KR101753644B1 - Realtime pcr module and method of manufacturing the same - Google Patents

Realtime pcr module and method of manufacturing the same Download PDF

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Publication number
KR101753644B1
KR101753644B1 KR1020150137785A KR20150137785A KR101753644B1 KR 101753644 B1 KR101753644 B1 KR 101753644B1 KR 1020150137785 A KR1020150137785 A KR 1020150137785A KR 20150137785 A KR20150137785 A KR 20150137785A KR 101753644 B1 KR101753644 B1 KR 101753644B1
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South Korea
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light source
layer
forming
source electrode
base substrate
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KR1020150137785A
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Korean (ko)
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KR20160149128A (en
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이도영
전인균
원준호
최경학
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(주)옵토레인
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00—Heating or cooling apparatus; Heat insulating devices
    • B01L7/52—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/508—Containers for the purpose of retaining a material to be analysed, e.g. test tubes rigid containers not provided for above
    • B01L3/5085—Containers for the purpose of retaining a material to be analysed, e.g. test tubes rigid containers not provided for above for multiple samples, e.g. microtitration plates
    • B01L3/50851—Containers for the purpose of retaining a material to be analysed, e.g. test tubes rigid containers not provided for above for multiple samples, e.g. microtitration plates specially adapted for heating or cooling samples
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/12—Specific details about manufacturing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/18—Means for temperature control

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  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Molecular Biology (AREA)
  • Analytical Chemistry (AREA)
  • Hematology (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)

Abstract

A real-time PCR module, which is detachably connected to a reader system and amplifies a genetic material of a sample placed in a reaction space under the control of the reader system, Includes a base substrate, a light source, and a barrier rib. The light source is integrally formed with the base substrate on the base substrate to generate light. The PC Al module includes a partition wall formed integrally with the light source on the light source to define a side surface of the reaction space.

Description

REALTIME PCR MODULE AND METHOD OF MANUFACTURING THE SAME [0002]

The present invention relates to a real-time PC al module and a method of manufacturing the same, and more particularly, to a real-time PC al module including a multi-chamber that simultaneously detects a plurality of micro samples, The present invention relates to a method of manufacturing a real-time PC Al module.

Gene amplification technology is an indispensable process in molecular diagnostics and it is a technique to repeatedly replicate and amplify a specific base sequence of deoxyribonucleic acid (DNA) or ribonucleic acid (RNA) in a sample. Among them, Polymerase chain reaction (PCR) is a typical gene amplification technique consisting of DNA denaturation, primer annealing and DNA replication. Since the step depends on the temperature of the sample, DNA can be amplified by changing the temperature of the sample repeatedly.

Real-time PCR (real-time PCR) is a method for real-time monitoring of the amplification state of a sample in an amplification process. It enables the quantitative analysis of DNA by measuring the intensity of fluorescence whose DNA varies depending on the replication amount. Conventional real-time PC Al devices usually include a heat transfer block that transfers heat to a thermoelectric element and a tube containing the sample, a light source that irradiates the excitation light to the sample inside the tube, and a light receiving unit that receives fluorescence emitted from the sample .

At present, a table top type real time PC Al device is occupied by an optical part for detecting the fluorescence of the sample in about 80% of the total volume. Because of this, there is almost no mobility, so on-site diagnosis is almost impossible and the equipment price is very expensive. In addition, it takes a lot of time to rearrange and correct the error due to moving process due to relocation, device relocation, and the like.

It also takes a lot of time to set up various reagents and the possibility of contamination is high. Furthermore, since the size of the system is so large, most of them are constituted by independent systems and it is difficult to exchange information with the outside.

Further, the structure for heating or cooling the sample is complicated, and the thermal efficiency and the thermal conductivity are low, so that it is difficult to immediately heat or cool the sample.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a real-time PC Al module including a multi-chamber which simultaneously checks several fine samples.

It is an object of the present invention to provide a method of manufacturing a real-time PC Al module in which the manufacturing process is simple and the manufacturing cost is reduced.

In order to accomplish the object of the present invention, a real time PC Al module is detachably coupled to a reader system, and amplifies a dielectric material of a sample placed in a reaction space under the control of the reader system Real Time PCR Module " includes a base substrate, a light source, and a barrier rib. The light source is integrally formed with the base substrate on the base substrate to generate light. The PC Al module includes a partition wall formed integrally with the light source on the light source to define a side surface of the reaction space.

In one embodiment, the PC Al module may further include a power supply line electrically connected to the light source through the base substrate to supply power to the light source.

In one embodiment, the PC Al module may further include a cover disposed at an upper portion of the partition to form an upper surface of the reaction space, and an opening for injecting the sample into the reaction space.

In one embodiment, the PC Al module may further include a temperature sensor for measuring the temperature of the sample, and an optical sensor for measuring light emitted from the reaction space.

In one embodiment, the septum may define a side of a plurality of reaction spaces.

In one embodiment, the barrier may have a thickness of 300 [mu] m to 730 [mu] m.

In one embodiment, the light source includes: a first light source electrode disposed on the base substrate and including an opening exposing a part of a top surface of the base substrate; a second light source electrode disposed on the first light source electrode, And a second light source electrode disposed on the light emission pattern, wherein the light emission pattern exposes a part of the upper surface of the first light source electrode.

In one embodiment, the first light source electrode, the light emission pattern, and the second light source electrode may be arranged in a stepped shape.

In one embodiment, the side surface of the light emission pattern may be inclined with respect to the upper surface of the base substrate.

In order to accomplish the object of the present invention, a PCR module, which is detachably connected to a reader system and amplifies a dielectric material of a sample placed in a reaction space under the control of the reader system, A temperature sensor and an optical sensor are formed on a base substrate through a semiconductor process. Then, a light source is formed integrally with the base substrate on the base substrate. Thereafter, the partition wall is formed integrally with the light source to define a side surface of the reaction space.

In one embodiment, a method of manufacturing a PC Al module may further include forming an insulating layer by depositing an insulating material on the base substrate, and forming a conductive pattern on a part of the insulating layer.

