KR101736307B1 - Bga probe pin for connection - Google Patents

Bga probe pin for connection Download PDF

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Publication number
KR101736307B1
KR101736307B1 KR1020150090574A KR20150090574A KR101736307B1 KR 101736307 B1 KR101736307 B1 KR 101736307B1 KR 1020150090574 A KR1020150090574 A KR 1020150090574A KR 20150090574 A KR20150090574 A KR 20150090574A KR 101736307 B1 KR101736307 B1 KR 101736307B1
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KR
South Korea
Prior art keywords
solder ball
probe pin
housing
terminal
plunger
Prior art date
Application number
KR1020150090574A
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Korean (ko)
Other versions
KR20170001805A (en
Inventor
이승용
전성국
Original Assignee
(주) 네스텍코리아
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Application filed by (주) 네스텍코리아 filed Critical (주) 네스텍코리아
Priority to KR1020150090574A priority Critical patent/KR101736307B1/en
Publication of KR20170001805A publication Critical patent/KR20170001805A/en
Application granted granted Critical
Publication of KR101736307B1 publication Critical patent/KR101736307B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A probe pin for busy contact is provided. The provided probe pin for a non-via-contact is provided with: a housing having a hollow portion; A bottom plunger slidably movably coupled in the housing and electrically connected to the circuit board of the tester; A top plunger fixed to an end of the housing and connected in a lateral direction of a solder ball as an external connection terminal of the semiconductor package; And an elastic member interposed between the bottom plunger and the top plunger, wherein the top plunger comprises: a pair of terminal blocks, which are symmetrically processed to receive the solder balls of the BGA and have connection terminals at their ends; A connecting protrusion connecting the pair of terminal blocks to each other and inserted and fixed in the housing; And a guide member protruding inwardly between the pair of terminal blocks to guide the electrical connection between the solder ball and the terminal block, thereby minimizing a shock generated during the connecting operation and connection process between the solder ball and the probe pin, So as to prevent damage to the surface of the substrate.

Description

A probe pin for a busy contact {BGA PROBE PIN FOR CONNECTION}

The present invention relates to a probe pin for busy contact, and more particularly, by improving the structure of the probe pin, the solder ball and the probe pin, which are external connection terminals of the semiconductor package, can be stably connected, To a probe pin for a BGA (Ball Grid Array) contact to prevent external damage between the probe pin and the probe pin.

A semiconductor integrated circuit existing in a chip state on a semiconductor wafer performs an electrical die sorting test (EDS) using a test equipment. In the process, a chip determined as a good product is subjected to a series of packaging ) Process is performed to re-process the semiconductor package to protect the chip from external impact.

The finished package is then subjected to an electrical final test. In the electrical die classification test (EDS) and the electrical final test process, an electric functional test is performed on each semiconductor integrated circuit having a chip or semiconductor package form using a tester equipped with various measuring instruments .

For the electrical inspection of the semiconductor package, a test is carried out with a semiconductor package mounted on a separate test socket. The shape of the test socket is basically determined according to the shape of the semiconductor package.

The type of the semiconductor package for determining the shape of the test socket is classified into a dual in-line package (DIP), a small out-line package (SOP), a quad flat package (QFP) and a ball grid array (BGA) The socket serves as an intermediary for connecting the external connection terminal of the semiconductor package and the test substrate.

A ball grid array (BGA) package using a solder ball as an external connection terminal in a semiconductor package includes a probe pin or a pogo pin having a structure in which a socket pin is installed inside the body, Pin) and performs the test process through the components.

Here, the solder ball has a safe zone where deformation due to an impact should not occur during the connection with the probe pin, and the position of the safety zone is the lower end portion and the center side edge portion of the solder ball. Accordingly, in the process of connecting the probe pin with the solder ball, the connection operation is performed by avoiding the safe zone.

1 is a cross-sectional view showing a main portion of a conventional Korean Registered Patent No. 10-110666 "probe pin for semiconductor inspection".

1, Korean Patent Registration No. 10-1106666 discloses a probe pin for semiconductor inspection electrically connecting a terminal of a semiconductor device and a substrate pad of a circuit board of a tester, wherein the inside of the probe pin is hollow, A body 10 formed with a through hole and divided into an upper body and a lower body; An elastic member (20) inserted in the body (10) and performing contraction and expansion movement; And a plunger (30) inserted into the body (10) so as to be positioned at a lower end of the elastic member (20) and vertically flowing by the elastic member (20) A contact portion 31 which is exposed to the outside through a through hole at the lower end of the body 10; And a body 33 integrally formed on the upper end of the contact portion 31 and in contact with the elastic member 20 so that the size of the inner diameter of the through hole at the upper end of the body 10 is smaller than the size of the elastic member 20 20 and the inner diameter of the through hole at the lower end is smaller than the outer diameter of the body portion of the plunger 30. [

Conventionally, the length of the probe pin is shortened by integrally forming the probe on the body, thereby contributing to the miniaturization of the semiconductor testing apparatus, improving the durability, and minimizing the friction contact between the components.

