KR101689333B1 - Method for analysis of droplet jetting apparatus - Google Patents

Method for analysis of droplet jetting apparatus Download PDF

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Publication number
KR101689333B1
KR101689333B1 KR1020150079452A KR20150079452A KR101689333B1 KR 101689333 B1 KR101689333 B1 KR 101689333B1 KR 1020150079452 A KR1020150079452 A KR 1020150079452A KR 20150079452 A KR20150079452 A KR 20150079452A KR 101689333 B1 KR101689333 B1 KR 101689333B1
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KR
South Korea
Prior art keywords
substrate
nozzle
gate electrode
ink
voltage
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KR1020150079452A
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Korean (ko)
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KR20160143191A (en
Inventor
이석한
손상욱
최재용
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성균관대학교산학협력단
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Priority to KR1020150079452A priority Critical patent/KR101689333B1/en
Publication of KR20160143191A publication Critical patent/KR20160143191A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/07—Ink jet characterised by jet control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/06—Ink jet characterised by the jet generation process generating single droplets or particles on demand by electric or magnetic field
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/07—Ink jet characterised by jet control
    • B41J2/075—Ink jet characterised by jet control for many-valued deflection
    • B41J2/095—Ink jet characterised by jet control for many-valued deflection electric field-control type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/07—Ink jet characterised by jet control
    • B41J2/11—Ink jet characterised by jet control for ink spray
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/07—Ink jet characterised by jet control
    • B41J2/12—Ink jet characterised by jet control testing or correcting charge or deflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/10—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/16—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring distance of clearance between spaced objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values

Abstract

The present invention relates to a method of manufacturing an ink-jet print head, which is capable of controlling a distance between a parameter-substrate and a nozzle under a specific condition through an ink pattern ejected through an ink ejection apparatus, a moving speed of the substrate, a voltage applied to the gate electrode, And analyzing a pattern of the ink ejected from the ink ejecting apparatus to quickly analyze the parameter condition of the ink ejecting apparatus.

Description

[0001] METHOD FOR ANALYSIS OF DROPLET JETTING APPARATUS [0002]

The present invention relates to an ink jet apparatus analysis method, and more particularly, to a method for quickly analyzing various parameters of an EHD ink jet apparatus ejecting an ink droplet from a nozzle using a strong electric field concentrated in a meniscus at a nozzle hole .

A strong electric field concentrated in the meniscus at the nozzle hole can trigger electrodynamic (EHD) ejection of droplets or jets smaller than the radius of the nozzle. EHD, which ejects such droplets or jets, is emerging as an industry capable of performing industrial printing. However, the distribution of the electric field along the path from the nozzle to the substrate plays an important role in the quality of the printing, since the EHD ejection depends on the electrostatic interaction of the electric field induced droplet or jet induced electric charge. For example, during EHD ejection, some of the charged droplets or jets may be broken by fine satellite / spray. Alternatively, distortions that are printed in a shape having a unique pattern on the substrate to be printed in a line shape may be generated.

This distortion causes a problem that the ink pattern of a desired shape (e.g., line shape) can not be printed. According to the existing technology, there is a problem that it is not possible to quickly analyze which parameter causes such a distortion.

Korean Patent Publication No. 1020090081921 (published on July 29, 2009)

An object of the present invention is to quickly analyze a parameter when a predetermined pattern is formed by an ink ejection apparatus under a specific parameter condition using an electrostatic force.

It is also an object of the present invention to quickly analyze parameters and control parameters so that a pattern of a desired shape is formed.

According to one embodiment of the present invention, there is provided an analysis method for an ink jet apparatus, which comprises the steps of: using an electrostatic field and irradiating the substrate with an ink jetting apparatus including an electrode for applying a voltage to the nozzle, The distance between the substrate and the nozzle, the moving speed of the substrate, the outer diameter of the nozzle, the physical properties of the substrate, and the distribution of charges accumulated on the substrate, based on the ink pattern formed on the substrate And analyzing at least one.

In addition, the ink apparatus analyzing method may further include: a voltage applied to the nozzle based on a fishbone ink pattern formed on the substrate; a distance between the substrate and the nozzle; a moving speed of the substrate; an outer diameter of the nozzle; Physical properties, and charge distribution accumulated on the substrate.

