KR101749962B1 - Preprocessing for Polishing Joint Surface of Mass Flow Controller - Google Patents

Preprocessing for Polishing Joint Surface of Mass Flow Controller Download PDF

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Publication number
KR101749962B1
KR101749962B1 KR1020150050094A KR20150050094A KR101749962B1 KR 101749962 B1 KR101749962 B1 KR 101749962B1 KR 1020150050094 A KR1020150050094 A KR 1020150050094A KR 20150050094 A KR20150050094 A KR 20150050094A KR 101749962 B1 KR101749962 B1 KR 101749962B1
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KR
South Korea
Prior art keywords
mirror
surface treatment
region
treatment region
bonding
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KR1020150050094A
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Korean (ko)
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KR20160120916A (en
Inventor
민병광
이승한
Original Assignee
엠케이프리시젼 주식회사
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Priority to KR1020150050094A priority Critical patent/KR101749962B1/en
Publication of KR20160120916A publication Critical patent/KR20160120916A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F15/00Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
    • G01F15/18Supports or connecting means for meters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/76Devices for measuring mass flow of a fluid or a fluent solid material
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F15/00Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
    • G01F15/18Supports or connecting means for meters
    • G01F15/185Connecting means, e.g. bypass conduits

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Measuring Volume Flow (AREA)

Abstract

The present invention relates to a mirror surface treatment method of a joint surface between blocks constituting a mass flow meter. More specifically, the present invention relates to a mirror surface treatment method for separating a joint surface area according to the necessity of mirror surface treatment and a mirror surface treatment To a surface of a mass flowmeter bonded to a surface of the mass flowmeter.
The present invention relates to a method for mirror-to-block bonding a first step of dividing a joining surface 11 to be mirror-polished into a mirror-finished region 13 requiring mirror-surface treatment and a non-mirror- S100); A second step S200 of machining the mirror surface treatment region 13 and the non-mirror surface treatment region 14 such that a step is formed; And a third step (S300) of lapping only the mirror surface treatment region (13) and subjecting the mirror surface to mirror surface treatment.

Description

TECHNICAL FIELD [0001] The present invention relates to a mass flow meter,

The present invention relates to a mirror surface treatment method of a joint surface between blocks constituting a mass flow meter. More specifically, the present invention relates to a mirror surface treatment method for separating a joint surface area according to the necessity of mirror surface treatment and a mirror surface treatment To a surface of a mass flowmeter bonded to a surface of the mass flowmeter.

In general, there are a flow meter for measuring the flow rate of gas or gas, such as a pressure differential flowmeter using an orifice, a vortex flowmeter, a turbine flowmeter, an ultrasonic flowmeter, an area flowmeter and a thermal mass flowmeter.

Among them, a thermal mass flowmeter uses a principle that, when a heated object is placed in a flowing fluid, heat exchange occurs between the fluid and the heated object to cool the heated object, and the cooling rate is a function of the flow rate. It is a flowmeter that measures the flow rate and the flow rate according to the measurement.

The thermal mass flowmeter has been widely used in the semiconductor manufacturing process due to its high accuracy and has recently been effectively applied to the chemical reaction process, the petrochemical field, the environmental field, and the building air conditioning field.

Figure 1 shows a conventional thermal mass flowmeter.

The conventional thermal type mass flow meter generally comprises a flow rate detector for measuring the flow rate and a flow rate controller for controlling the flow rate. The flow rate detector detects the flow rate of the fluid passing through the inlet (4) So as to be laminarized and to escape to the hollow portion 5.

The sensor tube 8 is connected to the front and rear of the bypass 7 through the connection hole 9 so that a part of the fluid is bypassed and a heater (not shown) is attached to the sensor tube 8 to heat the circulating fluid . The heater is placed in the sensor tube cover 2, and a resistance thermometer (not shown) is disposed on the front and rear of the heater to measure the resistance difference according to the temperature difference to estimate the total flow rate passing through the bypass 7 of the flow rate detector do.

