KR101599304B1 - Epoxy resin compositions based on bisphenol a typed epoxy resin for high pressure resin transfer molding - Google Patents

Epoxy resin compositions based on bisphenol a typed epoxy resin for high pressure resin transfer molding Download PDF

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KR101599304B1
KR101599304B1 KR1020150121155A KR20150121155A KR101599304B1 KR 101599304 B1 KR101599304 B1 KR 101599304B1 KR 1020150121155 A KR1020150121155 A KR 1020150121155A KR 20150121155 A KR20150121155 A KR 20150121155A KR 101599304 B1 KR101599304 B1 KR 101599304B1
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epoxy resin
rtm
resin composition
bisphenol
weight
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Korean (ko)
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최호경
최종하
임성식
박준성
박경준
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주식회사 신아티앤씨
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/12—Polymers characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity

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  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
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  • Epoxy Resins (AREA)

Abstract

Bisphenol A type epoxy resin; Reactive diluent; And an epoxy resin composition for a high-pressure resin transfer molding (HP-RTM) based on bisphenol A type epoxy resin containing a curing agent. The epoxy resin composition for the HP-RTM may exhibit a viscosity of 100 to 900 cps at 25 占 폚, a gel time of 10 seconds to 180 seconds, and a glass transition temperature of 60 占 폚 to 180 占 폚.

Description

TECHNICAL FIELD [0001] The present invention relates to an epoxy resin composition for high-pressure resin transfer molding based on bisphenol A type epoxy resin. BACKGROUND OF THE INVENTION [0002]

The present invention relates to an epoxy resin composition for high-pressure resin transfer molding (HP-RTM) based on bisphenol A type epoxy resin. More particularly, the present invention relates to an epoxy resin composition for HP-RTM based on bisphenol A type epoxy resin having excellent viscosity, gel time and the like.

As the reinforcing fiber, glass fiber, carbon fiber, boron fiber and the like are used. As the matrix resin, both a thermosetting resin and a thermoplastic resin are used, but a thermosetting resin that is easily impregnated into the reinforcing fiber is often used. As the double thermosetting resin, an epoxy resin, an unsaturated polyester resin, a vinyl ester resin, a phenol resin, a bismaleimide resin, a cyanate resin and the like are used.

Meanwhile, the fiber reinforced composite material is produced by a prepreg method, a hand lay-up method, a filament winding method, a pultrusion method, and a resin transfer molding (RTM) method.

Among them, the RTM process capable of forming a complicated shape by using carbon fiber of high rigidity and high strength as a continuous fiber is emerging as a powerful molding process. The RTM process is a process in which a reinforcing fiber base material is placed in a mold, the mold is closed, a resin is injected from a resin injection port to impregnate the reinforcing fiber, and then the resin is cured. it means.

The RTM process requires a high level of productivity and heat resistance, as well as shortening of the curing time and reaction time of the resin raw material and its mixture used, and the low viscosity of the resin raw material and its mixture is also an important factor Is required. However, when the viscosity, the reaction time, and the like are excessively shortened, other physical properties of the final product may not exhibit an excellent value. Accordingly, it has been studied as an important factor that the resin material and the mixture thereof show a certain level of mixed viscosity, reaction time, and the like.

KR 2001-0042681 A KR 2013-0131391 A

Embodiments of the present invention provide an epoxy resin composition for HP-RTM which can be used in a HP-RTM process with a certain range of mixed viscosity, gel time, glass transition temperature and the like.

According to one embodiment of the present invention, bisphenol A type epoxy resin; Reactive diluent; And curing agents; A high-pressure resin transfer molding (HP-RTM) epoxy resin composition is provided.

