KR101838685B1

KR101838685B1 - An apparatus for preventing electric shock and method the same

Info

Publication number: KR101838685B1
Application number: KR1020160179349A
Authority: KR
Inventors: 손호원; 이중원; 김윤근
Original assignee: 주식회사 로스윈
Priority date: 2016-08-30
Filing date: 2016-12-26
Publication date: 2018-03-14
Also published as: WO2018043840A1; KR20180025103A

Abstract

A plastic injector which is integrally injected and formed around the capacitor and the varistor element on one side of the substrate, a capacitor connected to the outside of the plastic injector, Wherein a cavity for discharging the static electricity introduced through the conductive connection portion is electrically connected to the varistor element and a conductive connection portion is formed to correspond to the gap between the conductive connection portion and the conductive connection portion, And an electric shock prevention device and a method of manufacturing the same.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric shock prevention apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric shock preventer, and more particularly, to an electric shock preventer that protects a user from a leakage current by a power source and protects an internal circuit from external static electricity, and a method of manufacturing the same.

Recently, portable electronic devices are installed in a variety of internal parts in accordance with miniaturization, weight reduction, and multifunctionality. Such a portable electronic device is very sensitive to external impact, so it is enclosed by a rigid housing to protect components such as an internal electronic circuit from an external impact.

In recent years, the adoption of metal housing has been increasing to improve the aesthetics and robustness of electronic devices. Since the metal housing is excellent in electrical conductivity due to the nature of the material, an electrical path can be formed between the housing and the built-in PCB module depending on the specific device or the part. Therefore, when a static electricity having a high voltage instantly flows into the built-in PCB module through a metal conductor such as a metal housing having a large exposed surface area, a PCB module such as an IC or the like may be damaged.

On the other hand, a portable electronic device usually uses a charger to charge the battery. The charger rectifies an external AC power source to a DC power source, and then converts the AC power to a low DC power source suitable for a portable electronic device through a transformer. Here, a Y-CAP composed of a capacitor is installed at both ends of the transformer in order to enhance the electrical insulation of the transformer.

However, when the Y-CAP does not have the normal characteristics, such as a non-genuine charger, the DC power may not be sufficiently blocked by the Y-CAP, and a leakage current may be generated by the AC power source. Can be propagated along.

As described above, since the leakage current can be transmitted to the metal conductor which can be brought into contact with the human body like the external housing (case) of the portable electric apparatus, it can give the user an uncomfortable feeling of crushing. In severe cases, You can get fatal.

Therefore, an electronic device such as a cell phone using a metal housing is required to protect the user from such a leakage current.

In view of the above, researches on an electric shock protection device for protecting the user from leakage current as well as external static electricity have been actively conducted recently. For example, Korean Patent No. 10 -1585604 and 10-1608226.

According to the conventional techniques, in the process of forming the body of the device by laminating the sheet layers of the ceramic material in a multilayer structure, electrode patterns are laminated to form internal electrodes, and voids are formed between the internal electrodes Thereby forming a capacitor or an electric shock protection unit (varistor function) having an electrostatic discharge (ESD) function.

However, since the conventional electric shock protection device having such a structure has a high sintering temperature (900 to 1200 ° C) and a thin interlayer thickness due to the characteristics of materials, the ceramic material has pores formed in the process of laminating a body with a ceramic material. It is difficult to ensure stability in ESD and withstand voltage characteristics because the accuracy of the gap is lowered and deviation is large.

Thus, there is a problem that the ESD protection function of the prior art is difficult to completely perform due to the material and the structural problem. That is, according to the related art, when a high voltage (10 kV) or more is applied, the capacitor absorbs the voltage and can not flow down to the ground, so that the ESD function can not be performed. That is, in order to solve the EDS function and the withstand voltage characteristic, the pore shape, height and precision are very important. According to the conventional technique formed by lamination with a ceramic material, the thickness of the ceramic material is increased, It is required to have electrical characteristics that can withstand the withstand voltage of 350 Vdc (V 1 mA) or more. However, the electric shock protection device formed of the conventional ceramic material has a limitation in the function of the varistor.

