KR101404250B1 - 취성 재료의 분할 장치 및 할단 방법 - Google Patents

취성 재료의 분할 장치 및 할단 방법 Download PDF

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Publication number: KR101404250B1
Authority: KR; South Korea
Prior art keywords: laser beam; brittle material; beam irradiation; laser; irradiation area
Prior art date: 2008-12-16

Application number

KR1020117016142A

Other languages

English (en)

Korean (ko)

Other versions

KR20110106360A (ko

Inventor

히토시 에노키조노

노리오 가루베

Original Assignee

가부시키가이샤 레미

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2008-12-16

Filing date

2009-12-15

Publication date

2014-06-09

2009-12-15 Application filed by 가부시키가이샤 레미 filed Critical 가부시키가이샤 레미

2011-09-28 Publication of KR20110106360A publication Critical patent/KR20110106360A/ko

2014-06-09 Application granted granted Critical

2014-06-09 Publication of KR101404250B1 publication Critical patent/KR101404250B1/ko

Links

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Images

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
Materials Engineering (AREA)
Optics & Photonics (AREA)
Mechanical Engineering (AREA)
Health & Medical Sciences (AREA)
Plasma & Fusion (AREA)
Toxicology (AREA)
Thermal Sciences (AREA)
Mining & Mineral Resources (AREA)
Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)
Laser Beam Processing (AREA)
Liquid Crystal (AREA)

KR1020117016142A 2008-12-16 2009-12-15 취성 재료의 분할 장치 및 할단 방법 KR101404250B1 (ko)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JPJP-P-2008-320251		2008-12-16
JP2008320251		2008-12-16
PCT/JP2009/070900 WO2010071128A1 (ja)	2008-12-16	2009-12-15	脆性材料の分割装置および割断方法

Publications (2)

Publication Number	Publication Date
KR20110106360A KR20110106360A (ko)	2011-09-28
KR101404250B1 true KR101404250B1 (ko)	2014-06-09

Family

ID=42268799

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020117016142A KR101404250B1 (ko)	2008-12-16	2009-12-15	취성 재료의 분할 장치 및 할단 방법

Country Status (4)

Country	Link
JP (1)	JP5562254B2 (ja)
KR (1)	KR101404250B1 (ja)
CN (1)	CN102239034A (ja)
WO (1)	WO2010071128A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102515494B (zh) *	2011-12-05	2014-04-09	深圳市华星光电技术有限公司	一种玻璃基板切割装置
EP3107868B1 (en)	2014-02-20	2021-05-26	Corning Incorporated	Methods for cutting radii in flexible thin glass
DE102014116958B9 (de)	2014-11-19	2017-10-05	Trumpf Laser- Und Systemtechnik Gmbh	Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
KR102138964B1 (ko)	2014-11-19	2020-07-28	트룸프 레이저-운트 시스템테크닉 게엠베하	비대칭 광학 빔 정형을 위한 시스템
DE102014116957A1 (de)	2014-11-19	2016-05-19	Trumpf Laser- Und Systemtechnik Gmbh	Optisches System zur Strahlformung
JP6700581B2 (ja) *	2015-06-25	2020-05-27	日本電気硝子株式会社	管ガラスの切断方法及び切断装置、並びに管ガラス製品の製造方法
KR20180075707A (ko) *	2015-11-25	2018-07-04	코닝 인코포레이티드	유리 웹의 분리 방법들
SG11202008663VA (en) *	2018-03-30	2020-10-29	Tokyo Electron Ltd	Laser processing device and laser processing method
JP7466829B2 (ja) *	2020-02-06	2024-04-15	日本電気硝子株式会社	ガラス板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH08197271A (ja) *	1995-01-27	1996-08-06	Ricoh Co Ltd	脆性材料の割断方法及び脆性材料の割断装置
JP2005212364A (ja)	2004-01-30	2005-08-11	Shibaura Mechatronics Corp	脆性材料の割断加工システム及びその方法
JP2008246808A (ja)	2007-03-30	2008-10-16	Japan Steel Works Ltd:The	高脆性非金属材料製の被加工物の加工方法及びその装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPWO2003008168A1 (ja) *	2001-07-16	2004-11-04	三星ダイヤモンド工業株式会社	脆性材料基板のスクライブ装置
RU2296135C2 (ru) *	2001-07-19	2007-03-27	Юнивейшн Технолоджиз, Ллс	Смешанные металлоценовые каталитические системы, содержащие компонент, обеспечивающий плохое включение сомономера, и компонент, обеспечивающий хорошее включение сомономера
RU2354616C2 (ru) *	2004-10-01	2009-05-10	Мицубоси Даймонд Индастриал Ко., Лтд.	Способ скрайбирования хрупкого материала и устройство скрайбирования
JP2006137169A (ja) *	2004-11-12	2006-06-01	Lemi Ltd	脆性材料の割断方法及び装置
JP2007076930A (ja) *	2005-09-12	2007-03-29	Joyo Kogaku Kk	ガラス切断方法
JPWO2007094348A1 (ja) *	2006-02-15	2009-07-09	東レエンジニアリング株式会社	レーザスクライブ方法、レーザスクライブ装置、及びこの方法または装置を用いて割断した割断基板

