KR101540721B1

KR101540721B1 - Scanning Electron Microscope

Info

Publication number: KR101540721B1
Application number: KR1020140002518A
Authority: KR
Inventors: 구정회
Original assignee: 구정회
Priority date: 2014-01-08
Filing date: 2014-01-08
Publication date: 2015-07-31
Also published as: KR20150082956A

Abstract

A sample holder provided on the stage in the sample analysis chamber, a fine mesh member provided at the electron beam transmission position on the upper portion of the sample holder and provided with microvoids to which the sample is attached, a cover member for fixing the fine mesh member to the upper portion of the sample holder, A transmission electron reflecting member provided at a lower portion of the fine mesh member of the sample holder and reflecting the electrons transmitted through the fine mesh member to a detector provided in the sample analysis chamber and a fine mesh member provided in the sample holder so as to be positioned below the fine mesh member, A device for imaging an image of a scanning electron microscope is disclosed which comprises a fine aperture stop preventing diffusion of an electron beam that has passed through a mesh member.

Description

Scanning Electron Microscope (SEM)

The present invention relates to a scanning electron microscope (SEM), and more particularly, to an imaging device for a scanning electron microscope capable of observing a sample such as a gel and a non-conductor with high resolution without coating.

Recently, the packing density of semiconductors, displays, and component materials is also rapidly increasing due to the development of IT / NT technology. The demand for electron microscopy analysis capable of analyzing the technology obtained by IT / NT is also increasing, and a typical example is a scanning electron microscope (hereinafter referred to as " SEM ").

SEM focuses the electron beam emitted from the electron gun through electromagnetic lenses and scans a certain minute area of the sample to capture secondary electrons protruding from the surface of the sample and fills the area scanned with a monitor pixel It is an image analyzer for observing the sample surface (several tens of nm).

On the other hand, when the electron beam emitted from the electron gun of the SEM is focused on the surface of the sample by the high-energy energy, the primary electrons incident on the sample must escape to the ground wire. The phenomenon that the primary electron accumulates in the sample, Charge-up ". These primary electrons form a hole-pair inside the sample, and ultimately the surface of the sample is negatively charged. When the sample surface is negatively charged, the yield of secondary electrons protruding from the surface of the sample can be largely generated. On the other hand, due to the extremely reciprocal repulsive force between the incident electrons and the secondary electrons, As shown in the figure, it is difficult to obtain a normal high-quality clear image because the image becomes brighter or the image flows. Therefore, in order to minimize this phenomenon, a conductive material such as Au or Carbon is coated with a coating of several tens of nanometers. That is, a potential difference between a cathode target (Au, Pt or Carbon) and a sample-anode is applied in a plasma atmosphere to irradiate the applied surface with a thin coating of ions of the sample on the surface of the sample So that the electron beam escapes along the grounded sample holder and the stage.

However, when such a sample coating method is applied to a liquid sample such as a gel, it is not applied to the liquid itself and thus problems are revealed. In addition, it is very difficult to observe inclusions contained in the gel and the liquid sample due to the characteristics of the scanning electron microscope equipment for observing the surface (several tens of nm) after drying and applying the liquid sample. In addition, when a sample having a size of several tens to several hundreds of nm is to be observed, the applied thickness greatly affects the measurement error, and therefore, there is a great need to overcome the problem.

In order to overcome the problem of the above coating method, a method of applying an acceleration voltage lowering to several KV in an SEM without applying a coating is used, or a low vacuum SEM (Low Vacuum SEM) is a typical solution for reducing an electrification phenomenon have. When these methods irradiate the sample with the electron beam with low acceleration voltage, the electrons of the irradiated electrons collide with each other more than the secondary electron, which is mainly used in the SEM, and capture and emit primary electrons. Therefore, it is a principle to minimize the charging phenomenon. In addition, a low-vacuum SEM is a principle in which a small amount of inert gas is introduced into a sample analysis chamber and ions generated due to collision with incident electrons are neutralized by reacting with charged electrons on the surface of the sample. However, such a low-acceleration voltage application method and a low-vacuum SEM method are difficult to observe at a high magnification due to a low resolution, and in particular, in a low-vacuum SEM mode, resolution decreases suddenly as the degree of vacuum decreases, There are limits to observation.

