KR101838685B1 - An apparatus for preventing electric shock and method the same - Google Patents
An apparatus for preventing electric shock and method the same Download PDFInfo
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- KR101838685B1 KR101838685B1 KR1020160179349A KR20160179349A KR101838685B1 KR 101838685 B1 KR101838685 B1 KR 101838685B1 KR 1020160179349 A KR1020160179349 A KR 1020160179349A KR 20160179349 A KR20160179349 A KR 20160179349A KR 101838685 B1 KR101838685 B1 KR 101838685B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/6485—Electrostatic discharge protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6616—Structural association with built-in electrical component with built-in single component with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0079—Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Thermistors And Varistors (AREA)
Abstract
A plastic injector which is integrally injected and formed around the capacitor and the varistor element on one side of the substrate, a capacitor connected to the outside of the plastic injector, Wherein a cavity for discharging the static electricity introduced through the conductive connection portion is electrically connected to the varistor element and a conductive connection portion is formed to correspond to the gap between the conductive connection portion and the conductive connection portion, And an electric shock prevention device and a method of manufacturing the same.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric shock preventer, and more particularly, to an electric shock preventer that protects a user from a leakage current by a power source and protects an internal circuit from external static electricity, and a method of manufacturing the same.
Recently, portable electronic devices are installed in a variety of internal parts in accordance with miniaturization, weight reduction, and multifunctionality. Such a portable electronic device is very sensitive to external impact, so it is enclosed by a rigid housing to protect components such as an internal electronic circuit from an external impact.
In recent years, the adoption of metal housing has been increasing to improve the aesthetics and robustness of electronic devices. Since the metal housing is excellent in electrical conductivity due to the nature of the material, an electrical path can be formed between the housing and the built-in PCB module depending on the specific device or the part. Therefore, when a static electricity having a high voltage instantly flows into the built-in PCB module through a metal conductor such as a metal housing having a large exposed surface area, a PCB module such as an IC or the like may be damaged.
On the other hand, a portable electronic device usually uses a charger to charge the battery. The charger rectifies an external AC power source to a DC power source, and then converts the AC power to a low DC power source suitable for a portable electronic device through a transformer. Here, a Y-CAP composed of a capacitor is installed at both ends of the transformer in order to enhance the electrical insulation of the transformer.
However, when the Y-CAP does not have the normal characteristics, such as a non-genuine charger, the DC power may not be sufficiently blocked by the Y-CAP, and a leakage current may be generated by the AC power source. Can be propagated along.
As described above, since the leakage current can be transmitted to the metal conductor which can be brought into contact with the human body like the external housing (case) of the portable electric apparatus, it can give the user an uncomfortable feeling of crushing. In severe cases, You can get fatal.
Therefore, an electronic device such as a cell phone using a metal housing is required to protect the user from such a leakage current.
In view of the above, researches on an electric shock protection device for protecting the user from leakage current as well as external static electricity have been actively conducted recently. For example, Korean Patent No. 10 -1585604 and 10-1608226.
According to the conventional techniques, in the process of forming the body of the device by laminating the sheet layers of the ceramic material in a multilayer structure, electrode patterns are laminated to form internal electrodes, and voids are formed between the internal electrodes Thereby forming a capacitor or an electric shock protection unit (varistor function) having an electrostatic discharge (ESD) function.
However, since the conventional electric shock protection device having such a structure has a high sintering temperature (900 to 1200 ° C) and a thin interlayer thickness due to the characteristics of materials, the ceramic material has pores formed in the process of laminating a body with a ceramic material. It is difficult to ensure stability in ESD and withstand voltage characteristics because the accuracy of the gap is lowered and deviation is large.
Thus, there is a problem that the ESD protection function of the prior art is difficult to completely perform due to the material and the structural problem. That is, according to the related art, when a high voltage (10 kV) or more is applied, the capacitor absorbs the voltage and can not flow down to the ground, so that the ESD function can not be performed. That is, in order to solve the EDS function and the withstand voltage characteristic, the pore shape, height and precision are very important. According to the conventional technique formed by lamination with a ceramic material, the thickness of the ceramic material is increased, It is required to have electrical characteristics that can withstand the withstand voltage of 350 Vdc (V 1 mA) or more. However, the electric shock protection device formed of the conventional ceramic material has a limitation in the function of the varistor.
