KR101571390B1 - Apparatus for drilling continuously using laser - Google Patents

Apparatus for drilling continuously using laser Download PDF

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Publication number
KR101571390B1
KR101571390B1 KR1020140069631A KR20140069631A KR101571390B1 KR 101571390 B1 KR101571390 B1 KR 101571390B1 KR 1020140069631 A KR1020140069631 A KR 1020140069631A KR 20140069631 A KR20140069631 A KR 20140069631A KR 101571390 B1 KR101571390 B1 KR 101571390B1
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KR
South Korea
Prior art keywords
film
laser head
laser
hole
laser beam
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KR1020140069631A
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Korean (ko)
Inventor
변영희
이형규
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변영희
주식회사 리텍
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Priority to KR1020140069631A priority Critical patent/KR101571390B1/en
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Publication of KR101571390B1 publication Critical patent/KR101571390B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/047—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention relates to a continuous drilling apparatus using a laser comprising: a unwinding roller; a drum stage; a first laser head, a second laser head, and a winding roller. In the unwinding roller, an unprocessed film is wound. The drum stage includes a transfer surface in the curved form rotating around a rotary shaft, and a vacuum hole for attaching a film to the transfer surface in order to transfer while the film supplied from the unwinding roller is attached to the transfer surface. The first laser head forms a through hole by irradiating a laser beam to a first area of the film attached to the transfer surface. The second laser head is installed in the rear of the first laser head with respect to the direction of transferring the film, installed to be displaced with the first laser head with respect to the width direction of the film, and forms a through hole by irradiating a laser beam to a second area of the film attached to the transfer surface. In the winding roller, the film having a through hole by the first laser head and the second laser head is re-wound.

Description

[0001] APPARATUS FOR DRILLING CONTINUOUSLY USING LASER [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuous drilling apparatus using a laser, and more particularly, to a continuous drilling apparatus using a laser which continuously forms a through hole at a desired position of a film-like flexible substrate using a laser.

The flexible substrate in the form of a film is capable of designing a compact and lightweight high-density wiring circuit, has a bendable characteristic, and is applied to a wide range of products such as mobile phones, cameras, and LCD displays.

1 is a schematic view of a conventional drilling apparatus using a laser.

The laser drilling apparatus is for forming a through hole at a desired position of a flexible substrate in the form of a laser using a laser. The drilling apparatus includes a take-up roller 21, a take-up roller 22, a flat plate support 24, (22), and a lifting bar (23).

The uncoated film 10 is wound on the unwinding roller 21 and the film 10 having the through-hole formed therein is wound up on the winding roller 22. The film 10 supplied from the unwinding roller 21 is conveyed to the side of the flat plate support 24 and supported by the flat plate support 24. Prior to irradiating the film 10 supported by the plate support 24 with the laser beam L, the film 10 should be flattened. If the through hole is formed in a state where the film 10 can not be flattened and rugged, there is a problem that the processing accuracy and positional accuracy of the through hole are remarkably lowered.

Therefore, in the conventional laser drilling apparatus, before the laser beam L is irradiated, the lift bar 23 is lowered from the front and rear of the plate support 24 to pull both sides of the film 10, (10) is flattened. Then, a laser beam L is irradiated from the laser head 22 to form a through hole in the film 10.

However, when the film 10 is flattened using the lifting bar 23, there is a problem that the operation speed of the drilling process is remarkably slowed down. A through hole is formed in a working region that can be covered by the laser head 22 and the film 10 is transported after lifting the lifting bar 23 again and descending the lifting bar 23 again to transport the film 10 The time required for raising and lowering the lifting bar 23 is longer than the actual working time required for forming the through hole by using the actual laser beam L, The time required for transporting the drilling machine 10 is much longer, which slows down the operation speed of the drilling process as a whole and also lowers the production yield.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide a method and apparatus for transferring a film while rotating a drum stage having a curved transfer surface, So as to improve the operation speed of the drilling process and increase the production yield.

According to an aspect of the present invention, there is provided a continuous drilling apparatus using laser, comprising: a take-up roller on which a raw film is wound; A second edge face that is curved around the rotation axis and that supports one end of the film supplied from the take-up roller, a second edge face that is spaced from the first edge face and supports the center of the film, A transfer surface having a third edge face spaced apart from the second edge face and supporting the other end of the film and a second edge face which is in close contact with the transfer face to closely contact the film with the transfer face, A vacuum space; a first space portion provided between the first rim surface and the second rim surface; and a second space portion provided between the second rim surface and the third rim surface; A first laser head for irradiating a laser beam onto a first area of the film adhered to the transfer surface to form a through hole; A first suction part installed in the first space part and sucking smoke generated when a through hole is formed by the laser beam irradiated from the first laser head; A laser beam is provided on the second region of the film closely attached to the transfer surface in a manner that the laser beam is provided to the rear side of the first laser head with respect to the transport direction of the film, A second laser head for forming a through hole by irradiation; A second suction part installed in the second space part and sucking smoke generated when a through hole is formed by the laser beam irradiated from the second laser head; And a take-up roller for rewinding the film having the through-holes formed by the first laser head and the second laser head, wherein the film portion on the upper side of the first space portion and the film portion on the upper side of the second space portion And the beam is irradiated.

