KR101809549B1 - Paint-electrodeposited plastic - Google Patents
Paint-electrodeposited plastic Download PDFInfo
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- KR101809549B1 KR101809549B1 KR1020170039714A KR20170039714A KR101809549B1 KR 101809549 B1 KR101809549 B1 KR 101809549B1 KR 1020170039714 A KR1020170039714 A KR 1020170039714A KR 20170039714 A KR20170039714 A KR 20170039714A KR 101809549 B1 KR101809549 B1 KR 101809549B1
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- C25D13/00—Electrophoretic coating characterised by the process
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/12—Electrophoretic coating characterised by the process characterised by the article coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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Abstract
Description
본 발명은 전착도장된 플라스틱에 관한 것이다.The present invention relates to electrodeposited plastics.
전착 도장은 통상 금속 등의 전기가 통하는 제품을 대상으로 수행된다.The electrodeposition coating is usually performed on a product such as a metal through which electricity flows.
최근 가벼우면서도 다양한 형상 구현이 가능한 플라스틱 소재가 생활가전 제품 및 자동차 산업 등에 많이 사용되면서 플라스틱 소재에 대한 금속 질감과 고급스러운 외장품 및 친환경적인 표면처리 공법 개발이 시장에서 요구되고 있다.Recently, plastic materials which can realize light and various shapes are widely used in household appliances and automobile industries, and there is a demand in the market to develop a metal texture for plastic materials, a luxurious exterior, and an environmentally friendly surface treatment method.
그러나 기존 플라스틱 소재를 활용한 표면 처리 방법으로는 시장에서 요구하는 친환경, 대량 생산 체계 및 수율 관리상 많은 어려움 및 기술적 한계가 있다.However, there are many difficulties and technical limitations in the environmentally friendly, mass production system and yield management required in the market for the surface treatment method using the conventional plastic material.
본 발명의 목적은 전착도장된 플라스틱을 제공하는 것이다.It is an object of the present invention to provide electroplated and painted plastics.
상기 본 발명의 목적은, 전착도장된 플라스틱에 있어서, 표면에 홀이 형성된 플라스틱; 상기 홀에 위치하는 팔라듐층; 상기 팔라듐층 상에 형성되어 있는 화학도금 니켈층; 상기 화학도금 니켈층 상에 형성되어 있는 전기도금 니켈층; 및 상기 전기도금 니켈층 상에 형성되어 있는 전착도장층을 포함하는 것에 의해 달성된다.An object of the present invention is to provide a plastic having electrodeposited coating, the plastic having a hole on its surface; A palladium layer located in the hole; A chemically-plated nickel layer formed on the palladium layer; An electroplated nickel layer formed on the chemically-plated nickel layer; And an electrodeposition coating layer formed on the electroplated nickel layer.
상기 전기도금 니켈층은 무광택 니켈층일 수 있다.The electroplated nickel layer may be a matte nickel layer.
상기 팔라듐층은 상기 플라스틱 상에 부분적으로 형성되어 있으며, 상기 화학도금 니켈층과 상기 전기도금 니켈층은 상기 팔라듐층보다 넓게 형성되어 있을 수 있다.The palladium layer is partially formed on the plastic, and the chemically-plated nickel layer and the electroplated nickel layer may be formed wider than the palladium layer.
상기 화학도금 니켈층과 상기 전기도금 니켈층은 상기 플라스틱 전면에 형성되어 있을 수 있다.The chemically-plated nickel layer and the electroplated nickel layer may be formed on the entire surface of the plastic.
상기 전기도금 니켈층과 상기 전착도장층은 직접 접하고 있을 수 있다.The electroplated nickel layer and the electrodeposition coating layer may be in direct contact with each other.
상기 전기도금 니켈층과 상기 화학도금 니켈층은 직접 접하고 있을 수 있다.The electroplated nickel layer and the chemically-plated nickel layer may be in direct contact with each other.
본 발명에 따르면 전착도장된 플라스틱이 제공된다.According to the present invention, an electrodeposited plastic is provided.
도 1은 본 발명에 따른 플라스틱의 전착도장 방법을 나타낸 것이고,
도 2는 본 발명에 따라 제조된 전착도장된 플라스틱을 나타낸 것이다.1 shows a method of electrodeposition coating of plastics according to the present invention,
Figure 2 shows electrodeposited plastics produced according to the present invention.