In one embodiment, a method of manufacturing a PC Al module includes etching a bottom surface of the base substrate to form a step on the bottom surface of the base substrate, forming a through hole through the base substrate through the step, Forming a power supply line in the through hole, and forming a printed circuit board electrically connected to the power supply line in the step.

In order to accomplish the object of the present invention, a PCR module, which is detachably connected to a reader system and amplifies a dielectric material of a sample placed in a reaction space under the control of the reader system, A light emitting layer and an upper metal layer are sequentially laminated on an auxiliary substrate. Subsequently, a partition wall layer is formed on the upper metal layer. Thereafter, the auxiliary substrate is separated from the light emitting layer. Subsequently, a lower metal layer is formed on the light emitting layer. Subsequently, the lower metal layer is patterned in an array shape to form a first light source electrode. Then, the barrier rib layer, the upper metal layer, and the light emitting layer are patterned to form a barrier rib, a first light source electrode, and a light emission pattern defining the reaction space. Subsequently, a base structure is formed under the first light source electrode.

In one embodiment, the step of separating the auxiliary substrate from the light emitting layer may further include irradiating a laser from the auxiliary substrate direction to the interface between the emission layer and the auxiliary substrate.

In one embodiment, the method further comprises forming a temperature control layer on the barrier rib layer, wherein the step of forming the barrier rib, the first light source electrode, and the light emission pattern comprises patterning the temperature control layer, And forming the second electrode layer.

In one embodiment, the temperature control line may comprise a thermal resistance line.

In one embodiment, the base structure may include a temperature sensor and an optical sensor.

In order to accomplish the object of the present invention, a PCR module, which is detachably connected to a reader system and amplifies a dielectric material of a sample placed in a reaction space under the control of the reader system, The upper metal layer, the light emitting layer, and the lower metal layer are sequentially formed on the lower surface of the partition wall layer. Next, the barrier rib layer, the upper metal layer, the light emitting layer, and the lower metal layer are patterned to form a barrier rib, a second light source electrode, and a light emission pattern defining side surfaces of the reaction space. Thereafter, the lower metal layer is patterned to form a first light source electrode. Subsequently, a base structure is formed under the first light source electrode.

In one embodiment, the method may further include forming a temperature control layer on the upper surface of the partition wall layer.

According to the present invention, optical parts such as a light source and an optical sensor are built in a PCA module in the form of a single chip, and the PCA module is manufactured in a detachable module form, . In addition, the size of PC Al module and reader system is drastically reduced and manufacturing costs are reduced.

Also, by forming the optical sensor and the temperature control unit at the same time using the same semiconductor process, the manufacturing process is simplified, manufacturing cost is reduced, and detection error is reduced.

In addition, the PC Al module incorporates a temperature control line for rapid and precise temperature control.

Also, the first electrode may be patterned from the lower side, the barrier rib, the second electrode, and the light emission pattern may be patterned from the upper side to form the light source more easily.

Further, by forming a temperature control line on the barrier rib, the temperature in the reaction space can be controlled more quickly and precisely.

Also, the manufacturing process is simplified and the manufacturing cost is reduced by using the same photolithography process for forming the first electrode, the process for forming the temperature control line, the barrier rib, the second electrode, and the light emission pattern.

In addition, even if the reader system is moved, since reordering due to device rearrangement and correction are unnecessary, the mobility can be remarkably improved and the field inspection can be performed. Especially, in case of an emergency such as infectious disease inspection, identification of the disaster scene, it is possible to input immediately, which can contribute to reduce the damage.

In addition, since the reagent is introduced in the PC Al module, there is no need for a separate procedure for setting the reagent, so that the possibility of contamination is drastically reduced and a separate procedure for preparation of the test is not necessary.

Further, the first light source electrode, the light emission pattern, and the end portions of the second light source electrode of the light source are arranged in a step-like manner, thereby improving the accuracy of the PCR equipment.

1 is a block diagram illustrating a reader system for a PC Al module according to an embodiment of the present invention.
FIG. 2 is a perspective view showing the reader system for the PC Al module shown in FIG. 1. FIG.
3 is a cross-sectional view illustrating the PC Al module shown in FIG.
4 is a perspective view showing the PC Al module shown in FIG.
FIGS. 5, 7, 9, 11, 13, 15, 17, and 19 are cross-sectional views illustrating a method of manufacturing the PC Al module shown in FIG.
Figures 6, 8, 10, 12, 14, 16, 18, and 20 illustrate Figures 5, 7, 9, 11, 13, 15, 17, 19 is a perspective view showing a manufacturing method of the PC Al module shown in Fig.
21 is a cross-sectional view illustrating a PC Al module according to another embodiment of the present invention.
22 is a perspective view showing the PC Al module shown in FIG.
23 is a cross-sectional view illustrating a PC Al module according to another embodiment of the present invention.
24 is a cross-sectional view illustrating a PC Al module according to another embodiment of the present invention.
25 to 30 are sectional views showing a method of manufacturing the PC Al module shown in FIG.
31 to 34 are cross-sectional views illustrating a method of manufacturing a PC Al module according to another embodiment of the present invention.
35 is a cross-sectional view illustrating a PC Al module according to another embodiment of the present invention.
36 is a cross-sectional view illustrating a PC Al module according to another embodiment of the present invention.

Hereinafter, a reader system for a PC Al module according to the present invention and an inspection method using the same will be described in detail with reference to the accompanying drawings.

FIG. 1 is a block diagram showing a reader system for a PC Al module according to an embodiment of the present invention, and FIG. 2 is a perspective view illustrating a reader system for a PC Al module shown in FIG. 1.

Referring to FIGS. 1 and 2, a reader system 100 for a PC Al module is detachably coupled to a PC Al module (PCR module 200) to drive the PC Al module 200. 2, one PC Al module 200 is shown coupled to the reader system 100, but one skilled in the art will appreciate that a plurality of PC Al modules 200 can be coupled to one reader system 100 at a time It will be understood that modifications may be made.

The reader system 200 includes a central information processing unit 110, a memory 120, an interface 130, and a temperature control circuit 140.