On the other hand, the fluid having passed through the hollow portion 5 passes through the flow rate regulating portion including the solenoid valve 3, and the flow rate is regulated and exits the mass flow meter through the outlet 6.

1, the flow rate detector of the conventional thermal mass flowmeter includes a body body 1 including a bypass 7 and a sensor body 10 including a sensor tube 8, do.

The mutual bonding surfaces 11 are mirror-finished by a method such as lapping in order to ensure tight bonding. After the positions of the sensor tubes 8 are aligned with the connection holes 9 of the main body 1, Lt; / RTI >

The mirror surface treatment of the sensor body 10 bonding surface 11 mechanically processes the hole of the sensor tube 8 and the screw hole 12 in the sensor body 10 as shown in Fig. (11), and is completed through a polishing process. Electrolytic polishing may be added as needed to remove the iron (Fe) component and fine dust from the bonding surface 11 and to leave only the nickel (Ni) layer on the surface to induce corrosion resistance in a semiconductor process or the like.

However, in the conventional lapping process of the sensor body 10 bonding surface 11, a lapping agent made of diamond powder is applied to the entire bonding surface 11 of the sensor body 10 and the bonding surface 11 is coated with cast iron, A scratch inducing element such as iron powder coming out of the screw hole 12 is transferred to the joint surface 11 to form a lap joint, There is a problem that scratches are caused on the mirror surface during the process of relative motion.

Accordingly, there is a problem in that the lapping time becomes excessively long due to repairs due to damage to the specular surface during the operation, and further, there is a case where the scratches are excessive and the entire sensor body 10 must be treated as defective.

In order to solve this problem, the screw hole 12 is machined mechanically and then a process of removing the scratch inducing element by high-pressure air is added. However, the fine iron powder does not easily fall off and remains, It is a fact that it can not collect.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a mass flowmeter in which a joint surface of a mass flow meter is divided according to the necessity of mirror surface treatment, And thus it is possible to mirror-interface the joint of the mass flowmeter with high accuracy and to significantly reduce the defect rate in the manufacturing process of the mass flowmeter.

In order to accomplish the above object, the present invention provides a method for mirror-to-block bonding, comprising the steps of: forming a bonding surface (11) to be mirror-finished by a mirror surface treatment region (13) (S100); < / RTI > A second step S200 of machining the mirror surface treatment region 13 and the non-mirror surface treatment region 14 such that a step is formed; And a third step (S300) of lapping only the mirror surface treatment region (13) and subjecting the mirror surface to mirror surface treatment.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a first step (S100) of dividing a bonding surface (11) to be mirror-finished into a mirror-surface treatment region (13) requiring mirror-surface treatment and a non- A second step (S200) of machining the specular surface treatment region (13) and the non-surface treatment region (14) to have mutual angles; And a third step (S300) of lapping only the specular surface region (13) and subjecting the specimen to mirror surface processing.

Here, the bonding surface is a bonding surface 11 where the sensor body 10 of the mass flow meter is bonded to the main body 1, and the specular surface treatment region 13 is formed of the sensor tube 8 of the bonding surface 11, And the non-mirror surface treatment region 14 is an area including a component which is likely to contain a scratch inducing element such as a screw hole 12 in the joint surface 11. [

According to another aspect of the present invention, there is provided a block of a mass flow meter including a bonding surface (11) to be subjected to a mirror surface treatment, wherein the bonding surface (11) Wherein the non-mirror surface treatment region 14 includes a non-mirror surface treatment region 14 that is different from the mirror surface treatment region 13 so as to minimize contact with mechanical friction elements during mirror surface treatment Is formed with a height difference in height (h).

Here, the block is a sensor body 10 coupled to the main body 1, and the specular surface treatment region 13 is a region including the hole of the sensor tube 8 in the bonding surface 11, (14) is advantageously a region of the joint surface (11) including a component which is likely to contain a scratch inducing element such as a screw hole (12).