In addition, according to the conventional technology, when the ceramic material is adapted to various layers, a capacitor layer is formed by stacking electrode patterns between the ceramic layers in a printed manner, and a varistor layer must be formed between the capacitor layers The structure is complicated, and the manufacturing process becomes complicated thereby leading to a deterioration in productivity, an increase in cost, an increase in the probability of occurrence of errors in the process, and a reliability of the product is deteriorated.

Meanwhile, the portable electronic apparatus having the metal housing is provided with a plurality of antennas according to function, and at least a part of the antennas is an internal antenna. The portable electronic apparatus is disposed in an external housing of the portable electronic apparatus, It is a tendency to use itself as an antenna.

In this case, the internal circuit of the antenna and the portable electronic device must be connected. In this case, the communication signal must be smoothly transmitted to the internal circuit without attenuation.

However, as described above, when the capacitance of a corresponding device is increased to effectively transmit a communication signal, there is a problem that the device is destroyed by external static electricity, and the device is damaged.

Moreover, as described above, the implementation of a high breakdown voltage for interrupting the leakage current by an external power source and the implementation of a high capacitance for transmitting a communication signal are difficult to achieve due to the mutually contradictory effects, There is a demand for a method capable of implementing a high capacitance at the same time as blocking the leakage current.

Korean Patent No. 10-1585604 Korean Patent No. 10-1608226

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide an electric shock prevention device and a method of manufacturing the same that can improve reliability by simultaneously forming ESD function and withstanding voltage It has its purpose.

According to an aspect of the present invention, there is provided an electric shock preventive apparatus comprising: a substrate; A capacitor and a varistor element provided on one surface of the substrate and spaced apart from each other; A plastic insert injected into the periphery of the capacitor and the varistor element from one side of the substrate to be integrally injected; And a conductive connection part connected to the outside of the plastic molded product and connected to a metal conductor which can be brought into contact with a human body of the electronic device, wherein a gap for discharging static electricity flowing through the conductive connection part is electrically connected to the varistor element And is electrically connected to the conductive connection part, and the capacitor is formed to correspond to the conductive connection part with a gap therebetween, and the capacitor is electrically connected to the conductive connection part.

Here, an external electrode may be formed on the external surface of the substrate. First and second internal electrodes formed on the inner surface of the substrate and electrically connected to the capacitor and the varistor element, respectively; And a connection electrode connecting the external electrode and the first and second internal electrodes, respectively, and the varistor element and the conductive connection portion are disposed to face each other directly with a gap of the gap through the gap.

In addition, a groove portion for exposing the capacitor to the outside is formed in the plastic molded article, and a conductive material is filled in the groove portion to connect the capacitor and the conductive connection portion.

In addition, an electrode pattern may be provided on the outer surface of the varistor element to form the bottom of the gap.

An electrode pattern may be formed on the outer surface of the capacitor and electrically connected to the conductive connection portion.

And first and second solid conductors assembled to the substrate and spaced apart from each other; An external electrode pattern formed on an outer surface of the substrate; A first internal electrode pattern formed on the inner surface of the substrate to connect the capacitor and the first solid conductor; A second internal electrode pattern formed on the inner surface of the substrate and connecting the second solid conductor and the varistor element; And a connection electrode connecting the external electrode and the first and second internal electrodes, respectively.

In addition, the gap may be formed between the second solid-state conductor and the conductive connection portion, and the plastic object may have a groove portion for exposing the first solid-state conductor to the outside, and the groove may be filled with a conductive material And connecting the first solid type conductor and the conductive connection portion.

The first solid type conductor may be disposed at the same height as the plastic molded body and directly connected to the conductive connection portion, and the gap may be formed between the second solid type conductor and the conductive connection portion.

It is also preferable that at least one of the first and second solid type conductors includes a short bar.

It is also preferable that at least one of the first and second solid type conductors is formed by filling a conductive material in a groove portion formed in the plastic molded article and curing it.

A solid-state conductor assembled to the substrate; An external electrode pattern formed on an outer surface of the substrate; A first internal electrode pattern formed on an inner surface of the substrate and connected to the capacitor; A second internal electrode pattern formed on an inner surface of the substrate and connecting the solid conductor and the varistor element; And a connection electrode connecting the external electrode and the first and second internal electrodes, respectively.

