KR101784461B1 - Laser direct imaging apparatus and laser direct imaging method - Google Patents

Laser direct imaging apparatus and laser direct imaging method Download PDF

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Publication number
KR101784461B1
KR101784461B1 KR1020160031095A KR20160031095A KR101784461B1 KR 101784461 B1 KR101784461 B1 KR 101784461B1 KR 1020160031095 A KR1020160031095 A KR 1020160031095A KR 20160031095 A KR20160031095 A KR 20160031095A KR 101784461 B1 KR101784461 B1 KR 101784461B1
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South Korea
Prior art keywords
scanner
laser pulse
error
laser
stage
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KR1020160031095A
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Korean (ko)
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KR20170107300A (en
Inventor
김경한
이제훈
안상훈
최지연
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한국기계연구원
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G03F7/70366—Rotary scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention provides a laser direct drawing apparatus and a laser direct drawing method capable of improving a processing speed and reducing an error.
According to one aspect of the present invention, there is provided a laser direct drawing apparatus comprising: a polygon scanner rotatably installed and having a polygonal cross section; a stage on which a workpiece is placed; a stage controller for transferring the stage; The error measuring unit and the laser pulse are turned on or off while the error is controlled by controlling the ON or OFF of the laser pulse based on the signal transmitted from the first error measuring unit And a laser modulator for compensating the laser beam.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser direct drawing apparatus and a laser direct drawing method,

The present invention relates to a laser direct drawing apparatus and a laser direct drawing method.

Photolithography is a core technology that can realize thin and light chips pursued in modern industry, and it can realize electronic circuits from tens of microns to tens of nanometers beyond the mechanical limit of material processing technology. This technology can be applied not only to flat panel display (FPD) and PCB manufacturing industry but also to all industries requiring semiconductor fabrication and other fine shape processing. By using this technology, it is possible to miniaturize precision PCB, realize low power consumption products, Development of microrobots, and production of high resolution flat panel display products.

As a photolithography method, there is a contact type, a proximity type, and a projection type. For example, in the case of the projection type, after the light emitted from the light source is passed through the FEL to improve the uniformity of the beam, The beam is irradiated by a projection lens through a pattern on a reticle serving as a mask, and the light is converted into a required size on the substrate, and the pattern is transferred to the substrate surface, and is used for photolithography.

Such a photolithography method is widely used in an exposure apparatus. In general, an exposure apparatus for forming a pattern on a substrate includes a PDP, a shadow mask (S / M), a PCB, a color filter (C / F) And the like. After a photoresist film is formed on a film to be patterned in a patterning process by using a mask, an optical system, an adjusting stage, and ultraviolet rays, a predetermined mask pattern is positioned corresponding to the photoresist film, The exposed portion of the photoresist film is removed by development, and the exposed film is removed by an etching process through the removed photoresist film pattern, and the photoresist film pattern is removed to remove the exposed film on the glass substrate A method of forming a desired pattern on a substrate has been used.

However, in the case of patterning a film on a glass by a photolithography method as described above, the process is complicated and complicated, the cost of the apparatus is high, and manufacturing time and cost are increased.

In order to solve the above problems, a direct patterning technique for forming a desired pattern by directly irradiating a laser beam onto a film has been required. In recent years, a polygon scanner has been used to form a desired pattern on an ITO film or a black matrix of a color filter A dry etching apparatus has been developed and commercialized.

However, the direct patterning technique using a polygon scanner has a drawback that it takes much time compared with the conventional method. In addition, there is a problem that an error occurs in a pattern having a size of several tens of micrometers depending on the rotation error of the polygon scanner and the movement error of the stage.

The present invention provides a laser direct drawing apparatus and a laser direct drawing method capable of improving a processing speed and reducing an error.

According to an aspect of the present invention, there is provided a laser direct drawing apparatus comprising: a polygon scanner rotatably installed and having a plurality of reflection surfaces; a stage on which a workpiece is placed; a stage controller for transferring the stage; 1 error measuring unit and the laser pulse are turned on or off while controlling the on or off of the laser pulse based on the signal transmitted from the first error measuring unit, Of the laser beam.

