KR101338861B1 - Flexible copper clad laminated film and Method for making the same - Google Patents

Flexible copper clad laminated film and Method for making the same Download PDF

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KR101338861B1
KR101338861B1 KR1020120033524A KR20120033524A KR101338861B1 KR 101338861 B1 KR101338861 B1 KR 101338861B1 KR 1020120033524 A KR1020120033524 A KR 1020120033524A KR 20120033524 A KR20120033524 A KR 20120033524A KR 101338861 B1 KR101338861 B1 KR 101338861B1
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copper foil
roll
thickness
laminated film
copper
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KR20130111041A (en
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김선기
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김선기
조인셋 주식회사
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B32B2038/0016—Abrading
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)

Abstract

얇은 두께의 동박을 구비한 롤 타입의 연성 동박 적층필름이 개시된다. 상기 적층필름은, 폴리머 필름; 및 한 면에서 상기 폴리머 필름이 접합하고, 반대 면에서 화학적 에칭에 의해 1차로 두께가 얇아지고 기계적 연마에 의해 2차로 두께가 얇아져 1미크론 내지 7미크론의 두께를 갖는 동박을 포함한다.A roll type flexible copper foil laminated film having a thin copper foil is disclosed. The laminated film is a polymer film; And copper foil having a thickness of 1 micron to 7 microns to which the polymer film is bonded on one side and thinned primarily on the opposite side by chemical etching and secondly thin by mechanical polishing.

Description

롤 타입의 연성 동박 적층필름 및 그 제조방법{Flexible copper clad laminated film and Method for making the same}Flexible copper clad laminated film and method for making the same

본 발명은 롤 타입의 연성 동박 적층필름에 관한 것으로, 특히 7미크론 이하의 얇은 두께의 동박을 구비하면서 동박의 기계적 강도가 좋은 연성 동박 적층필름에 관련한다.The present invention relates to a roll-type flexible copper foil laminated film, and more particularly to a flexible copper foil laminated film having a high mechanical strength of the copper foil while having a thin thickness of copper foil of 7 microns or less.

휴대폰이나 박형 디스플레이와 같은 전자기기에 사용되는 미세 패턴을 갖는 연성회로기판(Flexible Print Circuit Board; FPCB)은 유연성이 좋고 미세 회로패턴에 적합하도록 얇은 두께의 동박이 형성된 연성 동박 적층필름으로 제조된다. A flexible printed circuit board (FPCB) having a fine pattern used in an electronic device such as a mobile phone or a thin display is made of a flexible copper foil laminated film having a thin copper foil having a high flexibility and suitable for a fine circuit pattern.

종래에는 전해 동박 위에 열에 의해 용융된 폴리이미드를 캐스팅하여 제조한 연성 동박 적층필름을 사용해왔다. 또는 폴리이미드 필름 위에 동박을 접착한 연성 동박 필름을 사용해 왔다.Conventionally, the flexible copper foil laminated | multilayer film manufactured by casting the molten polyimide by heat on electrolytic copper foil was used. Or the flexible copper foil film which adhered copper foil on the polyimide film has been used.

그러나, 현재까지 전해 동박 또는 압연 동박의 두께를 7미크론 이하로 제조하는데 어려움이 많고 또한 이를 동박을 적용하여 연성 동박 적층필름을 제조하려면 얇은 두께를 갖는 동박이 끊어지기 쉽거나 취급하기 어려워 미세 회로패턴에 적합한 7미크론 이하의 동박을 구비한 연성 동박 적층필름을 제공하기 어려웠다. However, to date, it is difficult to manufacture the thickness of the electrolytic copper foil or the rolled copper foil to 7 microns or less, and in order to manufacture a flexible copper foil laminated film by applying the copper foil, a copper foil having a thin thickness is easily broken or difficult to handle, and thus, a fine circuit pattern. It was difficult to provide a flexible copper foil laminated film having a copper foil of 7 microns or less suitable for the present invention.

예를 들어, 폭이 약 300㎜이고 두께가 약 7미크론 이하인 롤 타입의 동박을 길이 방향으로 연속적으로 공급하면서 그 위에 액상의 폴리이미드를 캐스팅하거나 또는 폴리이미드 필름을 접착하는데 있어서 기계적인 한계점이 많아 작업이 어렵다.For example, there are many mechanical limitations in casting a liquid polyimide or bonding a polyimide film thereon while continuously supplying a roll-type copper foil having a width of about 300 mm and a thickness of about 7 microns or less in the longitudinal direction. The task is difficult.