The ink apparatus analyzing method may analyze at least one of the moving speed of the substrate and the physical properties of the substrate based on the dot ink pattern or the line ink pattern formed on the substrate.

The ink jetting apparatus may further include a gate electrode disposed under the nozzle, and based on the ink pattern formed on the substrate through the ink jetting apparatus, the geometry of the gate electrode, the gate electrode, And a voltage applied to the gate electrode are further analyzed.

Further, the gate electrode is a ring-shaped gate electrode.

Also, the ink injecting apparatus analyzing method is characterized by analyzing the radius of the ring-shaped gate electrode.

A method of forming a line-shaped ink pattern according to another embodiment of the present invention is a method of forming an ink pattern on the substrate by controlling an ink jetting apparatus including a substrate, a nozzle, and an electrode for applying a voltage to the nozzle And controls at least one of a voltage applied to the nozzle, a distance between the substrate and the nozzle, a moving speed of the substrate, an outer diameter of the nozzle, a physical property of the substrate, and a charge distribution accumulated in the substrate. do.

The method of forming the line-shaped ink pattern is characterized by controlling an ink jetting apparatus including a substrate, a nozzle, an electrode for applying a voltage to the nozzle, and a gate electrode disposed under the nozzle.

A gate electrode, a geometry of the gate electrode, a voltage applied to the gate electrode, and a distance between the nozzle and the gate electrode.

Further, the gate electrode has a ring-shaped geometry.

Also, the voltage applied to the gate electrode is controlled by a pulse-like voltage having a predetermined interval.

The voltage applied to the gate electrode is controlled such that a negative pulse voltage having a first time interval is applied and a positive pulse having a second time interval is applied after a predetermined interval.

The present invention has the advantage of quickly analyzing the various parameters of the ink jetting apparatus from various ink patterns and controlling the parameters to form the desired ink pattern.

1 is a schematic view of an ink jet apparatus using electrostatic force according to an embodiment of the present invention,
2 is a schematic diagram of satellite droplets discharged from a nozzle,
Figure 3 shows a satellite droplet image captured by a high speed camera,
Fig. 4 shows an ink pattern image when the substrate is stopped,
Figure 5 shows the ink pattern image,
Figure 6 shows the vector distribution of the electric field between the substrate and the nozzle as shown by COMOSOL software,
FIG. 7 shows the result of line patterning under the setting conditions of various parameters,
8 is a schematic view of an ink jet apparatus using electrostatic force according to another embodiment of the present invention,
9 is a graph showing a waveform of a gate voltage according to another embodiment of the present invention,
10 is a graph showing a waveform of a gate voltage according to another embodiment of the present invention,
Fig. 11 is a diagram showing the relationship between the ink pattern printed from the ink jetting apparatus when the gate voltage of Fig. 10 is applied,
12 is a graph showing waveforms of gate voltages according to another embodiment of the present invention,
13 is a view showing an ink pattern printed from the ink jetting apparatus when the gate voltage of Fig. 12 is applied,
14 is a graph showing waveforms of gate voltages according to another embodiment of the present invention,
Fig. 15 is a diagram showing the relationship between the ink pattern printed from the ink jetting apparatus when the gate voltage of Fig. 14 is applied,
16 shows the distribution of the electric field Ex according to the radius R of the ring-shaped gate electrode,
17 shows the distribution of the electric field (Ex) according to the distance between the gate electrode and the nozzle.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail.

It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted in an ideal or overly formal sense unless explicitly defined in the present application Do not.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In order to facilitate the understanding of the present invention, the same reference numerals are used for the same constituent elements in the drawings and redundant explanations for the same constituent elements are omitted.

A strong electric field concentrated in the meniscus at the nozzle 20 hole can trigger droplet ejecting or electro-hydrodynamic (EHD) ejection of the jetting. This EHD ejection can form a finer pattern using a variety of ink materials with a wide ink viscosity reaching thousands of CPs. The electric field distribution from the nozzle 20 to the substrate 10 plays an important role in determining the ink pattern shape. This electric field distribution is continuously changed by electrostatic interaction of charged droplets or inkjets. Also, during EHD ejection, some of the charged droplets or jets may be disintegrated into fine satellites / spray. Also, if the charges induced in the droplet or jet are accumulated in the non-conductive substrate 10, it will distort the original electric field and release the droplet or ink jet from the target. Due to such a distortion phenomenon, various pattern shapes appear.