In addition, according to the conventional technology, when the ceramic material is adapted to various layers, a capacitor layer is formed by stacking electrode patterns between the ceramic layers in a printed manner, and a varistor layer must be formed between the capacitor layers The structure is complicated, and the manufacturing process becomes complicated thereby leading to a deterioration in productivity, an increase in cost, an increase in the probability of occurrence of errors in the process, and a reliability of the product is deteriorated.
Meanwhile, the portable electronic apparatus having the metal housing is provided with a plurality of antennas according to function, and at least a part of the antennas is an internal antenna. The portable electronic apparatus is disposed in an external housing of the portable electronic apparatus, It is a tendency to use itself as an antenna.
In this case, the internal circuit of the antenna and the portable electronic device must be connected. In this case, the communication signal must be smoothly transmitted to the internal circuit without attenuation.
However, as described above, when the capacitance of a corresponding device is increased to effectively transmit a communication signal, there is a problem that the device is destroyed by external static electricity, and the device is damaged.
Moreover, as described above, the implementation of a high breakdown voltage for interrupting the leakage current by an external power source and the implementation of a high capacitance for transmitting a communication signal are difficult to achieve due to the mutually contradictory effects, There is a demand for a method capable of implementing a high capacitance at the same time as blocking the leakage current.
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide an electric shock prevention device and a method of manufacturing the same that can improve reliability by simultaneously forming ESD function and withstanding voltage It has its purpose.
According to an aspect of the present invention, there is provided an electric shock preventive apparatus comprising: a substrate; A capacitor and a varistor element provided on one surface of the substrate and spaced apart from each other; A plastic insert injected into the periphery of the capacitor and the varistor element from one side of the substrate to be integrally injected; And a conductive connection part connected to the outside of the plastic molded product and connected to a metal conductor which can be brought into contact with a human body of the electronic device, wherein a gap for discharging static electricity flowing through the conductive connection part is electrically connected to the varistor element And is electrically connected to the conductive connection part, and the capacitor is formed to correspond to the conductive connection part with a gap therebetween, and the capacitor is electrically connected to the conductive connection part.
Here, an external electrode may be formed on the external surface of the substrate. First and second internal electrodes formed on the inner surface of the substrate and electrically connected to the capacitor and the varistor element, respectively; And a connection electrode connecting the external electrode and the first and second internal electrodes, respectively, and the varistor element and the conductive connection portion are disposed to face each other directly with a gap of the gap through the gap.
In addition, a groove portion for exposing the capacitor to the outside is formed in the plastic molded article, and a conductive material is filled in the groove portion to connect the capacitor and the conductive connection portion.
In addition, an electrode pattern may be provided on the outer surface of the varistor element to form the bottom of the gap.
An electrode pattern may be formed on the outer surface of the capacitor and electrically connected to the conductive connection portion.
And first and second solid conductors assembled to the substrate and spaced apart from each other; An external electrode pattern formed on an outer surface of the substrate; A first internal electrode pattern formed on the inner surface of the substrate to connect the capacitor and the first solid conductor; A second internal electrode pattern formed on the inner surface of the substrate and connecting the second solid conductor and the varistor element; And a connection electrode connecting the external electrode and the first and second internal electrodes, respectively.
In addition, the gap may be formed between the second solid-state conductor and the conductive connection portion, and the plastic object may have a groove portion for exposing the first solid-state conductor to the outside, and the groove may be filled with a conductive material And connecting the first solid type conductor and the conductive connection portion.
The first solid type conductor may be disposed at the same height as the plastic molded body and directly connected to the conductive connection portion, and the gap may be formed between the second solid type conductor and the conductive connection portion.
It is also preferable that at least one of the first and second solid type conductors includes a short bar.
It is also preferable that at least one of the first and second solid type conductors is formed by filling a conductive material in a groove portion formed in the plastic molded article and curing it.
A solid-state conductor assembled to the substrate; An external electrode pattern formed on an outer surface of the substrate; A first internal electrode pattern formed on an inner surface of the substrate and connected to the capacitor; A second internal electrode pattern formed on an inner surface of the substrate and connecting the solid conductor and the varistor element; And a connection electrode connecting the external electrode and the first and second internal electrodes, respectively.