In an exemplary embodiment, the reactive diluent is selected from the group consisting of 1,4-butanediol glycidyl ether, ethyleneglycol diglycidyl ether, 1,6-hexanediol glycidyl But are not limited to, 1,6-hexanediol glycidyl ether, neopentyl glycol diglycidyl ether, 1,4-cyclohexane dimethanol diglycidyl ether ), Polypropylene glycol diglycidyl ether (200), polypropylene glycol diglycidyl ether (400), diethylene glycol (400), polypropylene glycol diglycidyl ether Polyethylene glycidyl ether (200), polyethylene glycol diglycidyl ether (200), polyethylene glycol diglycidyl ether (400), and polyethylene glycol diglycidyl ether polyethylene glycol diglycidyl ether (400) , Polyethylene glycol diglycidyl ether (600), resorcinol diglycidyl ether, thio-diphenyl diglycidyl ether (600) Diphenyl diglycidyl ether, trimethylolpropane triglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, castor oil polyglycidyl ether Sorbitol polyglycidyl ether, n-butyl glycidyl ether, aliphatic glycidyl ether having 8 to 15 carbon atoms, aliphatic diglycidyl ether having 12 to 14 carbon atoms , 2-ethylhexyl elycidyl ether, phenyl glycidyl ether, o-cresyl glycidyl ether, m, p-cresylP-cresyl glycidyl ether, p-tertiary butyl phenyl glycidyl ether, 3-alkyl phenol glycidyl ether, Octafluoropentyl glycidyl ether, o-phenyl phenol glycidyl ether, benzyl glycidyl ether and o-sec-butylphenyl glycidyl ether. And o-sec-butyl phenyl glycidyl ether.

In an exemplary embodiment, the curing agent may be an ethylene amine-based curing agent.

In an exemplary embodiment, the curing agent is selected from the group consisting of ethylene diamine, diethylene triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, Aminoethylene piperazine, and aminoethylethanolamine. The term " anionic surfactant "

In an exemplary embodiment, 5 to 100 parts by weight of the reactive diluent is added to 100 parts by weight of the bisphenol A type epoxy resin; And 10 to 50 parts by weight of the curing agent.

In an exemplary embodiment, the epoxy resin composition for HP-RTM further comprises a cure accelerator, wherein the cure accelerator is selected from the group consisting of a urea cure accelerator, an imidazole cure accelerator, and a tertiary amine cure accelerator, And 10 to 50 parts by weight of the curing accelerator based on 100 parts by weight of the bisphenol A type epoxy resin.

In an exemplary embodiment, the epoxy resin composition for HP-RTM may have a viscosity of from 100 cps to 900 cps at 25 占 폚.

In an exemplary embodiment, the epoxy resin composition for HP-RTM may have a gel time of 10 seconds to 180 seconds.

In an exemplary embodiment, the epoxy resin composition for HP-RTM may have a glass transition temperature of 60 < 0 > C to 130 < 0 > C.

In an exemplary embodiment, the epoxy resin composition for HP-RTM may exhibit a viscosity of from 100 cps to 900 cps at < RTI ID = 0.0 > 0 C, < / RTI > a gel time of from 10 seconds to 180 seconds and a glass transition temperature of from 60 占 폚 to 180 占 폚.

The epoxy resin composition for HP-RTM according to one embodiment of the present invention may have a viscosity, a gel time, and a glass transition temperature value within a certain range. Therefore, it can be usefully used in the HP-RTM process, thereby reducing the reaction time of the process and lowering the production cost of the final product.

Hereinafter, embodiments of the present invention will be described in detail. Although embodiments of the present invention have been described with reference to the accompanying drawings, it is to be understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention.

As used herein, the term " reactive diluent " refers generally to materials that lower the viscosity of an epoxy resin composition, and specifically includes 1,4-butanediol diglycidyl ether, 1,6- 1,6-hexanediol diglycidyl ether, an aliphatic glycidyl ether having 12 to 14 carbon atoms, and the like.

Epoxy resin composition for high pressure resin transfer molding

The present invention relates to a bisphenol A type epoxy resin; Reactive diluent; And an epoxy resin composition for high pressure resin transfer molding (HP-RTM) including a curing agent.

