KR101729275B1 - Composition for rollers used in semiconductor wafer cleaning equipment and rollers comprising the same - Google Patents

Composition for rollers used in semiconductor wafer cleaning equipment and rollers comprising the same Download PDF

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Publication number
KR101729275B1
KR101729275B1 KR1020150048229A KR20150048229A KR101729275B1 KR 101729275 B1 KR101729275 B1 KR 101729275B1 KR 1020150048229 A KR1020150048229 A KR 1020150048229A KR 20150048229 A KR20150048229 A KR 20150048229A KR 101729275 B1 KR101729275 B1 KR 101729275B1
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South Korea
Prior art keywords
roller
semiconductor wafer
cleaning apparatus
composition
wafer cleaning
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KR1020150048229A
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Korean (ko)
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KR20160119496A (en
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노용석
박기웅
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주식회사리온
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/069—Polyurethane

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A composition for a roller for a semiconductor wafer cleaning apparatus, wherein the roller composition is made of polyurethane having an NCO% of 3.8 to 6.05, and the roller for the semiconductor wafer cleaning apparatus is in contact with a cleaning solution having a pH of 10 to 12 By weight based on the total weight of the composition.

Description

TECHNICAL FIELD [0001] The present invention relates to a composition for a roller for a semiconductor wafer cleaning apparatus and a roller for a semiconductor wafer cleaning apparatus comprising the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition for a roller for a semiconductor wafer cleaning apparatus and a roller for a semiconductor wafer cleaning apparatus including the same, To a roller for a cleaning apparatus and a roller for a semiconductor wafer cleaning apparatus comprising the same.

In general, a semiconductor device is formed with a metal wiring for applying voltage to each device after each device is formed. Aluminum (Al) -based metal, which has a simple deposition process and low resistance compared to other materials, is mainly used as the metal wiring.

An intermetal dielectric layer is formed between the wirings and the wirings and a contact pattern is formed using the photoresist pattern as a mask to form contact holes. In order to carry out the photolithography process, the flatness of the underlying film is required. In order to make this flatness, a curved interlayer insulating film is planarized through a chemical mechanical polishing process. Residues that are not removed in the underlying film by the used chemical and slurry may become particles or form abnormal contact holes in a subsequent process or voids may be formed in the contact holes during wdep (tungsten deposition process) have. Therefore, a brush cleaning process is required after chemical mechanical polishing to remove such residues

Korean Patent Laid-Open Nos. 10-2006-0074770, 10-2005-0035999 and 10-2014-0082256 disclose a wafer cleaning apparatus using such roller brushes.

1 and 2 are schematic views of a conventional cleaning apparatus.

1 and 2, the first and second wafer rollers 10 and 12 for rotating the wafer and the wafer mounted between the first and second wafer rollers 10 and 12 are brought into contact with each other, (DIW) is supplied to the center portion so as to be in contact with both surfaces of the wafer, and is maintained in a soft state. When the wafer is rotated, the wafer is cleaned The first and second brushes 16 and 18 and the first and second brushes 16 and 18 and the first and second nozzles 16 and 18 for spraying the chemical, A proximity sensor 24 for generating a frequency by reading a magnetic sensor 26 mounted on the idler 14 and a control unit 20 for controlling the rotation speed of the wafer (26) for monitoring the RPM It can control.

Although the brush cleaning apparatus after the chemical mechanical polishing includes a roller for rotating the wafer, there is a problem that the roller can not maintain sufficient adhesion with the wafer due to various chemical components of the cleaning solution, and slipping, that is, Occurs

Therefore, a problem to be solved by the present invention is to provide a composition for a roller for a semiconductor wafer cleaning apparatus of a new component.

In order to solve the above problems, the present invention provides a composition for a roller for a semiconductor wafer cleaning apparatus, wherein the roller composition is composed of a polyurethane having an NCO% of more than 3.8 and less than 6.05, -12. ≪ / RTI > The present invention also provides a composition for a roller for a semiconductor wafer cleaning apparatus.

In one embodiment of the present invention, the% NCO of the polyurethane is 5.4 to 5.8.

In one embodiment of the present invention, the cleaning solution comprises ammonia and hydrogen peroxide water.

The present invention provides a roller for a semiconductor wafer cleaning apparatus including the above-described composition for a roller for a semiconductor wafer cleaning apparatus.

The present invention provides a semiconductor wafer cleaning apparatus including the above-described roller for a semiconductor wafer cleaning apparatus.

The roller according to the present invention is capable of high-speed rotation for a long time even in a high-alkali environment, and particularly, the adhesion of the wafer is maintained, thereby increasing the use time of the roller and stable operation.

1 and 2 are schematic views of a conventional cleaning apparatus.
3 is a photograph of a roller made of a composition according to one embodiment of the present invention.
4 and 5 are experimental results in which the roller was rotated at 50 rpm in a cleaning solution (containing ammonia and hydrogen peroxide) having a pH of 10 to 12.
FIGS. 6 and 7 are experimental results of setting the wafer rotation speed at the initial 100 rpm, and then measuring the rotation speed of the wafer while spraying the cleaning solution onto the right wafer.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described with reference to the accompanying drawings.