또한, 두께가 7미크론 이하인 동박 자체를 롤로 감아 제공하기 어렵다는 단점도 있다.In addition, there is a disadvantage that the copper foil itself having a thickness of 7 microns or less is difficult to be rolled up and provided.

다른 종래 기술로, 폴리이미드 필름 위에 구리 등의 시드 메탈(seed metal)을 스퍼터링 공정으로 옹스트롱(Å) 단위의 두께로 코팅을 한 후, 시드 메탈 위에 구리를 전해 도금하여 금속 층의 두께가 대략 3미크론 정도인 연성 동박 적층필름이 있다. 그러나, 이 제품은 동박의 두께를 7미크론 이하로 제공할 수 있어 미세 회로패턴에 적합하지만, 스퍼터링 공정을 거쳐야 하므로 가격이 높고 또한 동박과 폴리이미드 필름과의 접착력이 약하다는 단점이 있다. 더욱이, 전해 동박은 전해도금에 의해 형성된 것으로 압연 동박이 사용된 제품보다 기계적인 강도, 예를 들어 굴곡성이 나쁘다는 단점이 있다. In another conventional technique, a seed metal such as copper is coated on a polyimide film in a thickness of an angstrom unit by a sputtering process, followed by electroplating copper on the seed metal so that the thickness of the metal layer is approximately. There is a flexible copper foil laminated film on the order of 3 microns. However, this product is suitable for the fine circuit pattern because it can provide the thickness of the copper foil to 7 microns or less, but has a disadvantage in that the price is high and the adhesion between the copper foil and the polyimide film is weak because it has to go through a sputtering process. Moreover, the electrolytic copper foil is formed by electroplating and has a disadvantage in that mechanical strength, for example, bendability, is worse than that in which a rolled copper foil is used.

따라서, 본 발명은 이러한 문제점을 해결하기 위해 제안되는 것으로, 본 발명의 목적은 동박의 두께를 7미크론 이하로 유지하면서 동박의 기계적 강도가 좋은 롤 타입의 연성 동박 적층필름을 제공하는 것이다.Therefore, the present invention is proposed to solve such a problem, and an object of the present invention is to provide a roll type flexible copper foil laminated film having good mechanical strength of the copper foil while maintaining the thickness of the copper foil at 7 microns or less.

본 발명의 다른 목적은 동박의 두께가 7미크론 이하이며 동박과 필름이 접착력이 좋은 롤 타입의 연성 동박 적층필름을 제공하는 것이다.Another object of the present invention is to provide a roll-type flexible copper foil laminated film having a thickness of copper foil of 7 microns or less and having good adhesion between the copper foil and the film.

본 발명의 동박의 두께가 7미크론 이하이며 가격이 저렴한 롤 타입의 연성 동박 적층필름을 제공하는 것이다.The thickness of the copper foil of this invention is 7 micron or less, and it is providing the roll type flexible copper foil laminated | multilayer film inexpensive.

본 발명의 다른 목적은 상기의 롤 타입의 연성 동박 적층필름을 효율적으로 제조할 수 있는 제조방법을 제공하는 것이다.Another object of the present invention is to provide a manufacturing method that can efficiently produce the rolled flexible copper foil laminated film.

상기의 목적은, 폴리머 필름; 및 상기 폴리머 필름의 적어도 한 면에 접합하고, 상기 접합된 면의 반대 면에서 화학적 에칭에 의해 1차로 두께가 얇아지고 상기 화학적 에칭에 의해 구리입자의 밀도가 낮아진 면이 기계적 연마에 의해 2차로 두께가 얇아져 1미크론 내지 7미크론의 두께를 갖는 동박을 포함하는 롤 타입의 연성 동박 적층필름에 의해 달성된다.The above object is a polymer film; And a surface that is bonded to at least one side of the polymer film, the thickness of which is primarily thinned by chemical etching on the opposite side of the bonded surface, and the surface of which the density of copper particles is lowered by the chemical etching is secondary by mechanical polishing. Is thinned and is achieved by a rolled flexible copper foil laminated film comprising a copper foil having a thickness of 1 micron to 7 microns.