In an exemplary embodiment, the bisphenol A type epoxy resin may have a structure represented by the following formula (1), wherein n may be an integer of 0 to 5 inclusive.

 [Chemical Formula 1]

Figure 112015083426621-pat00001

In an exemplary embodiment, the bisphenol A type epoxy resin may have a molecular weight (Mw) of 300 to 2,000 and a viscosity of 3,000 to 30,000.

The reactive diluent may be selected from the group consisting of 1,4-butanediol glycidyl ether, ethyleneglycol diglycidyl ether, 1,6-hexanediol glycidyl ether, hexanediol glycidyl ether, neopentyl glycol diglycidyl ether, 1,4-cyclohexane dimethanol diglycidyl ether, polypropylene glycol Polypropylene glycol diglycidyl ether (200)], polypropylene glycol diglycidyl ether (400), diethylene glycol diglycidyl ether (400) Polyethylene glycol diglycidyl ether (200), polyethylene glycol diglycidyl ether (400) [polyethylene glycol diglycidyl ether (400)], polyethylene glycol diglycidyl ether )], Polyethylene glycol (600) [polyethylene glycol diglycidyl ether (600)], resorcinol diglycidyl ether, thio-diphenyl diglycidyl ether, trimethylol Trimethylolpropane triglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, castor oil polyglycidyl ether, sorbitol polyglycidyl ether, sorbitol polyglycidyl ether, n-butyl glycidyl ether, aliphatic glycidyl ether having 8 to 15 carbon atoms, aliphatic diglycidyl ether having 12 to 14 carbon atoms, 2-ethylhexyl glycidyl ether 2-ethylhexyl elycidyl ether, phenyl glycidyl ether, o-cresyl glycidyl ether, m, p-cresyl glycidyl ether (m, p-cresy glycidyl ether, p-tertiary butyl phenyl glycidyl ether, 3-alkyl phenol glycidyl ether, octafluoropentyl glycidyl ether, Octylpentyl glycidyl ether, o-phenyl phenol glycidyl ether, benzyl glycidyl ether, o-sec-butylphenyl glycidyl ether, phenyl glycidyl ether), and the like.

In an exemplary embodiment, the curing agent may be an ethyleneamine based curing agent, and specifically includes ethylene diamine, diethylene triamine, triethylenetetramine, tetraethylenepentamine, , Pentaethylenehexamine, aminoethylene piperazine, aminoethylethanolamine, and the like. [0033] The term " anionic surfactant "

In an exemplary embodiment, the epoxy resin composition for HP-RTM comprises 5 to 100 parts by weight of the reactive diluent with respect to 100 parts by weight of the bisphenol A type epoxy resin; And 10 to 50 parts by weight of the curing agent.

When the reactive diluent is less than 5 parts by weight, the mixed viscosity and the glass transition temperature of the epoxy resin composition for HP-RTM may be increased. When the reactive diluent is more than 100 parts by weight, the mixed viscosity and the glass transition temperature may decrease.

On the other hand, if the curing agent is less than 10 parts by weight or more than 50 parts by weight, the epoxy resin composition for HP-RTM may not be easily cured and the curing density of the epoxy resin composition for HP-RTM may be low have. Also, the glass transition temperature of the epoxy resin composition for HP-RTM may be low and the physical properties of the epoxy resin composition for HP-RTM may not be excellent.

In an exemplary embodiment, the epoxy resin composition for HP-RTM may further comprise a curing accelerator.

When the epoxy resin composition for HP-RTM further comprises a curing accelerator, the curing accelerator may include at least one member selected from the group consisting of a urea-based curing accelerator, an imidazole-based curing accelerator, and a tertiary amine-based curing accelerator , And 3 to 20 parts by weight of the curing accelerator based on 100 parts by weight of the bisphenol A type epoxy resin.

