KR101676761B1 - Pressure sensor and manufacturing method of the same - Google Patents

Pressure sensor and manufacturing method of the same Download PDF

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Publication number
KR101676761B1
KR101676761B1 KR1020150067072A KR20150067072A KR101676761B1 KR 101676761 B1 KR101676761 B1 KR 101676761B1 KR 1020150067072 A KR1020150067072 A KR 1020150067072A KR 20150067072 A KR20150067072 A KR 20150067072A KR 101676761 B1 KR101676761 B1 KR 101676761B1
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South Korea
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substrate
elastic body
air layer
face
thickness
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KR1020150067072A
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Korean (ko)
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박장웅
신성호
안병완
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울산과학기술원
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
    • G01L9/0005—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using variations in capacitance

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

The present invention relates to a flexible substrate, a pair of substrates which are attached to each other on the upper surface of the flexible substrate so as to face each other when the flexible substrate is folded, a pair of substrates are arranged to face each other, An elastic body for changing the thickness of the air layer as the thickness varies according to an external pressure, and an elastic body formed on the substrate so as to change the thickness of the air layer And a capacitance sensing circuit for converting a capacitance change due to the change into an electrical signal.
Therefore, the pressure-sensitive elastic body can be directly used for the transistor without being used separately from the electronic device, thereby reducing the number of processes and simplifying the manufacturing process, thereby reducing the manufacturing cost and folding the flexible substrate without applying a separate dielectric. The resulting air layer is used as a dielectric layer, which is easy to manufacture and economical.

Description

Technical Field [0001] The present invention relates to a pressure sensor and a manufacturing method of a pressure sensor,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure sensor and a method of manufacturing the pressure sensor, and more particularly, to a pressure sensor and a method of manufacturing a pressure sensor capable of measuring pressure by a change in capacitance.

Generally, pressure sensor is an energy conversion device that converts mechanical energy into electrical energy. It is used to measure absolute pressure or gauge pressure. Depending on the principle of sensing pressure, strain gauge type metal type pressure sensor, pressure resistance type pressure sensor Piezoelectric pressure sensor, Piezoresistive pressure sensor, Piezoelectric pressure sensor, MOSFET type, Piezojunction, Optical fiber pressure sensor and Piezocapacitive pressure sensor have been proposed and used.

Among these capacitive pressure sensors, a flat plate capacitor is mainly formed between the diaphragm (membrane line) and the support, and the deflection of the diaphragm according to the pressure externally applied, that is, between the two electrodes The pressure can be recognized by a change in the capacitance caused by the change of the gap. In this case, a distance between the two electrodes, which is changed by the pressure, is secured between the two electrodes, A rubber is provided to provide restoring force for restoration to the original position.

However, the conventional pressure sensor uses a pressure-sensitive elastomer separately from an electronic device such as a transistor, so that the process is complicated and the production cost increases accordingly.

Korean Patent Publication No. 2001-0051288

An object of the present invention is to provide a pressure sensor and a method of manufacturing a pressure sensor that can simplify the process and reduce the manufacturing cost.

According to an aspect of the present invention, there is provided a flexible substrate comprising: a flexible substrate; A pair of substrates spaced apart from each other on the upper surface of the flexible substrate and positioned to face each other when the flexible substrate is folded; And a barrier rib disposed between the pair of substrates so as to form an air layer while keeping the pair of substrates spaced apart from each other in a state where the pair of substrates are opposed to each other, An elastic body which changes the thickness of the air layer as the thickness changes; And a capacitance sensing circuit formed on the substrate and converting a capacitance change according to a thickness change of the air layer into an electrical signal.

According to another aspect of the present invention, there is provided a plasma display panel comprising: a pair of substrates positioned to face each other; And a barrier rib disposed between the pair of substrates so as to form an air layer by keeping the pair of substrates separated from each other so that the thickness of the air layer changes as the thickness changes according to an external pressure Elastomer; And a capacitance sensing circuit for converting the capacitance change due to the thickness change of the air layer into an electrical signal.