Here, the laser direct-write apparatus may further include a second error measuring unit for measuring a rotation error of the polygon scanner, and the laser modulator may be configured to measure a rotation error of the polygon scanner based on the signals transmitted from the first error measuring unit and the second error measuring unit The error can be compensated by controlling on or off.

In addition, the transfer unit may variably control the moving speed of the stage according to the input drawing, and the laser direct drawing apparatus may include a galvanometer scanner installed in front of the polygon scanner to move the laser in the thickness direction of the polygon scanner, As shown in FIG.

The polygon scanner may move a laser pulse in a first direction on a surface of a substrate, and the galvano scanner may move a laser pulse in a second direction intersecting a first direction on a surface of the substrate.

The polygon scanner may also move a laser pulse at a surface of the substrate at a first speed and the galvano scanner may move a laser pulse at a surface of the substrate at a second speed that is greater than the first speed.

The laser direct writing apparatus may further include a scanner board connected to the galvano scanner and controlling the galvano scanner based on a signal transmitted from the second error measuring unit.

According to another aspect of the present invention, there is provided a laser direct drawing apparatus comprising: a polygon scanner rotatably installed and having a plurality of reflecting surfaces; a stage on which a workpiece is placed; a stage transferring unit for transferring the stage; And a galvanometer scanner for reciprocating the laser in the thickness direction of the polygon scanner.

Wherein the polygon scanner moves a laser pulse at a surface of the substrate at a first speed and the galvano scanner can move a laser pulse at a surface of the substrate at a second speed that is greater than the first speed.

The polygon scanner may move a laser pulse in a first direction on a surface of a substrate, and the galvano scanner may move a laser pulse in a second direction intersecting a first direction on a surface of the substrate.

The laser direct writing apparatus may further include a scanner board connected to the galvano scanner and controlling the galvano scanner based on a signal transmitted from the second error measuring unit.

According to another aspect of the present invention, there is provided a laser direct drawing method including: a laser modulation step of generating a laser pulse, wherein a laser pulse is turned on or off; a polygon scanner control step of rotating the polygon scanner to move the laser; An error measuring step of measuring a movement error of the stage, and an error compensation step of compensating for on or off of the laser pulse based on the signal transmitted in the error measuring step .

Here, the laser direct drawing method may further include a galvanometer scanner control step of causing the laser to be incident on the polygon scanner while rotating the galvano scanner, and reciprocating the laser in the thickness direction of the polygon scanner.

The error measuring step also measures the rotation error of the polygon scanner, and the error compensation step may be performed on or off of the laser pulse to compensate for the movement error of the stage and the rotation error of the polygon scanner. ) Can be compensated.

The polygon scanner control step controls the polygon scanner to move the laser pulse in the first direction on the surface of the substrate, and the galvano scanner control step controls the galvano scanner to move the laser pulse in the first direction It is possible to control to move the laser pulse in the second direction which intersects.

The polygon scanner control step also moves a laser pulse at a surface of the substrate at a first speed and the galvano scanner control step moves a laser pulse at a surface of the substrate at a second speed that is greater than the first speed .

According to an aspect of the present invention, precision of movement can be improved by compensating a movement error of a stage and a rotation error of a polygon scanner. In addition, since the Galvano scanner and the polygon scanner move the laser pulse together, the processing speed can be improved.

1 is a configuration diagram showing a laser direct-write apparatus according to a first embodiment of the present invention.
FIG. 2 is a plan view showing a state of processing using a laser direct drawing apparatus according to the first embodiment of the present invention. FIG.
3 is a flowchart for explaining the laser direct drawing method according to the first embodiment of the present invention.
4 is a configuration diagram showing a laser direct-write apparatus according to a second embodiment of the present invention.
5 is a flow chart for explaining the laser direct drawing method according to the second embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

1 is a configuration diagram showing a three-dimensional laser irradiation apparatus according to a first embodiment of the present invention.

1, the laser direct drawing apparatus 101 according to the present embodiment includes a stage 10, a polygon scanner 30, a galvanometer scanner 27, a control unit 23, a data processing unit 22, A laser oscillator 24, a laser modulator 25, a first error measuring unit 21, and a second error measuring unit 32.

The laser direct writing apparatus 101 according to the first embodiment is an apparatus for forming a pattern on a substrate 15 by irradiating a laser pulse 40. [ For example, the laser direct-write device 101 may comprise an apparatus for exposing a photoresist layer formed on a substrate.

