KR101307940B1 - Laser direct structuring type, double injection type electro-less colored plating method and intenna thereof - Google Patents

Laser direct structuring type, double injection type electro-less colored plating method and intenna thereof Download PDF

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KR101307940B1
KR101307940B1 KR1020130025405A KR20130025405A KR101307940B1 KR 101307940 B1 KR101307940 B1 KR 101307940B1 KR 1020130025405 A KR1020130025405 A KR 1020130025405A KR 20130025405 A KR20130025405 A KR 20130025405A KR 101307940 B1 KR101307940 B1 KR 101307940B1
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South Korea
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black
nickel
plating
plating method
copper
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KR1020130025405A
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Korean (ko)
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김광종
박중형
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(주) 우진 더블유.티.피.
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set

Abstract

PURPOSE: A laser direct structuring type and a double injection type black-colored electroless plating method and an intenna by the same are provided to reduce processes, to improve the reliability of a product by reducing failure, and to obtain a glossy product. CONSTITUTION: A laser direct structuring type and a double injection type black-colored electroless plating method includes the following steps of: washing polluted materials in processes of double molding and forming circuit patterns and rearranging uneven portions; walking down acid utilized for forming a concavo-convex portion after forming the concavo-convex portion on the surface of a target object; applying catalyst on the surface of the target object and plating copper on the surface of the target object after the catalyst is absorbed; platting the circuit patterns by dipping the target object into solution including nickel and a black-colored pigment. [Reference numerals] (AA) Start; (BB) End; (S110) Step of first preprocessing; (S120) Step of second preprocessing; (S130) Step of activating; (S140) Step of copper striking; (S150) Step of copper plating; (S160) Step of applying a nickel catalyst; (S170) Step of colored-copper plating; (S180) Step of post-processing and packaging

Description

LDS형, 이중사출형 흑색을 포함하는 무전해 도금 방법 및 이에 의한 인테나 {Laser Direct Structuring Type, Double Injection Type Electro-less Colored Plating Method and Intenna thereof}Electroless plating method including LDS type, double injection type black and intena {Laser Direct Structuring Type, Double Injection Type Electro-less Colored Plating Method and Intenna Technical}

본 발명은 LDS 또는 이중사출형 흑색을 포함하는 무전해 도금 방법 및 이에 의한 인테나에 관한 것으로, 특히, 니켈 도금시 색이 있는 안료(pigment) 또는 염료(dye)를 포함한 용액을 사용하여 흑색 도금이 가능한 LDS 또는 이중사출 무전해 유색도금 방법 및 이에 의한 인테나를 제공하는 것이다.The present invention relates to an electroless plating method including an LDS or a double injection type black, and to an intenna, and in particular, black plating is performed by using a solution containing colored pigments or dyes during nickel plating. It is to provide a possible LDS or dual injection electroless color plating method and thereby an intenna.

일반적으로 송수신기기 혹은 휴대폰의 외부로 돌출된 안테나를 구비한 스마트폰과 같은 모바일기기는 그 디자인의 다양화와 슬림화가 어려워 안테나를 모바일기기 하우징 내부에 인쇄회로기판과 연결시켜 놓아 외부에 돌출부가 없으면서 안테나 특성을 유지하도록 설계된 것을 안테나 중에서도 인테나(Intenna)라고 한다.In general, a mobile device such as a smart phone having an antenna protruding outside of a transceiver or a mobile phone is difficult to diversify and slim in design, so that the antenna is connected to a printed circuit board inside the housing of the mobile device so that there is no protrusion on the outside. One of the antennas designed to maintain antenna characteristics is called Intenna.

이러한 인테나는 모바일기기의 디자인을 다양하게 설계할 수 있을 뿐만 아니라 모바일기기의 두께를 줄여 슬림화할 수 있는 장점을 제공한다.Such an antenna not only can design a variety of designs of a mobile device, but also provides an advantage of slimming down the thickness of a mobile device.

인테나는 현재 크게 두, 세 가지 방법으로 제조하고 있으며 이들 방법은 다음과 같다.Intena is currently manufactured in two or three ways.

하나의 방법은 모바일기기 설계에 따라 하우징과 인쇄회로기판이 배치되며 인테나 내장 공간이 정해지고 이에 대응한 플라스틱 사출금형을 제작하여 사출 성형된 베이스에 인테나 회로 패턴에 대응한 프레스 금형을 제작하여 동 박판이나 스테인레스 박판 등으로 타발하고 절곡하여 베이스에 끼워 열융착으로 고정시켜 인테나의 기능을 부가하는 방법으로 현재에도 사용되고 있다.One method is to place the housing and printed circuit board according to the design of the mobile device, to define the interior space of the interior, and to manufacture the plastic injection mold corresponding to it, and to manufacture the press mold corresponding to the interior circuit pattern on the injection molded base. It is also used in the present invention as a method of adding the function of intenna by punching and bending with stainless steel thin plate and fitting it to the base to be fixed by heat fusion.

다른 방법은 이중 사출법으로 인테나 내장 공간의 형태에 따라 설계된 베이스에 회로패턴을 설계한 후 베이스 사출금형과 회로패턴 사출금형을 연계하여 제작하여 이중사출기를 사용하여 베이스와 회로패턴의 사출재료를 각기 다른 성분의 플라스틱 재료로 이중사출하면서 베이스에 회로패턴을 형성하는 방법이다. 이중사출품의 회로패턴 부위에만 무전해 도금을 실시하여 인테나를 제조한다. 그러나, 이중 사출법은 금형 제작 기간에 시간과 비용이 많이 소요되며 금형 개발 등에 시간이 많이 걸린다는 단점을 갖는다.Another method is the double injection method, which design the circuit pattern on the base designed according to the shape of the interior space and then connect the base injection mold and the circuit pattern injection mold, and use the double injection machine to produce the injection material of the base and the circuit pattern, respectively. It is a method of forming a circuit pattern on a base while double-injecting with another plastic material. The intenna is produced by electroless plating only on the circuit pattern portion of the double injection product. However, the double injection method has a disadvantage in that it takes a lot of time and money in the mold production period and takes a lot of time in mold development.

