KR101430480B1

KR101430480B1 - Wafer lever lens portion and light emitting device package using the same

Info

Publication number: KR101430480B1
Application number: KR1020080042811A
Authority: KR
Inventors: 최문구; 김상천
Original assignee: 엘지전자 주식회사
Priority date: 2008-05-08
Filing date: 2008-05-08
Publication date: 2014-08-18
Also published as: KR20090116970A

Abstract

The present invention relates to a wafer level lens unit and a light emitting device package using the same, and more particularly, to a wafer level lens unit and a light emitting device package using the same, which can improve manufacturing efficiency and reliability. The present invention comprises: a lens substrate on which a plurality of lens shapes are arranged; And a shape reinforcement pattern formed on the lower side of the lens substrate.

A lens portion, a pattern, a package, a light emitting element, a wafer, and a lens substrate.

Description

[0001] The present invention relates to a wafer level lens unit and a light emitting device package using the same,

The present invention relates to a wafer level lens unit and a light emitting device package using the same, and more particularly, to a wafer level lens unit and a light emitting device package using the same, which can improve manufacturing efficiency and reliability.

LED (Light Emitting Diode) is a light emitting device fabricated using semiconductor manufacturing process. Since the luminescence phenomenon was observed by applying voltage to semiconductor devices in the 1920s, it began to be put to practical use in the late 1960s. Since then, researches and developments have been made to improve the efficiency of LED steadily. In particular, there is a growing interest in LEDs having optical characteristics enough to replace conventional light sources. In addition, research on LED packages has been actively conducted along with an increase in research on LEDs.

Conventional LED packages can be divided into plastic leaded chip carrier (PLCC) packages, ceramic packages and silicon packages. The PLCC package is called a plastic leaded chip carrier package and is a package in which the leads are placed all the way around a plastic package.

The ceramic package is a package manufactured by firing a ceramic at a predetermined temperature, and is used in a product having a low thermal resistance due to its excellent thermal conductivity. The recently introduced silicon package is a package made of a thermally conductive silicon wafer similar to a ceramic package, realizing excellent thermal conductivity and low profile.

SUMMARY OF THE INVENTION The present invention provides a wafer level lens unit that can be easily manufactured in a batch process, can be reduced in material cost without including a glass material, and can be easily manufactured, and a light emitting device package using the same There is.

According to a first aspect of the present invention, there is provided a lens apparatus comprising: a lens substrate on which a plurality of lens shapes are arranged; And a shape reinforcement pattern formed on the lower side of the lens substrate.

According to a second aspect of the present invention, there is provided a light emitting device package comprising: a package portion in which a light emitting element is mounted in a mounting groove, and a filling material is filled in the mounting groove; And a lens portion coupled to the upper side of the package portion and having a lens shape and a shape reinforcing pattern formed on the lower side of the lens shape.

Since the structure can support the structure itself by the shape reinforcing pattern, the light emitting device package can be manufactured by a batch process, and since no separate glass substrate is attached to the lens portion, It is possible to shorten the distance between the lens and the lens, and the coupling between the package and the lens is easier and the manufacturing is easier, thereby improving the mass productivity and reliability.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. Rather, the intention is not to limit the invention to the particular forms disclosed, but rather, the invention includes all modifications, equivalents and substitutions that are consistent with the spirit of the invention as defined by the claims.

It will be appreciated that when an element such as a layer, region or substrate is referred to as being present on another element "on," it may be directly on the other element or there may be an intermediate element in between . It will be appreciated that if a portion of a component, such as a surface, is referred to as " inner ", it means that it is farther from the outside of the device than other portions of the element.

It will be appreciated that these terms are intended to encompass different orientations of the device in addition to those depicted in the Figures. Finally, the term 'directly' means that there are no intervening elements in the middle. As used herein, the term " and / or " includes any and all combinations and all combinations of related items noted.

Although the terms first, second, etc. may be used to describe various elements, components, regions, layers and / or regions, such elements, components, regions, layers and / It is to be understood that the invention should not be limited by these terms.

&Lt; Embodiment 1 >

The wafer level lens section means that a plurality of optical lenses are manufactured on one substrate.

1, the structure of such a wafer level lens unit 10 is such that a plurality of lens shapes 11 are arranged on a lens substrate 12, (13).

This wafer level lens portion 10 is aligned and engaged with the wafer level package 20 as in FIG. At this time, the wafer level package 20 is mounted with the light emitting device chip 23 in the mounting groove 22 formed in the substrate 21 formed of silicon semiconductor or ceramic, and the mounting groove 22 is normally filled with the filling material 24 ).