According to another aspect of the present invention, there is provided a plasma display panel comprising: a pair of substrates positioned to face each other; An elastic body disposed between the pair of substrates and formed of a dielectric material whose thickness varies according to an external pressure; And a capacitance sensing circuit for converting a capacitance change due to a change in thickness of the elastic body into an electrical signal.

According to another aspect of the present invention, there is provided a method of manufacturing a flexible substrate, comprising: attaching a first substrate and a second substrate to each other on a top surface of a flexible substrate; Forming a capacitance sensing circuit in the first substrate and the second substrate to convert a capacitance change into an electrical signal; The first substrate and the second substrate are disposed so as to face each other so as to face each other so as to form an air layer and to form a partition for changing the thickness of the air layer according to a change in thickness according to an external pressure, Applying an elastic body onto the second substrate; And folding the flexible substrate such that the first substrate and the second substrate face each other.

According to another aspect of the present invention, there is provided a method of manufacturing a flexible substrate, comprising: attaching a first substrate and a second substrate to each other on a top surface of a flexible substrate; Forming a capacitance sensing circuit in the first substrate and the second substrate to convert a capacitance change into an electrical signal; Applying an elastic body formed of a dielectric material on the first substrate or the second substrate; And folding the flexible substrate such that the first substrate and the second substrate face each other.

The pressure sensor and the pressure sensor manufacturing method according to the present invention provide the following effects.

First, the pressure sensing elastomer can be directly used for a transistor without being used separately from an electronic device (for example, a transistor), thereby reducing the number of processes and simplifying the process, thereby reducing manufacturing costs.

Second, since the flexible substrate is folded without applying a separate dielectric material and an air layer formed through the flexible substrate is used as a dielectric layer, manufacturing is easy and economical.

Third, it is possible to simplify the process as compared with the step of sequentially stacking the electrodes by attaching the hard substrates to the flexible flexible substrate and simultaneously forming the source electrode, the drain electrode and the gate electrode on each hard substrate.

Fourth, the data of all transistors can be read at the same time, which saves measurement cost and time.

Fifth, it is possible to apply elastic bodies having various elastic moduli, and thus it is possible to manufacture a pressure sensor capable of detecting a desired pressure range, and its application range can be expanded.

Sixth, since the air layer is used as the dielectric layer, the number of trapped charges and the number of defective sites are reduced, which greatly increases the mobility of the charge.

1 is a cross-sectional view showing a pressure sensor according to an embodiment of the present invention.
2 is a cross-sectional view illustrating a change in thickness according to an external pressure and a change in capacitance of the air layer according to the pressure in the pressure sensor of FIG.
3 is a perspective view showing a state in which the flexible substrate shown in FIG. 1 is formed on a supporting member.
4 is a perspective view showing a state where a first substrate and a second substrate are attached to the flexible substrate of FIG.
5 is a perspective view illustrating a state where electrodes are formed on the first substrate and the second substrate of FIG.
6 is a perspective view showing a state where a channel is formed with the electrode of FIG.
7 is a perspective view showing a state in which an elastic body is applied to the upper surface of the electrode except for the channel of FIG.
8 is a perspective view showing a state in which the flexible substrate of FIG. 7 is folded to manufacture a pressure sensor.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1, a pressure sensor 600 according to an embodiment of the present invention includes a flexible substrate 100, a pair of substrates 210 and 220, an elastic body 300, a capacitance sensing circuit 400 ).

The soft substrate 100 is made of a flexible synthetic resin material so that it can be folded. In this case, various materials including PDMS (Polydimethylsiloxane) can be applied to the synthetic resin material.

The pair of substrates 210 and 220 are spaced apart from each other in a vertical direction. The pair of substrates 210 and 220 are spaced apart from each other in correspondence to a gap for folding on the upper surface of the flexible substrate 100, Lt; / RTI > The source and drain electrodes 411 and 412, the gate electrode 413, and the channel 414 are formed on the substrate 210 and 220, respectively.

The pair of substrates 210 and 220 may include a first substrate 210 and a second substrate 220 formed of a hard substrate and formed with an electrode and a channel to form the capacitance sensing circuit 400 do. In detail, the first substrate has a source electrode 411 and a drain electrode 412, and a channel 414 is formed between the source electrode 411 and the drain electrode 412.

