KR101838043B1 - Transparent electronic device and method for manufacturing the same - Google Patents
Transparent electronic device and method for manufacturing the same Download PDFInfo
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- KR101838043B1 KR101838043B1 KR1020150149549A KR20150149549A KR101838043B1 KR 101838043 B1 KR101838043 B1 KR 101838043B1 KR 1020150149549 A KR1020150149549 A KR 1020150149549A KR 20150149549 A KR20150149549 A KR 20150149549A KR 101838043 B1 KR101838043 B1 KR 101838043B1
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- 238000000034 method Methods 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 118
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000012044 organic layer Substances 0.000 claims abstract description 28
- 238000002347 injection Methods 0.000 claims description 23
- 239000007924 injection Substances 0.000 claims description 23
- 239000010409 thin film Substances 0.000 claims description 14
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 9
- 230000005525 hole transport Effects 0.000 claims description 8
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 7
- 239000011368 organic material Substances 0.000 claims description 5
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 5
- 229910001923 silver oxide Inorganic materials 0.000 claims description 5
- 238000002207 thermal evaporation Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 229910000476 molybdenum oxide Inorganic materials 0.000 claims description 4
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims description 4
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 claims description 4
- 229910001930 tungsten oxide Inorganic materials 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract 1
- 238000000605 extraction Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 8
- 239000004417 polycarbonate Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 229920000515 polycarbonate Polymers 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 229910052791 calcium Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000001939 inductive effect Effects 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910016036 BaF 2 Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical compound C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 2
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 1
- BNIUBQUDMPRXLZ-UHFFFAOYSA-N C(CCC)C1=CC=C(C=C1)NC1=CC=C(C=C1)N(C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound C(CCC)C1=CC=C(C=C1)NC1=CC=C(C=C1)N(C1=CC=CC=C1)C1=CC=CC=C1 BNIUBQUDMPRXLZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- MCEWYIDBDVPMES-UHFFFAOYSA-N [60]pcbm Chemical compound C123C(C4=C5C6=C7C8=C9C%10=C%11C%12=C%13C%14=C%15C%16=C%17C%18=C(C=%19C=%20C%18=C%18C%16=C%13C%13=C%11C9=C9C7=C(C=%20C9=C%13%18)C(C7=%19)=C96)C6=C%11C%17=C%15C%13=C%15C%14=C%12C%12=C%10C%10=C85)=C9C7=C6C2=C%11C%13=C2C%15=C%12C%10=C4C23C1(CCCC(=O)OC)C1=CC=CC=C1 MCEWYIDBDVPMES-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000000025 interference lithography Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- ATGUVEKSASEFFO-UHFFFAOYSA-N p-aminodiphenylamine Chemical compound C1=CC(N)=CC=C1NC1=CC=CC=C1 ATGUVEKSASEFFO-UHFFFAOYSA-N 0.000 description 1
- 239000004038 photonic crystal Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Classifications
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- H01L51/5203—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/413—Nanosized electrodes, e.g. nanowire electrodes comprising one or a plurality of nanowires
-
- H01L51/424—
-
- H01L51/5088—
-
- H01L51/5262—
-
- H01L51/56—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Electroluminescent Light Sources (AREA)
- Photovoltaic Devices (AREA)
Abstract
The present invention provides a semiconductor device comprising: a substrate; A stripe-shaped nano-auxiliary electrode repeatedly formed on the upper surface of the substrate at a predetermined distance; An ultra-thin metal electrode formed on an upper surface of the substrate and the nano-assist electrode; An organic layer formed on the upper surface of the ultra thin metal electrode; And a cathode layer formed on an upper surface of the organic layer, wherein the ultra-thin metal electrode includes a seed layer and a metal layer, and a method of manufacturing the same.
Description
The present invention relates to a transparent electronic device and a method of manufacturing the same. More particularly, the present invention relates to a transparent electronic device and a manufacturing method thereof. More particularly, the present invention relates to a transparent electronic device and a method of manufacturing the same. The present invention relates to a transparent electronic device which can be easily used in a flexible substrate and can maximize a light extraction effect by inducing a surface plasmon mode due to an ultra-thin metal film, and a manufacturing method thereof.