According to another aspect of the present invention, there is provided a method of manufacturing an anti-electrostatic device, including: forming an outer electrode patterned on an outer surface of a substrate; first and second inner electrodes patterned to be separated from each other on the inner surface; And a connection electrode connecting the first and second internal electrodes, respectively; Assembling a capacitor and a varistor element on the inner surface of the prepared substrate so as to be connected to the first and second internal electrodes, respectively; Injecting a plastic molding using an injection mold into the substrate to form a plastic injection molded product coupled with the capacitor and the varistor element to produce a PCB injection product; Coupling the conductive connection to the outside of the PCB injection; And cutting the conductive connection part and the PCB injection product to manufacture an electric shock prevention device for each unit.

In this case, it is preferable that the gap is formed at a position corresponding to the varistor element in the step of manufacturing the PCB.

Further, it is preferable that the step of manufacturing the PCB injection product further comprises the step of forming a groove to expose the capacitor to the outside of the plastic injection molding, and filling the groove with a conductive material.

The assembling may further include assembling a first solid conductor to be connected to the first inner electrode on the inner surface of the substrate and assembling the second solid conductor to be connected to the second inner electrode It is good to include.

Further, it is preferable that the gap is formed at a position corresponding to the second solid-state conductor in the step of manufacturing the PCB injection product.

The method may further include the step of forming the groove portion to expose the first solid type conductor to the outside of the plastic molded article in the step of manufacturing the PCB molded article, and filling the groove portion with the conductive material.

In addition, the first solid conductor may be disposed such that the first solid conductor and the conductive connector are directly connected to each other in the step of manufacturing the PCB injection product, or the plastic injector may be formed at the same height as the first solid conductor It is good.

Also, the assembling may include assembling a solid-state conductor to be connected to the second inner electrode on the inner surface of the substrate, the gap being formed at a position corresponding to the solid-state conductor, And is directly connected to the conductive connection portion.

The conductive connection portion may include conductive silicone or conductive elastic pieces bonded to the metal plate.

According to the present invention, a capacitor and a varistor element are assembled on a substrate, a cavity is integrally formed using a plastic injection mold to produce a PCB injection product, and a conductive connection portion As shown in Fig. When the voids are formed by the injection molding as described above, the voids can be formed at a desired level as compared with the prior art, and the voids can be formed to a desired size without any deviation of the voids .

Therefore, not only the ESD function is completely performed, but also the withstand voltage characteristic is improved, thereby enhancing the reliability of the product.

In addition, since it has a simple structure, the manufacturing process can be simplified, productivity can be increased, and manufacturing cost can be lowered.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded cross-sectional view of an anti-shock device according to a first embodiment of the present invention; FIG.
2 is a partially exploded perspective view showing an electric shock preventer according to a first embodiment of the present invention.
Fig. 3 is a flowchart for explaining a manufacturing process of the electric shock preventer shown in Fig. 1. Fig.
4 is a sectional view showing an electric shock preventing apparatus according to a second embodiment of the present invention.
5 is a partially separated perspective view showing the electric shock preventing device shown in FIG.
6 is a cross-sectional view illustrating an electric shock preventing apparatus according to a third embodiment of the present invention.
7 is a partially exploded perspective view showing the electric shock preventing device shown in FIG.
FIG. 8 is a sectional view showing an electric shock preventer according to a fourth embodiment of the present invention.
FIG. 9 is a partially separated perspective view showing the electric shock preventing device shown in FIG.
10 is an assembled cross-sectional view showing an electric shock preventing apparatus according to a fifth embodiment of the present invention.
11 is a partially exploded perspective view showing the electric shock preventing device shown in FIG.
12 is a perspective view showing an electric shock preventing apparatus according to a sixth embodiment of the present invention.
13 is a side view of the electric shock preventer shown in Fig.
14 is a schematic view for explaining the function of the electric shock preventer according to the embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electric shock prevention apparatus and a method of manufacturing the same according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

14, an anti-shock device 100 according to an embodiment of the present invention includes a conductive case 11 (hereinafter referred to as a 'metal conductor') that is in contact with a human body of an electronic device, a PCB module (Not shown). The detection prevention device 100 provides a discharge path for static electricity flowing from the metal conductor 11 and blocks the leakage current to the metal conductor 11 in the electronic device. In addition, the anti-shock device 100 transmits an RF signal from the metal conductor 11 to the PCB module 13.