The second substrate 220 is formed with the source electrode 411 and the drain electrode 412 and the gate electrode 413 at the portion facing the channel 414 when the flexible substrate 100 is folded . In this embodiment, the source electrode 411, the drain electrode 412, and the gate electrode 413 are formed on the substrate. However, the present invention is not limited thereto, and various circuit patterns necessary for an electronic device may be formed Of course.

The elastic body 300 is disposed between the pair of substrates 210 and 220 in a state where the pair of substrates 210 and 220 are opposed to each other so that the pair of substrates 210 and 220 are spaced apart from each other .

In addition, the elastic body 300 includes barrier ribs 310 disposed between the pair of substrates to form an air layer 320. Here, the thickness of the air layer 320 varies as the thickness of the barrier rib 310 changes according to external pressure.

The barrier rib 310 is formed such that the channel 414 is exposed to the air layer 320 and the source electrode 411 and the drain electrode 412 are buried in the barrier rib 310. When the flexible substrate is folded, And contacts the electrode 413.

The barrier rib 310 may be formed by patterning the elastic body 300 applied to the first substrate 210 to form a space corresponding to the channel 414 to fold the flexible substrate, When the second substrate 210 and the second substrate 220 face each other, the air layer 320 is formed through the air in the space. Meanwhile, although the method of patterning the elastic body 300 according to the method for forming the air layer 320 has been described as an embodiment, various processes may be applied to the air layer 320 if the method can form the air layer 320 Of course it is possible.

The air layer 320 is formed at a position corresponding to the channel 414 and serves as a dielectric. In detail, the air layer 320 is formed by filling air in a space formed by folding the flexible substrate 100 and positioning the first substrate 210 and the second substrate 220 so as to face each other, The channel 414 is exposed through the opening 320.

The elastic body 300 is preferably formed of a mixture of PDMS and benzophenone and xylene. However, the present invention is not limited thereto, and elastomers having various elastic moduli can be applied, and the range of application is wide.

Although the air layer 320 is used as a dielectric in the above description, it is possible to manufacture the pressure sensor 600 by using a dielectric material having a known dielectric constant instead of the air layer 320. In this case, the pressure sensor 600 is formed by forming the elastic body 300 as a dielectric, and the elastic body 300 is disposed between the first substrate 210 and the second substrate 220. Herein, the dielectric material may be a dielectric material such as PDMS (Sylgard 184; dielectric constant 3), polyimide (dielectric constant 3.4), anilox (EPM 2490; dielectric constant 3.4), acetic acid (dielectric constant 6.2), acetone (dielectric constant 20.7) (Dielectric constant: 24.3), methanol (dielectric constant: 33.1), pyridine (dielectric constant: 1.12), and water (dielectric constant: 80.4).

The capacitance sensing circuit 400 is formed on the substrates 210 and 220 and converts a capacitance change due to a change in the thickness of the air layer 320 into an electrical signal.

Meanwhile, the electrostatic capacitance sensing circuit 400 may be arranged in rows and columns spaced apart from each other on the substrates 210 and 220 with respect to the setting region, so that the capacitive sensing circuit 400 can sense pressure over a wide area. Accordingly, the pressure sensor 600 can be effectively applied to various devices such as a pressure sensor or a medical weight balance sensor installed at the arm end of the robot.

Referring to FIG. 2, the operation of the pressure sensor 600 will be described. Referring to the drawings, when pressure is applied to the pressure sensor 600, the thickness of the elastic body 300 is changed by the pressure, and the thickness of the air layer 320 is also changed. In this case, the pressure sensor 600 changes the electrostatic capacity of the air layer 320, thereby changing the electrical characteristics of the air layer 320, thereby sensing the pressure.

As described above, since the pressure sensor 600 does not use the elastic body 300 separately, it is possible to reduce the manufacturing cost by simplifying the process steps and the process steps, Since the flexible substrate 100 is folded and formed by simultaneously forming the source electrode 411, the gate electrode 413 and the drain electrode 412 after attaching the first substrate 210 and the second substrate 220, Can be simplified.