The central information processing unit 110 reads the driving data stored in the memory 120 to drive the temperature control module 150 and the PC Al module 200 and outputs optical sensing information and temperature information from the PC Al module 200 And stores it in the memory 120 in real time. The central information processing unit 110 generates the gene amplification amount information by calculating the amplification amount of the gene in real time using the optical sensing information and the temperature information received from the PC Al module 200 in real time. The central information processing unit 110 stores the gene amplification amount information in the memory 120 in real time and transmits the information to the interface 130.

The PC Al module 200 includes a control interface 210, a light source driver 220, a light source 230, a reaction container 240, a temperature sensor 250, an optical sensor 260, and a temperature controller 270 do. For example, the PC Al module 200 is an interchangeable module having a unique sample, which can be used after being used for one time and discarded.

The control interface 210 receives the temperature control signal from the reader system 100 and transmits the temperature control signal to the temperature controller 270 to generate a light source driving signal and apply the signal to the light source driving unit 220. The control interface 210 receives the optical sensing signal generated by the optical sensor 260 and the temperature signal generated by the temperature sensor 250 and transmits the same to the reader system 100.

The light source driving unit 220 drives the light source 230 using the light source driving signal received from the control interface 210. A sample in the reaction vessel 240 is inspected using the light generated by the light source 230. The reason for disposing the light source 230 in this embodiment is to minimize errors due to external light and to reduce an error of the optical sensor 260 due to a change in brightness of external light.

The reaction vessel 240 houses the sample and amplifies the dielectric material contained in the sample. In this embodiment, the reaction vessel 240 may include only one reaction space or two or more reaction spaces. When the reaction vessel 240 includes two or more reaction spaces, it is possible to simultaneously test one sample or a plurality of samples.

The reaction vessel 240 may include various materials such as silicon, plastic, and the like.

The temperature sensor 250 is disposed adjacent to the reaction vessel 240 to measure the temperature of the sample placed in the reaction vessel 240. The temperature of the sample measured by the temperature sensor 250 is changed to a temperature signal and applied to the control interface 210.

The optical sensor 260 measures fluorescence, phosphorescence, and reflected light generated from the sample in the reaction container 240 to generate an electric signal.

FIG. 3 is a cross-sectional view illustrating the PC Al module shown in FIG. 1, and FIG. 4 is a perspective view showing the PC Al module shown in FIG.

1 to 4, the PC Al module 200 includes a base substrate 201, a control interface 210, a light source driver 220, a printed circuit board 221, a power supply line 223, An insulating layer 225, a conductive pattern 227, a light source 230, a reaction space 241, a partition wall 245, a cover 247, a temperature sensor 250, an optical sensor 260, 270). In this embodiment, the insulating layer 225, the light source 230, and the partition wall 245 define a reaction space 241 and form a reaction vessel 240.

The base substrate 201 includes wafers for semiconductor devices. The base substrate 201 may include a silicon substrate, a sapphire substrate, a silicon carbide (SiC) substrate, or the like. In this embodiment, the base substrate 201 may include semiconductor elements formed through various processes such as doping, deposition, etching, and the like.

The control interface (210 in FIG. 1) may be formed of a separate circuit, or may be formed on the base substrate 201 through a semiconductor process.

In this embodiment, the light source driver 220 is a separate circuit, and is connected to the base substrate 201 through the printed circuit board 221. In another embodiment, the light source driver 220 may be formed on the base substrate 201 through a semiconductor process. In another embodiment, a connector (not shown) for connecting the printed circuit board 221 to an external device (not shown) may be further disposed.

The printed circuit board 221 is connected to the base board 201 to control elements formed on the base board 201 or exchange signals with the outside. In this embodiment, the printed circuit board 221 is coupled along a step formed on the back surface of the base substrate 201 and includes a window exposing the step. In another embodiment, the temperature of the base substrate 201 and the fluorescence generated in the reaction space 241 may be measured through the window.

The power supply line 223 is disposed through the base substrate 201 and transmits the power supplied through the printed circuit board 221 to the light source 230.

The insulating layer 225 covers the upper portion of the base substrate 201 to prevent the sample in the reaction space 241 from reacting with the substance in the base substrate 201. The insulating layer 225 electrically isolates the light source 230 from the temperature sensor 250 and the optical sensor 260 and controls the temperature sensor 250 and the optical sensor 260 by a power source applied to the light source 230, To prevent malfunctions. In this embodiment, the insulating layer 225 may comprise a transparent insulating material such as silicon oxide, silicon nitride, or the like.

In this embodiment, the power supply line 223 is electrically connected to the light source 230 through the conductive pattern 227 disposed in the insulating layer 225.

The light source 230 is disposed on the insulating layer 225 and supplies light to the reaction space 241 by a power source supplied from the power source supply line 223. In this embodiment, the light source 230 includes a light emitting diode (LED) and is formed directly on the insulating layer 225 through a semiconductor process. In this embodiment, the light emitting diode 230 defines the reaction space 241 together with the partition wall 245.

The barrier rib 245 is formed on the light emitting diode 230 and is formed integrally with the light emitting diode 230. For example, the barrier ribs 245 may have a thickness of 300 mu m to 730 mu m.

The cover 247 is joined to the upper portion of the partition wall 245 to form the upper surface of the reaction space 241. An opening for injecting the sample into a part of the cover 247 may be formed.

In this embodiment, the temperature sensor 250 and the optical sensor 260 are disposed inside the base substrate 201. In another embodiment, the temperature sensor 250 and the optical sensor 260 may be disposed on the upper surface or the lower surface of the base substrate 201.

FIGS. 5, 7, 9, 11, 13, 15, 17, and 19 are cross-sectional views illustrating a method of manufacturing the PC Al module shown in FIG. 3. FIGS. 6, 8, 10, Figs. 12, 14, 16, 18 and 20 are cross-sectional views illustrating the manufacturing of the PC Al module shown in Figs. 5, 7, 9, 11, 13, 15, 17, These are perspective diagrams showing how.

5 and 6 are a cross-sectional view and a perspective view, respectively, showing a step of forming a temperature sensor, an optical sensor, an insulating layer, and a conductive pattern on each base substrate.