At this time, the wafer level lens portion 10 and the wafer level package 20 can be bonded to each other with an adhesive 25 or the like.

When a plurality of lenses are fabricated on one substrate, it is possible to combine them with a light emitting device package array such as a wafer level package array 20 at a time, thereby saving the number of processes and manufacturing time So that the mass productivity can be greatly improved.

At this time, the lens shape 11 included in the lens unit 10 serves to control the luminous intensity of light emitted from the light emitting device chip 23 and the like.

Then, the wafer level lens unit 10 and the wafer level package 20 coupled to each other as described above can be used as a light emitting device package separately from the individual elements 30 as shown in FIG.

On the other hand, the above-described wafer-level lens unit 10 is manufactured by mold-molding together with the glass substrate 13.

4, a glass substrate 13 is fixed to the mold upper plate 40, a lens shape 51 is formed on the lens mold 50, and a lens material is applied to the lens mold 50 And is coupled with the mold upper plate 40. [ The material for the lens is usually liquid silicone.

As shown in FIG. 5, the mold upper plate 40 is aligned with the lens mold 50, and after the temperature and pressure are applied, a solidified lens array can be formed on the glass substrate 13. FIG. 6 shows an example of the wafer level lens unit manufactured in this manner.

The wafer level lens unit 10 formed on the glass substrate 13 may serve to support a lens substrate made of a material such as silicon. However, additional cost may be incurred by using glass, , And the glass substrate (13) and the lens substrate (12) must be formed in a combined manner.

&Lt; Embodiment 2 >

7, the wafer level lens unit 100 includes a plurality of lens shapes 110 arranged on a lens substrate 120, and a shape enhancing unit (not shown) 130 are formed.

That is, the configuration of the lens unit 100 of the present embodiment is formed of one material constituting the lens shape 110, and a shape reinforcement unit 130 for supporting the lens substrate 120 is used without using a glass substrate The shape reinforcement 130 may have a shape reinforcing pattern.

The lens shape 110 and the lens substrate 120 may be formed of a synthetic resin such as silicone or may be manufactured by injection molding or compression molding.

At this time, the shape reinforcing pattern 130 of the wafer-level lens unit 100 can prevent the problem that the lens substrate 120 without the glass substrate may be bent due to the flexibility of the structure such as warping or expansion or contraction .

That is, as the size of the wafer level lens unit 100 formed only of a synthetic resin such as silicon becomes larger, the entire structure becomes more flexible, which may cause thermal deformation during the process. However, the shape reinforcement pattern 130 prevents such a phenomenon You can.

The shape reinforcing pattern 130 may be an engraved pattern 131 as shown in FIG. 8 or an embossed pattern 132 as shown in FIG.

As shown in FIG. 10, the shape reinforcement pattern 130 may have a honeycomb shape in which hexagon shapes are connected to each other. In addition, the shape reinforcement pattern 130 may have a plurality of polygonal shapes such as a triangle, . The polygonal or circular shape may be formed to be connected to each other, but may be formed at regular intervals.

Such a shape reinforcing pattern 130 can suppress the thermal deformation of the entire wafer level lens unit 100 or the lens substrate 120 and can improve the structural rigidity, The yield can be improved.

11, a reinforcing rim portion 140 having a step with the lens substrate 120 may be formed on the rim side of the wafer level lens portion 100. Such a rim portion 140 may be formed later in the wafer level package 100. [ It is possible to mitigate thermal deformation such as bending, expansion, or contraction of the lens unit 100 which may occur at the bonding step with the lens unit 100, and to facilitate the handling of the lens unit 100 during the transportation or bonding step for the process .

12, the edge portion 140 is formed outside the lens shape 110 located at the outermost portion of the wafer level lens portion 100, and its thickness and shape can be arbitrarily adjusted.

In addition to the spherical lens shape shown in the above process, the aspherical lens shape 111 as shown in FIG. 13A can be used as the type of the lens shape included in the lens portion 100, As shown in FIG. 13B, a lens 112 in which a scatterer for dispersion of light is mixed may be used. In some cases, the lens shape 110 may include a phosphor for converting the color of the light source.

As shown in FIG. 13C, a microlens shape 113 in which a plurality of small lens shapes are provided in one unit package can be used, and as shown in FIG. 13D, a fresnel lens shape 114 is used .