Transparent electronic devices are devices that have the purpose of eliminating the spatial / visual constraints of existing electronic devices using transparent characteristics. Transparent electronic devices are used in transparent devices that can be manufactured by actively utilizing transparency. They are used in a wide range of industries including optical and electronic products (displays, solar cells, smart windows, other, wearable devices) And so on. Accordingly, studies on transparent electronic devices have been actively conducted.
In the organic light emitting diode (OLED), one of the transparent electronic devices, only 20% of the emitted light is emitted to the outside, and 80% of the light is emitted from the glass or the transparent conductive substrate (ITO) constituting the organic light emitting diode and the organic layer, The efficiency of the diode is low.
In order to improve the light extraction efficiency of organic light emitting diodes (OLED), a microlens array is attached to the outside of the glass substrate, a scattering layer is coated, or a glass substrate mode light is extracted using a high refractive index glass substrate In order to improve light extraction efficiency of a waveguide mode between a transparent electrode such as ITO (Indium Tin Oxide) and an organic layer in which more light is trapped, a scattering layer may be interposed between the transparent electrode and the glass substrate, A method of introducing a photonic crystal structure having a size and an arrangement interval has been attempted. Also, a method of making the device itself into a corrugated structure or a wrinkled structure has been proposed. Also, a technique for forming an auxiliary electrode for improving a voltage drop phenomenon of an organic light emitting diode has been proposed.
Disclosure of the Invention The present invention has been made to solve the above problems of the prior art, and it is an object of the present invention to provide an ultra-thin metal film as a transparent electrode in order to maximize a light extraction effect by inducing a surface plasmon mode, And an object of the present invention is to provide a transparent electronic device and a manufacturing method thereof.
According to an aspect of the present invention, there is provided a transparent electronic device comprising: a substrate; A stripe-shaped nano-auxiliary electrode repeatedly formed on the upper surface of the substrate at a predetermined distance; An ultra-thin metal electrode formed on an upper surface of the substrate and the nano-assist electrode; An organic layer formed on the upper surface of the ultra thin metal electrode; And a cathode layer formed on an upper surface of the organic layer, wherein the ultra-thin metal electrode includes a seed layer and a metal layer.
At this time, the nano-auxiliary electrode may be formed at a period of 100 to 1000 nm.
The seed layer may be formed of at least one selected from the group consisting of Al, Ca, and Au.
The metal layer may be formed of a metal including Ag.
Further, a hole injection layer formed between the ultra-thin metal electrode and the organic layer may be further included.
Meanwhile, the hole injection layer may be formed of at least one selected from the group consisting of molybdenum oxide, zinc oxide, silver oxide, nickel oxide, and tungsten oxide.
The organic layer may have a structure in which a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injecting layer are sequentially stacked.
The organic layer may be composed of an organic material for a solar cell including a hole transport layer, a photoactive layer, an electron transport layer, and an electron injection layer.
According to another aspect of the present invention, there is provided a method of manufacturing a transparent electronic device, comprising: forming a nano-auxiliary electrode by patterning a high-conductive material on a substrate (step a); Forming an ultra-thin metal electrode on an upper surface of the substrate and the nano-assist electrode (step b); Forming an organic layer on the upper surface of the ultra-thin metal electrode (step c); And forming a cathode layer on an upper surface of the organic layer (step d), wherein the ultra-thin metal electrode forming step includes a seed layer forming step and a metal layer forming step.
The step a may be performed by a method of forming a stripe-shaped nano-auxiliary electrode at a period of 100 to 1000 nm.
The step b may be performed by a vacuum thermal deposition method.
The seed layer forming step may be performed by forming a thin film of at least one selected from the group consisting of Al, Ca and Au.
The metal layer forming step may be performed by forming a thin film using Ag.
And forming a hole injection layer between the step b and the step c.
The hole injection layer forming step may be performed by forming a thin film of at least one selected from the group consisting of molybdenum oxide, zinc oxide, silver oxide, nickel oxide, and tungsten oxide.
The step c may be performed by sequentially laminating a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injecting layer.
The step c may be performed by a method of forming an organic layer using an organic material for a solar cell including a hole transport layer, a photoactive layer, an electron transport layer, and an electron injection layer.