However, in Korean Patent No. 10-1106666, "Probe pin for semiconductor inspection", in the process of connecting a solder ball and a probe pin, which are external connection terminals of a semiconductor package, the solder ball's safe zone is crushed and solder balls Causing serious damage and causing a visual defect of the solder ball.

In addition, in the conventional probe pin, the probe pin is deformed due to the impact generated during the process of connecting the solder ball and the probe pin in the use process. As a result, the defective contact ratio between the solder ball and the probe pin increases, There is a problem in that it can not be performed smoothly.

Korean Patent No. 10-1106666

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and it is an object of the present invention to provide a solder ball and a probe pin, And provides an A-contact probe pin.

Another object of the present invention is to provide a probe pin for bidirectional contact that can prevent external damage of the solder ball and the probe pin in the connection process by minimizing a direct impact generated during the connection process of the solder ball and the probe pin .

According to an aspect of the present invention, A bottom plunger slidably movably coupled in the housing and electrically connected to the circuit board of the tester; A top plunger fixed to an end of the housing and connected to a solder ball as an external connection terminal of the semiconductor package in a lateral direction; And an elastic member interposed between the bottom plunger and the top plunger,

Wherein the top plunger includes:

A pair of terminal blocks which are symmetrically processed to receive solder balls of the BGA and have connection terminals at their ends;

A connecting protrusion connecting the pair of terminal blocks to each other and inserted and fixed in the housing; And

And a guide member protruding inward between the pair of terminal blocks to guide electrical connection between the solder ball and the terminal block.

In the present invention, the terminal block may be provided with an inclined surface having a predetermined inclination angle at a lower portion thereof, and a vertical surface may be extended and protruded at an end portion of the inclined surface.

In the present invention, the guide member protrudes inward from each of the terminal blocks, and the guide member operates by the force of the solder ball entering between the terminal block and the terminal block to guide the connection terminal of the terminal block in the lateral direction of the solder ball .

In the present invention, the guide members protruding from the respective terminal blocks may be alternately protruded so as not to overlap with each other.

According to the present invention, by improving the structure of the probe pin connecting to the solder ball of the BGA, the probe pin can be connected in the lateral direction avoiding the safe zone of the solder ball, It is possible to improve the lifetime of the product and to improve the stability and electrical conductivity in the connection process.

In addition, the probe pin of the present invention has an effect of preventing damage to the lower end of the solder ball, which acts as a main medium of electrical signal transmission in connection with the solder ball.

Further, the probe pin of the present invention can be connected to the solder ball by pressing the side direction of the solder ball in a clamping state when connected to the solder ball, thereby achieving an accurate contact between the probe pin and the solder ball.

In addition, by directly converting the direction of the force transmitted from the solder ball and pull pin to the horizontal direction, the direct impact transmitted to the solder ball during the connection process is avoided, thereby preventing the outer damage of the solder ball and the probe pin As a matter of course, the data flow using the probe pin can be smoothly performed.

1 is a cross-sectional view showing a main portion of a conventional Korean Registered Patent No. 10-1106666 "probe pin for semiconductor inspection".
2 is a perspective view illustrating a probe pin for a busy contact according to a preferred embodiment of the present invention.
3 is an exploded perspective view showing a probe pin for a via contact according to a preferred embodiment of the present invention.
4 is a plan view showing a developed state of a top plunger in a probe pin for busy contact according to a preferred embodiment of the present invention.
5 is a flowchart showing a process of manufacturing a top plunger of a probe pin for busy contact according to a preferred embodiment of the present invention.
FIG. 6 is a cross-sectional view showing a principal part of a probe pin for a via contact according to a preferred embodiment of the present invention.
7 is an operational state diagram illustrating a probe pin for a busy contact according to a preferred embodiment of the present invention.

Hereinafter, a probe pin for a via contact according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a perspective view showing a probe pin for a via contact according to a preferred embodiment of the present invention, and FIG. 3 is an exploded perspective view illustrating a probe pin for a via contact according to a preferred embodiment of the present invention.

2 and 3, the probe pin 100 for contactless contact according to the present invention includes a housing 110, a bottom plunger 120, a top plunger 130, and an elastic member 150, .

The housing 110 binds the components of the probe pin 100 and serves as a frame of the probe pin 100.

The housing 110 is formed of a metal material and has a cylindrical shape having a hollow portion therein. According to an embodiment of the present invention, a separate metal may be deposited on the outer surface of the housing 110 to increase conductivity.

