KR101335271B1 - The printed circuit board manufacturing method - Google Patents

The printed circuit board manufacturing method Download PDF

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KR101335271B1
KR101335271B1 KR1020130018695A KR20130018695A KR101335271B1 KR 101335271 B1 KR101335271 B1 KR 101335271B1 KR 1020130018695 A KR1020130018695 A KR 1020130018695A KR 20130018695 A KR20130018695 A KR 20130018695A KR 101335271 B1 KR101335271 B1 KR 101335271B1
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South Korea
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psr
bvh
hole
substrate
plating
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KR1020130018695A
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Korean (ko)
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김진대
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주식회사 에스아이 플렉스
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Priority to KR1020130018695A priority Critical patent/KR101335271B1/en
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Publication of KR101335271B1 publication Critical patent/KR101335271B1/en
Priority to CN201410060121.5A priority patent/CN104010454B/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The present invention relates to a BVH coating PSR printing method including: a first process (S10) for processing a BVH hole by irradiating a substrate with an UV laser; a second process (S20) for providing conductivity by processing the surface processed with BVH with chemical copper and a direct plating; and a third process (S30) for printing a PSR to which a via filling plating method is applied in order to reduce PSR skip faults around the hall. The BVH coating PSR printing method which uses a via fill copper plating is able to: reduce a lead time about 60% in comparison with existing methods because a process order, which is processed respectively in three times in existing TOP·BOT when proceeding with a PSR printing, can reduce the process order of TOP·BOT to be processed respectively in one time, total two times, by the application of the via fill copper plating; and, depending on the reduction of a printing number, secure a PSR capacity and reduce losses about the number of people and quality. [Reference numerals] (AA) Start;(BB) End;(S10) First process where a BVII hole is processed;(S20) Second process where the hole is granted with conductivity;(S30) Third process where a PSR method is performed

Description

ＶＩＡ ＦＩＬＬ 동도금을 이용한 ＢＶＨ도포 ＰＳＲ 인쇄공법{The printed circuit board manufacturing method}BH coating PSR printing method using GI FILL copper plating {The printed circuit board manufacturing method}

본 발명은 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법에 관한 것으로서, 더욱 상세하게는 VIA FILL PLATING 공법 적용에 따른 BVH 내부를 동으로 충진하여 PSR을 진행함으로서 BVH 부위의 PSR인쇄가 SKIP되어 불량이 발생하는 것을 방지할 수 있도록 하는 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법에 관한 것이다. The present invention relates to a BVH coating PSR printing method using a VIA FILL copper plating, more specifically, by filling the inside of the BVH according to the VIA FILL PLATING method applied to the copper PSR proceeds to the PSR printing of the BVH site SKIP is defective occurs The present invention relates to a BVH-coated PSR printing method using VIA FILL copper plating, which can be prevented.

핸드폰 및 카메라, LCD 제품 들이 경량, 슬림화되면서 FPCB도 경량화 하기 위해 패턴을 구현하는 방식을 CM와 층을 연결하는 VIA 홀로서 데이타를 전송하는 방식으로 변화하고 잇다. 그로 인한 FPCB에서도 여러 가지 홀 사양이 개발되고 있으며, 여러 가지 홀 사양 중 BVH 사양이 패턴 대체용으로 사용되어 지고 있다.As mobile phones, cameras, and LCD products become lighter and slimmer, FPCB is also changing the way of implementing patterns to transmit data as a VIA hole connecting CM and layers. As a result, various hole specifications are being developed in FPCB, and BVH specification is used for pattern replacement among various hole specifications.

그러나 BVH은 층과 층 사이로 데이터가 전송되므로 빠른 데이터처리가 가능하며 패턴을 대체할 수 있어 슬림화가 가능한 장점을 가지고 있으나, 반대로 층과 층 사이에 노이즈 최소화하기 위해 여러 가지 절연층이 사용되어 전기 동도금 진행시 두께 미달 및 VOID가 발생되는 문제가 발생되었다.
However, BVH has the advantage of being slimmer because it can transfer data between layers and can replace patterns, but on the contrary, various insulating layers are used to minimize noise between layers. There was a problem that less thickness and VOID occurred during the process.

도 1은 종래의 PSR 인쇄 공법의 흐름을 도시한 공정도이고, 도 2는 종래의 PSR 인쇄 공법으로 인해 발생되는 문제점을 도시한 도면이다.1 is a process chart showing the flow of the conventional PSR printing method, Figure 2 is a view showing a problem caused by the conventional PSR printing method.