According to the present invention, the problem of the conventional ITO electrode can be solved by realizing an ultra-thin metal film as a transparent electrode. Specifically, since the conventional ITO electrode has a weak mechanical strength and is easily broken, there is a problem that the surface resistance of the electrode increases as the electrode substrate for a flexible display is warped. However, the ultra-thin metal film has a very strong mechanical strength, The flexible substrate can be easily used. Also, by realizing an ultra-thin metal film as a transparent electrode, light extraction efficiency can be remarkably improved.
In addition, the transparent electronic device according to the present invention can be widely used in electronic fields such as LCD front electrodes, OLED electrodes, displays, touch screens, solar cells, and optoelectronic devices.
1 is a schematic view showing a cross-sectional structure of a transparent electronic device according to an embodiment of the present invention.
2A to 2E are cross-sectional views illustrating a method of manufacturing a transparent electronic device according to an embodiment of the present invention.
3 is an SEM image of an Al (1 nm) / Ag structure and an Ag single structure thin film.
FIG. 4 is a graph of light transmittance of Al (1 nm) / Ag structure and Ag single structure thin film.
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. The shape and the size of the elements in the drawings may be exaggerated for clarity and the same elements are denoted by the same reference numerals in the drawings.
And throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "electrically connected" with another part in between. Also, when a component is referred to as " comprising "or" comprising ", it does not exclude other components unless specifically stated to the contrary .
FIG. 1 is a cross-sectional view of a transparent electronic device according to an embodiment of the present invention, and FIGS. 2A to 2E are views illustrating a method of manufacturing a transparent electronic device according to an embodiment of the present invention. The transparent
First, referring to FIGS. 1 and 2A, the nano-
The nano-
As shown in FIGS. 1, 2B and 2C, an
The thickness of the
The seed layer may include at least one selected from the group consisting of Al, Ca, and Au. By including a seed layer in the ultra-thin metal electrode, excellent smoothness and continuity of the thin film can be realized, and ultimately the light transmittance can be dramatically increased.
The metal layer may be made of silver (Ag).
1 and 2D, the transparent
On the other hand, as shown in FIGS. 1 and 2E, the
The hole transporting layer may be formed of at least one selected from the group consisting of poly (9,9-dioctylfluorene-co-bis-N, N '- (4-butylphenyl) (9,9-dioctylfluorene-co-bis-N, N'- (4-butylphenyl) -bis-N, N'-phenyl-1,4-phenylenediamine), PEDOT: poly (styrenesulfonate) -doped poly 3,4-ethylenedioxythiophene) or a p-type metal oxide (NiO, WO 3, etc.), but the present invention is not limited thereto.
The light emitting layer may be composed of a spirofluorene-based light emitting polymer or the like. However, the present invention is not limited thereto.
The electron transporting layer may include oxadiazole or the like. However, the present invention is not limited thereto.
The electron injection layer may include BaF 2 or the like. However, the present invention is not limited thereto.
The
On the other hand, the
Hereinafter, a method of manufacturing a transparent electronic device according to an embodiment of the present invention will be described in detail.
Example: Fabrication of transparent electronic device for OLED
A PC (Polycarbonate) substrate was used as the substrate. Aluminum, which is a highly conductive material, was patterned on the substrate to form stripe-shaped nano-auxiliary electrodes at intervals of 500 nm. At this time, the thickness of the nano-auxiliary electrode was set to 200 nm. The patterning can be made using laser interference lithography (a technique of forming a pattern by exposing an interference fringe created by two or more lasers to a photoresist layer as a photosensitive material). Then, an ultra-thin metal electrode was formed on the upper surface including the substrate and the nano auxiliary electrode by a thermal deposition method. As the ultra-thin metal electrode, a seed layer having a thickness of 1 nm was formed by Al, and a metal layer (thickness of 4 to 16 nm) was formed. Then, a hole injection layer of 40 nm in thickness of MoO 3 was formed on the upper surface of the ultra-thin metal electrode. N, N'-phenyl-1,4-phenylenediamine) (poly (9,9-dioctylfluorene-co-bis- N, N'-phenyl-1,4-phenylenediamine (PFB, a hole transport material manufactured by Dow Chemical) was spin-coated to form 50 nm A light emitting layer having a thickness of 70 nm was formed on the hole transporting layer by using a spirofluorene-based light emitting polymer as a blue light emitting material, and oxadiazole was deposited on the light emitting layer to form a 40 nm thick electron transporting layer Then, BaF 2 was deposited to form an electron injection layer having a thickness of 4 nm. A cathode layer having a thickness of 2.7 nm and Al having a thickness of 150 nm was formed on the electron injection layer. A transparent electronic device was manufactured.
