KR101824734B1 - Light emitting module - Google Patents

Light emitting module Download PDF

Info

Publication number
KR101824734B1
KR101824734B1 KR1020100112980A KR20100112980A KR101824734B1 KR 101824734 B1 KR101824734 B1 KR 101824734B1 KR 1020100112980 A KR1020100112980 A KR 1020100112980A KR 20100112980 A KR20100112980 A KR 20100112980A KR 101824734 B1 KR101824734 B1 KR 101824734B1
Authority
KR
South Korea
Prior art keywords
light emitting
heat dissipation
via hole
lead electrode
copper foil
Prior art date
Application number
KR1020100112980A
Other languages
Korean (ko)
Other versions
KR20120051502A (en
Inventor
김경준
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100112980A priority Critical patent/KR101824734B1/en
Publication of KR20120051502A publication Critical patent/KR20120051502A/en
Application granted granted Critical
Publication of KR101824734B1 publication Critical patent/KR101824734B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

The present invention relates to a light emitting module, which includes a heat dissipating member, an insulating plate on the heat dissipating member, a first electrode terminal and a second electrode terminal on the insulating plate, and the first electrode terminal and the second electrode terminal And a heat dissipation via hole penetrating the insulation plate and in contact with the heat dissipation member, and at least one light emitting diode electrically connected to the first electrode terminal and the second electrode terminal and disposed on the heat dissipation via hole . Therefore, it is possible to provide a light emitting module with improved heat dissipation properties and device reliability.

Description

[0001] LIGHT EMITTING MODULE [0002]

The present invention relates to a light emitting module.

Generally, a circuit board refers to a substrate which is formed by forming a circuit pattern of a conductive material such as copper on an electrically insulating substrate and immediately before mounting a heating element related to an electronic component. Such a circuit board mounts a heat generating element such as a semiconductor element and a light emitting diode (LED). In particular, a device such as a light emitting diode emits a serious heat.

Therefore, if heat is not applied to the circuit board on which the heat-generating element is mounted, the temperature of the circuit board on which the heat-generating element is mounted may be increased to cause malfunction or malfunction of the heat-generating element, do

The embodiment provides a light emitting module having a heat dissipation via hole.

Embodiments provide a light emitting module in which a light emitting diode is brought into contact with a heat dissipation via hole provided in a circuit board.

Embodiments provide a light emitting module for contacting a support frame of a light emitting diode on an upper surface of a conductive via.

An embodiment of the present invention includes a heat dissipating member, an insulating plate on the heat dissipating member, a first electrode terminal and a second electrode terminal on the insulating plate, the insulating plate penetrating the first electrode terminal and the second electrode terminal, A circuit board including a heat-dissipating via hole in contact with the member; And at least one light emitting diode electrically connected to the first electrode terminal and the second electrode terminal and disposed on the heat dissipation via hole.

The embodiment can improve the heat radiation efficiency of the light emitting diode.

The embodiment can improve the reliability of the light emitting module.

1 is a perspective view of a light emitting module according to a first embodiment.
2 is an enlarged perspective view of a portion of the light emitting module of FIG.
3 is a cross-sectional view of the light emitting module of FIG. 2 taken along line I-I '.
4 is a cross-sectional view of a light emitting module according to a second embodiment.
5 is a cross-sectional view of a light emitting module according to the third embodiment.
6 is a cross-sectional view of a light emitting module according to a fourth embodiment.
7 is a cross-sectional view of a light emitting module according to a fifth embodiment.
9 is an exploded perspective view of a backlight unit including a light emitting module according to the present invention.
10 is a perspective view of a lighting system including a light emitting module according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification .

Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.

Hereinafter, a light emitting module according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG.

FIG. 1 is a perspective view showing a light emitting module according to a first embodiment, FIG. 2 is an enlarged perspective view of a part of the light emitting module of FIG. 1, and FIG. 3 is a sectional view taken along line I-I 'of FIG.

1 to 3, the light emitting module 300 includes a circuit board 200 and a light emitting diode 100 on the circuit board 200.

The light emitting module 300 has a structure in which a plurality of light emitting diodes 100 are arranged at a predetermined interval on a circuit board 200. The plurality of light emitting diodes 100 may be arranged in one or more columns, They can be connected in series or in parallel. These technical features may be changed within the technical scope of the embodiment.