Hereinafter, a method of manufacturing the pressure sensor 600 will be described with reference to FIGS. 3 to 8. Since details of the configuration of the pressure sensor 600 have been described above, The manufacturing method will be focused on.

Referring to FIG. 3, the flexible substrate 100 is formed on the upper surface of the support 500. Here, the flexible substrate 100 is formed by coating a predetermined thickness of a synthetic resin material such as PDMS on the upper surface of a support material 500 such as a wafer or glass, and then heating and dewatering.

Then, as shown in FIG. 4, the first substrate 210 and the second substrate 220, which are made of a hard substrate such as SU8, are attached to the upper surface of the flexible substrate 100 with a gap therebetween.

5, a source electrode 411 and a drain electrode 412 are formed on the first substrate 210, a gate electrode 413 is formed on the second substrate 220, A semiconductor material is applied to the upper surfaces of the source electrode 411 and the drain electrode 412 and then etched to form a channel 414.

Here, the source electrode 411, the drain electrode 412, and the gate electrode 413 are formed through patterning after depositing a semiconductor material, wherein the semiconductor material includes at least one of Si, Ge , Sn, SiC, BN, BP , AlN, AlP, AlAs, GaN, GaAs, GaSe, TiO2, CuO, FeO, In 2 O 3, can be applied, such as IZO, IGZO, Al 2 O 3 , it is outside the Of course, other materials can be used as long as one goal can be achieved. In addition, the deposition process and the patterning process described above can use various processes that can achieve the above-mentioned object such as a photolithography process, and a detailed description thereof will be omitted. At this time, the source electrode 411, the drain electrode 412 and the gate electrode 413 are formed by folding the flexible substrate 100 so that the first substrate 210 and the second substrate 220 face each other As shown in FIG.

The source electrode 411, the drain electrode 412 and the gate electrode 413 may be formed on the first substrate 210 and the second substrate 220 at the same time, .

When the electrodes 211, 212, and 221 are formed, the channel 414 is formed by applying a semiconductor material for the channel 414 to the upper surface of the first substrate 210 (see FIG. 6). Here, the channel 414 may be formed by coating the semiconductor material on the upper surface of the first substrate 210, coating a positive photoresist liquid (positive PR) or a negative photoresist liquid, Etching the semiconductor material in the portion of the channel 414 pattern using a corrosive liquid and removing the positive photoresist liquid remaining on the channel 414 pattern, As shown in FIG. The channel 414 may be formed between the source electrode 411 and the drain electrode or may be formed on the upper surface of the first substrate 210 before the source electrode 411 and the drain electrode 412 are formed. Or may be formed on the source electrode 411 and the drain electrode 412. Various methods are possible as long as the source electrode 411 and the drain electrode can be electrically connected to each other.

Thereafter, a capacitance sensing circuit 400 for converting a capacitance change into an electrical signal is formed on the first substrate 210 and the second substrate 220. The capacitance sensing circuit 400 may be formed on the first substrate 210 and the second substrate 220. The source electrode 411, the gate electrode 413, the drain electrode 412, Can be formed.

Then, as shown in FIG. 7, the elastic body 300 is applied to the first substrate 210 and the second substrate 220 by a predetermined height to form the barrier ribs 310. More specifically, the barrier rib 310 supports the first substrate 210 and the second substrate 220 such that the first substrate 210 and the second substrate 220 are opposed to each other when the flexible substrate 100 is folded, The air layer 320 is formed together with the first substrate 210 and the second substrate 220. At this time, when the thickness of the barrier rib 310 is changed according to the external pressure, the thickness of the air layer 320 is changed according to the external pressure, and the air layer 320 is formed by patterning the applied elastic body 300 . Here, the air layer 320 is formed corresponding to the position of the capacitance sensing circuit 400.

The elastic body 300 may have various physical properties such as RTV, PDMS, Flaxane, Tecothane, Nitrile, Neoprene, EPDM, SBR, silicone, Fluorocarbon viton, polyurethane, polybutadiene, EcoFlex and products from NuSil A pressure sensor 600 capable of sensing a desired pressure range by mixing the photo-initiator material with the elastic body 300 and forming the air layer 320 through patterning may be used. Can be manufactured.

