KR101475455B1 - Electronic device having a heat radiating structure, Its method and a heat radiating structure having a heat radiation computer - Google Patents

Electronic device having a heat radiating structure, Its method and a heat radiating structure having a heat radiation computer Download PDF

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Publication number
KR101475455B1
KR101475455B1 KR20130164120A KR20130164120A KR101475455B1 KR 101475455 B1 KR101475455 B1 KR 101475455B1 KR 20130164120 A KR20130164120 A KR 20130164120A KR 20130164120 A KR20130164120 A KR 20130164120A KR 101475455 B1 KR101475455 B1 KR 101475455B1
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KR
South Korea
Prior art keywords
heat
heat sink
electronic component
cooling fan
frame
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Application number
KR20130164120A
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Korean (ko)
Inventor
오갑석
권영일
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동명대학교산학협력단
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Priority to KR20130164120A priority Critical patent/KR101475455B1/en
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Publication of KR101475455B1 publication Critical patent/KR101475455B1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention provides an electronic device having a heat dissipating structure, a heat dissipating method thereof, and a computer having a heat dissipating structure. And a heat radiating plate 15 installed in the frame 11 to remove the heat of the electronic component 13 from which heat is generated. The heat radiating plate 15 has a predetermined angle from the bottom of the frame 11. The heat radiating plate 15 can be installed on the electronic component 13 to remove heat generated by the electronic component 13 with a slope similar to that of the electronic component 13. [

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a heat dissipation structure, a heat dissipation method thereof, and a computer having a heat dissipation structure,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a heat dissipating structure, a heat dissipating method thereof, and a computer having the heat dissipating structure, and more particularly to an electronic device having a heat dissipating structure, And a computer having a heat dissipation structure.

In general, a heat sink is a metal device that draws heat to the air by pulling out heat with a pin protruding from the side to prevent heat transfer from the device, and has good thermal conductivity and has a wide surface area to facilitate heat exchange.

In this connection, Korean Patent Laid-Open Publication No. 10-2001-0026307 entitled "Heat sink of CPU cooling structure" relates to a heat sink of a CPU cooling structure, in which an upper surface of a base portion 22 A plurality of heat dissipating grooves 25 are formed on the convex surface 24 of the upper portion of the base 22 so as to maximize the heat dissipation area of the heat dissipating protrusions 27, And a heat-radiating plate 21 on which a portion 28 is further formed. Therefore, the cross-sectional area of the base 22 is increased by the convex portion, so that the heat can be absorbed by the CPU 3 as much as it is, and a large number of heat dissipating grooves 25 and heat dissipating protrusions 27 ), The heat radiation area contacting the atmosphere is maximized by the expansion parts 28 on both sides, and the CPU 3 reliably releases a large amount of heat absorbed in the base.

Korean Utility Model Publication No. 1999-0041018, entitled "Heat sink of a central processing unit (CPU) cooling apparatus ", includes a main plate installed inside a computer housing, a central processing unit installed on the main plate, And a heat radiating plate connected to the heat absorbing plate by a pipe and provided outside the computer housing. The heat radiating plate includes a first member and a second member, A body having a groove formed in a predetermined path and having a refrigerant inlet end and a refrigerant outlet end so that the refrigerant is circulated on the inner side of any one of the first and second members; And a second nipple for discharging the refrigerant introduced into the body from the first nipple. The heat sink of the cooling unit for cooling the central processing unit (CPU) of the computer system has a groove of a predetermined path which the refrigerant distribution suggests a technique for forming the interior of the heat sink.

Korean Utility Model Publication No. 20-0255849 entitled "Cooling Unit of Central Processing Unit" is a central processing unit for quickly releasing heat generated by a central processing unit and facilitating operation of the central processing unit The generated heat is transferred to the sink pad and the heat radiating fins and forcedly cooled by the cooling fan to quickly lower the temperature of the CPU. In addition, the present invention relates to a cooling device of a general central processing unit (CPU) A sink pad is coupled to a central processing unit, a heat radiating fin formed by bending a plurality of times is coupled to the heat sink, and a cooling fan is installed on a top of a lid having a through hole covering the heat radiating fin.