According to another aspect of the present invention, there is provided a method of manufacturing an anti-electrostatic device, including: forming an outer electrode patterned on an outer surface of a substrate; first and second inner electrodes patterned to be separated from each other on the inner surface; And a connection electrode connecting the first and second internal electrodes, respectively; Assembling a capacitor and a varistor element on the inner surface of the prepared substrate so as to be connected to the first and second internal electrodes, respectively; Injecting a plastic molding using an injection mold into the substrate to form a plastic injection molded product coupled with the capacitor and the varistor element to produce a PCB injection product; Coupling the conductive connection to the outside of the PCB injection; And cutting the conductive connection part and the PCB injection product to manufacture an electric shock prevention device for each unit.
In this case, it is preferable that the gap is formed at a position corresponding to the varistor element in the step of manufacturing the PCB.
Further, it is preferable that the step of manufacturing the PCB injection product further comprises the step of forming a groove to expose the capacitor to the outside of the plastic injection molding, and filling the groove with a conductive material.
The assembling may further include assembling a first solid conductor to be connected to the first inner electrode on the inner surface of the substrate and assembling the second solid conductor to be connected to the second inner electrode It is good to include.
Further, it is preferable that the gap is formed at a position corresponding to the second solid-state conductor in the step of manufacturing the PCB injection product.
The method may further include the step of forming the groove portion to expose the first solid type conductor to the outside of the plastic molded article in the step of manufacturing the PCB molded article, and filling the groove portion with the conductive material.
In addition, the first solid conductor may be disposed such that the first solid conductor and the conductive connector are directly connected to each other in the step of manufacturing the PCB injection product, or the plastic injector may be formed at the same height as the first solid conductor It is good.
Also, the assembling may include assembling a solid-state conductor to be connected to the second inner electrode on the inner surface of the substrate, the gap being formed at a position corresponding to the solid-state conductor, And is directly connected to the conductive connection portion.
The conductive connection portion may include conductive silicone or conductive elastic pieces bonded to the metal plate.
According to the present invention, a capacitor and a varistor element are assembled on a substrate, a cavity is integrally formed using a plastic injection mold to produce a PCB injection product, and a conductive connection portion As shown in Fig. When the voids are formed by the injection molding as described above, the voids can be formed at a desired level as compared with the prior art, and the voids can be formed to a desired size without any deviation of the voids .
Therefore, not only the ESD function is completely performed, but also the withstand voltage characteristic is improved, thereby enhancing the reliability of the product.
In addition, since it has a simple structure, the manufacturing process can be simplified, productivity can be increased, and manufacturing cost can be lowered.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded cross-sectional view of an anti-shock device according to a first embodiment of the present invention; FIG.
2 is a partially exploded perspective view showing an electric shock preventer according to a first embodiment of the present invention.
Fig. 3 is a flowchart for explaining a manufacturing process of the electric shock preventer shown in Fig. 1. Fig.
4 is a sectional view showing an electric shock preventing apparatus according to a second embodiment of the present invention.
5 is a partially separated perspective view showing the electric shock preventing device shown in FIG.
6 is a cross-sectional view illustrating an electric shock preventing apparatus according to a third embodiment of the present invention.
7 is a partially exploded perspective view showing the electric shock preventing device shown in FIG.
FIG. 8 is a sectional view showing an electric shock preventer according to a fourth embodiment of the present invention.
FIG. 9 is a partially separated perspective view showing the electric shock preventing device shown in FIG.
10 is an assembled cross-sectional view showing an electric shock preventing apparatus according to a fifth embodiment of the present invention.
11 is a partially exploded perspective view showing the electric shock preventing device shown in FIG.
12 is a perspective view showing an electric shock preventing apparatus according to a sixth embodiment of the present invention.
13 is a side view of the electric shock preventer shown in Fig.
14 is a schematic view for explaining the function of the electric shock preventer according to the embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electric shock prevention apparatus and a method of manufacturing the same according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.
14, an
1 and 2, the
The
The
The
The plastic
When the so-called void layer forming the gap G is formed by injection molding as described above, molding can be performed at a low temperature (about 320 DEG C or so) compared with the conventional molding using a ceramic material. And can be formed to a sufficient thickness, so that ESD and withstand voltage characteristics can be solved. That is, even if a high voltage is applied, the ESD function can be normally performed by the gap G having a sufficient gap.