1 and 2, the anti-shock device 100 having the above functions includes a substrate 110, a capacitor 120 disposed on the substrate 110, a varistor element 130, a substrate And a conductive connecting part 150 coupled to an outer side of the plastic molded product 140. The plastic molded product 140 is connected to the upper part of the plastic molded product 110,

The substrate 110 is electrically connected to the PCB module 13 of the electronic device 10. The external electrode 111 is patterned on the external surface and the first and second internal electrodes 112 and 113 ) Are formed. The external electrodes 111 are connected by connection electrodes 114 and 115 formed through the external and internal surfaces of the substrate 110.

The capacitor 120 is provided to be electrically connected to the internal electrode 112 and is assembled on the substrate 110 by solder printing or conductive paste and is then bonded through a reflow process or a thermosetting process, 1 internal electrode 112, as shown in FIG. The capacitor 120 passes the RF signal from the metal conductor 11 and transmits the RF signal to the PCB module 13. The capacitor 120 may be modularized in a chip form, Can be made variously. The capacitor 120 illustrated in the present invention has a structure in which connection terminals are formed at a part of the edges or corners of both ends. In the first embodiment, the connection terminals of both ends of the capacitor 120 are connected to the first internal electrode 111 As shown in FIG. A specific structure of the capacitor 120 having such a configuration can be applied to a known technology, and the specific structure thereof does not limit the present invention, so a detailed description thereof will be omitted.

The varistor element 130 is assembled on the inner surface of the substrate 110 and electrically connected to the second internal electrode 113. The varistor element 130 is provided with a gap G formed between the varistor element 130 and the conductive connection part 150 to provide a discharging path of static electricity flowing through the metal conductor 11, Thereby preventing the leakage current from leaking to the conductor 11 through the conductive connecting portion 150. The varistor element 130 may have a modular structure in the form of a chip, and a varistor having various known configurations may be applied. In other words, the specific configuration of the varistor element 130 does not limit the present invention, so that the specific configuration will be omitted. However, the varistor element 130 is assembled to the inner surface of the substrate 110 in the same manner as the capacitor 120, And is electrically coupled to the electrode 115. For example, in the varistor element 130, connection terminals are provided at a part of the edges or corners of both ends, and connection terminals of both ends are connected to the second internal terminal 113 according to the arrangement posture of the varistor element 130 , Only one of the connection terminals may be connected to the second internal terminal 113 and the other connection terminal may be exposed to the gap G or coupled to the plastic injection molding 140.

The plastic injection molding material 140 may be integrally formed by molding an inner surface of the substrate 110, that is, a surface of the surface on which the capacitor 120 and the varistor element 130 are formed, with a plastic material and filling and injection molding. It is preferable to apply a fixing adhesive such as a bond to the capacitor 120 and the varistor element 130 before the injection molding process and cure the capacitor 120 and the varistor element 130 so that the capacitor 120 and the varistor element 130 can be firmly coupled to the plastic injection molding 140. The gap G corresponding to the varistor element 130 is formed in the process of manufacturing the plastic injection molded body 140 from the injection mold, and conductive paste, conductive silicon, solder, etc. are formed on the portion corresponding to the capacitor 120 Of the conductive adhesive agent 145 is injected. That is, the cavity G and the groove 141 may be formed so as to be exposed through the outer surface of the plastic injection molding 140 in the process of molding the plastic injection molding 140 using the mold. The gap G and the groove portion 141 can be formed to a sufficient size and can be precisely formed in a desired shape and size.

When the so-called void layer forming the gap G is formed by injection molding as described above, molding can be performed at a low temperature (about 320 DEG C or so) compared with the conventional molding using a ceramic material. And can be formed to a sufficient thickness, so that ESD and withstand voltage characteristics can be solved. That is, even if a high voltage is applied, the ESD function can be normally performed by the gap G having a sufficient gap.

The conductive connection part 150 is connected to the outside of the plastic injection molding 140 and includes a conductive silicon (conductive sponge) 151 and a metal plate 153 coupled to one surface of the conductive silicon 151. The conductive silicon 151 has conductivity and is elastically deformable by an external force. A metal plate 153 is bonded to one surface of the conductive silicon 151 by a conductive epoxy film or the like. The metal plate 153 may be formed of a copper material.

