KR101773400B1 - Conductive Paste - Google Patents

Conductive Paste Download PDF

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Publication number
KR101773400B1
KR101773400B1 KR1020150031634A KR20150031634A KR101773400B1 KR 101773400 B1 KR101773400 B1 KR 101773400B1 KR 1020150031634 A KR1020150031634 A KR 1020150031634A KR 20150031634 A KR20150031634 A KR 20150031634A KR 101773400 B1 KR101773400 B1 KR 101773400B1
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KR
South Korea
Prior art keywords
metal particles
metal
metal particle
particle
particles
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KR1020150031634A
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Korean (ko)
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KR20160108759A (en
Inventor
문종건
신명동
이규만
최인규
Original Assignee
(주)뉴옵틱스
유주티엔씨(주)
주식회사 창성시트
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Priority to KR1020150031634A priority Critical patent/KR101773400B1/en
Priority to PCT/KR2015/013544 priority patent/WO2016143985A1/en
Publication of KR20160108759A publication Critical patent/KR20160108759A/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

The present invention relates to a conductive paste capable of improving electrical characteristics, comprising: a binder; And
Wherein the plurality of metal particles include a plurality of metal particles, and the plurality of metal particles include a metal particle fused body formed by fusion of at least two or more metal particles.

Description

Conductive Paste [0002]

TECHNICAL FIELD The present invention relates to a conductive paste, and more particularly, to a conductive paste having improved electrical characteristics.

BACKGROUND ART Recently, electronic devices such as displays or transistors are commonly required to be manufactured in a high-density and highly-integrated form with the trend of shortening the size of electronic products, and thus attention has been paid to a technique of forming metal patterns usable for electrodes or wiring. Particularly, application to a sensor electrode or a wiring electrode of a touch panel has attracted considerable attention.

Various processes are applied to the fabrication of such a metal pattern, and the embossing and embossing metal patterning technologies are compatible with each other. Although each technique has advantages and disadvantages, intaglio metal pattern technology is attracting attention in that it can reduce the thickness of the sheet and has an easier fabrication process.

The metallic pattern of the engraved pattern is formed by filling the conductive paste. Generally, such a conductive paste is formed by dispersing metal particles in a binder. The conductive paste is required to have excellent electrical conductivity and low resistance for the purpose of use, and it is difficult to realize a conductive paste having excellent electrical conductivity and low resistance because metal particles dispersed in the binder hardly have a definite crystal structure .

In order to realize excellent electrical conductivity and low resistance, metal particles used in a conductive paste are modified or mixed with metal particles such as needle-shaped or bar-shaped particles. However, the productivity is decreased and the production cost is increased.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a conductive paste capable of improving electrical characteristics while solving the problems of the prior art.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. It can be understood.

To achieve the above object, the conductive paste of the present invention comprises a binder; And a plurality of metal particles, wherein the plurality of metal particles includes a metal particle fused body formed by fusion-bonding at least two or more metal particles.

In one embodiment, the number of metal particles constituting the metal particle fused body may be 2 or 3, and the metal particle fused body may have a range of 85 to 95 parts by weight based on 100 parts by weight of the whole metal particles.

In another embodiment, the metal particle may have a spherical shape, wherein the length of the metal particle fused body may range from 85 to 95% of the total length of the individual metal particles constituting the metal particle fused body, have. In addition, the diameter of the spherical metal particles may range from 100 to 400 nm.

According to another embodiment of the present invention, there is provided a method for manufacturing a metal particle fuse, which further comprises a spherical nanoparticle formed by mutual fusion welding to the metal particle fused body, wherein the diameter of the spherical nanoparticle is 1/10 To 1/3. In addition, the content of the nanoparticles may be in the range of 15 to 30 parts by weight based on 100 parts by weight of the entire metal particles.

As described above, the present invention, which is developed to solve the problems of the prior art as described above, can achieve excellent electrical characteristics as a conductive paste including a metal particle fused body in which metal particles are mutually fused.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a metal particle fused body in which two metal particles are fused according to an embodiment of the present invention. FIG.
FIG. 2 is a view showing a metal particle fused body in which three metal particles are fused according to an embodiment of the present invention.
FIG. 3 is a view showing nanoparticles formed by fusing to a metal particle fuse according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms " comprising, "" including, " or " having ", when used in this application, specify features, numbers, steps, operations, elements, But do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, the well-known functions or constructions are not described in order to simplify the gist of the present invention.

In the present invention, the conductive paste includes a binder and a plurality of metal particles, and known materials that act as electrically conductive irrespective of their names such as conductive inks, conductive pastes and the like are included in the scope of the present invention.