또한, 상기의 목적은, 두께가 7미크론을 초과하는 롤 타입의 동박에서, 일단을 하나의 롤에 감고 타단을 다른 롤에 고정하여 상기 동박에 인장력이 가해진 상태에서 공급하는 단계; 상기 동박 위에 폴리머를 캐스팅 도포하고 냉각하여 폴리머 필름/동박 접합체를 형성하는 단계; 상기 동박의 표면을 화학적 에칭하여 1차로 상기 동박의 두께를 줄이면서 상기 동박 표면의 구리 입자의 밀도가 낮아지도록 하는 단계; 및 상기 에칭된 동박의 표면을 기계적 연마에 의해 2차로 상기 동박의 두께를 7미크론 이하로 줄이는 단계를 포함하는 롤 타입의 연성 동박 적층필름의 제조방법에 의해 달성된다.In addition, the above object, in a roll-type copper foil having a thickness of more than 7 microns, winding one end to one roll and fixing the other end to the other roll to supply the copper foil in a state where a tensile force is applied; Casting and coating a polymer on the copper foil to form a polymer film / copper bond; Chemically etching the surface of the copper foil so that the density of the copper particles on the surface of the copper foil is decreased while primarily reducing the thickness of the copper foil; And reducing the thickness of the copper foil to 7 microns or less by mechanical polishing the surface of the etched copper foil.

더욱이, 상기의 목적은, 두께가 7미크론을 초과하는 롤 타입의 동박이 폴리머 필름의 적어도 한 면에 접착제에 의해 접착된 폴리머 필름/접착제/동박 접합체의 일단을 롤에 감고 타단을 다른 롤에 고정하여 상기 동박에 인장력이 가해진 상태에서 공급하는 단계; 상기 동박의 표면을 화학적 에칭하여 1차로 상기 동박의 두께를 줄이면서 상기 동박 표면의 구리 입자의 밀도가 낮아지도록 하는 단계; 및 상기 에칭된 동박의 표면을 기계적 연마에 의해 2차로 상기 동박의 두께를 7미크론 이하로 줄이는 단계를 포함하는 롤 타입의 연성 동박 적층필름의 제조방법에 의해 달성된다.Moreover, the above object is to roll one end of a polymer film / adhesive / copper bond bonded to a roll type copper foil having a thickness of more than 7 microns by an adhesive to at least one side of the polymer film and fix the other end to another roll. Supplying the copper foil in a state where a tensile force is applied thereto; Chemically etching the surface of the copper foil so that the density of the copper particles on the surface of the copper foil is decreased while primarily reducing the thickness of the copper foil; And reducing the thickness of the copper foil to 7 microns or less by mechanical polishing the surface of the etched copper foil.

바람직하게, 상기 기계적 연마는, 연마 롤에 의해 연마 또는 블레이드에 의한 연마이다.Preferably, the mechanical polishing is polishing by a polishing roll or polishing by a blade.

상기한 롤 타입의 연성 동박 적층필름에 의하면, 7미크론 이하 두께의 동박을 구비하면서도 동박과 폴리이미드 필름의 접착력이 우수하고 제조원가가 저렴하며 동박의 기계적 강도가 우수하다는 효과를 갖는다.According to the roll-type flexible copper foil laminated film described above, it has an effect of having excellent adhesion between the copper foil and the polyimide film, inexpensive manufacturing cost, and excellent mechanical strength of the copper foil, while having a copper foil having a thickness of 7 microns or less.

도 1은 본 발명의 일 실시 예를 따른 롤 타입의 연성 동박 적층필름(100)을 나타낸다.
도 2는 본 발명의 일 실시 예를 따른 롤 타입의 연성 동박 적층필름(200, 300)을 나타낸다.
도 3은 일 실시 예에 따른 롤 타입의 연성 동박 적층필름의 제조 방법을 나타낸다.1 shows a rolled flexible copper foil laminated film 100 according to an embodiment of the present invention.
Figure 2 shows a roll type flexible copper foil laminated film (200, 300) according to an embodiment of the present invention.
Figure 3 shows a method of manufacturing a roll-type flexible copper foil laminated film according to an embodiment.

이하, 첨부된 도면을 참조하여 본 발명의 일 실시 예를 설명한다.Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention.

도 1은 본 발명의 일 실시 예를 따른 롤 타입의 연성 동박 적층필름(100)을 나타낸다.1 shows a rolled flexible copper foil laminated film 100 according to an embodiment of the present invention.