The stage 10 is formed in a plate-like shape and is installed movably in a second direction (x-axis direction in Fig. 1). The stage 10 is controlled by the control section 23 and can be moved by a linear motor (not shown) provided on the stage 10. [ A substrate 15 is provided on the stage 10 and the substrate 15 moves together with the stage 10.

On the other hand, a first error measuring unit 21 for measuring a movement error of the stage 10 is connected to the stage 10. The first error measuring unit 21 measures an error of movement of the stage 10, and may be an encoder, a speed sensor, a position sensor, a CCD camera, or the like. The first error measuring unit 21 can measure the position and speed error of the stage 10. [

The data processing unit 22 generates CAM (computer aided manufacturing) data based on the input CAD data. The data processing unit 22 previously calculates the moving speed of the stage 10, the operation of the galvanometer scanner 27, and the laser modulation based on the drawing data. The data processing unit 22 transmits the generated CAM data to the control unit 23.

The control unit 23 includes a data transfer board 231, a motion board 233, and a scanner board 232. The data transfer board 231 transfers data at a high speed and transfers the data transferred from the data processing unit 22 to the motion board 233 and the scanner board 232. In addition, the data transfer board 231 can transmit a large amount of real-time processed data to the motion board 233 and the scanner board 232. Here, the real-time machining data refers to data transmitted from the first error measuring unit 21 and the second error measuring unit 32 and data indicating the progress of machining.

The motion board 233 is connected to the stage 10 to control the movement of the stage 10. The motion board 233 variably moves the stage 10 at different speeds depending on processing conditions. 2, for example, the motion board 233 moves the stage 10 at the first speed in the patterned machining area D1, and in the blank area D2 without the pattern, Is moved at a second speed that is faster than the first speed to improve the machining speed.

The scanner board 232 is connected to the laser oscillator 24 and the galvanometer scanner 27 to control the operation of the laser oscillator 24 and the galvanometer scanner 27. The laser oscillator 24 generates a laser pulse 40, wherein the period of the laser pulse 40 can be from 1 MHz to 100 MHz. The laser oscillator 24 generates the laser pulse 40 only when it generates the pattern by the scanner board 232.

The laser modulator 25 is provided behind the laser oscillator 24 to control the on / off of the laser pulse 40 emitted from the laser oscillator 24. [ The laser modulator 25 controls ON and OFF of the laser pulse 40, and the pattern is determined by the laser modulator 25. When the laser pulse 40 is turned on as shown in Fig. 2, a machining spot SP1 is formed on the substrate 15, and when the laser pulse 40 is turned off, An unprocessed empty spot SP2 is formed.

The laser modulator 25 controls on or off based on the information transmitted from the scanner board 232 and transmits the laser beam to the first error measuring unit 21 and the second error measuring unit 32 (On) or off (off) in accordance with the received signal to compensate for the error. As a result, a precise pattern can be processed on the substrate 15.

The polygon scanner 30 has a plurality of reflection surfaces and is rotatably installed to move a laser incident on the polygon scanner 30 in a first direction (y-axis direction in FIG. 1). Here, the first direction may be the width direction of the substrate 15. The polygon scanner 30 may be a polygonal column having a polygonal cross-section. The polygon scanner 30 reflects the laser pulse 40 while rotating at a constant speed around the reference axis x1 by the motor 35 connected thereto so that the reflected laser pulse 40 moves in the first direction . The polygon scanner 30 can be rotated by the motor 35 from 30000 RPM to 80000 RPM.

The polygon scanner 30 is provided with a second error measuring unit 32 for measuring the rotation error of the polygon scanner 30. [ The second error measuring unit 32 includes an encoder or a CCD camera to measure the rotation error of the polygon scanner 30 and transmits the measured error to the scanner board 232 and the laser modulator 25.

The galvano scanner 27 is disposed between the laser modulator 25 and the polygon scanner 30 and moves the laser pulse 40 incident on the laser modulator 25 to the polygon scanner 30. [ The Galvano scanner 27 may include a first reflector 271, a second reflector 273, a first motor 272, and a second motor 274. The first reflector 271 is connected to the first motor 272 so as to be rotatable and moves the laser pulse 40 in the thickness direction of the polygon scanner 30. [ The second reflection plate 273 is connected to the second motor 274 so as to be rotatable and compensates for the error.

