KR101461026B1 - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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Publication number
KR101461026B1
KR101461026B1 KR20130112844A KR20130112844A KR101461026B1 KR 101461026 B1 KR101461026 B1 KR 101461026B1 KR 20130112844 A KR20130112844 A KR 20130112844A KR 20130112844 A KR20130112844 A KR 20130112844A KR 101461026 B1 KR101461026 B1 KR 101461026B1
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KR
South Korea
Prior art keywords
display device
module
user
load port
control panel
Prior art date
Application number
KR20130112844A
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Korean (ko)
Inventor
조은지
이욱
Original Assignee
피에스케이 주식회사
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Priority to KR20130112844A priority Critical patent/KR101461026B1/en
Application granted granted Critical
Publication of KR101461026B1 publication Critical patent/KR101461026B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A substrate processing apparatus is provided. A substrate processing apparatus according to an embodiment of the present invention includes a load port module (LPM) on which a FOUP storing a plurality of wafers is mounted; A wafer transfer module (EFEM, Equipment Front End Module) disposed between the load port module and a process module (PM); And a control panel unit installed at one side of the load port module and having a display device for visually confirming progress of a process carried out through a controller, The control panel unit includes a panel body on which the display device is placed; And an elevating member installed on the panel body and adjusting a height of the display device in consideration of a user's elongation condition.

Description

[0001] SUBSTRATE PROCESSING APPARATUS [0002]

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus having a display device for operation and status confirmation of equipment.

Generally, semiconductor manufacturing processes include various processes such as deposition, photo, etching, ashing, cleaning, and the like. A semiconductor manufacturing facility for such a semiconductor manufacturing process is provided with a display device for confirming the operation and status of the equipment on the front of the facility.

However, since the position of the display device provided in the existing semiconductor manufacturing facility is fixed, the following problems occur depending on the user's elongation condition.

For example, when the height of the user is small, when the user looks at the screen of the display device, he / she should watch the screen by lifting his / her head. When the height of the user is large, Not only fatigue is easily felt on the screen, but also the screen is not properly displayed depending on the angle of view.

Embodiments of the present invention are intended to provide a substrate processing apparatus in which the height and tilt of a display device are automatically adjusted according to a user's elongation condition.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a load port module (LPM) in which a FOUP storing a plurality of wafers is loaded; A wafer transfer module (EFEM, Equipment Front End Module) disposed between the load port module and a process module (PM); And a control panel unit installed at one side of the load port module and having a display device for visually confirming progress of a process carried out through a controller, The control panel unit includes a panel body on which the display device is placed; And an elevating member installed on the panel body for adjusting a height of the display device in consideration of a user's elongation condition.

The elevating member may include a guide rail installed vertically on the panel body. And a guide block installed in the display device and slidably coupled along the guide rail.

Further, the guide rails may be arranged in a pair, and the guide block may be installed at each corner of the display device.

The control panel unit may further include a tilting member for varying a tilt of the display device.

Further, the tilting member may be a cylinder.

The tilting member may be installed at each corner of the display device.

In addition, the tilting members may be installed at both ends of the guide rail.

The control panel unit may include a sensing unit for sensing a user's extension condition or an input unit for inputting a user's extension condition; And a control unit for controlling the elevating member and the tilting member according to the extension condition of the user checked by the sensing unit or the input unit.

According to the embodiments of the present invention, it is possible to provide a display panel device meeting the most optimal viewing angle and eye level from all the users using the semiconductor processing apparatus, thereby providing a work environment in which more defensive work can be performed, Can be improved.

1 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention.
2 is a front view of the substrate processing equipment shown in Fig.
3 and 4 are a front view and a side view showing the control panel unit.
5A and 5B are views illustrating a state in which a height and an inclination are adjusted according to a user's height.
6 is a view showing a modification of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view schematically showing a substrate processing facility according to an embodiment of the present invention, and FIG. 2 is a front view of the substrate processing facility shown in FIG. 1.

1 and 2, the substrate processing apparatus 10 includes a load port module (LPM) 100, a wafer transfer module 200, a process module (PM) 300, (400).

The load port module 100 is a device for loading or unloading the wafers w for processing into the wafer transfer module 200. The load port module 100 is disposed in front of a wafer transfer module 200, also referred to as an equipment front end module (EFEM).

The load port module 100 includes a load port 110 which is also called a FOUP opener for opening and closing a cover of a FOUP F on which a FOUP (a carrier) . FOUP (F) is a carrier for a typical lot for production and is seated on the load port by a logistics automation system (eg OHT, AGV, RGV, etc.). The load port 110 is provided with a plate 112 on which the FOUP F is lifted. The load port 110 functions to open the FOUP F and take out a wafer (not shown) loaded in the FOUP F to the inside of the wafer transfer module 200.

One or more of the load ports 110 may be provided to the process module 300 for processing the unprocessed wafers stored in the FOUP F and the remainder may be processed by the process module 300 The wafer W can be stored in the FOUP F.

The FOUP F is capable of preventing contact between the wafer and oxygen when transferring the processed wafers w to another process and transferring the processed wafers w conveniently to the load port module 100 when transferring the wafers w from the outside to the load port module 100 . The FOUP (FOUP) has a case shape and a door is provided on one side to be opened and closed. On the inner wall of the FOUP F, a plurality of slots for loading wafers are formed, and a plurality of wafers are stacked without contacting each other.

The wafer transfer module 200, also referred to as an equipment front end module (EFEM), transports the substrate W between the FOUP F mounted on the load port 110 and the processing part 300, A transfer robot (not shown) that can operate in order to operate the robot can be provided. The transfer robot transfers the substrate between the FOUP F and the process module 300. That is, the transfer robot takes out the substrates from the FOUP F placed on the load port at least one time in one operation and transfers them to the process module 300. The transfer robot installed in the wafer transfer module 200 may be various robots used in a semiconductor manufacturing process.

The process module 300 is an area in which an actual process such as a heat treatment, a thin film, a deposition, and etching for processing a wafer proceeds. Here, the process module 300 may be configured to perform various substrate processing operations. For example, the process module may be an ashing chamber that uses plasma to remove the photoresist to remove the photoresist, the process module may be a CVD chamber configured to deposit an insulating film, and the process module may be an interconnect The etch chamber may be an etch chamber configured to etch apertures or openings in the insulating layer to form structures, and the process module may be a chamber to preheat or cool the substrate.

FIGS. 3 and 4 are a front view and a side view showing the control panel unit, and FIGS. 5A and 5B are views showing a state in which the height and tilt are adjusted according to the user's height.

3 to 5B, the control panel unit 400 is installed at one side of the load port module 100. The control panel unit 400 includes a display device 420 for visually confirming progress of the process performed through a facility controller (not shown), a panel body 410 where the display device 420 is positioned, A tilting member 460, a user sensing sensor 470,

The elevating member 450 is installed on the panel body 410. The elevating member 450 adjusts the height of the display device 420 in consideration of the user's elongation condition. For example, the elevating member 450 includes a pair of guide rails 452 vertically installed on the panel body 410, and guide blocks 454 slidably coupled along the guide rails 452. The guide blocks 454 are installed at four corners of the display device 420, respectively.

The tilting member 460 is provided for varying the inclination of the display device 420. [ The tilting member 460 may be a cylinder. The tilting member 460 is installed between the guide block 454 and the display device 420 in a hinged manner.

The user detection sensor 470 is installed in the panel body 410. The user detection sensor 470 detects the user's elongation condition. Alternatively, the control panel unit 400 can manually input the user's extension condition through the input unit (keyboard).

 The control unit 480 receives the user's height data from the user detection sensor 470 or the input unit. The control unit 480 automatically controls the elevating member 450 and the tilting member 460 so as to move the display device 420 at an optimum height and screen tilt according to the user's height. For example, the control unit 480 may select the automatic or manual option when the user desires to use the display device control or not in the screen for setting the S / W parameter, and then input the height and tilt of the user in the automatic mode Generate the parameters. When the user entered the height, the mean face length of male and female was 21.2 (23.6 + 24 + 18.2 + 18.6) / 4 when the average face length of male was 23.6 ~ 24cm and female face length was 18.2 ~ 18.6cm , And from the starting point of the forehead to eyebrows, eyebrows, nose, nose, and tip of the nose are 1: 1: 0.9, the result is 21.2 * (1 / 2.9) = 7.3. In this way, the display device is automatically moved to the corresponding height by a calculation formula for increasing / decreasing the user's height by 7.3 cm, and positioned at the optimum eye level. The control unit 480 can adjust the up / down / left / right tilt of the display device by individually controlling each of the four tilting members.

6 is a view showing a modification of the present invention.

6, the tilting members 460 of the control panel unit 400a are installed at both ends of the guide rails 452 of the elevating member 450 so that the guide rails 452 are tilted, The inclination of the display device 420 that is raised and lowered can be adjusted.

The foregoing description is intended to illustrate and describe the present invention. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, It is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the foregoing description of the invention is not intended to limit the invention to the precise embodiments disclosed. In addition, the appended claims should be construed to include other embodiments.

400: controller panel part 410: panel body
420: display device 450: elevating member
460: tilting member 470: user detection sensor
480:

Claims (8)

A substrate processing apparatus comprising:
A load port module (LPM) on which a FOUP storing a plurality of wafers is loaded;
A wafer transfer module (EFEM, Equipment Front End Module) disposed between the load port module and a process module (PM);
And a control panel unit installed at one side of the load port module and having a display device for visually confirming progress of a process carried out through a controller,
The control panel unit
A panel body on which the display device is placed; And
And an elevating member installed on the panel body and adjusting a height of the display device in consideration of a user's elongation condition,
The elevating member
A guide rail vertically installed on the panel body; And
And a guide block installed in the display device and slidably coupled along the guide rail. delete The method according to claim 1,
The guide rails are arranged in a pair,
Wherein the guide block is installed at each corner of the display device. The method according to claim 1,
The control panel unit
Further comprising a tilting member for varying a tilt of the display device. 5. The method of claim 4,
The tilting member
Wherein the substrate is a cylinder. 5. The method of claim 4,
The tilting member
Wherein the display device is mounted on each corner of the display device. 5. The method of claim 4,
The tilting member
Wherein the guide rails are provided at both ends of the guide rails. 5. The method of claim 4,
The control panel unit
A sensing unit for sensing a user's elongation condition or an input unit for inputting a user's elongation condition; And
And a control unit for controlling the elevating member and the tilting member according to an extension condition of the user checked by the sensing unit or the input unit.

KR20130112844A 2013-09-23 2013-09-23 Substrate processing apparatus KR101461026B1 (en)

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180002002A (en) * 2016-06-28 2018-01-05 테크-샘 아게 Overhead manufacturing, processing and storage system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003533015A (en) * 2000-04-12 2003-11-05 アシスト テクノロジーズ インコーポレイテッド Module sorter
US7152488B2 (en) 2003-06-04 2006-12-26 Leica Microsystems Semiconductor Gmbh System operating unit
KR20110123695A (en) * 2010-05-07 2011-11-15 나노세미콘(주) One united type semiconductor processing device
KR20120096737A (en) * 2011-02-23 2012-08-31 동국대학교 산학협력단 Apparatus and method for providing information to user

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003533015A (en) * 2000-04-12 2003-11-05 アシスト テクノロジーズ インコーポレイテッド Module sorter
US7152488B2 (en) 2003-06-04 2006-12-26 Leica Microsystems Semiconductor Gmbh System operating unit
KR20110123695A (en) * 2010-05-07 2011-11-15 나노세미콘(주) One united type semiconductor processing device
KR20120096737A (en) * 2011-02-23 2012-08-31 동국대학교 산학협력단 Apparatus and method for providing information to user

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180002002A (en) * 2016-06-28 2018-01-05 테크-샘 아게 Overhead manufacturing, processing and storage system
KR102326782B1 (en) * 2016-06-28 2021-11-17 무라다기카이가부시끼가이샤 Overhead manufacturing, processing and storage system

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