8, after the supporting member 500 is removed, the first substrate 210 and the second substrate 210 are removed from the first substrate 210 and the second substrate 210 after the elastic member 300 is coated and the air layer 320 is formed. The flexible substrate 100 is folded so that the substrate 220 is in contact with the gate electrode 413 to cover the air layer 320. The air layer 320 is formed in the patterned portion of the elastic body 300.

In the meantime, the method of manufacturing the pressure sensor 600 described above shows a case where the air layer 320 is applied as a dielectric. However, instead of the air layer 320, a dielectric material having a known dielectric constant can be used. In this case, in the above-described step, the elastic body 300 is applied as an elastic body 300 formed of a dielectric, and the elastic body 300 is applied on the first substrate 210 or the second substrate 220 The flexible substrate 100 is folded and formed. In this case, it is not necessary to perform the process of forming the barrier ribs 310 separately.

Here, the dielectric may be any material having a known dielectric constant, and may be any material selected from the group consisting of PDMS (Sylgard 184), polyimide, urethane (EPM 2490), acetic acid, acetone, ethanol, methanol, As shown in FIG.

When the pressure is applied to the pressure sensor 600, the thickness of the elastic body 300 is changed. This changes the capacitance of the air layer 320 to change the electrical characteristics, So that the sensing circuit 400 senses and senses the pressure.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

100 ... flexible substrate 210 ... first substrate
220 ... second substrate 300 ... elastic body
310 .... barrier rib 320 ... air layer, dielectric layer
400 ... Capacitive sensing circuit 411 ... Source electrode
412 ... drain electrode 413 ... gate electrode
414 ... channel 500 ... support member
600 ... Pressure sensor

Claims (18)

