KR101798040B1 - Method for hybrid printing and rf resonator manufactured using the same - Google Patents

Method for hybrid printing and rf resonator manufactured using the same Download PDF

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Publication number
KR101798040B1
KR101798040B1 KR1020150161324A KR20150161324A KR101798040B1 KR 101798040 B1 KR101798040 B1 KR 101798040B1 KR 1020150161324 A KR1020150161324 A KR 1020150161324A KR 20150161324 A KR20150161324 A KR 20150161324A KR 101798040 B1 KR101798040 B1 KR 101798040B1
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South Korea
Prior art keywords
dielectric substrate
ground plane
line
circuit
resonator
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KR1020150161324A
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Korean (ko)
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KR20170057922A (en
Inventor
임성준
이삭
Original Assignee
중앙대학교 산학협력단
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/10—Dielectric resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Details Of Aerials (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

The present invention discloses a hybrid printing method. The hybrid printing method of the present invention includes printing a metal circuit on a thin planar nonconductor using an inkjet printing technique; Fabricating a dielectric substrate using a three-dimensional printing technique using a non-conductive vagina as a raw material; Creating a ground plane; And attaching the metal circuit, the dielectric substrate, and the ground plane.

Description

TECHNICAL FIELD [0001] The present invention relates to a hybrid printing method and an RF resonator using the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid printing method and a device manufactured using the hybrid printing method. More particularly, the present invention relates to a hybrid printing method using a three-dimensional printing technique and an inkjet printing technique, an RF resonator (RF resonator) Radio Frequency Antenna.

3D printing technology has many advantages such as an environmentally friendly and uncomplicated process such as injection of raw material such as plastic liquid or powder and freely taking out 3D solid material. Therefore, 3D printing technology is attracting much attention in many fields.

A 3D printer based on such a three-dimensional printing technology can be classified into a metal 3D printer using a metal material and a plastic 3D printer using a plastic material.

Metal 3D printers use DMLS (Direct Metal Laser Sintering), DMT (Laser-aided Direct Metal Tooling), etc. This method is very expensive and requires a long production time have. Therefore, there is a disadvantage that such a three-dimensional printing technique is not easy to access.

In the case of plastic 3D printers, the same method as FDM (Fused Deposition Modeling) is used. The cost of equipment is low, and by using eco-friendly and low-cost materials such as PLA (Polyacarboxylic Acid) or Acrylonitrile Butadiene Styrene This is an easy feature. In this case, however, there is a disadvantage that a conductive device can not be created.

Therefore, conventionally, in order to make a conductive device such as a RF resonator using a 3D printer, a metal 3D printer has to be used, so that a high cost and long production time have been required.

It is an object of the present invention to provide a hybrid printing method in which a conductor portion of a conductive device is fabricated using an inkjet printing technique and a dielectric portion is fabricated using a three-dimensional printing technique.

It is another object of the present invention to provide an RF resonator fabricated using the hybrid printing method.

It is still another object of the present invention to provide an RF antenna fabricated using the hybrid printing method.

In order to accomplish the above object, the hybrid printing method of the present invention includes printing a metal circuit on a thin planar nonconductor using inkjet printing technology; Fabricating a dielectric substrate using a three-dimensional printing technique using a non-conductive material as a raw material; Creating a ground plane; And attaching the metal circuit, the dielectric substrate, and the ground plane.

Preferably, the metal circuit printing step may use the conductive ink to print the metal circuit on paper.

Preferably, the dielectric substrate manufacturing step may use a three-dimensional printing technique of FDM (Fused Deposition Modeling).

Preferably, the dielectric substrate manufacturing step may use a PLA (poly-late acid) material.

Preferably, the step of fabricating the dielectric substrate may produce a dielectric substrate in the form of a flat plate.

Preferably, the step of fabricating the dielectric substrate may produce a dielectric substrate having a mesh shape.

Preferably, the metal circuit printing step may print an RF resonator circuit or an RF antenna circuit.

Preferably, the RF resonator circuit includes a first line of a predetermined width connected to the input / output terminals across the center of the dielectric substrate in the vertical direction; And a second line having a predetermined width extending in a horizontal direction at a center of the first line.

