KR101727773B1 - Exposure apparatus - Google Patents
Exposure apparatus Download PDFInfo
- Publication number
- KR101727773B1 KR101727773B1 KR1020127017196A KR20127017196A KR101727773B1 KR 101727773 B1 KR101727773 B1 KR 101727773B1 KR 1020127017196 A KR1020127017196 A KR 1020127017196A KR 20127017196 A KR20127017196 A KR 20127017196A KR 101727773 B1 KR101727773 B1 KR 101727773B1
- Authority
- KR
- South Korea
- Prior art keywords
- lens
- photomask
- mask pattern
- exposure
- light
- Prior art date
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
- Lenses (AREA)
Abstract
The present invention includes photomasks 10 and 24 in which a mask pattern having the same shape as the exposure pattern exposed on the surface of the TFT substrate 4 held on the stage 8 is formed, A unit lens group 15, 29 constituted by arranging a plurality of convex lenses 14, 28 in the normal direction of the photomasks 10, 24 so as to be able to form images on the surface of the TFT substrate 4, A plurality of lens assemblies 11 and 25 arranged in a plane parallel to the surface of the TFT substrate 4 held on the photomasks 10 and 24 and the stages 8 and lens assemblies 11 and 25 And moving means 12 and 26 for moving the masks 10 and 24 and the plane parallel to the surface of the TFT substrate 4 on the stage 8.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an exposure apparatus for exposing an exposed object held on a stage to exposure light through a photomask to form a predetermined pattern, To an exposure apparatus capable of performing exposure with high resolving power.
A conventional exposure apparatus of this type is an exposure apparatus for intermittently irradiating exposure light through a photomask to an object to be exposed at a constant speed and exposing the mask pattern of the photomask to a predetermined position, And a plurality of light receiving elements arranged in a direction substantially orthogonal to the carrying direction, the first image pickup means being arranged to image a position on the opposite side of the exposure position from the exposure position, Second imaging means arranged to take an image of a position on the side opposite to the exposure position or on the side opposite to the carrying direction of the object to be exposed than the exposure position and having a plurality of light receiving elements arranged substantially parallel to the carrying direction, Relative to the photomask in a direction substantially orthogonal to the carrying direction, An alignment means for correcting an exposure position and a control means for controlling the driving of the alignment means on the basis of the detected first reference position for exposure position correction previously provided on the object by the first imaging means, And control means for controlling the irradiation timing of the exposure light when a second reference position for extracting the irradiation timing of the exposure light, which is previously provided on the object, is detected by the imaging means, based on the detected second reference position (for example, Patent Document 1).
However, in such a conventional exposure apparatus, in the case of exposing a pattern having periodicity to an object to be exposed (substrate), it is possible to easily carry out exposure of the substrate while controlling the irradiation timing of exposure light at a predetermined cycle while conveying the substrate at a constant speed in one direction However, exposure of an aperiodic pattern is difficult. In addition, since the photomask is exposed so as to face the substrate closely, the phase of the pattern on the substrate becomes blurred due to the presence of the time (collimation half angle) in the light source light irradiated on the photomask, There is a possibility that exposure can not be formed.
Such a problem can be solved by using a stepper exposure apparatus for exposing a photomask image onto a substrate by reducing an image by an imaging lens to expose the substrate. However, for example, when exposure is performed to a substrate having a large area of 1 m or more on one side There is a problem that the lens aperture used becomes large in correspondence with the size of the substrate and becomes expensive.
Accordingly, an object of the present invention is to provide an exposure apparatus which can cope with such a problem and can perform exposure of an aperiodic pattern in a large-area exposed object with a high resolution.
In order to attain the above object, an exposure apparatus according to the present invention comprises: a photomask in which a mask pattern having the same shape as an exposure pattern exposed on a surface of an object held on a stage is formed; And a plurality of convex lenses arranged in a direction normal to the photomask so as to form an image of equal magnification of the mask pattern formed on the photomask on the surface of the object to be imaged is formed on the photomask and on the stage And a moving means for moving the lens assembly in a plane parallel to the surfaces of the photomask and the object on the stage.