1 is a schematic view of an ink jet apparatus using electrostatic force according to an embodiment of the present invention. The ink ejecting apparatus according to an embodiment of the present invention may include a substrate 10 on which ink patterns are formed, a nozzle 20 through which ink is ejected, and an electrode (not shown) for applying a voltage to the nozzle 20 .

According to an embodiment of the present invention, it is possible to inversely analyze parameters that cause a distortion phenomenon based on various pattern shapes formed through the ink jet apparatus. The parameters include the voltage applied to the nozzle 20, the moving speed of the substrate 10, the distance between the substrate 10 and the nozzle 20, the moving speed of the substrate 10, the outer diameter of the nozzle 20, The physical properties of the substrate 10, and the charge distribution accumulated in the substrate 10.

Conversely, according to an embodiment of the present invention, an ink jet apparatus including a substrate 10, a nozzle 20, and an electrode for applying a voltage to the nozzle 20 is controlled to form a line-shaped ink pattern The moving speed of the substrate 10, the distance between the substrate 10 and the nozzle 20, the moving speed of the substrate 10, the outer diameter of the nozzle 20, And the distribution of charges accumulated in the substrate 10 can be controlled.

The ink used in one embodiment of the present invention is a commercially available solvent pigment ink (e.g., Ink Tec, K 300), the surface tension coefficient and viscosity of the ink being 30-32 dynes / cm at 25 +/- 5 DEG C and 10-12 cps to be. The selected ink is stable to produce a cone-jet mode.

According to one embodiment of the present invention, the ink is supplied to the nozzle 20 having a constant pressure by a chamber (not shown). The nozzle 20 according to an embodiment of the present invention may be a tapered glass nozzle of various sizes.

The substrate 10 according to one embodiment of the present invention may be disposed on top of an electrically grounded electrode (not shown). The electrode has a vacuum chuck, is computer-controlled, and can be connected to a stage movable in the X and Y axes.

Figure 2 is a schematic diagram of satellite droplets (satellites) ejected from the row. Referring to FIG. 3, a strong electric field concentrated at the meniscus in the nozzle 20 hole can trigger the electro-hydrodynamic (EHD) ejection of the ink droplet. Referring to FIG. 3, during EHD ejection, a portion of the jet may be broken down into a plurality of fine satellites droplets by an electric field distribution.

Fig. 3 is an ejected image captured by a high-speed camera, Fig. 3a is an image ejected onto a conductive substrate 10, and Fig. 3b is an ejected image on a non-conductive substrate 10. Fig. Referring to FIG. 3B, ink ejected to the non-conductive substrate 10 generates a scattering phenomenon. This scattering phenomenon can be caused by the accumulated charge pattern even if the nozzle 20 and the substrate 10 are close enough, and the scattered droplets are irregularly dispersed around the previously accumulated charge pattern.

4 shows an ink pattern image when the substrate 10 is stopped. 4A is an ink pattern printed on the non-conductive substrate 10 in a state where the substrate 10 is stationary, and FIG. 4B is an ink pattern printed on the conductive substrate 10 in a state where the substrate 10 is stationary And Fig. 4C is a microscopic image of the ink pattern printed on the non-conductive substrate 10 in a state where the substrate 10 is stationary.

 Referring to FIG. 4B, the ink pattern printed on the conductive substrate 10 in a state where the substrate 10 is stopped is formed into a dot pattern having a specific shape. 4A, the ink ejected onto the non-conductive substrate 10 in a state where the substrate 10 is stationary has a problem that only a part of the divided droplets fall in the direction of the substrate 10 and many fine droplets It is scattered. In particular, referring to Fig. 4C, which is a microscopic image of the ejected ink on the non-conductive substrate 10, a concentric pattern is formed around the center. This pattern indicates that irregular satellite droplets are formed in a uniform pattern.