Preferably, the generating of the ground plane may include attaching a copper tape to the lower surface of the dielectric substrate to generate a ground plane.

Preferably, the adhering step may be performed using a film-type adhesive film to adhere the metal circuit and the dielectric substrate.

According to another aspect of the present invention, there is provided an RF resonator comprising: a dielectric substrate fabricated using a three-dimensional printing technique using a non-conductive material as a raw material; An RF resonator circuit printed on a thin planar nonconductor using an inkjet printing technique using conductive ink and attached to one side of the dielectric substrate; And a ground plane attached to the other side of the dielectric substrate.

Preferably, the dielectric substrate may be fabricated using a FDM (Fused Deposition Modeling) type three-dimensional printing technique using PLA (Poly-D Acid) as a material.

Preferably, the dielectric substrate may be in the form of a flat plate or a mesh.

Preferably, the RF resonator circuit includes a first line of a predetermined width connected to the input / output terminals across the center of the dielectric substrate in the vertical direction; And a second line having a predetermined width extending in a horizontal direction at a center of the first line.

According to the present invention, by providing a hybrid printing method using a three-dimensional printing technique and an ink-jet printing technique in combination with a conductor portion manufactured using an ink-jet printing technique and a dielectric portion fabricated using a three-dimensional printing technique, There is an advantage that a resonator or an antenna can be generated at a cost.

1 is a flowchart of a hybrid printing method according to an embodiment of the present invention.
2 is a view for explaining an example of generating a conductive device using a hybrid printing method according to an embodiment of the present invention.
3 is a front view of an RF resonator fabricated using a hybrid printing method according to an embodiment of the present invention.
4 is a view illustrating a back surface of an RF resonator fabricated using a hybrid printing method according to an embodiment of the present invention.
5 is a diagram illustrating first and second examples of a dielectric substrate type produced in accordance with an embodiment of the present invention.
FIG. 6 is a diagram comparing parasitic losses according to the shape of the dielectric substrate illustrated in FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to facilitate a person skilled in the art to easily carry out the technical idea of the present invention. . In the drawings, the same reference numerals are used to designate the same or similar components throughout the drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a flowchart of a hybrid printing method according to an embodiment of the present invention. Referring to FIG. 1, a hybrid printing method according to an embodiment of the present invention is as follows.

First, in step S110, a first printer supporting inkjet printing technology prints a metal circuit on a thin planar nonconductor using an inkjet printing technique.

For this, a conductive ink (for example, silver ink or the like) may be used. In addition, the metal circuit can be printed on paper. At this time, the present invention is not limited to printing the metal circuit on paper. That is, the present invention is capable of printing metal circuits on all thin flat non-conductors. For example, the metal circuit may be printed on a transparent sheet of vinyl material.

Meanwhile, the printed metal circuit may be an RF resonator circuit or an RF antenna circuit. A concrete configuration example of the RF resonator circuit or the RF antenna circuit will be described with reference to FIGS. 3 and 4. FIG.

In step S120, the second printer supporting the three-dimensional printing technology fabricates the dielectric substrate using the three-dimensional printing technique.

At this time, the second printer performs three-dimensional printing using a non-conductive material such as plastic as a raw material. For example, in step S120, a three-dimensional printing technique based on FDM (Fused Deposition Modeling) using polylactic acid (PLA) as a material can be used. At this time, the dielectric substrate to be manufactured may be formed in a flat plate shape in which the PLA is filled, or in the form of a mesh in which holes are formed at regular intervals.

In step S130, the ground plane generating apparatus generates the ground plane.

At this time, the ground plane generating device may generate a ground plane in the form of copper tape, generate a metal ground plane through ink jet printing, or cut an existing metal to create a ground plane.

Here, the ground plane generating apparatus may be a device for generating copper tape, a device for cutting metal, or a printer supporting ink jet printing technology such as a first printer.

Finally, in step S140, the attaching apparatus attaches the metal circuit, the dielectric substrate and the ground plane respectively generated in steps S110 to S130.