Therefore, it is not an alternative for the solution of biology and organic matter observation. In addition, low - vacuum SEM requires more than tens of millions of won to install and manufacture. Therefore, the charging effect has been regarded as a weak point of SEM which implements high resolution and high magnification image analysis and measurement. The above charging phenomenon is a problem to be solved because the image appears blurred or the image itself, which is realized by the secondary electrons collected by the detector, flows. In addition, as the packing density of the industrial structure increases rapidly, the importance and demand for measurement and analysis of fine samples are increasing, and alternatives to observe SEM without "coating" .

Korean Patent Laid-Open Publication No. 10-1999-0086239 (SAMPLE ANALYZER AND DRIVE METHOD WITH SCANNING ELECTRON MICROSCOPE)

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide an image-realizing device of an image-transferring microscope capable of observing an organic material such as a gel or the like, have.

According to an aspect of the present invention, there is provided an imaging apparatus for a scanning electron microscope comprising: a sample holder installed on a stage in a sample analysis chamber; A fine mesh member disposed at an electron beam transmission position on the upper portion of the sample holder and having microvoids to which the sample is attached; A cover member for fixing the fine mesh member to the upper portion of the sample holder; A transmission electron reflecting member installed at a lower portion of the fine mesh member of the sample holder and reflecting the electrons transmitted through the fine mesh member to a detector provided in the sample analysis chamber; And a fine aperture stop provided in the sample holder to be positioned below the fine mesh member to prevent diffusion of an electron beam passing through the fine mesh member.

Also, the sample holder may include: a base portion that is seated on an upper portion of the stage; A vertical wall portion extending upward from one side of the base portion; And a sample mounting portion extending to face the base portion at an upper portion of the vertical wall portion, wherein a coupling hole through which the transmission electron reflecting member is inserted is coupled to the base portion, and the sample mounting portion is provided with a micro- And a through hole through which the electron beam passes is preferably formed.

In addition, a coupling positioning groove for determining a coupling position of the transmission electron reflecting member is formed in an inner periphery of a coupling hole formed in the base portion, and a coupling height adjusting groove for limiting a coupling height of the transmitting electromagnetic reflecting member is formed in the coupling positioning groove. .

In addition, the sample mounting part may be formed on the upper surface of the sample mounting part so as to protrude to a predetermined height in a circular column shape, and the cover member may be coupled to the upper part of the sample mounting part to fix the fine mesh member placed on the sample mounting part.

The transmission electron reflecting member may have a positioning protrusion formed on an outer side of a coupling portion that is fitted to and engaged with a coupling hole of the base portion and corresponds to the positioning groove, It is preferable that a reflection surface formed by coating a gold (Au) thin film on the surface is formed.

The fine mesh member may be formed of a conductive material containing nickel (Ni), iron (Fe), and copper (Cu) and having a fine mesh (500 to 2000 mesh) A nano-conductor fine powder sample can be applied by thinly coating.

The fine mesh member may be formed to have conductivity by plated with gold or carbon to a thickness of several tens to 100 nm.

In addition, prior to applying the liquid sample or the non-conductive fine powder sample to the fine mesh member, viscous and conductive glycerin is applied to the fine mesh member to adhere the weakly viscous liquid and fine powder and the sample to the mesh member &Lt; RTI ID = 0.0 >

According to the imaging apparatus of the scanning electron microscope according to the embodiment of the present invention, it is possible to observe the organic matter such as the liquid and the fine powder such as the gel with high resolution without coating treatment.

Particularly, a liquid sample or a powder sample is thinly coated on or adhered to a fine mesh member, and the electron beam is scanned to reduce the charging phenomenon in the sample, and a clearer There is an advantage that the image can be acquired.