Korean Utility Model Publication No. 20-0188874 entitled "Heat Sink of Central Processing Unit" is characterized in that a step portion and a projecting step are formed on the lower side of the heat sink so that the heat sink can be installed at an accurate mounting position of the CPU board, It is possible to quickly and easily combine the heat sink 50 and the CPU board 80 due to the prevention of the flow of the heat sink 50 and to tightly connect the heat sink 50 and the CPU board 80 at an accurate coupling position.

Such a conventional technology is a system for releasing heat by allowing a refrigerant to flow to quickly discharge generated heat, forming a projection on the fin, and maintaining a close relationship with the cooling fan. There is a problem in that a high manufacturing cost is incurred in the constitution of the parts to be applied for the complicated and tight maintenance of the manufacturing.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in order to solve the problems of the related art, and it is an object of the present invention to provide a new type of heat dissipation structure for increasing the heat dissipation efficiency by giving a certain slope to the heat dissipating electronic component, And a computer having the heat radiation structure and the heat dissipation structure thereof.

According to an aspect of the present invention for achieving the above-mentioned object, An electronic component installed inside the frame and generating heat; A heat sink for removing heat of the electronic component; The heat sink may have a slope with a certain angle from the bottom of the frame.

In the electronic device having the heat dissipating structure according to the present invention, the heat dissipating method and the computer having the heat dissipating structure, the heat dissipating plate is installed on the electronic component, and has a slope like the electronic component, can do.

According to an aspect of the present invention for achieving the above object, there is provided an electronic device including: an electronic component to which heat is generated; and a heat sink for dissipating heat to the outside are connected to the electronic component and the heat sink is installed to be inclined relative to the bottom surface, .

According to an aspect of the present invention for achieving the above-mentioned object, A main board installed inside the computer main body casing; And a heat sink for removing heat from the central processing unit installed in the main board, The main board may have a predetermined angle from the bottom of the computer main body.

In the electronic device having the heat dissipating structure, the heat dissipating method thereof, and the computer having the heat dissipating structure according to the present invention, the heat dissipating plate is installed on the central processing unit and has a slope like the main board, Can be removed.

According to the electronic device, the heat dissipating method, and the computer having the heat dissipating structure according to the present invention, the heat dissipation efficiency can be improved by giving a certain gradient to the electronic component that generates heat and the heat dissipating plate provided on the electronic component, .

1 is a view showing an electronic device having a heat dissipation structure according to a technical idea of the present invention;
2 illustrates a computer having a heat dissipation structure according to a first preferred embodiment of the present invention;
3 illustrates an electronic device having a horizontal heat dissipation structure according to a second preferred embodiment of the present invention;
4 illustrates an electronic device having a vertical heat dissipation structure according to a second embodiment of the present invention;
5 is a view showing an electronic device having an inclined heat radiating structure according to a second preferred embodiment of the present invention;
FIG. 6 is a graph showing values of heat sink temperature measured through an electronic device having a horizontal heat dissipation structure according to a second preferred embodiment of the present invention; FIG.
FIG. 7 is a graph showing values of heat sink temperature measured through an electronic device having a vertical heat dissipation structure according to a second preferred embodiment of the present invention; FIG.
FIG. 8 is a graph showing values of heat sink temperature measured through an electronic device having an inclined heat radiating structure according to a second preferred embodiment of the present invention.

1 is a view showing an electronic device 10 having a heat dissipation structure according to the technical idea of the present invention.

1, a heat sink 15 is installed inside the frame 11 to remove the heat of the electronic component 13 from which heat is generated. The heat sink 15 has a certain angle from the bottom of the frame 11 It has a slope. The heat radiating plate 15 can be installed on the electronic component 13 to remove heat generated by the electronic component 13 with a slope similar to that of the electronic component 13. [

The frame 11 according to the present invention can accommodate various electronic components 13 and can have various structures. Further, the electronic component 13 to which the heat sink 15 of the present invention is installed may be a component to be applied to a refrigerator, a computer, or the like as the electronic component 13 that emits heat. The heat radiating plate 15 has a certain angle from the bottom of the frame 11 and may include a plurality of pins.