For example, the attaching device may attach the ground plane generated in the form of a copper tape to the dielectric substrate, and the dielectric substrate and the metal circuit with the ground plane may be attached using an adhesive film. However, the present invention is not limited to this, and a metal circuit and a dielectric substrate can be attached using various methods. Through the process of steps S110 to S140, a resonator or an antenna can be fabricated.

As described above, according to the embodiment of the present invention, there is an advantage that a conductive device can be manufactured at a low cost in a short time by providing a hybrid printing method using a three-dimensional printing technique and an ink-jet printing technique in combination.

In particular, when a metal 3D printer is used, a considerably high cost is required. However, since the inkjet printing technology of the first printer is used in the present invention, it is possible to easily manufacture a metal circuit at low cost.

On the other hand, the process of steps S110 to S140 is performed by each of the first printer, the second printer, the ground plane generator, and the attaching device, wherein each of the devices is arranged in series on a production line in the same space, The operation may be performed according to the process, but the operation may be performed separately for the separated time in the separated space.

2 is a view for explaining an example of generating a conductive device using a hybrid printing method according to an embodiment of the present invention.

Referring to FIGS. 1 and 2, a printed metal circuit 110 is positioned on a first layer (Layer # 1) at the top, and a second layer (Layer # 2) And the ground plane 130 using the copper tape is positioned on the third layer (Layer # 3), which is the lowest layer.

2, an example in which the mesh-shaped dielectric substrate 120 is positioned on the second layer (Layer # 2) is shown. However, the present invention is not limited to the example illustrated in FIG. For example, it is also possible to use a dielectric substrate in the form of a flat plate.

FIGS. 3 and 4 show examples of an RF resonator fabricated using the hybrid printing method illustrated in FIG.

3 is a front view of the RF resonator, and FIG. 4 is a rear view of the RF resonator.

Referring to FIG. 3, a T-shaped RF resonator circuit is printed on the front surface 100a of the RF resonator. The T-shaped RF resonator circuit includes an RF resonator A first line 111 having a predetermined width connected to the input / output terminal A / B of the first line 111 and a second line 113 having a predetermined width extending a predetermined length in the horizontal direction from the center of the first line 111, .

3, the length M of the first line 111 is 50 mm, the length 4 / λ of the second line 113 is 37.5 mm, the lengths of the first and second lines 111 and 111, , And 113 (width) W is preferably 7.1 mm.

3, a T-shaped RF resonator circuit has been described. However, the present invention is not limited to the T-shaped RF resonator circuit, and the present invention can be applied to various types of RF resonator circuits.

Referring to FIG. 4, a copper tape 130 covering the entire dielectric substrate is attached to the rear surface 100b of the RF resonator to form the copper tape 130 as a ground plane.

The RF antenna is similar to the RF resonator shown in FIGS. 3 and 4 except that it has no output terminal, and the remaining configuration is very similar. That is, the RF antenna circuit type and the connection form with the RF antenna circuit, the dielectric substrate and the ground plane, and the structure thereof are very similar to those of the RF resonator. Accordingly, specific examples and explanations of the RF antenna will be replaced with the description of Figs. 3 and 4. Fig.

5 is a diagram illustrating first and second examples of a dielectric substrate type produced in accordance with an embodiment of the present invention.

5 (a) illustrates a first example of a dielectric substrate produced in accordance with an embodiment of the present invention, and FIG. 5 (b) illustrates a second example of a dielectric substrate produced in accordance with an embodiment of the present invention have.

5A and 5B, a first example of the dielectric substrate produced according to the embodiment of the present invention is a dielectric substrate 120a in the form of a flat plate, and the dielectric substrate 120a formed according to the embodiment of the present invention It can be seen that the second example of the substrate is a dielectric substrate 120b in the form of a mesh.

As described above, there is a difference in performance between the case where the dielectric substrate is implemented in the form of a flat plate and the case where the dielectric substrate is implemented in the form of a mesh. FIG. 6, and FIGS. 7A and 7B are graphs for comparing the results.

FIG. 6 is a diagram comparing parasitic losses according to the shape of the dielectric substrate illustrated in FIG.

