KR101738948B1 - Apparatus for detecting impact and damages applying asymmetrical arrangement of sensors and method for same - Google Patents

Apparatus for detecting impact and damages applying asymmetrical arrangement of sensors and method for same Download PDF

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KR101738948B1
KR101738948B1 KR1020150177440A KR20150177440A KR101738948B1 KR 101738948 B1 KR101738948 B1 KR 101738948B1 KR 1020150177440 A KR1020150177440 A KR 1020150177440A KR 20150177440 A KR20150177440 A KR 20150177440A KR 101738948 B1 KR101738948 B1 KR 101738948B1
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sensors
sensor
driver
sensor group
angle
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KR1020150177440A
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Korean (ko)
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정휘권
이명준
전준영
박규해
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전남대학교산학협력단
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/38—Detecting the response signal, e.g. electronic circuits specially adapted therefor by time filtering, e.g. using time gates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4445—Classification of defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/0289—Internal structure, e.g. defects, grain size, texture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/10—Number of transducers
    • G01N2291/103—Number of transducers one emitter, two or more receivers

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

A driver attached to the structural integrity examination target structure, connected to the information processing unit and generating guided ultrasound waves; And
And a plurality of sensors arranged asymmetrically at predetermined positions based on the driver and connected to the information processing unit,
The sensor group provides an apparatus for measuring an impact and damage direction utilizing an asymmetric sensor arrangement capable of detecting a crack position of a structure from geometrical information between the driver and each sensor.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an apparatus and method for detecting an impact and damage using an asymmetric sensor arrangement,

The present invention relates to a damage detection method and apparatus using an asymmetric sensor arrangement.

Structural health monitoring is a technology that grasps the status of industrial infrastructure and large structures such as ships and aircraft in real time through multiple sensor networks and signal processing techniques. This technology has the advantage of greatly improving the time efficiency and economical efficiency compared to the conventional nondestructive inspection, and researches and system development on application in various structures are actively being actively carried out.

Structural soundness monitoring technology uses passive sensing method using acoustic emission technique and active sensing method using induction ultrasonic wave which are generated in the environment where the structure is operated. Various techniques are under development to detect the location of the initial micro-damage.

Initial structural health monitoring technology detects the location by recording signals due to impact and damage per sensor network, constructing a database, and then searching for signals similar to the measured signals. However, this technique requires multiple sensors with location-specific signal training and complex signal processing. When applying this technique to complex structures, accuracy is greatly reduced.

Korean Patent Publication No. 2010-0124242 (Nov. 26, 2010)

An embodiment of the present invention is to provide an apparatus for measuring an impact and a damage position by arranging a plurality of sensors asymmetrically using geometric information of each sensor.

In addition, an embodiment of the present invention provides a method of measuring impact and damage positions using asymmetrical arrangement of a plurality of sensors, using geometric information of each sensor.

Another embodiment of the present invention is to provide an apparatus for measuring impact and damage positions by arranging a plurality of asymmetrically arranged sensor groups and using geometric information of each sensor group.

Another embodiment of the present invention is to provide a method of arranging a plurality of asymmetrically arranged sensor groups and measuring the impact and damage position using the geometric information of each sensor group.

Yet another embodiment of the present invention is to provide detection of the location of cracks without measuring the velocity of the damaged reflected wave and guided ultrasound.

Another embodiment of the present invention is to provide that the accuracy of position detection is not affected even in the course of detecting cracks on anisotropic and isotropic materials.

According to an embodiment of the present invention, there is provided an ultrasonic diagnostic apparatus comprising: a driver attached to a structural integrity examination target structure, connected to an information processing unit, for generating an induced ultrasound wave; And a sensor group including a plurality of sensors arranged asymmetrically at predetermined positions on the basis of the driver and connected to the information processing unit, wherein the sensor group detects a crack position of the structure from the geometrical information between the driver and each sensor The present invention provides an apparatus for measuring the impact and damage direction utilizing an asymmetric sensor arrangement.

