KR101808793B1 - Circuit protection device and method of manufacturing the same - Google Patents
Circuit protection device and method of manufacturing the same Download PDFInfo
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- KR101808793B1 KR101808793B1 KR1020150071828A KR20150071828A KR101808793B1 KR 101808793 B1 KR101808793 B1 KR 101808793B1 KR 1020150071828 A KR1020150071828 A KR 1020150071828A KR 20150071828 A KR20150071828 A KR 20150071828A KR 101808793 B1 KR101808793 B1 KR 101808793B1
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- esd protection
- noise filter
- pattern
- electrode
- forming
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/043—Printed circuit coils by thick film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The ESD protection unit includes a thick film process or a thin film process. The noise filter unit is formed by a thin film process. The ESD protection unit is formed by a thin film process And a method of manufacturing the same.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit protection device, and more particularly, to a circuit protection device in which an electrostatic discharge (ESD) device and a common mode noise filter are stacked in a single chip, and a manufacturing method thereof.
Various frequency bands have been used in accordance with the multifunctionalization of portable electronic devices such as smart phones. That is, a plurality of functions using different frequency bands such as wireless LAN (wireless LAN), bluetooth, and GPS are adopted in one smartphone. In addition, due to the high integration of electronic devices, the internal circuit density in a limited space is increased, thereby causing noise interference between internal circuits inevitably.
A plurality of circuit protection devices are used to suppress noise at various frequencies of the portable electronic device and to suppress noise between the internal circuits. For example, a capacitor, a chip bead, a common mode noise filter, or the like, which removes noise in different frequency bands, are used. Here, the common mode noise filter has a structure in which two choke coils are combined into one, can pass the signal current of the differential mode, and can remove only the common mode noise current. That is, the common mode noise filter can classify and remove the differential current signal current and common mode noise current, which are AC currents. An example of such a common mode noise filter is disclosed in Korean Patent Publication No. 2013-0035474.
In addition, since electronic devices are sensitive to external stimuli, when a small abnormal voltage and high frequency noise are introduced into an internal circuit of an electronic device from the outside, a circuit is broken or a signal is distorted. In the differential mode, passive components such as diodes and varistors must be used separately to suppress the ESD that may occur at the input / output terminals together with the common mode noise filter. When a separate passive component is used for the input / output terminal to cope with ESD, the mounting area is widened and the manufacturing cost is increased. That is, since a plurality of varistors for preventing noise and a varistor for preventing ESD must be provided, the mounting area increases and a plurality of devices are required, resulting in an increase in manufacturing cost. In addition, a signal distortion occurs due to a varistor or the like for preventing ESD. In other words, the varistor serves as a capacitor in a normal operating state of an electronic device to which no transient voltage is applied, and the capacitance of the capacitor changes at a high frequency. Therefore, when a varistor element is used in a high- There arises a problem that the phenomenon occurs.
On the other hand, since the common mode noise filter is required to be mainly used in a smart phone or the like, the thin film type common mode noise filter gradually replaces the coil type common mode noise filter. The thin film common mode noise filter forms a coil pattern by forming a metal layer by electroplating. That is, the thin film type common mode noise filter has a structure in which a seed layer and a photosensitive layer are formed on a substrate, the photosensitive layer is patterned in a coil shape, an electroplating process is performed to grow a metal layer from the seed layer, And a step of forming an insulating layer thereon is repeated a plurality of times. In order to connect the lower coil pattern and the upper coil pattern, a via hole should be formed and a via hole should be filled. In order to fill the via hole, a seed layer is formed, a via pattern is formed by photolithography and development, After the growth, the metal layer and the seed layer formed in the region other than the via hole are removed. The conventional common mode noise filter has a complicated process because the seed layer formation, the photolithography and the development process must be performed to fill the via hole.
The present invention provides a circuit protection device and a method of manufacturing the same that can reduce the mounting area by integrating an ESD protection element and a common mode noise filter.
The present invention provides a circuit protection device in which an ESD protection device formed by a thick film or thin film process and a common mode noise filter formed by a thin film process are implemented in one chip, and a method of manufacturing the same.
The present invention provides a circuit protection device and a manufacturing method thereof that can simplify the manufacturing process of the common mode noise filter.
A method of manufacturing a circuit protection device according to an embodiment of the present invention includes: forming an ESD protection portion on a substrate; And forming a noise filter portion on the ESD protection portion, wherein the ESD protection portion is formed by a thick film process or a thin film process, and the noise filter portion is formed by a thin film process.
The ESD protection unit includes first and second internal electrodes spaced apart from each other in the vertical direction, and an ESD protection layer formed in contact with the first and second internal electrodes. The noise filter unit includes a plurality of coils And a lead pattern connected to the coil pattern and exposed to the outside.