The conductive connection part 150 having the above-described structure may be bonded to the outer surface of the plastic injection molding 140 in a cured state or may be connected to the conductive connection part 150 including the bond (adhesive), conductive paste, conductive epoxy, conductive film, Lt; / RTI > The metal plate 153 is electrically connected to the capacitor 120 by the various conductive joints 145 and is coupled to the varistor element 130 with the gap G therebetween.

In the electric shock preventive apparatus 100 having the above configuration, the conductive connection part 150 is connected to the metal case of the electronic device 10, that is, the metal conductor 11, and the substrate 110 is connected to the PCB module 13 So that it is installed inside the electronic device 10. The electric shock preventer 100 provided in the electronic device 10 can discharge the static electricity flowing from the metal conductor 11 through the gap G and discharge the leakage current from the inside through the varistor element 130 Leakage to the outside can be blocked. The RF signal from the outside can be transmitted to the PCB module 14 via the capacitor 120.

4 and 5, the anti-shock device 100 'according to the second embodiment of the present invention includes electrode patterns 116 and 117 on the exposed surface of the capacitor 120 and the exposed surface of the varistor element 130, respectively. ) Is provided. The electrode pattern 116 may be printed or plated on the outer surface of the capacitor 120 before the injection molding of the plastic injection molding 140. The electrode pattern 116 is exposed to the groove portion 141 after the plastic injection molding 140 is formed and connected to the conductive adhesive 145, that is, the solder or the conductive paste.

1 and 2, the connection terminals formed on both ends of the capacitor 120 and the varistor element 130 are disposed at the lower portion and the upper portion, respectively, The electrode patterns 116 and 117 can be positioned on the exposed surfaces of the capacitor 120 and the varistor element 130 as shown in FIGS.

Of course, the electrode patterns 116 and 117 may also be laminated on the outside of the varistor element 130 by printing, plating, or the like before the plastic injection molding 140 is formed.

6 and 7, according to the third embodiment of the present invention, the PCB insert 170 '' includes a capacitor 120 and a varistor (not shown) on the inner surface of the PCB 110, And the first and second solid conductors 181 and 183 are further disposed between the elements 130 and 130, respectively. The first solid type conductor 181 is provided on the substrate 110 and is electrically connected to the first internal electrode 112 and the second solid type conductor 183 is provided on the substrate 110 And is electrically connected to the second internal electrode 113. The groove 141 formed in the plastic molded article 140 is formed at a position corresponding to the first solid type conductor 181 and the gap G is formed at a position corresponding to the second solid type conductor 183 . The groove 141 is filled with a conductive adhesive 145 so that the conductive connection 150 and the first solid conductor 181 are electrically connected to each other. The second solid conductor 183 disposed to face the gap G is connected to the varistor element 130 via the second internal electrode 113 so that the static electricity flowing through the conductive connection part 150 Can be discharged through the gap G between the second solid type conductor 183 and the conductive connection part 150 and the leakage current inside the varistor element 130 can be prevented from being leaked to the outside do.

The first and second solid conductors 181 and 183 are assembled on the substrate 110 in the same manner as the capacitor 120 and the varistor element 130. 3, when the capacitor 120 and the varistor element 130 are assembled to the substrate 110 in the step S11, the first and second solid conductors 181 and 183 are also connected together Assemble. Then, the plastic molding is injected into the mold to form the trench 141 at the position corresponding to the first solid-state conductor 181 during injection molding, and the gap G corresponds to the second solid-state conductor 183 Can be formed in the same manner. That is, only the forming position of the groove 141 and the gap G is changed, and the manufacturing process can be proceeded in the same manner.

