KR101414449B1 - Method for printing micro pattern - Google Patents

Method for printing micro pattern Download PDF

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Publication number
KR101414449B1
KR101414449B1 KR1020130004560A KR20130004560A KR101414449B1 KR 101414449 B1 KR101414449 B1 KR 101414449B1 KR 1020130004560 A KR1020130004560 A KR 1020130004560A KR 20130004560 A KR20130004560 A KR 20130004560A KR 101414449 B1 KR101414449 B1 KR 101414449B1
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KR
South Korea
Prior art keywords
printing
groove
wire
pattern
mold
Prior art date
Application number
KR1020130004560A
Other languages
Korean (ko)
Inventor
김준섭
Original Assignee
(주)피엔티
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Priority to KR1020130004560A priority Critical patent/KR101414449B1/en
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Publication of KR101414449B1 publication Critical patent/KR101414449B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A fine pattern printing method for printing a fine pattern having a width of from nanometer to micrometer scale on a surface of a film or a plate is disclosed. The disclosed fine pattern printing method includes a groove forming step of forming a groove corresponding to a print pattern on a surface of a base member, a printing mold having an embossed pattern protruding from a groove by placing a wire thereon, A printing material applying step of applying a printing material to an upper surface of the printing mold to which the wire is fixed, and a step of applying a printing material to the printing medium by contacting the embossing pattern with the printing medium, And a printing material transferring step of transferring the printing material.

Description

[0001] The present invention relates to a method for printing micro pattern,

The present invention relates to a method of printing a fine pattern having a width of from nanometer to micrometer scale.

In many electronic devices such as display devices and smart phones, fine patterns are formed on the surface of a film or a plate to form a circuit or a pattern. In order to form a circuit or a pattern on the surface of a film or a plate, a screen printing or a transfer printing method is usually used, but the precision is not enough to repeatedly implement a pattern having a fine width. On the other hand, although photolithography used in a semiconductor process is used as a method of forming a fine pattern, an expensive apparatus and equipment are required, and it is difficult to apply it to form a fine pattern in a flexible material such as a film There is a problem.

The present invention provides a fine pattern printing method for printing a fine pattern having a width of from nanometer to micrometer scale on the surface of a film or a plate.

The present invention provides a fine pattern printing method for printing a fine pattern using a printing mold formed by fixing a printing wire to a film or a plate.

According to the present invention, there is provided a method of manufacturing a printed wiring board, comprising the steps of: forming a groove corresponding to a printed pattern on a surface of a base member; forming a printing mold having an embossed pattern protruding by seating and fixing a wire in the groove; A printing material applying step of applying a printing material to an upper surface of the printing mold to which the wire is fixed; a printing material applying step of applying a printing material to an upper portion of the relief pattern by contacting the relief pattern with a printing medium; And a step of transferring the printing material onto the medium.

The wire may have any one of circular, oval, and polygonal cross-sections.

The base member may be a film or a flat plate.

The print medium may be a film or a flat plate.

The groove forming step may include pressing the surface of the base member using a roller having a protrusion corresponding to the groove on the outer circumferential surface.

The groove forming step may include irradiating a laser onto the surface of the base member.

The printing mold forming step may include the step of bonding the wire to the groove using an adhesive.

According to the fine pattern printing method of the present invention, it is possible to easily print a fine pattern having a width of nanometer to micrometer scale on the surface of a film or a plate at a lower cost than photolithography . In addition, a fine pattern can be printed on a flexible material.

1 to 5 are sectional views sequentially illustrating a method for printing a fine pattern according to an embodiment of the present invention.
Fig. 6 is a sectional view showing a modification of Fig. 2. Fig.
FIG. 7 is a cross-sectional view showing an example of an apparatus in which a printing material is applied to a printing mold and a process in which a printing material is transferred to a printing medium continuously in the fine pattern printing method of the present invention.

Hereinafter, a method of printing a fine pattern according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The terminology used herein is a term used to properly express the preferred embodiment of the present invention, which may vary depending on the intention of the user or operator or the custom in the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the contents throughout this specification.

1 to 5 are sectional views sequentially illustrating a method for printing a fine pattern according to an embodiment of the present invention. The fine pattern printing method of the present invention is a method of printing a fine pattern having a width of nanometer to micrometer scale on a print medium in the form of a film or a flat plate. Referring to FIGS. 1 to 5, a method for printing a fine pattern according to an embodiment of the present invention includes a groove forming step, a printing mold forming step, a printing material applying step, and a printing material transferring step.

Referring to FIG. 1, the groove forming step is a step of forming a groove 13 corresponding to a printing pattern on the surface 11 of the base member 10. The base member 10 may be a flat plate of metal or plastic material, or may be a flexible film.