With this configuration, the unit lens group, which is disposed between the photomask and the stage, in which a plurality of convex lenses are arranged in the normal direction of the photomask, is called a photomask and a surface parallel to the surface of the object to be held on the stage And moving the lens assembly in the plane parallel to the stage with the moving means by moving the lens assembly in such a manner that an equal size image of the mask pattern formed on the photomask is formed on the surface of the object to be held on the stage, And exposes a predetermined pattern to the exposed object.
The lens assembly may further include a plurality of rows of lens rows arranged at a predetermined pitch in the moving direction and having a plurality of unit lens groups arranged at a predetermined pitch in a direction orthogonal to the moving direction thereof, One lens train of the lens train adjacent to each other is shifted by a predetermined amount in the arrangement direction of the unit lens group so that a part of each unit lens group of each lens train overlaps. As a result, a plurality of rows of the lens units in which a plurality of unit lens groups are arranged at a predetermined pitch in the direction orthogonal to the moving direction of the lens assembly are arranged in a plurality of rows at a predetermined pitch in the moving direction, The mask pattern of the photomask is exposed on the object while moving the lens assembly provided by shifting one lens train of the lens train adjacent to the unit lens group by a predetermined amount in the arrangement direction of the unit lens group so that a part of the unit lens group is overlapped.
The lens assembly may include a first lens array, a second lens array, a third lens array and a fourth lens array in which a plurality of convex lenses are formed on the front and back surfaces of a transparent substrate, And an intermediate overlaid image of the mask pattern of the photomask is formed between the second lens array and the third lens array. Thereby, the first, second, third, and fourth lens arrays in which a plurality of convex lenses are formed in correspondence with the front and back surfaces of the transparent substrate are superimposed on the optical axes of the corresponding convex lenses, An image of the equal magnification of the mask pattern formed on the photomask is imaged on the surface of the object to be imaged by the lens assembly configured to image the intermediate overlaid image of the mask pattern between the second lens array and the third lens array.
The lens assembly is provided with a first diaphragm having an opening of a predetermined shape near the surface of the convex lens located on the upstream side in the traveling direction of light of the third lens array, . Thereby, by the first diaphragm having an opening of a predetermined shape formed in the vicinity of the surface of the convex lens located on the upstream side in the traveling direction of light of the third lens array of the lens assembly, the exposure area by the unit lens is moved to the center of the lens Limit.
The aperture of the first diaphragm may have a rectangular opening when viewed in plan view and an area of a portion of the aperture overlapping with a part of the aperture of the first diaphragm adjacent to the lens assembly when viewed in the moving direction of the lens assembly, And half of the light is shielded. As a result, in the rectangular opening viewed from the plane, a part of the overlapping portion of the portion of the opening of the first diaphragm adjacent to the opening of the lens assembly when viewed from the moving direction of the lens assembly is half the area of the entire overlapping portion, The exposure area is limited at the aperture of the first iris of one shape to expose the mask pattern of the photomask to the surface of the object to be exposed. In this case, a predetermined amount of exposure is performed by the overlapping exposure of the unit lens group which is present in the moving direction of the lens assembly.
In addition, the lens assembly is provided with a second diaphragm which limits the diameter of the light beam in the vicinity of the lens surface on the upstream side of the light traveling direction of the fourth lens array. Thereby, the diameter of the light beam is restricted by the second diaphragm provided close to the lens surface on the upstream side of the direction of travel of light in the fourth lens array.
The stage is capable of carrying the object in one direction, and the moving means moves the lens assembly while the movement of the stage is stopped. Thereby, the stage carrying the object to be imaged and carrying it in one direction is temporarily stopped, and in this stop state, the lens assembly is moved by the moving means to expose the mask pattern of the photomask onto the object.
Further, a plurality of light-shielding films arranged in at least one row at a predetermined interval in a direction orthogonal to the conveying direction of the object are provided on the light-shielding film formed on one surface of the transparent substrate, on the opposite side of the photomask from the transfer direction of the object, And the other mask pattern is exposed to a predetermined cycle to the object to be exposed while the light source beam is intermittently irradiated to the other photomask at a predetermined time interval and conveyed at a constant speed to the other photomask . As a result, the light-shielding film provided on the opposite side of the photomask from the transfer direction of the object to be photographed above the stage and arranged in at least one row at a predetermined interval in the direction orthogonal to the conveying direction of the object, The light source light is intermittently irradiated to the other photomask forming the other mask pattern at a predetermined time interval, and the other mask pattern is exposed to the exposed body during a predetermined speed in a predetermined cycle.