Referring to FIGS. 8 and 9, the anti-shock device 200 according to the fourth embodiment of the present invention includes a printed circuit board (PCB) 270 and a conductive connection 150. Here, the PCB injection object 270 includes a capacitor 120, a varistor element 130, first and second solid conductors 181 'and 183, which are assembled on a substrate 110, The two solid conductors 181 'and 183 are characterized by having different heights. Specifically, the first solid conductor 181 ', which is electrically connected to the capacitor 120 by the first internal electrode 112, is exposed to the outer surface of the plastic molded article 140 and is electrically connected to the conductive connection part 150 They are directly connected and connected. The second solid conductor 183 is arranged to face the conductive connection part 150 with a space between the conductive connection part 150 and the second internal electrode 113 (Not shown). The PCB injection molded body 270 having the above structure is assembled with the capacitor 120, the varistor element 130 and the first and second solid conductors 181 'and 183 on the substrate 110, Shaped conductor 181 'in the process of injecting the plastic molding by using the first solid conductor 181'. Therefore, a separate film is used between the first solid conductor 181 'and the conductive connection portion 150 to thermally cure the first solid conductor 181' and the conductive connection portion 150 so that they can be directly electrically connected.

In addition, instead of the first solid conductor 181 ', the groove may be formed in the plastic molded product 140 to a depth at which the first internal terminal 112 is exposed. Then, a conductive The paste may be filled and formed to have the same height as that of the first solid type conductor 181 'to be electrically connected to the conductive connection portion 150.

10 and 11, the electric shock protection device 200 'according to the fifth embodiment of the present invention differs from the electric shock protection device 200 according to the fourth embodiment described above in that the first solid- And the capacitor 120 is connected to the first internal electrode 112 and the outer side of the plastic injection object 140. The first internal electrode 112 and the second internal conductor 183 are connected to the varistor element 130, And is connected to the conductive connection part 150 by an electrode 116 exposed to the conductive connection part 150. The electric shock preventer 200 'having the above-described structure can be directly joined to the PCB injection object 270 by the conductive material when the PCB injection object 270 and the conductive connection part 150 are bonded. The conductive material may be a conductive film, And the like.

As described above, the solid type conductor described in the embodiments of the present invention may include a so-called short bar, and may further include a solder, a conductive paste, or the like in a groove portion formed in the plastic molded article 140 And may include a filled and cured conductor.

12 and 13, according to the sixth embodiment of the present invention, there is provided an electric shock preventive device 200 '' having a conductive connecting portion 250 coupled to the outside of the PCBs 170 and 270, A conductive elastic piece 251 having a C clip shape and a metal plate 253 coupled to a joint surface of the conductive elastic piece 251.

The conductive elastic piece 251 is a portion which is connected to the conductive outer case of the electronic device and connected thereto. The conductive elastic piece 251 is elastically contacted with the conductive outer case, that is, the metal conductor 11 when the electric device 200 " The conductive elastic piece 251 has a plate-shaped joint portion 251a to which the metal plate 253 is coupled and a metal conductor 1130 that is bent and extended at one end of the joint portion 251a And an elastic contact portion 251b elastically contacting the contact portion 251a.

The metal plate 253 may be integrally formed on the joining portion 251a, or separately formed and then joined. The connection between the metal plate 253 and the conductive elastic piece 251 may be combined using various bonding means such as heat welding, welding, bonding, and a conductive bonding film.

Further, a metal plate 255 may be further provided between the PCB projections 170 and 270 and the conductive connection portion 200 ".

The metal plate 255 may be bonded to the outer surface of the PCB injection molded product 170 or 270 with a conductive material such as a conductive film or a solder and the metal plate 253 may be electrically connected to the conductive film 250. [ Or a conductive joint such as a solder.

Of course, the elastic piece 251 may be directly joined to the metal plate 255 in a state where the metal plate 255 is joined to the outer surface of the PCBs 170 and 270. That is, either one of the two metal plates 253 and 255 may be provided, or both of them may be included.

A manufacturing process of the anti-shock devices according to various embodiments of the present invention having the above-described configuration will be described below.

3, solder or conductive paste is first printed on the PCB substrate 110, and the capacitor 120 and the varistor element 130 are assembled on the printed conductive material, (S11). Of course, the solid conductor (short bar) can be further assembled and bonded in the step S11, and a detailed description thereof has been described in detail in the second to fourth embodiments.

Next, the fixing adhesive is injected into the capacitor 120, the varistor element 130, and the short bar (solid conductor) to harden the capacitor 120 and the varistor element 130 and the short bar (Conductor) is molded with a plastic material to form the plastic injection molding 140 (S13). In the step (S13), the cavity (G) and the groove portion (141) are formed on the outer surface of the plastic molded article (140).