FIG. 1 is an image showing the effect of the charging effect on the scanning electron microscope image.
FIG. 2 is a schematic diagram showing an imaging apparatus of a scanning electron microscope according to an embodiment of the present invention.
FIG. 3A is an exploded cross-sectional view of the imaging device shown in FIG. 2. FIG.
3B is an assembled perspective view of the imaging implement shown in FIG.
4A is a diagram showing a principle of a transmission image mode of an electron beam.
4B is a view for explaining a combining mode of a transmission electron beam image and a secondary electron beam image.
FIG. 4C is a diagram illustrating a secondary electronic image mode photographed at a high magnification using the image implementing apparatus of the present invention without charging. FIG.
4D is a schematic view for explaining generation of secondary electrons and transmission electrons by electron beams in the fine mesh member.
5A is a view showing a state in which a liquid sample is applied to a fine mesh member.
FIG. 5B is an enlarged view of arrows in FIG. 5A. FIG.
6A is a diagram showing a picture mode by charging phenomenon in a general scanning electron microscope.
FIG. 6B is a diagram illustrating a transmission electronic image mode using the image implementing apparatus of the present invention.
6C is an image obtained by synthesizing transmission electrons and secondary electrons.
FIG. 7 is a diagram showing an image (a) obtained by using a general scanning electron microscope and an image (b) obtained by using a microscope to which an image implementing apparatus according to an embodiment of the present invention is applied.

Hereinafter, a scanning electron microscope according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIGS. 2 to 4D, an imaging apparatus 100 of a scanning electron microscope according to an embodiment of the present invention is installed in a sample analysis chamber 10 of a scanning electron microscope and is irradiated from an electron gun (not shown) And implements the image of the sample by the electron beam 21 converged while passing through the barrel 20.

The scanning electron microscope imaging apparatus 100 includes a sample holder 110 installed on a stage in a sample analysis chamber 10 and a sample holder 110 disposed at an electron beam transmission position on the sample holder 110, A cover member 130 for fixing the fine mesh member 120 to the upper portion of the sample holder 110 and a cover member 130 for fixing the fine mesh member 120 of the sample holder 110, A transmission electron reflecting member 140 installed at a lower portion of the fine mesh member 120 for reflecting the electrons transmitted through the sample attached to the fine mesh member 120 to the detector 40, And has a fine diaphragm 150.

The sample holder 110 includes a base part 111 which is mounted on an upper part of the stage 30 and a vertical wall part 112 extending upward from one side of the base part 111 and a vertical wall part 112 And a sample mounting part 113 extending from the upper part to face the base part 111. A coupling hole 114 through which the transmission electron reflecting member 140 is inserted is formed in the base portion 111. A coupling positioning groove 114a for determining the coupling position of the transmission electron reflecting member 140 is formed on the inner circumference of the coupling hole 114 and a coupling positioning groove 114a for positioning the transmission electron reflecting member 140 is formed on the lower end of the coupling positioning groove 114a. And a locking protrusion 114b for limiting the coupling height is formed.

A through hole 115 is formed in a portion of the sample mounting part 113 corresponding to the center of the coupling hole 114 of the base part 111 so that electrons transmitted through the sample are inserted into the coupling hole 114, To the reflective member 140. The sample mounting part 116 is formed on the upper surface of the sample mounting part 113 at a periphery of the through hole 115 so as to protrude a predetermined height in a circular column shape. The through hole 115 is formed coaxially with the sample holder 116, and the fine mesh member 120 is seated on the upper end.

The fine mesh member 120 can be stably fixed by the cover member 130 while the fine mesh member 120 is placed on the sample mounting portion 116 so as to cover the through hole 115 . A through hole 131 is formed at the center of the cover member 130 so that an electron beam focused at the center can pass through the cover member 130. The cover member 130 is inserted into the cover member 130 so as to surround the outside of the sample mounting portion 116. The cover member 130 is threaded on the inner periphery of the sample holder portion 116 and threaded on the outer periphery of the sample holder portion 116 so as to be screwed to each other.