5 and 6, a temperature sensor 250 and an optical sensor 260 are formed on a silicon substrate (not shown) to form a base substrate 201 '. In this embodiment, an optical sensor 260 including a light sensing diode array may be formed on a silicon substrate (not shown) through a semiconductor process such as doping, deposition, etching, and the like. The temperature sensor 250 may be formed simultaneously with the optical sensor 260 through the semiconductor process.

Subsequently, an insulating material is deposited on the base substrate 201 'to form an insulating layer 225. Thereafter, a conductive pattern 227 is formed on a part of the insulating layer 225. In this embodiment, a part of the insulating layer 225 may be etched to form the conductive pattern 227. [ In another embodiment, the insulating layer 225 and the conductive pattern 227 may be formed through a plurality of deposition / etching processes.

7 and 8 are a cross-sectional view and a perspective view showing a step of partially etching the bottom surface of the base substrate shown in Figs. 5 and 6, respectively.

Referring to FIGS. 7 and 8, a bottom surface of the base substrate 201 '(FIGS. 5 and 6) is etched to form a step on the bottom surface of the base substrate 201. For example, the step can be formed through a photolithography process.

9 and 10 are a cross-sectional view and a perspective view showing a step of forming through holes in the etched bottom surface of the base substrate shown in Figs. 7 and 8, respectively.

9 and 10, a through hole 223h is formed in the etched bottom surface of the base substrate 201 to expose the lower surface of the conductive pattern 227. As shown in FIG. In this embodiment, the through hole 223h penetrates the base substrate 201 in the vertical direction. For example, the through hole 223h may be formed through a photolithography process.

11 and 12 are a cross-sectional view and a perspective view showing steps of forming a power supply line in the through hole shown in Figs. 9 and 10, respectively.

Referring to Figs. 11 and 12, a power supply line 223 is formed in the through hole (223h in Fig. 9 and Fig. 10). For example, a power supply line 223 can be formed by depositing a metal on the inner surface of the through hole (223h in FIG. 9 and FIG. 10).

13 and 14 are a cross-sectional view and a perspective view showing a step of forming a light source on the insulating layers shown in Figs. 11 and 12, respectively.

Referring to FIGS. 13 and 14, a light source 230 is formed on the insulating layer 225. In this embodiment, the light source 230 includes a light emitting diode and includes a first electrode (not shown), a light emission pattern (not shown), and a second electrode (not shown) Structure. The light emitting diode may include an inorganic light emitting diode or an organic light emitting diode. For example, when the light source 230 is an organic light emitting diode, a bottom metal layer (not shown), a light emitting layer (not shown), and an upper metal layer (not shown) are sequentially stacked, .

Figs. 15 and 16 are a cross-sectional view and a perspective view showing a step of forming a barrier rib and a cover glass on the light sources shown in Figs. 13 and 14, respectively.

Referring to FIGS. 15 and 16, a barrier rib 245 is formed on the light source 230. The barrier ribs 245 may include various materials such as silicon, plastic, polymer, metal, and the like. In this embodiment, the light source 230 and the barrier ribs 245 may be patterned through the same photolithographic process. For example, after a lower metal layer (not shown), a light emitting layer (not shown), an upper metal layer (not shown), and a barrier layer (not shown) are sequentially stacked on the insulating layer 225, So that the light source 230 and the barrier rib 245 can be formed at the same time.

Then, a cover glass 247 'is attached on the barrier rib 245. In this embodiment, the cover glass 247 'may include various materials such as glass, plastic, and the like. For example, the barrier rib 245 and the cover glass 247 'may be attached through an adhesive (not shown) or fused by laser irradiation. In this embodiment, the cover glass 247 'may be attached using a wafer level chip scale package WLCSP.

17 and 18 are a cross-sectional view and a perspective view showing the step of forming the barrier rib and the cover on the light sources shown in Figs. 15 and 16, respectively.

Referring to Figs. 17 and 18, the cover glass (247 'in Fig. 15) is subsequently cut to form the cover 247. Fig. The cover 247 defines the upper part of the reaction space 241.

19 and 20 are a cross-sectional view and a perspective view showing the step of attaching the printed circuit board and the light source driving unit to the lower part of the base board shown in Figs. 17 and 18, respectively.

19 and 20, a printed circuit board 221 is attached to the lower surface of the base substrate 201. Next, Then, a light source driver 220 and a connector (not shown) are attached to the printed circuit board 221.

According to the embodiment of the present invention, the optical parts such as the light source 230 and the optical sensor 260 are embedded in the PC Al module 200 in the form of a single chip, 200 are manufactured in the form of a removable module so that the size of the reader system 100 is greatly reduced. In addition, the size of the PC Al module 200 and the reader system 100 is drastically reduced and the manufacturing cost is reduced.

Also, the optical sensor 260 and the temperature control unit 250 are formed at the same time by using the same semiconductor process, so that the manufacturing process is simplified, the manufacturing cost is reduced, and the detection error is reduced.

FIG. 21 is a cross-sectional view illustrating a PC Al module according to another embodiment of the present invention, and FIG. 22 is a perspective view illustrating a PC Al module shown in FIG. 21. In this embodiment, the remaining components except for the reaction vessel are the same as the embodiment shown in Figs. 1 to 20, so duplicate descriptions of the same components will be omitted.

1, 2, 21 and 22, the PC Al module 200 includes a base substrate 201, a control interface 210, a light source driver 220, a printed circuit board 221, The power supply line 223, the insulating layer 225, the conductive pattern 227, the light source 230a, the reaction spaces 241a and 241b, the barrier rib 245a, the cover 247, the temperature sensor 250, (260), and a temperature control unit (270). In this embodiment, the insulating layer 225, the light source 230a, and the partition wall 245a define reaction spaces 241a and 241b and form a reaction container (240 in FIG. 1).