도시된 바와 같이, 일정한 두께를 갖는 폴리이미드 필름(110)의 표면 위에 얇은 두께를 갖는 동박(120)이 적층되어 접착된다.As shown, the copper foil 120 having a thin thickness is laminated and bonded on the surface of the polyimide film 110 having a constant thickness.

폴리이미드 필름(110)은 폴리이미드 필름(110)에 대응하는 액상의 폴리머 수지를 동박(120) 위에 캐스팅 도포하고 냉각하여 액상의 폴리머 수지를 경화하여 형성한다.The polyimide film 110 is formed by casting and coating a liquid polymer resin corresponding to the polyimide film 110 on the copper foil 120 and cooling the liquid polymer resin.

이 실시 예에서는 내열성이 좋은 폴리이미드(PI) 필름을 예로 들고 있으나, 다른 종류의 폴리머 필름, 가령 폴리에스테르(PET) 필름을 이용할 수 있다.In this embodiment, a polyimide (PI) film having good heat resistance is taken as an example, but other types of polymer films such as polyester (PET) films may be used.

동박(120)의 표면은 화학적 에칭에 의해 1차로 두께가 얇아지고 기계적 연마에 의해 2차로 두께가 얇아지며, 특히, 기계적 연마에 의해 동박(120)의 표면 조도(Rz)가 향상된다. The surface of the copper foil 120 is first thinned by chemical etching and secondly thinned by mechanical polishing. In particular, the surface roughness Rz of the copper foil 120 is improved by mechanical polishing.

동박(120)의 표면 조도가 향상됨으로써 고주파 특성을 향상시킬 수 있는바, 구체적으로, 고주파에서는 표피 효과(skin effect)에 의해 전류가 주로 금속 표면으로 흐르므로 표면 조도가 작은 동박(120)의 고주파 특성이 좋아진다.The surface roughness of the copper foil 120 can be improved to improve high frequency characteristics. Specifically, at a high frequency, a high frequency of the copper foil 120 having a small surface roughness is caused by the current mainly flowing to the metal surface by a skin effect. The characteristics are better.

바람직하게, 기계적 연마에 의해 2차로 두께가 얇아진 동박 위에는 금속 도금이 추가로 하여 표면 조도를 좋게 하여 고주파 성능을 향상 시키거나 내 부식성을 향상시킬 수 있다.Preferably, on the copper foil thinned secondly by mechanical polishing, metal plating may be added to improve surface roughness to improve high frequency performance or to improve corrosion resistance.

동박(120)의 두께는 1미크론 내지 7미크론 정도이며, 연성 회로기판(FPCB)으로 사용될 때 기계적인 성능 예를 들면 유연성과 굴곡성을 좋게 하기 위하여 동박(120)은 바람직하게 압연 동박일 수 있으며, 이에 한정되지 않고 조달이 용이한 전해 동박을 사용할 수도 있다.The copper foil 120 has a thickness of about 1 to 7 microns, and when used as a flexible printed circuit board (FPCB), the copper foil 120 may be preferably a rolled copper foil to improve mechanical performance, for example, flexibility and flexibility. It is not limited to this, The electrolytic copper foil which is easy to procure can also be used.

도 2는 본 발명의 일 실시 예를 따른 롤 타입의 연성 동박 적층필름(200, 300)을 나타낸다.Figure 2 shows a roll type flexible copper foil laminated film (200, 300) according to an embodiment of the present invention.

도 2a를 보면, 폴리이미드 필름(210) 위에 폴리머 접착제(220)를 개재하여 동박(230)이 접착되어 적층된다.Referring to FIG. 2A, the copper foil 230 is bonded and laminated on the polyimide film 210 via the polymer adhesive 220.

또한, 도 2b를 보면, 폴리이미드 필름(310)의 상면과 하면에 각각 폴리머 접착제(320, 322)를 개재하여 동박(330, 332)이 접착되어 적층된다.2B, the copper foils 330 and 332 are bonded to and laminated on the upper and lower surfaces of the polyimide film 310 via the polymer adhesives 320 and 322, respectively.

