KR101276243B1 - Led radiator - Google Patents

Led radiator Download PDF

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Publication number
KR101276243B1
KR101276243B1 KR1020100095122A KR20100095122A KR101276243B1 KR 101276243 B1 KR101276243 B1 KR 101276243B1 KR 1020100095122 A KR1020100095122 A KR 1020100095122A KR 20100095122 A KR20100095122 A KR 20100095122A KR 101276243 B1 KR101276243 B1 KR 101276243B1
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South Korea
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heat dissipation
led
vibration
base
dissipation unit
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KR1020100095122A
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Korean (ko)
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KR20120033547A (en
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홍순교
유정희
배병영
성부현
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주식회사 엘티전자
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/63—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air using electrically-powered vibrating means; using ionic wind
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/168—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being resilient rings acting substantially isotropically, e.g. split rings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

본 발명은 별도의 송풍팬 없이 진동에 의해 엘이디에서 발생되는 열을 제거시킬 수 있는 엘이디용 방열장치에 관한 것이다.
본 발명의 엘이디용 방열장치는 열전도성의 금속재질로 된 베이스(22)와, 상기 베이스(22)의 하부에 다수로 형성된 핀(24)으로 구성된 방열부(2); 상기 방열부(2)의 상부에 안착되며 엘이디(7)가 형성된 피씨비(4); 상기 피씨비(4) 또는 방열부(2)에 장착된 진동수단(6)을 포함하는 것을 특징으로 한다.The present invention relates to a heat dissipation device for an LED that can remove the heat generated from the LED by the vibration without a separate blowing fan.
The heat dissipation device for an LED of the present invention comprises: a heat dissipation unit (2) consisting of a base (22) made of a thermally conductive metal and a plurality of fins (24) formed under the base (22); A PCB 4 mounted on an upper portion of the heat dissipation unit 2 and having an LED 7 formed thereon; It characterized in that it comprises a vibration means (6) mounted on the PC (4) or the heat dissipation unit (2).

Description

엘이디용 방열장치{LED RADIATOR}LED Radiator {LED RADIATOR}

본 발명은 엘이디용 방열장치에 관한 것으로, 더욱 상세하게는 별도의 송풍팬 없이 진동에 의해 엘이디에서 발생되는 열을 제거시킬 수 있는 엘이디용 방열장치에 관한 것이다.
The present invention relates to a heat dissipation device for an LED, and more particularly to a heat dissipation device for an LED that can remove the heat generated from the LED by vibration without a separate blowing fan.

일반적으로 광 방출 소자는 단순한 발광을 이용한 표시 장치로서 사용되었으나, 최근에는 다양한 파장 및 에너지를 가지는 광원으로서의 가능성이 연구되고 있다. 특히 발광 다이오드(Light Emitting Diode:LED)는 일반적인 표시 장치는 물론이고 조명장치나 엘씨디(LCD) 표시장치의 백라이트 소자에도 응용되는 등 적용 영역이 점차 다양해 지고 있다. In general, the light emitting device has been used as a display device using simple light emission, but recently, the possibility of a light source having various wavelengths and energy has been studied. In particular, light emitting diodes (LEDs) are being applied to a variety of applications, such as not only general display devices but also backlight devices of lighting devices and LCD displays.

최근 들어 LED의 한계였던 휘도 문제가 크게 개선되면서 긴 수명과 저전력 사용의 장점이 부각되어 21세기 화합물 반도체가 주도하는 광반도체 시대의 차세대 광원으로 확실히 자리매김하고 있다.Recently, as the luminance problem, which was the limitation of LED, has been greatly improved, the advantages of long life and low power usage are highlighted, making it the next generation light source in the optical semiconductor era led by compound semiconductors of the 21st century.

즉 전력소모를 낮추고 조도를 높이며 장시간 사용할 수 있는 고출력 백색 발광 다이오드 전구, 일명 엘이디 조명등이 개발되었다. In other words, high-power white light-emitting diode bulbs, also known as LED lights, have been developed that can reduce power consumption, increase illumination, and can be used for a long time.