또 다른 방법은 플라스틱 원재료에 도금이 될 수 있도록 활성제인 금속성분 및 충진제를 혼입하여 사용하는 레이저(Laser) 방식이다. 이 방법은 사출성형품에 회로패턴을 레이저로 가공하여 인테나를 제조하므로 엘디에스(이하에서 ‘LDS’라 함, Laser Direct Structuring)법이라고 하며 개발 내지 제조과정에서 시간을 절감할 수 있어 경제성을 향상시킬 수 있는 최신 기술의 하나이다. 즉, 도금의 씨앗(seed)인 금속 성분이 원재료(Resin)에 혼입되어 있어 이중사출법에 따른 공정과 비교하면 에칭공정, 중화공정, 활성공정 등이 생략되어 제조 시간을 절감할 수 있다는 장점을 갖는다. 그러나, 이러한 이중사출법 또는 LDS법에서도 도금 공정을 거친 뒤에 니켈 도금을 한 부분과 인테나를 포함하는 최종 제품인 예를 들면 스마트폰의 색상과 조화를 이루지 않아 스마트폰의 색상과 조화를 이루도록 별도의 도장 내지 코팅 공정을 진행하고 있다. Another method is a laser method in which a metal ingredient and a filler, which are active agents, are mixed and used to plate the plastic raw materials. This method is called LDS (Laser Direct Structuring) method because it manufactures the intenna by processing the circuit pattern on the injection molded product by laser. It can save time in development and manufacturing process and improve the economical efficiency It is one of the latest technologies to be able. That is, since the metal component, which is the seed of plating, is mixed in the raw material, it is possible to reduce the manufacturing time by eliminating the etching process, the neutralizing process, and the active process as compared with the double injection method. Have However, even in such a double injection method or LDS method, the final product including nickel-plated part and intena after the plating process, for example, does not match the color of the smartphone, so that the separate coating to match the color of the smartphone To the coating process.

이러한 엘디에스 도금방법에 대한 일예가 대한민국 등록특허 제10-1167568호에 개시되어 있다.An example of such a plating method is disclosed in Republic of Korea Patent No. 10-1167568.

그러나, 이러한 종래기술에서는 도금 공정이 완료된 이후에 별도의 도장 공정이 진행되어 도장에 따른 불량 발생하고 별도의 도장 공정이 진행되어야 하여 공정이 증가하여 공정추가에 따른 비용이 발생되고 증가한 공정에 따른 시간이 증가와 도장에 따른 불량 손실 등이 발생할 수 있다는 우려가 있다.However, in such a prior art, after the plating process is completed, a separate coating process is performed to cause defects due to the painting, and a separate coating process is to be performed, thereby increasing the process and incurring the cost of adding the process and increasing the time according to the increased process. There is a concern that this increase and defect loss due to coating may occur.

본 발명의 목적은, 공정을 간단하고 편리하게 단축할 수 있는 LDS 또는 이중사출형 흑색을 포함하는 무전해 도금 방법 및 이에 의한 인테나를 제공하는 것이다.SUMMARY OF THE INVENTION An object of the present invention is to provide an electroless plating method comprising an LDS or double injection type black and an intenna thereby, which can simplify the process simply and conveniently.

또한, 본 발명의 다른 목적은, 불량률을 절감하여 제품의 신뢰성을 향상시킬 수 있는 LDS 또는 이중사출형 흑색을 포함하는 무전해 도금 방법 및 이에 의한 인테나를 제공하는 것이다.In addition, another object of the present invention is to provide an electroless plating method including an LDS or double injection type black and an intenna thereby, which can reduce a defective rate and improve product reliability.

또한, 본 발명의 또 다른 목적은, 경제성과 외적 미감을 향상시킬 수 있는 LDS 또는 이중사출형 흑색을 포함하는 무전해 도금 방법 및 이에 의한 인테나를 제공하는 것이다.In addition, another object of the present invention is to provide an electroless plating method including an LDS or a double injection type black and an intenna which can improve economics and external aesthetics.

삭제delete

본 발명의 목적은, 소재를 이중 사출 과정 및 회로 패턴을 형성하는 과정에서 오염된 물질을 세척하고 사출 성형시 불균일한 부분을 재배열하는 초음파 탈지 단계와; 도금을 하고자 하는 표면에 요철을 형성하는 에칭 단계와; 상기 에칭 단계에서 사용된 산을 중화시키는 중화 단계와; 도금을 하고자 하는 표면에 촉매를 부여하고 흡착된 후 동도금하는 활성화 및 동스크라이크 단계와; 동도금된 표면에서 이온의 활성화를 부여하는 니켈촉매 단계와; 니켈과 흑색을 포함하는 안료(pigment)를 포함하는 용액에 상기 소재를 침지하여 상기 회로 패턴을 도금하는 흑색니켈 단계;를 포함하고, 상기 흑색니켈 단계에서 용액은 순수 700~850g/ℓ, 니켈 4.4~5.2g/ℓ를 포함한 안료 44~52g/ℓ, 차아인산나트륨 20~25g/ℓ, 안정제 2~5g/ℓ 범위의 니켈 및 흑색용액을 포함하고, pH 7.0~7.5 범위에서 온도 82~86℃를 유지한 상태에서 상기 회로 패턴 상에 니켈 금속막이 형성되는 것을 특징으로 하는 흑색을 포함하는 무전해 도금 방법에 의하여 달성된다.An object of the present invention, the ultrasonic degreasing step of cleaning the contaminated material in the process of forming a double injection process and the circuit pattern of the material and rearranges the uneven portion during the injection molding; An etching step of forming irregularities on the surface to be plated; Neutralizing the acid used in the etching step; An activation and copper strike step of applying a catalyst to the surface to be plated, adsorbing, and then copper plating; A nickel catalyst step of imparting activation of ions on the copper plated surface; The black nickel step of plating the circuit pattern by immersing the material in a solution containing a pigment (pigment) containing nickel and black; In the black nickel step, the solution is pure 700 ~ 850 g / L, nickel 4.4 Pigment containing ˜5.2 g / l, 44-52 g / l, sodium hypophosphite 20-25 g / l, stabilizer 2-5 g / l, nickel and black solution, pH 82-86 ° C. It is achieved by the electroless plating method including black, characterized in that a nickel metal film is formed on the circuit pattern in the state.

삭제delete

또한, 상기 니켈 및 흑색용액에는 인 성분이 1~3wt%를 포함하는 것이 바람직하다.In addition, the nickel and the black solution preferably contains 1 to 3 wt% of a phosphorus component.

한편, 본 발명의 목적은, 흑색을 포함하는 무전해 흑색도금 방법에 의해 제조된 인테나에 의해서도 달성된다.On the other hand, the objective of this invention is also achieved by the intena manufactured by the electroless black plating method containing black.

본 발명에 따르면, 공정을 간단하고 편리하게 단축할 수 있고, 불량률을 절감하여 제품의 신뢰성을 향상시킬 수 있으며, 경제성과 미감을 향상시킬 수 있는 LDS 또는 이중사출형 흑색을 포함하는 무전해 도금 방법 및 이에 의한 인테나를 제공할 수 있다.According to the present invention, the electroless plating method including the LDS or double injection type black, which can shorten the process simply and conveniently, improve the reliability of the product by reducing the defective rate, and improve the economics and aesthetics. And thereby an intenna.