도 1에 도시된 바와 같이, BVH 가공된 면에 화학동 및 전기 동도금을 진행한 뒤 PSR 인쇄공법을 진행하게 되는데, 홀의 내부에 PSR을 채워넣어야 하므로 여러번에 걸쳐 인쇄를 진행한다. As shown in Figure 1, after the copper copper and electroplating the BVH processed surface is subjected to the PSR printing method, because the PSR must be filled in the inside of the hole is printed several times.

이를 다시 설명하면, 1차 인쇄는 홀 내부를 인쇄하여 홀의 내부만 채우고, 2차 인쇄는 1차 인쇄에서 홀 주변에 미진한 부분과 표면을 인쇄하는 프리즘 인쇄단계이다. 2차 인쇄가 완료된 후에는 완벽한 PHOTO SOLDER RESIST 역할을 하기 위해 3차 인쇄가 이루어진다. In other words, the first printing prints the inside of the hole to fill only the inside of the hole, and the second printing is a prismatic printing step of printing a portion and a surface around the hole in the first printing. After secondary printing is complete, tertiary printing is performed to serve as a complete PHOTO SOLDER RESIST.

상기와 같이 PSR 홀 SKIP 방지를 위해 여러 차례 인쇄 실시로 생산량 및 리드 타임이 증가되는 문제점이 발생하였으며, 3차 인쇄까지 완료된 다음 예비 건조가 이루어지면 홀 내부에 발생하는 열 팽창에 의해 동이 노출되는 가능성이 커지는 문제점이 있었다. As mentioned above, the printing and the lead time were increased by several times of printing to prevent the PSR hole SKIP. If the pre-drying is completed after the third printing, the copper may be exposed by the thermal expansion generated inside the hole. There was this growing problem.

대한민국 특허청 등록특허공보 제10-1009729호Korea Patent Office Registered Patent Publication No. 10-1009729

본 발명은 상기와 같은 종래의 문제점을 해소하기 위한 것으로서, 본 발명의 목적은 PSR 인쇄 진행시 기존 TOP·BOT에 각 3회씩 진행되던 공정 횟수를 VIA FILL 동도금 적용으로 인해 TOP·BOT 각각 1회씩 총 2회로 공정 순서를 줄일 수 있어 그에 따른 리드 타임 감소 및 인쇄 횟수 감소에 따른 PSR CAPA를 확보할 수 있으며 인원 및 품질에 대한 LOSS을 줄일 수 있는 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법을 제공하는 것이다. The present invention is to solve the conventional problems as described above, the object of the present invention is a total of one time each TOP · BOT due to the application of the VIA FILL copper plating the number of processes that were carried out three times to each existing TOP · BOT during the PSR printing process It is possible to reduce the order of the two-circuit process, to secure the PSR CAPA according to the reduction of the lead time and the number of prints, and to provide the BVH-coated PSR printing method using VIA FILL copper plating to reduce the LOSS for the personnel and quality. .

본 발명은 앞서 본 목적을 달성하기 위하여 다음과 같은 구성을 가진 실시예에 의해 구현된다.
In order to achieve the above object, the present invention is implemented by the following embodiments.

본 발명은 기판에 UV LASER를 조사하여 BVH 홀을 가공하는 제1 공정(S10)과, 가공된 BVH 면에 화학동 및 DIRECT PLATING을 처리하여 전도성을 부여한 제 2공정(S20)과, 홀의 주위 PSR SKIP 불량을 감소하기 위해 VIA FILLING PLATING 공법이 적용된 기판에 PSR 인쇄하는 제 3공정(S30)을 포함하는 것을 특징으로 하는 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법을 제공한다.
The present invention is the first step (S10) for processing the BVH hole by irradiating the UV LASER to the substrate, the second step (S20) to give the conductivity by treating chemical copper and DIRECT PLATING on the processed BVH surface, and the PSR around the hole In order to reduce SKIP defects, there is provided a BVH-coated PSR printing method using a VIA FILL copper plating, including a third step (S30) of printing PSR on a substrate to which a VIA FILLING PLATING method is applied.

상기에서 홀에 전도성을 부여하는 제 2공정(S20)은 VIA FILL 전기 동도금을 진행하는 것을 특징으로 하는 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법을 제공한다.
The second step (S20) of imparting conductivity to the hole provides a BVH coating PSR printing method using VIA FILL copper plating, characterized in that the VIA FILL electroplating.