The galvanometer scanner 27 periodically changes the irradiation direction of laser pulses using the first reflector 271 so that the galvanometer scanner 27 reciprocates the laser pulse in the thickness direction of the polygon scanner 30 .

The laser pulse 40 reciprocates in the second direction (y-axis direction) on the substrate 15 in accordance with the rotation of the galvanometer scanner 27. The second direction (y-axis direction) may be a direction intersecting the first direction (x-axis direction) and perpendicular to the first direction, and may be the longitudinal direction of the substrate 15. [

The Galvano scanner 27 is controlled by the scanner board 232. The scanner board 232 is controlled by the second error measuring unit 32 so that the error measured by the second error measuring unit 32 can be compensated. And controls the Galvano scanner 27 based on the signal. The compensation of the error can be made by the rotation of the second reflection plate 273.

As described above, according to the present embodiment, the correction of the error can be performed by the galvanometer scanner 27 and the laser modulator 25, thereby improving the accuracy.

The speed at which the polygon scanner 30 moves the laser pulse 40 in the first direction on the surface of the substrate 15 is referred to as a first speed and the speed at which the galvano scanner 27 moves from the surface of the substrate 15 in the second direction The second speed is greater than the first speed and the second speed is greater than twice the first speed and less than twenty times when the rate of moving the laser pulse 40 to the second speed is a second speed . Conventionally, the processing is performed using only the polygon scanner 30. However, according to the present embodiment, the galvanometer scanner 27 is provided, and the processing speed can be increased as compared with the conventional method.

The Galvano scanner 27 switches the movement of the laser pulse 40 in the second direction every time the polygon scanner 30 moves the laser pulse 40 in the first direction. Thus, when the laser pulse 40 is turned once in the first direction by the polygon scanner 30, the laser pulse 40 is scanned by the galvanometer scanner 27 several tens to several thousands times in the second direction You can switch. 2, each time the polygon scanner 30 moves the laser pulse 40 between the machining spots SP1, the galvanometer scanner 27 switches the direction of the laser pulses so that laser pulses 40).

The laser direct writing apparatus 101 further includes optical systems 41, 42, 43 and 45. The optical systems 41, 42, 43 and 45 may be composed of a plurality of lenses and a reflection plate. The optical systems 41, 42, 43 and 45 can change the path of the laser pulse 40 and can condense or magnify the laser pulse 40. [

3 is a flowchart for explaining the laser direct drawing method according to the first embodiment of the present invention.

1 and 3, the laser direct drawing method according to the first embodiment includes processing data generation step S101, laser modulation step S102, galvanometer scanner control step S103, polygon scanner rotation Step S104, stage transfer step S105, error measurement step S106, and error compensation step S107.

The processing data generation step (S101) generates computer aided manufacturing (CAM) data based on the input drawing data (CAD DATA). The machining data generation step (S101) previously calculates the moving speed of the stage 10, the operation of the galvanometer scanner 27, and the laser modulation based on the drawing data.

The laser modulation step S102 generates a laser pulse and controls on / off of the generated laser pulse. In the laser modulation step S102, the laser pulse is turned on or off so that the laser pulse can be irradiated only to the portion where the pattern is to be formed according to the machining data.

In the Galvano scanner control step S103, while rotating the Galvano scanner, the laser is incident on the polygon scanner, and the laser is reciprocated in the thickness direction of the polygon scanner. The Galvano scanner control step S103 controls the galvano scanner 27 to reciprocate the laser pulse 40 in the second direction (the x-axis direction in Fig. 1) on the surface of the substrate 15. [ Accordingly, the laser pulse can be changed into a form similar to the surface light source by the Galvano scanner control step S103.

The polygon scanner rotating step S104 rotates the polygon scanner 30 to move the laser pulse. The polygon scanner control step S104 controls the polygon scanner 30 to move the laser pulse in the first direction (y-axis direction in Fig. 1) on the surface of the substrate.

The polygon scanner rotation step S104 moves the laser pulse at the first speed at the surface of the substrate 15 and the galvano scanner 27 moves the laser pulse at the second speed at the surface of the substrate 15. [ Where the second speed may be greater than the first speed and the second speed may be from two to twenty times the first speed.