The mirror surface treatment method of the mass flowmeter bonded surface provided in the present invention is advantageous in that the mirror surface treatment can be performed with high precision since the scratch inducing element can be prevented from being transferred from another area by mirror- have.

Since the unnecessary scratch is prevented according to the mirror surface treatment method of the mass flow meter junction surface of the present invention, it is possible to perform the surface treatment with a short work time.

It is possible to remarkably reduce the defective mass flow meter by applying the mirror surface treatment method of the bonding surface of the present invention.

1 is a side sectional view for explaining a structure of a conventional thermal mass flow meter
FIG. 2 is a perspective view showing a joint surface of a conventional thermal mass flow meter sensor body. FIG.
3 is a perspective view showing a sensor body joint surface mirror-polished according to the present invention;
Fig. 4 is a side cross-sectional view of a sensor body joint surface which is mirror-
5 is a side cross-sectional view showing another embodiment of a sensor body joint surface to be mirror finished according to the present invention
6 is a flowchart illustrating a mirror surface treatment method of a mass flow meter joint surface of the present invention

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

4 is a side cross-sectional view of a sensor body joint surface to be subjected to mirror-surface treatment according to the present invention, and Fig. 5 is a cross-sectional view of the sensor body according to the present invention, Sectional view showing another embodiment of the joint surface. 6 is a flow chart for explaining the mirror surface treatment method of the mass flow meter joint surface of the present invention.

Although not necessary to understand the technical idea of the invention as a part that is not different from the prior art, it is excluded from the description, but the technical idea and the scope of protection of the present invention are not limited thereto.

3 and 4, the bonding surface 11 of the sensor body 10 to be mirror-finished according to the mirror surface treatment method of the mass flow meter bonding surface of the present invention will be described in detail.

The contact surface 11 of the sensor body 10 of the present invention is divided into the mirror surface treatment region 13 and the non-mirror surface treatment region 14 depending on the mirror surface treatment necessity.

The mirror surface treatment region 13 is an area including the hole of the sensor tube 8 in the joint surface 11 so as to be rigidly joined to the body body 1 Is a region in which the target fluid flowing into the sensor tube 8 is not leaked.

The non-mirror surface treatment region 14 is a region including a component which is likely to contain a scratch-inducing element such as iron powder, such as a screw hole 12 in the bonding surface 11, and strict bonding is unnecessary.

In the bonding surface 11 according to the mirror surface bonding method of the present invention, the non-mirror surface treatment region 14 minimizes the contact with mechanical friction elements such as wraps during mirror surface treatment of the mirror surface treatment region 13 Is formed at a height (h) different from that of the mirror surface treatment region (13).

In the present invention, when lapping the mirror-surface treatment region 13, the lap is not in contact with the non-mirror-surface treatment region 14 containing the scratch-inducing element, so that the scratch-inducing element is transferred to the mirror- The scratches do not occur on the surface 13.

The step (h) between the mirror surface treatment region 13 and the non-mirror surface treatment region 14 is sufficient to raise the wrap so that the wrap does not contact the non-mirror surface treatment region 14. For example, in Fig. 4, the value of h is preferably 2 to 5 mm or so.

The step (h) between the specular surface treatment region 13 and the non-surface treatment region 14 is preferably formed by mechanical working before lapping.

In another embodiment of the present invention, as shown in FIG. 5, the mirror surface treatment region 13 and the non-mirror surface treatment region 14 may be formed to have mutual angles. Accordingly, the non-mirror-surface treatment region 14 becomes an oblique incline shape.

Since the non-mirror surface treatment region 14 is not a stepwise structure as shown in FIG. 4 but a simple tapered shape, the machining time can be reduced only by conventional friction machining.

Next, the mirror surface treatment method of the joint of the mass flow meter of the present invention will be described in detail with reference to FIG.

