KR101334316B1 - Light emitting diode having radiant heating member - Google Patents

Light emitting diode having radiant heating member Download PDF

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Publication number
KR101334316B1
KR101334316B1 KR1020070060711A KR20070060711A KR101334316B1 KR 101334316 B1 KR101334316 B1 KR 101334316B1 KR 1020070060711 A KR1020070060711 A KR 1020070060711A KR 20070060711 A KR20070060711 A KR 20070060711A KR 101334316 B1 KR101334316 B1 KR 101334316B1
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South Korea
Prior art keywords
light emitting
emitting diode
body portion
support
heat dissipation
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KR1020070060711A
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Korean (ko)
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KR20090002180A (en
Inventor
서태원
이상철
정찬성
조토프
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서울반도체 주식회사
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Priority to KR1020070060711A priority Critical patent/KR101334316B1/en
Publication of KR20090002180A publication Critical patent/KR20090002180A/en
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Publication of KR101334316B1 publication Critical patent/KR101334316B1/en

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Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode having a heat dissipation member, comprising a heat dissipation member and a light emitting chip mounted on the heat dissipation member, wherein the heat dissipation member includes a body portion made of a metal material and a side portion of the body portion to surround the body portion. There is provided a light emitting diode comprising a support formed to protrude and a carbon nanotube layer disposed on the support.

Light emitting diode, heat dissipation member, carbon nanotube layer

Description

Light emitting diode having a heat radiating member {Light emitting diode having radiant heating member}

1 is a schematic cross-sectional view of a light emitting diode according to the prior art.

2 is a schematic perspective view of a light emitting diode according to an embodiment of the present invention.

3 and 4 are plan and rear views of the light emitting diode shown in FIG. 2.

FIG. 5 is a cross-sectional view of the light emitting diode shown in FIG. 2 taken along line II. FIG.

6 is a table comparing the heat radiation effect of the light emitting diode according to the prior art and the present invention.

7 is a schematic perspective view of a light emitting diode according to another embodiment of the present invention.

FIG. 8 is a cross-sectional view of the light emitting diode shown in FIG. 7 taken along line II-II. FIG.

Description of the Related Art [0002]

100: light emitting chip 200: heat dissipation member

210: body portion 220: recess

230: support 240: first carbon nanotube layer

250: second carbon nanotube layer 300: printed circuit board

The present invention relates to a light emitting diode having a heat dissipation member, and more particularly to a light emitting diode having a heat dissipation member including a carbon nanotube layer.

The light emitting diode forms a P / N junction on a group III or group V compound semiconductor on a wafer to apply forward current to induce light emission in the visible or near infrared and infrared wavelength bands to display, communicate, measure, control, illuminate, and It is applied to the field.

1 is a schematic cross-sectional view of a light emitting diode according to the prior art. Referring to FIG. 1, a conventional light emitting diode includes a substrate 10, first and second lead terminals 21 and 22 disposed on the substrate 10, and a light emitting chip 30 mounted on the substrate 10. The light emitting chip 30 includes a wire 40 electrically connecting the light emitting chip 30 and the first and second lead terminals 21 and 22, and a molding part 50 to seal the light emitting chip 30. In this case, the light emitting chip 30 may be mounted on the first lead terminal 21 or the second lead terminal 22, and a phosphor (not shown) may be included in the molding part 50.

In general, the brightness of the light emitting diode is proportional to the current applied to the light emitting chip, and the current applied to the light emitting chip is proportional to the heat emitted by the light emitting chip. Therefore, in order to brighten the brightness of the light emitting diode, high current must be applied, but the light emitting chip is damaged due to heat emitted from the light emitting chip. In addition, since the heat generated from the light emitting chip 30 is discharged through the substrate 10 or the first and second lead terminals 21 and 22, the light emitting diode described above is sufficient to emit heat generated from the light emitting chip. Can't. As a result, there is a problem that the lifespan of the light emitting diode is shortened.

SUMMARY OF THE INVENTION The present invention is to overcome the above-mentioned conventional problems, and to provide a light emitting diode having improved heat dissipation efficiency by providing a heat dissipation member including a carbon nanotube layer.

According to an aspect of the invention, the heat radiation member; And a light emitting chip mounted on the heat dissipation member, wherein the heat dissipation member includes a body part made of a metal material; A support part formed to protrude on the side of the body part so as to surround the body part; And a carbon nanotube layer disposed on the support.

A recess is formed in an upper surface of the body portion, and the light emitting chip is mounted in the recess.

A plurality of recesses are formed, and each recess is formed to be spaced apart from each other in an area around the upper surface of the body portion.

The carbon nanotube layer is attached on at least one of one side and the other side of the support.

The support portion is made of a metallic material.

The support portion is formed integrally with the body portion.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

FIG. 2 is a schematic perspective view of a light emitting diode according to an embodiment of the present invention. FIGS. 3 and 4 are plan and rear views of the light emitting diode shown in FIG. 2, and FIG. 5 is a view showing the light emitting diode shown in FIG. 2. It is sectional drawing cut along the line I-I.