도 2a와 2b는 각각 접착제(220, 320, 322)를 개재하여 폴리이미드 필름(210, 310)과 동박(230, 330, 332)이 접착되는 것을 제외하고는 도 1과 같이 1미크론 내지 7미크론 두께의 동박을 구비한다.2A and 2B are 1 micron to 7 micron as shown in FIG. 1 except that the polyimide films 210 and 310 and the copper foils 230, 330 and 332 are bonded through the adhesives 220, 320 and 322, respectively. The copper foil of thickness is provided.

이하, 도 3을 참조하여 일 실시 예에 따른 연성 동박 적층필름의 제조 방법에 대하여 설명한다.Hereinafter, a method of manufacturing a flexible copper foil laminated film according to an embodiment will be described with reference to FIG. 3.

일단이 롤에 감긴 두께가 7미크론을 초과하는 동박(120)이 공급되면, 타단을 다른 롤에 감아 동박(120)에 일정한 장력이 걸리도록 한다.Once the copper foil 120 having a thickness of more than 7 microns wound on the roll is supplied, the other end is wound on another roll to apply a constant tension to the copper foil 120.

이와 같이, 롤-투-롤(roll-to-roll) 방식으로 동박(120)을 공급하면서, 동박(120)의 한 면 위에 용융된 폴리이미드 수지를 캐스팅(casting) 공정에 의해 3미크론 내지 100미크론 범위 내에서 적절한 두께로 도포한 후, 냉각공정을 통해 액상의 폴리이미드 수지가 냉각되어 형성된 폴리이미드 필름(110)이 동박(120) 위에 접착 되도록 한다(단계 S30).As such, while supplying the copper foil 120 in a roll-to-roll manner, the molten polyimide resin is cast on a surface of the copper foil 120 by 3 microns to 100 by a casting process. After coating to an appropriate thickness within the micron range, the polyimide film 110 formed by cooling the liquid polyimide resin through the cooling process to be bonded onto the copper foil (120) (step S30).

이 경우 액상의 폴리이미드 수지는 동박(120) 위에서 냉각되면서 동박(120)과 자기 접착된다.In this case, the liquid polyimide resin is self-bonded with the copper foil 120 while being cooled on the copper foil 120.

이와 달리, 도 2의 구조를 갖는 경우, 폴리이미드 필름(210, 310)의 상면이나 하면 또는 양면에 각각 폴리머 접착제(220, 320, 322)를 개재하여 동박(230, 330, 332)이 접착되어 적층된 연성 동박 적층필름(200, 300)이 롤에 감아 공급할 수 있다.In contrast, in the case of having the structure of FIG. 2, the copper foils 230, 330, and 332 are adhered to the top, bottom, or both surfaces of the polyimide films 210 and 310 through the polymer adhesives 220, 320, and 322, respectively. The laminated flexible copper foil laminated films 200 and 300 may be wound and supplied to a roll.

바람직하게, 폴리이미드 필름(210, 310)과 동박(230, 330, 332)은 열과 압력에 의해 내열 에폭시 접착제(320, 322)에 의해 접착된다.Preferably, the polyimide films 210 and 310 and the copper foils 230, 330 and 332 are bonded by heat resistant epoxy adhesives 320 and 322 by heat and pressure.

이후 폴리이미드 필름(110) 위에 접합된 동박(120)을, 가령 습식공정에 의한 화학 에칭액에 통과시켜 동박(120)의 두께를 1차로 얇게 한다(단계 S31).Then, the copper foil 120 bonded on the polyimide film 110 is passed through a chemical etching solution by a wet process, for example, to thin the thickness of the copper foil 120 primarily (step S31).

이러한 에칭과정을 통하여 동박(120)의 표면 조도가 증가하며, 이에 따라, 표면에서의 구리 입자의 밀도가 낮아지게 된다.Through this etching process, the surface roughness of the copper foil 120 is increased, thereby lowering the density of copper particles on the surface.

도 1의 확대된 원은 A 부분을 확대한 것으로, 최종적인 동박(120)의 표면이 아니라 1차 에칭된 동박(120)의 표면을 나타낸다. 도시된 것처럼, 동박(120)은 정상부분(121)과 에칭 부분(122)이 구별되는데, 에칭 부분(122)은 에칭에 의해 구리 입자의 밀도가 낮아진 상태를 이룬다.The enlarged circle in FIG. 1 is an enlarged view of the portion A, not the surface of the final copper foil 120, but the surface of the primary etched copper foil 120. As shown, the copper foil 120 is distinguished from the top portion 121 and the etching portion 122, the etching portion 122 is a state in which the density of the copper particles is lowered by the etching.