The light source 230a is disposed on the insulating layer 225 and supplies light to the reaction spaces 241a and 241b by a power source supplied from the power source supply line 223. [ In this embodiment, the light source 230a includes a light emitting diode (LED) and is formed directly on the insulating layer 225 through a semiconductor process. The light source 230a defines the reaction spaces 241a and 241b together with the partition wall 245a. In this embodiment, the light source 230a surrounds the reaction spaces 241a and 241b in a mesh shape. In another embodiment, the light source 230a may have a square ring shape.

The barrier rib 245a is formed on the light emitting diode 230a and is formed integrally with the light emitting diode 230a. In this embodiment, the partition wall 245a surrounds the reaction spaces 241a and 241b in a mesh shape.

The cover 247a is coupled to the upper portion of the partition wall 245a to form the upper surfaces of the reaction spaces 241a and 241b. A plurality of openings for injecting the sample may be formed in a part of the cover 247a.

According to the embodiment of the present invention as described above, the partition walls separating the plurality of reaction spaces 241a and 241b through the semiconductor process are formed to have the same design so that the capacity of each of the reaction spaces 241a and 241b is uniform Do.

23 is a cross-sectional view illustrating a PC Al module according to another embodiment of the present invention. In this embodiment, the remaining components except for the temperature control section are the same as those in the embodiment shown in Figs. 1 to 20, so that a duplicate description of the same components will be omitted.

1, 2, and 23, the PC Al module 200 includes a base substrate 201, a control interface 210, a light source driver 220, a printed circuit board 221, The conductive layer 227 and the light source 230a are formed on the surface of the insulating layer 225. The conductive layer 223 is formed on the insulating layer 225 and the conductive pattern 227 is formed on the insulating layer 225. The conductive pattern 227 includes a light source 230a, reaction spaces 241a and 241b, a barrier rib 245a, a cover 247, ), And a temperature control unit (270 in FIG. 1).

The temperature control section (270 in FIG. 1) includes a temperature control line 271. In this embodiment, the temperature control line 271 is disposed in the insulating layer 225 to control the temperature of the reaction space 241. The temperature control line 271 includes a conductive pattern, a thermoelectric semiconductor, and the like. For example, the conductive pattern of the temperature control line 271 may include a metal line, a doped semiconductor line, a metal oxide line such as indium tin oxide (ITO), and the like. For example, the thermoelectric semiconductor of the temperature control line 271 may include heavy chemical compounds such as Bi 2 Te 3 and PbTe, FeSi 2 , boron carbide, SiC, and the like.

The temperature control line 271 may be disposed on the upper surface of the insulating layer 225 or between the insulating layer 225 and the base substrate 201 or on the lower surface of the base substrate 201 .

According to the embodiment of the present invention as described above, the PC Al module 200 incorporates the temperature control line 271 to enable rapid and precise temperature control.

FIG. 24 is a cross-sectional view illustrating a PCA module according to another embodiment of the present invention, and FIGS. 25 to 30 are cross-sectional views illustrating a method of manufacturing the PCA module shown in FIG. In this embodiment, the remaining components except for the light source, the upper metal layer, the plurality of reaction spaces, and the manufacturing method thereof are the same as the embodiment shown in Figs. 1 to 20, so that redundant description of the same components It is omitted.

Referring to FIG. 24, the PC Al module includes a base structure 30, a light source 20, a partition 11, and a temperature control line 46.

The base structure 30 includes a control interface 210, a light source driver 220, a printed circuit board 221, a power supply line 223, an insulating layer 225, a conductive pattern 227 A temperature sensor 250, an optical sensor 260, a temperature controller 270, and the like.

The light source 20 is arranged in an array on the base structure 30 and includes a first light source electrode 21, a second light source electrode 23 and a light emission pattern 25.

The first light source electrode 21, the second light source electrode 23, and the light emission pattern 25 are sequentially stacked on the base structure 30.

The barrier ribs (11) are arranged in an array on the light source (20). The light source 20 and the partition 11 define a plurality of reaction spaces 41. In another embodiment, the light source 20 and the partition 11 may define only one reaction space.

25 is a cross-sectional view illustrating a step of forming a light emitting layer and an upper metal layer on an auxiliary substrate to manufacture the PC Al module shown in FIG.

Referring to FIGS. 24 and 25, in order to manufacture the PC Al module, the light emitting layer 25 'and the upper metal layer 23' are sequentially stacked on the auxiliary substrate 10 '. At this time, the light emitting layer 25 'may be an organic light emitting layer. The auxiliary substrate 10 'may include a silicon substrate, a synthetic resin substrate, and the like so that the auxiliary substrate 10' can be detached later. However, when the light emitting layer 25 'is an inorganic light emitting layer, the auxiliary substrate 10' may include a sapphire substrate.

26 is a cross-sectional view showing a step of forming a barrier rib layer on the upper metal layer shown in Fig.

Referring to FIGS. 24 and 26, a partition wall layer 11 'is formed on the upper metal layer 23'. For example, the partition wall layer 11 'may include silicon, glass, synthetic resin, or the like. For example, the thickness of the partition wall layer 11 'may be 300 μm to 730 μm.

27 is a cross-sectional view showing a step of separating an auxiliary substrate from the light emitting layer shown in Fig.

Referring to FIGS. 26 and 27, the auxiliary substrate 10 'is separated from the light emitting layer 25'. For example, a laser is irradiated in the direction of the auxiliary substrate 10 'shown in FIG. 26 to form a portion of the auxiliary substrate 10' which is adjacent to the interface between the emitting layer 25 'and the auxiliary substrate 10' And the molten silicon can be used to separate the auxiliary substrate 10 'from the light emitting layer 25'. Accordingly, a structure in which the barrier rib layer 11 ', the upper metal layer 23', and the light emitting layer 25 'are sequentially stacked is produced.

28 is a cross-sectional view illustrating a step of forming a first electrode on the bottom surface of the structure shown in FIG. 27 and forming a temperature control layer on the top surface.

27 and 28, a lower metal layer is formed on the lower surface of the light emitting layer 25 '. Thereafter, the lower metal layer is patterned into an array shape to form the first light source electrode 21.

