KR101593963B1 - UV LED light source module unit for exposure photolithography process and exposure photolithography apparatus used the same - Google Patents
UV LED light source module unit for exposure photolithography process and exposure photolithography apparatus used the same Download PDFInfo
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- KR101593963B1 KR101593963B1 KR1020150107835A KR20150107835A KR101593963B1 KR 101593963 B1 KR101593963 B1 KR 101593963B1 KR 1020150107835 A KR1020150107835 A KR 1020150107835A KR 20150107835 A KR20150107835 A KR 20150107835A KR 101593963 B1 KR101593963 B1 KR 101593963B1
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- Prior art keywords
- light source
- light
- exposure
- unit
- ultraviolet light
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
Abstract
Description
BACKGROUND OF THE
For example, an image such as a semiconductor element, a circuit board (PCB) and a liquid crystal display (LCD), an organic light emitting diode (OLED), and a plasma display panel (PDP) The display panel is manufactured such that a microcircuit pattern is formed by an optical micromachining technique called photolithography in an exposure process in its manufacturing process.
Generally, an ultra-high-pressure mercury lamp or a halogen lamp is mainly used as an exposure light source used in a conventional exposure process. However, the conventional exposure light source has a low lifetime and a high power consumption, But also environmental problems.
Particularly, there is a demand for ultra-high resolution realization using the technique of miniaturization of exposure pattern in manufacture of TFT (Thin Film Transistor) or CF (Color Filter) in display fields such as liquid crystal display devices (LCD) and organic light emitting diodes It is a reality that it is impossible to realize the miniaturization of the exposure pattern and realization of the ultrahigh resolution which is the core technology of the display industry due to the technical limitations of the process of finishing the exposure pattern using the existing exposure light source (Hg Lamp).
In recent years, there has been a demand for miniaturization and high-definition of exposure patterns due to miniaturization, large capacity, high integration, and high density of semiconductor devices, and therefore the existing exposure light source has a limitation .
Recently, development of new exposure techniques such as liquid immersion exposure and extreme ultraviolet exposure has been actively carried out. For example, ultraviolet light emitting devices (UV LEDs) can be used with low power consumption, long life, selective use of single wavelength and short wavelength And as an environmentally friendly light source for exposure, it is becoming popular as a substitute for existing light sources for exposure.
However, in the case of an exposure apparatus using an ultraviolet light emitting element (UV LED) as a light source, the structure of the optical path that can reduce the optical loss, the improvement of the light intensity distribution and the power of the optical output and the miniaturization of the exposure pattern, Demand for the development of optical components, modules, and units is in a critical stage, along with the development of high efficiency new light sources (UV LEDs) for large capacity and high density.
SUMMARY OF THE INVENTION The present invention has been made in view of the technical background as described above, and it is an object of the present invention to solve the problems of the background art described above, which has been acquired by the applicant for deriving the present invention, It can not be said to be publicly known to the general public prior to the filing of the invention.
SUMMARY OF THE INVENTION It is an object of the present invention to provide an ultraviolet light emitting device having a plurality of ultraviolet light emitting devices and a condensing lens array module, And to provide a low power consumption type light source module unit for exposure capable of maximizing the light collection efficiency by the optimum combination.
Another object of the present invention is to provide a low power consumption type light source module unit capable of effectively and dramatically improving exposure performance and exposure efficiency so that the exposure pattern can be miniaturized and high resolution can be realized, and an exposure apparatus having the unit as a light source .
Still another object of the present invention is to provide an economical and practical low power consumption type light source module unit for exposure and an exposure apparatus having the unit as a light source by being improved into an alternative compatible modular unit which can be easily replaced with a light source of existing exposure apparatus .
According to an aspect of the present invention, there is provided a light source module unit for exposure according to the present invention, comprising: a light source panel having a plurality of unit ultraviolet light emitting devices mounted on a support panel in a matrix array structure on a circuit board; A plurality of unit condensing lenses arranged on the light output side of the light emitting device so as to face the light source panel are disposed at the centers of the ultraviolet light emitting element arrays on the light source panel with respect to the main light axis, And an optical panel provided in an array structure of a matrix type in a state of being eccentric to an arbitrary reference center axis line side passing through the optical axis.