A conductive material such as a conductive paste is injected into the formed trench 141 to be cured (S14). When the capacitor 120 is disposed to be exposed to the outside of the plastic injection molding 140 without forming the groove 141, the capacitor 120 and the conductive connection part 150 may be directly connected to each other using the conductive epoxy film. Can be bonded.

Called PCB projections 170, 170 ', 170 ", 270, 270', 270", in which a capacitor and a varistor element are molded by a plastic material, are manufactured on the substrate 110 through the above-described processes (S10 to S14).

Next, metal plates 153 and 155 are bonded to the outer surfaces of the PCB projections 170, 170 ', 170', 270, 270 ', and 270' with an electrically conductive material (S16).

Subsequently, the conductive connecting parts 150 and 250 are prepared, and a conductive material (film) is adhered to the lower surface (bonding surface) of the conductive connecting parts 150 and 250, and the conductive connecting parts 150 and 250 to which the conductive material is adhered (S18).

The conductive connection portions 150 and 250 are thermally press-bonded or soldered together with the PCBs 170, 170 ', 170', 270, 270 ', and 270' to integrate them (S19). At this time, the conductive connection part 150 can be directly bonded to the metal plate 153. In the case of the conductive connection part 250, the metal plate 253, which is joined to the metal plate 255, They may be bonded to each other in a state in which they are pre-bonded to the pieces 251. Of course, the metal plate 253 may be omitted, and the elastic plate 151 may be directly contacted to the metal plate 255 to be integrated.

The conductive joints 150 and 250 and the PCB extrusions 170, 170 ', 170', 270, 270 ', and 270', which are bonded and bonded as described above, are cut into a predetermined size and are separated in units of the anti-shock device 100 (S20).

The characteristics and the appearance of the modularized parts are inspected (S21), and parts without abnormality are packaged and shipped (S22).

As described above, the gap G is injection-molded using the plastic injection mold in the process of manufacturing the anti-shock device according to the various embodiments of the present invention, so that the gap G is processed at a low temperature So that it is possible to solve the problem of the withstand voltage characteristic at the time of high temperature molding. Particularly, since the gap G is formed by injection molding, it is possible to form the gap of the gap G sufficiently large, and it is possible to precisely mold the gap G with the minimum error, .

In addition, since a PCB injection is manufactured using a process of injecting and molding a plastic molding using an injection mold in a state where a capacitor 120, a varistor element 130 and a short bar are assembled on a substrate 110, The process is simple, the structure of the parts is simple, and the manufacturing time can be shortened and the cost can be reduced.

Further, since the structure is simple, the process error of the product can be reduced, and a reliable component can be provided at a low cost.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Those skilled in the art will readily appreciate that many modifications and variations of the present invention are possible without departing from the spirit and scope of the appended claims.

11. Metal conductor 13 ... PCB module
100, 100, 100, 200, 200, 200,
120. Capacitor 130. Varistor element
140 .. Plastic Injection 150, 250 .. Conductive Connection
170,170 ', 170 ",270,270' .. PCB Injection
181, 181. A first solid body conductor 183. A second solid body conductor

Claims

Board;
A capacitor and a varistor element provided on one surface of the substrate and spaced apart from each other;
A plastic insert injected into the periphery of the capacitor and the varistor element from one side of the substrate to be integrally injected;
And a conductive connection part connected to the outside of the plastic molded article and connected to a metal conductor which can be contacted with human body of the electronic device,
Wherein a gap for discharging static electricity flowing through the conductive connection portion is electrically connected to the varistor element and is formed to correspond to the conductive connection portion with a gap therebetween,
Wherein the capacitor is electrically connected to the conductive connection portion.

The method according to claim 1,
An external electrode pattern formed on an outer surface of the substrate;
First and second internal electrodes formed on the inner surface of the substrate and electrically connected to the capacitor and the varistor element, respectively; And
And a connection electrode connecting the external electrode and the first and second internal electrodes, respectively,
And the varistor element and the conductive connection portion are disposed to face each other with a gap of the gap through the gap.