When the above phenomenon is used, when the dot pattern is formed on the substrate through the ink ejection apparatus, the dot pattern is analyzed inversely, and the substrate is not stopped, and the physical property of the substrate 10 can be analyzed as a conductive substrate.

Further, according to the method of forming a line-shaped ink pattern according to the embodiment of the present invention, the substrate 10 included in the ink ejecting apparatus is controlled to move at a constant speed without stopping, .

5 is a result of ink patterning formed on the substrate 10 when the substrate 10 is moved. In the case of the conductive substrate 10, the line width is the distance (the working distance, WD) between the substrate 10 and the nozzle 20 only, the moving speed of the substrate 10 (the moving speed of the stage) And the applied voltage (V1) applied to the nozzle. In the case of the non-conductive substrate 10, it is patterned in the form of a fish bone under the conditions of certain parameters, and the scattering effect around the patterning line due to the charges accumulated in the patterned lines outside the range of certain parameters .

4 and 5, when a dot-shaped ink pattern, a satellite / sprayed ink pattern, a line-shaped ink pattern, and a fishbone patterning are generated, the specific parameter condition of the ink jetting device is reversed Can be analyzed.

Figure 6 shows the vector distribution of the electric field between the substrate 10 and the nozzle 20 as illustrated by the COMOSOL software. If there is no pattern on the non-conductive substrate 10, the direction of the electric field vector is only toward the substrate 10. However, if charge is accumulated around the pattern on the substrate 10, the direction of the electric field vector in the vicinity of the substrate 10 is reversed. As a result, scattering of broken charged droplets occurs.

In order to investigate the change of the electric field distribution according to the amount of charge on the pattern, a simulation according to the change in charge amount is performed. As shown in Fig. 6, when the surface charge increases from 0.0003 to 0.0004 C / m < 2 >, the direction of the electric field in the vicinity of the substrate 10 changes inversely. In addition, as the amount of charge increases, the electric field intensity in the vicinity of the substrate 10 in the opposite direction increases, and the scattering phenomenon becomes stronger. 6, if the substrate 10 is a non-conductive substrate 10 and no pattern is formed on the substrate 10, if the electric field vector diverges in the opposite direction of the nozzle 20, It can be determined that the electric charge accumulated on the substrate 10 is smaller than 0.0004 C / m 2 . Further, in order to form a line-shaped ink pattern, the charge accumulated on the substrate 10 can be controlled to be less than 0.0004 C / m 2 .

Fig. 7 shows the result of ink patterning under the setting conditions of various parameters.

7A shows the distance between the nozzle 20 and the substrate 10 and the moving speed of the substrate 10 when the outer diameter of the nozzle 20 is 5 mu m and the voltage applied to the nozzle 20 is 1.6 kV. (Stage moving speed). 7B is a graph showing the relationship between the moving speed of the substrate 10 and the voltage applied to the nozzle 20 when the outer diameter of the nozzle 20 is 5 mu m and the distance between the nozzle 20 and the substrate 10 is 100 mu m. 7C shows the result of the ink patterning when the moving speed of the substrate 10 is 25 mm / s and the distance between the nozzle 20 and the substrate 10 is 300 mu m. (20). ≪ / RTI >

7 (a) and 7 (b), in order to print a fishbone ink pattern on the substrate 10, when the moving speed of the substrate 10 is a specific condition, It can be seen that the pattern is formed.

Referring to FIG. 7 (b), if the moving speed (stage speed) of the substrate 10 is larger than 50 mm / s, the ink pattern is formed into a line shape by a weak scattering effect according to the accumulated weakened charge pattern. However, if the stage speed is less than 50 mm / s, the scattered charged droplets are severely scattered because the scattering effect is strong, so that the pattern is formed in a concavo-convex shape as shown in FIG. 7 (b).

However, even if the moving speed of the substrate 10 is appropriately controlled, the outer diameter of the nozzle 20 is too small, the voltage applied to the nozzle 20 is too low, The ink pattern of the fish-bone pattern may not be displayed.

7A, when the substrate 10 is non-conductive, the outer diameter of the nozzle 20 is greater than 0 and 10 mu m or less, and the applied voltage applied to the nozzle 20 is 1.0 And when the ink 10 is printed with a fishbone pattern on the substrate 10 when the moving speed of the substrate 10 is more than 0 to 12.5 mm / s, the substrate 10 and the nozzle (not shown) 20 can be determined to be 50 to 200 占 퐉.