The sensor may be arranged so that the wavelength of the damaged reflected wave coming back from the crack in response to the induced ultrasonic wave generated by the actuator can be sequentially transmitted.

In addition, the distance and angle between each sensor and the sensor group and the actuator can be located at predetermined positions.

The sensor group may also include three sensors.

A plurality of sensor groups and drivers may be formed.

A driver is attached to one point of the structure to be researched for structural integrity and attached to the structural integrity examination structure at a position adjacent to the actuator and the time delay information of the acoustic emission wave measured by the actuator is transmitted to the information processing section, The time delay information of the damaged reflection wave is sensed by the sensor and transmitted to the information processing section. The time delay information of the acoustic emission wave and the reflected reflected wave And the time delay information of the structure can be determined to determine the structural integrity of the structure.

The sensor may be arranged so that the wavelength of the reflected reflected wave generated from the crack by the guided ultrasonic wave generated by the actuator can be sequentially transmitted.

 Also, the distance and angle between the sensors of the sensors can be located at predetermined positions.

In addition, the sensor may be divided into the front, rear, left, and right directions of the center of the driver.

A first sensor group that measures a first angle indicating a direction of impact or damage, and includes one driver and a plurality of sensors; And a second sensor group located apart from the first sensor group and measuring a second angle indicative of an impact or damage direction, and including a plurality of sensors, wherein the first sensor group and the second sensor group include: There is provided an apparatus for measuring an impact and a damaged position, which is an apparatus according to any one of claims 1 to 9.

An embodiment of the present invention can provide an apparatus for measuring impact and damage locations using asymmetrical arrangement of a plurality of sensors using geometry information of each sensor.

According to an embodiment of the present invention, a plurality of sensors may be arranged asymmetrically to provide a method of measuring impact and damage locations using geometric information of each sensor.

Further, another embodiment of the present invention can provide an apparatus for arranging a plurality of asymmetrically arranged sensor groups and measuring the impact and damage position using the geometric information of each sensor group.

Further, another embodiment of the present invention can provide a method of arranging a plurality of asymmetrically arranged sensor groups and measuring the impact and damage position using the geometric information of each sensor group.

Further, another embodiment of the present invention can detect the position of the crack without measuring the velocity of the damaged reflected wave and the guided ultrasonic wave.

Further, another embodiment of the present invention may not be affected by the accuracy of position detection even in the course of detecting cracks on anisotropic and isotropic materials.

1 is a view showing the arrangement of a sensor group and a driver according to an embodiment of the present invention;
2 is a diagram illustrating the detection of a distance to a crack by utilizing the geometric information of the first sensor unit according to an embodiment of the present invention.
FIG. 3 is a diagram illustrating a process of amplifying a wavelength of a sensor according to an embodiment of the present invention.
4 is a view showing a plurality of sensor group arrangement according to another embodiment of the present invention;
FIG. 5 is a flowchart showing a procedure for detecting a shock and a damaged position according to an embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, this is merely an example and the present invention is not limited thereto.

In the following description, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions of the present invention, and may be changed according to the intention or custom of the user, the operator, and the like. Therefore, the definition should be based on the contents throughout this specification.

The technical idea of the present invention is determined by the claims, and the following embodiments are merely a means for effectively explaining the technical idea of the present invention to a person having ordinary skill in the art to which the present invention belongs.

Embodiments of the present invention may further include a second sensor group 200 having the same configuration as the first sensor group 100 including only the driver 10 and the plurality of sensors S1, S2, S3, Will be described later.

Here, in the embodiment including the two sensor groups 100 and 200, the first sensor group 100 and the second sensor group 200 are separately described, and in the embodiment including only one sensor group 100 Since the first sensor group 100 has the same configuration as the first sensor group 100, it is described as the first sensor group 100 irrespective of the first or second distinction.