The circuit board 200 includes an insulating plate 250, a plurality of insulating layers 220, 230 and 240, a copper foil layer 210, and a plurality of circuit patterns 221 and 225. The circuit board 200 uses a lower copper foil layer 210 of the copper foil layer formed on the upper and lower portions of the insulating plate 250 as a base plate based on a flexible copper clad laminate (FCCL) as a heat radiating plate, The first circuit pattern 225 is formed by plating.

The insulating plate 250 of the circuit board 200 includes an epoxy or polyimide resin as a base of the circuit board 200 and a solid component such as a filler or a glass fiber is dispersed Or the like.

The insulating plate 250 may have a thickness of about 1 mm +/- 0.5 mm, and the thickness of the insulating plate 250 is not limited thereto.

A first circuit pattern 225 is formed by etching or plating an upper copper foil layer on the insulating plate 250. A first circuit pattern 225 is formed to insulate the first circuit patterns 225 and to embed the first circuit pattern 225. [ An insulating layer 240 and a second insulating layer 230 are formed.

A second circuit pattern 221 is formed on the second insulating layer 230 and a part of the second circuit pattern 221 forms electrode terminals 222 and 224 contacting the light emitting diode 100 .

A third insulating layer 220 is formed to fill the second circuit pattern 221 on the second insulating layer 230 and to open the electrode terminals 222 and 224. The third insulating layer 220 may be formed of a solder resist. At this time, when the first insulating layer 240 is formed by embedding the first circuit pattern 225, the second insulating layer 230, which is an interlayer insulating layer, may be omitted.

The material of the first and second insulating layers 220 and 230 may be one of epoxy type and preg type. The first and second insulating layers 220 and 230 may function as an adhesive member for bonding between adjacent two layers. Further, the adhesive layer may be adhered to each layer using an adhesive, but the invention is not limited thereto. Also, the material of the insulating layers 220 and 230 may be formed around the electrode terminals 222 and 224 in the circuit patterns 221 and 225 by a compression molding process.

For convenience of explanation, the embodiment has a structure in which two-layer circuit patterns 221 and 225 and three insulating layers 220, 230 and 240 are disposed, but the present invention is not limited to such a laminated structure. In addition, the thickness of the circuit pattern may be between 20 and 50 um, and the thickness of the insulating layers 220, 230 and 240 may be about 80 to 120 um.

The first circuit pattern 225 may be formed by etching a copper foil layer attached to the upper surface of the insulating plate 250 as described above and the second circuit pattern 221 may be formed by etching Cu, May be formed using an alloy of a material to be selected, preferably using Cu, and the surface of the Cu may further be coated with another material and may be changed within the technical scope of the embodiment.

And electrode terminals 222 and 224 selectively connected to the light emitting diode 100 among the second circuit patterns 221. The electrode terminals 222 and 224 may be formed of an optional circuit according to an internal circuit pattern. Here, the first circuit pattern 225 and the electrode terminals 222 and 224 of the second circuit pattern 221 may be connected to each other via a via structure, but the present invention is not limited thereto.

The electrode terminals 222 and 224 of the second circuit pattern 225 may be divided into a first electrode terminal 222 and a second electrode terminal 224 having different polarities. And the second electrode terminals 224 may be formed of one or a plurality of electrodes. The first electrode terminal 222 and the second electrode terminal 224 are spaced apart from each other and the gap may be disposed within the length (one side width) of the light emitting diode 100.

A plurality of insulation layers 220, 230 and 240 and a heat dissipation via hole 262 penetrating the insulation plate 250 are formed in the circuit board 200.

The heat dissipation via hole 262 may be disposed under the light emitting diode mounting area. The heat dissipation via hole 262 is exposed from the third insulating layer 220 to the lower copper foil layer 210 through the circuit board 200 and exposed to the upper surface of the circuit board 200.

The shape of the upper surface of the heat dissipation via hole 262 may be circular or polygonal, and the side surface may be polygonal, as shown in FIG. 3, and may be variously changed within the technical scope of the embodiment.

A plurality of the heat dissipation via holes 262 are disposed between the first electrode terminal 222 and the second electrode terminal 224 of the circuit board 200.

Specifically, the heat dissipation via hole 262 is formed to be electrically insulated from the first electrode terminal 222 and the second electrode terminal 224 and electrically insulated from the support frame 115 of the light emitting diode 100 do.