이후, 롤-투-롤 방식으로 인장력이 걸린 동박(120)을 연마 롤 사이를 통과시켜 동박(120)의 표면을 2차로 얇게 한다(단계 S32).Thereafter, the copper foil 120 subjected to the tension in the roll-to-roll manner is passed between the polishing rolls to make the surface of the copper foil 120 second thin (step S32).

상기한 바와 같이, 에칭을 통하여 동박(120)의 표면에서의 구리 입자의 밀도가 낮아진 상태이므로 동박(120)을 연마 롤 사이로 통과시키면, 동박(120)의 표면이 쉽게 연마된다.As described above, since the density of the copper particles on the surface of the copper foil 120 is lowered through etching, when the copper foil 120 is passed between the polishing rolls, the surface of the copper foil 120 is easily polished.

한편, 이 실시 예와 달리, 에칭을 통하여 표면에서의 구리 입자의 밀도가 낮아진 동박(120)을 블레이드를 이용하여 2차로 얇게 할 수 있다. On the other hand, unlike this embodiment, the copper foil 120, the density of the copper particles on the surface through the etching can be thinned secondly by using the blade.

이후,필요에 의해, 기계적 연마에 의해 2차로 두께가 얇아진 동박 위에는 금속 도금이 추가로 하여 표면 조도를 좋게 하여 고주파 성능을 향상시키거나 내 부식성을 향상시킬 수 있다. Thereafter, if necessary, metal plating may be further added on the copper foil thinned second by mechanical polishing to improve surface roughness, thereby improving high frequency performance or improving corrosion resistance.

상기와 같은 과정을 거쳐 두께가 7미크론이 넘는 동박을 7미크론 이하의 두께를 갖도록 가공할 수 있으며, 1차의 에칭과 2차의 연마를 적절하게 조절하여 원하는 두께의 동박을 제조할 수 있다.Through the above process, the copper foil having a thickness of more than 7 microns can be processed to have a thickness of 7 microns or less, and the copper foil having a desired thickness can be manufactured by appropriately adjusting the primary etching and the secondary polishing.

따라서, 7미크론 이하 두께의 동박을 구비하면서도 동박과 폴리이미드 필름의 접착력이 우수하고 제조원가가 저렴하며 기계적 성능이 우수한 롤 타입의 연성 동박 적층필름을 제공할 수 있다.Therefore, it is possible to provide a roll-type flexible copper foil laminated film having excellent adhesion between the copper foil and the polyimide film and having low manufacturing cost and excellent mechanical performance while having copper foil having a thickness of 7 microns or less.

이와 같이 본 발명의 롤 타입의 연성 동박 적층필름은 이후 낱장으로 이루어진 시트 형상의 연성 회로 기판을 자동으로 제조하는 원자재로 사용될 수 있어 미세 패턴을 갖는 연성 회로 기판을 자동화로 제조하는데 필요하다.
As described above, the roll-type flexible copper foil laminated film of the present invention may be used as a raw material for automatically manufacturing a sheet-shaped flexible circuit board made of a sheet, and thus, is required to automatically manufacture a flexible circuit board having a fine pattern.

이상에서는 본 발명의 실시 예를 중심으로 설명하였지만, 당업자의 수준에서 다양한 변경을 가할 수 있음은 물론이다. 따라서, 본 발명의 권리범위는 상기한 실시 예에 한정되어 해석될 수 없으며, 이하에 기재되는 특허청구범위에 의해 해석되어야 한다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Accordingly, the scope of the present invention should not be construed as being limited to the embodiments described above, but should be construed in accordance with the following claims.

100, 200, 300: 연성 동박 적층필름
110, 210, 310: 폴리이미드 필름
120, 230, 330, 332: 동박
220, 320, 322: 폴리머 접착제100, 200, 300: flexible copper foil laminated film
110, 210, 310: polyimide film
120, 230, 330, 332: copper foil
220, 320, 322: polymer adhesive

Claims (10)