Each of the sensor groups 100 and 200 to be described later includes four drivers 10 and 40 and four sensors S1, S2, S3, S4, S5, S6, S7 and S8, S2, S3, S4, S5, S6, S7, and S8) may be included.

However, the case where the impact and damage positions can be detected with relatively higher accuracy by using four sensors S1, S2, S3, S4, S5, S6, S7, S8 will be described as an example.

When a plurality of sensor groups are used, even if the material constituting the inspection target structure is formed isotropically or anisotropically, it may not be affected by the accuracy of the position detection of the crack 30 due to the kind of the constituent material .

On the other hand, when two sensors are used, an example of deriving the speed value of the wavelength or applying the speed value of the wavelength according to the predetermined table may be implemented.

In addition, the impact and damage detection apparatus using the asymmetric sensor arrangement is hereinafter abbreviated as a detection apparatus.

1 is a view showing an arrangement of a first sensor group 100 according to an embodiment of the present invention.

Referring to FIG. 1, the detection apparatus includes a first sensor group 100 and the first sensor group 100 includes one driver 10 and four sensors S1, S2, S3, and S4. The driver 10 can be attached to the structure to be inspected to transmit the guided ultrasonic wave 11 and can be connected to an information processing unit (not shown) by wire or wireless means including an electrical connection, .

Sensors S1, S2, S3, and S4 may be arranged on the front, rear, left, and right sides of the driver 10 on the structural integrity inspection target structure. Since the sensors S1, S2, S3, and S4 may be arranged at predetermined positions, distance and angle information between the sensors S1, S2, S3, and S4 may already be recorded or stored in the information processing unit. In the information processing unit, geometric information such as distance and angle information between each sensor S1, S2, S3, S4 and the driver 10 can be recorded or stored.

However, the distance between the driver 10 and each of the sensors S1, S2, S3, and S4 may be differently maintained. Each of the sensors S1, S2, S3, and S4 maintains a distance a, b, c, and d from the driver 10, and each distance a, b, c, . The time, distance and angle at which the damaged reflected wave 12 returned from the crack 30 reaches the respective sensors S1, S2, S3, S4 by the arrangement of the sensors S1, S2, S3, .

The geometric information means positional information according to distances and angles between the sensors S1, S2, S3, and S4 and the driver 10. The guided ultrasonic wave 11 emitted from the driver 10 based on the geometric information, S2, S3, and S4 located around the driver 10 by returning to the damaged reflection wave 12, and transmitting the time information that has arrived to the information processing unit.

The damaged reflected wave 12 that returns from the crack 30 formed at a certain point reaches the sensors S1, S2, S3, and S4 at a certain angle, and each arrival time is delayed . The delay time difference and the time information for returning the damaged radiation wave 12 can be measured and stored or recorded in the information processing unit.

The measured time information is obtained by using the distance a, b, c, d between the predetermined driver 10 and each sensor S1, S2, S3, S4 as shown in FIG. The velocity of the induced ultrasound wave 11 generated can be derived. The derived velocity of the guided ultrasonic wave 11 can be a fixed value in deriving the impact and damage direction of the structure.

Since the velocity of the guided ultrasonic wave 11 is derived from the geometric information, the time taken for the damaged reflected wave 12 reflected from the crack 30 to reach the sensors S1, S2, S3, and S4 is measured One of the sensors S1, S2, S3, and S4 may transmit arrival time information of the damaged reflection wave 12 to the information processing unit. Since the time, distance, and velocity values can be derived by the information processing unit, the distance between the crack 30 and the first sensor unit 100 can be derived.

In order to detect the position of the crack 30, the distance and direction with respect to the first sensor group 100 must be derived, and the distance can be derived from the above description. Referring to FIG. 2, a method for deriving the direction in which the crack 30 is located from the first sensor group 100 will be described.

2 is a diagram illustrating the detection of the distance from the crack 30 by utilizing the geometric information of the first sensor unit 100 according to an embodiment of the present invention.