The heat dissipation via hole 262 may be a conductive via hole whose inner surface is plated with metal. The inner surface of the heat dissipation via hole 262 may be plated with a conductive metal such as Cu, Al, Au, or the like.

The plurality of heat dissipation via holes 262 may be arranged below the support frame 115 of the light emitting diode 100 and may not be formed under the region where the light emitting device 130 is mounted.

That is, as shown in FIG. 2, the heat dissipation via hole 262 is formed under the support frame 115 other than the light emitting device 130, thereby preventing the light emitting device 130 from being attached / detached due to unevenness of the surface due to plating .

The plurality of heat dissipation via holes 262 may be spaced apart from each other, and two or more heat dissipation via holes 262 may be arranged in a cluster.

The diameter of the heat dissipation via hole 262 may be 50 μm or more, preferably about 100 to 400 μm. The height of the heat dissipation via hole 262 may be about 200 to 300 μm, which may vary depending on the multilayer structure of the circuit board 200.

As described above, the heat dissipation efficiency of the light emitting diode 100 can be improved by transmitting heat to the lower copper foil layer 210 of the circuit board 200 using the heat dissipation via hole 262.

The light emitting diode 100 includes a body 120, a first lead electrode 111, a second lead electrode 113 and a support frame 115 provided on the body 120, A light emitting device 130 provided on the first lead electrode 120 and electrically connected to the first lead electrode 111 and the second lead electrode 113 and a molding member 150 surrounding the light emitting device 130 do.

The support frame 115 is spaced apart from the first lead electrode 111 and the second lead electrode 113 between the first lead electrode 111 and the second lead electrode 113, And is electrically insulated from the first lead electrode 111 and the second lead electrode 113. The light emitting device 130 is attached to the support frame 115.

The supporting frame 115 is formed to have the widest area in the body 120 and preferably the supporting frame 115 and the first and second lead electrodes 111 and 113 An area ratio of 7: 1.5: 1.5 can be satisfied. That is, when the widths of the support frame 115, the first lead electrode 111 and the second lead electrode 113 are the same, the ratio of the lengths is d1: d2: d3 = 7: 1.5: 1.5 Can be satisfied.

The body 120 may include a silicon material, a synthetic resin material, or a metal material. A sloped surface may be formed around the light emitting device 130.

The support frame 115, the first lead electrode 111, and the second lead electrode 113 may be formed of a lead frame or a plated layer and electrically isolated from each other to provide power to the light emitting device 130 . In addition, the support frame 115, the first lead electrode 111, and the second lead electrode 113 can increase the light efficiency by reflecting the light generated from the light emitting device 130, 130 may be discharged to the outside.

The first lead electrode 111, the second lead electrode 113 and a part of the support frame 115 are disposed below the body 120. The first lead electrode 111 is connected to the circuit And the second lead electrode 113 is bonded to the second electrode terminal 224 of the circuit board 200. The second electrode terminal 224 of the circuit board 200 is bonded to the first electrode terminal 222 of the substrate 200. Here, the support frame 115 is formed to cover the heat dissipation via hole 262 of the circuit board 200.

The light emitting device 130 may be mounted on the support frame 115 of the body 120. The light emitting device 130 may be electrically connected to the first lead electrode 111 and the second lead electrode 113 through a wire 140.

That is, the light emitting device 130 is a horizontal type light emitting device, and two electrodes 131 and 133 separated from each other are connected to the first lead electrode 111, the second lead electrode 113, As shown in Fig.

The molding member 150 may be formed of silicon or epoxy, and may surround the light emitting device 130 to protect the light emitting device 130. In addition, the molding member 150 may include a phosphor to change the wavelength of light emitted from the light emitting device 130.

One end of the lead electrodes and the support frames 111, 113 and 115 are disposed on the bottom surface of the body portion 120, and the light emitting element 130 and the molding member (150).

The light emitting diode 100 is mounted on the circuit board 200 so that the first lead electrode 111 and the second lead electrode 113 of the light emitting diode 100 are electrically connected to the circuit board 200, And is bonded to the first electrode terminal 222 and the second electrode terminal 224.