7A, when the substrate 10 is non-conductive, the outer diameter of the nozzle 20 is greater than 0 and 10 mu m or less, and the applied voltage applied to the nozzle 20 is 1.0 And the distance between the substrate 10 and the nozzle 20 is 100 to 200 mu m and the movement speed of the substrate is controlled to 100 mm / s or more when the fishbone pattern is formed, Can be formed.

7A and 7B, when the substrate 10 is non-conductive and the outer diameter of the nozzle 20 is greater than 0 and 10 mu m or less in outer diameter of the nozzle 20, If a fingerprint ink pattern is printed on the substrate 10 with a low applied voltage of 1.0 to 1.8 kV and a distance between the substrate 10 and the nozzle 20 of 50 to 100 占 퐉, According to the apparatus analysis method, it can be determined that the moving speed of the substrate 10 is more than 0 and less than 50 mm / s. In this case, when the ink pattern of the line pattern is to be formed in the fishbone ink pattern, the moving speed of the substrate 10 can be controlled to be 50 mm / s or more.

7 (c), the substrate 10 is non-conductive, the distance between the substrate 10 and the nozzle 20 is 50 to 300 占 퐉, the applied voltage applied to the nozzle 20 is 1.0? If the fishbone shape is patterned on the substrate 10 in the case of 2.2 kV, it can be determined that the outer diameter of the nozzle 20 is more than 0 to 10 mu m.

7 (c), the substrate 10 is non-conductive, the distance between the substrate 10 and the nozzle 20 is 50 to 300 占 퐉, the applied voltage applied to the nozzle 20 is 1.0 To 2.2 kV, if only the satellite / spray droplet dispersed in the substrate 10 is printed, it can be determined that the nozzle 20 has an outer diameter of 25 mu m or more.

8, according to another embodiment of the present invention, an ink jet apparatus using electrostatic force includes a ring shaped gate electrode (not shown) disposed between a nozzle 20 and a substrate 10, gate electrode (40).

During EHD ejection, some of the charged droplets or jets may be broken into minute satellites / fogs. The ring-shaped gate electrode 40 of the present invention can suppress such satellites / mist and form a line-shaped ink pattern.

Referring to FIG. 9, in another embodiment of the present invention, a voltage (hereinafter referred to as a gate voltage) V2 applied to the gate electrode 40 for triggering the EHD discharge is not a single pulse- And may be a series of negative and positive pulse voltages mixed with the voltage. Here, the gate bias voltage is a voltage applied to the gate electrode 40 under the condition that a stable meniscus is formed at a predetermined height, and the positive and negative pulse voltages are applied to a drop-on-demand -demand discharge.

For example, the gate voltage V2 shown in Fig. 9 is set such that a positive pulse voltage and a positive pulse for drop-on-demand discharge are applied under the condition that a gate bias voltage of 0.9 kV is applied And a voltage is applied. Here, the negative pulse voltage has a magnitude of 0.4 kV and is applied for 500 μs. After a period of 200 μs, a positive pulse voltage of 0.9 kV is applied for 300 μs.

The gate voltage V2 shown in Fig. 10 shows a case where only a positive pulse voltage having a magnitude of 0.7 kV is applied for 500 mu s without a negative negative pulse voltage under the condition that the gate bias voltage is 1.3 kV, 11 is an ink pattern printed from the ink jetting apparatus when the gate voltage V2 of FIG. 10 is applied. It can be seen that the ink pattern printed in Fig. 11 breaks the charged ink droplet into a satellite / spray shape. That is, the gate voltage V2 having a magnitude of 2.0 kV is a voltage high enough to trigger the droplet. However, if a separate negative pulse voltage is not applied, it can be seen that the ink droplet is scattered in irregular satellite / spray form.