In addition, a fine diaphragm 150 having a fine hole is inserted and coupled in the through hole 115. The fine iris 150 is provided to prevent the electron beam transmitted through the fine mesh member 120 from diffusing. The electron beam passing through the fine iris 150 is guided to the transmission electron reflecting member 140.

As shown in FIGS. 5A and 5B, the fine mesh member 120 has a fine mesh (500 to 2000 mesh) structure in which micro-pores are formed. Examples of the fine mesh member 120 include Ni, Fe, And may be formed in a fine mesh structure so as to have a gap of several tens of microns with a conductive material such as copper (Cu). A liquid sample such as a gel or a non-conductive fine powder sample can be thinly applied to the fine mesh member 120 having such a structure. 5, the specimen is pretreated so that a mucous membrane is formed on the gap of the fine mesh member 120, and then the specimen is placed on the specimen holder 116 so as to be positioned above the fine iris 120, (130) are coupled and stably fixed. By using the fine mesh member 120 having micro pores in this way, it is possible to maintain the gel, the liquid sample, or the powdery sample in a thin state, and by holding it in the conductive fine mesh member 120, The " charging effect " can be remarkably lowered even when the electron beam is scanned for analysis.

In addition, metallic fine mesh members can be fabricated by plating thick (several tens to 100 nm) conductive gold or carbon with an ion coating apparatus used for sample preparation in SEM in a fine mesh sachet.

8, in order to observe a large-sized nonconductor sample such as an LCD and a solar cell, a soft mesh cloth thickly coated with a conductive material such as gold or carbon on the surface of the nonconductor sample is used as a fine mesh member After making a desired size, a certain part or whole of the sample is tightly tightened on the surface of the sample, and the mesh cloth is connected to the ground so that the electron beam accumulates on the surface of the sample and is discharged without passing through the mesh net. It can also be applied as an observation application technology.

In addition, a viscous liquid sample can be prepared by applying a sample onto a mesh member (mesh). Conversely, in the case of a liquid sample having no viscosity, a conductive liquid glycerin may be first applied to the mesh member in a thin state, and a liquid sample may be applied thereon to prepare a sample. As described above, it is possible to easily prepare and observe a sample by using a method of attaching nano powder or particles using conductive glycerin.

The transmission electron reflecting member 140 reflects the transmitted electrons passing through the fine mesh member 120 and passed through the fine iris 150 toward the detector 40. A positioning protrusion 142 corresponding to the positioning recess 114 protrudes outward from a coupling portion 141 of the transmission electron reflecting member 140 which is inserted into the coupling hole 114 of the base 111, . An upper end of the transmission electron reflecting member 140 is formed to be inclined so as to reflect the transmitting electrons to the detector 40. A reflection surface 143 formed by coating a gold (Au) thin film on the surface is formed. According to the above configuration, the electron beam converged at the barrel 20 and irradiated to the fine mesh member 120 is irradiated to the sample coated on the fine mesh member 120, so that secondary electrons are generated and collected by the detector 40 . Then, the electron beams transmitted through the fine mesh member 120, that is, the transmitted primary electrons and secondary electrons, are reflected by the reflecting surface 143 and directed to the detector 40.

Therefore, the detector 40 can capture the secondary electrons E1 generated by irradiating the sample with the electron beam, thereby realizing the secondary electron image. The reflected electrons E2 reflected from the reflecting surface 143 are collected, Electronic images can be simultaneously implemented. Then, the secondary electronic image and the reflection electronic image are synthesized to obtain a more accurate one image. That is, according to the image implementing apparatus of the present invention, as shown in FIGS. 6A to 6C, three types of images can be implemented. FIG. 6A is a secondary electron image mode realized in a general scanning electron microscope, FIG. 6B is a transmission electron image mode, and FIG. 6C is a mode in which a secondary electron and a transmission electron image are combined.