The stage transfer step S105 transfers the stage 10 on which the substrate 15 is mounted in the second direction. In the stage transferring step S105, the stage 10 can be transferred by the linear motor.

The error measurement step S106 measures the movement error of the stage 10 and the rotation error of the polygon scanner 30. [ The error measuring step S106 measures the moving speed and the moving position error of the stage using the first error measuring unit 21 connected to the stage 10 and the second error measuring unit 32, (30) is measured.

The error compensation step S107 compensates and controls the on or off of the laser pulse 40 based on the signal transmitted in the error measuring step S106. The error compensation step S107 controls on or off of the laser pulse to compensate for the movement error of the stage 10 and the rotation error of the polygon scanner 30. [ In addition, the error compensation step (S107) can control the rotation of the galvanometer scanner 27 to compensate for the rotation error of the polygon scanner 30. Thus, according to the first embodiment, it is possible to precisely process an error of the stage 10 and the polygon scanner 30 by compensating for the error.

Hereinafter, a laser direct drawing apparatus according to a second embodiment of the present invention will be described. 4 is a configuration diagram showing a laser direct-write apparatus according to a second embodiment of the present invention.

4, the laser direct drawing apparatus 102 according to the present embodiment includes a stage 10, a polygon scanner 30, a control unit 23, a data processing unit 22, a laser oscillator 24, A modulator 25, a first error measuring unit 21, and a second error measuring unit 32.

The laser direct writing apparatus 102 according to the first embodiment is an apparatus for forming a pattern on a substrate 15 by irradiating a laser pulse 40. [ For example, the laser direct imaging apparatus 102 may comprise an apparatus for exposing a photoresist layer formed on a substrate.

The stage 10 is formed in a plate-like shape and is movably installed in a second direction (x-axis direction in Fig. 4). The stage 10 is controlled by the control section 23 and can be moved by a linear motor (not shown) provided on the stage 10. [ A substrate 15 is provided on the stage 10 and the substrate 15 moves together with the stage 10.

On the other hand, a first error measuring unit 21 for measuring a movement error of the stage 10 is connected to the stage 10. The first error measuring unit 21 measures an error of movement of the stage 10, and may be an encoder, a speed sensor, a position sensor, a CCD camera, or the like. The first error measuring unit 21 can measure the position and speed error of the stage 10. [

The data processing unit 22 generates CAM (computer aided manufacturing) data based on the input CAD data. The data processing section 22 previously calculates the moving speed of the stage 10 and the laser modulation based on the drawing data. The data processing unit 22 transmits the generated CAM data to the control unit 23.

The control unit 23 includes a data transfer board 231, a motion board 233, and a scanner board 232. The data transfer board 231 transfers data at a high speed and transfers the data transferred from the data processing unit 22 to the motion board 233 and the scanner board 232. In addition, the data transfer board 231 can transmit a large amount of real-time processed data to the motion board 233 and the scanner board 232. Here, the real-time machining data refers to data transmitted from the first error measuring unit 21 and the second error measuring unit 32 and data indicating the progress of machining.

The motion board 233 is connected to the stage 10 to control the movement of the stage 10. The motion board 233 variably moves the stage 10 at different speeds depending on processing conditions.

The scanner board 232 is connected to the laser oscillator 24 to control the operation of the laser oscillator 24. The laser oscillator 24 generates a laser pulse 40, wherein the period of the laser pulse 40 can be from 1 MHz to 100 MHz. The laser oscillator 24 generates the laser pulse 40 only when it generates the pattern by the scanner board 232.

The laser modulator 25 is provided behind the laser oscillator 24 to control the pulse of the laser pulse 40 emitted from the laser oscillator 24. The laser modulator 25 controls ON and OFF of the laser pulse 40, and the pattern is determined by the laser modulator 25. When the laser pulse 40 is turned on as shown in Fig. 2, a machining spot SP1 is formed on the substrate 15, and when the laser pulse 40 is turned off, An unprocessed empty spot SP2 is formed.

The laser modulator 25 controls on or off based on the information transmitted from the scanner board 232 and transmits the laser beam to the first error measuring unit 21 and the second error measuring unit 32 (On) or off (off) in accordance with the received signal to compensate for the error. As a result, a precise pattern can be processed on the substrate 15.