In order to make the understanding of the present invention clear in the following description, the description of the known technology for the characteristics of the present invention will be omitted. The following examples are intended to illustrate the present invention and should not be construed as limiting the scope of the present invention. Accordingly, equivalent inventions performing the same functions as the present invention are also within the scope of the present invention.

The present inventors have found that, in the case of a cleaning solution containing ammonia and hydrogen peroxide (1 to 2: 1 by volume) in particular, the pH of the cleaning solution is adjusted to 10 to 12, the adhesion of the roller to the roller .

To solve this problem, the present inventors provide a composition for a roller for a semiconductor wafer cleaning apparatus, wherein the composition for a roller provides a polyurethane having an NCO% of more than 3.8 to less than 6.05 as a composition for a roller for a semiconductor wafer cleaning apparatus. As used herein, NCO% is a parameter widely used in the art and is an important parameter that determines the properties of a polyurethane, as a percentage by weight of an unreacted isocyanate group of the material.

The present inventors have found that when the NCO% is in the range of more than 3.8 to less than 6.05, and more preferably in the range of 5.4 to 5.8, it is possible to maintain sufficient adhesion when the roller is rotated at a high speed in a cleaning solution (containing ammonia, hydrogen peroxide solution) It is possible to rotate at high speed for a long time.

3 is a photograph of a roller made of a composition according to one embodiment of the present invention. The roller comprising the composition according to the present invention was used in the brush cleaning apparatus of Korean Patent Publication No. 10-2014-0082256. However, the scope of the present invention is not limited thereto, and the scope of the present invention extends to any system in which a cleaning solution containing both ammonia and hydrogen peroxide is used in a basic condition and which adheres to and rotates the wafer.

The following table is the physical property data of the composition for the cleaning device roller according to the present invention and the comparative composition for the comparison.

Figure 112015033349271-pat00001

4 and 5 are experimental results in which the roller was rotated at 50 rpm in a cleaning solution (containing ammonia and hydrogen peroxide) having a pH of 10 to 12. In this experimental example, Comparative Example 1 (ref.) Is a polyurethane having an NCO content of 6.05, and Comparative Example 2 (sample 1) is a roller made of polyurethane having an NCO content of 3.8.

It can be seen in Figures 4 and 5 that the polyurethane with NCO% of 5.6 (Example 1, sapmple 2) maintains the wafer rotation speed at a constant rpm for 120 seconds at 50 rpm. On the other hand, when the NCO% is 3.8 or less or 6.05 or more, the decrease in the speed of the wafer is remarkably increased.

FIGS. 6 and 7 are experimental results of setting the wafer rotation speed at the initial 100 rpm, and then measuring the rotation speed of the wafer while spraying the cleaning solution onto the right wafer.

Referring to FIGS. 6 and 7, it can be seen that the polyurethane roller having an NCO% in the range of greater than 3.8 but less than 6.05 maintains a constant speed despite long-term use.

Therefore, the polyurethane roller having an NCO% of more than 3.8 but less than 6.05, more preferably 5.4 to 5.8 is capable of high-speed rotation for a long time in an alkaline environment, and particularly, the adhesion force of the wafer is maintained.

The present invention provides a roller made of the aforementioned polyurethane and a semiconductor wafer cleaning apparatus comprising the same.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

Claims (5)

A composition for a roller for a semiconductor wafer cleaning apparatus,
Wherein the composition for a roller comprises a polyurethane having an NCO weight percentage of more than 3.8 and less than 6.05,
The roller for semiconductor wafer cleaning apparatus is characterized in that it is contacted with a cleaning solution of pH 10-12 consisting of ammonia and hydrogen peroxide water in a volume ratio of 1: 2: 1 during cleaning,
Wherein the roller for the semiconductor wafer cleaning apparatus maintains the adhesive force when the semiconductor wafer is rotated at 50 to 100 rpm. The method according to claim 1,
Wherein the weight percent of NCO of the polyurethane is 5.4 to 5.8. delete A roller for a semiconductor wafer cleaning apparatus comprising the composition for a roller for a semiconductor wafer cleaning apparatus according to any one of claims 1 to 2. A semiconductor wafer cleaning apparatus comprising a roller for a semiconductor wafer cleaning apparatus according to claim 4.
KR1020150048229A 2015-04-06 2015-04-06 Composition for rollers used in semiconductor wafer cleaning equipment and rollers comprising the same KR101729275B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150048229A KR101729275B1 (en) 2015-04-06 2015-04-06 Composition for rollers used in semiconductor wafer cleaning equipment and rollers comprising the same

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Application Number Priority Date Filing Date Title
KR1020150048229A KR101729275B1 (en) 2015-04-06 2015-04-06 Composition for rollers used in semiconductor wafer cleaning equipment and rollers comprising the same

Publications (2)

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KR101729275B1 true KR101729275B1 (en) 2017-05-02

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007108320A (en) * 2005-10-12 2007-04-26 Canon Inc Developing roller, method for producing the same, process cartridge and image forming apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007108320A (en) * 2005-10-12 2007-04-26 Canon Inc Developing roller, method for producing the same, process cartridge and image forming apparatus

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