KR101749962B1 - Preprocessing for Polishing Joint Surface of Mass Flow Controller - Google Patents
Preprocessing for Polishing Joint Surface of Mass Flow Controller Download PDFInfo
- Publication number
- KR101749962B1 KR101749962B1 KR1020150050094A KR20150050094A KR101749962B1 KR 101749962 B1 KR101749962 B1 KR 101749962B1 KR 1020150050094 A KR1020150050094 A KR 1020150050094A KR 20150050094 A KR20150050094 A KR 20150050094A KR 101749962 B1 KR101749962 B1 KR 101749962B1
- Authority
- KR
- South Korea
- Prior art keywords
- mirror
- surface treatment
- region
- treatment region
- bonding
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
- G01F15/18—Supports or connecting means for meters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/76—Devices for measuring mass flow of a fluid or a fluent solid material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
- G01F15/18—Supports or connecting means for meters
- G01F15/185—Connecting means, e.g. bypass conduits
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Measuring Volume Flow (AREA)
Abstract
The present invention relates to a mirror surface treatment method of a joint surface between blocks constituting a mass flow meter. More specifically, the present invention relates to a mirror surface treatment method for separating a joint surface area according to the necessity of mirror surface treatment and a mirror surface treatment To a surface of a mass flowmeter bonded to a surface of the mass flowmeter.
The present invention relates to a method for mirror-to-block bonding a first step of dividing a joining surface 11 to be mirror-polished into a mirror-finished region 13 requiring mirror-surface treatment and a non-mirror- S100); A second step S200 of machining the mirror surface treatment region 13 and the non-mirror surface treatment region 14 such that a step is formed; And a third step (S300) of lapping only the mirror surface treatment region (13) and subjecting the mirror surface to mirror surface treatment.
Description
The present invention relates to a mirror surface treatment method of a joint surface between blocks constituting a mass flow meter. More specifically, the present invention relates to a mirror surface treatment method for separating a joint surface area according to the necessity of mirror surface treatment and a mirror surface treatment To a surface of a mass flowmeter bonded to a surface of the mass flowmeter.
In general, there are a flow meter for measuring the flow rate of gas or gas, such as a pressure differential flowmeter using an orifice, a vortex flowmeter, a turbine flowmeter, an ultrasonic flowmeter, an area flowmeter and a thermal mass flowmeter.
Among them, a thermal mass flowmeter uses a principle that, when a heated object is placed in a flowing fluid, heat exchange occurs between the fluid and the heated object to cool the heated object, and the cooling rate is a function of the flow rate. It is a flowmeter that measures the flow rate and the flow rate according to the measurement.
The thermal mass flowmeter has been widely used in the semiconductor manufacturing process due to its high accuracy and has recently been effectively applied to the chemical reaction process, the petrochemical field, the environmental field, and the building air conditioning field.
Figure 1 shows a conventional thermal mass flowmeter.
The conventional thermal type mass flow meter generally comprises a flow rate detector for measuring the flow rate and a flow rate controller for controlling the flow rate. The flow rate detector detects the flow rate of the fluid passing through the inlet (4) So as to be laminarized and to escape to the
The
On the other hand, the fluid having passed through the
1, the flow rate detector of the conventional thermal mass flowmeter includes a
The
The mirror surface treatment of the
However, in the conventional lapping process of the
Accordingly, there is a problem in that the lapping time becomes excessively long due to repairs due to damage to the specular surface during the operation, and further, there is a case where the scratches are excessive and the
In order to solve this problem, the
SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a mass flowmeter in which a joint surface of a mass flow meter is divided according to the necessity of mirror surface treatment, And thus it is possible to mirror-interface the joint of the mass flowmeter with high accuracy and to significantly reduce the defect rate in the manufacturing process of the mass flowmeter.
In order to accomplish the above object, the present invention provides a method for mirror-to-block bonding, comprising the steps of: forming a bonding surface (11) to be mirror-finished by a mirror surface treatment region (13) (S100); < / RTI > A second step S200 of machining the mirror
According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a first step (S100) of dividing a bonding surface (11) to be mirror-finished into a mirror-surface treatment region (13) requiring mirror-surface treatment and a non- A second step (S200) of machining the specular surface treatment region (13) and the non-surface treatment region (14) to have mutual angles; And a third step (S300) of lapping only the specular surface region (13) and subjecting the specimen to mirror surface processing.