즉, LDS 또는 이중사출 인테나 무전해 도금에서 회로 패턴 부위에 도금색상이 순수 금속니켈 색으로 휴대폰 색상과 조화가 되지 않아 캐리어(예를 들면, 재질 PC) 부위 및 회로 패턴 전체에 도장을 실시한다. 도장시 발생되는 기포 와 캐리어 크랙(Crack) 외에 도장 찌꺼기가 표면에 이물 등이 달라붙는 불량을 현저하게 감소시키고, 도금 시 발생되는 패턴 가장자리에 미세한 과도금과 세척과정에서 발생되는 얼룩불량을 감소시킬 수 있고, 도장 작업이 삭제되어 작업절감에 따른 경제적 효과를 향상시킬 수 있다.That is, in LDS or double injection intena electroless plating, the plating color on the circuit pattern part is pure metal nickel color and is not compatible with the cell phone color. In addition to the bubbles and carrier cracks generated during painting, the paint dregs significantly reduce defects such as foreign matters sticking to the surface, and reduce fine stains caused by fine over-plating and cleaning process on the pattern edges generated during plating. And, the painting work can be deleted to improve the economic effect of the work saving.

도 1은 본 발명의 일실시예에 따른 LDS 무전해 흑색도금 방법의 개략 공정도,
도 2는 본 발명의 일실시예에 따른 이중사출 무전해 흑색도금 방법의 개략 공정도,
3a는 본 발명의 일실시예에 따른 모바일 기기의 인테나를 형성하는 LDS 흑색도금 방법 및 이중사출 흑색도금 방법에 의한 소재의 도금 단계 이후의 사진,
3b는 본 발명의 일실시예에 따른 모바일 기기의 인테나를 형성하는 LDS 흑색도금 방법 및 이중사출 흑색도금 방법에 의한 소재의 유색도금 단계 이후의 사진,
3c는 본 발명의 일실시예에 따른 모바일 기기의 인테나를 형성하는 LDS 흑색도금 방법 및 이중사출 흑색도금 방법에 의한 소재의 후처리인 조립 단계 이후의 사진,
도 4a 내지 도 4c는 종래기술에서 모바일 기기의 인테나를 형성하기 위한 순차적 과정으로 동도금 단계, 니켈도금 단계, 도장 단계 이후의 사진이다.1 is a schematic process diagram of an LDS electroless black plating method according to an embodiment of the present invention;
2 is a schematic process diagram of a double injection electroless black plating method according to an embodiment of the present invention;
3a is a photograph after the plating step of the material by the LDS black plating method and the double injection black plating method for forming an intenna of a mobile device according to an embodiment of the present invention,
3b is a photograph after the colored plating step of the material by the LDS black plating method and the double injection black plating method for forming an antenna of the mobile device according to an embodiment of the present invention,
3c is a photograph after the assembling step, which is a post-treatment of the material by the LDS black plating method and the double injection black plating method for forming an intenna of a mobile device according to an embodiment of the present invention;
4A to 4C are photographs after the copper plating step, the nickel plating step, and the painting step as a sequential process for forming an intenna of a mobile device in the prior art.

본 발명의 일실시예에 따른 LDS 타입, 이중사출 타입 무전해 흑색도금 방법 및 이에 의한 인테나에 대하여 도 1 내지 도 4c 를 참조하여 구체적으로 설명하면 다음과 같다.An LDS type, a double injection type electroless black plating method, and an intenna according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 4C.

도 1은 본 발명의 일실시예에 따른 LDS 무전해 흑색도금 방법의 개략 공정도이고, 도 2는 본 발명의 일실시예에 따른 이중사출 무전해 흑색도금 방법의 개략 공정도이며, 3a는 본 발명의 일실시예에 따른 모바일 기기의 인테나를 형성하는 LDS 흑색도금 방법 및 이중사출 흑색도금 방법에 의한 소재의 도금 단계 이후의 사진이고, 3b는 본 발명의 일실시예에 따른 모바일 기기의 인테나를 형성하는 LDS 흑색도금 방법 및 이중사출 흑색도금 방법에 의한 소재의 흑색도금 단계 이후의 사진이며, 3c는 본 발명의 일실시예에 따른 모바일 기기의 인테나를 형성하는 LDS 흑색도금 방법 및 이중사출 흑색도금 방법에 의한 소재의 후처리인 조립 단계 이후의 사진이고, 도 4a 내지 도 4c는 종래기술에서 모바일 기기의 인테나를 형성하기 위한 순차적 과정으로 동도금 단계, 니켈도금 단계, 도장 단계 이후의 사진이다.1 is a schematic process diagram of the LDS electroless black plating method according to an embodiment of the present invention, Figure 2 is a schematic process diagram of a double injection electroless black plating method according to an embodiment of the present invention, 3a The LDS black plating method for forming the antenna of the mobile device according to an embodiment and the picture after the plating step of the material by the double injection black plating method, 3b is to form the antenna of the mobile device according to an embodiment of the present invention The photograph after the black plating step of the material by the LDS black plating method and the double injection black plating method, 3c is an LDS black plating method and a double injection black plating method for forming an intenna of a mobile device according to an embodiment of the present invention. Figure 4a to 4c is a post-assembly after the assembling step of the material by the step, copper plating step as a sequential process for forming the intenna of the mobile device in the prior art , A photograph after the nickel plating step, coating step.

먼저 본 발명의 일실시예에 따른 LDS 타입 무전해 흑색도금 방법(이하에서 ‘무전해 흑색도금 방법’이라 함)에 대하여 도 1, 도 3a 내지 도 3c를 참조하여 구체적으로 설명하면 다음과 같다.First, the LDS type electroless black plating method (hereinafter, referred to as an 'electroless black plating method') according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 and 3A to 3C.

무전해 흑색도금 방법은 도 1에 도시된 바와 같이 전처리 1단계(S110), 전처리 2단계(S120), 활성화 단계(S130), 동스트라이크 단계(S140), 동도금 단계(S150), 니켈촉매 단계(S160), 흑색니켈도금 단계(S170)를 포함한다. 또한, LDS 타입 무전해 흑색도금 방법은 후처리 및 포장 단계(S180)를 포함한다.In the electroless black plating method, as shown in FIG. 1, pretreatment step 1 (S110), pretreatment step 2 (S120), activation step (S130), copper strike step (S140), copper plating step (S150), and nickel catalyst step ( S160) and black nickel plating step S170. In addition, the LDS type electroless black plating method includes a post-treatment and packaging step (S180).