The groove 13 can be formed by using a groove forming tool 5 including a pair of rollers 6 and 7. The groove forming tool 5 includes a support roller 6 for supporting the base member 10 and a press roller 7 which is in close contact with the support roller 6 via the base member 10 and forms a nip . The press roller 7 has projections 8 corresponding to the grooves 13 on the outer circumferential surface thereof. When the base member 13 is interposed between the support roller 6 and the press roller 7 and the press roller 7 is rotated, the support roller 6 performs idling rotation, The surface 11 of the base member 10 is pressed by the projections 8 to form the grooves 13. [

However, the formation of the groove 13 is not limited to the method using the groove forming tool 5. For example, instead of using the groove forming tool 5, a laser is irradiated to the surface of the base member 10 while moving the laser light source along the path corresponding to the print pattern to form the grooves 13 You may.

Referring to FIG. 2, the print mold forming step includes the steps of: placing a wire 15 on a groove 13 (see FIG. 1) of the base member 10; mold 17 is formed. It is preferable that the wire 15 is easy to bend along the extended shape of the groove 13 and is easy to cut in accordance with the length of the groove 13, and for example, a metal wire can be applied. The cross section of the wire 15 is circular, but not limited thereto, and polygons such as elliptical, triangular, and rectangular are also possible.

The wire 15 is applied to the inside of the groove 13 by adhering an adhesive (not shown) to the inside of the groove 13 (refer to FIG. 1), placing the wire 15 on the groove 13, As shown in Fig. When the wire 15 is placed on the groove 13, an upper portion of the wire 15 protrudes above the surface 11 of the base member 10 as shown in FIG. 2 to form a relief pattern corresponding to the print pattern .

Referring to FIG. 3, the step of applying the printing material is a step of applying the printing material 20 to the upper surface of the printing mold 17 in which the wire 15 is fixed and the positive pattern is formed. The printing material 20 may be ink. Alternatively, the printing material 20 may be a paste containing copper (Cu), silver (Ag) or the like as a conductive material. The printing material 20 may be applied to the printing mold 17 by using a slot coater while moving the printing mold 17 in one direction. However, the method of applying the printing material is not limited thereto, and the printing material may be sprayed with an atomizer, or the printing material may be coated with a roller.

4, the printing material transfer step includes contacting the printing medium 25 with the relief pattern of the printing mold 17 to transfer the printing material 20 applied on the upper portion of the relief pattern to the printing medium 25 This is the stage of transcription. Specifically, the printing mold 17 to which the printing material 20 is applied is placed on the die 24, the upper side of the printing medium 25 is opposed to the printing medium 25, Thereby pressing the print medium 25 downward. Accordingly, only the printing material 20 applied to the upper portion of the relief pattern 20 among the printing material 20 applied to the printing mold 17 is transferred to the printing medium 25 by contacting the printing medium 25.

According to the pressing strength, it is possible to determine the width of the printing material 20 applied to the top of the relief pattern. That is, when the pressing force is increased, the width of the printing material to be transferred is widened, whereas when the pressing force is small, the width of the printing material to be transferred is narrowed.

Accordingly, the width of a print pattern to be patterned on the print medium 25 can be adjusted, and a fine pattern can be formed.

5, a print pattern is formed on the print medium 25 by curing the print medium 20 transferred to the print medium 25. [ Only the printing material 20 in the narrow area at the upper end of the wire 15 is transferred to the printing medium 25 to form the printing pattern so that the width W of the printing pattern is smaller than the diameter of the wire 15 And the width W of the printed pattern is determined on the basis of the contact pressure of the printing medium 25 and the printing mold 17 and the thickness and properties of the printing material 20 applied to the printing mold 17, scale to micrometer scale. The printing medium 25 shown in Fig. 5 may be a flat plate of metal or plastic material, or a flexible film. An embodiment in the case where the print medium is a film will be described later with reference to Fig.

Fig. 6 is a sectional view showing a modification of Fig. 2. Fig. 6, a wire 16 having a triangular cross section is seated and fixed on a groove 14 formed in the surface 12 of the base member 11 to form a printing mold 18 having a relief pattern formed thereon . The wire 16 is adhered and fixed to the groove 14 using an adhesive. Because of the wire 16 having a triangular cross section, an extremely narrow edge is formed at the upper end of the relief pattern, and the print medium is contacted only with the edge and is spaced apart. The print pattern can be formed to be narrower than the case of Fig.

FIG. 7 is a cross-sectional view showing an example of an apparatus in which a printing material is applied to a printing mold and a process in which a printing material is transferred to a printing medium continuously in the fine pattern printing method of the present invention. Referring to FIG. 7, the printing apparatus 30 is a device capable of repeatedly printing a fine pattern on a flexible film-type print medium 50 supplied continuously without interruption. The printing apparatus 30 includes an unwinding roller 45 for continuously feeding a film-shaped print medium 50 rolled up in a roll form while releasing the print medium 50, A transfer roller 46 to be transferred to the printing medium 50 and a path supporting roller 47 for defining and supporting the path of the printing medium 50 onto which the printing medium 40 is transferred. Although not shown, the print medium 50 may pass through the path support roller 47, pass through the print material curing unit, and be rewound and collected in a rewinding roller.