The electronic device 10 having such a heat dissipating structure may have a certain angle from the bottom so that when it comes into contact with air, the heat radiation efficiency can be made higher than that of the heat sink 15 of the same volume having a conventional structure.

On the other hand, the electronic device 10 having a heat dissipating structure has a structure in which the electronic component 13 in which heat is generated and the heat sink 15 for dissipating heat to the outside are connected to the electronic component 13 and the heat sink 15 is mounted on the bottom surface A heat dissipation method of an electronic device for allowing the heat dissipation to be performed by inclining the heat dissipating member to the heat dissipating member can be used.

The heat dissipating method of the electronic device is a method of increasing the heat radiation efficiency by providing a slope so that heat can be efficiently dissipated through heat dissipation through the heat dissipating plate 15. In this case, an organic operation method of the heat dissipating plate 15 and the electronic component 13 And the detailed description thereof will be omitted.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. It should be noted that, in the drawings, the heat dissipation plate easily manufactured from the prior art, the connection method of the heat dissipation plate and the electronic component, and the related art in which the heat dissipation plate discharges heat through the heat dissipation fin, The details of the present invention will be apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG.

2 is a view showing a computer having a heat radiation structure according to a first preferred embodiment of the present invention.

2, a computer 20 having a heat dissipating structure includes a main board 23 installed inside a computer main body casing 21, and a heat of the central processing unit 25 installed on the main board 23 And the main board 23 has a slope at a predetermined angle from the bottom 22 of the computer main body. At this time, the heat dissipating plate 27 is installed on the central processing unit 25 and removes heat generated in the central processing unit 25 with a slope as the main board 23.

The computer main body casing 21 and the main board 23 of the computer 20 having the heat dissipating structure according to the preferred embodiment of the present invention are constituted by a casing capable of accommodating a main body including a main computer main board and a main computer board do.

The main board 23 is installed at a predetermined angle from the bottom 22 of the main body casing 21 and the heat sink 27 is installed on the inclined main board 23 and the auxiliary cooling fan 29 ' Respectively.

The heat dissipating plate 27 is a heat dissipating plate for dissipating the heat of the general computer central processing unit 25 and is not limited in its form and can be mounted on the heat dissipating plate 27 in the form of an auxiliary cooling fan 29 ' .

The cooling fan 29 is installed on the side of the inclined side of the heat radiating plate 27 and is installed horizontally with the radiating fin of the heat radiating plate 27.

As described above, when the main board 23 of the ordinary computer has a certain angle from the floor, the heat radiation efficiency is improved more than that of the heat sink 27 of the same volume having a normal structure when it comes into contact with air through the cooling fan 29 You can increase it.

FIGS. 3 to 8 illustrate an electronic device having a horizontal, vertical, and tilting structure according to a second preferred embodiment of the present invention, and show temperature values of a heat sink of the electronic device.

3 to 5 illustrate an embodiment in which the heat radiating plate 27 is horizontally, vertically, or inclined. FIG. 3 shows a heat radiating plate 27 horizontally disposed with the cooling fan 29, 27 are installed perpendicular to the cooling fan 29, and FIG. 5 is a view showing that the heat sink 27 is inclined. At this time, the cooling fan 29 shown in Fig. 5 is installed on the side of the heat sink 27 where the inclination is high.

6 to 8 are graphs showing values of heat sink temperature measured through an electronic device having a horizontal, vertical, and inclined heat radiating structure. At this time, the value of the experiment is the data measured for each 50 minutes in the state that 700 W of load resistance is attached to the heat sink 27 and power of 700 W is applied.