FIG. 7A is a photograph of a sample observed with a general scanning electron microscope, and FIG. 7B is a photograph showing an image of a sample observed using an image-realizing device of the present invention.

Therefore, if the sample is too thick to transmit the secondary electrons, the image of the secondary electron (E1) appears. In the case of thin liquid sample, the image characteristic of the reflecting electron (E2) becomes stronger. In addition, in the high magnification image, sample processing by the mesh 2000 is maintained in the sample processing.

4A and 4B show the principle of realizing an electron microscope image without an ionization locus and an electrification phenomenon of an electron beam. FIG. 4A is a view showing the principle of generation of a transmission image mode transmitted through the fine mesh member 120, and FIG. (Reflection electron) image and a secondary electron image in a composite mode. And FIG. 4C is a diagram showing a secondary electronic image mode (Charge-up Reduction) photographed at a high magnification by applying the image implementing apparatus of the present invention without charging.

In the meantime, as in the present invention, it is important to thinly pre-treat gel-like, liquid-like, and powder-like specimens of the fine mesh member 120 while being non-conductive to allow the ionization trajectory to pass therethrough. A method of thinly pretreating a sample can be carried out as follows.

That is, a method of treating the gel or the liquid sample in a form of being rubbed on the fine mesh member 120 may be applied. In the case of the fine powder, a method of spraying a small amount of the fine powder onto the fine mesh member 120 using a spray adhesive, and then powdering the powder in a state of being thinly spread with the blade is buried in the fine mesh member 120 . Such a manufacturing method is very easy to apply the technique of the present invention because it is very easy to process thinly when the viscosity is high like gel.

That is, a gel or a powder is applied to the gap between the fine mesh members 120 in the same manner as described above, and the liquid sample having a low viscosity is applied to the fine mesh member 120 in a liquid phase If it is buried and dried, it can be applied because it can adhere to the voids in the mesh even under vacuum. Therefore, the sample to be processed through the preprocessing process has a region through which the electron beam can pass. When the sample preprocessed to enable such transmission is mounted on the image-realizing device of the present invention and observed with an SEM, the image can be observed freely from the charging effect in a specific region as shown in FIG. In addition, when the sample is formed to be somewhat thick, it is difficult to observe a direct transmission image in which electrons pass through the sample. However, in a situation where the sample to be observed is exposed on the surface, the ionization locus (Transmission & Scanning Electron Microscope (hereinafter referred to as " TSEM ") in which a high magnification secondary electron and a transmitted secondary electron (reflection electron) are synthesized by substantially minimizing the charging phenomenon, ) Can be obtained. As shown in FIG. 4, the synthesized so-called TSEM image can minimize the charging effect and has excellent contrast such as TEM. As a result, the organic material sample has high resolution and high resolution according to the high acceleration voltage (40 KeV) It is possible to secure a high-magnification image. In addition, even if the mesh is not formed on the meshes in the fine mesh member 120 in the sample pretreatment process, the ionization locus is connected to the conductive fine mesh member 120, So that it is possible to observe the image with only the secondary electrons while minimizing the charging phenomenon. FIG. 4c is a graph showing the results of a TSEM image obtained by synthesizing a secondary electron image and a transmitted secondary electron (reflection electron) image while minimizing a charging phenomenon in a liquid gel and a fine powder sample by applying the technique of the present invention This is an example of a case in which a high-magnification image is obtained while minimizing the effect of the image as an image showing an experiment. It is proved that the SEM image can be taken without coating at a high resolution through the application example of the patented technique.

Specifically, as shown in FIGS. 4A and 4B, the electron beam incident on the sample undergoes an ionization process causing many collisions in the sample. Therefore, if the sample thickness is small or small, the ionization trajectory can minimize the charging phenomenon because electrons can escape to the vacuum phase. Generally, in the case of a thick non-conductor, since the electron beam can not escape to the outside when irradiated, the charge accumulates in the sample, and thus a charging phenomenon occurs. The ionization collision locus inside the sample is as follows.