Subsequently, a temperature control layer 46 'is formed on the upper surface of the partition wall layer 11'. In this embodiment, the temperature control layer 46 'may include a high-resistance metal, a metal oxide, a doped semiconductor, or the like, or may include a thermoelectric semiconductor.

29 is a cross-sectional view showing a step of forming a temperature control line, a barrier rib, a first electrode, and a light emission pattern by patterning the temperature control layer, the partition wall layer, the upper metal layer, and the light emitting layer shown in FIG.

Referring to FIGS. 28 and 29, the temperature control line 46 ', the partition wall layer 11', the upper metal layer 23 'and the light emitting layer 25' The barrier rib 11, the second light source electrode 23, and the light emission pattern 25 are formed. For example, the temperature control layer 46 ', the barrier layer 11', the top metal layer 23 ', and the light emitting layer 25' may be patterned using a photolithographic process. In this embodiment, the temperature control line 46, the partition 11, the first light source electrode 21, and the light emission pattern 25 are patterned in the same manner as the second light source electrode 23 in the form of an array. For example, the temperature control line 46, the partition 11, the first light source electrode 21, and the light emission pattern 25 may have a recessed shape than the second light source electrode 23 .

30 is a cross-sectional view illustrating a step of forming a base structure on a lower portion of the first electrode shown in FIG.

Referring to FIG. 30, a base structure 30 is formed below the first light source electrode 21. In this embodiment, the base structure 30 includes a control interface 210, a light source driver 220, a printed circuit board 221, a power supply line 223, an insulating layer 225, A conductive pattern 227, a temperature sensor 250, an optical sensor 260, a temperature controller 270, and the like. For example, the base structure 30 formed with the temperature sensor 250, the optical sensor 260 and the like may be attached to the lower part of the first light source electrode 21. In another embodiment, after a silicon substrate (not shown) is attached to the bottom of the first light source electrode 21, a temperature sensor 250, an optical sensor 260, And the like.

According to this embodiment, the first light source electrode 21 is patterned from the lower side, and the partition 11, the second light source electrode 23, and the light emission pattern 25 are patterned from the upper side, Can be formed more easily.

Further, by forming the temperature control line 46 on the partition 11, the temperature in the reaction space 41 can be controlled more quickly and precisely.

31 to 34 are cross-sectional views illustrating a method of manufacturing a PC Al module according to another embodiment of the present invention. In this embodiment, the remaining components except for the step of etching the temperature control layer, the barrier layer, the upper metal layer, the light emitting layer, and the lower metal layer are the same as those shown in FIGS. 24 to 30, And the description thereof will be omitted.

31, a temperature control layer 46 'is formed on the upper surface of the partition wall layer 11', and an upper metal layer 23 ', a light emitting layer 25', and a lower metal layer 21 ' . In this embodiment, the temperature control layer 46 ', the upper metal layer 23', the light emitting layer 25 ', and the lower metal layer 21' are formed on the auxiliary substrate 10 ' Can be formed. That is, the light emitting layer 25 ', the upper metal layer 23', and the partition wall layer 11 'are sequentially formed on the upper surface of the auxiliary substrate 10', and the auxiliary substrate 10 ' The temperature control layer 46 'and the lower metal layer 21' can be formed on the upper surface of the partition wall layer 11 'and the lower surface of the light emitting layer 25', respectively. In another embodiment, the temperature control layer 46 'is formed on the upper surface of the partition wall layer 11', and the upper metal layer 23 ', the light emitting layer 25', and the lower metal layer 21 ' .

32 is a cross-sectional view showing a step of sequentially etching the temperature control layer, the partition wall layer, the upper metal layer, and the light emitting layer shown in Fig.

31 and 32, the temperature control layer 46 ', the partition wall layer 11', the upper metal layer 23 ', and the light emitting layer 25' are etched from above to form the temperature control line 46, The first light source electrode 11, the second light source electrode 23, and the light emission pattern 25 are formed. For example, the temperature control line 46, the partition 11, the second light source electrode 23, and the light emission pattern 25 may be etched to have an array shape by photolithography.

33 is a cross-sectional view showing the step of etching the lower metal layer shown in Fig.

Referring to FIGS. 32 and 33, the lower metal layer 21 'is then etched to form the first light source electrode 21. In this embodiment, the etching process shown in Fig. 32 and the etching process shown in Fig. 33 can be performed through the same photolithography process using the same mask. In another embodiment, a mask different from the etching process shown in Fig. 32 and the etching process shown in Fig. 33 may be used. For example, the opening of the mask used in the etching process shown in FIG. 33 may be smaller than the mask used in the etching process shown in FIG.

34 is a cross-sectional view showing a step of attaching a base structure to a lower portion of the first electrode shown in FIG.

Referring to FIG. 34, a base structure 30 is attached to a lower portion of the first light source electrode 21.

According to the present embodiment as described above, the first light source electrode 21 is formed, and the process of forming the temperature control line 46, the partition 11, the second light source electrode 23, and the light emission pattern 25 Using the same photolithography process, the manufacturing process is simplified and the manufacturing cost is reduced.

35 is a cross-sectional view illustrating a PC Al module according to another embodiment of the present invention. In this embodiment, the remaining components except for the light source are the same as those in the embodiment shown in Figs. 24 to 30, so that redundant description of the same components is omitted.

35, the PC Al module includes a base structure 30, a light source 20a, a partition 11, and a temperature control line 46. In this embodiment, the PC Al module includes a plurality of reaction spaces 41a. The upper surface of the base structure 30 constitutes the lower surface of the reaction spaces 41a and the side surfaces of the light source 20a and the partition 11 constitute the inner surfaces of the reaction spaces 41a.

The light source 20a includes a first light source electrode 21a, a second light source electrode 23a, and a light emission pattern 25a.

The first light source electrode 21a is disposed on the base structure 30 and includes an opening exposing a part of the upper surface of the base structure 30. [ A part of the upper surface of the base structure 30 exposed by the first light source electrode 21a constitutes the lower part of the reaction spaces 41a. In this embodiment, the side surface of the first light source electrode 21a is formed in the vertical direction with respect to the upper surface of the base structure 30. [ In another embodiment, the side surface of the first light source electrode 21a may be formed in an oblique direction.