The heat dissipation via hole 262 is connected to an area of the support frame 115 of the light emitting diode 100 other than the light emitting device 130 through bonding or surface contact. Accordingly, the heat generated from the LED 100 is conducted through the heat dissipation via hole 262, and the heat dissipation via hole 262 is electrically connected to the lower part of the copper foil layer 210 through the thermally conductive metal of the heat dissipation via hole 262, . The heat dissipation via hole 262 may dissipate heat generated from the light emitting diode 100, thereby improving the reliability of the light emitting module 300.

As described above, while the lower copper foil layer 210 of the FCCL is used as a heat dissipation plate, heat is dissipated to the lower surface of the circuit board 200 through the heat dissipation via hole 262 on the lower surface of the support frame 115 on which the light emitting device 130 is mounted. The device reliability can be secured.

The light emitting module 300 may include a plurality of light emitting diodes 100 and may efficiently dissipate heat generated from the plurality of light emitting diodes 100.

Hereinafter, another embodiment of the present invention will be described with reference to Figs.

4 is a cross-sectional view illustrating a light emitting module according to a second embodiment. In describing the second embodiment, the same parts as those of the first embodiment are referred to in the first embodiment, and redundant description will be omitted.

4, the light emitting module 300A can dissipate the heat generated from the light emitting diode 100A through the heat dissipation via hole 262A and the lower copper foil layer 210, which is a heat dissipation plate of the circuit board 200. FIG.

The light emitting diode 100 includes a first lead electrode 111, a second lead electrode 113, and a support frame 115 in the body 120. The first lead electrode 111, the second lead electrode 113, and the support frame 115 may be implemented as a lead frame.

The support frame 115 is disposed between the first lead electrode 111 and the second lead electrode 113 and is electrically isolated from the lead electrodes 111 and 113.

The support frame 115 is disposed on the bottom surface of the cavity region of the body 120. The light emitting device 130 is attached to the support frame 115 with an adhesive, and the first lead electrode 111 and the second lead electrode 113 are connected by a wire.

The first lead electrode 111 of the light emitting diode 100 is bonded to the first electrode terminal 222 of the circuit board 200 and the second lead electrode 113 is bonded to the second electrode of the circuit board 200. [ And is bonded to the terminal 224. The support frame 115 of the light emitting diode 100 may be attached to the heat dissipation via hole 260A of the circuit board 200 by a conductive adhesive or the like.

The heat dissipation via hole 260A is filled with a heat dissipation via formed of a thermally conductive material, for example, an alloy including a metal such as copper, gold, and aluminum.

The heat dissipation via may be formed by applying the thermoconductive material in the via hole in the form of paste, and the metal coin may be embedded in the heat dissipation via hole 260A.

3, the heat dissipation via hole 262A is formed integrally with the lower portion of the support frame 115, and one region of the heat dissipation via is located under the light emitting device 130. [

The heat generated from the light emitting device 130 of the light emitting diode 100 is conducted to the support frame 115 below the support frame 115. The support frame 115 is a heat dissipation via hole for burying the heat dissipation via hole 262A below the support frame 115 And the heat dissipation via conducts its own heat dissipation and conducts heat to the copper foil layer 210, which is a heat dissipation plate below the heat dissipation plate.

Since the lower end of the heat dissipation via contacts the copper foil layer 210, it can be electrically separated from the circuit patterns of the other circuit patterns 221 and 225.

5 is a cross-sectional view illustrating a light emitting module according to a third embodiment.

In describing the third embodiment, the same parts as those of the second embodiment are referred to in the second embodiment, and redundant description will be omitted.

Referring to FIG. 5, the light emitting module 300B may dissipate heat generated from the light emitting diode 100 through the lower copper foil layer 210 through the heat dissipation via hole 262B as shown in FIG. The heat dissipation via hole 262B is formed under the region other than the light emitting device 130 of the support frame 115, and the side surface thereof is plated with a conductive material.

At this time, the light emitting module 300B further includes a heat dissipation via 263 at a lower portion of the support frame 115 where the light emitting device 130 is attached.

The heat dissipation via 263 is embedded in an alloy including a metal such as copper, gold, and aluminum, and the heat dissipation via 263 is formed by applying the thermoconductive material in paste form , And embedding a metal coin into the via hole.