Where H is the penetration depth of the ionization locus,

A: atomic weight, g mol-1

z: atomic number

ρ: density, g ㎤

In the present invention, the ionization collision locus of electrons shows a large difference depending on the material. However, in the case of a sample of an organic material composed of carbon (C), hydrogen (H) and oxygen (O) And it is possible to transmit the sample through a thin pretreatment. In the case of the fine powder, since most of the fine powder has a size of less than nm or several um, it can easily escape through the vacuum or grounded fine mesh member 120 even if direct permeation is not performed. Therefore, It is possible to observe the sample at the optimum electron beam resolution and high magnification of the voltage state. Generally, a transmission electron microscope (TEM) is a method of irradiating an electron beam and observing the sample directly. Such a transmission electron microscope is advantageous in that it can obtain an ultrahigh-resolution and high-magnification transmission image by applying an acceleration voltage of 200 keV or more to ensure transparency and pretreating a metallic sample thinly. However, the transmission electron microscope is a high-priced device of billions of units, and it is necessary to have a series of devices for thinly pre-treating the sample, and there is a disadvantage in that it requires specialization in sample production. Therefore, the technology itself is not universalized, There is a disadvantage that it can not be done. However, when the image-realizing device of the present invention is applied, the secondary electron and the transmitted secondary electron image can be easily observed by applying to the liquid phase and the fine powder.

According to the image implementing apparatus 100 of the present invention as described above, the following operational effects can be expected.

That is, the present invention maximizes the ionization locus of the electron beam to a depth trajectory using a high-acceleration voltage so as to optimize the resolution so as to minimize the charging phenomenon, It is possible to observe the sample with a high resolution and a high magnification by causing it to escape to the fine mesh member 120. Particularly, in the case of liquid and fine powder samples, since the thickness can be kept thin enough so that the electron beam is not accumulated within the area to be scanned, the image can be observed by minimizing the charging effect. That is, the electron beam to be scanned is made thin so as not to be charged around the target in addition to the shape of the fine sample to be observed, so that the ionization locus is formed between the mesh member 120 and the vacuum- So that a high resolution / high magnification image can be realized. Accordingly, the transmitted secondary electrons are reflected by the transmission electron reflecting member 140, so that a transmission electron (reflection electron) image can be obtained at the same time in addition to the conventional secondary electron image. In addition, even if it is difficult to implement the direct transmission image as a result of the sample processing, it is possible to realize the secondary image and the transmission secondary image by the ionization trajectory, which has the advantage of securing a clear image at a high magnification without charging.

In addition, the present invention can be applied to liquid and fine powder, and it is possible to realize a high resolution and high magnification SEM image by minimizing the charging effect, and the TSEM image can be applied to a gel or fine The image of the powder can be observed by minimizing the charging phenomenon by using the ionization locus of the electron beam. That is, it has an advantage that the image of excellent contrast and sharpness possessed by the transmission image and observation at high magnification and high acceleration voltage are easy. Therefore, it is advantageous to realize a clear image by increasing the resolution.

In addition, since a composite image of a secondary electron image and a transmitted secondary electron (reflection electron) image can be obtained at the same time by one sample preparation process, it can be applied as a very useful method for image analysis. In other words, it has the advantage of diversifying the sample analysis from the viewpoint of the secondary electron image mode for observing the surface, the characteristic of the transmitted image and the image which is synthesized at the same time. Moreover, it can maintain the advantage of performance implementation that realistically observes at high magnification, while it does not incur a cost burden on implementation method.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Those skilled in the art will readily appreciate that many modifications and variations of the present invention are possible without departing from the spirit and scope of the appended claims.