그런데 이와 같은 엘이디 조명등은 고전류, 고휘도의 칩으로 인하여 자체 열이 많이 발생한다. However, such LED lamps generate a lot of heat due to high current and high brightness chips.

따라서 엘이디 조명등 및 이들이 장착된 기판의 내부 열을 방출시킬 필요가 있다.Therefore, there is a need to emit the internal heat of the LED lamps and the substrate on which they are mounted.

이에 따라 근래에는 엘이디 조명등의 열을 방출하기 위한 연구가 다양하게 이루어지고 있으며, 그 주된 방향은 별도의 송풍팬을 이용하는 방법이다.Accordingly, in recent years, various researches for emitting heat such as LED lighting have been made, and the main direction thereof is a method using a separate blowing fan.

도 1은 종래 엘이디용 방열장치를 나타낸 도면이다.1 is a view showing a heat radiation device for a conventional LED.

도 1에 나타낸 바와 같이, 종래 엘이디용 방열장치는, As shown in Figure 1, the conventional LED heat dissipation device,

열전도성의 금속재질로 된 베이스(22')의 하부에 다수로 핀(24')이 형성된 방열부(2'); 상기 방열부(2')의 상부에 안착되며 엘이디(7')가 형성된 피씨비(4'); 그리고 상기 핀(24')에 장착된 송풍팬(3')으로 구성된다.A heat radiating portion 2 'having a plurality of fins 24' formed under the base 22 'made of a thermally conductive metal; A PCB 4 'mounted on an upper portion of the heat radiating portion 2' and having an LED 7 'formed thereon; And a blowing fan 3 'mounted on the pin 24'.

따라서 송풍팬(3')이 회전되면서 방열부(2')의 열을 제거토록 하고 있다.Therefore, as the blower fan 3 'is rotated, the heat of the heat radiating part 2' is removed.

그러나, 이와 같은 종래 기술은 송풍팬의 가동에 의해 소음이 발생되고, 종종 송풍팬이 정지되어 발열기능을 수행하지 못하게 되며, 또한 핀들 사이에 먼지 등의 이물질이 끼어 방열 성능을 저해시키는 문제점이 있었다.
However, such a prior art has a problem that noise is generated by the operation of the blower fan, the blower fan is often stopped to perform the heat generation function, and also foreign matters such as dust are trapped between the fins, which hinders heat dissipation performance. .

본 발명은 상기한 종래 기술의 문제점을 해소하기 위해 안출된 것으로, 방열부에 지속적인 진동을 가함으로써 핀의 떨림을 유발하여 핀들 사이의 공기 흐름을 유도함으로써 열을 제거할 수 있도록 한 엘이디용 방열장치를 제공하는데 그 목적이 있다.
The present invention has been made in order to solve the above problems of the prior art, the heat radiation device for the LED to remove the heat by inducing air flow between the fins by causing the vibration of the fins by applying continuous vibration to the radiator The purpose is to provide.

상기한 본 발명의 목적은, 열전도성의 금속재질로 된 베이스와, 상기 베이스의 하부에 다수로 형성된 핀으로 구성된 방열부; 상기 방열부의 상부에 안착되며 엘이디가 형성된 피씨비; 상기 피씨비 또는 방열부에 장착된 진동수단을 포함하는 것을 특징으로 하는 엘이디용 방열장치에 의해 달성될 수 있다.The object of the present invention is a heat-dissipating part consisting of a base made of a thermally conductive metal material and a plurality of fins formed in the lower portion of the base; A PCB seated on an upper portion of the heat dissipation unit and including an LED; It can be achieved by the heat radiation device for the LED, characterized in that it comprises a vibration means mounted to the PCB or the heat radiating portion.

상기 피씨비 또는 방열부에는 코일스프링이 장착되고, 상기 코일스프링의 끝단에 상기 진동수단이 장착된 것을 특징으로 한다.The coil spring or the heat radiating portion is mounted with a coil spring, characterized in that the vibration means is mounted on the end of the coil spring.