The other photomask is formed by sequentially forming two mask pattern groups of two kinds of mask patterns having different required resolving power on the light shielding film formed on the surface of the transparent substrate opposite to the object to be exposed, And a micro lens for projecting the mask pattern onto the object to be projected correspondingly to a mask pattern having a high resolution required among the two types of mask patterns having different required resolving power is formed on the surface on the object side. As a result, of the two mask pattern groups formed of two types of mask patterns different in the required resolution from each other formed in the light-shielding film formed on the surface of the transparent substrate opposite to the object to be exposed in the transport direction of the object to be exposed, A plurality of mask patterns of the pattern group are projected on the object to be exposed on the transparent substrate by a plurality of microlenses formed corresponding to the mask pattern having a high required resolution.
The mask pattern group having a mask pattern with a high required resolution may include a plurality of mask pattern columns formed by arranging the plurality of mask patterns in a straight line at a predetermined pitch in a direction substantially perpendicular to the conveying direction of the object to be imaged And a plurality of exposure patterns formed by a mask pattern column positioned on the head side in the conveying direction of the object to be inspected are complemented by a plurality of exposure patterns formed by a subsequent mask pattern column, And the mask patterns are formed so as to be shifted by a predetermined dimension in the arrangement direction of the plurality of mask patterns. Thereby, a plurality of mask pattern columns formed by arranging a plurality of mask patterns at a predetermined pitch in a direction substantially orthogonal to the conveying direction of the object are provided, and a plurality of mask pattern columns arranged in the conveying direction of the object to be inspected, Is formed by a mask pattern column located at the head side in the conveying direction of the object to be exposed by a mask pattern group formed by a mask pattern group having a high required resolution and formed by shifting the mask pattern columns of the mask pattern array by a predetermined dimension in the arrangement direction of the plurality of mask patterns Is complemented by a plurality of exposure patterns formed by a subsequent mask pattern column.
The other photomask is to expose two types of mask patterns having different required resolving power to the display region at the center of the substrate for the thin film transistor at a predetermined cycle, A mask pattern having a high required resolution is a mask pattern for an electrode wiring of a thin film transistor and a mask pattern having a low required resolution is a signal line for supplying signals to the thin film transistor and a mask pattern for a scan line, Is provided with a terminal mask pattern connected to the signal line or the scanning line in an area outside the display area of the substrate for a thin film transistor. As a result, the exposure patterns of the electrode wirings of the thin film transistors having the high resolution required in the other photomask and the exposure patterns of the signal lines and the scanning lines having the low required resolution are formed at predetermined intervals in the central display region of the substrate for the thin film transistor, An exposure pattern of a terminal connected to an exposure pattern of a signal line or a scanning line in a photomask is formed in an area outside the display region of the substrate.
According to the invention of claim 1, it is possible to expose a lens assembly formed so as to be imageable on the surface of an object to be exposed in parallel with the surface of the photomask, while the mask pattern formed on the photomask is moved in parallel, The pattern can be exposed with a high resolution. In this case, the lens assembly may be smaller than the size of the photomask. Therefore, even if the size of the photomask is increased in correspondence with the large-area exposed object, the size of the lens assembly to be used can be reduced, and the cost of parts can be reduced. Thus, the manufacturing cost of the apparatus can be reduced.
According to the second aspect of the present invention, the mask pattern having a size larger than the size of the lens can be continuously connected and exposed without being interrupted.
According to the third aspect of the present invention, it is possible to easily form a lens assembly in which a plurality of unit lenses are arranged in a plane. Therefore, the manufacturing cost of the lens assembly can be reduced.
According to the fourth aspect of the present invention, it is possible to eliminate the influence of the aberration of the lens and form a uniformly sized image of the mask pattern of the photomask on the surface of the object to be exposed with high accuracy. Therefore, the formation precision of the exposure pattern can be improved.
According to the fifth aspect of the present invention, overexposure can be prevented even when overlapping exposure is performed to connect the exposure pattern. Therefore, the formation accuracy of the exposure pattern can be further improved.
According to the sixth aspect of the present invention, it is possible to limit the diameter of the bundle of rays and further improve the resolving power by the unit lens group of the lens assembly.
According to the seventh aspect of the present invention, the exposure can be performed while the object to be exposed is continuously supplied, and the efficiency of the exposure processing can be improved.