In the continuous drilling apparatus using laser according to the present invention, the first region and the second region may be divided based on a center portion in the width direction of the film.

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In the continuous drilling apparatus using a laser according to the present invention, the first suction portion is operated only while the laser beam is irradiated by the first laser head, and the second suction portion is irradiated with the laser beam from the second laser head Lt; / RTI >

In the continuous drilling apparatus using a laser according to the present invention, each of the first laser head and the second laser head includes a galvanometer scanner for deflecting the laser beam to a desired position, A first detecting unit installed at the front and detecting an error of the film with respect to the transport direction of the film; A second detecting unit installed at the rear of the second laser head for detecting an error of the film with respect to the transport direction of the film; And a controller receiving the error detected by the first detector and the second detector and transmitting a correction value for correcting the error to the galvanometer scanner.

In the continuous drilling apparatus using a laser according to the present invention, a pair of fitting holes arranged in parallel with the width direction of the film is formed at both ends of the film, and the first detecting portion and the second detecting portion are formed in the fitting It is possible to detect the wrong error by sensing the hole.

A continuous drilling apparatus using a laser according to the present invention is characterized by comprising: a first inspection unit installed at the rear of the first laser head for inspecting a state of a through hole formed in the first region; And a second inspection unit installed at the rear of the second laser head for checking the state of the through hole formed in the second area.

According to the continuous drilling apparatus using the laser of the present invention, the operation speed of the drilling process can be improved and the production yield can be increased.

Further, according to the continuous drilling apparatus using the laser of the present invention, the work area of the laser head can be set small to improve the processing accuracy of the through hole, and at the same time, the size of the apparatus can be reduced.

Further, according to the continuous drilling apparatus using the laser of the present invention, it is possible to prevent damage to the transfer surface of the film and to improve the durability of the apparatus.

Further, according to the continuous drilling apparatus using the laser of the present invention, it is possible to reduce the defect rate of the product and improve the working speed of the drilling process.

1 is a schematic view of a drilling apparatus using a conventional laser,
2 is a schematic view of a continuous drilling apparatus using a laser according to an embodiment of the present invention,
FIG. 3 is a view showing a drum stage of a continuous drilling apparatus using the laser of FIG. 2,
FIG. 4 is a plan view along the IV-IV 'direction shown in FIG. 2,
FIG. 5 is a view for explaining the functions of the first detection unit and the second detection unit of the continuous drilling apparatus using the laser of FIG. 2,
FIG. 6 is a view showing a first suction unit and a second suction unit of the continuous drilling apparatus using the laser of FIG. 2;

Hereinafter, embodiments of a continuous drilling apparatus using a laser according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a schematic view of a continuous drilling apparatus using a laser according to an embodiment of the present invention, FIG. 3 is a view showing a drum stage of a continuous drilling apparatus using the laser of FIG. 2, FIG. 5 is a view for explaining the functions of the first detecting unit and the second detecting unit of the continuous drilling apparatus using the laser of FIG. 2, and FIG. 6 is a cross- FIG. 1 is a view showing a first suction part and a second suction part of a continuous drilling machine using a laser of FIG.

2 to 6, the continuous drilling apparatus 100 using the laser according to the present embodiment forms a through hole at a desired position of a flexible substrate in the form of a film by using a laser, The drum stage 120, the first laser head 131, the second laser head 132, the first detection section 141, the second detection section 142, the control section, the first inspection section 151, a second inspecting section 152, a first suction section 161, a second suction section 162, and a winding roller 170.

The unwinding roller 110 is wound with the raw film 10 and continuously supplies the film to the drum stage 120 side.

As shown in FIG. 3, the drum stage 120 is formed in a cylindrical shape as a whole, and is rotatably installed around a rotation axis C. The drum stage 120 is provided with a conveying surface 121 and a vacuum hole 126.

The transfer surface 121 is formed in a curved shape corresponding to the side surface of the drum stage 120 disposed in parallel with the rotation axis C. The transfer surface 121 is also in contact with the rotation axis C. When the drum stage 120 rotates, (C).