The
The
In the electric shock
4 and 5, the anti-shock device 100 'according to the second embodiment of the present invention includes
1 and 2, the connection terminals formed on both ends of the
Of course, the
6 and 7, according to the third embodiment of the present invention, the PCB insert 170 '' includes a
The first and second
Referring to FIGS. 8 and 9, the
In addition, instead of the first solid conductor 181 ', the groove may be formed in the plastic molded
10 and 11, the electric shock protection device 200 'according to the fifth embodiment of the present invention differs from the electric
As described above, the solid type conductor described in the embodiments of the present invention may include a so-called short bar, and may further include a solder, a conductive paste, or the like in a groove portion formed in the plastic molded
12 and 13, according to the sixth embodiment of the present invention, there is provided an electric shock preventive device 200 '' having a conductive connecting
The conductive elastic piece 251 is a portion which is connected to the conductive outer case of the electronic device and connected thereto. The conductive elastic piece 251 is elastically contacted with the conductive outer case, that is, the
The
Further, a
The
Of course, the elastic piece 251 may be directly joined to the
A manufacturing process of the anti-shock devices according to various embodiments of the present invention having the above-described configuration will be described below.
3, solder or conductive paste is first printed on the
Next, the fixing adhesive is injected into the
A conductive material such as a conductive paste is injected into the formed
Called
Next,
Subsequently, the conductive connecting
The
The
The characteristics and the appearance of the modularized parts are inspected (S21), and parts without abnormality are packaged and shipped (S22).
As described above, the gap G is injection-molded using the plastic injection mold in the process of manufacturing the anti-shock device according to the various embodiments of the present invention, so that the gap G is processed at a low temperature So that it is possible to solve the problem of the withstand voltage characteristic at the time of high temperature molding. Particularly, since the gap G is formed by injection molding, it is possible to form the gap of the gap G sufficiently large, and it is possible to precisely mold the gap G with the minimum error, .
In addition, since a PCB injection is manufactured using a process of injecting and molding a plastic molding using an injection mold in a state where a
Further, since the structure is simple, the process error of the product can be reduced, and a reliable component can be provided at a low cost.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Those skilled in the art will readily appreciate that many modifications and variations of the present invention are possible without departing from the spirit and scope of the appended claims.
11.
100, 100, 100, 200, 200, 200,
120.
140 ..
170,170 ', 170 ",270,270' .. PCB Injection
181, 181. A first
Claims (20)
A capacitor and a varistor element provided on one surface of the substrate and spaced apart from each other;
A plastic insert injected into the periphery of the capacitor and the varistor element from one side of the substrate to be integrally injected;
And a conductive connection part connected to the outside of the plastic molded article and connected to a metal conductor which can be contacted with human body of the electronic device,
Wherein a gap for discharging static electricity flowing through the conductive connection portion is electrically connected to the varistor element and is formed to correspond to the conductive connection portion with a gap therebetween,
Wherein the capacitor is electrically connected to the conductive connection portion.
An external electrode pattern formed on an outer surface of the substrate;
First and second internal electrodes formed on the inner surface of the substrate and electrically connected to the capacitor and the varistor element, respectively; And
And a connection electrode connecting the external electrode and the first and second internal electrodes, respectively,
And the varistor element and the conductive connection portion are disposed to face each other with a gap of the gap through the gap.
Wherein the plastic molded body has a groove portion for exposing the capacitor to the outside,
Wherein the groove is filled with a conductive material to connect the capacitor and the conductive connection portion.
And an electrode pattern is formed on an outer surface of the varistor element to form a bottom of the gap.
First and second solid conductors assembled to the substrate and spaced apart from each other;
An external electrode pattern formed on an outer surface of the substrate;
A first internal electrode pattern formed on the inner surface of the substrate to connect the capacitor and the first solid conductor;
A second internal electrode pattern formed on the inner surface of the substrate and connecting the second solid conductor and the varistor element;
And a connection electrode connecting the external electrode and the first and second internal electrodes, respectively.
Said gap being formed between said second solid conductor and said conductive connection,
Wherein the plastic molded body has a groove portion for exposing the first solid body conductor to the outside,
Wherein the groove portion is filled with a conductive material to connect the first solid type conductor and the conductive connection portion.
Wherein the first solid body conductor is disposed at the same height as the plastic injection body and is directly connected to the conductive connection portion,
Wherein the gap is formed between the second solid-state conductor and the conductive connection portion.
And at least one of the first and second solid type conductors includes a short bar.
Wherein at least one of the first and second solid type conductors is formed by curing a conductive material filled in a groove formed in the plastic molded article.