A first external electrode connected to the first internal electrode and connected to the ground terminal, and a second external electrode connected to the second internal electrode and the lead pattern and connected to the signal input terminal.
The first outer electrode is partially formed at the same time as the first inner electrode, and the second outer electrode is partially formed at the same time as the second inner electrode. The first and second outer electrodes are formed in the coil pattern and the outgoing pattern .
Wherein the step of fabricating the noise filter portion comprises: forming a first portion of a plating lead and a second external electrode connected thereto and a first coil pattern; Forming an insulating film on the first coil pattern and then forming a via hole exposing the first coil pattern and the first portion of the second external electrode; Forming a via plug for filling the via hole from the first portion of the first coil pattern and the second external electrode by applying power through the plating lead line; And forming a second portion of the second external electrode and a second coil pattern connected to the via plug on the insulating layer.
At least one coil pattern is stacked in the vertical direction on the second coil pattern, and a plurality of the coil patterns stacked in the vertical direction are arranged in the horizontal direction in a region between the plating lead lines.
The noise filter unit may be formed in contact with the ESD protection unit, or may be formed as a separate process from the ESD protection unit and bonded to the ESD protection unit.
The ESD protection portion is formed between the vertical coil patterns.
The ESD protection layer formed by the thick film process is a material obtained by mixing at least one conductive material including RuO 2 , Pt, Pd, Ag, Au, Ni, Cr, and W with at least one organic material including PVA and PVB .
And forming the ESD protection layer and then performing a heat treatment process at 600 ° C to 1000 ° C.
The ESD protection layer formed by the thin film process may include at least one conductive material including RuO 2 , Pt, Pd, Ag, Au, Ni, Cr, and W to at least one polymer including polyimide, epoxy resin, and benzocyclobutene. And the like.
And forming the ESD protection layer and then performing a heat treatment process at 100 ° C to 400 ° C.
A circuit protection device according to another aspect of the present invention is a circuit protection device manufactured by the above method including an ESD protection unit and a noise filter unit formed on a substrate and an external electrode connected to the ESD protection unit and the noise filter unit The ESD protection unit includes first and second internal electrodes spaced apart from each other in the vertical direction, and an ESD protection layer formed in contact with the first and second internal electrodes. The noise filter unit includes a plurality of coil patterns, The external electrode includes a first external electrode connected to the first internal electrode and connected to the ground terminal, and a second external electrode connected to the second internal electrode and the outgoing pattern, And a second external electrode connected to the terminal.
The first internal electrodes are spaced apart from each other by a predetermined distance, and the ESD protection layer is formed between the first internal electrodes.
The external electrodes are formed on the side surface and the upper surface of the laminate from the substrate.
The circuit protection device according to the embodiments of the present invention can be formed by stacking the ESD protection part and the noise filter part in one device, thereby performing the ESD removing function as well as the noise removal by using one device . Therefore, compared to the conventional one using two or more separate devices to protect the common mode noise and ESD, the device can be manufactured in a single chip and miniaturized. Therefore, the size of the electronic device can be prevented from increasing, the mounting area can be drastically reduced, Distortion of the input / output signal can be prevented by using the device, and the reliability of the electronic device can be improved.
In addition, the ESD protection part may be formed by a thick film or thin film process, the noise filter part may be formed by a thin film process, the noise filter part may be formed with a lead pattern and a plating lead line so as to be connected to the coil pattern when the coil pattern of the lowermost layer is formed, The via hole can be filled by an electroplating process using the lower coil pattern as a seed by making it possible to receive power. Therefore, compared with the conventional method in which a seed layer and a metal layer are formed to fill a via hole, the seed layer formation step for burial hole is not performed, thereby reducing the number of processes and time and improving productivity.
1 is a perspective view of a circuit protection device according to an embodiment of the present invention;
FIGS. 2 and 3 are cross-sectional views taken along lines AA 'and BB' of FIG. 1;
4 is an exploded perspective view of an ESD protection portion of a circuit protection device according to an embodiment of the present invention.
5 is a schematic diagram of a noise filter portion of a circuit protection device according to an embodiment of the present invention.
6 to 12 are sectional views sequentially taken along line AA 'of FIG. 1 to explain a method of manufacturing a circuit protection device according to an embodiment of the present invention.
13 is a sectional view of a circuit protection device according to another embodiment of the present invention.
14 is a schematic view of an ESD protection portion of a circuit protection device according to another embodiment of the present invention.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of other various forms of implementation, and that these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know completely.