In order to achieve the above-mentioned objects, an exposure apparatus according to the present invention includes an exposure table for supporting an exposure substrate coated with a photosensitizer, driving means for driving the exposure table in a movable state on the XY plane, A light source module unit for exposure provided for emitting illumination light for exposure to the substrate; an optical system provided between the substrate and the light source module unit for exposure; and control means for controlling driving of the driving means and the exposure light source unit In the exposure apparatus, the light source module unit for exposure includes a light source panel in which a plurality of unit ultraviolet light emitting elements are mounted on a support panel by being mounted on a circuit board in a matrix-like array structure; A plurality of unit condensing lenses arranged on the light output side of the light emitting device so as to face the light source panel are disposed at the centers of the ultraviolet light emitting element arrays on the light source panel with respect to the main light axis, And an optical panel provided in an array structure of a matrix type in a state of being eccentric to an arbitrary reference center axis line side passing through the optical axis.
According to the present invention, the unit condenser lens is gradually spaced from an arbitrary reference center axis side passing through the center of the ultraviolet light emitting element array on the light source panel, and is closer to the edge, And the diffused light emitted from each of the unit ultraviolet light emitting elements is condensed in the light receiving region set in the optical system of the exposure apparatus.
According to an aspect of the present invention, the ultraviolet light emitting device may be mounted on a unit circuit board as a packaged LED light source. Accordingly, the support panel constituting the light source panel may have a configuration in which a plurality of LED light sources in a package form are mounted on a plurality of unit circuit boards.
According to another aspect of the present invention, the ultraviolet light emitting element may be mounted as a packaged LED light source on a single circuit board.
According to another aspect of the present invention, the ultraviolet light emitting device may be mounted as an LED light source on a single or multiple circuit boards in the form of a single chip or a plurality of chips.
In the present invention, the unit condensing lens on the optical panel may be a double-sided convex lens, and a double-sided convex lens having a curvature surface of a different optical structure may be disposed according to the array position.
According to the present invention, there is provided an ultraviolet light-emitting element which is spaced apart from the reference center axis side passing through the center of the ultraviolet light-emitting element array on the light source panel, with respect to the optical distance "a" set in the optical system from the ultraviolet light- X "between the center axis of each of the ultraviolet light emitting elements and the center axis of the condensing lens, and the distance" c "between the center of the condensing lens and the distance" b "between the ultraviolet light emitting element and the condensing lens, ) Is set such that the reference of the eccentric distance "x" of the condensing lens satisfies "x = b * c / a", and the range of "x" / 2ab < x < bc (2b + t) / 2ab "
Also, it is preferable that the distance c between the surface of the ultraviolet light-emitting device and the condenser lens and the diameter d of the condenser lens satisfy the condition of 1.0c <d <2.5c.
The light source panel and the optical panel are preferably supported by the housing and configured to be detachable from the exposure apparatus.
Further, it is preferable that the light source panel and the optical panel are further provided with a radiation means.
According to the light source module unit for exposure according to the present invention, an optical panel, which is a condenser lens array module capable of maximizing the condensing efficiency with respect to the light source panel which is a plurality of ultraviolet light emitting (UV) LED array modules, As high power and high efficiency can be realized with a single wavelength and a short wavelength, it is possible to miniaturize the exposure pattern and achieve a remarkable high resolution by effectively improving the exposure performance and the exposure efficiency.
In addition, according to the light source module unit for exposure according to the present invention, it is possible to provide an alternative and compatible module unit that can be easily replaced with a light source of a conventional exposure apparatus, thereby providing a practical and economical exposure apparatus.
Further, since the light source module unit for exposure according to the present invention is used, it is possible to expect a remarkable reduction in maintenance cost by using low power consumption, reducing the cost of replacing the light source, improving the operation time of the exposure equipment, and solving environmental problems .
In addition, since the light source module unit for exposure according to the present invention can selectively use ultraviolet light having a single wavelength and a short wavelength with high efficiency and high output, it is possible to realize high resolution by pattern refinement which is a core technology for realizing high quality exposure performance It is.
1 is a schematic exploded perspective view showing a light source module unit for exposure according to the present invention.
2 is a schematic perspective view schematically illustrating a unit light source and a condenser lens array structure of an exposure light source module unit according to the present invention.
FIG. 3 is a schematic plan view schematically showing an array structure of an ultraviolet light-emitting device composed of a unit light source of an exposure light source module unit according to the present invention. FIG.
4 and 5 are schematic diagrams for explaining an eccentric array structure of a unit light source and a condenser lens of an exposure light source module unit according to the present invention, respectively.
6 is a graph showing the measurement result of the light collection amount according to the light collecting structure of the light source module unit for exposure according to the present invention.
7 is a photograph showing the light irradiation state of the light source module unit for exposure according to the present invention.
8 and 9 are external perspective views schematically showing a state in which the light source module units for exposure according to the present invention are unitized into different housings.
10 and 11 are a schematic perspective view and a plan view, respectively, showing a light source and a condenser lens array structure of a light source module unit for exposure according to another embodiment of the present invention.