The bottom plunger 120 is connected to the housing 110 so as to be slidable in the housing 110 to perform an electrical connection operation with the tester circuit board 3 for electrical characteristics inspection.

 The end of the housing 110 to which the bottom plunger 120 is connected is subjected to a rounding process so that the bottom plunger 120 is not detached from the housing 110.

The top plunger 130 includes a pair of terminal blocks 131 each having a connection terminal 135 at an end thereof and a connection protrusion 130 connected to the pair of terminal blocks 131, And a guide member 140 for guiding the electrical connection between the solder ball 1 and the terminal block 131 which are the external connection terminals of the body to be inspected.

The top plunger 130 will be described in detail with reference to FIGS. 4 and 5.

FIG. 4 is a plan view showing a developed state of a top plunger in a probe pin for a busy contact according to a preferred embodiment of the present invention. FIG. 5 is a cross- Fig.

4 and 5, a part of the top plunger 130 of the present invention protrudes to the outside of the housing 110, and another part of the top plunger 130 is fixed in a state of being drawn into the housing 110, Which is an external connecting terminal of the chain semiconductor package.

The top plunger 130 includes a pair of terminal blocks 131 for receiving the solder ball 1 thereon and connection pins 138 provided at the bottom of the terminal block 131 and connection terminals And a guide member 140 provided thereon.

The terminal block 131 is in the shape of a plate-like body and its intermediate portion is bent in a "V" shape. A vertical plane 134 extends and protrudes from an end of each of the inclined planes 133. The vertical plane 134 extends in a direction perpendicular to the vertical plane 134, 134 are provided at the ends of the connection terminals 135.

The connection leg 138 is connected to a connection protrusion 137 protruded downward between the pair of terminal strips 131 and inserted into and fixed to the housing 110.

The guide member 140 is provided on the vertical surface 134 of the terminal block 131 to guide the electrical connection between the solder ball 1 and the terminal block 131 of the semiconductor package.

The guide member 140 protrudes inward from a vertical surface 134 of each of the terminal blocks 131. The guide member 140 is operated by the force of the solder ball 1 entering between the terminal strip 131 and the terminal block 131 to move the connection terminal 135 of the terminal strip 131 toward the side of the solder ball 1 .

Here, the guide members 140 protruding from the respective terminal blocks 131 are alternately protruded so as not to overlap with each other.

The top plunger 130 has the shape of the plate body through a plurality of bending processes.

First, the vertical surface 134 of each terminal block 131 is bent at a predetermined angle.

Next, the guide member 140 is bent so as to be perpendicular to the vertical surface 134.

Next, the connecting foot 138 is bended so as to protrude downward from the terminal block 131.

Next, the terminal block 131 is bended so as to have a "V" shape on the basis of the intermediate portion between the terminal block 131 and the terminal block 131. [ At this time, the vertical surface 134 is vertical, and the guide member 140 is perpendicular to the vertical surface 134 to have the shape of the top plunger 130.

The elastic member 150 is interposed between the bottom plunger 120 and the top plunger 130 in the housing 110. The elastic member 150 maintains elasticity between the bottom plunger 120 and the top plunger 130 and sets the position of the bottom plunger 120 sliding in the housing 110. Here, the elastic member 150 may be any product having self-elasticity, but the present invention applies a spring, which is a typical product having elasticity.

The probe pin for a busy contact according to a preferred embodiment of the present invention improves the structure of the probe pin to prevent external damage generated during the process of connecting the solder ball and the probe pin, And the operation and effect of the operation will be described in detail with reference to the drawings.

FIG. 6 is a cross-sectional view illustrating a principal part of a probe pin for a via contact according to a preferred embodiment of the present invention, and FIG. 7 is an operational diagram illustrating a probe pin for a via contact according to a preferred embodiment of the present invention.

Referring to FIGS. 6 and 7, the probe pin 100 of the present invention is mounted in a tester device to perform a semiconductor electrical characteristic inspection. The probe pin 100 includes a solder ball 1 as an external connection terminal of a ball grid array (BGA) (3).

The bottom plunger 120 of the probe pin 100 is electrically connected to the circuit board 3 of the tester and the top plunger 130 is electrically connected to the solder ball 1 which is an external connection terminal of the BGA.

Here, in order to electrically connect the top plunger 130 and the solder ball 1, the solder ball 1 is inserted between the pair of terminal strips 131.

The solder ball 1 presses the guide member 140 downward of the top plunger 130 when the solder ball 1 enters a predetermined depth between the pair of terminal strips 131. Then,

When the solder ball 1 is pressed against the guide member 140, the pair of terminal strips 131 are tilted toward the solder ball 1 and the connection terminals 135 of the terminal strip 131 are tilted toward the solder ball 1, And is connected in the lateral direction by avoiding the safety zone (the safe zone (the lower end portion of the solder ball and the edge portion at the center side) of the solder ball.