상기 피씨비 또는 방열부에는 판스프링가 장착되고, 상기 판스프링의 상단에 진동수단이 장착된 것을 특징으로 한다.A leaf spring is mounted to the PCB or the heat dissipation portion, and a vibration means is mounted on an upper end of the leaf spring.

상기 핀은 상기 베이스와 연결되는 부위에 다수의 브릿지가 형성되어 휘어짐 탄성이 증가된 것을 특징으로 한다.The pin is characterized in that the bending elasticity is increased by the formation of a plurality of bridges in the portion connected to the base.

상기 진동수단은 진동모터, 피에조모터, 액츄에이터 외 진동발생 장치들 중 택일된 것을 특징으로 한다.The vibration means may be selected from among a vibration motor, a piezo motor, an actuator, and other vibration generating devices.

본 발명에 따르면 방열부에 지속적인 진동을 가함으로써 핀의 떨림을 유발하여 핀들 사이의 공기 흐름을 유도함으로써 열을 제거할 수 있고, 종래 송풍팬을 배제하여 소음을 절감하고, 부피를 최소화할 수 있는 효과가 있다.
According to the present invention, by applying continuous vibration to the heat radiating part to induce the air flow between the fins by inducing the trembling of the fins, it is possible to eliminate the conventional blower to reduce the noise, to minimize the volume It works.

도 1은 종래 엘이디용 방열장치를 나타낸 도면.
도 2는 본 발명에 따른 엘이디용 방열장치를 나타낸 정단면도,
도 3은 본 발명에 따른 엘이디용 방열장치의 다른 실시예를 나타낸 정면도,
도 4a 및 도 4b는 본 발명에 따른 엘이디용 방열장치에 적용되는 '진동모터'를 나타낸 도면,
도 5a 및 도 5b는 본 발명에 따른 엘이디용 방열장치의 또 다른 실시예를 나타낸 도면.1 is a view showing a heat radiation device for a conventional LED.
2 is a front sectional view showing a heat dissipation device for an LED according to the present invention;
Figure 3 is a front view showing another embodiment of the heat dissipation device for LEDs according to the present invention,
4a and 4b is a view showing a 'vibration motor' applied to the heat dissipation device for LEDs according to the present invention,
5a and 5b is a view showing another embodiment of the heat dissipation device for the LED according to the present invention.

이하 본 발명의 바람직한 실시예를 첨부된 도면을 토대로 상세하게 설명하면 다음과 같다.
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 엘이디용 방열장치를 나타낸 정단면도, 도 3은 본 발명에 따른 엘이디용 방열장치의 다른 실시예를 나타낸 정면도, 도 4a 및 도 4b는 본 발명에 따른 엘이디용 방열장치에 적용되는 '진동모터'를 나타낸 도면, 도 5a 및 도 5b는 본 발명에 따른 엘이디용 방열장치의 또 다른 실시예를 나타낸 도면이다.
Figure 2 is a front sectional view showing a heat dissipation device for an LED according to the present invention, Figure 3 is a front view showing another embodiment of the LED heat dissipation device according to the present invention, Figures 4a and 4b is a heat dissipation device for an LED according to the present invention 5A and 5B are views showing another embodiment of the heat dissipation device for LEDs according to the present invention.

도 2에 나타낸 바와 같이, 본 발명에 따른 엘이디용 방열장치(A)는 열전도성의 금속재질로 된 베이스(22)와, 상기 베이스(22)의 하부에 다수로 형성된 핀(24)으로 구성된 방열부(2); 상기 방열부(2)의 상부에 안착되며 엘이디(7)가 형성된 피씨비(4); 상기 피씨비(4) 또는 방열부(2)에 장착된 진동수단(6)을 포함한다.
As shown in FIG. 2, the heat dissipation device A according to the present invention includes a base 22 made of a thermally conductive metal, and a heat dissipation part including a plurality of fins 24 formed under the base 22. (2); A PCB 4 mounted on an upper portion of the heat dissipation unit 2 and having an LED 7 formed thereon; Vibration means (6) mounted to the PC (4) or the heat dissipation unit (2).