According to the eighth aspect of the present invention, in the same exposure step, an exposure pattern having no periodicity and an exposure pattern having periodicity can be formed.
According to the invention of claim 9, even when two types of exposure patterns having different required resolving power on the object to be formed are formed in a mixed state thereof, they can be simultaneously formed in the same exposure step, thereby improving the exposure processing efficiency .
According to the invention of
According to the eleventh aspect of the present invention, in the display region at the center of the thin film transistor substrate of the display device, the exposure pattern for the electrode wiring of the thin film transistor and the exposure pattern for the scan line, And an exposure pattern for a terminal having no periodicity can be formed in the same exposure step by connecting to an area outside the display area to the signal line or scan line exposure pattern. Therefore, the wiring pattern of the substrate for a thin film transistor can be efficiently formed.
1 is a front view showing an embodiment of an exposure apparatus according to the present invention.
2 is a plan view of Fig.
3 is a plan view showing a substrate for a thin film transistor used in the exposure apparatus of the present invention.
4 is a plan view showing a structural example of a photomask for a signal terminal used in the exposure apparatus of the present invention.
Fig. 5 is a diagram showing a configuration example of a lens terminal assembly for a signal terminal used in the exposure apparatus of the present invention. Fig. 5 (a) is a plan view and Fig. 5 (b) is a front view.
6 is a plan view for explaining the opening of the first diaphragm of the lens assembly for a signal terminal.
7 is an explanatory view showing exposure by two unit lens groups adjacent to the moving direction of the signal terminal lens assembly.
8 is a plan view showing another shape of the opening of the first diaphragm.
Fig. 9 is a plan view showing a structural example of a photomask for a scan terminal used in the exposure apparatus of the present invention. Fig.
Fig. 10 is a diagram showing a structural example of a lens assembly for a scanning terminal used in the exposure apparatus of the present invention, wherein (a) is a plan view and (b) is a front view.
11 is a plan view showing a large-area substrate provided with multiple display panels, which is a substrate used in the exposure apparatus of the present invention.
12 is a plan view showing an arrangement of the exposure optical unit in the exposure apparatus of the present invention and showing an example of arrangement of the large-area substrate in Fig.
FIG. 13 is a schematic plan view showing an example in which a plurality of types of mask patterns are formed on one photomask, in which (a) shows an example of a photomask for a signal terminal, (b) Fig.
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a front view showing an embodiment of an exposure apparatus according to the present invention, and Fig. 2 is a plan view of Fig. This exposure apparatus is capable of performing exposure of an aperiodic pattern in a large area exposed object with high resolving power and comprises a transfer means 1, a first exposure
Fig. 3 is a plan view of the
The transporting means 1 transports the
A first exposure
Here, the light source device 9 irradiates parallel light of light source light having a uniform luminance distribution to a
A
A signal
A specific example of the configuration of the signal
5 (b), the
Here, the function of each
5 (b), the
In this case, the
Here, with reference to FIG. 7, a description will be given in more detail of a state in which an area corresponding to the overlapped
7A is a plan view showing a
On the other hand, FIG. 7 (c) is an explanatory view showing the exposure of the point P corresponding to the overlapped
7 (d) is an explanatory view showing the exposure of the point Q corresponding to the overlapped
The shape of the
5 (b), the
The signal
And a moving
A second exposure
Here, the
A
A scan
A specific example of the configuration of the scan
10 (b), the scan-
The scanning
A moving
Next, the operation of the exposure apparatus thus constructed will be described.