The heat dissipation via hole formed in the lower portion of the light emitting device 130 is filled with the thermally conductive material to form the heat dissipation via hole 263 and the heat dissipation via hole 262B in the region other than the light emitting device 130 is plated The heat dissipation property can be ensured while maintaining the equilibrium when the light emitting element 130 is attached.

6 is a side sectional view showing a light emitting module according to a fourth embodiment.

In describing the fourth embodiment, the same parts as those of the first embodiment are referred to in the first embodiment, and redundant description will be omitted.

Referring to FIG. 6, the light emitting module 300C may dissipate the heat generated from the light emitting diode 100 through the lower copper foil layer 210 through the heat dissipation via hole 262C as shown in FIG. The heat dissipation via hole 262C is formed under the region other than the light emitting device 130 of the support frame 115, and its side surface is plated with a conductive material.

3, the side surface of the heat dissipation via hole 262C has a trapezoidal shape, that is, the area of the upper surface contacting the support frame 115 is larger than the area of the lower surface contacting the copper foil layer 210. [

Accordingly, the heat can be more efficiently received by receiving more heat from the support frame 115 and transferring it to the lower copper foil layer 210.

As shown in FIG. 5, the light emitting device 130 may further include a heat dissipating via.

7 is a side sectional view showing a light emitting module according to a fifth embodiment.

In describing the fifth embodiment, the same parts as those in the first embodiment will be referred to in the first embodiment, and redundant description will be omitted.

Referring to FIG. 7, the light emitting module 300D may dissipate the heat generated from the light emitting diode 100 to the lower copper foil layer 210 through the heat dissipation via holes 262 as shown in FIG. The heat dissipation via hole 262 is formed under the support frame 115 and includes a heat dissipation fin 262D inside the heat dissipation via hole 262.

That is, the light emitting module 300D further includes a plurality of heat dissipating fins 262D inserted and fixed in the heat dissipating via holes 262 from the copper foil layer 210. The heat dissipating fins 262D are riveted or screw- The copper foil layer 210 may be used as a heat radiation medium while being fixed to the circuit board 200.

The heat dissipation fin 262D may be formed of a metal having a high thermal conductivity, specifically, a metal such as copper, gold, or aluminum. A head portion 264 may be formed on the copper foil layer 210, Fixed.

As shown in FIG. 7, the plurality of radiating fins 262D may be formed under the region of the support frame 115 other than the light emitting device 130, but may also be formed under the light emitting device 130. FIG.

The light emitting device according to the above-described embodiment can function as an illumination system such as a backlight unit, a pointing device, a lamp, and a streetlight.

Hereinafter, an application example of the present invention will be described with reference to Figs. 8 and 9. Fig.

8 is a perspective view illustrating a backlight unit including a light emitting module according to the present invention.

However, the backlight unit 1100 of Fig. 8 is an example of the illumination system, and is not limited thereto.

8, the backlight unit 1100 includes a bottom cover 1140, a light guide member 1120 disposed in the bottom cover 1140, and a light guide member 1120 disposed on at least one side or bottom surface of the light guide member 1120 A light emitting module 1110 may be included. Further, a reflective sheet 1130 may be disposed below the light guide member 1120.

The bottom cover 1140 may be formed in the shape of a box having an opened upper surface to accommodate the light guide member 1120, the light emitting module 1110 and the reflective sheet 1130, . However, the present invention is not limited thereto.

The light emitting module 1110 may include a plurality of light emitting diodes 600 mounted on the substrate 700. A plurality of light emitting diodes (600) provide light to the light guide member (1120).

As shown, the light emitting module 1110 may be disposed on at least one of the inner surfaces of the bottom cover 1140, thereby providing light to at least one side of the light guide member 1120.

The light emitting module 1110 may be disposed under the light guide member 1120 in the bottom cover 1140 to provide light toward the bottom surface of the light guide member 1120. It can be variously modified according to the design of the backlight unit 1100.

The light guide member 1120 may be disposed in the bottom cover 1140. The light guide member 1120 can guide the light provided from the light emitting module 1110 to a display panel (not shown) by converting it into a surface light source.

Such a light guide member 1120 may be, for example, a light guide panel (LGP). The light guiding plate may be made of, for example, acrylic resin such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), cyclic olefin copolymer (COC), polycarbonate (PC) , And polyethylene naphthalate resin.

The optical sheet 1150 can be disposed on the upper side of the light guide member 1120.