전처리 1단계(110)는 사출 성형에서 발생하는 긁힘 등이 발생한 영역에 존재하는 금속입자가 도금이 되지 않도록 전처리를 하는 것으로 이러한 긁힘 등에 의해 노출된 금속입자 등의 전처리를 하지 않으면 추후의 도금 단계에서 불필요한 부분에 도금이 될 우려가 있기 때문이다.The pretreatment step 110 is to pre-treat the metal particles existing in the areas where scratches, etc., generated in the injection molding are not plated. In the later plating step, the metal particles exposed by such scratches are not pretreated. This is because there is a risk of plating on unnecessary parts.

전처리 1단계(110)에서 사용되는 처리용액은 순수 70 ~90wt%, 표면탈지제로 중아황산 소다(sodium bisulfite) 0.5 ~10wt%, 계면활성제 0.5 ~5wt%를 포함한다. 또한, 전처리 1단계(110)에서 밀핀 자국 및 배면 격자 긁힘 표면으로 드러난 금속입자를 산화시킬 목적으로 산(acid) 사용으로 염산(HCl) 1 ~10wt%, 과산화수소(H2O2) 0.5 ~3wt%가 더 추가되어 혼합되어 이루어지며 이러한 처리용액의 온도를 20 ~70℃ 범위로 유지시킨 상태에서 3 ~15분 정도 소재를 침지시킨다.The treatment solution used in the pretreatment step 110 includes 70 to 90 wt% pure water, 0.5 to 10 wt% sodium bisulfite as a surface degreasing agent, and 0.5 to 5 wt% surfactant. In addition, in the pretreatment step 110, 1-10 wt% of hydrochloric acid (HCl) and 0.5-3 wt% of hydrogen peroxide (H2O2) are further used as an acid for the purpose of oxidizing the metal particles exposed to the mil pin marks and the back lattice scratching surface. The mixture is added and mixed, and the material is immersed for 3 to 15 minutes while maintaining the temperature of the treatment solution in the range of 20 to 70 ° C.

전처리 2단계(120)는 레이저 가공 단계 소정의 설계에 의하여 필요로 하는 형상의 회로 패턴을 소재에 레이저로 가공을 한다. 레이저 가공 단계는 통상의 공지된 방법 중에서 선택적으로 이루어지므로 상세한 설명을 생략한다.Pre-processing step 120 is a laser processing step to process the circuit pattern of the shape required by a predetermined design with a laser material. The laser processing step is optionally made from conventionally known methods, and thus detailed description thereof is omitted.

전처리 2단계(120)에서는 레이저 가공 단계 발생된 분진 내지 패턴의 가스가 제거된다. 전처리 2단계(120)에서 사용되는 처리용액은 순수 85 ~90wt%, 표면탈지제로 중아황산 소다(Sodium bisulfite) 0.01 ~0.5wt%, 계면활성제 0.5 ~5wt%, 알코올 5 ~10wt%를 혼합하여 마련된다. 전처리 2단계(120)에서 처리용액의 온도를 20 ~70℃ 범위로 유지시킨 상태에서 3 ~15분 정도 소재를 침지시켜 초음파로 소재를 전처리시키는 것이 바람직하다.In the pretreatment step 120, the dust or pattern gas generated in the laser processing step is removed. The treatment solution used in the pretreatment step (120) is prepared by mixing 85 ~ 90wt% pure water, 0.01 ~ 0.5wt% sodium bisulfite, 0.5 ~ 5wt% surfactant, 5 ~ 10wt% alcohol as a surface degreasing agent do. Pretreatment In step 120, it is preferable to immerse the material for about 3 to 15 minutes while maintaining the temperature of the treatment solution in the range of 20 to 70 ° C. to pretreat the material by ultrasonic waves.

레이저 가공된 부위에는 현미경으로 관찰 시 도금의 씨앗이 되는 미세한 금속입자가 레이저 부위의 산과 골에 잔존되어 있으므로 주의하여 도금작업을 진행하여야 하므로 가능하면 레이저 가공 이후에는 이러한 씨앗이 되는 금속입자가 산화되지 않도록 산처리를 하지 않는 것이 바람직하다.In the laser processed parts, the metal particles that become the seed of plating when they are observed under a microscope remain in the acid and bone of the laser part. Therefore, the plating process should be carried out with caution. If possible, the metal particles that become seeds are not oxidized after laser processing. It is preferable that the acid treatment is not performed.

활성화 단계(130)는 전처리 1단계(110) 및 전처리 2단계(120)에서 산화 및 이탈된 미세한 금속성분 중에서도 회로 패턴 내부에 존재하는 금속성분을 활성화시키기 위해 촉매로 파라듐 촉매를 사용한다. 여기에 사용되는 파라듐 촉매의 일예는 상품명 ‘우진WTP 촉매’이다. 활성화 단계(130)에서 사용되는 처리용액은 파라듐 촉매 50 ~100ml/L(우진WTP 촉매), 황산(H2SO4) 50 ~100ml/L, 순수 800 ~900ml/L 로 혼합하여 이루어지고, 용액의 온도를 20 ~50℃ 범위로 유시시켜 3 ~15분 정도 소재를 침지시키는 것이 바람직하다.The activation step 130 uses a palladium catalyst as a catalyst for activating the metal component present in the circuit pattern among the fine metal components oxidized and departed in the first pretreatment step 110 and the second pretreatment step 120. One example of a palladium catalyst used herein is the trade name 'Wujin WTP catalyst'. Treatment solution used in the activation step 130 is made by mixing 50 ~ 100ml / L (Wujin WTP catalyst), 50 ~ 100ml / L sulfuric acid (H 2 SO 4 ), 800 ~ 900ml / L pure water, It is preferable that the temperature of the solution is kept in the range of 20 to 50 ° C. to immerse the material for about 3 to 15 minutes.

동스트라이크 단계(140)는 레이저 가공되어 표면이 다소 거친 회로 패턴에 촉매를 부여하고 동도금을 진행하는 것으로 가공된 회로 패턴에 동입자가 형성된 형상을 확인하고 검증한다. The copper strike step 140 confirms and verifies a shape in which copper particles are formed in the processed circuit pattern by applying a catalyst to the circuit pattern which is laser-processed to give the circuit pattern somewhat rough and copper plating.