The transfer surface 121 of the present embodiment mainly comprises a first rim surface 122, a second rim surface 123, and a third rim surface 124. The first rim surface 122 supports one end of the film 10 with respect to the width direction W of the film and the second rim surface 123 is disposed apart from the first rim surface 122, The center of the film is supported on the basis of the width direction W of the film. The third rim surface 124 is also spaced apart from the second rim surface 123 and supports the other end of the film with respect to the width direction W of the film.

The film 10 fed from the unwinding roller 110 is fed to the first edge face 122, the second edge face 123 and the third edge face 124 in a state in which the film 10 is in close contact with the feed face 121, A plurality of vacuum holes 126 are formed in a row so as to closely contact the film 10. The film 10 has the first rim surface 122, the second rim surface 123 and the third rim surface 124 while the inside of the vacuum hole 126 becomes a vacuum state lower than the atmospheric pressure by an external vacuum pump or the like. As shown in Fig.

The drum stage 120 further includes a first space 127 provided between the first rim surface 122 and the second rim surface 123 and a second rim surface 123 and a third rim surface 124, And a second space 128 provided between the first and second electrodes. The first space portion 127 is a space separated from the first rim surface 122 and the second rim surface 123 and the second space portion 128 is a space separated from the second rim surface 123 and the third rim surface 123. [ Quot; refers to a space spaced between the rim surfaces 124.

The first laser head 131 irradiates the laser beam L onto the first area 11 of the film adhered to the transfer surface 121 of the drum stage 120 to form a through hole. The first laser head 131 includes a galvanometer scanner for deflecting the laser beam to a desired position on the film 10 and a condenser lens for condensing the laser beam via the galvanometer scanner.

The working field, which is a limit area where the laser beam can be irradiated, is determined in consideration of the spot size of the laser beam, the processing precision, and the like. However, such a working area can not be enlarged for the precision processing as in the present invention. Therefore, since a small work area formed by one laser head can not form a through hole with respect to the entire width of the film 10, it is possible to divide the film 10 into a plurality of virtual areas, It is preferable to provide a plurality of laser heads capable of performing through-hole processing with respect to the region of the through hole.

As shown in Fig. 4, in the present embodiment, the film 10 transported by the drum stage 120 can be divided into two imaginary regions. The film 10 can be divided into the first region 11 and the second region 12 with respect to the central portion 15 with respect to the width direction W of the film. The first laser head 131 performs through-hole processing with respect to the first region 11 of the two divided regions and the second laser head 132 is irradiated with respect to the second region 12 of the divided two regions, The through hole processing can be performed.

The first laser head 131 is provided on the upper side of the first area 11 of the film and irradiates the laser beam L onto the first area 11 of the film which is in close contact with the transfer surface 121, .

The second laser head 132 irradiates the laser beam L onto the second area 12 of the film that is in close contact with the transfer surface 121 of the drum stage 120 to form a through hole. The second laser head 132 also includes a galvanometer scanner for deflecting the laser beam to a desired position on the film 10 and a condenser lens for condensing the laser beam via the galvanometer scanner.

The second laser head 132 of the present embodiment is provided at the rear of the first laser head 131 with respect to the transport direction A1 of the film and has the first laser head 131, Respectively. That is, the second laser head 132 is provided on the upper side of the second region 12 of the film at the rear of the first laser head 131, and the second region 12 of the film, A laser beam L is irradiated to form a through hole.

On the other hand, if the transfer surface 121 is located below the portion of the film 10 to which the laser beam L is irradiated, the transfer surface 121 may be damaged by the laser beam L. If the projections are formed due to the burning phenomenon of the transfer surface 121, not only the film 10 is adhered well but also the film 10 becomes rugged due to the shape of the damaged transfer surface 121, .

In order to prevent the transferring surface 121 from being damaged, the film 10 is held in close contact with the first rim surface 122, the second rim surface 123 and the third rim surface 124, It is preferable that the laser beam L is irradiated onto the upper film portion of the first spatial portion 127 and the upper film portion of the second spatial portion 128.

The first detection unit 141 is provided in front of the first laser head 131 for detecting a misalignment (a) of the film with respect to the transport direction A1 of the film. The second detecting portion 142 is provided behind the second laser head 132 for detecting a misalignment (a) of the film with respect to the film transport direction A1.

As shown in Figs. 4 and 5, a pair of fitting holes 16 are formed at both ends of the film 10 so as to be parallel to the width direction W of the film. The fitting hole 16 is previously formed in the film 10 for transferring the film 10 through a sprocket or the like in another process. The first detecting section 141 and the second detecting section 142 are arranged in parallel with the width direction W of the film before the laser beam L is irradiated by the first laser head 131 and the second laser head 132 A pair of insertion holes 16 to be disposed can be sensed to detect a misalignment (a) of the film with respect to the transport direction A1 of the film.