본 발명은 플라스틱 소재를 사용함으로써 디자인 성형성이 양호하며, 소재의 경량화, 저렴한 비용으로 필요한 색상을 다양하게 표현할 수 있는 고부가가치의 플라스틱 소재의 표면처리기술에 관한 것이다.The present invention relates to a high-value-added plastic material surface treatment technology which is good in design formability by using a plastic material, light in weight of the material, and capable of expressing various colors required at low cost.
플라스틱 소재는 에이비에스(ABS) 수지, 피씨(PC)-에이비에스(ABS) 수지 및 피씨(PC) 수지 중 적어도 어느 하나를 포함한다. 에비에스 수지는 아크릴로니트릴(A), 부타디엔(B), 스티렌(S)의 세 가지의 성분으로 되어 있으며, 스티렌-아크릴로니트릴의 공중합체를 에스비알(SBR)과 엔비알(NBR) 같은 고무나 부타티엔과 그래프트 중합시켜 제조하는 열가소성 수지로 내충격성, 내약품성, 내후성이 뛰어나고, 사출 성형성이 우수하며, 다른 수지와의 상용성이 우수하여 현재 널리 사용되고 있다.The plastic material includes at least one of an ABS resin, a PC resin, an ABS resin, and a PC resin. ABS resin is composed of three components of acrylonitrile (A), butadiene (B) and styrene (S), and styrene-acrylonitrile copolymer is copolymerized with SBR and NBR Is a thermoplastic resin produced by graft polymerization with rubber or butadiene, and is excellent in impact resistance, chemical resistance, weather resistance, injection moldability, excellent compatibility with other resins, and is widely used at present.
피씨 수지는 일명 폴리카보네이트라고도 하며, 비스페놀(bisphenol) 에이(A)와 포스켄(phosgen) 등을 반응시켜 제조하는 열가소성 수지로 현재 널리 사용되고 있다.PC resin is also called polycarbonate and is currently widely used as a thermoplastic resin produced by reacting bisphenol resin (A) with phosgene or the like.
피씨-에이비에스 수지는 피씨 수지와 에이비에스 수지를 혼합한 것으로서 널리 사용되고 있다.PC-EVI resin is widely used as a mixture of PC resin and EVI resin.
도 1은 플라스틱의 전착도장 방법을 나타낸 것이다. 1 shows a method of electrodeposition coating of plastic.
전착도장은 크게 화학 도금 공정, 전기 도금 공정 및 전착 도장 공정으로 나누어진다.Electrodeposition coating is mainly divided into chemical plating process, electroplating process and electrodeposition coating process.
화학 도금 공정의 탈지 단계에서는 플라스틱 표면을 친수성화시키며, 오염물 제거, 지문 제거, 유지 제거 및 변형 표면 제거를 통해 균일한 에칭 효과를 증대시킨다.In the degreasing step of the chemical plating process, the plastic surface is made hydrophilic, and the uniform etching effect is increased through the removal of contaminants, the removal of the fingerprints, the maintenance removal and the deformation surface removal.
표면거칠기 증가 단계는 에칭으로 실시될 수 있다.The step of increasing the surface roughness can be performed by etching.
표면거칠기 증가는 플라스틱 표면을 거치게 만들어 니켈 도금 시 계면박리를 최소화하기 위한 공정이다.The increase in surface roughness is a process for minimizing interfacial delamination during nickel plating by passing through the plastic surface.
에칭에서는 플라스틱에 있는 부타디엔 등을 녹여 제품표면에 많은 홀을 생성 시켜, 플라스틱 표면의 표면 장력을 낮추어 이후 공정의 효과를 증대시킨다.Etching dissolves butadiene in plastic to generate many holes on the surface of the product, thereby lowering the surface tension of the plastic surface, thereby enhancing the effect of the subsequent process.