In an exemplary embodiment, if the curing accelerator is less than 3 parts by weight, the gel time of the epoxy resin composition for HP-RTM may be reduced, and if it exceeds 20 parts by weight, the glass transition temperature may decrease.

The epoxy resin composition for HP-RTM according to an embodiment of the present invention may have a low viscosity of 100 to 900 cps at 25 ° C, and preferably a viscosity of 150 cps to 750 cps.

In addition, the epoxy resin composition for HP-RTM may have a gel time of 10 seconds to 180 seconds, preferably 20 seconds to 120 seconds.

In addition, the epoxy resin composition for HP-RTM may exhibit a glass transition temperature of 60 ° C to 130 ° C, and preferably a glass transition temperature of 70 ° C to 120 ° C.

The epoxy resin composition for HP-RTM according to an embodiment of the present invention can have a low viscosity of 100 to 900 cps at 25 DEG C, exhibits a gel time of 10 to 180 seconds, and has a glass transition temperature of 60 to 130 DEG C . The above conditions will have optimum conditions in the HP-RTM process, which can shorten the HP-RTM process time without deteriorating the physical properties of the epoxy resin composition, so that the production of the final product produced by the HP-RTM process It is possible to show an excellent effect such as lowering the unit price.

The embodiments of the present invention described above should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of protection of the present invention as long as it is obvious to those skilled in the art.

Example

As the bisphenol A type epoxy resin, SE-187 epoxy resin of Shin-A & T Co., Ltd. was used. As the reactive diluent, 1,4-butanediol diglycidyl ether (BDGE) -Hexanediol diglycidyl ether (HDGE) and an aliphatic glycidyl ether (LGE) having 12 to 14 carbon atoms were used. Diethylene triamine (DETA) was used as a curing agent. 2,4,6-Tris (dimethylaminomethyl) phenol as a curing accelerator and DMP-30 ] Were used.

Example  Preparation of 1 to 11

The above materials were mixed together as shown in Table 1 below to prepare epoxy resin compositions for HP-RTM according to Examples 1 to 11.

division Bisphenol A epoxy resin Reactive diluent Hardener Hardening accelerator SE-187 BDGE HDGE LGE DETA DMP-30 Weight portion 100 5-100 5-100 5-100 10-50 3-20 Example 1 100 5 - - 11.8 - Example 2 100 20 - - 14.2 - Example 3 100 50 - - 18.9 - Example 4 100 70 - - 22.1 - Example 5 100 100 - - 26.9 - Example 6 100 20 - 13.8 - Example 7 100 - 20 13.9 - Example 8 100 20 - - 15.6 - Example 9 100 20 - - 12.8 - Example 10 100 20 - - 14.2 3.6 Example 11 100 20 - - 14.2 7.1

Example  Preparation of 12-15

The above materials were mixed together as shown in Table 2 below to prepare epoxy resin compositions for HP-RTM according to Examples 12 to 15. At this time, no curing accelerator was used.

division Bisphenol A epoxy resin Reactive diluent Hardener Hardening accelerator SE-187 BDGE DETA DMP-30 Example 12 100 0 11 - Example 13 100 150 34.8 - Example 14 100 200 42.7 - Example 15 100 300 58.6 -

Comparative Example  Preparation of 1 to 3

Using the same materials as in Examples 1 to 11 but using isophronediamine (IPDA), Jeffamine (R) D-230 of Huntsman or polyamide, which is not ethyleneamine as a hardener, Were mixed to prepare epoxy resin compositions according to Comparative Examples 1 to 3. At this time, no curing accelerator was used.

division Bisphenol A epoxy resin Reactive diluent Hardener Hardener Hardener Hardening accelerator SE-187 BDGE IPDA D-230 Polyamide DMP-30 Comparative Example 1 100 20 29.3 - - - Comparative Example 2 100 20 - 41.3 - - Comparative Example 3 100 20 - - 75.7 -

Experimental Example : Mixed viscosity of epoxy resin composition, Gel time  And glass transition temperature experiment

The mixed viscosity, gel time and glass transition temperature of the epoxy resin composition for HP-RTM according to Examples 1 to 15 and the epoxy resin composition according to Comparative Examples 1 to 3 were measured and are shown in Table 4.