In order to detect the position of the crack 30, the distance and the direction from the first sensor group 100 must be derived, so that the distance is derived with reference to FIG. A process of deriving the distance from the first sensor group 100 will be described with reference to FIG. The sensors S1, S2, S3, and S4 are disposed at predetermined positions with respect to the driver 10, so that geometric information among them can be recognized by an information processing unit (not shown).

The crack 30 may emit the damaged reflected wave 12 in response to the guided ultrasound wave 11 emitted by the driver 10 and the damaged reflected wave 12 may reach the first sensor group 100. [ At this time, the damaged reflection wave 12 may reach the third sensor S3 of the first sensor group 100 as shown in the figure.

Examples in which the four sensors S1, S2, S3, S4 are arranged can be modified by a person skilled in the art and the geometrical information of each sensor S1, S2, S3, S4 can be varied can be changed. According to the geometric information, the wavelength entering angle [theta] at which the damaged reflection wave 12 enters can change. Thus, the geometric information is a fixed value and the wavelength entry angle [theta] can be a variable value. The center line 20 may be formed in the parallel direction with respect to the third sensor S3 in the third sensor S3 in which the damaged reflection wave 12 first arrives.

Here, the parallel direction is a means for indicating an arbitrary direction having a straight line, and the reference in the parallel direction can be determined by various modifications by those skilled in the art.

A wavelength entry angle? Can be formed from the damaged reflection wave 12 based on the arbitrary center line 20. The arbitrary center line 20 forms an output angle? 2 formed by a line connecting the third sensor S3 and the second sensor S2 and a line connecting the second sensor S2 and the first sensor S1 And the output angle? 4 formed by the line connecting the first sensor S1 and the fourth sensor S4 is formed.

The following equations can be established by combining the above calculated angles? 2,? 1,? 4 with the distance information derived from FIG.

Td13? Distance (1, 3) 占 cos (?)

Td12? Distance (1, 2) x cos (? 1 -?)

Td23? Distance (2, 3) 占 sin (? 2 -?)

Td41? Distance (4, 1) 占 sin (? 4 -?)

In the above equation, distance may be the number of the sensor in parentheses afterwards. For example, in the case of distance (4, 1), it may be the shortest distance between the fourth sensor S4 and the first sensor S1. And Td is a time delay distance. For example, in the case of Td13, it can be regarded as a time delay distance at which the damaged reflection wave 12 between the first sensor and the third sensor arrives.

In this equation, it is assumed that the wavelength entering angle [theta] can be formed in all directions, and the number of all cases can be substituted. Here, in all directions, when the minimum angle standard is 1 degree, the result that 360 times of the number of times is substituted can be derived.

Accordingly, the Td value corresponding thereto can be derived.

That is, all of the geometric information shown in FIG. 2 can be estimated on the assumption that the wavelength entry angle? Is formed from 1 degree to 360 degrees.

The distance can be detected by deriving the speed of the wavelength based on the above description and the distance can be detected using a predetermined value according to a given table. Although the above embodiment using four sensors S1, S2, S3 and S4 can detect distances and angles, when two or less sensors are used, an external condition such as a velocity value of a wavelength is given in a predetermined state .

FIG. 3 is a diagram illustrating a process of amplifying a wavelength of a sensor according to an embodiment of the present invention.

Referring to FIG. 3, the position of the crack 30 can be detected using the derived Td value and the estimated wavelength entry angle? Described above in FIG.

(a) shows a time shift S indicating the time difference between the respective wavelengths reaching the sensors S1, S2, S3 and S4 and the damaged reflected wave 12 reaching the sensors S1, S2, S3 and S4 Respectively. Here, the time shift S means a time difference in which the damaged reflected wave 12 reaches each of the sensors S1, S2, S3 and S4 and the time shift S means a time entry angle at which the damaged reflected wave 12 enters &thetas;).