상기에서 홀에 전도성을 부여하는 제 2공정(S20)은 기판의 오염물질을 제거하는 수세단계(S21)와, 상기 수세단계(S21)를 거친 기판에 황산에 brightener 성분을 첨가하는 PRE-DIP단계(S22)와, 상기 PRE-DIP단계(S22)를 거친 기판의 표면에 묻은 첨가물을 제거하는 수세단계(S23)와, 수세된 기판에 전기동도금을 진행하는 동도금단계(S24)를 포함하는 것을 특징으로 하는 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법을 제공한다.
In the second process (S20) of imparting conductivity to the holes, a washing step (S21) for removing contaminants on the substrate and a PRE-DIP step of adding a brightener component to sulfuric acid on the substrate through the washing step (S21) (S22), a washing step (S23) for removing the additives on the surface of the substrate subjected to the PRE-DIP step (S22), and a copper plating step (S24) for electroplating the washed substrate. It provides BVH coating PSR printing method using VIA FILL copper plating.

상기에서 PRE-DIP단계(S22)에 포함된 첨가물은 황산, brightener 및 물을 1:1:8의 비율로 혼합하여 형성하는 것을 특징으로 하는 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법을 제공한다. The additive included in the PRE-DIP step (S22) provides a BVH coating PSR printing method using VIA FILL copper plating, characterized in that formed by mixing sulfuric acid, brightener and water in a ratio of 1: 1: 8.

상술한 바와 같이 본 발명에 따른 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법은 PSR 인쇄 진행시 기존 TOP·BOT에 각 3회씩 진행되던 공정 횟수를 VIA FILL 동도금 적용으로 인해 TOP·BOT 각각 1회씩 총 2회로 공정 순서를 줄일 수 있어 그에 따른 리드 타임이 기존 공법에 대비하여 약 60%정도 감소할 수 있으며, 인쇄 횟수 감소에 따른 PSR CAPA를 확보할 수 있고 인원 및 품질에 대한 LOSS을 줄일 수 있는 효과를 도모할 수 있다. As described above, the BVH-coated PSR printing method using the VIA FILL copper plating according to the present invention is the number of processes that were performed three times in each of the existing TOP and BOT during the PSR printing process. By reducing the circuit process sequence, the lead time can be reduced by about 60% compared to the existing method, PSR CAPA can be secured by reducing the number of prints, and the loss of personnel and quality can be reduced. We can plan.

도 1은 종래의 PSR 인쇄 공법의 흐름을 도시한 공정도
도 2는 종래의 PSR 인쇄 공법으로 인해 발생되는 문제점을 도시한 사진
도 3은 본 발명의 일 실시예에 따른 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법에 대한 개략적인 구성도
도 4는 본 발명의 일 실시예에 따른 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법에 대한 개략적인 흐름도
도 5는 본 발명의 일 실시예에 따른 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법의 PRE-DIP단계에 대한 개략적인 구성도
도 6은 본 발명의 일 실시예에 따른 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법을 이용하여 형성된 기판에 관한 사진1 is a process chart showing the flow of a conventional PSR printing method
Figure 2 is a photograph showing the problems caused by the conventional PSR printing method
3 is a schematic configuration diagram of a BVH coated PSR printing method using a VIA FILL copper plating according to an embodiment of the present invention
Figure 4 is a schematic flowchart of the BVH coating PSR printing method using VIA FILL copper plating according to an embodiment of the present invention
Figure 5 is a schematic diagram of the PRE-DIP step of the BVH coating PSR printing method using VIA FILL copper plating according to an embodiment of the present invention
6 is a photograph of a substrate formed using a BVH coated PSR printing method using a VIA FILL copper plating according to an embodiment of the present invention

이하에서는 본 발명에 따른 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법을 첨부된 도면을 참조하여 상세히 설명한다. 도면들 중 동일한 구성요소들은 가능한 어느 곳에서든지 동일한 부호들로 나타내고 있음에 유의해야 한다. 또한 본 발명의 요지를 불필요하게 흐릴 수 있는 공지 기능 및 구성에 대한 상세한 설명은 생략한다.
Hereinafter, the BVH coating PSR printing method using the VIA FILL copper plating according to the present invention will be described in detail with reference to the accompanying drawings. It is to be noted that like elements in the drawings are represented by the same reference numerals as possible. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

도 3은 본 발명의 일 실시예에 따른 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법에 대한 개략적인 구성도이고, 도 4는 본 발명의 일 실시예에 따른 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법에 대한 개략적인 흐름도이며, 도 5는 본 발명의 일 실시예에 따른 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법의 PRE-DIP단계에 대한 개략적인 구성도이고, 도 6은 본 발명의 일 실시예에 따른 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법을 이용하여 형성된 기판에 관한 사진이다.
3 is a schematic configuration diagram of a BVH coated PSR printing method using a VIA FILL copper plating according to an embodiment of the present invention, Figure 4 is a BVH coated PSR printing method using a VIA FILL copper plating according to an embodiment of the present invention 5 is a schematic configuration diagram of a PRE-DIP step of the BVH-coated PSR printing method using VIA FILL copper plating according to an embodiment of the present invention, and FIG. 6 is an embodiment of the present invention. Photograph of the substrate formed by the BVH coating PSR printing method using the VIA FILL copper plating according to.