2009
- 2009-12-15 KR KR1020117016142A patent/KR101404250B1/ko active IP Right Grant
- 2009-12-15 WO PCT/JP2009/070900 patent/WO2010071128A1/ja active Application Filing
- 2009-12-15 JP JP2010542973A patent/JP5562254B2/ja not_active Expired - Fee Related
- 2009-12-15 CN CN2009801489582A patent/CN102239034A/zh active Pending

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH08197271A (ja) *	1995-01-27	1996-08-06	Ricoh Co Ltd	脆性材料の割断方法及び脆性材料の割断装置
JP2005212364A (ja)	2004-01-30	2005-08-11	Shibaura Mechatronics Corp	脆性材料の割断加工システム及びその方法
JP2008246808A (ja)	2007-03-30	2008-10-16	Japan Steel Works Ltd:The	高脆性非金属材料製の被加工物の加工方法及びその装置

Also Published As

Publication number	Publication date
WO2010071128A1 (ja)	2010-06-24
KR20110106360A (ko)	2011-09-28
CN102239034A (zh)	2011-11-09
JP5562254B2 (ja)	2014-07-30
JPWO2010071128A1 (ja)	2012-05-31

Legal Events

Date	Code	Title	Description
2012-01-12	A201	Request for examination
2013-10-18	E902	Notification of reason for refusal
2014-04-25	E701	Decision to grant or registration of patent right
2014-05-29	GRNT	Written decision to grant
2017-02-27	FPAY	Annual fee payment	Payment date: 20170228 Year of fee payment: 4
2018-05-23	FPAY	Annual fee payment	Payment date: 20180524 Year of fee payment: 5
2019-04-02	FPAY	Annual fee payment	Payment date: 20190403 Year of fee payment: 6

Publication	Publication Date	Title
KR101404250B1 (ko)	2014-06-09	취성 재료의 분할 장치 및 할단 방법
KR100849696B1 (ko)	2008-07-31	취성재료의 스크라이브 방법 및 스크라이브 장치
JP5345334B2 (ja)	2013-11-20	脆性材料の熱応力割断方法
JP5113462B2 (ja)	2013-01-09	脆性材料基板の面取り方法
CN101678501B (zh)	2015-06-24	利用单束辐射划刻和分离易碎材料的方法和装置
US10358374B2 (en)	2019-07-23	Methods for laser scribing and separating glass substrates
EP2724993A2 (en)	2014-04-30	Methods for laser scribing and separating glass substrates
WO2011002089A1 (ja)	2011-01-06	脆性材料基板の割断方法及び割断装置並びにその割断方法により得られる車両用窓ガラス
EP3274305B1 (en)	2023-09-06	Methods and apparatus for cutting a substrate
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JP2015221745A (ja)	2015-12-10	精密レーザ罫書き
TWI488703B (zh)	2015-06-21	脆性材料基板的切割方法及切割裝置
US20150059411A1 (en)	2015-03-05	Method of separating a glass sheet from a carrier
JP3792639B2 (ja)	2006-07-05	切断装置
JP2007260749A (ja)	2007-10-11	レーザ加工方法、レーザ加工装置及び脆性材料の加工品
JP2010138046A (ja)	2010-06-24	被割断材の加工方法および加工装置
JP5590642B2 (ja)	2014-09-17	スクライブ加工装置及びスクライブ加工方法
JP2007055000A (ja)	2007-03-08	非金属材料製の被加工物の切断方法及びその装置
JP2001212683A (ja)	2001-08-07	脆性材料の割断装置、脆性材料の割断方法および液晶表示装置の製造方法
JP2010253752A (ja)	2010-11-11	脆性材料の割断装置および脆性材料の割断方法
KR20190083459A (ko)	2019-07-12	레이저 스팟 빔을 이용한 절단 장치
KR20150058374A (ko)	2015-05-28	작업 대상물 할단 방법 및 작업 대상물 할단 장치
JP2008100412A (ja)	2008-05-01	レーザ割断方法
JP2013006706A (ja)	2013-01-10	ガラス基板の割断方法および割断装置
JP2009196175A (ja)	2009-09-03	割断装置、割断方法、およびフラットパネルディスプレイの製造方法