At this time, the mixed viscosity was measured with a brookfield viscometer, the gel time was measured under a hot plate condition at a surface temperature of 120 ° C, and the glass transition temperature was measured using a DSC under a temperature increasing rate of 20 ° C / min.

division Viscosity at 25 캜 (cps) Gel time (sec) at 120 ° C T g (° C) Example 1 722 74 118.4 Example 2 316 76 101.3 Example 3 291 82 90.2 Example 4 264 85 78.2 Example 5 168 93 76.3 Example 6 483 80 98.1 Example 7 360 111 79.1 Example 8 289 74 98.2 Example 9 331 78 99.3 Example 10 480 30 99.8 Example 11 505 24 92.4 Example 12 1,258 64 123.1 Example 13 122 71 68.3 Example 14 102 72 59.4 Example 15 97 74 52.1 Comparative Example 1 286 300 135.2 Comparative Example 2 201 605 76.2 Comparative Example 3 6,800 218 47.4

First, the epoxy resin compositions for HP-RTM prepared according to Examples 1 to 5 and the epoxy resin compositions for HP-RTM according to Examples 12 to 15 having less than 5 parts by weight or more than 100 parts by weight of reactive diluent were compared.

As shown in Table 4, it was confirmed that the mixed viscosity of the epoxy resin composition for HP-RTM was as high as 1,258 cps and the glass transition temperature was as high as about 123 ° C in Example 12 in which the reactive diluent was less than 5 parts by weight. In contrast, in Examples 13 to 15 in which the reactive diluent was more than 100 parts by weight, it was confirmed that the mixed viscosity and glass transition temperature of the epoxy resin composition for HP-RTM decreased. In particular, it was confirmed that the epoxy resin composition prepared according to Example 15 had a viscosity of only about 97 cps and a glass transition temperature of only 52 캜.

On the other hand, Comparative Example using an epoxy resin composition for HP-RTM prepared according to Example 2 and Isophronediamine (IPDA) which is not ethyleneamine as a curing agent, Jeffamine D-230 of Huntsman or polyamide The properties of the epoxy resin compositions prepared according to Examples 1 to 3 were compared.

In the case of using isophorone diamine (IPDA) as a curing agent (Comparative Example 1), the gel time was increased about 4 times as compared with the HP-RTM epoxy resin composition prepared according to Example 2, and it was confirmed that the glass transition temperature was improved . In addition, in the case of using D-230 as the curing agent (Comparative Example 2), the gel time was 8 times higher than that of the epoxy resin composition for HP-RTM prepared according to Example 2 and the glass transition temperature was about 30 占 폚 Respectively. On the other hand, in the case of using polyamide as a curing agent (Comparative Example 3), the mixed viscosity of the epoxy resin composition for HP-RTM increased to 6,800 cps as compared to the epoxy resin composition for HP-RTM prepared in Example 2, And the temperature also decreased to 60 ° C.

Claims (10)