본 발명의 일실시예에 따른 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법은 기판에 UV LASER를 조사하여 BVH 홀을 가공하는 제1 공정(S10)과, 가공된 BVH 면에 화학동 및 DIRECT PLATING을 처리하여 전도성을 부여한 제 2공정(S20)과, 홀의 주위 PSR SKIP 불량을 감소하기 위해 VIA FILLING PLATING 공법이 적용된 기판에 PSR 인쇄하는 제 3공정(S30)을 포함한다.
BVH coating using VIA FILL copper plating according to an embodiment of the present invention PSR printing method is the first step (S10) to process the BVH hole by irradiating the UV LASER to the substrate, and the chemical copper and DIRECT PLATING on the processed BVH surface The second step (S20) to give the conductivity by treatment, and the third step (S30) for PSR printing on the substrate to which the VIA FILLING PLATING method is applied to reduce the PSR SKIP defects around the hole.

상기 BVH 홀을 가공하는 제1 공정(S10)은 층과 층 사이 절연 물질인 프리프레그(PREP-RAG)와 커버레이(COVELAY)층을 삽입하여 적층이 진행된 기판을 준비한 다음 LASER 공법을 이용하여 관통방식이 아닌 한면만 BVH HOLE을 가공하는 단계로서, BVH가 TOP면이 아닌 BOT면에도 BVH가 있을 경우 양면 HOLE가공해도 무방하다.
In the first process S10 of processing the BVH hole, a substrate having been laminated is prepared by inserting a pre-preg (PREP-RAG) and a coverlay layer, which are insulating materials between layers, and then penetrating using a LASER method. It is a step to process BVH HOLE only on one side instead of the method. If BVH is present on BOT side instead of TOP side, double sided HOLE may be processed.

상기 홀에 전도성을 부여하는 제 2공정(S20)은 BVH가 가공된 면에 화학동 및 DIRECT PLATING 을 처리하여 전도성을 부여하는 단계로서, 상기 DIRECT PLATING공법은 쉐도우, 블랙홀, 전도송 폴리머 등의 공법을 포함하며, 도금하는 방법을 살펴보면, 먼저 기판의 표면에 묻은 오염물질을 제거하는 수세과정을 거친 뒤 황산에 brightener 성분을 첨가한 PRE-DIP과정을 거치게 되는데, 이때 PRE-DIP과정에서 형성된 첨가물은 황산, brightener 및 물을 1:1:8의 비율로 혼합하여 형성한다. 상기와 같이 형성된 첨가물이 포함된 수조 내에 기판을 침전시켜 첨가물이 기판의 표면 전체에 도포될 수 있도록 하는데 홀의 내부에도 침적될 수 있도록 홀 내부에 첨가물을 분사시킨다. 상기와 같이 PRE-DIP과정을 거친 기판은 다시 수세과정을 거친다. 수세과정을 거친 기판은 표면의 첨가물만 제거되고 홀 내부에는 황산과 brightener가 혼합된 첨가물이 그대로 잔재된 상태로 전기 동도금이 진행된다. 동도금 진행시 홀 내부에 잔재되어 있는 brightener는 ACCELERATOR의 기능을 함으로서 VIA FILLING 성을 좋게 하는 효과를 지닌다.
The second step (S20) of imparting conductivity to the hole is a step of imparting conductivity by treating chemical copper and DIRECT PLATING on the surface where BVH is processed, and the DIRECT PLATING method is a method such as shadow, black hole, conductive polymer, etc. In the method of plating, the water is first washed with water to remove contaminants on the surface of the substrate, followed by a PRE-DIP process in which brightener is added to sulfuric acid. It is formed by mixing sulfuric acid, brightener and water in a ratio of 1: 1: 8. Precipitating the substrate in the water bath containing the additive formed as described above allows the additive to be applied to the entire surface of the substrate to spray the additive inside the hole to be deposited inside the hole. As described above, the substrate that has undergone the PRE-DIP process is washed again with water. After washing with water, only the additives on the surface are removed, and the copper copper plating is carried out with the addition of sulfuric acid and brightener mixed in the hole. The brightener remaining inside the hall during copper plating has the effect of improving the filling performance by acting as an actuator.