The polygon scanner 30 has a plurality of reflection surfaces and is rotatably installed to move a laser incident on the polygon scanner 30 in a first direction (y-axis direction in FIG. 4). Here, the first direction may be the width direction of the substrate 15. The polygon scanner 30 may be a polygonal column having a polygonal cross-section. The polygon scanner 30 reflects the laser pulse 40 while rotating at a constant speed by the connected motor 35 so that the reflected laser pulse 40 can move in the first direction. The polygon scanner 30 can be rotated by the motor 35 from 30000 RPM to 80000 RPM.

The polygon scanner 30 is provided with a second error measuring unit 32 for measuring the rotation error of the polygon scanner 30. [ The second error measuring unit 32 includes an encoder or a ccd camera to measure the rotation error of the polygon scanner 30 and transmits the measured error to the scanner board 232 and the laser modulator 25.

The laser direct writing apparatus 102 further includes optical systems 41, 42, 43 and 45. The optical systems 41, 42, 43 and 45 may comprise a plurality of lenses and a reflector. The optical systems 41, 42, 43 and 45 can change the path of the laser pulse 40 and can condense or magnify the laser pulse 40. [

5 is a flowchart for explaining the laser direct drawing method according to the second embodiment of the present invention.

4 and 5, the laser direct drawing method according to the first embodiment includes a process data generating step (S201), a laser modulation step (S202), a polygon scanner rotating step (S203), a stage feeding step S204), an error measurement step S205, and an error compensation step S206.

The process data generation step S201 generates CAM (computer aided manufacturing) data based on the input CAD data. The processing data generation step (S201) preliminarily computes the moving speed of the stage 10 and the laser modulation based on the drawing data.

The laser modulation step S202 generates a laser pulse and controls on / off of the generated laser pulse. In the laser modulation step S202, the laser pulse is turned on or off so that the laser pulse can be irradiated only to the portion where the pattern is to be formed according to the machining data.

The polygon scanner rotating step (S203) rotates the polygon scanner (30) to move the laser pulse. The polygon scanner rotation step S203 controls the polygon scanner 30 to move the laser pulse in the first direction (y-axis direction in Fig. 4) on the surface of the substrate.

The stage transfer step S204 transfers the stage 10 on which the substrate 15 is mounted in the second direction. In the stage transferring step S204, the stage 10 can be transferred by the linear motor.

The error measurement step S205 measures the movement error of the stage 10 and the rotation error of the polygon scanner 30. [ The error measuring step S205 measures the moving speed and the moving position error of the stage using the first error measuring unit 21 connected to the stage 10 and uses the second error measuring unit 32 to measure the moving speed of the polygon scanner (30) is measured.

The error compensation step S206 compensates for on or off of the laser pulse 40 based on the signal transmitted in the error measuring step S205. The error compensation step S206 controls the on or off of the laser pulse so as to compensate the movement error of the stage 10 and the rotation error of the polygon scanner 30. [ Thus, according to the second embodiment, it is possible to precisely process by compensating for the errors of the stage 10 and the polygon scanner 30. [

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Of course.

101, 102: direct drawing apparatus 10: stage
15: substrate 21: first error measuring unit
22: Data processing unit 23:
231: Data transfer board 232: Scanner board
233: Motion board 24: Laser oscillator
25: laser modulator 26: reflector
27: galvanometer scanner 28, 35: motor
30: polygon scanner 32: second error measuring unit
40: laser pulse D1: machining area
D2: blank area

Claims (16)

