KR101334316B1 - Light emitting diode having radiant heating member - Google Patents
Light emitting diode having radiant heating member Download PDFInfo
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- KR101334316B1 KR101334316B1 KR1020070060711A KR20070060711A KR101334316B1 KR 101334316 B1 KR101334316 B1 KR 101334316B1 KR 1020070060711 A KR1020070060711 A KR 1020070060711A KR 20070060711 A KR20070060711 A KR 20070060711A KR 101334316 B1 KR101334316 B1 KR 101334316B1
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- KR
- South Korea
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- light emitting
- emitting diode
- body portion
- support
- heat dissipation
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Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode having a heat dissipation member, comprising a heat dissipation member and a light emitting chip mounted on the heat dissipation member, wherein the heat dissipation member includes a body portion made of a metal material and a side portion of the body portion to surround the body portion. There is provided a light emitting diode comprising a support formed to protrude and a carbon nanotube layer disposed on the support.
Light emitting diode, heat dissipation member, carbon nanotube layer
Description
1 is a schematic cross-sectional view of a light emitting diode according to the prior art.
2 is a schematic perspective view of a light emitting diode according to an embodiment of the present invention.
3 and 4 are plan and rear views of the light emitting diode shown in FIG. 2.
FIG. 5 is a cross-sectional view of the light emitting diode shown in FIG. 2 taken along line II. FIG.
6 is a table comparing the heat radiation effect of the light emitting diode according to the prior art and the present invention.
7 is a schematic perspective view of a light emitting diode according to another embodiment of the present invention.
FIG. 8 is a cross-sectional view of the light emitting diode shown in FIG. 7 taken along line II-II. FIG.
Description of the Related Art [0002]
100: light emitting chip 200: heat dissipation member
210: body portion 220: recess
230: support 240: first carbon nanotube layer
250: second carbon nanotube layer 300: printed circuit board
The present invention relates to a light emitting diode having a heat dissipation member, and more particularly to a light emitting diode having a heat dissipation member including a carbon nanotube layer.
The light emitting diode forms a P / N junction on a group III or group V compound semiconductor on a wafer to apply forward current to induce light emission in the visible or near infrared and infrared wavelength bands to display, communicate, measure, control, illuminate, and It is applied to the field.
1 is a schematic cross-sectional view of a light emitting diode according to the prior art. Referring to FIG. 1, a conventional light emitting diode includes a
In general, the brightness of the light emitting diode is proportional to the current applied to the light emitting chip, and the current applied to the light emitting chip is proportional to the heat emitted by the light emitting chip. Therefore, in order to brighten the brightness of the light emitting diode, high current must be applied, but the light emitting chip is damaged due to heat emitted from the light emitting chip. In addition, since the heat generated from the
SUMMARY OF THE INVENTION The present invention is to overcome the above-mentioned conventional problems, and to provide a light emitting diode having improved heat dissipation efficiency by providing a heat dissipation member including a carbon nanotube layer.
According to an aspect of the invention, the heat radiation member; And a light emitting chip mounted on the heat dissipation member, wherein the heat dissipation member includes a body part made of a metal material; A support part formed to protrude on the side of the body part so as to surround the body part; And a carbon nanotube layer disposed on the support.
A recess is formed in an upper surface of the body portion, and the light emitting chip is mounted in the recess.
A plurality of recesses are formed, and each recess is formed to be spaced apart from each other in an area around the upper surface of the body portion.
The carbon nanotube layer is attached on at least one of one side and the other side of the support.
The support portion is made of a metallic material.
The support portion is formed integrally with the body portion.
Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.
FIG. 2 is a schematic perspective view of a light emitting diode according to an embodiment of the present invention. FIGS. 3 and 4 are plan and rear views of the light emitting diode shown in FIG. 2, and FIG. 5 is a view showing the light emitting diode shown in FIG. 2. It is sectional drawing cut along the line I-I.