에칭에서는 황산 및 무수크롬산을 포함하는 에칭액을 사용할 수 있으며, 무수크롬산의 농도는 300 내지 400g/L 또는 360 내지 400g/L일 수 있다. 에칭시 에칭액의 온도는 62℃ 내지 68℃일 수 있으며, 에칭시간(침적시간)은 5분 내지 15분일 수 있다.In etching, an etching solution containing sulfuric acid and anhydrous chromic acid may be used, and the concentration of chromic anhydride may be 300 to 400 g / L or 360 to 400 g / L. The temperature of the etchant at the time of etching may be 62 ° C to 68 ° C, and the etching time (deposition time) may be 5 minutes to 15 minutes.
균일한 에칭품질을 얻기 위해 에칭액 중의 3가 크롬의 농도는 35g/L이하 또는 40g/L이하로 관리될 수 있다.The concentration of trivalent chromium in the etchant can be controlled to 35 g / L or less or 40 g / L or less in order to obtain a uniform etching quality.
환원단계는 플라스틱 표면 및 렉크에 잔존하는 에칭액 즉 육가크롬을 삼가크롬으로 환원시킨다. 이후 활성화단계에 사용되는 팔라듐과 육가크롬이 만나면 팔라듐입자를 분해하기 때문에 불량이 증가되기 때문에 환원단계가 필요하다.In the reduction step, the etchant remaining on the plastic surface and the reflector, that is, hexavalent chromium, is reduced to chromium. After the palladium and hexavalent chromium used in the activation step, the palladium particles are decomposed and the reduction step is needed because the defect is increased.
활성화단계는 에칭단계 후에 생성된 홀에 팔라듐과 주석을 침투, 흡착시킨다. 활성화단계에서는 이후 팔라듐을 감싸고 있는 주석을 제거하여 제품 표면에 팔라듐만 남게 하여 화학도금 시 반응 핵으로 작용 시키게 한다. 팔라듐은 홀 및 거칠어진 표면의 골을 중심으로 형성되고 플라스틱 전체 표면을 덮지는 않는다.The activation step penetrates and adsorbs palladium and tin into the holes created after the etching step. In the activation step, the tin surrounding the palladium is then removed, leaving only palladium on the surface of the product to act as reaction nuclei in chemical plating. Palladium is formed around the hole and the crest of the roughened surface and does not cover the entire surface of the plastic.
활성화는 팔라듐 기존 농도 30~50ppm 보다 높은 60~80ppm 으로 수행하며, 높은 팔라듐 함량은 다음 공정인 화학니켈공정의 활성화에 도움이 된다.Activation is performed at 60 ~ 80ppm, which is higher than the existing concentration of palladium of 30 ~ 50ppm, and the high palladium content helps to activate the chemical nickel process.
이후에 수행되는 화학도금의 목적은 플라스틱 표면을 도체화시켜 다음의 전기도금을 가능케 하는 것이다. 화학도금에서는 플라스틱 표면에 니켈을 형성시키며 화학도금니켈층의 두께는 1um이하로, 0.01um 내지 1um, 0.05 내지 1um일 수 있다.The purpose of the subsequent chemical plating is to conduct the plastic surface to enable subsequent electroplating. In the case of chemical plating, nickel is formed on the plastic surface, and the thickness of the chemically plated nickel layer may be 1um or less, 0.01um to 1um, 0.05 to 1um.
화학니켈은 팔라듐 핵을 중심으로 반응이 시작되어 각각의 핵에서 형성된 니켈 도금입자가 점점 클러스터를 형성하여 각각의 클러스터가 이어지면서 니켈도금 레이어를 형성한다.In the chemical nickel, the reaction starts around the palladium nuclei, and the nickel plating particles formed in each nucleus gradually form clusters, and each cluster forms a nickel plating layer.
전기도금에서는 화학도금니켈층 상에 전기도금니켈층을 형성하며, 전기도금니켈층은 무광택 니켈층(satin 니켈층)일 수 있다. 전기도금니켈층은 내식성 강화 역할을 한다.In electroplating, an electroplated nickel layer is formed on the chemically-plated nickel layer, and the electroplated nickel layer may be a matte nickel layer (satin nickel layer). The electroplated nickel layer serves to strengthen the corrosion resistance.
이상 설명한 본 발명에서의 화학도금에서는 화학도금 이후에 치환동 형성 단계가 생략된다. 또한, 전기 도금에서는 니켈 전기도금 전에 동도금이 생략되고 니켈 전기도금 후에 크롬 도금이 생략된다.In the above-described chemical plating in the present invention, the step of substituting copper is omitted after chemical plating. In electroplating, copper plating is omitted before nickel electroplating and chromium plating is omitted after nickel electroplating.