동스트라이크 단계(140)에서 사용되는 도금용액은 순수 700 ~800㎖/L, 건욕비율은 금속동 3 ~5g/L(예를 들면, 상품명 : ELC 1000-M 100㎖/ℓ), 안정제 및 촉진제 20 ~40㎖/L(예를 들면, 상품명 : ELC 1000-B 30㎖/ℓ), 수산화나트륨(NaOH) 8 ~10g/L, HCHO 3 ~5g/L로 이루어지며 온도를 40 ~60℃ 범위로, 5 ~20분 정도 소재를 침지시킨 다음 동입자의 형상을 확인한다. Plating solution used in the copper strike step 140 is pure water 700 ~ 800ml / L, dry bath ratio is 3 ~ 5g / L metal copper (for example, ELC 1000-M 100ml / L), stabilizer and accelerator 20 to 40 ml / L (for example, ELC 1000-B 30 ml / l), sodium hydroxide (NaOH) 8 to 10 g / L, HCHO 3 to 5 g / L and the temperature range of 40 to 60 ℃ After immersing the material for about 5 to 20 minutes, check the shape of the copper particles.

동스트라이크 단계(140)에서 소재에 형성된 동입자층이 균일하게 도막층을 형성한 것을 확인한 후 다음 단계인 동도금 단계(150)의 작업이 이루어진다.After confirming that the copper particle layer formed on the material in the copper strike step 140 uniformly forms a coating layer, the operation of the copper plating step 150, which is the next step, is performed.

전술한 전처리 1단계(110)에서 동스트라이크 단계(140)에 이르는 과정은 본 출원인의 특허 출원번호 10-2013-0014546호에 개시되어 있는 방법과 동일하다.The process from the above-described pretreatment step 110 to the copper strike step 140 is the same as the method disclosed in the applicant's patent application No. 10-2013-0014546.

다음, 동도금 단계(150)에서 도금 용액은 순수 700 ~800㎖/L, 금속동 3 ~5g/L(예를 들면, ELC 1000-M 110㎖/ℓ), 안정제 및 촉진제 20 ~40㎖/L(예를 들면, ELC 1000-B 20 ~40㎖/ℓ), 수산화나트륨(NaOH) 8 ~10g/L,포르말린(HCHO) 3 ~5g/L 로 혼합하여 이루어지고, 용액의 온도를 40 ~60℃ 범위로, 180 ~300분 정도 충분하게 소재를 침지시킨다. 동도금 후 동 두께를 확인하며, 동 두께의 일예로 10 ~15㎛가 바람직하다. Next, the plating solution in the copper plating step 150 is 700 ~ 800ml / L pure water, 3 ~ 5g / L metal copper (for example, ELC 1000-M 110ml / L), stabilizer and accelerator 20 ~ 40ml / L (For example, ELC 1000-B 20-40 ml / l), sodium hydroxide (NaOH) 8-10 g / L, formalin (HCHO) 3-5 g / L, and the solution temperature is 40-60 In the range of ℃, the material is immersed for about 180 ~ 300 minutes. After copper plating, the copper thickness is checked, and as an example of the copper thickness, 10 to 15 μm is preferable.

도금완료 후 도금용액을 분석하여 부족한 성분을 보충하여 주는 것이 바람직하고, 사용되는 보충액은 평균 5 ~20㎖/L(예를 들면, ELC 1000-A )정도로 사용한다.After plating is completed, it is preferable to replenish the insufficient components by analyzing the plating solution, and the replenishment solution to be used is used in an average of about 5-20 ml / L (for example, ELC 1000-A).

니켈촉매 단계(160)에서 활성화 단계(130)와 동일한 처리용액은 파라듐 촉매인 우진WTP 촉매 50 ~100ml/L, 황산(H2SO4) 50 ~100ml/L, 순수 800 ~900ml/L 로 혼합하여 이루어지고 용액의 온도를 20 ~50℃ 범위로 유지하여 2 ~7분 정도 소재를 침지시킨다. 동도금층 표면에서 특히 파라듐 촉매 이온의 활성화가 왕성하게 일어나 후 공정인 무전해 유색 니켈도금 단계(170)에서 니켈이온이 금속입자로 석출되어 균일한 니켈 도금층을 얻게 하기 위함이다.In the nickel catalyst step 160, the same treatment solution as the activation step 130 is 50 to 100 ml / L of a Udium WTP catalyst, sulfuric acid (H 2 SO 4 ) 50 to 100 ml / L, and 800 to 900 ml / L of pure water. It is made by mixing and the temperature of the solution is kept in the range of 20 ~ 50 ℃ to immerse the material for 2 to 7 minutes. In particular, the activation of the palladium catalyst ions on the surface of the copper plating layer is vigorous, so that nickel ions are precipitated as metal particles in the electroless colored nickel plating step 170, which is a post process, to obtain a uniform nickel plating layer.

흑색 니켈도금 단계(170)는 회로 패턴 상에 원하는 색을 갖는 니켈금속층을 형성한다. 이때 사용되는 용액은 순수 700 ~850g/ℓ, 니켈 4.4 ~5.2 g/ℓ를 포함한다. 흑색 니켈도금 단계(170)에서 상기의 니켈 성분을 포함하고 회로 패턴 상에 원하는 색을 나타내는 안료(pigment)(후술하는 바와 같이 또는 염료(dye)를 포함할 수 있음)가 혼합된 용액을 44 ~52g/ℓ, 차아인산나트륨 및 안정제를 22~30g/ℓ(여기서, 안정제의 혼합 비율은 2~5g/ℓ임)를 더 혼합한다. 혼합된 용액을 pH 7.0~7.5, 온도 82~86℃로 유지하여 소재를 침지시킨다. 흑색 니켈도금 단계(170)에서의 도금두께는 일예로 8~10㎛가 바람직하다. 그리고, 상기 용액에 포함되어 광택을 좌우하는 인 함량은 조절할 수 있으며 1~3wt%로 반광 상태인 것이 바람직하며 인 함량이 높을수록 유광 상태에 속한다.The black nickel plating step 170 forms a nickel metal layer having a desired color on the circuit pattern. The solution used at this time contains a pure water 700 ~ 850g / l, nickel 4.4 ~ 5.2 g / l. In the black nickel plating step 170, a solution containing the nickel component described above and a pigment (which may include a dye as described below) or a pigment showing a desired color on a circuit pattern is mixed. 52 g / l, sodium hypophosphite and stabilizer are further mixed with 22-30 g / l (wherein the mixing ratio of stabilizer is 2-5 g / l). The mixed solution is kept at pH 7.0-7.5 and a temperature of 82-86 ° C. to soak the material. The plating thickness in the black nickel plating step 170 is preferably 8 ~ 10㎛. In addition, the phosphorus content included in the solution to control the gloss can be controlled and is preferably in the semi-gloss state of 1 to 3wt%.