The metal particles may be a variety of metal particles such as Ag, Cu, Ni, Al, Co, Cr, Mn, and combinations thereof. The composite includes a core-shell structure. Preferably, spherical Ag particles can be used.

Regardless of the term, the binder includes a polymer resin that disperses metal particles to form a frame of a conductive paste, a surfactant-based dispersant for ensuring dispersibility of the conductive material, an additive for improving the viscosity and flowability of the resin, Oligomers, monomers, curing agents, solvents, and the like.

The polymer resin may be at least one of a cellulose resin, an acrylic resin or an epoxy resin, but is not limited thereto. It is needless to say that various other polymer resins may be used.

The conductive paste may include at least one of heat-curable oligomers or thermosetting monomers that react with heat so that the conductive paste can be thermally cured. The thermosetting oligomer may be at least one selected from the group consisting of an acrylic oligomer, a methacrylic oligomer, an acryl carboxylate acrylate, an epoxy acrylate oligomer (epoxy acrylate copolymer), a polyester acrylate oligomer and a urethane acrylate oligomer However, it is not limited thereto, and various kinds of thermosetting oligomers may be used.

The thermosetting monomer may be at least one selected from the group consisting of methyl methacrylate, ethyl methacrylate, tricyclodecane dimethanol dimethacrylate, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobornyl acrylate, acryloyloxyethyl Phenoxyethyleneglycol acrylate, phenoxyethyl acrylate, 2-hydroxyethyl acrylate, hardoxypropyl acrylate, diethylene glycol dimethacrylate, aryl methacrylate, ethylene glycol dimethacrylate, Diethylene glycol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, glycerol dimethacrylate, pentamethylperidyl methacrylate, lauryl acrylate, tetrahydroperfuryl acrylate , Hydroxyethyl acrylate, Hexanediol diacrylate, 1,6-hexanediol diacrylate, diethylene glycol diacrylate, tripropylene glycol diacrylate, dipropylene glycol diacrylate, polyethylene glycol Diacrylate, neopentyl glycol diacrylate, trimethylol propane triacrylate, neopentyl glycol diacrylate, ethoxylated trimethylol propane triacrylate, propoxylated trimethylol propane triacrylate, trimethylol propane triacrylate, Trimethylol propane trimethacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, glycerin propoxylated triacrylate, and methoxyethyl Be one kinds or more selected from the group consisting of glycol acrylate, but not limited to, the addition can be used are various types of thermosetting monomers.

Meanwhile, the conductive paste according to an embodiment of the present invention may further include a curing agent. The light brightening agent is a substance which is cured in response to heat so that the conductive paste according to the present embodiment can be thermally cured, and may contain 0.5 to 5% by weight. The curing agent may be at least one selected from the group consisting of an azobis initiator, benzoyl peroxide and triphenylmethyl chloride. When the curing agent is less than 0.5% by weight, sufficient curing is not carried out, .

In the present invention, the plurality of metal particles may include a metal particle fused body formed by fusion-bonding at least two or more metal particles.

In the present invention, various known fusing methods can be applied to fusing. In the present invention, the mutual fusion of the metal particles is preferably formed by thermal fusion. As shown in FIGS. 1 and 2, the outer surfaces of two or three metal particles can be melted and fused together by heat.

[Table 1] is a result of testing the resistance value of the conductive sheet produced using the conductive paste in which the Ag particle and the Ag particle, which are formed by thermally fusing a generally spherical Ag particle and a spherical Ag particle, are dispersed. The total content of the Ag particles was the same and the resistance values were measured under the same conditions for all the tests. Ag particle fusions were prepared by fusing 2 to 5 Ag particles.

division Resistance test with different metal particles only Spherical Ag particles Spherical Ag particle fusant Resistance value 885Ω 532Ω

It can be seen from the results of Table 1 that the use of the fused Ag particles has significantly lower resistance than that of the conventional spherical Ag particles.

The reason why the resistance value is lowered by using the fused metal particle fission product 100 is that not only the unit area of the fused product is widened due to fusion, but also the surface of the metal particle is melted to form a fused product by heat fusion, It is possible to obtain an improved electrical flow and a lower resistance value.