A
Next, a reference mark (not shown) provided in advance on the
Subsequently, the moving means 12 of the first exposure
6, the area corresponding to the overlapped
When the signal terminal terminal
The
Subsequently, the moving means 26 of the second exposure
At this time, the region corresponding to the overlapped portion in the limited exposure region by the
When the scanning
In the above-described embodiment, the description has been given of the case where only one set of the
In the above embodiment, a case has been described in which the exposure pattern of the signal side terminal and the scanning side terminal is formed on one liquid crystal
When the shapes of the signal side terminal and the scanning side terminal of each
In the above embodiment, the description has been given of the case where the
A specific example of the configuration of the photomask used here is such that a mask pattern group composed of a mask pattern for electrode wiring of a thin film transistor having a high required resolution has the plurality of mask patterns in a direction substantially perpendicular to the transfer direction And a plurality of mask pattern lines formed by arranging the mask patterns of the
In the above embodiment, the case where the
In the above description, the case where the
4: TFT substrate
8: Stage
10: Photomask for signal terminal
11: Lens assembly for signal terminals
13: mask pattern for signal terminal
14, 14a to 14h, 28, 28a to 28h:
15, 29: unit lens group
16, 30: Lens column
17a, 31a: a first lens array
17b, 31b: a second lens array
17c, and 31c: a third lens array
17d and 31d: a fourth lens array
19, 32: 1st diaphragm
20, 33: opening
22: overlap portion (a portion overlapping the opening of the adjacent first stop)
23, 34: Second stop
24: Photomask for scan terminal
25: Lens assembly for scanning terminals
27: mask pattern for scanning terminals
Claims (11)
A photomask in which a mask pattern having the same shape as the exposure pattern exposed on the surface of the object held on the stage is formed,
A unit lens group disposed between the photomask and the stage and configured by arranging a plurality of convex lenses in a direction normal to the photomask so as to form an image of equal magnification of the mask pattern formed on the photomask on the surface of the object, A plurality of lens assemblies arranged in a plane parallel to the surfaces of the photomask and the object held on the stage;
And a moving means for moving the lens assembly in a plane parallel to the surface of the photomask and the photomask on the stage while the movement of the stage is in a stop state,
And a light shielding film formed on one side of the transparent substrate at a side opposite to the carrying direction of the object to be exposed with respect to the photomask above the stage and arranged in at least one row at a predetermined interval in a direction orthogonal to the conveying direction of the object, The exposure apparatus according to claim 1, further comprising another photomask on which another mask pattern is formed, wherein the light source light is intermittently irradiated to the other photomask at a predetermined time interval to expose the other mask pattern to the object to be exposed at a predetermined cycle The exposure apparatus comprising:
The other photomask is to expose two kinds of mask patterns having different required resolving powers in a display area at the center of the substrate for the thin film transistor at a predetermined cycle. Among the two types of mask patterns having different required resolution, A mask pattern for an electrode wiring of a thin film transistor, wherein a mask pattern having a low required resolution is a signal line for supplying a signal to the thin film transistor and a mask pattern for a scan line,
Wherein the photomask is provided with a terminal mask pattern connected to the signal line or the scanning line in an area outside the display area of the substrate for the thin film transistor.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2009-275455 | 2009-12-03 | ||
JP2009275455A JP5294488B2 (en) | 2009-12-03 | 2009-12-03 | Exposure equipment |
PCT/JP2010/069974 WO2011068014A1 (en) | 2009-12-03 | 2010-11-10 | Exposure apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20120107980A KR20120107980A (en) | 2012-10-04 |
KR101727773B1 true KR101727773B1 (en) | 2017-04-17 |
Family
ID=44114871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020127017196A KR101727773B1 (en) | 2009-12-03 | 2010-11-10 | Exposure apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US9122171B2 (en) |