이러한 흑색 니켈도금 단계(170)를 거치면 전술한 본 발명에 따른 효과를 얻을 수 있다. 즉, 니켈도금을 하는 과정에서 색을 나타내는 안료(pigment) 또는 염료(dye)를 추가하거나 광택을 내는 성분을 투여하여 종래기술과 같이 별도의 도장 과정 내지 코팅 과정이 불필요하다.By passing through the black nickel plating step 170, the above-described effects according to the present invention can be obtained. That is, in the process of nickel plating, a pigment or dye (dye) representing a color is added or a component that gives a glossiness is administered so that a separate coating process or coating process is unnecessary as in the prior art.

본 실시예에서는 흑색만을 적용하였으나 금색, 은색뿐만 아니라 안료(pigment)를 다양하게 변경하여 다양한 색상이 구현될 수 있다. 또한, 다양한 색상을 구현할 수 있는 염료(dye)를 포함할 수도 있다.In the present embodiment, only black is applied, but various colors may be implemented by variously changing pigments as well as gold and silver. In addition, it may include a dye (dye) to implement a variety of colors.

다음, 후처리 및 포장 단계(180)에서 무전해 니켈도금이 완료되면 니켈이 대기 중의 산소와 결합하여 산화가 발생되어 니켈 표면 색상이 어두운 색으로 변하게 되는데 이러한 현상을 예방할 수 있도록 후처리한다. 후처리 단계에 사용되는 용액은 이소프로필알콜(Isopropyl Alcohol) 10 ~15g/L, 프로필렌글리콜(Propylene Glycol) 13 ~25g/L, 지방산 유기화합물 6 ~10g/L, 순수 900 ~950mg/L을 포함하고, 용액의 pH는 중성인 6.0~7.5, 온도를 25 ~55℃ 범위로 유지한 상태에서 1 ~5분 동안 소재를 용액에 침지시킨다.Next, when the electroless nickel plating is completed in the post-treatment and packaging step 180, the nickel is combined with oxygen in the atmosphere to cause oxidation so that the nickel surface color is changed to a dark color. The solution used in the post-treatment step contains 10 to 15 g / L isopropyl alcohol, 13 to 25 g / L propylene glycol, 6 to 10 g / L fatty acid organic compounds, and 900 to 950 mg / L pure water. And, the pH of the solution is neutral 6.0 ~ 7.5, the material is immersed in the solution for 1 to 5 minutes while maintaining the temperature in the range 25 ~ 55 ℃.

또한, 후처리 및 포장 단계(180)는 세척 및 건조 공정을 통해 제품이 세척된 후 건조되어 포장되어 출고된다.In addition, the post-treatment and packaging step 180 is shipped after the product is washed and dried through a washing and drying process packed.

그리고, 전술한 본 발명의 일실시예와 다른 실시예인 이중사출 타입 무전해 흑색도금방법(이하에서 ‘무전해 흑색도금 방법’이라 함)은 초음파 탈지 단계(115)와, 에칭 단계(125)와, 중화 단계(135)와, 동스트라이크 단계(140)와, 동도금 단계(150)와, 니켈촉매 단계(160), 흑색 니켈도금 단계(170)를 포함한다. 무전해 흑색도금 방법은, 활성 단계(137), 후처리 및 포장 단계(180)를 더 포함하는 것이 바람직하다. In addition, the dual injection type electroless black plating method (hereinafter, referred to as an 'electroless black plating method') according to one embodiment of the present invention described above is characterized in that the ultrasonic degreasing step 115 and the etching step 125 are performed. , A neutralization step 135, a copper strike step 140, a copper plating step 150, a nickel catalyst step 160, and a black nickel plating step 170. The electroless black plating method preferably further comprises an activation step 137, a post treatment and a packing step 180.

초음파 탈지 단계(115)에서 이중사출 성형품에 오염이 된 유지, 지문, 오일 등을 세척하고, 사출 성형시 압력에 의해 ABS(Acrylonitrile Butadiene Styrene) 성분이 불균형하게 분포된 부분을 균일하게 재배열시킨다. 초음파 탈지 단계(115)에서 사용하는 약품은 정면처리제 50~100㎖/ℓ로 사용하고, 초음파설비를 설치하여 세척효과를 극대화하고, 초음파의 주파수 파장은 약 40~45KHz를 유지하여 미세한 부분까지 오염물질을 제거하는 것이 바람직하다.In the ultrasonic degreasing step 115, the oil, fingerprints, oils, etc., which are contaminated in the double injection molded product are washed, and the parts in which the ABS (Acrylonitrile Butadiene Styrene) component is unevenly distributed by pressure during injection molding are uniformly rearranged. The chemicals used in the ultrasonic degreasing step 115 are used as the front treatment agent 50 ~ 100mL / ℓ, install the ultrasonic equipment to maximize the cleaning effect, the ultrasonic wave length of about 40 ~ 45KHz to contaminate the minute parts It is desirable to remove the material.

에칭 단계(125)에서 도금 레진 소재 ABS 표면에 부타디엔(Butadiene)성분이 크롬산에 의해 산화되어 수지의 표면에 요철이 생성된다, 미세한 요철(凹凸)을 형성시켜서 갈고리 효과(Anchoring Effect)를 주어 도금의 밀착성을 향상시키는 동시에 표면의 친수성를 부여하는 역할을 한다. 즉, 부다디엔의 이중결합이 분해되어 카르보닐기(C=O) 등의 극성기가 생겨 도금의 기초공사를 제공해 준다.In the etching step 125, butadiene component is oxidized by the chromic acid on the surface of the plated resin material ABS, thereby forming irregularities on the surface of the resin, forming fine irregularities to give an anchoring effect. It improves the adhesion and at the same time serves to impart hydrophilicity of the surface. In other words, the double bond of butadiene is decomposed to form a polar group such as carbonyl group (C = O) to provide the basic construction of the plating.

에칭 단계(125)에서 사용되는 도금 용액의 구성비는 크롬산(CrO3) 450~550g/ℓ, 황산(H2SO4)100~250g/ℓ, 순수200~450g/ℓ로 구성되는 것이 바람직하다.The composition ratio of the plating solution used in the etching step 125 is preferably composed of 450 to 550 g / l of chromic acid (CrO 3), 100 to 250 g / l of sulfuric acid (H 2 SO 4), and 200 to 450 g / l of pure water.