상기 방열부(2)는 대략 장방형의 판상으로 되며 알루미늄과 같은 열전도성 금속으로 형성된 베이스(22)와, 상기 베이스(22)의 하부에 형성된 얇은 박판 형상의 핀(24)이 미세 간격으로 다수로 배치되어 구성된다.The heat dissipation part 2 has a substantially rectangular plate shape, and a base 22 formed of a thermally conductive metal such as aluminum and a thin thin plate-shaped fin 24 formed under the base 22 are formed at a plurality of minute intervals. Arranged and configured.

즉 베이스(22)와 핀(24)은 다이캐스팅, 압출, 주조, 사출 등의 금형제조방법을 이용하여 일체형으로 제작되거나 또는 베이스(22)에 핀(24)을 용접시키거나 또는 핀(24)을 베이스(22)에 억지끼움시키는 방식, 도브테일 결합 등의 물리적인 방법으로 조립될 수도 있다.That is, the base 22 and the pin 24 may be integrally manufactured by using a die manufacturing method such as die casting, extrusion, casting, or injection, or the pins 24 may be welded to the base 22 or the pins 24 may be welded. The base 22 may be assembled by a physical method such as interference fit, dovetail coupling, or the like.

상기 핀(24)도 열전도성 금속재질이며, 장방형으로 형성되고, 그 두께는 약 0.1 mm∼4mm 가 바람직하다.The fins 24 are also thermally conductive metals, are formed in a rectangular shape, and the thickness thereof is preferably about 0.1 mm to 4 mm.

핀(24)의 두께가 얇을수록 휨 변형이 좋으나 너무 얇으면 파손의 우려가 있으므로 적정한 두께로 형성된다.The thinner the pin 24, the better the warpage deformation. However, if the pin 24 is too thin, the pin 24 may be damaged.

따라서 미세한 진동에도 상기 다수의 핀(24)들이 떨림이 발생될 수 있고, 이 떨림에 의해 핀(24)의 끝단, 즉 베이스(22)와 고정된 부위의 반대편이 좌우로 휘어지는 휨 변형이 가능하게 된다.
Therefore, the plurality of pins 24 may be shaken even in the minute vibration, and the shaking may enable bending deformation in which the ends of the pins 24, ie, opposite sides of the base 22 and the fixed portion are bent to the left and right. do.

한편 상기 방열부(2)는 외면에 카본나노튜브를 스프레이시켜 코팅하거나 또는 방열부(2)를 카본나노튜브 용액에 침지시켜 코팅되도록 한다.Meanwhile, the heat dissipation unit 2 is coated by spraying carbon nanotubes on the outer surface or by dipping the heat dissipation unit 2 in a carbon nanotube solution.

카본나노튜브(CNT)는 탄소 6개로 이루어진 육각형들이 서로 연결되어 관 모양을 이루고 있는 신소재로써 전기 전도도가 구리와 비슷하고, 열전도율은 자연계에서 가장 뛰어난 다이아몬드와 같으며, 강도는 철강보다 100배나 뛰어한 것으로 알려져 있다. Carbon nanotube (CNT) is a new material that consists of six carbon hexagons connected to each other to form a tubular shape. Its electrical conductivity is similar to that of copper. It is known.

따라서 카본나노튜브를 베이스(22) 및 핀(24)의 외면에 코팅시킴으로써 방열성능이 더욱 향상될 수 있다.Therefore, by coating the carbon nanotubes on the outer surface of the base 22 and the fin 24, the heat radiation performance can be further improved.