2 to 5, the light emitting diode includes a light emitting chip 100, a heat dissipation member 200, and a printed circuit board 300. The heat dissipation member 200 includes a body 210, a recess 220 formed on the body 210, a support 230, and a carbon nanotube layer 240. It is mounted in the set 220.

The light emitting chip 100 is a semiconductor PN junction diode. When the P and N semiconductors are bonded to each other and a voltage is applied thereto, holes of the P-type semiconductor move toward the N-type semiconductor and collect in the middle layer. The electrons move towards the P-type semiconductor and gather into the middle layer, the lowest point of the conduction band. These electrons naturally fall into the holes of the valence band, and at this point, they emit as much energy as the difference in height between the conduction band and the appliance band, that is, the energy gap, which is emitted in the form of light. In addition, various light emitting chips may be used. In addition, the light emitting chip 400 may emit light having various wavelengths. For this purpose, for example, the indium (In) content used as an active layer in a nitride-based light emitting diode may be adjusted, or light having different wavelengths may be used. A light emitting diode emitting light may be combined, or a light emitting chip emitting light of a predetermined wavelength such as ultraviolet light and a phosphor may be used in combination.

The heat dissipation member 200 may include a body portion 210, a recess 220, a support 230, and a carbon nanotube layer 240.

The body portion 210 is made of a metallic material to improve thermal conductivity. The body portion 210 is formed in the shape of a polygonal column whose cross section (ie, a surface cut in a direction parallel to the bottom surface of the body portion 210) is formed in the shape of a polygon. In the present embodiment, the body portion 210 is formed in the form of an octagonal pillar, but is not limited thereto, and may be variously modified, such as a square pillar or a pentagonal pillar.

A recess 220 is provided on an upper surface of the body 210 to provide a mounting space of the light emitting chip 100. A plurality of recesses 220 may be formed, and the plurality of recesses 220 may be spaced apart from each other on an area around the upper surface of the body portion 210, and the plurality of recesses 220 may be spaced apart at equal intervals. It is not intended to be, but may be arranged at boiling intervals. The recess 220 may be formed in the shape of the light emitting chip 100, and the size of the recess 220 may be larger than that of the light emitting chip 100, so that the light emitting chip 100 may be mounted. In the present embodiment, the recess 220 is formed in a rectangular shape, but is not limited thereto, and may be formed in various shapes.

As described above, when the recess 220 is formed on the circumferential region of the body portion 210 instead of the central portion of the body portion 210, the light emitting chip 100 is mounted on the circumferential region of the body portion 210. It is possible to avoid the heat generated in the 100 to the center of the body portion 210, the heat transfer can be made more effectively.

The support 230 is formed to protrude on the side of the body portion to surround the body portion 210. The shape of the support 230 may be formed in the same or similar to the cross-sectional shape of the body portion 210. In the present embodiment, the support 230 is formed in a circular shape, but may be formed in an octagonal shape such as a cross section of the body portion 210.

The support 230 may be made of a metal material similar to the body 210, and may be attached to the body 210 after being integrally formed with the body 210 or separately formed. Like the body portion 210, the support 230 not only emits heat, but also performs a function of supporting the carbon nanotube layer 240 described below.

The carbon nanotube layer 240 is attached to one surface of the support 230 so that the heat transfer path generated in the light emitting chip 100 is transverse (ie, the support 230 and the carbon nanotube layer 240 are In an extended direction) to prevent heat generated from the light emitting chip 100 from being concentrated and transferred to the body portion 210. In the present embodiment, the carbon nanotube layer 240 is attached to the upper surface of the support 230, but may be attached to the lower surface.

When the carbon nanotube layer 240 is attached to the support 230 as described above, the heat generated from the light emitting chip 100 is longitudinally (ie, the body 210 extends) by the body 210. Direction) and transversely by the support 230 and the carbon nanotube layer 240, the heat transfer path is dispersed to improve heat dissipation efficiency.

Looking at the carbon nanotube (CNT: Carbon nanotube) used as the material of the carbon nanotube layer 240, one of the new semiconductor materials based on carbon, carbon is a value of thermal conductivity much higher than Cu However, it is difficult to process in bulk form and requires a high temperature and high pressure process to have a certain strength. In addition, thermal conductivity of carbon has a high thermal conductivity in a constant axial direction when processed into a slice or planar shape, and low thermal conductivity in the other axis direction orthogonal thereto. Carbon nanotubes can be manufactured in a planar shape having a certain thickness while having the properties of carbon, and at this time, the thermal conductivity is high not only in the direction perpendicular to the plane but also in the parallel direction.

6 is a table comparing the heat radiation effect of the light emitting diode according to the prior art and the present invention. Referring to FIG. 6, the temperature of the light emitting chip of the light emitting diode according to the related art without a heat radiating member is 101.6 degrees Celsius, and the thermal resistance of the light emitting diode is 7.7, whereas the temperature of the light emitting chip of the light emitting diode according to the present invention is The thermal resistance is 73.6 degrees Celsius and 4.9, and it can be seen that the heat dissipation effect is significantly improved.