Therefore, in order to derive the above-mentioned wavelength entry angle (?) In FIG. 2, it is assumed that a wavelength entry angle? Is formed in all directions, and the result is shown in (c). (c), the maximum wavelength entering angle? P assumes a wavelength angle with the greatest intensity, assuming that the wavelength entering angle? enters in all directions based on the determined geometrical information of the first sensor 100 .

When the arrival delay time of the damaged reflected wave 12 is superimposed on the graph in (a) showing the wavelength due to the damaged reflected wave 12 arriving at each of the sensors S1, S2, S3 and S4, . A graph plotting these similar flows is shown in (b).

a portion where the wavelengths are amplified by overlapping the four sensor wavelengths 1sp, 2sp, 3sp, and 4sp with the sensor wavelengths 1sp, 2sp, 3sp, and 4sp may be formed. The amplification wavelength amp may vary in size depending on combinations of the sensor wavelengths 1sp, 2sp, 3sp, and 4sp in consideration of the time shift S, and the maximum wavelength size is determined by the maximum wavelength entry angle? P The wavelength of the light can be reduced.

By performing this process and comparing the amplification wavelengths (amp) and (c) of (b), it is possible to estimate the angle that can be confirmed by the wavelength entry angle ().

FIG. 4 is a diagram illustrating a plurality of sensor groups according to another embodiment of the present invention.

Referring to FIG. 3, another embodiment of the present invention for detecting the position of the crack 30 of the structure can be described. Unlike FIGS. 1 and 2, the embodiment includes two sensor groups 100 and 200, which derive only the direction in which the cracks 30 are located from each sensor group 100 and 200, The position of the crack 30 can be estimated.

Therefore, the position of the crack can be detected without obtaining the speed information of the wavelength through the predetermined speed value or the first and second sensors 100 and 200.

That is, since it can be detected without velocity information, it may not be influenced by the physical properties of the structure. The physical properties are, for example, isotropic or anisotropic properties, which directly or indirectly affect the transmission speed and refractive index of the wavelength.

Therefore, in detecting the position of the crack 30, it is possible to maintain and enhance the accuracy by detecting the position of the structure by physical properties of the structure that affect the wavelength, for example, only information excluding the velocity value.

The first sensor group 100 and the second sensor group 200 may be positioned while maintaining a predetermined gap distance. The geometric information that must be known in advance includes the angle and distance information of the four sensors S1, S2, S3, and S4 and the driver 10 included in the first sensor group 100 and the angle and distance information of the second sensor group 200 The angle and distance information with the four sensors S5, S6, S7 and S8 and the driver 40 and the distance and angle information between the respective drivers 10 and 40 may be required.

The predetermined geometrical information corresponds to one embodiment and is not limited to the geometric information among the configurations described above. The geometric information between the first sensor group 100 and the second sensor group 200 may include, And the like.

With this structure, it is possible to estimate the arrangement angle with the crack 30 through the geometrical information between the configurations included in the first sensor unit 100, and the angle between the configurations included in the second sensor unit 200 It is possible to estimate the arrangement angle with the crack 30 through the geometric information.

Therefore, since the geometric information between the two sensor groups 100 and 200 and the angles of the sensor groups 100 and 200 and the crack 30 can be derived, the position including the distance and the direction of the crack 30 can be derived have. This method can also be applied to a structure in which three or more sensor groups are formed.

4 is a flowchart illustrating a procedure for detecting a shock and a damaged position according to an embodiment of the present invention.

Detection of shock and hand position can be detected by the following method.

(P3), induction ultrasonic wave generation process (P4), receiving impaired reflected wave (P4), sensor array information and time delay information (P3) (P5), an impact position detection process (P6) using sensor arrangement information and time delay information, and a structure state information confirmation process (P7).

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, . Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by equivalents to the appended claims, as well as the appended claims.