또는 방열부(2)의 재질인 열전도성 금속과 카본나노튜브를 혼합한 원료를 금형에 주입하여 성형시켜 제조될 수도 있다.
Alternatively, the raw material may be manufactured by injecting a raw material mixed with a thermally conductive metal and carbon nanotubes, which are materials of the heat dissipation unit 2, into a mold.

한편 도 3에 도시된 바와 같이, 핀(24b)과 베이스(22)의 연결부위에 다수의 홈(242b)이 형성되고, 상기 다수의 홈(242b)과 홈(242b) 사이에 베이스(22)와 연겨되는 브릿지(244b)가 형성됨으로써 떨림에 의한 핀(24b)의 휨 변형이 더욱 증폭될 수 있도록 하여 발열 성능이 향상될 수 있다.
Meanwhile, as shown in FIG. 3, a plurality of grooves 242b are formed at a connection portion between the pin 24b and the base 22, and the base 22 is disposed between the plurality of grooves 242b and the grooves 242b. By forming the bridge 244b connected to the bend so that the bending deformation of the pin 24b due to vibration can be further amplified, the heat generation performance can be improved.

한편 다시 도 2를 참조하면, 상기 피씨비(4)는 방열부(2)의 상부에 장착되는 것으로, 상부에 다수의 엘이디(7)가 형성되며, 일측에 전원공급을 위한 리드선(42)이 연결된다.
Meanwhile, referring back to FIG. 2, the PC 4 is mounted on an upper portion of the heat dissipation unit 2, and a plurality of LEDs 7 are formed at an upper portion thereof, and a lead wire 42 for supplying power is connected to one side. do.

한편 상기 진동수단(6)은 진동을 발생시키기 위한 것으로, 방열부(2)에 진동을 발생시켜 핀(24)이 떨리도록 하고, 이 떨림에 의해 핀(24)과 핀(24) 사이의 공간에 체류하는 열기 및 핀(24)의 주변에 흐르는 열기의 흐름을 촉진시켜 외부의 공기와의 대류를 유발시켜 냉각이 가능하게 된다.On the other hand, the vibrating means 6 is for generating a vibration, and generates a vibration in the heat radiating portion 2 so that the pin 24 is shaken, the space between the pin 24 and the pin 24 by this shaking It is possible to accelerate the flow of heat remaining in the heat and the flow around the fin 24 to cause convection with the outside air, thereby enabling cooling.

진동수단(6)으로는 주로 진동모터가 바람직하나 이외에도 피에조모터 또는 액츄에이터도 적용 가능하다.
The vibration means 6 is preferably a vibration motor, but in addition to this, a piezomotor or an actuator can be applied.

상기 진동모터의 일 예는 도 4에 도시된 바와 같다.An example of the vibration motor is as shown in FIG.

즉 도 4a와 같이 원통형의 진동모터(61a) 또는 도 4b와 같이 원판형의 진동모터(61b)가 적용된다.
That is, a cylindrical vibration motor 61a as shown in FIG. 4A or a disk-shaped vibration motor 61b as shown in FIG. 4B is applied.

한편 진동수단(6)은 피씨비(4)에 장착될 수도 있고, 방열부(2)의 베이스(22)에 장착될 수도 있다. On the other hand, the vibration means 6 may be mounted to the PC 4, or may be mounted to the base 22 of the heat dissipation unit (2).

즉 피씨비(4)의 상면에 진동수단(6)이 직접 부착되거나 또는 베이스(22)의 측면에 부착될 수도 있다.That is, the vibration means 6 may be directly attached to the upper surface of the PC 4 or may be attached to the side of the base 22.

여기서 피씨비(4)의 상면에 진동수단(6)이 직접 부착되는 경우 진동에 의해 피씨비(4)에 부착된 엘이디(7)와 같은 부품의 이탈을 방지하기 위해 결합부위를 견고하게 접합시킬 필요가 있다.In this case, when the vibration means 6 is directly attached to the upper surface of the PC 4, it is necessary to firmly join the coupling parts in order to prevent separation of parts such as the LED 7 attached to the PC 4 by vibration. have.