Referring to FIG. 6, it can be seen that the dielectric substrate of the mesh type in the frequency band of 0 to 3 GHz is less in parasitic loss than the dielectric substrate of the flat type. That is, it can be seen that the mesh substrate of the dielectric type has a better performance than the dielectric substrate of the planar type.

As described above, an optimal embodiment has been disclosed in the drawings and specification. Although specific terms have been employed herein, they are used for purposes of illustration only and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will appreciate that various modifications and equivalent embodiments are possible without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

Claims (14)

Printing a metal circuit on a thin planar nonconductor using inkjet printing technology;
Fabricating a mesh-type dielectric substrate using a three-dimensional printing technique using a non-conductive material as a raw material;
Creating a ground plane; And
Attaching a metal circuit printed on the non-conductor, a dielectric substrate and a ground plane,
The dielectric substrate fabrication step
Using FDM (Fused Deposition Modeling) 3-D printing technology using PLA (Poly-Last Acid) as a material,
Wherein the metal circuit printing step prints a T-shaped RF resonator circuit.
The method according to claim 1, wherein the metal circuit printing step
Characterized in that said metal circuit is printed on paper using conductive ink.
delete delete delete delete delete The RF resonator circuit of claim 1, wherein the RF resonator circuit
A first line of a predetermined width connected to the input / output terminals in the vertical direction across the center of the dielectric substrate; And
And a second line having a predetermined width extending in a horizontal direction at a center of the first line.
The method of claim 1, wherein the ground plane generation step
And a copper tape is attached to the lower surface of the dielectric substrate to form a ground plane.
2. The method of claim 1,
Wherein the metal circuit and the dielectric substrate are attached using an adhesive film.
A mesh type dielectric substrate manufactured using a three-dimensional printing technique using a non-conductive material as a raw material;
A T-shaped RF resonator circuit that is printed on a thin planar nonconductor using an inkjet printing technique using conductive ink and then attached to one side of the dielectric substrate; And
And a ground plane attached to the other side of the dielectric substrate,
The dielectric substrate
And is fabricated using a three-dimensional printing technique of Fused Deposition Modeling (FDM) using PLA (polyacid acid) as a material.
delete delete 12. The system of claim 11, wherein the RF resonator circuit
A first line of a predetermined width connected to the input / output terminals in the vertical direction across the center of the dielectric substrate; And
And a second line having a predetermined width extending in a horizontal direction at a center of the first line.
KR1020150161324A 2015-11-17 2015-11-17 Method for hybrid printing and rf resonator manufactured using the same KR101798040B1 (en)

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KR101984841B1 (en) 2017-12-06 2019-05-31 울산과학기술원 Dielectric resonators based on 3d printing, resonance structures and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007000833A1 (en) 2005-06-29 2007-01-04 Harima Chemicals, Inc. Method for electrically conductive circuit formation
JP2016159629A (en) 2015-02-28 2016-09-05 ゼロックス コーポレイションＸｅｒｏｘ Ｃｏｒｐｏｒａｔｉｏｎ Systems and methods for implementing multi-layer addressable curing of ultraviolet (uv) light curable inks for three dimensional (3d) printed parts and components

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007000833A1 (en) 2005-06-29 2007-01-04 Harima Chemicals, Inc. Method for electrically conductive circuit formation
JP2016159629A (en) 2015-02-28 2016-09-05 ゼロックス コーポレイションＸｅｒｏｘ Ｃｏｒｐｏｒａｔｉｏｎ Systems and methods for implementing multi-layer addressable curing of ultraviolet (uv) light curable inks for three dimensional (3d) printed parts and components

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Title
John Kimionis외 4인, "3D/Inkjet-printed Origami Antennas for Multi-direction RF Harvesting", 2015 IEEE MTT-S International Microwave Symposium, 2015년 5월.*
Kunal A. Nate외 4인, " A Fully Printed Multilayer Aperture-Coupled Patch Antenna Using Hybrid 3D / Inkjet Additive Manufacturing Technique ", Proceedings of the 45th European Microwave Conference, 2015년*

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