Experimental Example 1: SEM analysis
A thin film prepared by thermally depositing an Al layer of 1 nm on a polycarbonate substrate and then thermally vapor-depositing an Ag layer of 4 to 10 nm and an Ag layer of 4 to 10 nm deposited on a polycarbonate substrate were subjected to SEM (scanning electron microscope). The results are shown in Fig. It was confirmed that the Al (1 nm) / Ag structure was superior in smoothness and continuity as compared with the Ag single structure.
Experimental Example 2: Analysis of light transmittance
A thin film prepared by thermally depositing an Al layer of 1 nm on a polycarbonate substrate and then thermally depositing an Ag layer of 4 to 16 nm and a thin film formed by thermally depositing an Ag layer of 4 to 16 nm on a polycarbonate substrate, And the results are shown in FIG. The light transmittance of the thin film was measured using a UV-Vis spectrophotometer (Varian, Cary 5000). The incident beam was measured in the region of 200 to 800 nm by adjusting the incident angle of the incident light to 90 degrees on the thin film surface. As shown in FIG. 3, it was confirmed that the Al (1 nm) / Ag structure exhibits a higher transmittance than the Ag single structure.
While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the technical scope of the present invention should be defined by the appended claims.
100: transparent electronic device
110: substrate
120: Nano-auxiliary electrode
130: ultra-thin metal electrode
131: metal layer
132: Seed layer
140: Hole injection layer
150: organic layer
160: cathode electrode
Claims (17)
A stripe-shaped nano-auxiliary electrode repeatedly formed on the upper surface of the substrate at a predetermined distance;
An ultra-thin metal electrode formed on an upper surface of the substrate and the nano-assist electrode;
An organic layer formed on the upper surface of the ultra thin metal electrode; And
And a cathode layer formed on an upper surface of the organic layer,
Wherein the ultra-thin metal electrode comprises a seed layer formed of Al and a metal layer formed of Ag,
And the metal layer formed of Ag is formed to a thickness of 4 to 10 nm.
Wherein the nano-assist electrode is formed at a period of 100 to 1000 nm.
And a hole injection layer formed between the ultra-thin metal electrode and the organic layer.
Wherein the hole injection layer is formed of at least one selected from the group consisting of molybdenum oxide, zinc oxide, silver oxide, nickel oxide, and tungsten oxide.
Wherein the organic layer is a structure in which a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injecting layer are stacked in this order.
Wherein the organic layer is composed of an organic material for a solar cell, the hole transport layer, the photoactive layer, the electron transport layer, and the electron injection layer.
Forming an ultra-thin metal electrode on an upper surface of the substrate and the nano-assist electrode (step b);
Forming an organic layer on the upper surface of the ultra-thin metal electrode (step c); And
And forming a cathode layer on an upper surface of the organic layer (step d)
The ultra-thin metal electrode forming step includes a seed layer forming step and a metal layer forming step,
The seed layer forming step is performed by forming a thin film using Al,
Wherein the metal layer forming step is performed by forming a thin film having a thickness of 4 to 10 nm using Ag.
Wherein the step (a) is performed by forming a stripe-shaped nano-auxiliary electrode at a period of 100 to 1000 nm.
Wherein the step (b) is performed by a vacuum thermal deposition method.
And forming a hole injection layer between the step (b) and the step (c).
Wherein the step of forming the hole injection layer is performed by a method of forming a thin film of at least one selected from the group consisting of molybdenum oxide, zinc oxide, silver oxide, nickel oxide and tungsten oxide.
Wherein the step c) is performed by sequentially laminating a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer.
Wherein the step c is performed by a method of forming an organic layer using an organic material for a solar cell including a hole transport layer, a photoactive layer, an electron transport layer, and an electron injection layer.
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