Hereinafter, a process of manufacturing the individual light emitting device packages by combining the wafer level lens unit 100 and the wafer level package 200 will be described.

First, as shown in FIG. 14A, a wafer level package 200 prepared by arranging individual packages on which a light emitting device chip 230 is mounted is arranged on a substrate 210. The package 200 may be manufactured through a conventional semiconductor process using the substrate 210 made of a silicon semiconductor, as described above.

That is, the substrate 210 is formed in the form of individual packages by etching or the like, and mounting grooves 220 for mounting the light emitting device chips 230 are formed in the individual packages. An electrode line (not shown) for electrically connecting the light emitting device chip 230 to the mounting groove 220 and the substrate 210 and for later mounting on the circuit board may be formed. Such an electrode line may extend to the rear surface of the substrate 210 to facilitate subsequent mounting on the circuit board.

Further, as shown in FIG. 14B, the wafer level lens unit 100 manufactured by the above-described process is prepared. The wafer level lens unit 100 is formed with a lens shape 110 that is positioned on the individual packages when aligned with the wafer level package 200.

The wafer level lens unit 100 and the wafer level package 200 are aligned and coupled to each other as shown in FIG. 14C. Such bonding may be achieved by using an adhesive, and in some cases, a thermal method may be applied. That is, as described above, since the wafer level lens unit 100 is made of synthetic resin such as silicon without a glass substrate, the wafer level lens unit 100 can be more easily combined with the package 200.

In addition, since such a process can be performed by a batch process, it is possible to improve the mass productivity, and since a separate glass substrate is not attached to the lens unit 100, Making it easier to manufacture.

Thereafter, the wafer level lens unit 100 and the wafer level package 200 coupled to each other in the above-described process are separated into individual light emitting device packages 300 as shown in FIG.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is natural to belong to the scope.

1 to 6 are roads showing the first embodiment of the present invention,

1 is a cross-sectional view showing an example of a wafer level lens portion.

2 is a cross-sectional view showing a state in which a wafer level lens unit and a wafer level package are combined.

FIG. 3 is a cross-sectional view showing an individually separated light emitting device package.

FIGS. 4 and 5 are schematic views showing a manufacturing process of the lens unit.

FIG. 6 is an external view of the lens unit manufactured by the manufacturing process of FIGS. 4 and 5. FIG.

Figs. 7 to 15 are roads showing a second embodiment of the present invention,

7 is a cross-sectional view showing the wafer level lens unit.

8 is a cross-sectional view showing a first specific example of the wafer level lens portion.

9 is a cross-sectional view showing a second specific example of the wafer level lens unit.

10 is a schematic plan view of the wafer level lens portion.

11 is a cross-sectional view showing a wafer level lens portion having a reinforcing rim portion.

12 is a plan view showing a wafer level lens portion having a reinforcing rim portion.

13A to 13D are sectional views showing examples of lens shapes.

14A to 14C are schematic views illustrating a light emitting device package manufacturing process.

15 is a perspective view showing an individual light emitting device package.

Claims

A lens substrate on which a plurality of lens shapes are arranged;

A shape reinforcement pattern formed on the lower side of the lens substrate; And

And a rim portion located outside the lens shape located at the outermost position on the rim side of the lens substrate and formed so as to have a step with the lens substrate,

Wherein the lens substrate, the shape reinforcement pattern, and the rim portion are integrally formed of a synthetic resin.

The wafer level lens unit according to claim 1, wherein the reinforcing pattern has a plurality of polygonal or circular shapes.

delete

The wafer level lens unit according to claim 1, wherein the lens shape is any one of a spherical lens, an aspherical lens, a plurality of microlenses, and a Fresnel lens.

The wafer level lens unit according to claim 1, wherein the lens substrate, the reinforcing pattern, and the entire frame are made of silicon.

In the light emitting device package,

A package portion in which a light emitting device is mounted in a mounting groove, and a filling material is filled in the mounting groove; And

And a lens portion coupled to the upper side of the package portion and having a lens shape and a shape reinforcement pattern formed on the lower side of the lens shape integrally formed of a synthetic resin.

The light emitting device package according to claim 6, wherein the shape reinforcing pattern of the lens portion is in direct contact with the package.

The light emitting device package according to claim 6, wherein the entire lens portion is formed of a silicone resin.

7. The light emitting device package according to claim 6, wherein the reinforcing pattern is an obtuse or convex shape.

The light emitting device package according to claim 6, wherein the reinforcing pattern is a polygonal shape, a plurality of circular shapes, or a honeycomb shape.