12 is a view showing the results of measurement of the CD value according to the mask line width by photographing the main part of the circuit pattern formed on the wafer by the light source module unit for exposure according to the present invention and the mercury lamp (Hg Lamp) View drawings.
13 is a graph showing the results of measurement of CD values according to a mask line width of a circuit pattern formed on a wafer by a light source module unit for exposure according to the present invention and a mercury lamp Hg Lamp, which is a conventional light source for exposure.
FIG. 14 is a schematic view schematically showing an essential part of an exposure apparatus to which an exposure light source module unit according to the present invention is applied. FIG.
Hereinafter, a light source module unit for exposure according to the present invention will be described in detail with reference to the accompanying drawings. The following description and the accompanying drawings are merely illustrative of the preferred embodiments of the present invention and are not intended to limit the light source module unit for exposure according to the present invention.
1 and 2, a plurality of unit ultraviolet light emitting devices (UV LEDs) 111 are mounted on a
According to an aspect of the present invention, the ultraviolet
Accordingly, the
On the other hand, the ultraviolet
3 is a schematic plan view schematically showing an array structure of an ultraviolet
3, the light
Although the
Therefore, the light
That is, the shape of the
3, the ultraviolet
On the other hand, in the structure in which the ultraviolet
In other words, the center O of the ultraviolet light-emitting element array on the
The light receiving area (see the reference numeral "A" in Figs. 4 and 5) is an aperture for forming a condensing target through which the condensed light passes through a reflector provided in an optical system of an unillustrated exposure apparatus. .
Therefore, in the light
That is, in the light
In other words, the light
In order to maximize the efficiency of condensing the diffused light emitted from the ultraviolet
4 and 5 are schematic diagrams for explaining an array structure in which the
4 and 5, "a" represents an optical distance from the ultraviolet
"B" represents the separation distance of the ultraviolet
"X" represents an eccentric distance between the center axis of the ultraviolet
4 and 5, the light
That is, the reference of the eccentric distance "x" of the
6 is a graph showing measurement results of the light collection amount according to the light condensing structure of the light
6, the light
Therefore, in the light
7 (a) is a diagram showing the light irradiation state of the
Referring to FIG. 7, it can be seen that the brightness of the light irradiation state through the
8 and 9, the light
The light
The light
The heat dissipating means may include a heat sink built in the
According to another aspect of the present invention, there is provided a light source module unit for exposure according to the present invention, wherein the ultraviolet
Meanwhile, FIG. 12 is a photograph showing photographic results of a comparison between the exposure light source module unit according to the present invention and the conventional exposure light source Hg Lamp.
The test results shown in Fig. 12 were obtained by applying a 1.5-m thick photoresist (PR name: DTFR-JC800) to a 3.5-inch wafer and setting mask line widths in the range of 1.0 to 3.5 um at intervals of 0.2 And developed with 2.38 wt% of tetramethylammonium hydroxide (TMAH) developer to develop a critical dimension (CD) of a microcircuit pattern formed through photolithography used in a conventional LCD manufacturing process, Was measured by photographing.
12, the limit of the critical dimension (CD) of a microcircuit pattern that can be implemented using a mercury lamp, which is a conventional exposure light source, is about 2.0 μm. On the other hand, the light source module unit for exposure according to the present invention It can be seen that the critical dimension (CD) of the microcircuit patterns that can be implemented is possible up to about 1.4 μm.
FIG. 13 is a graph showing the critical dimension line dimension (CD) measured by photographing in FIG. 12 and the ideal critical dimension line dimension (CD).
13, the critical dimension line dimension (CD) of a microcircuit pattern that can be implemented using the light source module unit for exposure according to the present invention is a critical dimension of a microcircuit pattern that can be realized using a conventional mercury lamp It can be seen that it is formed in a pattern closer to the ideal critical dimension fine dimension (CD) as compared with the line width fine dimension (CD).
Therefore, the line width of the fine circuit pattern formed using the light source module unit for exposure according to the present invention can be formed finer and more precisely than the line width of the circuit pattern formed using the mercury lamp (Hg Lamp) can confirm. Accordingly, the light source module unit for exposure according to the present invention can realize a remarkable high resolution in the exposure process.
FIG. 14 is a schematic configuration diagram schematically showing an essential part of an exposure apparatus to which an exposure light source module unit according to the present invention is applied. Here, the same reference numerals as those in the preceding drawings denote the same components.
14, an
The
The exposure table 250 is moved in the XY plane coordinates by the driving means according to the relative sizes of the
In the meantime, in the
On the other hand, the
A pattern formed on the
The
The light source module unit for
According to the
The light
In other words, the
While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that various modifications may be made, and such modifications are intended to fall within the scope of the appended claims.