Table 2 below shows the difference in resistance value according to the number of individual metal particles forming the metal particle fusion body 100.

division Resistance test with different number of metal particles formed from fusions Ag particles + two Ag particle fusions (50/50) Two Ag particle fusions 2 Ag particle fusions +3 Ag particle fusions (50/50) Three Ag particle fusions Resistance value 582? 458Ω 443Ω 465Ω division Three Ag particle fusions + four Ag particle fusions (50/50) Four Ag particle fusions 4 Ag particle fusions + 5 Ag particle fusions (50/50) Five Ag particle fusions Resistance value 527Ω 543Ω 574Ω 565Ω

The results of the above Table 2 show that when the fused bodies formed by fusing a single Ag particle and two individual Ag particles are mixed at a weight ratio of 50 to 50, It can be seen that the resistance value greatly increases when the fused material formed by fusing individual Ag particles and the fused material formed by fusing four individual Ag particles are mixed at a weight ratio of 50:50. Therefore, it is possible to form a low resistance value when two or three metal particles are formed into a fused body, and it is possible to obtain a low resistance value when two and three metal particle fused bodies 100 are formed by mixing Able to know.

Further, as a result of further checking, it was confirmed that when the single Ag particles or four or more Ag particle-fused materials not containing the fused material were contained in less than 15% by weight based on the total weight of the Ag particles, . That is, if the mixture of two or three metal particle fusion bodies 100 is 85 to 95 parts by weight based on 100 parts by weight of the whole metal particles, it is confirmed that the low resistance can be realized by the metal particle fusion body to be achieved in the present invention . In addition, a small amount of a single metal particle or four or more metal particle fission products 100 than the pure metal particle particle fusion product 100 is formed can reduce the manufacturing time in filtering two or three metal particle fusion products 100 It is advantageous in terms of productivity.

The metal particle fusion body 100 may be formed by thermal fusion as mentioned above. The spherical metal particles may be placed in a crucible and then heated to 100 to 200 ° to form a heat-welded metal particle fusion body 100. The formed metal particle fusion body 100 can filter only the metal particle fusion body 100 in which two or three fusion bonded bodies are applied by applying vibration to the mesh shaped filtering apparatus.

The length (D) of the metal particle fused body can be set to be 85 to 95% of the total length (R1 + R2) of the diameter of the individual metal particles constituting the metal particle fused body. As shown in FIG. 1, when two metal particles are fusion-bonded, imaginary common regions (hatched portions) extending from the outer surface of the metal particles are fusion-bonded to each other to form a metal particle fusion body. If the length (D) of the metal particle fusing material over the original diameter total length (R1 + R2) of individual metal particles exceeds 95%, that is, if the width G of the common area is less than 5% , The possibility that the metal particle fusion body 100 is separated into the individual metal particles increases. When the length D of the metal particle fusion body 100 is less than 85%, that is, the width G of the common region is less than the sum length (R1 + R2) exceeds 15%, the heating temperature becomes higher and the possibility that three or more metal particle fusion bodies are formed into one lump becomes high. At this time, the diameter (R1 or R2) of the metal particle, the length (D) of the metal particle fusion body and the width (G) of the common region are calculated as a straight line passing through the spherical inner center points (C).

Although the above description has been made on the case of two individual metal particles, the same concept applies when three individual metal particles form the fused body 100 as shown in Fig. That is, the width of the common region may be formed to 5% to 15% of the individual metal particle diameter sum length (R1 + R2).

The diameter (R1 or R2) of the spherical metal particles forming the metal particle fusion body 100 may be 100 to 400 nm. When the thickness is less than 100 nm, it is difficult to control the length (D) of the metal particle fusion material 100 upon thermal fusion. When the thickness exceeds 400 nm, the resistance value is increased and the surface area is widened, There is a problem.

The present invention may further include a nanoparticle 200 formed by fusing to the metal particle fusion body 100. In the present invention, the nanoparticle 200 refers to a metal nanoparticle smaller than the size of the individual metal particles of the metal particle fuse 100. When the individual metal particles of the metal particle fusion body 100 are spherical, it is preferable that the nanoparticle 200 also has a spherical shape. At this time, the diameter of the nanoparticle 200 is preferably 1/10 to 1/3 of the diameter (R1 or R2) of the individual metal particles.