A solid-state conductor assembled to the substrate;
An external electrode pattern formed on an outer surface of the substrate;
A first internal electrode pattern formed on an inner surface of the substrate and connected to the capacitor;
A second internal electrode pattern formed on an inner surface of the substrate and connecting the solid conductor and the varistor element;
And a connection electrode connecting the external electrode and the first and second internal electrodes, respectively.
Assembling a capacitor and a varistor element on the inner surface of the prepared substrate so as to be connected to the first and second internal electrodes, respectively;
Injecting a plastic molding using an injection mold into the substrate to form a plastic injection molded product coupled with the capacitor and the varistor element to produce a PCB injection product;
Coupling the conductive connection to the outside of the PCB injection;
And cutting the conductive connection portion and the PCB injection product to manufacture an electric shock preventive device for each unit.
Wherein the cavity is formed at a position corresponding to the varistor element in the step of manufacturing the PCB injection product.
In the step of manufacturing the PCB injection molding, a groove is formed to expose the capacitor to the outside of the plastic injection molding,
The method of claim 1, further comprising filling the groove with a conductive material.
Assembling a first solid type conductor to be connected to the first internal electrode on the inner surface of the substrate and assembling a second solid type conductor to be connected to the second internal electrode, / RTI >
And forming a gap at a position corresponding to the second solid type conductor in the step of manufacturing the PCB injection product.
A step of forming the groove portion so as to expose the first solid type conductor to the outside of the plastic molded article in the PCB molded product manufacturing step,
The method of claim 1, further comprising filling the groove with a conductive material.
Wherein the first solid conductor is disposed such that the first solid conductor and the conductive connector are directly connected to each other in the PCB injection product manufacturing step or the plastic injection molding is formed at the same height as the first solid conductor Wherein said method comprises the steps of:
A solid-state conductor is assembled to the inner surface of the substrate so as to be connected to the second internal electrode, the gap is formed at a position corresponding to the solid-
Wherein the capacitor is disposed so as to be exposed to the outside of the plastic molded article and to be directly connected to the conductive connection portion.
Wherein the conductive plate includes conductive silicon or conductive elastic pieces joined to the metal plate.
Priority Applications (2)
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KR1020160179349A KR101838685B1 (en) | 2016-08-30 | 2016-12-26 | An apparatus for preventing electric shock and method the same |
PCT/KR2016/015335 WO2018043840A1 (en) | 2016-08-30 | 2016-12-27 | Electric shock protection device and manufacturing method therefor |
Applications Claiming Priority (3)
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KR1020160110909 | 2016-08-30 | ||
KR20160110909 | 2016-08-30 | ||
KR1020160179349A KR101838685B1 (en) | 2016-08-30 | 2016-12-26 | An apparatus for preventing electric shock and method the same |
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KR20180025103A KR20180025103A (en) | 2018-03-08 |
KR101838685B1 true KR101838685B1 (en) | 2018-03-14 |
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KR1020160179349A KR101838685B1 (en) | 2016-08-30 | 2016-12-26 | An apparatus for preventing electric shock and method the same |
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WO (1) | WO2018043840A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100270549A1 (en) | 2008-07-02 | 2010-10-28 | Stats Chippac, Ltd. | Semiconductor Device and Method of Providing Electrostatic Discharge Protection for Integrated Passive Devices |
KR101608226B1 (en) | 2014-11-20 | 2016-04-14 | 주식회사 아모텍 | Circuit protection device and mobile electronic device with the same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090037099A (en) * | 2007-10-11 | 2009-04-15 | 주식회사 이노칩테크놀로지 | Laminated chip element |
KR101012965B1 (en) * | 2008-10-20 | 2011-02-08 | 주식회사 아모텍 | Complex device |
KR20150135909A (en) * | 2014-05-26 | 2015-12-04 | 삼성전기주식회사 | Composite electronic component, manufacturing method thereof, board for mounting the same and packing unit thereof |
-
2016
- 2016-12-26 KR KR1020160179349A patent/KR101838685B1/en active IP Right Grant
- 2016-12-27 WO PCT/KR2016/015335 patent/WO2018043840A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100270549A1 (en) | 2008-07-02 | 2010-10-28 | Stats Chippac, Ltd. | Semiconductor Device and Method of Providing Electrostatic Discharge Protection for Integrated Passive Devices |
KR101608226B1 (en) | 2014-11-20 | 2016-04-14 | 주식회사 아모텍 | Circuit protection device and mobile electronic device with the same |
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WO2018043840A1 (en) | 2018-03-08 |
KR20180025103A (en) | 2018-03-08 |
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