이상의 본 발명에서는 유산동 공정을 생략하고 니켈을 단독 처리하여 자연 메탈 질감을 구현한다. In the present invention, natural metal texture is realized by omitting the sulfuric acid process and treating nickel alone.
또한, 니켈 처리시 밀착성 강화를 위해 활성화, 화학니켈의 처리를 강화하였다.In addition, the activation of nickel and the treatment of chemical nickel have been strengthened in order to enhance the adhesion.
무전해 도금되는 니켈의 입자의 크기에 따라 반사정도의 차이로 무광 유광이 결정되며, 니켈 도금 조건으로 제어할 수 있다. 무광니켈은 표면 난반사로 무광 효과를 나타내며, 무광니켈 첨가제에 따라 광택, 반광 및 무광 등 다양한 광택 구현이 가능하다.Depending on the size of the electrolessly plated nickel particles, the degree of reflectivity is determined by the matte luminous flux, which can be controlled by nickel plating conditions. The matte nickel has a matte effect due to the diffuse reflection on the surface. Depending on the matte nickel additive, various glosses such as gloss, semi-gloss and matte can be realized.
이후 플라스틱에 고부가가치의 고급스러운 표면 선형성을 구현하기 위하여 전착도장 공정을 행한다.The electrodeposition coating process is then carried out to realize a high added value, high surface linearity to the plastic.
전착도장 공정은 피도물 및 도료에 양극과 음극 전류를 흘려 이온입자가 이동하는 현상을 이용한 것이다. 전착도장 공정은 피도물과 그 대극을 도료로 사용하여 직류전류를 통하게 하여 피도물 표면에 전기적으로 도막을 형성하게 하는 도장 방법이다.The electrodeposition coating process utilizes the phenomenon that the ion particles move by flowing the anode and cathode currents to the substrate and the paint. The electrodeposition coating process is a coating method in which a coating film is formed on the surface of a substrate by passing direct current through the substrate and its counter electrode as a coating material.
전착단계는 수용성 도료에 피도물을 침적시키고, 피도물과 그 대극 사이에 직류전류를 통하여 피도물 표면에 전기적으로 도막을 석출시킨다.The electrodeposition step deposits the coating material on the water-soluble coating material, and electrically discharges the coating film on the surface of the coating material through the direct current between the coating material and the counter electrode.
이후 여액단계, 후처리단계 등을 거친 후 건조를 수행한다.After the filtration step, the post-treatment step, and the like, drying is performed.
여액단계는 전착도장에서 발생되는 잔류도료를 회수하여, 폐기처분에 의한 도료 비용 증가 문제를 해결하기 위한 단계이다. 특히 대용량 설비에서의 원가절감 효과가 크다.The filtrate step is a step for recovering the residual paint generated in the electrodeposition painting to solve the problem of increase in paint cost due to disposal. Especially, cost reduction effect in large capacity facilities is great.
후처리단계는 제품의 표면안정화를 위하여 부여되는 구역이다.The post-treatment step is the zone conferred for surface stabilization of the product.
건조단계는 상온 ~ 140℃ 이하에서의 공정으로 제품에 내식성, 경도가 부여한다. 특히 본 발명에서는 저온소부형 전착 도료를 사용하여, 저온에서의 건조가 가능하다. 저온소부형 전착 도료를 사용하여 건조는 상온 ~ 140℃ 이하 수행될 수 있다.The drying step is a process at room temperature to 140 ° C or less, giving the product corrosion resistance and hardness. In particular, in the present invention, it is possible to dry at a low temperature by using a low temperature baked electrodeposition coating. Drying using a low-temperature baked electrodeposition coating can be performed at room temperature to 140 ° C or less.
도 2를 참조하여 본 발명에 따라 제조된 전착도장된 플라스틱을 설명한다.The electrodeposited plastics produced according to the present invention will be described with reference to FIG.