This optical sheet 1150 may include at least one of, for example, a diffusion sheet, a light condensing sheet, a brightness increasing sheet, and a fluorescent sheet. For example, the optical sheet 1150 may be formed by laminating a diffusion sheet, a light condensing sheet, a brightness increasing sheet, and a fluorescent sheet. In this case, the diffusion sheet 1150 spreads the light emitted from the light emitting module 1110 evenly, and the diffused light can be condensed by the condensing sheet into a display panel (not shown). At this time, the light emitted from the light condensing sheet is randomly polarized light. The brightness increasing sheet can increase the degree of polarization of the light emitted from the light condensing sheet. The light collecting sheet may be, for example, a horizontal or / and a vertical prism sheet. The brightness enhancement sheet may be, for example, a dual brightness enhancement film. Further, the fluorescent sheet may be a translucent plate or film in which the phosphor is spun.

A reflective sheet 1130 may be disposed below the light guide member 1120. The reflective sheet 1130 can reflect light emitted through the lower surface of the light guide member 1120 toward the exit surface of the light guide member 1120. The reflective sheet 1130 may be formed of a resin having high reflectance, for example, PET, PC, poly vinyl chloride, resin, or the like, but is not limited thereto.

9 is a view for explaining a lighting system including a light emitting device according to the present invention. However, the illumination system 1200 of Fig. 9 is an example of the illumination system, and is not limited thereto.

9, the lighting system 1200 includes a case body 1210, a light emitting module 1230 installed in the case body 1210, a connection terminal 1210 installed in the case body 1210, (1220).

The case body 1210 is preferably formed of a material having a good heat dissipation property, and may be formed of, for example, a metal or a resin.

The light emitting module 1230 may include a substrate 700 and at least one light emitting diode 600 mounted on the substrate 700.

The substrate 700 may be the circuit board 200 shown in FIGS.

Further, the substrate 700 may be formed of a material that efficiently reflects light, or may be formed of a color whose surface is efficiently reflected, for example, white, silver, or the like.

At least one light emitting diode 600 may be mounted on the substrate 700.

The light emitting diode 600 may include at least one light emitting diode (LED). The light emitting device may include a colored light emitting device that emits red, green, blue, or white colored light, and a UV light emitting device that emits ultraviolet (UV) light.

The light emitting module 1230 may be arranged to have various combinations of light emitting elements to obtain color and brightness. For example, a white light emitting element, a red light emitting element, and a green light emitting element may be disposed in combination in order to secure a high color rendering index (CRI). Further, a fluorescent sheet may be further disposed on the path of the light emitted from the light emitting module 1230, and the fluorescent sheet changes the wavelength of the light emitted from the light emitting module 1230. For example, when the light emitted from the light emitting module 1230 has a blue wavelength band, the fluorescent sheet may include a yellow phosphor, and the light emitted from the light emitting module 1230 may be seen through the fluorescent sheet as white light do.

The connection terminal 1220 may be electrically connected to the light emitting module 1230 to supply power. 9, the connection terminal 1220 is connected to the external power source in a socket manner, but is not limited thereto. For example, the connection terminal 1220 may be formed in a pin shape and inserted into an external power source or may be connected to an external power source by wiring.

In the above-described illumination system, at least one of a light guide member, a diffusion sheet, a light condensing sheet, a brightness increasing sheet, and a fluorescent sheet is disposed on the path of light emitted from the light emitting module to obtain a desired optical effect.

The backlight unit 1100 and the illumination system 1200 described in FIGS. 8 and 9 include the light emitting modules 300, 300A, 300B, 300C, and 300D described in FIGS. 1 to 7 of the present invention, .