중화 단계(135)에서 에칭 단계(125)에서 사용된 크롬산이 ABS레진 미세 기공에 잔존되어 있으므로 이러한 크롬산 내지 황산을 제거한다. 중화 단계(135)에서 강산으로 처리된 제품의 표면을 약산으로 중화시키는 것이 바람직하고, 이 단계는 무전해 동 도금 시 피복력이 좋아지므로 밀착력 및 신뢰성을 향상시킬 수 있어 공정상 중요한 단계로 생략되어서는 안 된다.Since the chromic acid used in the etching step 125 in the neutralization step 135 remains in the ABS resin micropores, the chromic acid to sulfuric acid is removed. In the neutralization step 135, it is preferable to neutralize the surface of the product treated with the strong acid with the weak acid, and this step may be omitted as an important step in the process because it can improve the adhesion and reliability because the coating power is improved during electroless copper plating. Can not be done.

중화 단계(135)에서 사용되는 약품은 염산(HCl) 80~150㎖/ℓ, 과산화수소(H2O2) 5~25㎖/ℓ이다.The chemicals used in the neutralization step 135 are 80-150 mL / L hydrochloric acid (HCl) and 5-25 mL / L hydrogen peroxide (H2O2).

활성 단계(137)는 후술하는 활성 1단계와 활성 2 단계를 포함한다.The activation step 137 includes an activation step 1 and an activation step 2 described below.

활성 1단계는 ABS 표면에 금속화가 되기 위해서 촉매를 부가하는 과정이다. 활성 1단계에서 사용하는 촉매로 효과가 매우 우수한 팔라듐(Pd)과 주석화합물(Sn) 촉매를 사용하는 것이 바람직하며, 촉매의 형태는 콜로이드(colloid)성으로 크기는 이온(Ion)보다 큰 1~300nm정도이며, 내부는 팔라듐과 주석이온으로 구성되어 있고 외부는 염소(Cl)이온으로 구형을 이루고 있는 것이 바람직하다.One step of activation is the process of adding a catalyst to metallize the ABS surface. It is preferable to use palladium (Pd) and tin compound (Sn) catalysts, which are very effective as catalysts used in the first step of the activity.The type of the catalyst is colloidal and the size is 1 ~ larger than the ion. It is about 300nm, and the inside is composed of palladium and tin ions, and the outside is preferably spherical with chlorine (Cl) ions.

활성 1단계에서 사용되는 촉매 등의 비율은 팔라듐 및 주석화합물 100~300㎖/ℓ, 염산(HCl)50~200㎖/ℓ으로 구성되며, 작업온도는 20~30℃, 작업시간은 1~5분 정도가 바람직하다.The ratio of the catalyst used in the first stage of the activity consists of 100-300 ml / l of palladium and tin compounds, 50-200 ml / l of hydrochloric acid (HCl), the working temperature is 20-30 ° C., and the working time is 1-5 Minutes are preferred.

활성 2단계는 활성 1단계에서 ABS 미세기공 표면에 촉매(팔라듐 주석화합물)가 흡착되어 팔라듐(Pd)이 +2가 이온에서 금속으로 환원되고, 주석(Sn)은 산화되어 주석 4가 이온으로 변한다. 활성 2단계의 반응식은 다음과 같다.In the second stage of activation, in the first stage of activation, a catalyst (palladium tin compound) is adsorbed on the surface of the ABS micropore to reduce palladium (Pd) from +2 ions to metals, and tin (Sn) is oxidized to turn into tin tetravalent ions. . The reaction scheme of the two steps of activity is as follows.

Sn+2 + Pd+2 ⇒ Sn+4 + Pd Sn + 2 + Pd + 2 ⇒ Sn + 4 + Pd

활성 2단계에서 사용되는 약품은 황산(H2SO4) 또는 염산(HCl)을 많이 사용하는데, 황산(H2SO4) 100~250 ㎖/ℓ를 포함하고, 용액 온도는 35~55℃, 작업시간은 10~60초 정도가 바람직하다. The chemicals used in the second step of active use sulfuric acid (H2SO4) or hydrochloric acid (HCl) a lot, including sulfuric acid (H2SO4) 100 ~ 250 ㎖ / L, the solution temperature is 35 ~ 55 ℃, working time 10 ~ 60 Seconds are preferred.

그리고, 본 실시예에서의 동스트라이크 단계(140), 동도금 단계(150), 니켈촉매 단계(160), 흑색 니켈도금 단계(170)와 후처리 및 포장 단계(180)는 전술한 실시예와 동일하므로 이하에서 구체적인 설명을 생략한다.In addition, the copper strike step 140, the copper plating step 150, the nickel catalyst step 160, the black nickel plating step 170 and the post-treatment and packing step 180 in the present embodiment are the same as in the above-described embodiment. Therefore, detailed description will be omitted below.

그리고, 전술한 LDS 타입, 이중사출 타입 무전해 흑색도금 방법에 의해 제조된 인테나와 종래기술에 따른 인테나를 사진으로 비교한 것이 도 3a 내지 도 4c에 도시되어 있다.3A to 4C show a photographic comparison of the intenna prepared by the above-described LDS type and double injection type electroless black plating method and the intenna according to the prior art.

즉, 도 3a는 본 발명의 일실시예에 따른 LDS 타입 무전해 흑색도금 방법과 다른 실시예에 따른 이중사출 타입 무전해 흑색도금 방법에 의해 각각 제조된 동도금 단계 이후의 사진이고, 도 3b는 도 3a는 본 발명의 일실시예에 따른 LDS 타입 무전해 흑색도금 방법과 다른 실시예에 따른 이중사출 타입 무전해 흑색도금 방법에 의해 각각 제조된 흑색 니켈도금 단계 이후의 사진이며, 도 3c는 도 3a는 본 발명의 일실시예에 따른 LDS 타입 무전해 흑색도금 방법과 다른 실시예에 따른 이중사출 타입 무전해 흑색도금 방법에 의해 각각 제조되어 조립된 상태의 사진이다.That is, Figure 3a is a photograph after the copper plating step respectively prepared by the LDS type electroless black plating method and the double injection type electroless black plating method according to another embodiment of the present invention, Figure 3b Figure 3a is a photograph after the black nickel plating step respectively produced by the LDS type electroless black plating method and the double injection type electroless black plating method according to another embodiment of the present invention, Figure 3c Is a photograph of a state prepared and assembled by the LDS type electroless black plating method and the double injection type electroless black plating method according to another embodiment of the present invention, respectively.