The light emission pattern 25a is disposed on the first light source electrode 21a and includes an opening exposing a part of the upper surface of the base structure 30 and a part of the upper surface of the first light source electrode 21a. In this embodiment, the side surface of the light emission pattern 25a is formed in the vertical direction with respect to the upper surface of the base structure 30. [ In another embodiment, the side surface of the light emission pattern 25a may be formed in an oblique direction.

The second light source electrode 23a is disposed on the light emission pattern 25a and exposes a part of the upper surface of the base structure 30, a part of the upper surface of the first light source electrode 21a, and a part of the upper surface of the light emission pattern 25a And an opening. In this embodiment, the side surface of the second light source electrode 23a is formed in the vertical direction with respect to the upper surface of the base structure 30. [ In another embodiment, the side surface of the second light source electrode 23a may be formed in an oblique direction.

The barrier rib 11 is disposed on the second light source electrode 23a of the light source 20a and includes openings that define the sides of the reaction spaces 41a. In this embodiment, the partition 11 has the same shape as the second light source electrode 23a when viewed in a plan view. In another embodiment, the barrier rib 11 may be smaller than the second light source electrode 23a when viewed in a plan view, and may expose a part of the upper surface of the second light source electrode 23a.

A temperature control line 46 is disposed on the partition 11 to control the temperature of the samples (not shown) disposed inside the reaction spaces 41a. The temperature control line 46 may be arranged in various shapes on the partition 11.

According to this embodiment, the ends of the first light source electrode 21a, the light emission pattern 25a, and the second light source electrode 23a of the light source 20a are arranged in a step shape to form a reaction space 41a, Has a shape in which the corners thereof enter the center. If the corners of the reaction space 41a have a shape that enters toward the center, the convection of the samples in the reaction space 41a is promoted in the temperature control process, and the rate of temperature change is accelerated. Thus, the accuracy of the PCR equipment is improved.

36 is a cross-sectional view illustrating a PC Al module according to another embodiment of the present invention. In this embodiment, the remaining components except for the side surface shape of the light emission pattern are the same as the embodiment shown in FIG. 35, so that duplicate descriptions of the same components will be omitted.

Referring to FIG. 36, the PC Al module includes a base structure 30, a light source 20b, a partition 11, and a temperature control line 46. In this embodiment, the PC Al module includes a plurality of reaction spaces 41b.

The light source 20b includes a first light source electrode 21b, a second light source electrode 23b, and a light emission pattern 25b.

The first light source electrode 21b is disposed on the base structure 30 and includes an opening exposing a part of the upper surface of the base structure 30. [

The light emission pattern 25b is disposed on the first light source electrode 21b and includes an opening exposing a part of the upper surface of the base structure 30 and a part of the upper surface of the first light source electrode 21b. In this embodiment, the side surface of the light emission pattern 25b is formed in an oblique direction with respect to the upper surface of the base structure 30. [ For example, the side surface of the light emitting pattern 25b may be formed at a 45-degree angle with respect to the upper surface of the base structure 30. [

The second light source electrode 23b is disposed on the light emission pattern 25b and exposes a part of the upper surface of the base structure 30, a part of the upper surface of the first light source electrode 21b, and a part of the upper surface of the light emission pattern 25b And an opening.

According to this embodiment, the ends of the first light source electrode 21b and the second light source electrode 23b of the light source 20b are arranged in a step shape and the light emission pattern 25b is formed in an oblique direction, And the corner of the space 41b has a shape smoothly entering toward the center. When the corner of the reaction space 41b has a shape smoothly entered toward the center, the convection phenomenon of the samples in the reaction space 41b is promoted in the temperature regulation process, and the temperature change rate is accelerated. Thus, the accuracy of the PCR equipment is improved.

According to the embodiment of the present invention as described above, optical parts such as a light source and an optical sensor are embedded in the PC Al module in the form of one chip, and the PC Al module is manufactured in a detachable module form, Is greatly reduced. In addition, the size of PC Al module and reader system is drastically reduced and manufacturing costs are reduced.

Also, by forming the optical sensor and the temperature control unit at the same time using the same semiconductor process, the manufacturing process is simplified, manufacturing cost is reduced, and detection error is reduced.

In addition, the PC Al module incorporates a temperature control line for rapid and precise temperature control.

Also, the first electrode may be patterned from the lower side, the barrier rib, the second electrode, and the light emission pattern may be patterned from the upper side to form the light source more easily.

Further, by forming a temperature control line on the barrier rib, the temperature in the reaction space can be controlled more quickly and precisely.

Also, the manufacturing process is simplified and the manufacturing cost is reduced by using the same photolithography process for forming the first electrode, the process for forming the temperature control line, the barrier rib, the second electrode, and the light emission pattern.

In addition, even if the reader system is moved, since reordering due to device rearrangement and correction are unnecessary, the mobility can be remarkably improved and the field inspection can be performed. Especially, in case of an emergency such as infectious disease inspection, identification of the disaster scene, it is possible to input immediately, which can contribute to reduce the damage.

In addition, since the reagent is introduced in the PC Al module, there is no need for a separate procedure for setting the reagent, so that the possibility of contamination is drastically reduced and a separate procedure for preparation of the test is not necessary.

Further, the first light source electrode, the light emission pattern, and the end portions of the second light source electrode of the light source are arranged in a step-like manner, thereby improving the accuracy of the PCR equipment.

INDUSTRIAL APPLICABILITY The present invention has industrial applicability that can be used for research, disaster prevention, medical use, animal husbandry, and pet treatment apparatus for amplifying and inspecting genetic material.