A stage on which an object to be processed is placed;
A laser oscillator for emitting a laser pulse;
A polygon scanner rotatably installed to move the laser pulse in a first direction on a surface of the object, the object having a plurality of reflective surfaces reflecting the laser pulse;
A galvanometer scanner installed in front of the polygon scanner for moving the laser pulse in a thickness direction of the polygon scanner so as to move the laser pulse in a second direction intersecting the first direction on the surface of the object;
A stage controller for moving the stage;
A first error measuring unit for measuring a movement error of the stage;
A second error measuring unit for measuring a rotation error of the polygon scanner; And
Wherein the first error measuring unit and the second error measuring unit are provided on the rear side of the laser oscillator to turn on or off the laser pulse and on the basis of a signal transmitted from the first error measuring unit and the second error measuring unit, ) Or off (off) to compensate for the error;
/ RTI >
Wherein the galvanometer scanner periodically changes an irradiation direction of the laser pulse based on a signal transmitted from the second error measuring unit to compensate a rotation error of the polygon scanner. delete The method according to claim 1,
And the stage control unit variably controls the moving speed of the stage according to the input drawing. delete delete The method according to claim 1,
Wherein the polygon scanner moves a laser pulse at a surface of the object at a first speed and the galvanometer scanner is adapted to move a laser pulse at a surface of the object at a second speed greater than the first speed, Device. The method according to claim 1,
And a scanner board connected to the galvano scanner and controlling the galvano scanner based on a signal transmitted from the second error measuring unit. A stage on which an object to be processed is placed;
A laser oscillator for emitting a laser pulse;
A polygon scanner rotatably installed to move the laser pulse in a first direction on a surface of the object, the object having a plurality of reflective surfaces reflecting the laser pulse;
A stage transferring unit for transferring the stage;
A galvanometer scanner installed in front of the polygon scanner and reciprocating the laser in the thickness direction of the polygon scanner to move the laser pulse in a second direction intersecting the first direction on the surface of the object;
A first error measuring unit for measuring a movement error of the stage; And
A second error measuring unit for measuring a rotation error of the polygon scanner;
/ RTI >
The galvano scanner includes:
And a second reflector that is rotated about a second axis perpendicular to the first axis, the first reflector being rotated about the first axis, and the second reflector being rotated about a second axis perpendicular to the first axis. 9. The method of claim 8,
Wherein the polygon scanner moves a laser pulse at a surface of the object at a first speed and the galvanometer scanner is adapted to move a laser pulse at a surface of the object at a second speed greater than the first speed, Device. 10. The method of claim 9,
Wherein the polygon scanner moves a laser pulse in a first direction on a surface of the object to be processed and the galvanometer scanner moves a laser pulse in a second direction crossing a first direction on a surface of the object, . 10. The method of claim 9,
Wherein the laser direct writing apparatus further comprises a scanner board connected to the galvano scanner and controlling the galvano scanner based on a signal transmitted from the second error measuring unit. A laser modulation step of generating a laser pulse and turning on or off a laser pulse;
A galvanometer scanner control step of causing the laser pulse to be incident on the polygon scanner while rotating the galvano scanner, and moving the laser pulse in the thickness direction of the polygon scanner;
A polygon scanner control step of rotating the polygon scanner to move the laser pulse;
A stage transfer step of transferring the stage;
An error measuring step of measuring a movement error of the stage and a rotation error of the polygon scanner; And
An error compensation step of compensating for on or off of the laser pulse based on the signal transmitted in the error measuring step;
/ RTI >
Wherein the rotation of the galvanometer scanner is controlled based on a rotation error of the polygon scanner in the error compensation step. delete delete 13. The method of claim 12,
Wherein the polygon scanner control step controls the polygon scanner to move the laser pulses in a first direction at a surface of the substrate, and wherein the galvano scanner control step controls the galvano scanner such that the galvano scanner crosses the first direction So as to move the laser pulse in the second direction. 16. The method of claim 15,
Wherein the step of controlling the polygon scanner moves a laser pulse at a surface of the substrate at a first speed and wherein the step of controlling the galvano scanner comprises the step of moving the laser pulse at a second speed greater than the first speed, Direct drawing method.
KR1020160031095A 2016-03-15 2016-03-15 Laser direct imaging apparatus and laser direct imaging method KR101784461B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102152463B1 (en) 2019-06-03 2020-09-07 한국기계연구원 Pattern writing apparatus and pattern writing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001242410A (en) 2000-02-29 2001-09-07 Toppan Forms Co Ltd Perforation forming device and forming method
KR100832801B1 (en) 2007-05-02 2008-05-27 (주)하드램 Laser cutting device using polygon mirror

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001242410A (en) 2000-02-29 2001-09-07 Toppan Forms Co Ltd Perforation forming device and forming method
KR100832801B1 (en) 2007-05-02 2008-05-27 (주)하드램 Laser cutting device using polygon mirror

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102152463B1 (en) 2019-06-03 2020-09-07 한국기계연구원 Pattern writing apparatus and pattern writing method

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