As shown in FIG. 5A, for example, three through holes 17a are formed in parallel with the direction in which the pair of fitting holes 16 are arranged. However, when the film 10 is in a broken state The through hole 17a can be formed at an incorrect position.

If the pair of fitting holes 16 are sensed by using the first detection unit 141 and the second detection unit 142, the error a of the film can be detected with respect to the film transport direction A1, As shown in FIG. 5 (b), when the error a is corrected, three through holes 17b are formed parallel to the direction in which the pair of fitting holes 16 are arranged, Can be formed.

Image acquiring means such as a camera may be used as the first detecting unit 141 and the second detecting unit 142 of the present embodiment and an image of the pair of fitting holes 16 may be acquired using a camera or the like, The insertion hole 16 can be detected.

The controller receives the error a detected by the first detector 141 and the second detector 142 and transmits a correction value for correcting the error a to the galvanometer scanner. The galvanometer scanner does not need manual operation such as repositioning the film 10 by irradiating the film 10 by controlling the laser beam L in the direction of correcting the error a of the film.

The first inspection unit 151 inspects the state of the through hole formed in the first region 11 of the film adhered to the transfer surface 121 and is installed behind the first laser head 131.

An image acquisition means such as a camera may be used as the first inspection unit 151 of the present embodiment, and an image of the through hole formed in the first region 11 may be obtained by using a camera or the like so that the diameter of the through hole, You can check the status.

The second inspection unit 152 inspects the state of the through hole formed in the second region 12 of the film adhered to the transfer surface 121 and is installed behind the second laser head 132.

Similarly, in the second inspection section 152 of the present embodiment, an image acquiring means such as a camera may be used, and an image of a through hole formed in the second region 12 may be obtained by using a camera or the like to determine the diameter of the through hole, And so on.

On the other hand, if the state of the through hole inspected by the first inspection unit 151 or the second inspection unit 152 is defective, the rework may be performed. The drum stage 120 is rotated in a direction opposite to the rotating direction at the time of processing the through holes and the corresponding position is transferred to the lower side of the first laser head 131 or the second laser head 132, It is also possible to reprocess the faulty through hole by inspection.

The first suction part 161 sucks the smoke generated when the through hole is formed by the laser beam L irradiated from the first laser head 131. The first suction part 161 is installed in the first space part 127, do.

The first suction portion 161 is disposed in the first space portion 127 immediately below the first region 11 of the film and the inside of the first suction portion 161 is evacuated to a vacuum The smoke generated when the through holes are formed can be sucked into the first suction unit 161 and be discharged to the outside.

The second suction part 162 is for sucking the smoke generated when the through hole is formed by the laser beam L irradiated from the second laser head 132. The second suction part 162 is installed in the second space part 128 do.

Similarly, the second suction portion 162 is disposed in the second space portion 128 just under the second region 12 of the film, and the inside of the second suction portion 162 is lower than the atmospheric pressure As the vacuum state is established, the smoke generated when the through holes are formed is sucked into the second suction portion 162 and can be discharged to the outside.

At this time, the first suction portion 161 is turned on only while the laser beam L is irradiated by the first laser head 131, and is turned off while the laser beam L is irradiated by the second laser head 132 . The second suction portion 162 is turned on only while the laser beam L is irradiated by the second laser head 132 and is turned off while the laser beam L is irradiated by the first laser head 131 . In this manner, by operating the first suction portion 161 and the second suction portion 162 only when necessary, it is possible to solve the problem that the suction efficiency is lowered due to insufficient flow rate.

The winding roller 170 rewinds the film 10 having the through-holes formed by the first laser head 131 and the second laser head 132.

The continuous drilling apparatus using the laser according to the present embodiment configured as described above has a structure in which a film is adhered to a drum stage having a curved transfer surface and a film is transferred while rotating the drum stage, Can be continuously formed. Therefore, there is no need to stop the film transfer to flatten the film before irradiating the laser beam as in the conventional method, and the process of transferring the film and the process of forming the through hole by irradiating the laser beam can be performed simultaneously . Accordingly, the continuous drilling apparatus using the laser of the present embodiment can improve the operation speed of the drilling process, thereby increasing the production yield.

Further, in the continuous drilling apparatus using laser according to the present embodiment configured as described above, a plurality of laser heads capable of respectively performing through-hole processing on a plurality of divided regions on the film are installed together on one drum stage The work area of the laser head can be set small so as to improve the processing accuracy of the through hole and to reduce the size of the apparatus.