3. The method of claim 2,
Wherein the plastic molded body has a groove portion for exposing the capacitor to the outside,
Wherein the groove is filled with a conductive material to connect the capacitor and the conductive connection portion.

4. The method according to any one of claims 1 to 3,
And an electrode pattern is formed on an outer surface of the varistor element to form a bottom of the gap.

The apparatus according to claim 4, wherein an electrode pattern is formed on an outer surface of the capacitor to electrically connect the conductive connection portion.

The method according to claim 1,
First and second solid conductors assembled to the substrate and spaced apart from each other;
An external electrode pattern formed on an outer surface of the substrate;
A first internal electrode pattern formed on the inner surface of the substrate to connect the capacitor and the first solid conductor;
A second internal electrode pattern formed on the inner surface of the substrate and connecting the second solid conductor and the varistor element;
And a connection electrode connecting the external electrode and the first and second internal electrodes, respectively.

The method according to claim 6,
Said gap being formed between said second solid conductor and said conductive connection,
Wherein the plastic molded body has a groove portion for exposing the first solid body conductor to the outside,
Wherein the groove portion is filled with a conductive material to connect the first solid type conductor and the conductive connection portion.

The method according to claim 6,
Wherein the first solid body conductor is disposed at the same height as the plastic injection body and is directly connected to the conductive connection portion,
Wherein the gap is formed between the second solid-state conductor and the conductive connection portion.

The method according to claim 6,
And at least one of the first and second solid type conductors includes a short bar.

The method according to claim 6,
Wherein at least one of the first and second solid type conductors is formed by curing a conductive material filled in a groove formed in the plastic molded article.

The method according to claim 1,
A solid-state conductor assembled to the substrate;
An external electrode pattern formed on an outer surface of the substrate;
A first internal electrode pattern formed on an inner surface of the substrate and connected to the capacitor;
A second internal electrode pattern formed on an inner surface of the substrate and connecting the solid conductor and the varistor element;
And a connection electrode connecting the external electrode and the first and second internal electrodes, respectively.

A step of preparing a substrate having external electrodes patterned on the external surface of the substrate, first and second internal electrodes patterned to be separated from each other on the internal surface, and connection electrodes connecting the external electrode and the first and second internal electrodes, ;
Assembling a capacitor and a varistor element on the inner surface of the prepared substrate so as to be connected to the first and second internal electrodes, respectively;
Injecting a plastic molding using an injection mold into the substrate to form a plastic injection molded product coupled with the capacitor and the varistor element to produce a PCB injection product;
Coupling the conductive connection to the outside of the PCB injection;
And cutting the conductive connection portion and the PCB injection product to manufacture an electric shock preventive device for each unit.

13. The method of claim 12,
Wherein the cavity is formed at a position corresponding to the varistor element in the step of manufacturing the PCB injection product.

The method according to claim 12 or 13,
In the step of manufacturing the PCB injection molding, a groove is formed to expose the capacitor to the outside of the plastic injection molding,
The method of claim 1, further comprising filling the groove with a conductive material.

13. The method of claim 12,
Assembling a first solid type conductor to be connected to the first internal electrode on the inner surface of the substrate and assembling a second solid type conductor to be connected to the second internal electrode, / RTI >

16. The method of claim 15,
And forming a gap at a position corresponding to the second solid type conductor in the step of manufacturing the PCB injection product.

17. The method of claim 16,
A step of forming the groove portion so as to expose the first solid type conductor to the outside of the plastic molded article in the PCB molded product manufacturing step,
The method of claim 1, further comprising filling the groove with a conductive material.

17. The method of claim 16,
Wherein the first solid conductor is disposed such that the first solid conductor and the conductive connector are directly connected to each other in the PCB injection product manufacturing step or the plastic injection molding is formed at the same height as the first solid conductor Wherein said method comprises the steps of:

13. The method of claim 12,
A solid-state conductor is assembled to the inner surface of the substrate so as to be connected to the second internal electrode, the gap is formed at a position corresponding to the solid-
Wherein the capacitor is disposed so as to be exposed to the outside of the plastic molded article and to be directly connected to the conductive connection portion.

14. The method as claimed in claim 12 or 13,
Wherein the conductive plate includes conductive silicon or conductive elastic pieces joined to the metal plate.