delete A flexible substrate;
A pair of substrates spaced apart from each other on the upper surface of the flexible substrate and positioned to face each other when the flexible substrate is folded;
And a barrier rib disposed between the pair of substrates so as to form an air layer while keeping the pair of substrates spaced apart from each other in a state where the pair of substrates are opposed to each other, An elastic body which changes the thickness of the air layer as the thickness changes; And
And a capacitance sensing circuit formed on the substrate and converting a capacitance change according to a thickness change of the air layer into an electrical signal,
Wherein:
A first substrate on which a source electrode and a drain electrode for forming the capacitance sensing circuit are formed, and on which a channel is formed between the source electrode and the drain electrode; and a source electrode and a drain electrode, And a second substrate on which a gate electrode is formed in a portion opposite to the channel. The method of claim 2,
Wherein,
At least a portion of the channel is exposed to the air layer, and the source electrode and the drain electrode are embedded. The method of claim 3,
Wherein,
And the upper surface contacts the gate electrode when the flexible substrate is folded. The method of claim 2,
Wherein the first substrate and the second substrate are each formed of a rigid substrate. The method of claim 2,
Wherein the capacitance sensing circuit comprises:
Wherein a plurality of pressure sensors are formed on the substrate so as to be spaced apart from each other. The method of claim 2,
Wherein the air layer is positioned between the channel and the gate electrode. delete delete A pair of substrates positioned to face each other;
An elastic body disposed between the pair of substrates and formed of a dielectric material whose thickness varies according to an external pressure; And
And a capacitance sensing circuit for converting a capacitance change due to a change in thickness of the elastic body into an electrical signal,
The dielectric material
Wherein the dielectric layer is formed of any one dielectric material selected from the group consisting of the elastomer, PDMS (Sylgard 184), polyimide, epilamus (EPM2490), acetic acid, acetone, ethanol, methanol, pyridine and water. A pair of substrates positioned to face each other;
An elastic body disposed between the pair of substrates and formed of a dielectric material whose thickness varies according to an external pressure;
A capacitance sensing circuit for converting a change in capacitance according to a thickness change of the elastic body into an electrical signal; And
And a flexible substrate to which the substrates are attached on an upper surface in a state of being spaced apart from each other,
And when the flexible substrate is folded, the substrates are positioned to face each other. delete Attaching the first substrate and the second substrate to each other on the upper surface of the flexible substrate;
Forming a capacitance sensing circuit in the first substrate and the second substrate to convert a capacitance change into an electrical signal;
The first substrate and the second substrate are disposed so as to face each other so as to face each other so as to form an air layer and to form a partition for changing the thickness of the air layer according to a change in thickness according to an external pressure, Applying an elastic body onto the second substrate; And
And folding the flexible substrate such that the first substrate and the second substrate face each other,
Wherein forming the capacitive sensing circuit comprises:
Forming a source electrode and a drain electrode on the first substrate, applying a semiconductor material to an upper surface of the source electrode and the drain electrode,
Further comprising forming a gate electrode on the second substrate,
Wherein the air layer is located between the channel and the gate electrode. Attaching the first substrate and the second substrate to each other on the upper surface of the flexible substrate;
Forming a capacitance sensing circuit in the first substrate and the second substrate to convert a capacitance change into an electrical signal;
The first substrate and the second substrate are disposed so as to face each other so as to face each other so as to form an air layer and to form a partition for changing the thickness of the air layer according to a change in thickness according to an external pressure, Applying an elastic body onto the second substrate; And
And folding the flexible substrate such that the first substrate and the second substrate face each other,
The air-
And forming the elastic body by patterning corresponding to the position of the electrostatic capacity sensing circuit on the applied elastic body. Attaching the first substrate and the second substrate to each other on the upper surface of the flexible substrate;
Forming a capacitance sensing circuit in the first substrate and the second substrate to convert a capacitance change into an electrical signal;
The first substrate and the second substrate are disposed so as to face each other so as to face each other so as to form an air layer and to form a partition for changing the thickness of the air layer according to a change in thickness according to an external pressure, Applying an elastic body onto the second substrate; And
And folding the flexible substrate such that the first substrate and the second substrate face each other,
The elastic body may be,
A method of manufacturing a pressure sensor that applies PDMS and the elastomer formed of a mixture of benzophenone and xylene. delete Attaching the first substrate and the second substrate to each other on the upper surface of the flexible substrate;
Forming a capacitance sensing circuit in the first substrate and the second substrate to convert a capacitance change into an electrical signal;
Applying an elastic body formed of a dielectric material on the first substrate or the second substrate; And
And folding the flexible substrate such that the first substrate and the second substrate face each other,
Wherein forming the capacitive sensing circuit comprises:
Forming a source electrode and a drain electrode on the first substrate, applying a semiconductor material to an upper surface of the source electrode and the drain electrode,
Further comprising forming a gate electrode on the second substrate,
A method of manufacturing a pressure sensor in which the elastic body is positioned between the channel and the gate electrode Attaching the first substrate and the second substrate to each other on the upper surface of the flexible substrate;
Forming a capacitance sensing circuit in the first substrate and the second substrate to convert a capacitance change into an electrical signal;
Applying an elastic body formed of a dielectric material on the first substrate or the second substrate; And
And folding the flexible substrate such that the first substrate and the second substrate face each other,
The elastic body may be,
A method of manufacturing a pressure sensor that applies PDMS and the elastomer formed of a mixture of benzophenone and xylene.
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KR101868704B1 (en) 2016-12-30 2018-06-20 한상열 Capacitive pressure sensor
CN108731850A (en) * 2018-07-25 2018-11-02 汉王科技股份有限公司 Capacitance pressure transducer, and electronic pen
KR20180129370A (en) * 2017-05-26 2018-12-05 주식회사 시노펙스 Thin film force sensor structure and manufacturing method thereof
KR20190037745A (en) * 2017-09-29 2019-04-08 주식회사 와이즈터치 Force sensor and method of manufacturing the same
KR20200066440A (en) * 2018-11-30 2020-06-10 한국생산기술연구원 High Sensitive Composite Sensor and Sensor Measurement System Using it
JPWO2020080322A1 (en) * 2018-10-16 2021-02-15 株式会社村田製作所 Displacement detection sensor and flexible device

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KR101868704B1 (en) 2016-12-30 2018-06-20 한상열 Capacitive pressure sensor
KR20180129370A (en) * 2017-05-26 2018-12-05 주식회사 시노펙스 Thin film force sensor structure and manufacturing method thereof
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