JP (1) | JP5294488B2 (en) |
KR (1) | KR101727773B1 (en) |
CN (1) | CN102640058B (en) |
TW (1) | TWI494707B (en) |
WO (1) | WO2011068014A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5354803B2 (en) | 2010-06-28 | 2013-11-27 | 株式会社ブイ・テクノロジー | Exposure equipment |
JP5704525B2 (en) | 2010-08-19 | 2015-04-22 | 株式会社ブイ・テクノロジー | Scan exposure equipment using microlens array |
EP2716476B1 (en) | 2011-05-26 | 2016-08-17 | Bridgestone Corporation | Tire |
JP6023952B2 (en) * | 2011-07-29 | 2016-11-09 | 株式会社ブイ・テクノロジー | Microlens array and scan exposure apparatus using the same |
JP5760250B2 (en) * | 2011-08-03 | 2015-08-05 | 株式会社ブイ・テクノロジー | Microlens array and scan exposure apparatus using the same |
CN103858208B (en) * | 2011-08-10 | 2016-08-24 | 株式会社V技术 | The alignment device of exposure device and alignment mark |
JP5514284B2 (en) * | 2011-12-06 | 2014-06-04 | 富士フイルム株式会社 | Method for producing resin pattern using composition for microlens array exposure machine |
JP5867916B2 (en) * | 2011-12-06 | 2016-02-24 | 国立研究開発法人産業技術総合研究所 | Exposure apparatus and exposure method |
CN102591159B (en) * | 2012-03-21 | 2013-10-09 | 苏州大学 | Optical machining system and method |
JP6286813B2 (en) * | 2012-03-26 | 2018-03-07 | 株式会社ニコン | Exposure apparatus, exposure method, and device manufacturing method |
JP2013238670A (en) * | 2012-05-11 | 2013-11-28 | Canon Inc | Exposure apparatus, exposure method, method for manufacturing device, and aperture plate |
JP6712587B2 (en) * | 2015-02-18 | 2020-06-24 | 株式会社ブイ・テクノロジー | Scanning exposure device |
KR102547257B1 (en) * | 2017-07-25 | 2023-06-23 | 도판 인사츠 가부시키가이샤 | Exposure device and exposure method |
US20200218165A1 (en) * | 2018-12-21 | 2020-07-09 | Xia Tai Xin Semiconductor (Qing Dao) Ltd. | Exposure apparatus and method of detecting alignment error of reticle |
CN111619108A (en) | 2019-02-28 | 2020-09-04 | 宁波市石生科技有限公司 | Novel photocuring 3D printing apparatus |
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JP2008176257A (en) | 2007-01-22 | 2008-07-31 | Tokyo Denki Univ | Projection exposure device and projection exposure method |
JP2009058666A (en) | 2007-08-30 | 2009-03-19 | V Technology Co Ltd | Exposure apparatus |
JP2009277900A (en) | 2008-05-15 | 2009-11-26 | V Technology Co Ltd | Exposure device and photomask |
JP2012098420A (en) | 2010-10-29 | 2012-05-24 | V Technology Co Ltd | Scanning exposure device using micro-lens array |
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JPH09244255A (en) * | 1996-03-13 | 1997-09-19 | Nikon Corp | Exposure device for liquid crystal |
KR100503767B1 (en) * | 2003-06-27 | 2005-07-26 | 학교법인연세대학교 | Two-dimensional light-modulating nano/micro aperture array and high-speed nano pattern recording system utilized with the array |
US20090009736A1 (en) * | 2003-10-27 | 2009-01-08 | Koninklijke Philips Electronics N.V. | Apparatus for and Method of Forming Optical Images |
JP2006243543A (en) * | 2005-03-04 | 2006-09-14 | Fuji Photo Film Co Ltd | Method for forming permanent pattern |
JP2008076709A (en) * | 2006-09-21 | 2008-04-03 | V Technology Co Ltd | Exposure device |
-
2009
- 2009-12-03 JP JP2009275455A patent/JP5294488B2/en not_active Expired - Fee Related
-
2010
- 2010-11-10 WO PCT/JP2010/069974 patent/WO2011068014A1/en active Application Filing
- 2010-11-10 CN CN201080054737.1A patent/CN102640058B/en not_active Expired - Fee Related
- 2010-11-10 KR KR1020127017196A patent/KR101727773B1/en active IP Right Grant
- 2010-11-19 TW TW099139851A patent/TWI494707B/en not_active IP Right Cessation
-
2012
- 2012-05-30 US US13/483,751 patent/US9122171B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008176257A (en) | 2007-01-22 | 2008-07-31 | Tokyo Denki Univ | Projection exposure device and projection exposure method |
JP2009058666A (en) | 2007-08-30 | 2009-03-19 | V Technology Co Ltd | Exposure apparatus |
JP2009277900A (en) | 2008-05-15 | 2009-11-26 | V Technology Co Ltd | Exposure device and photomask |
JP2012098420A (en) | 2010-10-29 | 2012-05-24 | V Technology Co Ltd | Scanning exposure device using micro-lens array |
Also Published As
Publication number | Publication date |
---|---|
JP5294488B2 (en) | 2013-09-18 |
CN102640058B (en) | 2014-10-22 |
WO2011068014A1 (en) | 2011-06-09 |
KR20120107980A (en) | 2012-10-04 |
CN102640058A (en) | 2012-08-15 |
TWI494707B (en) | 2015-08-01 |
TW201202858A (en) | 2012-01-16 |
US20120236283A1 (en) | 2012-09-20 |
US9122171B2 (en) | 2015-09-01 |
JP2011118155A (en) | 2011-06-16 |
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