When the connection terminal 135 is connected to the side surface of the solder ball 1, data flow for checking electrical characteristics between the BGA and the tester circuit terminal can be smoothly performed.

The probe pin for a BGA contact of the present invention improves the structure of a probe pin connecting with a solder ball which is an external connection terminal of a BGA so that the probe pin can be connected in a lateral direction avoiding a safe zone of the solder ball, In order to prevent the damage of the main parts of the solder ball during the connection process, the life of the product can be improved.

In addition, since the direct impact generated in the connection process is avoided by changing the direction of the force transmitted during the connection process of the solder ball and the pull pin, the data flow using the probe pin is prevented by preventing the external damage of the solder ball and the probe pin So that it can be smoothly performed.

1: solder ball 3: circuit board 110: housing
120: bottom plunger 130: top plunger 131: terminal block
133: sloped surface 134: vertical surface 135: connection terminal
137: connecting protrusion 138: connecting protrusion 140: guide member
150: elastic member

Claims (4)

A housing having a hollow portion;
A bottom plunger slidably movably coupled in the housing and electrically connected to the circuit board of the tester;
A pair of terminal blocks fixed to the ends of the housing and symmetrical to each other to receive the solder balls of the BGA so as to be laterally connected to the solder balls as external connection terminals of the semiconductor package, A top plunger including a connecting protrusion for connecting the pair of terminal blocks to each other and inserted and fixed to the housing and a guide member protruding inward between the pair of terminal blocks to guide electrical connection between the solder ball and the terminal block, And
And an elastic member interposed between the bottom plunger and the top plunger,
The guide member
And the guide member is operated by the force of the solder ball entering between the terminal block and the terminal block to guide the connection terminal of the terminal block in the lateral direction of the solder ball. . The method according to claim 1,
Wherein,
Wherein an inclined surface having a predetermined angle inclined angle is provided at a lower portion thereof, and a vertical surface is extended and protruded at an end portion of the inclined surface. delete The method according to claim 1,
Wherein the guide members protruding from the respective terminal blocks are alternately protruded so as not to overlap each other.
KR1020150090574A 2015-06-25 2015-06-25 Bga probe pin for connection KR101736307B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150090574A KR101736307B1 (en) 2015-06-25 2015-06-25 Bga probe pin for connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150090574A KR101736307B1 (en) 2015-06-25 2015-06-25 Bga probe pin for connection

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KR20170001805A KR20170001805A (en) 2017-01-05
KR101736307B1 true KR101736307B1 (en) 2017-05-22

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220046258A (en) * 2020-10-07 2022-04-14 주식회사 제네드 Probe pin for probing solder ball
WO2022075507A1 (en) * 2020-10-07 2022-04-14 주식회사 제네드 Probe pin for probing solder ball

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102169858B1 (en) * 2019-03-13 2020-10-26 퀄맥스시험기술 주식회사 Probe for the test device
KR102162476B1 (en) * 2019-07-18 2020-10-06 박상량 High Performance Semiconductor Test Socket With Single Body Housing
KR102212346B1 (en) * 2019-12-17 2021-02-04 주식회사 제네드 A probe pin
TW202240174A (en) * 2021-03-31 2022-10-16 南韓商普因特工程有限公司 The electro-conductive contact pin
KR20230126339A (en) * 2022-02-23 2023-08-30 (주)포인트엔지니어링 The Electro-conductive Contact Pin And Test Device Having The Same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004053343A (en) * 2002-07-18 2004-02-19 Fujitsu Ltd Contact probe
JP2008243561A (en) * 2007-03-27 2008-10-09 Enplas Corp Contact pin, and socket for electric component
JP2012252893A (en) 2011-06-03 2012-12-20 Yamaichi Electronics Co Ltd Socket for semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101106666B1 (en) 2010-05-17 2012-01-20 주식회사 타이스일렉 Probe pin for testing semiconductor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004053343A (en) * 2002-07-18 2004-02-19 Fujitsu Ltd Contact probe
JP2008243561A (en) * 2007-03-27 2008-10-09 Enplas Corp Contact pin, and socket for electric component
JP2012252893A (en) 2011-06-03 2012-12-20 Yamaichi Electronics Co Ltd Socket for semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220046258A (en) * 2020-10-07 2022-04-14 주식회사 제네드 Probe pin for probing solder ball
WO2022075507A1 (en) * 2020-10-07 2022-04-14 주식회사 제네드 Probe pin for probing solder ball
WO2022075508A1 (en) * 2020-10-07 2022-04-14 주식회사 제네드 Probe pin for probing solder ball
KR102416776B1 (en) 2020-10-07 2022-07-05 주식회사 제네드 Probe pin for probing solder ball

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