Bisphenol A type epoxy resin;
Reactive diluent; And
The present invention provides an epoxy resin composition for high-pressure resin transfer molding (HP-RTM)
The reactive diluent may be at least one selected from the group consisting of 1,4-butanediol glycidyl ether and 1,6-hexanediol glycidyl ether. Including,
The bisphenol A type epoxy resin has a molecular weight (Mw) of 300 to 2,000 and a viscosity (cps) of 3,000 to 30,000,
The epoxy resin composition for HP-RTM has a gel time of 10 to 93 seconds. delete The method according to claim 1,
Wherein the curing agent is an ethyleneamine-based curing agent. The method of claim 3,
The curing agent is selected from the group consisting of ethylene diamine, diethylene triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, aminoethylene piperazine ) And aminoethylethanolamine. ≪ Desc / Clms Page number 24 > The method according to claim 1,
5 to 100 parts by weight of the reactive diluent with respect to 100 parts by weight of the bisphenol A type epoxy resin; And 10 to 50 parts by weight of the curing agent. The method according to claim 1,
The epoxy resin composition for HP-RTM further comprises a curing accelerator,
The curing accelerator is selected from the group consisting of a urea-based curing accelerator, an imidazole-based curing accelerator, and a tertiary amine-based curing accelerator,
Further comprising 10 to 50 parts by weight of the curing accelerator based on 100 parts by weight of the bisphenol A type epoxy resin. The method according to claim 1,
The epoxy resin composition for HP-RTM having a viscosity of 100 cps to 900 cps at 25 占 폚. delete The method according to claim 1,
An epoxy resin composition for HP-RTM having a glass transition temperature of 60 占 폚 to 130 占 폚. The method according to claim 1,
An epoxy resin composition for HP-RTM exhibiting a viscosity of from 100 cps to 900 cps at 25 占 폚, a gel time of from 10 seconds to 93 seconds, and a glass transition temperature of from 60 占 폚 to 180 占 폚.
KR1020150121155A 2015-08-27 2015-08-27 Epoxy resin compositions based on bisphenol a typed epoxy resin for high pressure resin transfer molding KR101599304B1 (en)

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WO2019124713A1 (en) * 2017-12-21 2019-06-27 주식회사 동성화학 Single-component epoxy-based adhesive composition and article using same
KR20190075774A (en) * 2017-12-21 2019-07-01 주식회사 동성화학 One-component type epoxy-based adhesives composition and articles using thereof
KR20200001242A (en) * 2018-06-27 2020-01-06 듀라원 주식회사 Colorless and solventless resin paints for protect sliding and preparation method therof
KR102404854B1 (en) * 2021-02-08 2022-06-02 함병필 The techniques to prevent the movements and sinking of stone plates and ceramic tiles using the difference in viscosity of epoxy resin
CN115433344A (en) * 2022-09-02 2022-12-06 深圳市飞荣达科技股份有限公司 Fast curing agent for HP-RTM (high pressure-resin transfer molding) and preparation method and application thereof
CN115490831A (en) * 2022-08-29 2022-12-20 深圳市飞荣达科技股份有限公司 Active diluent for HP-RTM resin, preparation method of active diluent and HP-RTM resin

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019124713A1 (en) * 2017-12-21 2019-06-27 주식회사 동성화학 Single-component epoxy-based adhesive composition and article using same
KR20190075774A (en) * 2017-12-21 2019-07-01 주식회사 동성화학 One-component type epoxy-based adhesives composition and articles using thereof
KR102147015B1 (en) * 2017-12-21 2020-08-21 주식회사 동성화학 One-component type epoxy-based adhesives composition and articles using thereof
KR20200001242A (en) * 2018-06-27 2020-01-06 듀라원 주식회사 Colorless and solventless resin paints for protect sliding and preparation method therof
KR102139705B1 (en) * 2018-06-27 2020-07-30 듀라원 주식회사 Colorless and solventless resin paints for protect sliding and preparation method therof
KR102404854B1 (en) * 2021-02-08 2022-06-02 함병필 The techniques to prevent the movements and sinking of stone plates and ceramic tiles using the difference in viscosity of epoxy resin
CN115490831A (en) * 2022-08-29 2022-12-20 深圳市飞荣达科技股份有限公司 Active diluent for HP-RTM resin, preparation method of active diluent and HP-RTM resin
CN115433344A (en) * 2022-09-02 2022-12-06 深圳市飞荣达科技股份有限公司 Fast curing agent for HP-RTM (high pressure-resin transfer molding) and preparation method and application thereof
CN115433344B (en) * 2022-09-02 2023-06-23 深圳市飞荣达科技股份有限公司 Rapid curing agent for HP-RTM, and preparation method and application thereof

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