12 and 14 show the gate voltage V2 applied to the gate electrode 40, respectively. The gate voltage V2 shown in FIGS. 12 and 14 is applied with a gate bias voltage of 0.9 kV. 12 is a voltage waveform showing a gate voltage (V2) when only a negative pulse voltage having a magnitude of 0.4 kV is applied for 500 mu s, and Fig. 14 is a voltage waveform showing only a negative pulse voltage having a magnitude of 0.4 kV applied for 500 mu s Thereafter, the waveform of the gate voltage (V2) is shown when only a positive pulse voltage having a magnitude of 0.6 kV is applied for 300 μs after the interval of 200 μs.

13 and 15 show images of droplets ejected from the nozzles 20 captured by a high-speed camera when the voltages shown in Figs. 12 and 14 are applied to the gate electrode 40, respectively. 13 and 15, when the diameter (ring diameter) of the ring-shaped gate electrode 40 is 5 mm, the effective suppression of satellite / spraying does not occur. However, when the diameter of the gate electrode 40 is 1 mm , It can be seen that effective suppression of satellite / spray occurs. 15, when the gate electrode 40 has a diameter of 1 mm and a negative pulse voltage is applied to the gate electrode 40 and a positive pulse voltage is applied after a predetermined interval, the most effective satellite / In the case of the present invention.

When a line-shaped ink pattern is formed in the ink ejection apparatus having the gate electrode 40 using the above-described phenomenon, the voltage applied to the gate electrode 40 is a pulse-shaped voltage. More specifically, It can be analyzed that a positive pulse voltage having a second time interval is applied after a predetermined interval after applying a negative pulse voltage having the first time interval.

According to an embodiment of the present invention, when a satellite / spray liquid droplet is formed on a substrate, a negative pulse voltage having a first time interval is applied to the gate voltage, And then a positive pulse voltage having a second time interval is applied after roughing, whereby a line-shaped ink pattern can be formed.

16 shows the distribution of the electric field Ex according to the radius R of the ring-shaped gate electrode 40 when the distance between the gate electrode 40 and the substrate 10 is set to 2 mm. The electric field (Ex) defined in quadrant 2 or quadrant 4 forces the charged satellites / dispersions to disperse. However, Ex defined in quadrant 1 or quadrant 3 forces the converged satellites / fogs to converge. Here, effective suppression of the satellite / spray occurs when the satellites / sprays are forced to converge.

16, when the radius R of the gate electrode 40 increases from 0.2 mm to 1.4 mm, the slope of Ex increases in the second and fourth quadrants. That is, as the radius R of the gate electrode 40 increases from 0.2 mm to 1.4 mm, the force forcing the satellite / spray to converge increases. However, when the radius R of the gate electrode 40 becomes larger than 1.4 mm, the slope of the electric field Ex abruptly shrinks to zero, and when the radius R of the gate electrode 40 is larger than 1.6 mm , And the electric field (Ex) begins to appear in the first and third quadrants representing forces that force the satellite / spray to diverge.

Thus, referring to Figures 12-16, it can be seen that the radius R of the most ideal gate electrode 40 for suppressing satellites / atomizations is 0.2 mm to 1.4 mm.

When the line-shaped ink pattern is formed in the ink ejection apparatus having the gate electrode 40 using the above phenomenon, the radius R of the gate electrode 40 is analyzed to be 0.2 mm to 1.4 mm .

In addition, according to one embodiment of the present invention, when the satellite / spray liquid droplet is formed on the substrate, the radius R of the gate electrode 40 is adjusted to be 0.2 mm to 1.4 mm , A line-shaped ink pattern can be formed.

Referring to FIG. 17, when the distance D between the gate electrodes of the nozzles is 0.1 mm or less, Ex is distributed in the first and third quadrants, whereby the distance D between the gate electrodes of the nozzles is 0.1 mm The force to force the satellite / spray to converge is not provided. However, when the distance D between the gate electrode 40 and the gate electrode 40 increases from 0.1 mm to 0.2 mm, Ex appears in the quadrant 2 and quadrant 4, It can be seen that when the distance D between the electrodes is 0.2 mm, a force is generated that forces the satellite / spray to converge. In addition, the slope of Ex increases when the distance D between the gate electrode of the gate electrode 40 and the gate electrode increases from 0.2 mm to 0.6 mm. According to this, it can be seen that the distance D between the gate electrode of the gate electrode 40 and the gate electrode increases from 0.2 mm to 0.6 mm, which increases the force to converge the satellites / sprays.