이러한 본 발명에 따른 무전해 흑색도금 방법에 의한 것과 비교되는 종래기술에 따른 동도금 이후의 사진이 도 4a이고, 흑색을 포함하지 않은 니켈도금 이후의 사진이 도 4b이며, 도장 과정을 마친 후의 사진이 도 4c이다.Figure 4a is a picture after copper plating according to the prior art compared with that by the electroless black plating method according to the present invention, Figure 4b is a picture after nickel plating not containing black, the picture after finishing the coating process 4C.

이러한 사진과 전술한 각 공정에 따른 설명에서도 알 수 있는 바와 같이 본 발명에 따르면, 공정을 간단하고 편리하게 단축할 수 있고, 불량률을 절감하여 제품의 신뢰성을 향상시킬 수 있으며, 경제성과 미감을 향상시킬 수 있는 LDS 또는 이중사출형 흑색을 포함하는 무전해 도금 방법 및 이에 의한 인테나를 제공할 수 있다. 또한, 최종 제품에 광택을 부여할 수 있어 외관을 향상시킬 수도 있다.As can be seen from the photograph and the description of each process described above, according to the present invention, the process can be shortened simply and conveniently, the defect rate can be reduced, the reliability of the product can be improved, and the economics and aesthetics can be improved. It is possible to provide an electroless plating method comprising an LDS or a double injection type black and an intenna thereby. In addition, gloss can be imparted to the final product to improve the appearance.

즉, LDS 또는 이중사출 인테나 무전해 도금에서 회로 패턴 부위에 도금색상이 순수 금속니켈 색으로 휴대폰 색상과 조화가 되지 않아 캐리어(예를 들면, 재질 PC) 부위 및 회로 패턴 전체에 도장을 실시한다. 도장시 발생되는 기포 와 캐리어 크랙(Crack) 외에 도장 찌꺼기가 표면에 이물 등이 달라붙는 불량을 현저하게 감소시키고, 도금 시 발생되는 패턴 가장자리에 미세한 과도금과 세척과정에서 발생되는 얼룩불량을 감소시킬 수 있고, 도장 작업이 삭제되어 작업절감에 따른 경제적 효과를 향상시킬 수 있다.That is, in LDS or double injection intena electroless plating, the plating color on the circuit pattern part is pure metal nickel color and is not compatible with the cell phone color. In addition to the bubbles and carrier cracks generated during painting, the paint dregs significantly reduce defects such as foreign matters sticking to the surface, and reduce fine stains caused by fine over-plating and cleaning process on the pattern edges generated during plating. And, the painting work can be deleted to improve the economic effect of the work saving.

여기서, 본 발명의 여러 실시예를 도시하여 설명하였지만, 본 발명이 속하는 기술 분야의 통상의 지식을 가진 당업자라면 본 발명의 원칙이나 정신에서 벗어나지 않으면서 본 실시예를 변형할 수 있음을 알 수 있을 것이다. 발명의 범위는 첨부된 청구항과 그 균등물에 의해 정해질 것이다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the invention. will be. The scope of the invention will be determined by the appended claims and their equivalents.

Claims (5)

삭제delete 소재를 이중 사출 과정 및 회로 패턴을 형성하는 과정에서 오염된 물질을 세척하고 사출 성형시 불균일한 부분을 재배열하는 초음파 탈지 단계와;
도금을 하고자 하는 표면에 요철을 형성하는 에칭 단계와;
상기 에칭 단계에서 사용된 산을 중화시키는 중화 단계와;
도금을 하고자 하는 표면에 촉매를 부여하고 흡착된 후 동도금하는 활성화 및 동스크라이크 단계와;
동도금된 표면에서 이온의 활성화를 부여하는 니켈촉매 단계와;
니켈과 흑색을 포함하는 안료(pigment)를 포함하는 용액에 상기 소재를 침지하여 상기 회로 패턴을 도금하는 흑색니켈 단계;를 포함하고,
상기 흑색니켈 단계에서 용액은 순수 700~850g/ℓ, 니켈 4.4~5.2g/ℓ를 포함한 안료 44~52g/ℓ, 차아인산나트륨 20~25g/ℓ, 안정제 2~5g/ℓ 범위의 니켈 및 흑색용액을 포함하고,
pH 7.0~7.5 범위에서 온도 82~86℃를 유지한 상태에서 상기 회로 패턴 상에 니켈 금속막이 형성되는 것을 특징으로 하는 흑색을 포함하는 무전해 도금 방법.An ultrasonic degreasing step of cleaning the contaminated material in the process of forming a dual injection process and forming a circuit pattern of the material and rearranging uneven portions during injection molding;
An etching step of forming irregularities on the surface to be plated;
Neutralizing the acid used in the etching step;
An activation and copper strike step of applying a catalyst to the surface to be plated, adsorbing, and then copper plating;
A nickel catalyst step of imparting activation of ions on the copper plated surface;
And a black nickel step of plating the circuit pattern by immersing the material in a solution containing a pigment including nickel and black.
In the black nickel step, the solution is pure 700 to 850 g / L, pigment 44 to 52 g / L including nickel 4.4 to 5.2 g / L, sodium hypophosphite 20 to 25 g / L, stabilizer 2 to 5 g / L and nickel and black Contains a solution,
An electroless plating method comprising black, wherein a nickel metal film is formed on the circuit pattern while maintaining a temperature of 82 to 86 ° C. in a pH range of 7.0 to 7.5. 삭제delete 제2항에 있어서,
상기 니켈 및 흑색용액에는 인 성분이 1~3wt%를 포함하는 것을 특징으로 하는 무전해 흑색도금 방법.3. The method of claim 2,
The nickel and black solution electroless black plating method, characterized in that the phosphorus component contains 1 ~ 3wt%. 제2항의 흑색을 포함하는 무전해 도금 방법에 의해 제조된 인테나.Intena produced by the electroless plating method comprising the black of claim 2.
KR1020130025405A 2013-03-07 2013-03-11 Laser direct structuring type, double injection type electro-less colored plating method and intenna thereof KR101307940B1 (en)

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KR101490125B1 (en) 2014-10-02 2015-02-12 (주) 우진 더블유.티.피. Laser Direct Structuring Type, Double Injection Type Electro-less White Color Plating Method, Intenna and Rear Case thereof
KR101531386B1 (en) * 2013-12-06 2015-06-24 문기전 Manufacturing method of intenna
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KR101167568B1 (en) 2012-01-13 2012-08-23 동진P&I산업(주) Electroless plating method having cleaner process
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KR101531386B1 (en) * 2013-12-06 2015-06-24 문기전 Manufacturing method of intenna
KR101490125B1 (en) 2014-10-02 2015-02-12 (주) 우진 더블유.티.피. Laser Direct Structuring Type, Double Injection Type Electro-less White Color Plating Method, Intenna and Rear Case thereof
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