The embodiments of the present invention described above are not only implemented by the apparatus and method but may be implemented through a program for realizing the function corresponding to the configuration of the embodiment of the present invention or a recording medium on which the program is recorded, The embodiments can be easily implemented by those skilled in the art from the description of the embodiments described above.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

Emitting module 300, 300A, 300B, 300C, 300D
Circuit board 200
Light emitting diode 100
The light-

Claims (15)

A circuit board including an insulating plate, an insulating layer including a first electrode terminal and a second electrode terminal on the insulating plate, and a heat-dissipating via hole;
A lower copper foil layer disposed under the circuit board; And
And at least one light emitting diode disposed on the heat dissipation via hole,
The light-
A support frame;
A light emitting element disposed on the support frame;
A first lead electrode contacting the first electrode terminal and a second lead electrode contacting the second electrode terminal,
Wherein the heat dissipation via hole penetrates the insulating layer, the insulating plate, and the lower copper foil layer and contacts the heat radiating member including the lower copper foil layer,
And a plurality of radiating fins inserted into the radiating via holes from the lower copper foil layer to fix the lower copper foil layer to the circuit board,
Wherein the heat radiating fins include a head portion disposed on the lower copper foil layer and fixing the lower copper foil layer to a circuit board, wherein the head portion has a smaller width from a lower surface to a top surface of the lower copper foil layer. The method according to claim 1,
The supporting frame, the first lead electrode and the second lead electrode are electrically insulated,
Wherein the heat dissipation via hole has a diameter of 50 占 퐉 or more,
Wherein the support frame has an area larger than an area of the first lead electrode and the second lead electrode. delete delete delete delete The method according to claim 1,
Wherein the heat dissipation via hole is filled with a thermally conductive material,
Wherein the insulating plate is a flexible plate,
The supporting frame, the first lead electrode and the second lead electrode are electrically insulated,
And the area of the support frame, the first lead electrode, and the second lead electrode satisfy 7: 1.5: 1.5. delete The method according to claim 1,
Wherein the heat dissipation via hole is formed under the support frame other than the light emitting element,
And the heat dissipation via hole is exposed on the upper surface of the circuit board. delete delete delete delete delete delete
KR1020100112980A 2010-11-12 2010-11-12 Light emitting module KR101824734B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100112980A KR101824734B1 (en) 2010-11-12 2010-11-12 Light emitting module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100112980A KR101824734B1 (en) 2010-11-12 2010-11-12 Light emitting module

Publications (2)

Publication Number Publication Date
KR20120051502A KR20120051502A (en) 2012-05-22
KR101824734B1 true KR101824734B1 (en) 2018-02-01

Family

ID=46268575

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100112980A KR101824734B1 (en) 2010-11-12 2010-11-12 Light emitting module

Country Status (1)

Country Link
KR (1) KR101824734B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6704175B2 (en) * 2016-01-27 2020-06-03 パナソニックＩｐマネジメント株式会社 LED module and lighting fixture using the same
KR20190037741A (en) 2017-09-29 2019-04-08 서울반도체 주식회사 Light emitting diode, light emitting diode module and displace device having the same

Also Published As

Publication number Publication date
KR20120051502A (en) 2012-05-22

Similar Documents

Publication Publication Date Title
US9445490B2 (en) Film system for LED applications
EP1815535B1 (en) Illuminator and method for producing such illuminator
US8598616B2 (en) Light emitting device and light unit using the same
WO2011136236A1 (en) Leadframe, wiring board, light emitting unit, and illuminating apparatus
JP2005158957A (en) Light emitting device
JP2009158451A (en) Edge light type light-emitting diode backlight module
KR102282209B1 (en) Mounting assembly and lighting device
JP2007324547A (en) Light emitting diode light source, illuminator, display unit, and traffic signal
JP2007096285A (en) Light emitting device mounting substrate, light emitting device accommodating package, light emitting device and lighting device
JP4659515B2 (en) Light-emitting element mounting substrate, light-emitting element storage package, light-emitting device, and lighting device
KR101824734B1 (en) Light emitting module
JP2000236111A (en) Light source equipment
US8791482B2 (en) Light emitting device package
JP5685862B2 (en) Light source device
JP2009212126A (en) Lighting system
KR101924014B1 (en) Light emitting device package and lighting system having the same
CN215933639U (en) Light emitting diode, light bar and backlight module
KR101880058B1 (en) Light emitting device package and lighting apparatus having the same
KR101896677B1 (en) Light emitting device and lighting system having thereof
KR101766462B1 (en) Printed circuit board
KR101128991B1 (en) Side view optical package and manufacturing method of the same
KR101098951B1 (en) Light emitting device
KR20110107637A (en) Printed circuit board and menufacturing the same, light emitting device package, light emitting appratus, and lighting system
KR101905573B1 (en) Light emitting device module and lightig system the same
US20160345438A1 (en) Film/Foil System for LED Applications

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant