KR101452213B1 - Apparatus and method for Scribing substrate - Google Patents

Apparatus and method for Scribing substrate Download PDF

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KR101452213B1
KR101452213B1 KR1020120155041A KR20120155041A KR101452213B1 KR 101452213 B1 KR101452213 B1 KR 101452213B1 KR 1020120155041 A KR1020120155041 A KR 1020120155041A KR 20120155041 A KR20120155041 A KR 20120155041A KR 101452213 B1 KR101452213 B1 KR 101452213B1
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South Korea
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glass
cutting
axis
substrate
disposed
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KR1020120155041A
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Korean (ko)
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KR20140084981A (en
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김영훈
강승재
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주식회사 에스에프에이
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)

Abstract

A substrate cutting apparatus and a method thereof are disclosed. The apparatus for cutting a substrate according to an embodiment of the present invention includes an apparatus for forming a work line on which an EN (ENCAP) glass is disposed on an upper portion and a cutting process is performed on an original substrate on which an LT (LTPS) table; An original substrate loading unit disposed in an entrance area of the apparatus table and loaded with an original substrate; A substrate reversing unit disposed behind the original substrate loading unit along the operation line and inverting the original substrate such that the EN glass is disposed at the lower portion and the LT glass is disposed at the upper portion; An X-axis lower cutting unit for cutting the EN glass in the lower region of the original substrate downward in the X-axis direction which is the working line direction; And an X-axis upper cutting unit disposed behind the X-axis lower cutting unit along the operation line and cutting the LT glass in the X-axis direction in the lower area of the original substrate.

Description

[0001] Apparatus and method for scribing substrate [0002]

The present invention relates to an apparatus and a method for cutting a substrate, and more particularly, to an apparatus and method for cutting a substrate, which can cut an original substrate into unit substrates by an optimal method considering the amount of cutting of the LT glass and the EN glass from the original substrate, The present invention relates to a substrate cutting apparatus and a method for cutting a substrate, which can improve cutting efficiency as well as reduction in tact time.

Various types of flat panel display substrates are available, including LCD (Liquid Crystal Display), PDP (Plasma Display Panel) and OLED (Organic Light Emitting Diodes).

Among them, an OLED called an organic light emitting diode refers to a 'self-emitting organic material' that emits light by using an electroluminescent phenomenon that emits light when a fluorescent organic compound is supplied with an electric current.

OLEDs can be driven at low voltages and can be made thinner, have a wide viewing angle, and have a fast response time, making them a next-generation display device that can replace current LCDs.

OLEDs can be divided into passive PMOLEDs and active AMOLEDs depending on the driving method. In particular, AMOLED is a self-emissive display that has a faster response speed than conventional displays, has a natural color and has low power consumption. In addition, if AMOLED is applied to film rather than glass substrate, it can implement the technology of flexible display.

Currently available OLED substrates are 32 inches and 55 inches in size.

Such an OLED substrate is called an ENCAP glass (hereinafter referred to as an EN glass) and a low temperature polysilicon (LTPS) glass (hereinafter referred to as an LT glass) through a cutting device, which is also called a scriber or a scribe apparatus. ) Are bonded to each other.

On the other hand, when the LT glass and the EN glass are cut from the original substrate as required, the amount of the EN glass to be cut must be larger than that of the LT glass due to the characteristics of the OLED substrate. In the past, a simple scriber, The cutting efficiency of the substrate is inevitably lowered, and productivity improvement can not be expected. Therefore, it is urgent to improve the structure.

Korea Patent Office Application No. 10-2004-7019582

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide an apparatus and a method for cutting a substrate, which can cut a substrate into unit substrates by an optimal method considering the amount of cutting of the LT glass and the EN glass from the substrate, The present invention provides a substrate cutting apparatus and a method thereof capable of improving productivity with a reduction in tact time.

According to an aspect of the present invention, there is provided an apparatus comprising: a device table forming an operation line in which an EN (ENCAP) glass is disposed on an upper portion and an LT (LTPS) glass is disposed on a lower portion, A substrate loading unit disposed in an entrance area of the apparatus table and loaded with the original substrate; A substrate reversing unit disposed at a rear side of the original substrate loading unit along the operation line, inverting the original substrate so that the EN glass is disposed at a lower portion and the LT glass is disposed at an upper portion; An X-axis lower cutting unit for cutting the EN glass in a lower region of the original substrate in an X-axis direction that is a direction of the work line; And an X-axis upper cutting unit disposed at the rear of the X-axis lower cutting unit along the operation line and cutting the LT glass upward in the X-axis direction in a lower region of the original substrate. Can be provided.

And a first stage disposed in an upper region of the X-axis lower cutting portion and adapted to absorb the LT glass as an upper portion of the original substrate inverted by the original substrate reverser.

And a plurality of first vision cameras for sensing a position where the EN glass is to be cut downward in the X-axis direction before the X-axis lower cutting unit cuts the EN glass downward in the X-axis direction.

And a second stage disposed at a rear portion of the first stage along the operation line and disposed in a lower region of the X-axis upper cutting portion, for adsorbing the EN glass under the original substrate.

And a plurality of second vision cameras for sensing a position to be cut in the X-axis direction before the LT glass is cut upward in the X-axis direction by the X-axis upper cutting unit.

Wherein the original substrate loading unit includes: a shuttle unit for transferring the original substrate at an index; And a centering unit for centering the original substrate.

And a Y-axis lower cutting unit disposed at the rear of the X-axis lower cutting unit and cutting the EN glass in a Y-axis direction intersecting with the X-axis in a lower area of the original substrate.

And a Y-axis upper cutting unit disposed behind the X-axis upper cutting unit and cutting the LT glass upward in the Y-axis direction in an upper area of the original substrate.

An unloading transfer disposed in the exit area of the apparatus table for unloading the processed substrate after the cutting process has been completed; And a process-completed substrate reverser disposed around the unloading transfer, for reversing the unloaded substrate such that the EN glass is disposed on the upper portion and the LT glass is disposed on the lower portion.

The substrate may be an OLED (Organic Light Emitting Diodes).

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: an original substrate loading step in which an EN (ENCAP) glass is disposed on an upper side and an LT (LTPS) A substrate inverting step of inverting the original substrate such that the EN glass is disposed at a lower portion and the LT glass is disposed at an upper portion; An X-axis lower cutting step of cutting the EN glass in a lower region of the original substrate in an X-axis direction which is a direction of a work line in which a cutting process is performed; And an upper X-axis cutting step of cutting the LT glass in the X-axis direction in an upper region of the original substrate after the X-axis lower cutting step.

And the LT glass absorption step of adsorbing the LT glass which is the upper part of the original substrate inverted so that the EN glass is arranged at the lower part and the LT glass is arranged at the upper part before the X-axis lower cutting step is performed have.

And a lower cutting position sensing step of sensing an X-axis direction lower cutting position in the X-axis direction before the X-axis lower cutting step is performed.

The EN glass adsorption step may further include adsorbing the EN glass as a lower part of the original substrate on which the X-axis lower cutting is completed before the X-axis upper cutting step is performed.

And an X-axis direction upper cutting position sensing step of sensing an upper cutting position in the X-axis direction before the X-axis upper cutting step is performed.

And a Y-axis lower cutting step of cutting the EN glass in the Y-axis direction intersecting with the X-axis in a lower region of the original substrate after the X-axis lower cutting step.

And a Y-axis upper cutting step of cutting the LT glass in the Y-axis direction in an upper region of the original substrate after the Y-axis lower cutting step.

A step of unloading a processed substrate on which a cutting process has been completed; And a process-completed substrate reversing step of reversing the unloaded substrate such that the EN glass is disposed on the upper side and the LT glass is disposed on the lower side.

According to the present invention, the original substrate can be cut into unit substrates by an optimal method considering the amount of cutting of the LT glass and the EN glass from the original substrate, thereby improving the cutting efficiency of the substrate unlike the prior art, time can be reduced.

1 is a schematic diagram of a 55 inch module cut through a substrate cutting apparatus according to one embodiment of the present invention.
FIG. 2 is a schematic view showing a step of cutting a substrate according to an embodiment of the present invention.
3 is a flowchart of a substrate cutting method according to an embodiment of the present invention.
4 is a plan structural view of a substrate cutting apparatus according to an embodiment of the present invention.
Fig. 5 is a side view of the structure of Fig. 4. Fig.
FIG. 6 is a structural diagram of the area A in FIG.
FIG. 7 is a structural diagram for the area B in FIG.
8 is a structural view of the area C in Fig.
FIG. 9 is a structural diagram for the area D in FIG.
FIG. 10 is a structural view of the area E in FIG. 4; FIG.
Fig. 11 is a structural diagram of the F region in Fig. 4; Fig.
FIG. 12 is a structural view of the G region in FIG. 4; FIG.
13 is a schematic diagram of a 55 inch lighting cut through a substrate cutting apparatus according to another embodiment of the present invention.
FIG. 14 is a schematic view showing a step of cutting a substrate according to another embodiment of the present invention.
15 is a flowchart of a substrate cutting method according to another embodiment of the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

1 is a schematic diagram of a 55 inch module cut through a substrate cutting apparatus according to one embodiment of the present invention.

As described above, the OLED substrate is in a state in which an ENCAP glass (hereinafter referred to as EN glass) and a low temperature polysilicon (LTPS) glass (hereinafter referred to as LT glass) are bonded through a cutting apparatus of this embodiment And can be manufactured by cutting the original substrate horizontally / vertically.

At this time, in the case of a 55 inch module cut, since the cutting amount of the EN glass is larger than that of the LT glass as shown in FIG. 1, it is difficult to apply a conventional cutting device. Thus, in this embodiment, .

3 is a flowchart illustrating a method of cutting a substrate according to an embodiment of the present invention. FIG. 4 is a flowchart illustrating a method of cutting a substrate according to an exemplary embodiment of the present invention. Referring to FIG. 2, 4 is a structural view of the region A of FIG. 4, FIG. 7 is a structural view of the region B of FIG. 4, and FIG. 8 is a cross- FIG. 10 is a structural diagram for the region D in FIG. 4, FIG. 10 is a structural diagram for the region E in FIG. 4, FIG. 11 is a structural diagram for the region F in FIG. And FIG. 13 is a structural diagram for the H region in FIG.

1, an EN (ENCAP) glass is disposed at an upper portion of the apparatus and a LT (LTPS) glass is disposed at an upper portion of the apparatus. An apparatus table 110 for forming a working line on which a cutting process is performed on an original substrate (see FIG. 1) (See FIG. 1) that has been cut to complete the cutting process.

As shown in Fig. 4, a work line that sequentially advances the process while the original substrate flows is referred to as an X-axis direction, and a direction crossing the X-axis direction is defined as a Y-axis direction.

In the entrance area of the apparatus table 110, as shown in FIG. 5, an original substrate loading unit 120 on which the original substrate is loaded is provided.

The original substrate loaded on the original substrate loading unit 120 is an original substrate on which an EN glass is disposed on the upper side and an LT glass is disposed on the lower side and attached together. Such an original substrate can be transferred by a separate fork as shown in FIG. 2, and is conterated after being transferred.

6, the original substrate loading unit 120 includes a shuttle unit 121 for transferring an original substrate at an index, a centering unit 122 for centering the transferred original substrate, ).

An up / down driving unit 123 for up / down driving the original substrate is provided on the upper part of the shuttle unit 121.

The original substrate inverter 130 for inverting the original substrate is provided in the rear of the original substrate loading unit 120 along the X axis direction, which is a working line on the apparatus table 110, as shown in FIG.

As described above, the original substrate loaded on the original substrate loading unit 120 is an original substrate on which the EN glass is disposed on the upper side and the LT glass is disposed on the lower side and is vertically changed through the original substrate transfer 130 . That is, the original substrate is inverted such that the EN glass is disposed at the lower portion and the LT glass is disposed at the upper portion through the original substrate inverter 130.

As shown in FIG. 7, the original substrate inverter 130 rotates while the original substrate is vacuum-attracted, thereby reversing the original substrate.

A first stage 140 for picking up an LT glass, which is an upper portion of the original substrate inverted by the original substrate inverter 130, is provided around the original substrate inverter 130.

The first stage 140 shown in FIG. 7 can be applied to a vacuum chuck, an electrostatic chuck, or a magnetic chuck, and allows the EN glass to be exposed downward by adsorbing the LT glass, which is the upper portion of the original substrate.

A plurality of first vision cameras 145 (see FIGS. 2 and 8) are provided around the first stage 140. The plurality of first vision cameras 145 are arranged such that the X-axis lower cutting unit 150 cuts a position to be lowered in the X-axis direction before cutting the EN glass in the lower area of the original substrate in the X- Detection. The sensed information is sent to the controller, and the controller controls the operation of the X-axis lower cutting unit 150 based on the information.

8, the LT glass as an upper part of the original substrate is absorbed by the first stage 140, so that the lower part of the X-axis lower cutting unit 150 is exposed to the EN glass lower part 150 exposed toward the X- In the X-axis direction which is the working line direction.

Although not shown in detail, the X-axis lower cutting unit 150 can cut the EN glass by the action of a cutting wheel. 8A is a plan structural view of the X-axis lower cutting area 150, and FIG. 8B is a side structural view thereof.

The EN glass under the X-axis lower cutting unit 150 is cut in the X-axis direction which is the work line direction.

On the other hand, a second stage 160 is provided behind the X-axis lower cutting unit 150, as shown in FIG. The second stage 160 is disposed in the lower region of the X-axis lower cutting unit 150 from the rear of the first stage 140 along the X-axis direction and serves to adsorb the EN glass which is the lower part of the original substrate. The second stage 160 can be driven by the stage driving unit 161 and can be driven up / down in the direction of the arrow in Fig.

The second stage 160 may also be applied to a vacuum chuck, an electrostatic chuck, or a magnetic chuck as in the first stage 140, and the LT glass may be exposed upward by adsorbing EN glass as a lower part of the original substrate.

A plurality of second vision cameras 165 (see FIGS. 2 and 10) are provided in the periphery of the second stage 160. The plurality of second vision cameras 165 are arranged such that the X-axis upper cutting unit 170 cuts the upper cutting position in the X-axis direction before cutting the LT glass in the upper area of the original substrate in the X- Detection. The sensed information is sent to the control unit, and the control unit controls the operation of the upper X-axis cutting unit 170 based on the information.

As shown in FIG. 10, the X-axis upper cutting unit 170 is configured such that the EN glass, which is the lower part of the original substrate, is adsorbed by the second stage 160 so that the upper part is exposed to the LT cutting unit 170 side Is cut in the X-axis direction which is the working line direction.

Although not shown in detail, the X-axis upper cutting portion 170 can cut the LT glass by the action of a cutting wheel. 10 (a) is a plan structural view of the X-axis upper cutting portion 170, and FIG. 10 (b) is a side structural view thereof.

The upper substrate, which has passed the X-axis upper cutting unit 170, has a state in which the upper LT glass is cut in the X-axis direction which is the working line direction.

On the other hand, an unloading transfer 180 and a processed substrate inverter 190 are provided behind the X-axis upper cutting unit 170.

The unloading transfer 180 is disposed in the exit area of the apparatus table 110 as shown in FIG. 11, and serves to unload the processed substrate (see FIG. 1) on which the cutting process has been completed.

12, the process-completed substrate inverter 190 is disposed in the periphery of the unloading transfer 180, and moves in a direction required in the process for the unloaded substrate, that is, the EN glass is disposed at the upper portion And the LT glass is reversed so that it is arranged at the bottom. The process-completed substrate inverter 190 is substantially the same as the structure of the above-described substrate inverter 130, and a detailed description thereof will be omitted.

Hereinafter, the substrate cutting method of this embodiment will be described with reference to Figs. 2 and 3. Fig.

The original substrate is loaded into the original substrate loading unit 120 of the apparatus table 110 (S11). The loaded original substrate is reversed so that the EN glass is disposed on the lower side and the LT glass is disposed on the upper side through the substrate plate inverter 130 (S12).

The first stage 140 adsorbs the LT glass, which is an upper portion of the inverted original substrate, so that the EN glass is disposed on the lower side and the LT glass is disposed on the upper side (S13). Next, a position to be lower cut in the X-axis direction of the EN glass is sensed (S14). Then, the X-axis lower cutting unit 150 cuts the EN glass in the lower area of the original substrate in the X-axis direction that is the working line direction (S15).

When the lower cutting of the X-axis direction with respect to the EN glass is completed, the second stage 160 sucks the EN glass which is the lower part of the original substrate on which the X-axis lower cutting is completed (S16). Next, a position to be cut in the X-axis direction of the LT glass is sensed (S17). Then, the X-axis upper cutting unit 170 cuts the LT glass in the upper region of the original substrate in the X-axis direction that is the working line direction (S18).

When the cutting process is completed in this way, the processed substrate, which has been cut, is unloaded by the unloading transfer 180 (S19).

Then, the EN glass is disposed on the upper side through the process-completed substrate inverter 190, and the LT glass is inverted again to be disposed on the lower side and then taken out to the post-process.

According to this embodiment having such a structure and operation, the original substrate can be cut into a unit substrate by an optimum method considering the amount of cutting of the LT glass and the EN glass from the original substrate, thereby improving the cutting efficiency of the substrate It is possible to improve the productivity as well as decrease the tact time.

FIG. 13 is a schematic view of a 55-inch lighting cut through a substrate cutting apparatus according to another embodiment of the present invention, FIG. 14 is a schematic view showing a step of cutting a substrate according to another embodiment of the present invention, 6 is a flowchart of a substrate cutting method according to another embodiment of the present invention.

Unlike the module cut shown in Fig. 1, in the case of the lighting cut, a step of cutting the EN glass and the LT glass in the Y-axis direction shown in Fig. 4 is added.

15, the Y-axis lower cutting step S36 may be performed consecutively after the X-axis lower cutting step S35, and the Y-axis upper cutting step S40 may be performed along the X-axis upper cutting step S39 ). ≪ / RTI > Alternatively, the X-axis lower cutting unit 150 and the X-axis upper cutting unit 170 may be separately provided. The Y-axis lower cutting unit (not shown) and the Y- As shown in FIG.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

110: apparatus table 120: original substrate loading section
121: Shuttle unit 122: Centering unit
123: up / down driving part 130:
140: first stage 145: first vision camera
150: X-axis lower cutting portion 160: second stage
165: Second vision camera 170: X-axis upper cutting unit
180: unloading transfer 190: process completed substrate transfer

Claims (18)

A device table forming an operation line on which an EN (ENCAP) glass is disposed on an upper portion and an LT (LTPS) glass is disposed on a lower portion and a cutting process is performed on the joined substrate;
A substrate loading unit disposed in an entrance area of the apparatus table and loaded with the original substrate;
A substrate reversing unit disposed at a rear side of the original substrate loading unit along the operation line, inverting the original substrate so that the EN glass is disposed at a lower portion and the LT glass is disposed at an upper portion;
An X-axis lower cutting unit for cutting the EN glass in a lower region of the original substrate in an X-axis direction that is a direction of the work line; And
And an X-axis upper cutting unit disposed at the rear of the X-axis lower cutting unit along the operation line, for cutting the LT glass upward in the X-axis direction in a lower region of the original substrate. The method according to claim 1,
Further comprising a first stage disposed in an upper region of the X-axis lower cutting portion for picking up the LT glass as an upper portion of the original substrate inverted by the original substrate reverser. The method according to claim 1,
Further comprising a plurality of first vision cameras for sensing a position to be cut in the X-axis direction before the EN glass is lower-cut in the X-axis direction by the X-axis lower cutting unit . 3. The method of claim 2,
Further comprising a second stage disposed at a rear portion of the first stage along the operation line and disposed in a lower region of the X-axis upper cutting portion, for adsorbing the EN glass as a lower portion of the original substrate Cutting device. The method according to claim 1,
Further comprising a plurality of second vision cameras for sensing a position to be cut in the X-axis direction before the LT glass is cut in the X-axis direction by the X-axis upper cutting unit . The method according to claim 1,
The original-
A shuttle unit for transferring the original substrate to an index; And
And a centering unit for centering the original substrate. The method according to claim 1,
Further comprising a Y-axis lower cutting unit disposed at the rear of the X-axis lower cutting unit and cutting the EN glass in a Y-axis direction intersecting with the X-axis in a lower area of the original substrate. . 8. The method of claim 7,
Further comprising a Y-axis upper cutting unit disposed behind the X-axis upper cutting unit and cutting the LT glass upward in the Y-axis direction in an upper region of the original substrate. The method according to claim 1,
An unloading transfer disposed in the exit area of the apparatus table for unloading the processed substrate after the cutting process has been completed; And
And a process-completed substrate reverser disposed around the unloading transfer, for reversing the unloaded substrate such that the EN glass is disposed on the upper portion and the LT glass is disposed on the lower portion. The method according to claim 1,
Wherein the substrate is OLED (Organic Light Emitting Diodes). An original substrate loading step in which an EN (ENCAP) glass is disposed on an upper portion and an LT (LTPS) glass is disposed on a lower portion to load an attached original substrate;
A substrate inverting step of inverting the original substrate such that the EN glass is disposed at a lower portion and the LT glass is disposed at an upper portion;
An X-axis lower cutting step of cutting the EN glass in a lower region of the original substrate in an X-axis direction which is a direction of a work line in which a cutting process is performed; And
And an X-axis upper cutting step of cutting the LT glass in the X-axis direction in an upper region of the original substrate after the X-axis lower cutting step. 12. The method of claim 11,
Further comprising an LT glass adsorption step for adsorbing the LT glass as an upper portion of the original substrate which is inverted such that the EN glass is disposed at the lower portion and the LT glass is disposed at an upper portion before the X axis lower cutting step is performed Wherein the substrate is cut. 13. The method of claim 12,
Further comprising an X-axis direction lower cutting position sensing step of sensing a position to be lowered in the X-axis direction before the X-axis lower cutting step is performed. 12. The method of claim 11,
Further comprising an EN glass adsorption step of adsorbing the EN glass as a lower part of the original substrate on which the X-axis lower cutting is completed before the X-axis upper cutting step is performed. 15. The method of claim 14,
Further comprising an X-axis direction upper cutting position sensing step of sensing a position to be cut in the X-axis direction before the X-axis upper cutting step is performed. 12. The method of claim 11,
Further comprising a Y-axis lower cutting step of cutting the EN glass in a Y-axis direction intersecting with the X-axis in a lower region of the original substrate after the X-axis lower cutting step. 17. The method of claim 16,
Further comprising a Y-axis upper cutting step of cutting the LT glass in the Y-axis direction in an upper region of the original substrate after the Y-axis lower cutting step. 12. The method of claim 11,
A step of unloading a processed substrate on which a cutting process has been completed; And
Further comprising the step of inverting the substrate to be unloaded, wherein the EN glass is disposed on the upper side and the LT glass is inverted again so that the LT glass is disposed on the lower side.
KR1020120155041A 2012-12-27 2012-12-27 Apparatus and method for Scribing substrate KR101452213B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100681828B1 (en) 2005-07-20 2007-02-12 주식회사 에스에프에이 Multi braking system
KR100788199B1 (en) 2006-07-18 2007-12-26 주식회사 에스에프에이 System and method for scribing substrate
JP2010021411A (en) 2008-07-11 2010-01-28 Murata Mfg Co Ltd Device and method for positioning workpiece
KR101166960B1 (en) 2009-10-30 2012-07-19 선 에흐웨이 Method for cutting a liquid crystal display cell mother board and automatic cutting system for the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100681828B1 (en) 2005-07-20 2007-02-12 주식회사 에스에프에이 Multi braking system
KR100788199B1 (en) 2006-07-18 2007-12-26 주식회사 에스에프에이 System and method for scribing substrate
JP2010021411A (en) 2008-07-11 2010-01-28 Murata Mfg Co Ltd Device and method for positioning workpiece
KR101166960B1 (en) 2009-10-30 2012-07-19 선 에흐웨이 Method for cutting a liquid crystal display cell mother board and automatic cutting system for the same

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