에칭공정을 통해 플라스틱(10)의 표면에는 홀(11)이 형성되어 있다. 팔라듐층(20)은 홀(11) 내부를 중심으로 플라스틱(10) 표면에 산점되어 있다.A hole (11) is formed in the surface of the plastic (10) through an etching process. The
화학도금 니켈층(30)은 플라스틱(10) 전체 표면에 형성되어 있으며 팔라듐층(20)과 직접 접촉한다.The chemically plated nickel layer 30 is formed on the entire surface of the
전기도금 니켈층(40)은 플라스틱(10) 전체 표면에 형성되어 있으며 화학도금 니켈층(30)과 직접 접촉한다.The electroplated nickel layer 40 is formed on the entire surface of the
전기도금 니켈층(40)의 두께는 화학도금 니켈층(30)의 두께의 5배 내지 20배, 5배 내지 15배, 7배 내지 13배일 수 있다.The thickness of the electroplated nickel layer 40 may be 5 to 20 times, 5 to 15 times, 7 to 13 times the thickness of the chemically plated nickel layer 30.
전착도장층(50)은 플라스틱(10) 전체 표면에 형성되어 있으며 전기도금 니켈층(40)과 직접 접촉한다.The
본 발명에 속하는 기술 분야에 통상적인 지식을 가진 자는 본 발명의 본질적인 특성에서 벗어나지 않는 범위에서 변형된 형태로 구현될 수 있음을 이해할 수 있을 것이다. 그러므로 상기 설명적인 관점에서 그와 동등한 범위 내에 있는 내용을 본 발명에 포한된 것으로 해석되어야 한다.It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.
Claims (6)
표면에 홀이 형성된 플라스틱;
상기 홀에 위치하는 팔라듐층;
상기 팔라듐층 상에 형성되어 있는 화학도금 니켈층;
상기 화학도금 니켈층 상에 형성되어 있는 전기도금 니켈층; 및
상기 전기도금 니켈층 상에 형성되어 있는 전착도장층을 포함하며,
상기 전기도금 니켈층과 상기 화학도금 니켈층은 직접 접하고 있으며,
상기 전기도금 니켈층의 두께는 상기 화학도금 니켈층의 두께의 5배 내지 20배이며,
상기 팔라듐층은,
상기 표면에 홀이 형성된 플라스틱의 표면에 팔라듐과 주석을 침투 및 흡착시키는 단계;및
상기 주석을 제거하여 상기 팔라듐층을 형성하는 단계를 거쳐 얻어진 것인 전착도장된 플라스틱.In electrodeposited plastics,
Plastic with holes on its surface;
A palladium layer located in the hole;
A chemically-plated nickel layer formed on the palladium layer;
An electroplated nickel layer formed on the chemically-plated nickel layer; And
And an electrodeposition coating layer formed on the electroplated nickel layer,
Wherein the electroplated nickel layer and the chemically-plated nickel layer are in direct contact with each other,
Wherein the thickness of the electroplated nickel layer is 5 to 20 times the thickness of the chemically plated nickel layer,
The palladium layer may be,
Penetrating and adsorbing palladium and tin on the surface of the plastic on which the holes are formed;
And removing the tin to form the palladium layer.
상기 전기도금 니켈층은 무광택 니켈층인 것을 특징으로 하는 전착도장된 플라스틱.The method according to claim 1,
Wherein the electroplated nickel layer is a matte nickel layer.
상기 팔라듐층은 상기 플라스틱 상에 부분적으로 형성되어 있으며,
상기 화학도금 니켈층과 상기 전기도금 니켈층은 상기 팔라듐층보다 넓게 형성되어 있는 것을 특징으로 하는 전착도장된 플라스틱.3. The method of claim 2,
Wherein the palladium layer is partially formed on the plastic,
Wherein the plated nickel layer and the plated nickel layer are formed wider than the palladium layer.
상기 화학도금 니켈층과 상기 전기도금 니켈층은 상기 플라스틱 전면에 형성되어 있는 것을 특징으로 하는 전착도장된 플라스틱. 3. The method of claim 2,
Wherein the plated nickel layer and the plated nickel layer are formed on the entire surface of the plastic.
상기 전기도금 니켈층과 상기 전착도장층은 직접 접하고 있는 것을 특징으로 하는 전착도장된 플라스틱.The method according to claim 1,
Wherein the electroplated nickel layer and the electrodeposition coating layer are in direct contact with each other.
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