When the line-shaped ink pattern is formed in the ink ejecting apparatus having the gate electrode 40 using the above phenomenon, the distance D between the gate electrode and the gate electrode in the nozzle of the gate electrode 40 is larger than 0.1 mm .

Further, by using the above phenomenon, according to the embodiment of the present invention, when the satellite / spray liquid droplet is formed on the substrate, the distance D between the gate electrodes in the nozzle of the gate electrode 40 is set to 0.1 mm And more preferably 0.2 to 0.6 mm, so that a line-shaped ink pattern can be formed.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions as defined by the following claims It will be understood that various modifications and changes may be made thereto without departing from the spirit and scope of the invention.

Claims (11)

A voltage applied to the nozzle based on an ink pattern formed on the substrate through an ink ejecting apparatus including a substrate, a nozzle, and an electrode for applying a voltage to the nozzle using an electrostatic field, a voltage applied between the substrate and the nozzle A distance of the substrate, a moving speed of the substrate, an outer diameter of the nozzle, a physical property of the substrate, and a charge distribution accumulated on the substrate,
The ink jet apparatus further includes a gate electrode disposed under the nozzle, wherein a voltage applied to the gate electrode is controlled to a pulse-like voltage having a predetermined interval,
And an ink jetting device for further analyzing at least one of a geometrical structure of the gate electrode, a distance between the gate electrode and the nozzle, and a voltage applied to the gate electrode, based on the ink pattern formed on the substrate through the ink jetting device, Device analysis method. The method according to claim 1,
The method of analyzing an ink jetting apparatus according to the present invention is characterized in that a voltage applied to the nozzle, a distance between the substrate and the nozzle, a moving speed of the substrate, an outer diameter of the nozzle, And analyzing at least one of a charge distribution accumulated on the substrate. The method according to claim 1,
Wherein the method of analyzing an ink jetting apparatus analyzes at least one of a moving speed of the substrate and a physical property of the substrate based on a dot ink pattern or a line ink pattern formed on the substrate. delete The method according to claim 1,
Wherein the gate electrode is a ring-shaped gate electrode. 6. The method of claim 5,
Wherein the method of analyzing the ink jetting apparatus analyzes the radius of the ring-shaped gate electrode. A method of forming an ink pattern on a substrate by controlling an ink jetting apparatus including a substrate, a nozzle, and an electrode for applying a voltage to the nozzle,
Wherein at least one of a voltage applied to the nozzle, a distance between the substrate and the nozzle, a moving speed of the substrate, an outer diameter of the nozzle, a physical property of the substrate, and a charge distribution accumulated in the substrate is controlled, Forming a pattern,
The ink jet apparatus further includes a gate electrode disposed under the nozzle, wherein a voltage applied to the gate electrode is controlled to a pulse-like voltage having a predetermined interval,
Wherein at least one of a geometry of the gate electrode, a voltage applied to the gate electrode, and a distance between the nozzle and the gate electrode is controlled to form a line-shaped ink pattern. delete 8. The method of claim 7,
Wherein the gate electrode has a ring-shaped geometry. delete 8. The method of claim 7,
Wherein a negative pulse voltage having a first time interval is applied to a voltage applied to the gate electrode, and a positive pulse having a second time interval is applied after a predetermined interval.
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CN111347792A (en) * 2018-12-21 2020-06-30 细美事有限公司 Printing apparatus and printing method

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4672583B2 (en) * 2006-03-23 2011-04-20 デュプロ精工株式会社 Control method for paper transport device provided with transport paper displacement detection device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
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KR100948954B1 (en) 2008-01-25 2010-03-23 성균관대학교산학협력단 Droplet jetting apparatus using electrostatic force and manufacturing method and ink providing method thereof
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4672583B2 (en) * 2006-03-23 2011-04-20 デュプロ精工株式会社 Control method for paper transport device provided with transport paper displacement detection device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111347792A (en) * 2018-12-21 2020-06-30 细美事有限公司 Printing apparatus and printing method
CN111347792B (en) * 2018-12-21 2021-11-02 细美事有限公司 Printing apparatus and printing method

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