2 to 5, the light emitting diode includes a
The
The
The
A
As described above, when the
The
The
The
When the
Looking at the carbon nanotube (CNT: Carbon nanotube) used as the material of the
6 is a table comparing the heat radiation effect of the light emitting diode according to the prior art and the present invention. Referring to FIG. 6, the temperature of the light emitting chip of the light emitting diode according to the related art without a heat radiating member is 101.6 degrees Celsius, and the thermal resistance of the light emitting diode is 7.7, whereas the temperature of the light emitting chip of the light emitting diode according to the present invention is The thermal resistance is 73.6 degrees Celsius and 4.9, and it can be seen that the heat dissipation effect is significantly improved.
7 is a schematic perspective view of a light emitting diode according to another embodiment of the present invention, and FIG. 8 is a cross-sectional view of the light emitting diode shown in FIG. 7 taken along the line II-II. 7 and 8, the structure of the carbon nanotube layer is different from the above embodiment, and the rest of the configuration is almost similar, and will be described below with a different configuration.
7 and 8, the light emitting diode includes a
The first
What has been described above is only an exemplary embodiment of a light emitting diode having a heat dissipation member according to the present invention, and the present invention is not limited to the above embodiment, and as claimed in the following claims, Without departing from the gist of the present invention, one of ordinary skill in the art will have the technical spirit of the present invention to the extent that various modifications can be made.
As described above, according to the present invention, the heat dissipation member is formed using the carbon nanotube layer to diversify the heat transfer path generated from the light emitting chip, thereby further improving the heat dissipation effect of the light emitting diode.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070060711A KR101334316B1 (en) | 2007-06-20 | 2007-06-20 | Light emitting diode having radiant heating member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020070060711A KR101334316B1 (en) | 2007-06-20 | 2007-06-20 | Light emitting diode having radiant heating member |
Publications (2)
Publication Number | Publication Date |
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KR20090002180A KR20090002180A (en) | 2009-01-09 |
KR101334316B1 true KR101334316B1 (en) | 2013-11-28 |
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KR1020070060711A KR101334316B1 (en) | 2007-06-20 | 2007-06-20 | Light emitting diode having radiant heating member |
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KR (1) | KR101334316B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102283073B1 (en) | 2021-01-08 | 2021-07-28 | 새빛이앤엘 (주) | Hybrid Heat Dissipation Assembly using Elastic Interlayer with CNT Layer and Fabrication Method Thereof |
KR102321545B1 (en) | 2021-06-29 | 2021-11-03 | 심용철 | Elastic Interlayer Manufactureing Method of Hybrid Heat Dissipation Assembly |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101025763B1 (en) * | 2009-04-24 | 2011-04-04 | 이춘희 | Power heat radiation apparatus for high luminant LED |
KR102013161B1 (en) | 2012-08-20 | 2019-08-23 | 삼성디스플레이 주식회사 | Back light assembly and display apparatus having the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020046338A (en) * | 2000-12-12 | 2002-06-21 | 엘지전자 주식회사 | Heat sink using carbon nanotube |
KR20050111298A (en) * | 2004-05-21 | 2005-11-24 | 서울반도체 주식회사 | Light-emitting diode package using high thermal conductive reflector and manufacturing method of the same |
KR100697664B1 (en) | 2005-11-21 | 2007-03-20 | 서울반도체 주식회사 | LED using carbon nano tube |
-
2007
- 2007-06-20 KR KR1020070060711A patent/KR101334316B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020046338A (en) * | 2000-12-12 | 2002-06-21 | 엘지전자 주식회사 | Heat sink using carbon nanotube |
KR20050111298A (en) * | 2004-05-21 | 2005-11-24 | 서울반도체 주식회사 | Light-emitting diode package using high thermal conductive reflector and manufacturing method of the same |
KR100697664B1 (en) | 2005-11-21 | 2007-03-20 | 서울반도체 주식회사 | LED using carbon nano tube |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102283073B1 (en) | 2021-01-08 | 2021-07-28 | 새빛이앤엘 (주) | Hybrid Heat Dissipation Assembly using Elastic Interlayer with CNT Layer and Fabrication Method Thereof |
KR102321545B1 (en) | 2021-06-29 | 2021-11-03 | 심용철 | Elastic Interlayer Manufactureing Method of Hybrid Heat Dissipation Assembly |
Also Published As
Publication number | Publication date |
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KR20090002180A (en) | 2009-01-09 |
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