KR101622084B1 - Singulation apparatus of a manufacturing parts - Google Patents

Singulation apparatus of a manufacturing parts Download PDF

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Publication number
KR101622084B1
KR101622084B1 KR1020160013119A KR20160013119A KR101622084B1 KR 101622084 B1 KR101622084 B1 KR 101622084B1 KR 1020160013119 A KR1020160013119 A KR 1020160013119A KR 20160013119 A KR20160013119 A KR 20160013119A KR 101622084 B1 KR101622084 B1 KR 101622084B1
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KR
South Korea
Prior art keywords
punch
rail
block
strip
die
Prior art date
Application number
KR1020160013119A
Other languages
Korean (ko)
Inventor
김재인
전진표
Original Assignee
(주)유한엔씨아이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to KR1020160013119A priority Critical patent/KR101622084B1/en
Application granted granted Critical
Publication of KR101622084B1 publication Critical patent/KR101622084B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B26D7/1845—Means for removing cut-out material or waste by non mechanical means
    • B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The present invention relates to a new structure of a manufacturing part singulation apparatus capable of punching and transferring a part by a compact structure and capable of increasing efficiency in a manufacturing process.
According to the present invention, there is provided a singulation apparatus in which a plurality of parts P fed on a strip S are individually fed by punching; (20) including a rail (22) provided to allow the strip (S) to proceed continuously; A punch 30 including a punch block 31 mounted on a lower side of the rail 22 and mounted with a punch 32 which is upwardly operated to punch the component P; A die block (not shown) formed on the upper side of the rail 22 and having an insertion hole 42 vertically penetrated to receive the component P punched by the punch 32 is disposed so as to face the punch 30 41; < / RTI > An adsorption head 52 positioned above the die 40 and waiting for insertion in the insertion hole 42 at the time of punching operation by the punch 32 to adsorb the component P And a transferring unit (50) including the transferring unit (50).

Description

[0001] The present invention relates to a singulation apparatus of a manufacturing part,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing part singulation apparatus, and more particularly, to a manufacturing part singulation apparatus having a new structure capable of punching and transferring a component by a compact structure, .

Generally, in a manufacturing process of a semiconductor, a camera module, an LED, or the like, when a plurality of components are supplied in a strip form integrally joined together in a previous stage, they are separately punched and subjected to a singulation process of supplying the individual components to a post-process.

A conventional singulation apparatus for this purpose generally comprises a die for mounting a strip continuously connected with parts and a punch for punching the parts so as to face the die. Individual parts are conveyed to one side of the die and the punch by vacuum suction The suction means is provided.

An example of such a singulation apparatus is that punching is performed by an upper punch in a state that a die is positioned at a lower portion thereof. This is because the punching apparatus is provided with an adsorption means for transferring a punched component as punching is performed with the punch being located at the upper portion It is troublesome to manufacture the punch in consideration of the position and operating state of each structure so that the punch operating positions do not overlap with each other.

In other singulation apparatus, the punch is positioned at the bottom so that the die is positioned at the upper side and the punching operation is performed at the lower side from the upper side, as opposed to the above-mentioned example. In this case, In this case, even when the component is clamped to the correct position during the punching operation or when the component after punching is stably exposed to the upper portion of the die There is a limitation in forming a compact structure and operation of the apparatus.

Korean Unexamined Patent Application Publication No. 2002-0074277 (2002. 09. 30) Korean Patent Registration No. 10-0450583 (September 17, 2004)

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a punching method and a punching method, And to provide a new structure manufacturing part singulation apparatus capable of increasing process efficiency while increasing productivity.

According to a feature of the present invention, there is provided a singulation apparatus in which a plurality of parts P fed on a strip S are individually fed by punching;

(20) including a rail (22) provided to allow the strip (S) to proceed continuously;

A punch 30 including a punch block 31 mounted on a lower side of the rail 22 and mounted with a punch 32 which is upwardly operated to punch the component P;

A die block (not shown) formed on the upper side of the rail 22 and having an insertion hole 42 vertically penetrated to receive the part P punched by the punch 32 is disposed so as to face the punch 30 41; < / RTI >

An adsorption head 52 positioned above the die 40 and waiting for insertion in the insertion hole 42 at the time of punching operation by the punch 32 to adsorb the component P And a transferring section (50) including the transferring section (50).

According to another aspect of the present invention, the supply unit 20 includes a rail block 21 on which the rail 22 is formed, and a rail block 21 on which the rail block 21 is brought into close contact with or spaced from the bottom surface of the die block 41. [ And a lifting means (24) is provided.