또 피씨비(4)가 고정되는 대상물(미도시)에 장착부위에는 진동을 흡수할 수 있도록 댐핑장치(미도시)가 구비됨이 바람직하다.
In addition, it is preferable that a damping device (not shown) is provided at the mounting portion on the object (not shown) to which the PC 4 is fixed so as to absorb vibration.

한편 도 5에 나타낸 바와 같이, 진동수단(6)은 피씨비(4)에 직접 장착되지 않고 진동을 증폭시키기 위한 연결수단에 장착된다.On the other hand, as shown in Figure 5, the vibrating means 6 is not mounted directly to the PC 4, but is attached to the connecting means for amplifying the vibration.

상기 연결수단에 의해 진동수단(6)에서 발생된 진동이 더욱 증폭되도록 하기 위함이다.This is to further amplify the vibration generated by the vibration means 6 by the connecting means.

상기 연결수단으로는 도 5a와 같이 코일스프링(8a)이거나 또는 도 5b와 같이 판스프링(8b)가 바람직하다.As the connecting means, a coil spring 8a as shown in FIG. 5A or a leaf spring 8b as shown in FIG. 5B is preferable.

즉 코일스프링(8a)이 피씨비(4) 또는 방열부(2)의 베이스(22)에 장착되고, 상기 코일스프링(8a)의 끝단에 상기 진동수단(6)이 장착된다.That is, the coil spring 8a is mounted on the base 22 of the PCB 4 or the heat dissipation unit 2, and the vibration means 6 is mounted on the end of the coil spring 8a.

또는 판스프링(8b)은 대략 "ㄱ"자 형상으로써 하단이 피씨비(4) 또는 방열부(2)의 베이스(22)에 고정되고, 상단에 진동수단(6)이 장착된다.Alternatively, the leaf spring 8b has a substantially "a" shape and a lower end thereof is fixed to the base 22 of the PCB 4 or the heat dissipation unit 2, and the vibration means 6 is mounted on the upper end thereof.

따라서 진동수단(6)에서 발생된 진동이 상기 코일스프링(8a) 또는 판스프링(8b)에 의해 더욱 증폭되어 베이스(22) 및 핀(24)으로 전달됨으로써 발열 성능이 향상될 수 있다.Therefore, the vibration generated by the vibration means 6 is further amplified by the coil spring 8a or the leaf spring 8b and transferred to the base 22 and the fin 24, thereby improving heat generation performance.

또한 진동수단(6)의 주파수와 핀(24)의 고유주파수가 일치된다면 공진현상에 의해 더욱 진동이 증폭될 수 있고 핀(24)의 떨림도 증폭될 수 있어 발열성능이 향상될 수 있다.In addition, if the frequency of the vibration means 6 and the natural frequency of the pin 24 is matched, the vibration can be further amplified by the resonance phenomenon and the vibration of the pin 24 can be amplified, so that the heating performance can be improved.

즉 물체는 각기 고유한 주파수를 가지고 있고 그 고유한 주파수와 맞는다면 그 세기에 상관없이 강한 진동이 일어나는 현상이 공진현상이다.
That is, if an object has its own frequency and fits its own frequency, a strong vibration occurs regardless of its strength.

또한 피씨비(4) 또는 방열부(2)에 열센서(미도시)를 장착하여 온도에 비례하여 진동수단(6)의 진동 세기를 조절함으로써 발열량을 조절할 수 있다.In addition, a heat sensor (not shown) may be mounted on the PC 4 or the heat dissipation unit 2 to adjust the amount of heat generated by adjusting the vibration intensity of the vibration means 6 in proportion to the temperature.

즉 방열부(2)의 온도가 높을 경우 진동수단(6)이 강하게 진동하도록 제어하고, 이와 반대로 온도가 낮을 경우 진동수단(6)의 진동을 최저 수준으로 제어한다.
That is, when the temperature of the heat dissipation unit 2 is high, the vibration means 6 is controlled to vibrate strongly. On the contrary, when the temperature is low, the vibration means of the vibration means 6 is controlled to the minimum level.