10, 40:
11: Guided ultrasound
12: Damaged reflected wave
20: arbitrary center line
30: crack
S1: the first sensor
S2: second sensor
S3: third sensor
S4: fourth sensor
S5: fifth sensor
S6: sixth sensor
S7: Seventh sensor
S8: 8th sensor
100: first sensor group
200: second sensor group
a: separation angle
td12, td41, td13, td23: Signal arrival distance difference
θ: Wavelength entering angle
θ 1, θ 2, θ 4: Calculation angle
a, b, c, d, L: separation distance
S: Time shift
1sp: first sensor wavelength
2sp: second sensor wavelength
3sp: Third sensor wavelength
4sp: fourth sensor wavelength
amp: amplification wavelength
θ P: maximum wavelength entering angle
P1: Actuator and Sensor Installation Process
P2: Acoustic emission wave measurement process
P3: Impact location detection process
P4: Guided ultrasound generation process
P5: Damaged reflected wave reception process
P6: Damage Location Detection Process
P7: Structure verification process

Claims (10)

A driver attached to the structural integrity examination target structure, connected to the information processing unit and generating guided ultrasound waves; And
And a plurality of sensors arranged asymmetrically at predetermined positions based on the driver and connected to the information processing unit,
The information processing unit,
Detecting a position of the crack with geometrical information including a distance and an angle between the plurality of sensors and a wavelength entry angle at which an impaired reflected wave reflected from a crack reaches the plurality of sensors,
Wherein the wavelength entry angle is a maximum wavelength entry angle formed by overlapping the wavelengths formed by the damaged reflection waves reaching each of the plurality of sensors, thereby forming an asymmetric sensor arrangement.
The method according to claim 1,
Wherein the plurality of sensors are arranged such that the damaged reflected waves can be sequentially transmitted.
delete The method according to claim 1,
Wherein the sensor group comprises three sensors.
The method according to claim 1,
Wherein a plurality of the sensor groups and the actuators are formed.
A sensor group including a plurality of sensors arranged in accordance with predetermined geometrical information including a distance and an angle at a position adjacent to the driver, A structural integrity test object,
Generating an induced ultrasound wave in the driver ;
A time shift indicating a time difference when the damaged ultrasonic wave is reflected from the crack and the damaged reflected wave reaches each of the plurality of sensors is transmitted to the information processing unit,
Wherein the information processing unit detects the position of the crack by the wavelength entry angle, which is an angle at which the damaged reflection wave reaches the plurality of sensors, and the geometric information when each time shift is overlapped,
Wherein the wavelength entry angle is a maximum wavelength entry angle formed by overlapping wavelengths formed by the damaged reflection waves reaching each of the plurality of sensors.
The method of claim 6,
The plurality Wherein the sensor is arranged such that the wavelength of the impaired reflected wave is sequentially transmitted.
delete The method of claim 6,
The plurality Wherein the sensor can be positioned in the front, rear, left, and right directions, respectively, at the center of the driver.
A first sensor group that measures a first angle indicating a direction of impact or damage, and includes one driver and a plurality of sensors; And
And a second sensor group located apart from the first sensor group and measuring a second angle indicating an impact or damage direction, the second sensor group including another driver and a plurality of sensors,
Wherein the first sensor group and the second sensor group are the detection devices according to any one of claims 1, 2, 4, and 5.
KR1020150177440A 2015-12-11 2015-12-11 Apparatus for detecting impact and damages applying asymmetrical arrangement of sensors and method for same KR101738948B1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003066016A (en) * 2001-08-23 2003-03-05 Toshiba Corp Measuring method for depth of defect in structure
JP2008139171A (en) 2006-12-01 2008-06-19 Fuji Heavy Ind Ltd Impact detection system
JP2011185921A (en) 2010-02-09 2011-09-22 Fuji Heavy Ind Ltd System and method for measuring damage length

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003066016A (en) * 2001-08-23 2003-03-05 Toshiba Corp Measuring method for depth of defect in structure
JP2008139171A (en) 2006-12-01 2008-06-19 Fuji Heavy Ind Ltd Impact detection system
JP2011185921A (en) 2010-02-09 2011-09-22 Fuji Heavy Ind Ltd System and method for measuring damage length

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