The printing mold 37 has a base member 31 in the form of a flexible film and a wire 35 seated and fixed in a groove corresponding to the printing pattern formed on the base member 31. [ The printing mold 37 is connected at its both ends to form a closed curve belt and wound on the first and second rollers 35 and 38 as the first and second rollers 35 and 38 rotate Move along the closed curve path. At least one of the first and second rollers 35, 38 may be a print mold drive roller, and the roller other than the drive roller is an idle roller for idling rotation.

The transfer roller 46 is pressed toward the second roller 38 so that the print medium 50 wound on the transfer roller 46 comes into contact with the print mold 37 wrapped around the second roller 38 with an appropriate size of pressure. The slot coater 42 applies a printing material 40 to the printing mold 37 before the printing mold 37 is contacted with the printing medium 50. [ The printing material 40 is coated on the upper surface of the printing mold 37 on which the wire 35 is fixed and the positive pattern is formed and the printing medium 50 and the printing mold 37 wound on the transfer roller 46 The printing material 40 applied to the upper portion of the relief pattern is transferred to the printing medium 50 by contact.

The printing medium 50 to which the printing material 40 has been transferred passes through the printing material curing unit (not shown) via the path support roller 47 and is rewound and collected in the rewinding roller (not shown). The printing mold 37 on which the printing material 40 at the upper end of the wire 35 is transferred by contact with the printing medium 50 travels toward the slot coater 42 along the closed curve path. The blade 43 scrapes and removes the printing material 40 remaining on the printing mold 37 before reaching the slot coater 42. [

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the present invention. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

10: Base 15: Wire
17: Printing mold 20: Printing material
22: slot coater 25: print medium
25: unwinding roller 46: transfer roller

Claims (7)

A groove forming step of forming a groove corresponding to the print pattern on the surface of the base member;
A printing mold forming step of placing a wire on the groove and fixing the wire to form a printing mold having a protruding relief pattern;
Applying a printing material onto an upper surface of the printing mold to which the wire is fixed; And
And a printing material transferring step of transferring the printing material applied on the upper portion of the relief pattern to the printing medium by contacting the relief pattern with the printing medium. The method according to claim 1,
Wherein the cross section of the wire is one of circular, elliptical, and polygonal. The method according to claim 1,
Wherein the base member is a film or a flat plate. The method according to claim 1,
Wherein the print medium is a film or a flat plate. The method according to claim 1,
Wherein the groove forming step includes pressing the surface of the base member using a roller having a projection corresponding to the groove on an outer circumferential surface thereof. The method according to claim 1,
Wherein the groove forming step includes irradiating a laser onto a surface of the base member. The method according to claim 1,
Wherein the printing mold forming step comprises adhering the wire to the groove using an adhesive.
KR1020130004560A 2013-01-15 2013-01-15 Method for printing micro pattern KR101414449B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020079620A1 (en) * 2018-10-17 2020-04-23 3M Innovative Properties Company Printing patterns via die cutting
KR102396765B1 (en) * 2020-11-18 2022-05-10 김호민 Pressed pattern producing apparatus using magnetic units

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000035503A (en) * 1998-11-17 2000-06-26 알프레드 엘. 미첼슨 Replicating a nanoscale pattern
KR20030094654A (en) * 2002-06-07 2003-12-18 엘지.필립스 엘시디 주식회사 A printing machine for organic luminescence layer of OLED
KR101051448B1 (en) 2010-10-26 2011-07-22 한국기계연구원 Transparent electrode manufacturing method using metal pattern based print and transparent electrode thereby
KR101150959B1 (en) 2011-01-17 2012-05-29 (주)피엔티 Apparatus for forming pattern on light guide panel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000035503A (en) * 1998-11-17 2000-06-26 알프레드 엘. 미첼슨 Replicating a nanoscale pattern
KR20030094654A (en) * 2002-06-07 2003-12-18 엘지.필립스 엘시디 주식회사 A printing machine for organic luminescence layer of OLED
KR101051448B1 (en) 2010-10-26 2011-07-22 한국기계연구원 Transparent electrode manufacturing method using metal pattern based print and transparent electrode thereby
KR101150959B1 (en) 2011-01-17 2012-05-29 (주)피엔티 Apparatus for forming pattern on light guide panel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020079620A1 (en) * 2018-10-17 2020-04-23 3M Innovative Properties Company Printing patterns via die cutting
KR102396765B1 (en) * 2020-11-18 2022-05-10 김호민 Pressed pattern producing apparatus using magnetic units

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