10 ': auxiliary substrate 11, 245: partition wall
11 ': partition wall layer 20, 230: light source
21, 231: first light source electrode 21 ': lower metal layer
23, 232: second light source electrode 23 ': upper metal layer
25, 235: emission pattern 25 ': emission layer
46, 246: temperature control line 100: reader system (Reader System)
110: central information processing unit 120: memory, drive data
130: Interface 140: Temperature control circuit
200: PCR module 201, 202: base substrate
30: base structure 210: control interface
220: light source driver 221: printed circuit board
223: power supply line 225: insulating layer (silicon oxide layer)
227: conductive pattern (metal wiring) 236: optical film layer
237: etching stop layer 240: reaction container
241: reaction space 243: coating film
247: cover 250: temperature sensor
260: Optical sensor 270: Temperature control unit
271: Temperature control line

Claims (19)

1. A Realtime PCR Module, which is detachably coupled to a reader system and amplifies a dielectric material of a sample placed in a reaction space under the control of the reader system,
A base substrate;
A light source integrally formed with the base substrate on the base substrate to generate light; And
And a partition wall formed integrally with the light source on the light source to form a side surface of the reaction space. The PC LED module according to claim 1, further comprising a power supply line electrically connected to the light source through the base substrate to supply power to the light source. The PC Al module according to claim 1, further comprising a cover disposed on the partition wall to form an upper surface of the reaction space, and an opening for injecting the sample into the reaction space is formed. The apparatus according to claim 1, further comprising: a temperature sensor for measuring a temperature of the sample; And
And an optical sensor for measuring light emitted from the reaction space. 2. The PC Al module according to claim 1, wherein the partition walls form side surfaces of a plurality of reaction spaces. The PC Al module according to claim 1, wherein the barrier ribs have a thickness of 300 to 730 μm. The light source according to claim 1,
A first light source electrode disposed on the base substrate and including an opening exposing a part of an upper surface of the base substrate;
A light emitting pattern disposed on the first light source electrode and exposing a part of the upper surface of the base substrate and a part of a top surface of the first light source electrode; And
And a second light source electrode disposed on the light emission pattern. 8. The PC Al module according to claim 7, wherein the first light source electrode, the light emission pattern, and the second light source electrode are arranged in a stepped shape. 8. The PC Al module according to claim 7, wherein a side surface of the light emission pattern is inclined with respect to an upper surface of the base substrate. A method of manufacturing a PCR module, which is detachably coupled to a reader system and amplifies a dielectric material of a sample placed in a reaction space under the control of the reader system,
Forming a temperature sensor and an optical sensor on a base substrate through a semiconductor process;
Forming a light source integrally with the base substrate on the base substrate; And
And forming a partition wall integrally formed with the light source to form a side surface of the reaction space. The method of claim 10, further comprising: depositing an insulating material on the base substrate to form an insulating layer; And
And forming a conductive pattern on a part of the insulating layer. The method of claim 10, further comprising: etching a bottom surface of the base substrate to form a step on the bottom surface of the base substrate;
Forming a through hole in the stepped portion through the base substrate;
Forming a power supply line in the through hole; And
And forming a printed circuit board electrically connected to the power supply line in the stepped portion. A method of manufacturing a PCR module, which is detachably coupled to a reader system and amplifies a dielectric material of a sample placed in a reaction space under the control of the reader system,
Laminating an emission layer and an upper metal layer on the auxiliary substrate in this order;
Forming a barrier layer on the upper metal layer;
Separating the auxiliary substrate from the light emitting layer;
Forming a lower metal layer on the light emitting layer;
Forming a first light source electrode by patterning the lower metal layer in an array shape;
Forming a barrier rib, a first light source electrode, and a light emission pattern for forming the reaction space by patterning the barrier rib layer, the upper metal layer, and the light emitting layer; And
And forming a base structure below the first light source electrode. 14. The method according to claim 13, wherein the step of separating the auxiliary substrate from the light emitting layer further comprises irradiating a laser between the light emitting layer and the auxiliary substrate from the direction of the auxiliary substrate . 14. The method of claim 13, further comprising forming a temperature control layer on the barrier layer, wherein forming the barrier rib, the first light source electrode, and the light emission pattern comprises patterning the temperature control layer, ≪ / RTI > further comprising the step of forming a line. 16. The method of claim 15, wherein the temperature control line comprises a thermal resistance line. 14. The method of claim 13, wherein the base structure comprises a temperature sensor and an optical sensor. A method of manufacturing a PCR module, which is detachably coupled to a reader system and amplifies a dielectric material of a sample placed in a reaction space under the control of the reader system,
Sequentially forming an upper metal layer, a light emitting layer, and a lower metal layer on a bottom surface of the barrier rib layer;
Forming a barrier rib, a second light source electrode, and a light emission pattern that form side faces of the reaction space by patterning the barrier rib layer, the upper metal layer, the light emitting layer, and the lower metal layer;
Forming a first light source electrode by patterning the lower metal layer; And
And forming a base structure below the first light source electrode. The method as claimed in claim 18, further comprising forming a temperature control layer on the upper surface of the partition wall layer.
KR1020150137785A 2015-06-17 2015-09-30 Realtime pcr module and method of manufacturing the same KR101753644B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100459896B1 (en) 2002-03-06 2004-12-04 삼성전자주식회사 Thermostatic control Method and apparatus for Driving a PCR(polymerize chain reaction) chip
KR100668320B1 (en) 2003-12-10 2007-01-12 삼성전자주식회사 Module for polymerase chain reaction and multiple polymerase chain reaction system
KR100952102B1 (en) 2007-08-29 2010-04-13 한양대학교 산학협력단 Chip for micro polymerase chain reaction and manufacture method thereof
KR101368463B1 (en) 2010-04-23 2014-03-03 나노바이오시스 주식회사 Device for amplify nucleic acid comprising two heating block

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100459896B1 (en) 2002-03-06 2004-12-04 삼성전자주식회사 Thermostatic control Method and apparatus for Driving a PCR(polymerize chain reaction) chip
KR100668320B1 (en) 2003-12-10 2007-01-12 삼성전자주식회사 Module for polymerase chain reaction and multiple polymerase chain reaction system
KR100952102B1 (en) 2007-08-29 2010-04-13 한양대학교 산학협력단 Chip for micro polymerase chain reaction and manufacture method thereof
KR101368463B1 (en) 2010-04-23 2014-03-03 나노바이오시스 주식회사 Device for amplify nucleic acid comprising two heating block

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