According to another aspect of the present invention, the supply unit 20 is provided with an ion generator 26 positioned at the front end of the rail 22 to prevent ions from being generated on the strip S to prevent the generation of static electricity ≪ / RTI >

According to a further feature of the present invention, the die part (40) is provided with a guide pin (43) for supporting one side of the strip (S) so that the part (P) Quot;

As described above, according to the present invention, the strip S in a state in which a plurality of parts P are engaged is continuously provided along the rail 22, and the punch The part P punched by the suction head 32 is received in the insertion hole 42 of the die block 41 positioned at the upper part and the suction head 52 So that the punching operation of the punch 32 and the suction operation of the suction head 52 are simultaneously performed on the insertion hole 42 and the separate avoiding operation between the components or the forward and backward movement It is possible to minimize the work or waiting time required for punching and conveying the part P, thereby greatly increasing the productivity.

The rail block 21 having the rail 22 is moved up and down by the elevating means 24 so that the rail block 21 is brought into close contact with the bottom surface of the die block 41 The rail block 21 can be transferred in a state of being separated from the bottom surface of the die block 41 so that the rail block 21 can be transferred to the apparatus during the transportation operation So that interference can be prevented and smooth progress can be achieved.

The present invention is characterized in that the guide pin 43 is provided at the lower portion of the die block 41 to support the strip S by the guide pin 43 to punch the component P in a fixed position There is an advantage that not only the work can be performed but also it is possible to support or release the strip S in accordance with the lifting operation of the rail block 21 as described above by the simple pin structure.

1 is a perspective view illustrating an embodiment of the present invention.
2 is a perspective view showing a part of the configuration according to an embodiment of the present invention.
3 is a cross-sectional view showing a configuration according to an embodiment of the present invention.
4 is a side sectional view showing an operating state according to an embodiment of the present invention;
5 is a front section view showing an operating state according to an embodiment of the present invention;
6 is a front section view showing another operating state according to an embodiment of the present invention;
7 is a front section view showing another operating state according to an embodiment of the present invention;
8 is a front cross-sectional view showing another operating state according to an embodiment of the present invention;

The objects, features and advantages of the present invention will become more apparent from the following detailed description. Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

1 to 8 show a preferred embodiment of the present invention. 1, the singulation apparatus 10 of the present invention is provided with a supply unit 20 for continuously feeding a strip S in a horizontal direction at a predetermined height on a main body 11, The punching portion 30 and the die portion 40 for punching the strip S are positioned at the upper and lower portions of the supply portion 20.

In this configuration, a punch portion 30 including a punch 32 to be actuated upward is positioned on the lower side of the supply portion 20, and a punch portion 30 is provided on the upper side of the supply portion 20, And the transfer unit 50 is vertically and horizontally movable on the die unit 40. The transfer unit 50 is mounted on the upper side of the die unit 40, (51) capable of moving back and forth or right and left on the main body (53).

The detailed configuration and operation state of the present invention will be described with reference to FIGS. 2 to 8. FIG.

As shown in FIG. 2, the strip S punched by the present invention is provided in the shape of a band having a constant width, and a plurality of guide holes 1 are formed on both sides in the longitudinal direction, And the parts P coupled by the plurality of bridges 3 on the incision 2 are arranged in a line.

Meanwhile, the supply unit 20 includes a rail block 21 for horizontally transporting the strip S on a support bar 23 having a predetermined height, and the strip S is moved on the rail block 21 The rail 22 is formed in a substantially T-shaped groove so that the component P passes through the rail 22 while guiding both sides of the strip S.

3, the supply unit 20 may be provided with an anion or positive ions on the strip S positioned on the front side of the rail block 21 and supplied on the rail 22 to prevent static electricity The ion generator 26 may be provided.

The punch block 30 is positioned below the rail block 21. The punch block 30 includes a punch block 31 mounted with the plurality of punches 32 upward, The punch block 31 is coupled to a guide rod 34 for guiding the elevating operation when the elevating means 33 is moved up and down, The guide block 35 can be engaged by the spring 36 so that the guide block 35 can be actuated elastically.

One end of the die 40 is coupled to the upper end of the guide rod 34 and the other end of the die 40 is fixedly coupled to another support 12 of the main body 11, And a die block 41 having an insertion hole 42 penetrating upward and downward to correspond to the punch 32.

The punch 32 is inserted into the die block 41 through the lower portion of the insertion hole 42 and the suction head 52 of the suction means 51 is inserted through the upper portion of the insertion hole 42 So that punching and adsorption operation of the component P on the strip S are performed.

The rail block 21 and the die block 41 can be transported in a state of being spaced apart from each other and the punching operation of the component P is performed in a state in which the strip S is in close contact with each other. This will be described with reference to FIG.

4, a support rod 23 is connected to the lower end of the rail block 21 and an elevating means 24 is coupled to the lower portion of the support rod 23, And is brought into close contact with the bottom surface of the die block 41 or away from the die block 41 while being moved up and down in the lifting operation.