FIG. 1 is a perspective view of a circuit protection device according to an embodiment of the present invention, and FIGS. 2 and 3 are sectional views taken along lines A-A 'and B-B' of FIG. FIG. 4 is an exploded perspective view of an ESD protection unit of a circuit protection device according to an embodiment of the present invention, and FIG. 5 is a schematic view of a noise filter unit of a circuit protection device according to an embodiment of the present invention.
Referring to FIGS. 1, 2 and 3, a circuit protection device according to an embodiment of the present invention includes a
The
The
The
The
The
The
The first
The insulating
The
The second
As described above, the circuit protection device according to one embodiment of the present invention may be formed by stacking the
Meanwhile, the circuit protection device according to an embodiment of the present invention can form the
Referring to FIG. 6, an
Referring to FIG. 7, a first insulating
Referring to FIG. 8, the
9, a second insulating
10, a
Referring to FIG. 11, the
Referring to FIG. 12, a coil pattern is formed by a predetermined number of layers, and a third
As described above, in the method of fabricating the circuit protection device according to the embodiment of the present invention, the
Meanwhile, the circuit protection device according to an embodiment of the present invention includes a
In addition, the
Although the technical idea of the present invention has been specifically described according to the above embodiments, it should be noted that the above embodiments are for explanation purposes only and not for the purpose of limitation. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention.
100: substrate 200: ESD protection part
300: Noise filter unit 400: External electrode
500: magnetic layer
Claims (15)
And forming a noise filter portion including a plurality of coil patterns provided in the vertical and horizontal directions on the ESD protection portion,
Wherein the ESD protection unit is formed by a thick film process or a thin film process, the noise filter unit is formed by a thin film process,
Wherein forming the noise filter portion comprises:
Forming a plating lead line and a first coil pattern connected to the plating lead line,
Forming an insulating film on the first coil pattern and then forming a via hole exposing the first coil pattern;
Forming a via plug for filling the via hole from the first coil pattern by applying power through the plating lead line;
And forming a second coil pattern connected to the via plug on the insulating film.
Wherein the noise filter portion further includes a lead pattern connected to the coil pattern and exposed to the outside.
Forming a first portion of a second external electrode connected to the plating lead line;
Forming a via hole in the insulating layer to expose a first portion of the second external electrode;
Forming a via plug to fill the via hole from the first portion of the second external electrode by applying power through the plating lead line; And
And forming a second portion of a second external electrode connected to the via plug on the insulating layer.
An ESD protection part and a noise filter part laminated on a substrate, and an external electrode connected to the ESD protection part and the noise filter part,
The ESD protection unit includes first and second internal electrodes spaced apart from each other in the vertical direction, and an ESD protection layer formed in contact with the first and second internal electrodes,
Wherein the noise filter portion includes a plurality of coil patterns and an extraction pattern connected to the coil pattern and exposed to the outside,
Wherein the external electrode includes a first external electrode connected to the first internal electrode and connected to a ground terminal, and a second external electrode connected to the second internal electrode and the lead pattern and connected to the signal input terminal, .
Priority Applications (2)
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KR1020150071828A KR101808793B1 (en) | 2015-05-22 | 2015-05-22 | Circuit protection device and method of manufacturing the same |
PCT/KR2016/004586 WO2016190559A1 (en) | 2015-05-22 | 2016-05-02 | Circuit protection device and manufacturing method therefor |
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KR1020150071828A KR101808793B1 (en) | 2015-05-22 | 2015-05-22 | Circuit protection device and method of manufacturing the same |
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KR20160137146A KR20160137146A (en) | 2016-11-30 |
KR101808793B1 true KR101808793B1 (en) | 2017-12-13 |
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KR101994754B1 (en) | 2017-08-23 | 2019-07-01 | 삼성전기주식회사 | Inductor |
Citations (1)
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KR100732128B1 (en) * | 2005-11-10 | 2007-06-25 | (주) 래트론 | A bead-varistor integrated device with different materials |
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US8633777B2 (en) * | 2009-12-01 | 2014-01-21 | Qualcomm Incorporated | Methods and apparatus for inductors with integrated passive and active elements |
JP2012074460A (en) * | 2010-09-28 | 2012-04-12 | Murata Mfg Co Ltd | Esd protection device |
JP5459291B2 (en) * | 2011-10-28 | 2014-04-02 | Tdk株式会社 | Composite electronic components |
KR101912270B1 (en) * | 2013-07-26 | 2018-10-29 | 삼성전기 주식회사 | Common mode filter |
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2015
- 2015-05-22 KR KR1020150071828A patent/KR101808793B1/en active IP Right Grant
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KR100732128B1 (en) * | 2005-11-10 | 2007-06-25 | (주) 래트론 | A bead-varistor integrated device with different materials |
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