10. Sample Analysis Chamber 20. Barrel
110 .. Sample holder
120 .. Fine mesh member (or fine mesh coated with gold)
130. Cover member 140. Transmission electron reflecting member

Claims

A sample holder installed on a stage in a sample analysis chamber;
A fine mesh member disposed at an electron beam transmission position on the upper portion of the sample holder and having a void to which a sample is attached;
A cover member for fixing the fine mesh member to the upper portion of the sample holder;
A transmission electron reflecting member installed at a lower portion of the fine mesh member of the sample holder and reflecting the electrons transmitted through the fine mesh member to a detector provided in the sample analysis chamber; And
And a fine aperture stop provided in the sample holder so as to be positioned below the fine mesh member to prevent diffusion of an electron beam passing through the fine mesh member,
The sample holder
A base portion mounted on an upper portion of the stage;
A vertical wall portion extending upward from one side of the base portion; And
And a sample mounting part extending from the upper part of the vertical wall part to face the base part,
A through hole through which the electron beam passes is formed in the sample mounting part, and the through hole through which the electron beam passes is formed in the sample mounting part,
An engaging hole for determining a engaging position of the transmitting electron reflecting member is formed on the inner periphery of the engaging hole formed in the base portion,
Wherein the coupling position determining groove is formed with a latching protrusion for restricting a coupling height of the transmission electron reflecting member.

delete

A sample holder installed on a stage in a sample analysis chamber;
A fine mesh member disposed at an electron beam transmission position on the upper portion of the sample holder and having a void to which a sample is attached;
A cover member for fixing the fine mesh member to the upper portion of the sample holder;
A transmission electron reflecting member installed at a lower portion of the fine mesh member of the sample holder and reflecting the electrons transmitted through the fine mesh member to a detector provided in the sample analysis chamber; And
And a fine aperture stop provided in the sample holder so as to be positioned below the fine mesh member to prevent diffusion of an electron beam passing through the fine mesh member,
The sample holder
A base portion mounted on an upper portion of the stage;
A vertical wall portion extending upward from one side of the base portion; And
And a sample mounting part extending from the upper part of the vertical wall part to face the base part,
A sample mounting part is formed on an upper surface of the sample mounting part so as to protrude to a predetermined height in a circular column shape,
Wherein the cover member is coupled to an upper portion of the sample mounting portion to fix the fine mesh member placed on the sample mounting portion.

A sample holder installed on a stage in a sample analysis chamber;
A fine mesh member disposed at an electron beam transmission position on the upper portion of the sample holder and having a void to which a sample is attached;
A cover member for fixing the fine mesh member to the upper portion of the sample holder;
A transmission electron reflecting member installed at a lower portion of the fine mesh member of the sample holder and reflecting the electrons transmitted through the fine mesh member to a detector provided in the sample analysis chamber; And
And a fine aperture stop provided in the sample holder so as to be positioned below the fine mesh member to prevent diffusion of an electron beam passing through the fine mesh member,
The sample holder
A base portion mounted on an upper portion of the stage;
A vertical wall portion extending upward from one side of the base portion; And
And a sample mounting part extending from the upper part of the vertical wall part to face the base part,
Wherein the transmission electron reflecting member has a positioning protrusion protruding from an outer side of an engaging portion of the transmitting electron reflecting member,
Wherein an upper surface of the transmission electron reflecting member is inclined to reflect transmitted electrons to the detector, and a reflective surface formed by coating a gold (Au) thin film on the surface of the transmitting electron reflecting member is formed.

The method according to any one of claims 1, 4, and 5,
The fine mesh member is formed of a conductive material containing nickel (Ni), iron (Fe), and copper (Cu) and has a fine mesh (500 to 2000 mesh) Wherein the sample can be applied and adhered.

The method according to any one of claims 1, 4, and 5,
Wherein the fine mesh member is formed to have conductivity by plating gold or carbon to a thickness of several tens to 100 nm on a fine mesh sieve.

The method according to claim 6,
Characterized in that glycerin having viscosity and conductivity is applied to the fine mesh member so as to adhere the viscous liquid, powder, sample and the like to the mesh member before applying the liquid sample or the non-conductive powder sample to the fine mesh member Imaging device for scanning electron microscope.