As the rail block 21 is brought into close contact with the die block 41 during the punching operation, the strip S is fixed at a predetermined position and a stable punching operation can be performed. When the rail block 21 is moved to the rail block 21, So that the strip S can be moved smoothly as it is spaced from the die block 41.

A guide pin 43 is downwardly protruded from the bottom surface of the die block 41 so as to correspond to the guide hole 1 of the strip S. The rail block 21 is lifted up to the die block 41, The guide hole 1 of the strip S is fitted on the guide pin 43 and stopped at a predetermined position on the guide pin 43. When the rail block 21 descends and is separated from the die block 41 Since the strip S is separated from the guide pin 43 and the step surfaces 25 and 44 are formed on the corresponding surfaces of the rail block 21 and the die block 41, .

The specific operation state of the present invention will now be described with reference to FIGS. 5 to 8. FIG. 5, when the strip S is fed from the previous stage and is conveyed on the rail block 21 to reach a predetermined position, the rail block 21 is temporarily stopped by the elevating means 24 And is brought into close contact with the bottom surface of the die block 41.

6, the punch block 31 is moved upward to punch the component P by the punch 32. At this time, the punch block 30 is provided with the punch block 31 The tip end of the punch 32 is inserted through the lower portion of the insertion hole 42 of the die block 41. In this punching operation, And the component P is received in the insertion hole 42. At this time, the upper part of the insertion hole 42 is positioned such that the suction head 52 of the suction unit 51 is inserted .

7, the part P held in the insertion hole 42 is pushed by the suction head 52 waiting on the insertion hole 42 at the time of punching operation by the punch 32, Vacuum suction is carried out to the upper portion of the insertion hole 42 and is then transferred to the subsequent process along the guide rail 53 described above.

8, when the component P is sucked and conveyed by the suction unit 51, the strip S advances as the punch unit 30 and the rail block 21 descend, The punching and suction transporting operations as described above are repeatedly performed.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. It will be apparent to those of ordinary skill in the art.

10: Singulation apparatus 20: Supply unit
21: rail block 22: rail
24: lifting means 25:
26: ion generator 30: punch part
31: Punch block 32: Punch
33: elevating means 35: guide block
40: die part 41: die block
42: insertion hole 43: guide pin
44: step surface 50:
51: suction means 52: suction head
53: guide rail

Claims (4)

1. A singulation apparatus adapted to individualize parts (P) to be fed in a state in which a plurality of them are combined on a strip (S) by punching;
(20) including a rail (22) provided to allow the strip (S) to proceed continuously;
A punch 30 including a punch block 31 mounted on a lower side of the rail 22 and mounted with a punch 32 which is upwardly operated to punch the component P;
A die block (not shown) formed on the upper side of the rail 22 and having an insertion hole 42 vertically penetrated to receive the part P punched by the punch 32 is disposed so as to face the punch 30 41; < / RTI >
An adsorption head 52 positioned above the die 40 and waiting for insertion in the insertion hole 42 at the time of punching operation by the punch 32 to adsorb the component P And a transfer unit 50 including the transfer unit 50;
Wherein the die part (40) is provided with a guide pin (43) for supporting one side of the strip (S) so that the part (P) is positively positioned.
2. The apparatus as claimed in claim 1, wherein the supply unit (20) comprises a rail block (21) with the rail (22) formed thereon, a lifting and lowering means (24). ≪ / RTI > 3. The apparatus according to claim 1 or 2, wherein the supply unit (20) is provided with an ion generator (26) positioned at the front end of the rail (22) and blowing ions onto the strip (S) Wherein said at least one of said at least two of said at least two of said at least two of said at least one of said plurality
delete
KR1020160013119A 2016-02-02 2016-02-02 Singulation apparatus of a manufacturing parts KR101622084B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160013119A KR101622084B1 (en) 2016-02-02 2016-02-02 Singulation apparatus of a manufacturing parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160013119A KR101622084B1 (en) 2016-02-02 2016-02-02 Singulation apparatus of a manufacturing parts

Publications (1)

Publication Number Publication Date
KR101622084B1 true KR101622084B1 (en) 2016-05-17

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107244548A (en) * 2017-07-20 2017-10-13 深圳格兰达智能装备股份有限公司 Material pick-and-place equipment and feeder
CN108257902A (en) * 2018-03-19 2018-07-06 东莞市中之电子科技有限公司 A kind of diode arrangement enters to set up standby

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107244548A (en) * 2017-07-20 2017-10-13 深圳格兰达智能装备股份有限公司 Material pick-and-place equipment and feeder
CN107244548B (en) * 2017-07-20 2023-08-15 江门格兰达物联装备有限公司 Material grabbing and placing equipment and feeding machine
CN108257902A (en) * 2018-03-19 2018-07-06 东莞市中之电子科技有限公司 A kind of diode arrangement enters to set up standby

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