The red solid lines in Figs. 6 to 8 indicate the atmospheric temperature and the blue solid line indicates the heat sink temperature. 6 and 7, it is found that the temperature of the heat sink 27 is higher than the temperature of the heat sink 27 placed vertically to the cooling fan 29. [ This is because the heat dissipation speed of the heat dissipation fin is perpendicular to the direction in which the heat dissipation pin is opposed to the cooling fan 29, and thus the above result can be confirmed.

6 and 7 are compared with FIG. 8, it can be seen that the heat sink temperature of FIG. 8 is lower by about 3 to 4 degrees than the heat sink temperature of FIGS. As a result of such experiment, when the heat sink 27 has a slope, when it comes into contact with the air, the heat radiation efficiency can be further increased as compared with the heat sink 27 having the same volume.

Although the electronic device having the heat dissipation structure according to the preferred embodiment of the present invention, the heat dissipation method thereof, and the computer having the heat dissipation structure have been described above with reference to the above description and drawings, It will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit of the invention.

10: electronic device 11: frame
13: Electronic component 15: Heat sink
20: Computer having a heat radiating structure 21: Casing
22: Bottom 23: Motherboard
25: central processing unit 27: heat sink
29: cooling fan 29 ': auxiliary cooling fan

Claims (5)

A frame;
An electronic component installed inside the frame and generating heat;
A heat sink for removing heat of the electronic component;
Further comprising an auxiliary cooling fan over the heat sink,
Further comprising a cooling fan provided on one side of the frame and having a slope of the heat sink, the cooling fan being provided in a horizontal direction with respect to the heat sink fin of the heat sink,
Wherein the heat sink has a heat radiating structure for increasing the cooling efficiency by having a certain angle from the bottom of the frame.
The method according to claim 1,
Wherein the heat sink is disposed on the electronic component and has a slope similar to the electronic component to remove heat generated in the electronic component.
A heat radiating plate for radiating heat to the outside of the electronic component in which heat is generated is connected and an auxiliary cooling fan is installed on the heat radiating plate and is installed in a frame on one side of the inclination of the heat radiating plate, Wherein a cooling fan is installed and the heat radiating plate is installed so as to be inclined with respect to the bottom of the frame so that heat radiation is performed.
A computer body casing;
A main board installed inside the computer main body casing;
And a heat sink for removing heat from the central processing unit installed in the main board,
Further comprising an auxiliary cooling fan over the heat sink,
Further comprising a cooling fan provided on a side of the main body casing having a slope of the heat sink and provided in a horizontal direction with the heat sink fin of the heat sink,
Wherein the main board has a heat dissipation structure for increasing the cooling efficiency by having a predetermined angle from the bottom of the computer body.
5. The method of claim 4,
Wherein the heat dissipation plate is installed on the central processing unit and has a slope similar to that of the main board to remove heat generated in the central processing unit.
KR20130164120A 2013-12-26 2013-12-26 Electronic device having a heat radiating structure, Its method and a heat radiating structure having a heat radiation computer KR101475455B1 (en)

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KR20130164120A KR101475455B1 (en) 2013-12-26 2013-12-26 Electronic device having a heat radiating structure, Its method and a heat radiating structure having a heat radiation computer

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KR20130164120A KR101475455B1 (en) 2013-12-26 2013-12-26 Electronic device having a heat radiating structure, Its method and a heat radiating structure having a heat radiation computer

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000078049A (en) * 1998-08-28 2000-03-14 Hitachi Ltd Radio equipment for indoor installation
KR20060087096A (en) * 2005-01-28 2006-08-02 삼성에스디아이 주식회사 Radiation structure of an intelligent power module and a plasma display device with the same structure
JP4679643B2 (en) * 2006-07-04 2011-04-27 富士通株式会社 Radiation unit, radiator and electronic device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000078049A (en) * 1998-08-28 2000-03-14 Hitachi Ltd Radio equipment for indoor installation
KR20060087096A (en) * 2005-01-28 2006-08-02 삼성에스디아이 주식회사 Radiation structure of an intelligent power module and a plasma display device with the same structure
JP4679643B2 (en) * 2006-07-04 2011-04-27 富士通株式会社 Radiation unit, radiator and electronic device

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