삭제delete 삭제delete 삭제delete 삭제delete 롤 타입의 동박의 일단을 롤에 감고 타단을 다른 롤에 고정하여 상기 동박에 인장력이 가해진 상태에서 공급하는 단계;
상기 동박 위에 액상의 폴리머 수지를 캐스팅 도포하고 액상의 폴리머 수지를 냉각하여 형성한 폴리머 필름이 상기 동박에 접착된 폴리머 필름/동박 접합체를 형성하는 단계;
상기 동박의 표면을 화학적 에칭하여 1차로 상기 동박의 두께를 줄이면서 상기 동박 표면의 구리 입자의 밀도가 낮아지도록 하는 단계; 및
상기 에칭된 동박의 표면을 기계적 연마에 의해 2차로 상기 동박의 두께를 줄이는 단계를 포함하는 것을 특징으로 하는 롤 타입의 연성 동박 적층필름의 제조방법.Winding one end of a roll-type copper foil on a roll and fixing the other end to another roll to supply the copper foil in a state where a tensile force is applied;
Forming a polymer film / copper foil assembly bonded to the copper foil by a polymer film formed by casting a liquid polymer resin on the copper foil and cooling the liquid polymer resin;
Chemically etching the surface of the copper foil so that the density of the copper particles on the surface of the copper foil is decreased while primarily reducing the thickness of the copper foil; And
And reducing the thickness of the copper foil secondarily by mechanical polishing the surface of the etched copper foil. 롤 타입의 동박이 폴리머 필름의 적어도 한 면에 접착제에 의해 접착된 폴리머 필름/접착제/동박 접합체의 일단을 롤에 감고 타단을 다른 롤에 고정하여 상기 동박에 인장력이 가해진 상태에서 공급하는 단계;
상기 동박의 표면을 화학적 에칭하여 1차로 상기 동박의 두께를 줄이면서 상기 동박 표면의 구리 입자의 밀도가 낮아지도록 하는 단계; 및
상기 에칭된 동박의 표면을 기계적 연마에 의해 2차로 상기 동박의 두께를 줄이는 단계를 포함하는 것을 특징으로 하는 롤 타입의 연성 동박 적층필름의 제조방법.A roll-type copper foil wound on at least one side of a polymer film / adhesive / copper bond bonded to the at least one side of the polymer film by a roll, and the other end fixed to the other roll to supply the copper foil in a state where a tensile force is applied;
Chemically etching the surface of the copper foil so that the density of the copper particles on the surface of the copper foil is decreased while primarily reducing the thickness of the copper foil; And
And reducing the thickness of the copper foil secondarily by mechanical polishing the surface of the etched copper foil. 청구항 5 또는 6에 있어서,
상기 기계적 연마는, 연마 롤에 의해 연마 또는 블레이드에 의한 연마인 것을 특징으로 하는 롤 타입의 연성 동박 적층필름의 제조방법.
The method according to claim 5 or 6,
The mechanical polishing is a method of producing a flexible copper foil laminated film of a roll type, characterized in that it is polished by a polishing roll or polished by a blade.
청구항 5 또는 6의 방법으로 제조되어 상기 동박이 1미크론 내지 7미크론의 두께를 갖는 것을 특징으로 하는 롤 타입의 연성 동박 적층필름.The rolled flexible copper foil laminated film of claim 5 or 6, wherein the copper foil has a thickness of 1 micron to 7 microns. 청구항 8에 있어서,
상기 동박은 전해 동박 또는 압연 동박 중 어느 하나인 것을 특징으로 하는 롤 타입의 연성 동박 적층필름.The method according to claim 8,
The copper foil is a roll-type flexible copper foil laminated film, characterized in that any one of an electrolytic copper foil or a rolled copper foil. 청구항 8에 있어서,
상기 동박 위에는 금속 도금이 추가로 이루어지는 것을 특징으로 하는 롤 타입의 연성 동박 적층필름.
The method according to claim 8,
Rolled flexible copper foil laminated film, characterized in that the metal plating is further formed on the copper foil.
KR1020120033524A 2012-03-30 2012-03-30 Flexible copper clad laminated film and Method for making the same KR101338861B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080043222A (en) * 2006-11-11 2008-05-16 조인셋 주식회사 Flexible metal clad film and method for making the same
KR20080076373A (en) * 2007-02-15 2008-08-20 엘에스엠트론 주식회사 Method for manufacturing flexible copper clad layer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080043222A (en) * 2006-11-11 2008-05-16 조인셋 주식회사 Flexible metal clad film and method for making the same
KR20080076373A (en) * 2007-02-15 2008-08-20 엘에스엠트론 주식회사 Method for manufacturing flexible copper clad layer

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