비록 본 발명이 상기 언급된 바람직한 실시예와 관련하여 설명되어졌지만, 발명의 요지와 범위로부터 벗어남이 없이 다양한 수정 및 변형이 가능한 것은 당업자라면 용이하게 인식할 수 있을 것이며, 이러한 변경 및 수정은 모두 첨부된 청구의 범위에 속함은 자명하다.
Although the present invention has been described in connection with the above-mentioned preferred embodiments, it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the invention, It is obvious that the claims fall within the scope of the claims.

2 : 방열부 4 : 피씨비
6 : 진동수단 7 : 엘이디
22 : 베이스 24 : 핀 2: heat dissipation part 4
6: vibrating means 7: LED
22: base 24: pin

Claims (9)

열전도성의 금속재질로 된 베이스와, 상기 베이스의 하부에 다수로 형성된 핀으로 구성된 방열부;
상기 방열부의 상부에 안착되며 엘이디가 형성된 피씨비;
상기 피씨비 또는 방열부에 장착된 진동수단을 포함하고,
상기 진동수단은 진동모터, 피에조모터, 액츄에이터 중 택일되는 것이고,
상기 진동수단은 피씨비의 상부에 부착되거나 또는 베이스의 측면에 부착되고,
상기 방열부에는 온도를 측정하여 진동수단의 진동 세기를 조절하도록 열센서가 장착되고,
상기 진동수단의 주파수와 상기 핀의 고유주파수가 일치된 것을 특징으로 하는 엘이디용 방열장치.A heat dissipation unit including a base made of a thermally conductive metal and a plurality of fins formed under the base;
A PCB seated on an upper portion of the heat dissipation unit and having an LED formed thereon;
Vibration means mounted to the PC or radiator,
The vibration means is one of a vibration motor, a piezo motor, an actuator,
The vibrating means is attached to the top of the PC or attached to the side of the base,
The heat dissipation unit is equipped with a thermal sensor to measure the temperature to adjust the vibration intensity of the vibration means,
Heat dissipation device for an LED, characterized in that the frequency of the vibration means and the natural frequency of the fins match. 제 1항에 있어서,
상기 방열부는 외면에 카본나노튜브가 코팅된 것을 특징으로 하는 엘이디용 방열장치.The method of claim 1,
The heat dissipation unit LED heat dissipation device, characterized in that the carbon nanotubes are coated on the outer surface. 제 1항에 있어서,
상기 방열부는 열전도성 금속과 카본나노튜브가 혼합된 재질로 이루어진 것을 특징으로 하는 엘이디용 방열장치.The method of claim 1,
The heat dissipation unit LED heat dissipation device, characterized in that made of a material that is mixed with the thermal conductive metal and carbon nanotubes. 제 1항에 있어서,
상기 핀과 베이스의 연결부위에 다수의 홈이 형성되고, 상기 다수의 홈들 사이에 브릿지가 형성되어 떨림이 증폭될 수 있도록 한 것을 특징으로 하는 엘이디용 방열장치.The method of claim 1,
A plurality of grooves are formed in the connection portion between the fin and the base, and a bridge is formed between the plurality of grooves so that the tremor can be amplified. 삭제delete 삭제delete 제 1항에 있어서,
상기 진동수단은 피씨비 또는 베이스에 장착된 연결수단에 결합된 것을 특징으로 하는 엘이디용 방열장치.The method of claim 1,
The vibration means is a heat dissipation device for an LED, characterized in that coupled to the connection means mounted to the PC or base. 제 7항에 있어서,
상기 연결수단은 코일스프링 또는 판스프링인 것을 특징으로 하는 엘이디용 방열장치.8. The method of claim 7,
The connecting means is a heat radiation device for an LED, characterized in that the coil spring or leaf spring. 삭제delete
KR1020100095122A 2010-09-30 2010-09-30 Led radiator KR101276243B1 (en)

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