100: Light source module unit for exposure
110: Light source panel
111: ultraviolet light emitting element
112: circuit board
113: Support panel
120: Optical panel
121: condenser lens
122: lens panel
200: Exposure device
210: reflector
240: mask
A: light receiving area / aperture
Claims (13)
A plurality of unit condensing lenses arranged on the light output side of the light emitting device so as to face the light source panel are disposed at the centers of the ultraviolet light emitting element arrays on the light source panel with respect to the main light axis, And an optical panel provided in an array structure of a matrix type in a state of being eccentric to an arbitrary reference center axis line side passing through the optical axis,
A distance between the ultraviolet light-emitting device and the light-receiving area (A) from the ultraviolet light-emitting device to the light-receiving area (A) x "between the center axis of each of the ultraviolet light emitting elements and the center axis of the condensing lens, and the distance" c "between the center of the light collecting lens and the center axis of the condensing lens, The relationship of the diameter "t" is set such that the reference of the eccentric distance "x" of the condensing lens satisfies "x = b * c / a"<x<bc (2b + t) / 2ab ".
Wherein the unit condenser lens is disposed in a matrix form in which the amount of eccentricity with respect to the main optical axis of the corresponding unit ultraviolet light emitting device is increased as the unit condenser lens is disposed closer to an edge of the arbitrary reference central axis side passing through the center of the ultraviolet light emitting device array on the light source panel And the diffused light emitted from each of the unit ultraviolet light emitting elements is condensed in the light receiving region set in the optical system of the exposure apparatus.
Wherein the ultraviolet light-emitting device is mounted on the unit circuit board in the form of an LED light source in the form of a chip or a package or a mixture of both.
Wherein the ultraviolet light emitting device is mounted on a single circuit board by a LED light source in the form of any one selected from a chip or a package or a mixture of both.
Wherein the unit condenser lens is a double-sided convex lens.
Wherein the unit condensing lens is formed of a biconvex lens having a curvature surface of a different optical structure according to an arrangement position of the unit condensing lens.
Wherein a distance c between a unit surface of the unit ultraviolet light emitting device and the unit ultraviolet light emitting device and a diameter d of the light converging lens satisfy a condition of 1.0c <d <2.5c.
Wherein the light source panel and the optical panel are supported so as to be unitized in a detachable state in an exposure apparatus.
Wherein the light source panel and the optical panel are further provided with a heat dissipating means around the light source panel and the optical panel.
The light source module unit for exposure,
A light source panel in which a plurality of unit ultraviolet light emitting elements are mounted on a support panel by being mounted on a circuit board in an array structure in a matrix form;
A plurality of unit condensing lenses arranged on the light output side of the light emitting device so as to face the light source panel are disposed at the centers of the ultraviolet light emitting element arrays on the light source panel with respect to the main light axis, And an optical panel provided in an array structure of a matrix type in a state of being eccentric to an arbitrary reference center axis line side passing through the optical axis,
A distance between the ultraviolet light-emitting device and the light-receiving area (A) from the ultraviolet light-emitting device to the light-receiving area (A) x "between the center axis of each of the ultraviolet light emitting elements and the center axis of the condensing lens, and the distance" c "between the center of the light collecting lens and the center axis of the condensing lens, The relationship of the diameter "t" is set such that the reference of the eccentric distance "x" of the condensing lens satisfies "x = b * c / a"<x<bc (2b + t) / 2ab "is satisfied.
