevating member includes a plurality of cylinders for supporting any one of the cylinders,
Wherein the measuring step measures the pressure of each of the cylinders to measure the horizontality.
KR1020160184120A 2016-12-30 2016-12-30 Apparatus and Method for treating substrate KR101853377B1 (en)

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