The following Table 3 shows the resistance values according to the sizes of the nanoparticles 200 and the resistance values measured after the bendability test. The individual metal particles forming the metal particle fusion body 100 were 300 nm in diameter and the length D of the metal particle fusion body 100 was controlled to be 90% of the total metal particle diameter addition length (R1 + R2) And the content of the nanoparticle 100 was 20 parts by weight based on 100 parts by weight of the entire metal particles including the metal particle fusion material 100. In the bendability test, the conductive paste containing the metal particle fused body 100 and the nanoparticle 200 was filled and sintered in an engraved pattern, and the conductive sheet was sieved to have a diameter of about 5 cm. The posterior resistance value was measured. The metal particle fuse 100 and the nanoparticle 200 used in this test used Ag particles.

division Diameter of nanoparticle 10 nm 20 nm 30 nm 50nm 60nm 80nm 100 nm 120 nm Resistance value 432? 437Ω 417? 415Ω 412Ω 405Ω 410Ω 412Ω Bendability
after the test
Resistance value 449Ω 452? 443Ω 437Ω 435Ω 429Ω 432? 488Ω

It can be seen from the results of Table 3 that the increase in the resistance value is increased when the nanoparticle 200 is 20 nm or less and the fluctuation width of the resistance value after the bendability test is increased when the nanoparticle 200 is 120 nm or more Able to know.

Therefore, it can be seen that the nanoparticle 200 can have a low resistance value when it is 1/10 to 1/3 of the diameter of the individual metal particles, and can maintain electrical characteristics when applied to a flexible electronic device .

The content of the nanoparticles 200 is preferably 15 to 30 parts by weight based on 100 parts by weight of the entire metal particles. When the amount is less than 15 parts by weight, the fluctuation of the resistance value after the bending property test becomes large. When the amount exceeds 30 parts by weight, the effect of improving the resistance value is insufficient.

The nanoparticle 200 formed by fusing to the metal particle fusion body 100 is the same as the method of manufacturing the metal particle fusion body 200 described above. That is, the metal particle fusion body 100 may be placed in a crucible, and the nanoparticles 200 may be dispersed using a dispersing device so as to be evenly distributed over the metal particle fusion body, followed by heating.

The nanoparticle 200 formed by fusing the metal particle fusion material 100 or the metal particle fusion material 100 described above becomes a constituent component of the conductive paste together with the binder. The conductive paste is filled in the sheet having the engraved pattern formed thereon, and can serve as a conductive sheet having electrical conductivity. Such a conductive sheet is preferably used as a sensor electrode of a touch panel requiring high electrical conductivity and low resistance. It goes without saying that the present invention can be applied to other electronic devices.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is obvious to those who have.

100: metal particle fusant
200: Nano Particles
R1, R2: Individual metal particle diameter
D: length of metal particle fusion

Claims (8)

bookbinder; And
And includes a plurality of spherical metal particles,
Wherein the spherical metal particles have a diameter of 100 to 400 nm,
Wherein the plurality of metal particles comprises 85 to 100 parts by weight of a metal particle fused body formed by fusion bonding two or three metal particles,
Characterized in that the length of the metal particle fused body due to the mutual fusion of the two metal particles is 85 to 95% of the sum of the diameters of the two individual metal particles constituting the metal particle frit by the two metal particles. Paste
delete delete delete delete delete The method according to claim 1,
And a spherical nanoparticle formed by mutual fusion bonding to the metal particle fused body,
Wherein the diameter of the spherical nanoparticles is 1/10 to 1/3 of the diameter of the individual metal particles constituting the metal particle fused body.
The method of claim 7,
Wherein the content of the nanoparticles is 15 to 30 parts by weight based on 100 parts by weight of the entire metal particles.
KR1020150031634A 2015-03-06 2015-03-06 Conductive Paste KR101773400B1 (en)

Priority Applications (2)

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KR1020150031634A KR101773400B1 (en) 2015-03-06 2015-03-06 Conductive Paste
PCT/KR2015/013544 WO2016143985A1 (en) 2015-03-06 2015-12-10 Conductive paste

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KR101773400B1 true KR101773400B1 (en) 2017-10-13

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070131912A1 (en) * 2005-07-08 2007-06-14 Simone Davide L Electrically conductive adhesives
KR101067353B1 (en) 2008-09-05 2011-09-23 팀켐 컴퍼니 Anisotropic conductive material

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6238599B1 (en) * 1997-06-18 2001-05-29 International Business Machines Corporation High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
WO2009090915A1 (en) * 2008-01-17 2009-07-23 Nichia Corporation Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for manufacturing light-emitting device
KR101340171B1 (en) * 2009-07-21 2013-12-10 니치아 카가쿠 고교 가부시키가이샤 Method for producing conductive material, conductive material obtained by the same method, electronic device containing the conductive material, and light-emitting device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070131912A1 (en) * 2005-07-08 2007-06-14 Simone Davide L Electrically conductive adhesives
WO2008048207A2 (en) 2005-07-08 2008-04-24 General Electric Company Electrically conductive adhesives
KR101067353B1 (en) 2008-09-05 2011-09-23 팀켐 컴퍼니 Anisotropic conductive material

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WO2016143985A1 (en) 2016-09-15

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