Wherein the unit condenser lens is arranged in a matrix-like array in which an amount of eccentricity with respect to the main optical axis of the corresponding unit ultraviolet light-emitting device is increased as the unit condenser lens is disposed closer to an edge at an arbitrary reference center axis line side passing through the center of the ultraviolet light- And condenses the diffused light emitted from each of the unit ultraviolet light emitting elements into a light receiving area set in the optical system of the exposure apparatus.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150107835A KR101593963B1 (en) | 2015-07-30 | 2015-07-30 | UV LED light source module unit for exposure photolithography process and exposure photolithography apparatus used the same |
TW104135369A TWI579658B (en) | 2015-07-30 | 2015-10-28 | Uv led light source module unit for exposure photolithography process and exposure photolithography apparatus used the same |
CN201510726723.4A CN106406033B (en) | 2015-07-30 | 2015-10-30 | For the light source module unit of exposure and the exposure device including the light source module unit |
CN201520858315.XU CN205103540U (en) | 2015-07-30 | 2015-10-30 | A exposure device for making public light source module unit and including this light source module unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150107835A KR101593963B1 (en) | 2015-07-30 | 2015-07-30 | UV LED light source module unit for exposure photolithography process and exposure photolithography apparatus used the same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020150169812A Division KR20170015075A (en) | 2015-12-01 | 2015-12-01 | UV LED light source module unit for exposure photolithography process and exposure photolithography apparatus used the same |
Publications (1)
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KR101593963B1 true KR101593963B1 (en) | 2016-02-15 |
Family
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Family Applications (1)
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KR1020150107835A KR101593963B1 (en) | 2015-07-30 | 2015-07-30 | UV LED light source module unit for exposure photolithography process and exposure photolithography apparatus used the same |
Country Status (3)
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KR (1) | KR101593963B1 (en) |
CN (2) | CN205103540U (en) |
TW (1) | TWI579658B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018062861A1 (en) * | 2016-09-27 | 2018-04-05 | ㈜블루코어 | Light source module unit for exposure and exposure device having same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101593963B1 (en) * | 2015-07-30 | 2016-02-15 | 조남직 | UV LED light source module unit for exposure photolithography process and exposure photolithography apparatus used the same |
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JP2003218001A (en) | 2002-01-18 | 2003-07-31 | Pentax Corp | Aligner |
WO2007108504A1 (en) * | 2006-03-23 | 2007-09-27 | Matsushita Electric Industrial Co., Ltd. | Projection type display device and light source device |
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JP3987350B2 (en) * | 2001-11-16 | 2007-10-10 | 株式会社リコー | Laser illumination optical system and exposure apparatus, laser processing apparatus, and projection apparatus using the same |
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KR100983582B1 (en) * | 2007-12-31 | 2010-10-11 | 엘지디스플레이 주식회사 | Apparatus and method for exposure and method for pattrning thin layer using the same |
TWI531872B (en) * | 2008-09-22 | 2016-05-01 | Asml荷蘭公司 | Lithographic apparatus, programmable patterning device and lithographic method |
JP2010164658A (en) * | 2009-01-13 | 2010-07-29 | Oki Data Corp | Lens array, lens unit, led head, exposing unit, image forming apparatus, and reading apparatus |
EP2226683A1 (en) * | 2009-03-06 | 2010-09-08 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Illumination system for use in a stereolithography apparatus |
JP5515120B2 (en) * | 2010-10-29 | 2014-06-11 | 株式会社ブイ・テクノロジー | Scan exposure equipment using microlens array |
JP2012145869A (en) * | 2011-01-14 | 2012-08-02 | Hitachi High-Technologies Corp | Exposure method and device thereof |
JP2013171088A (en) * | 2012-02-17 | 2013-09-02 | Hitachi High-Technologies Corp | Proximity exposure apparatus, method for forming exposure light of proximity exposure apparatus, and method for manufacturing display panel substrate |
CN103592821B (en) * | 2013-10-16 | 2015-06-03 | 浙江欧视达科技有限公司 | Novel LED (light-emitting diode) light source system for ultraviolet exposure machine |
KR101593963B1 (en) * | 2015-07-30 | 2016-02-15 | 조남직 | UV LED light source module unit for exposure photolithography process and exposure photolithography apparatus used the same |
-
2015
- 2015-07-30 KR KR1020150107835A patent/KR101593963B1/en active IP Right Grant
- 2015-10-28 TW TW104135369A patent/TWI579658B/en active
- 2015-10-30 CN CN201520858315.XU patent/CN205103540U/en not_active Withdrawn - After Issue
- 2015-10-30 CN CN201510726723.4A patent/CN106406033B/en active Active
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JP2003218001A (en) | 2002-01-18 | 2003-07-31 | Pentax Corp | Aligner |
WO2007108504A1 (en) * | 2006-03-23 | 2007-09-27 | Matsushita Electric Industrial Co., Ltd. | Projection type display device and light source device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018062861A1 (en) * | 2016-09-27 | 2018-04-05 | ㈜블루코어 | Light source module unit for exposure and exposure device having same |
KR101848072B1 (en) * | 2016-09-27 | 2018-04-11 | (주)블루코어 | UV LED light source module unit for exposure photolithography process and exposure photolithography apparatus used the same |
CN109923477A (en) * | 2016-09-27 | 2019-06-21 | 蓝科莱株式会社 | Exposure light source modular unit and the exposure device for being provided with the light source module unit |
Also Published As
Publication number | Publication date |
---|---|
TW201704884A (en) | 2017-02-01 |
CN205103540U (en) | 2016-03-23 |
TWI579658B (en) | 2017-04-21 |
CN106406033A (en) | 2017-02-15 |
CN106406033B (en) | 2019-05-03 |
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