The method for mirror-surface processing of the mass flowmeter bonded surface of the present invention includes a first step (S100) of distinguishing between the specular surface treatment region (13) and the non-surface treatment region (14); A second step S200 of machining the mirror surface treatment region 13 and the non-mirror surface treatment region 14 such that a step is formed; And a third step (S300) of lapping only the mirror surface treatment region 13 to make it mirror-finished.

In the first step S100, the specular surface treatment region 13 may be an area including a hole of the sensor tube 8 among the bonding surfaces 11, and may be an area that needs to be strictly bonded to the body body 1 have.

In the first step S100, the non-mirror-surface treatment region 14 is a region including a component having a high possibility of containing a scratch-inducing element, such as a screw hole 12 in the joint surface 11, Area.

Meanwhile, the mirror surface treatment method of the mass flowmeter joint surface of the present invention can be replaced with the step of machining the second step S200 so that the mirror surface treatment region 13 and the non-mirror surface treatment region 14 have mutual angles .

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It goes without saying that various modifications can be made.

1: Body Body 2: Sensor tube cover
3: Solenoid valve 7: Bypass
8: Sensor tube 9: Connection hole
10: sensor body 11: joint surface
12: screw hole 13: mirror-finished region
14: non-

Claims (5)

A first step (S100) of dividing a joining surface (11) to be mirror-polished into a mirror-surface processing region (13) requiring mirror-surface processing and a non-mirror-surface processing region (14); A second step S200 of machining the mirror surface treatment region 13 and the non-mirror surface treatment region 14 such that a step is formed; And a third step (S300) of lapping only the specular surface treatment region (13) and mirror-polishing the specimen surface (13) , wherein the bonding surface (11) Wherein the specular surface treatment region 13 is a region including the hole of the sensor tube 8 in the bonding surface 11 and the non-surface treatment region 14 is the bonding surface 11, And a component including a component that is likely to contain a scratch inducing element such as a threaded hole (12).
A first step (S100) of dividing a joining surface (11) to be mirror-polished into a mirror-surface processing region (13) requiring mirror-surface processing and a non-mirror-surface processing region (14); A second step (S200) of machining the specular surface treatment region (13) and the non-surface treatment region (14) to have mutual angles; And a third step (S300) of lapping only the specular surface region (13) and the specular surface treatment region (13) to form a mirror surface , wherein the bonding surface (11) is formed by bonding the sensor body (10) of the mass flowmeter And the specular surface treatment region 13 is a region including the hole of the sensor tube 8 in the bonding surface 11 and the non-surface treatment region 14 is a bonding surface 11 of the bonding surface 11, Characterized in that it is an area comprising components that are likely to contain a scratch inducing element, such as a screw hole (12)

delete Wherein the bonding surface (11) comprises a mirror surface treatment region (13) which requires mirror surface treatment and a non-mirror surface treatment region (14) which is not treated, and wherein the non-mirror surface treatment The area 14 is formed with a step or a slope at a height h different from the specular surface treatment area 13 so that the contact with the mechanical friction element is minimized while the specular surface treatment area 13 is mirror- Wherein the block is a sensor body 10 associated with the body 1 and the specular surface treatment region 13 is a region including the hole of the sensor tube 8 in the bonding surface 11, Is characterized in that it is a region including a component which is likely to contain a scratch inducing element such as a screw hole (12) in the joint surface (11) delete
KR1020150050094A 2015-04-09 2015-04-09 Preprocessing for Polishing Joint Surface of Mass Flow Controller KR101749962B1 (en)

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KR101749962B1 true KR101749962B1 (en) 2017-07-28

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197580A (en) * 2001-12-21 2003-07-11 Fujikoshi Mach Corp Wafer polishing apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197580A (en) * 2001-12-21 2003-07-11 Fujikoshi Mach Corp Wafer polishing apparatus

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