Further, the continuous drilling apparatus using the laser according to the present embodiment configured as described above has a first space portion between the first rim surface and the second rim surface, and a second space between the second rim surface and the third rim surface, By irradiating the upper part of the film with the laser beam, it is possible to prevent damage to the transfer surface of the film and to improve the durability of the apparatus.

Further, in the continuous drilling apparatus using the laser according to the present embodiment configured as described above, a detecting section is provided in front of the laser head to detect a wrong error of the film, and a wrong error The defect rate of the product can be reduced and the operation speed of the drilling process can be improved.

The scope of the present invention is not limited to the above-described embodiments and modifications, but can be implemented in various forms of embodiments within the scope of the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

100: Continuous drilling machine using laser
110: Retraction roller
120: drum stage
121: Feed surface
126: Vacuum hole
131: first laser head
132: second laser head
170: take-up roller

Claims (8)

A take-up roller on which the raw film is wound;
A second edge face that is curved around the rotation axis and that supports one end of the film supplied from the take-up roller, a second edge face that is spaced from the first edge face and supports the center of the film, A transfer surface having a third edge face spaced apart from the second edge face and supporting the other end of the film and a second edge face which is in close contact with the transfer face to closely contact the film with the transfer face, A vacuum space; a first space portion provided between the first rim surface and the second rim surface; and a second space portion provided between the second rim surface and the third rim surface;
A first laser head for irradiating a laser beam onto a first area of the film adhered to the transfer surface to form a through hole;
A first suction part installed in the first space part and sucking smoke generated when a through hole is formed by the laser beam irradiated from the first laser head;
A laser beam is provided on the second region of the film closely attached to the transfer surface in a manner that the laser beam is provided to the rear side of the first laser head with respect to the transport direction of the film, A second laser head for forming a through hole by irradiation;
A second suction part installed in the second space part and sucking smoke generated when a through hole is formed by the laser beam irradiated from the second laser head; And
And a winding roller for rewinding the film having the through-holes formed by the first laser head and the second laser head,
And a laser beam is irradiated onto the film portion on the upper side of the first space portion and the film portion on the upper side of the second space portion. The method according to claim 1,
Wherein the first region and the second region are divided based on a center portion in the width direction of the film. delete delete The method according to claim 1,
Characterized in that the first suction portion is operated only while the laser beam is irradiated by the first laser head and the second suction portion is operated only while the laser beam is irradiated by the second laser head. Device. The method according to claim 1,
Wherein each of the first laser head and the second laser head has a galvanometer scanner for deflecting the laser beam to a desired position,
A first detector disposed in front of the first laser head for detecting an error of the film with respect to the transport direction of the film;
A second detecting unit installed at the rear of the second laser head for detecting an error of the film with respect to the transport direction of the film; And
And a controller for receiving the error detected by the first detector and the second detector and transmitting a correction value for correcting the error to the galvanometer scanner, . The method according to claim 6,
Wherein a pair of fitting holes are formed at both ends of the film so as to be parallel to the width direction of the film,
Wherein the first detecting unit and the second detecting unit detect the fitted error by detecting the fitting hole. The method according to claim 1,
A first inspection unit installed at the rear of the first laser head for checking a state of a through hole formed in the first area; And
And a second inspection unit installed at a rear side of the second laser head to inspect a state of the through hole formed in the second area.
KR1020140069631A 2014-06-09 2014-06-09 Apparatus for drilling continuously using laser KR101571390B1 (en)

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Cited By (6)

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KR20180088085A (en) 2017-01-26 2018-08-03 주식회사 제니스테크 Devices of inspecting films, patterning devices having the same and methods of inspecting films
KR102158708B1 (en) 2020-06-10 2020-09-22 주식회사 디에이테크놀로지 Drum Type Pattern Jig for Laser Notching Process of Electrode Film for Secondary Battery, And Laser Notching System Having the Pattern Jig
KR102245162B1 (en) 2020-08-11 2021-04-27 주식회사 디에이테크놀로지 System for Laser Notching Process of Secondary Battery Electrode Film
CN114043023A (en) * 2021-11-25 2022-02-15 惠州市西龙五金制品有限公司 Electric spark puncher of steel with smog processing function
KR102430493B1 (en) 2021-03-22 2022-08-10 주식회사 디에이테크놀로지 Laser Notching System for Manufacturing Secondary Battery
KR20220160324A (en) 2021-05-27 2022-12-06 주식회사 디에이테크놀로지 Laser Notching System for Manufacturing Secondary Battery

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