7 is a schematic perspective view of a light emitting diode according to another embodiment of the present invention, and FIG. 8 is a cross-sectional view of the light emitting diode shown in FIG. 7 taken along the line II-II. 7 and 8, the structure of the carbon nanotube layer is different from the above embodiment, and the rest of the configuration is almost similar, and will be described below with a different configuration.

7 and 8, the light emitting diode includes a light emitting chip 100, a heat dissipation member 200, and a printed circuit board 300. The heat dissipation member 200 includes a body portion 210, a recess 220 formed on the body portion 210, a support portion 230, a first carbon nanotube layer 240, and a second carbon nanotube layer 250. The light emitting chip 100 is mounted in the recess 220.

The first carbon nanotube layer 240 is attached on one surface of the support 230, and the second carbon nanotube layer 250 is attached on the other surface of the support 230, so that the heat generated from the light emitting chip 100 may be reduced. By inducing the transfer path in the transverse direction (that is, the direction in which the support 230 and the carbon nanotube layer 240 extends), the heat generated from the light emitting chip 100 is concentrated and transferred to the body portion 210 Will be prevented.

What has been described above is only an exemplary embodiment of a light emitting diode having a heat dissipation member according to the present invention, and the present invention is not limited to the above embodiment, and as claimed in the following claims, Without departing from the gist of the present invention, one of ordinary skill in the art will have the technical spirit of the present invention to the extent that various modifications can be made.

As described above, according to the present invention, the heat dissipation member is formed using the carbon nanotube layer to diversify the heat transfer path generated from the light emitting chip, thereby further improving the heat dissipation effect of the light emitting diode.

Claims (9)

Heat dissipation member; And It includes a light emitting chip mounted on the heat radiating member, The heat dissipation member, A body portion made of a metallic material; A support part formed to protrude on the side of the body part so as to surround the body part; And A light emitting diode comprising a carbon nanotube layer disposed on the support. The method of claim 1, A recess is formed in an upper surface of the body portion, wherein the light emitting chip is mounted in the recess. The method of claim 1, The body portion is a light emitting diode, characterized in that the cross section is formed in the shape of a polygon. The method of claim 3, The support portion is a light emitting diode, characterized in that the cross section is formed in the same shape as the cross section of the body portion. 3. The method of claim 2, A plurality of recesses are formed, and each recess is formed to be spaced apart from each other in the peripheral area of the upper surface of the body portion. The method of claim 1, The carbon nanotube layer is a light emitting diode, characterized in that attached to at least one side of one side and the other side of the support. The method of claim 1, The support portion is a light emitting diode, characterized in that made of a metallic material. The method of claim 1, The support portion is a light emitting diode, characterized in that formed integrally with the body portion. The method of claim 1, The support portion is formed separately from the body portion, characterized in that attached to the body portion.
KR1020070060711A 2007-06-20 2007-06-20 Light emitting diode having radiant heating member KR101334316B1 (en)

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KR101334316B1 true KR101334316B1 (en) 2013-11-28

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102283073B1 (en) 2021-01-08 2021-07-28 새빛이앤엘 (주) Hybrid Heat Dissipation Assembly using Elastic Interlayer with CNT Layer and Fabrication Method Thereof
KR102321545B1 (en) 2021-06-29 2021-11-03 심용철 Elastic Interlayer Manufactureing Method of Hybrid Heat Dissipation Assembly

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101025763B1 (en) * 2009-04-24 2011-04-04 이춘희 Power heat radiation apparatus for high luminant LED
KR102013161B1 (en) 2012-08-20 2019-08-23 삼성디스플레이 주식회사 Back light assembly and display apparatus having the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020046338A (en) * 2000-12-12 2002-06-21 엘지전자 주식회사 Heat sink using carbon nanotube
KR20050111298A (en) * 2004-05-21 2005-11-24 서울반도체 주식회사 Light-emitting diode package using high thermal conductive reflector and manufacturing method of the same
KR100697664B1 (en) 2005-11-21 2007-03-20 서울반도체 주식회사 LED using carbon nano tube

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020046338A (en) * 2000-12-12 2002-06-21 엘지전자 주식회사 Heat sink using carbon nanotube
KR20050111298A (en) * 2004-05-21 2005-11-24 서울반도체 주식회사 Light-emitting diode package using high thermal conductive reflector and manufacturing method of the same
KR100697664B1 (en) 2005-11-21 2007-03-20 서울반도체 주식회사 LED using carbon nano tube

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102283073B1 (en) 2021-01-08 2021-07-28 새빛이앤엘 (주) Hybrid Heat Dissipation Assembly using Elastic Interlayer with CNT Layer and Fabrication Method Thereof
KR102321545B1 (en) 2021-06-29 2021-11-03 심용철 Elastic Interlayer Manufactureing Method of Hybrid Heat Dissipation Assembly

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