상기 PSR 인쇄하는 제 3공정(S30)은 전기동도금이 완료된 기판의 표면에 PSR잉크를 도포하여 인쇄하는 공정으로서, 인쇄된 잉크속의 용제를 증발시켜 잉크의 끈적임을 없앨 수 있도록 예비건조를 거친 다음 작업필름을 이용하여 레지스트가 필요한 부분에 자외선을 조사하는 노광과정을 거친 뒤 UV 중합반응이 되지 않은 잉크 부위(빛을 받지 않은 부분)에 현상액을 용해시켜 잉크를 제거한다.
The third step of printing PSR (S30) is a process of printing by applying a PSR ink on the surface of the substrate, the copper plating is completed, after the pre-drying to remove the stickiness of the ink by evaporating the solvent in the printed ink After the film is exposed to ultraviolet rays to the areas where the resist is required, the developer is dissolved in the ink area (the part not receiving the light) that is not subjected to UV polymerization to remove the ink.

이상에서, 출원인은 본 발명의 다양한 실시예들을 설명하였지만, 이와 같은 실시예들은 본 발명의 기술적 사상을 구현하는 일 실시예일 뿐이며, 본 발명의 기술적 사상을 구현하는 한 어떠한 변경예 또는 수정예도 본 발명의 범위에 속하는 것으로 해석되어야 한다.While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Should be interpreted as falling within the scope of.

S10 : BVH 홀을 가공하는 제1 공정
S20 : 홀에 전도성을 부여하는 제 2공정
S30 : PSR 인쇄하는 제 3공정S10: First process for machining BVH holes
S20: second process of imparting conductivity to the hole
S30: 3rd process of PSR printing

Claims (4)

기판에 UV LASER를 조사하여 BVH 홀을 가공하는 제1 공정(S10)과, 가공된 BVH 가공된 면에 화학동 및 DIRECT PLATING을 처리하여 전도성을 부여한 제 2공정(S20)과, 홀의 주위 PSR SKIP 불량을 감소하기 위해 VIA FILLING PLATING 공법이 적용된 기판에 PSR 인쇄하는 제 3공정(S30)을 포함하며,
상기 홀에 전도성을 부여하는 제 2공정(S20)은 기판의 오염물질을 제거하는 수세단계(S21)와, 상기 수세단계(S21)를 거친 기판에 황산에 brightener 성분을 첨가하는 PRE-DIP단계(S22)와, 상기 PRE-DIP단계(S22)를 거친 기판의 표면에 묻은 첨가물을 제거하는 수세단계(S23)와, 수세된 기판에 전기동도금을 진행하는 동도금단계(S24)를 포함하고,
상기 PRE-DIP단계(S22)에 포함된 첨가물은 황산, brightener 및 물을 1:1:8의 비율로 혼합하여 형성하는 것을 특징으로 하는 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법The first step (S10) of processing the BVH hole by irradiating the UV LASER to the substrate, the second step (S20) of applying the copper and DIRECT PLATING to the processed BVH processed surface to give conductivity, and the PSR SKIP around the hole In order to reduce the defects include a third step (S30) for PSR printing on the substrate to which the VIA FILLING PLATING method is applied,
The second step (S20) of imparting conductivity to the hole includes a washing step (S21) for removing contaminants on the substrate, and a PRE-DIP step of adding a brightener component to sulfuric acid on the substrate through the washing step (S21) ( S22), a washing step (S23) for removing the additives on the surface of the substrate subjected to the PRE-DIP step (S22), and a copper plating step (S24) for performing electrocopper plating on the washed substrate,
The additive contained in the PRE-DIP step (S22) is BVH coated PSR printing method using a VIA FILL copper plating, characterized in that formed by mixing sulfuric acid, brightener and water in a ratio of 1: 1: 8 제1항에 있어서,
상기 홀에 전도성을 부여하는 제 2공정(S20)은 VIA FILL 전기 동도금을 진행하는 것을 특징으로 하는 VIA FILL 동도금을 이용한 BVH도포 PSR 인쇄공법The method of claim 1,
The second step (S20) of imparting conductivity to the hole is performed by VIA FILL electroplating, BVH coating PSR printing method using VIA FILL copper plating 삭제delete 삭제delete
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