Here, the bonding surface is a
According to another aspect of the present invention, there is provided a block of a mass flow meter including a bonding surface (11) to be subjected to a mirror surface treatment, wherein the bonding surface (11) Wherein the non-mirror
Here, the block is a
The mirror surface treatment method of the mass flowmeter bonded surface provided in the present invention is advantageous in that the mirror surface treatment can be performed with high precision since the scratch inducing element can be prevented from being transferred from another area by mirror- have.
Since the unnecessary scratch is prevented according to the mirror surface treatment method of the mass flow meter junction surface of the present invention, it is possible to perform the surface treatment with a short work time.
It is possible to remarkably reduce the defective mass flow meter by applying the mirror surface treatment method of the bonding surface of the present invention.
1 is a side sectional view for explaining a structure of a conventional thermal mass flow meter
FIG. 2 is a perspective view showing a joint surface of a conventional thermal mass flow meter sensor body. FIG.
3 is a perspective view showing a sensor body joint surface mirror-polished according to the present invention;
Fig. 4 is a side cross-sectional view of a sensor body joint surface which is mirror-
5 is a side cross-sectional view showing another embodiment of a sensor body joint surface to be mirror finished according to the present invention
6 is a flowchart illustrating a mirror surface treatment method of a mass flow meter joint surface of the present invention
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
4 is a side cross-sectional view of a sensor body joint surface to be subjected to mirror-surface treatment according to the present invention, and Fig. 5 is a cross-sectional view of the sensor body according to the present invention, Sectional view showing another embodiment of the joint surface. 6 is a flow chart for explaining the mirror surface treatment method of the mass flow meter joint surface of the present invention.
Although not necessary to understand the technical idea of the invention as a part that is not different from the prior art, it is excluded from the description, but the technical idea and the scope of protection of the present invention are not limited thereto.
3 and 4, the
The
The mirror
The non-mirror
In the
In the present invention, when lapping the mirror-
The step (h) between the mirror
The step (h) between the specular
In another embodiment of the present invention, as shown in FIG. 5, the mirror
Since the non-mirror
Next, the mirror surface treatment method of the joint of the mass flow meter of the present invention will be described in detail with reference to FIG.
The method for mirror-surface processing of the mass flowmeter bonded surface of the present invention includes a first step (S100) of distinguishing between the specular surface treatment region (13) and the non-surface treatment region (14); A second step S200 of machining the mirror
In the first step S100, the specular
In the first step S100, the non-mirror-
Meanwhile, the mirror surface treatment method of the mass flowmeter joint surface of the present invention can be replaced with the step of machining the second step S200 so that the mirror
It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It goes without saying that various modifications can be made.
1: Body Body 2: Sensor tube cover
3: Solenoid valve 7: Bypass
8: Sensor tube 9: Connection hole
10: sensor body 11: joint surface
12: screw hole 13: mirror-finished region
14: non-
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150050094A KR101749962B1 (en) | 2015-04-09 | 2015-04-09 | Preprocessing for Polishing Joint Surface of Mass Flow Controller |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150050094A KR101749962B1 (en) | 2015-04-09 | 2015-04-09 | Preprocessing for Polishing Joint Surface of Mass Flow Controller |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160120916A KR20160120916A (en) | 2016-10-19 |
KR101749962B1 true KR101749962B1 (en) | 2017-07-28 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020150050094A KR101749962B1 (en) | 2015-04-09 | 2015-04-09 | Preprocessing for Polishing Joint Surface of Mass Flow Controller |
Country Status (1)
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KR (1) | KR101749962B1 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003197580A (en) * | 2001-12-21 | 2003-07-11 | Fujikoshi Mach Corp | Wafer polishing apparatus |
-
2015
- 2015-04-09 KR KR1020150050094A patent/KR101749962B1/en active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003197580A (en) * | 2001-12-21 | 2003-07-11 | Fujikoshi Mach Corp | Wafer polishing apparatus |
Also Published As
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KR20160120916A (en) | 2016-10-19 |
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